JP2002073147A - Manufacture cost calculation system and recording medium with recorded manufacturing cost calculating program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To calculates the costs needed on a production line by specific cost calculated objects. SOLUTION: This manufacturing cost calculation system has a storage means 3 which stores cost data by cost items, characteristic parameters regarding a manufacturing device, and use time rate data by the cost-calculated objects of the manufacturing device, a load rate arithmetic means 21 which reads the characteristic parameters regarding the manufacturing device and the use time rate data by the cost-calculated objects out of the storage means 3 and calculates load rates by the cost-calculated objects for allocating the costs for common cost parts of the cost data by the cost items by the cost-calculated objects, and a load cost arithmetic means 22 which reads the cost data by the cost items out of the storage means 3, allocates the costs for the common cost parts by the cost-calculated objects according to the load rates by the cost-calculated objects and calculates manufacturing costs by the cost-calculated objects.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing cost calculation system and a recording medium storing a manufacturing cost calculation program.

[0002]

2. Description of the Related Art In a production line, it is common to analyze a profit situation based on a production cost and a sales amount and to formulate a production plan. A computer is used to calculate the production cost used for the analysis. The manufacturing cost calculation system of the used manufacturing line is used. Conventional manufacturing cost calculation systems use computers to input data such as direct material costs, indirect material costs, consumables costs, power costs, depreciation of buildings and equipment for each cost item, and aggregate them for each manufacturing line. Was common.

[0003]

However, since the conventional manufacturing cost calculation system calculates the manufacturing cost for each manufacturing line, a manufacturing method for manufacturing a plurality of types of products, such as a semiconductor chip manufacturing line, is used. On the line, there was a problem that the manufacturing cost for each product type could not be calculated. That is, the sales are calculated for each product type, but the production cost for each product type to be handled cannot be obtained. For this reason, it was not possible to analyze and examine the profit situation for each product type, which was an obstacle to making a production plan.

Further, since it is not possible to calculate the manufacturing cost per lot, per minimum manufacturing unit before dividing into products, or per product, the product yield varies, for example, as in a semiconductor chip manufacturing line. In such a manufacturing line, there is a problem that it is impossible to grasp the tendency of the manufacturing cost to fluctuate due to a change in yield, which makes it difficult to judge the business feasibility. SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and a main object of the present invention is to provide a manufacturing cost calculation system and a manufacturing cost calculation program which can easily calculate costs (costs) generated in a manufacturing line for each cost calculation target. An object of the present invention is to provide a recorded recording medium. Specifically, it is an object of the present invention to provide a manufacturing cost calculation system capable of calculating the manufacturing cost for each product type, each lot, each minimum manufacturing unit, or each product.

[0005]

In order to solve the above-mentioned problems, the present invention relates to a system for calculating a production cost of a product on a production line. A storage unit for storing cost data, unique parameters related to manufacturing apparatuses installed on the manufacturing line, and usage time rate data for each cost calculation target in these manufacturing apparatuses; a unique parameter related to the manufacturing apparatus from the storage unit; A load ratio calculating means for reading the usage time rate data for each cost calculation target in the cost calculation target, and calculating a burden ratio for each cost calculation target for allocating the cost of the common expense portion in the cost data for each cost item for each cost calculation target; The cost data for each cost item is read from the There are, allocate the cost of common expenses portion for each cost calculation target, characterized by having a pocket expenses calculating means for calculating the cost of manufacturing each cost calculation target. Here, the manufacturing cost for each cost calculation target is, for example, the manufacturing cost for each product type or each lot.

In this case, in one example of the configuration of the manufacturing cost calculation system, the cost data for each cost item includes at least the depreciation cost and the power cost of the buildings and facilities of the manufacturing line, and the cost calculation means calculates the cost ratio for each cost calculation target. The system is configured to allocate the depreciation cost and the power cost of the building and facilities of the production line to the production cost for each cost calculation target based on the production cost. One configuration example of the unique parameter related to the manufacturing apparatus uses the purchase price of the manufacturing apparatus. In another configuration example of the manufacturing cost calculation system, the storage unit further stores the production amount data for each cost calculation target, and reads out the production amount data for each cost calculation target from the storage unit, and calculates the cost calculated by the burden cost calculation unit. Unit cost calculation means for calculating a manufacturing cost per predetermined manufacturing unit in each cost calculation target based on the manufacturing cost for each calculation target is further provided. In one configuration example in this case, the cost calculation target production amount data includes the cost calculation target yield data, and the unit cost calculation unit uses the cost calculation target production amount data including the cost calculation target yield data. It is configured to calculate the manufacturing cost per predetermined manufacturing unit in the cost calculation target. Here, the manufacturing cost per predetermined manufacturing unit is the manufacturing cost of the minimum manufacturing unit before being divided into products or the unit of one product. In this case, for example, in a semiconductor chip manufacturing line, the minimum manufacturing unit before being divided into products is a wafer, and the product is a chip cut out from the wafer.

[0007] Still another example of the configuration of the manufacturing cost calculation system is a result data storage means for storing the actual use time data for each lot of each manufacturing apparatus collected on the manufacturing line, and for each lot of each manufacturing apparatus. And a utilization rate calculating means for calculating a usage time rate for each cost calculation target for each manufacturing apparatus based on the actual usage time data for each manufacturing apparatus, and storing the calculated usage time rate data as the usage time rate data for each cost calculation target in the storage means. One configuration example in this case includes a performance data collection unit that collects performance usage time data for each lot of each manufacturing apparatus collected on the manufacturing line via a communication network and stores the data in a performance data storage unit. One configuration example of the performance data collection means is further configured to collect performance data of the production amount data for each cost calculation target and store the data in the storage means.

A computer-readable recording medium on which a production cost calculation program according to the present invention is recorded is installed in a production line together with cost data classified by cost, in which costs incurred in the production line are classified for each expense item. Storage means for storing unique parameters related to the manufacturing apparatus and usage time rate data for each cost calculation object in the manufacturing apparatus, and storing the unique parameters related to the manufacturing apparatus and the usage time rate for each cost calculation object in the manufacturing apparatus. Data and read out the cost data for each cost item from the storage device, and load ratio calculation means for calculating the burden ratio for each cost calculation object for allocating the cost of the common expense portion in the cost data for each cost item for each cost calculation object. Based on the burden rate for each cost calculation object calculated by the rate calculation means, Allocating strike for each cost calculation target, as pocket expenses calculating means for calculating the cost of manufacturing each cost calculation target, a program for causing a computer to function is recorded.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a configuration of a semiconductor chip manufacturing cost calculation system according to a first embodiment of the present invention. In FIG. 1, the manufacturing cost calculation system 1 includes an arithmetic processing unit 2 and a storage unit 3, and an input device 5 and a display device 6 are connected. The calculation processing means 2 includes a burden ratio calculation means 21 and a burden cost calculation means 22, and the storage means 3 includes a database 31 which is referred to by the burden ratio calculation means 21 and the burden cost calculation means 22. .

The database 31 stores cost data by cost, which is obtained by classifying costs generated on the manufacturing line for each cost item, unique parameters of each manufacturing apparatus installed in the manufacturing line, and usage time for each cost calculation target. The rate data and the operation time rate data for each cost calculation target of the worker of this manufacturing line are stored. Here, a case where the production cost for each product type is calculated as a cost calculation target will be described as an example. In this case, the usage time rate data for each type of each manufacturing apparatus is used as the usage time rate data for each cost calculation target. Further, as the operation time rate data for each cost calculation target, the operation time rate data for each type of the worker of the production line is used.

In this configuration, the manufacturing cost calculation system is arranged such that the burden ratio calculating means 21 calculates the cost data by cost item based on the unique parameters of each manufacturing device and the usage time rate of each type of each manufacturing device. The burden ratio for each product is calculated for allocating, to each product, an item of the common expense portion that cannot be accounted for for each product, and the burden cost calculation means 22 calculates the product type based on the burden ratio for each product calculated by the burden ratio calculation means 21. The cost of the common expense portion is calculated for each product, and the cost of the cost portion that can be booked for each product type is added to calculate the product cost of each type of semiconductor chip.

Next, data stored in the database 31 will be described. Cost data by cost item includes direct material costs, indirect material costs, electricity costs, equipment costs, repair costs, miscellaneous costs,
It consists of depreciation of buildings and equipment, depreciation of manufacturing equipment, direct labor costs and staff labor costs. Direct material costs include silicon wafers, materials added to silicon wafers in each process and attached to finished semiconductor chips,
Expenses required for an exposure mask (reticle) and the like for forming a circuit pattern on a silicon wafer. In addition, as a material adhering to a completed semiconductor chip, for example, a raw material gas for film formation or a noble metal added as a material to a silicon wafer in each manufacturing apparatus is used.

The indirect material cost is a cost that is not directly added to the silicon wafer but is consumed as a material, and includes, for example, a cleaning liquid, a chemical, and a processing gas used in each manufacturing apparatus. The power cost is a cost required for power used in the production line. The equipment cost is a cost required for tools and equipment necessary for operating the production line, and corresponds to, for example, a wafer carrier used for handling silicon wafers. The repair cost is a cost required for maintenance and repair of factory equipment and manufacturing equipment necessary for operating the production line. The miscellaneous expenses are various expenses necessary for maintaining the manufacturing process, for example, cleaning expenses for dust-free clothes worn in a clean room.

The depreciation of buildings and equipment is the cost required for depreciation of common equipment such as clean room buildings and pure water production equipment. The depreciation cost of a manufacturing device is the cost required for depreciation of each manufacturing device. Direct labor costs are the labor costs of personnel required for manufacturing. The staff labor cost is the labor cost of the manpower required for production management and the manpower required for solving troubles in manufacturing and stably operating the manufacturing line. Of these expenses, the expenses that can be booked for each product type are direct material costs, depreciation of manufacturing equipment, and direct personnel costs. On the other hand, the items of the common expense part are indirect material costs,
These are electricity costs, equipment costs, repair costs, miscellaneous costs, depreciation of buildings and equipment, and staffing costs.

The unique parameters relating to the manufacturing apparatus are parameters unique to the manufacturing apparatus used as indices for calculating the burden ratio of each type, and are obtained from the purchase price, rated power consumption, occupied floor area, volume and weight of the manufacturing apparatus. The selected one, a combination thereof, or a weighted combination is used. Here, the purchase price of the manufacturing apparatus is used as the unique parameter related to the manufacturing apparatus. The database 31 stores unique parameters for each manufacturing apparatus. In this case, the stored unique parameter may be only the purchase price of the manufacturing apparatus, or may be a part or all selected from the purchase price of the manufacturing apparatus, the rated power consumption, the occupied floor area, the volume, and the weight. .

The usage time rate data for each type of manufacturing apparatus is the ratio of the processing time of each type to the operating time of the manufacturing apparatus, and the database 31 stores the usage time rate data for each type of manufacturing apparatus. . The operation time rate data for each type of the workers on the production line is the ratio of the operation time for each type to the operation time of the workers engaged in production on the production line. The ratio of the work time for each type to the total work time is stored as the work time rate data for each type. These data stored in the database 31 are input to the input device by using data for each cost item registered in the accounting cost management system of the semiconductor factory and production management data for each product type registered in the manufacturing management system. Can be entered from

Next, a method of calculating a manufacturing cost of the semiconductor chip manufacturing cost calculating system according to the present invention will be described. This manufacturing cost calculation system firstly assigns, to each manufacturing apparatus, a burden ratio for each type in order to allocate, to each type, a cost item of a common expense portion which cannot be recorded for each type in cost data for each type which constitutes a manufacturing cost. It is calculated based on the unique parameters and the usage time rate data for each type of each manufacturing apparatus. The reason for using the intrinsic parameters of the manufacturing apparatus as an index is that a semiconductor chip manufacturing line is composed of a large number of manufacturing apparatuses installed in a clean room of a semiconductor factory. Since semiconductor chips are manufactured by repeatedly performing processes such as development, etching and diffusion on silicon wafers,
This is because the use of the manufacturing apparatus is reflected in the manufacturing cost by performing the weighting using the unique parameter related to the manufacturing apparatus, and a result that is realistic can be obtained.

Here, the burden rate for each product type is calculated as in equation (1). In equation (1), αk is the burden ratio of the k-th type to all the types, Eki is the usage time rate data of the k-th type in the i-th manufacturing apparatus, TP
i is a unique parameter of the ith manufacturing apparatus, and n is the total number of manufacturing apparatuses. Here, the burden ratio is calculated using the purchase price of the manufacturing device as a unique parameter of the manufacturing device used as an index for calculating the burden ratio of each type. by the way,
In the manufacture of a semiconductor chip, not all the manufacturing apparatuses of a manufacturing line are used for manufacturing one type of product, but in that case, only the value of the usage time rate data of the type in the relevant manufacturing device becomes 0. Equation (1) does not change.

[0019]

(Equation 1)

Next, the manufacturing cost of the common expense portion allocated to each product type is calculated as in equation (2). In equation (2), CIk is the manufacturing cost of the common expense portion allocated to the k-th type, TM is the indirect material cost, TP is the power cost, TT is the equipment cost, TF is the repair cost, TO is the miscellaneous cost, and T is the miscellaneous cost.
E is depreciation of buildings and equipment, and LI is staff labor.

[0021]

(Equation 2)

Next, the cost that can be calculated for each product type is calculated as in equation (3). Note that in equation (3), C
Dk is the manufacturing cost of the expense portion directly recorded in the k-th type, MDk is the direct material cost of the k-th type, and Eki is i
Usage time rate data of the k-th type in the k-th manufacturing apparatus, EEi is the depreciation cost of the i-th manufacturing apparatus, Tk is the working time rate data of the k-th type in the total working time of the direct labor cost target worker, LD is the direct labor cost, and n is the total number of manufacturing equipment.

[0023]

(Equation 3)

Next, CIk obtained by equation (2) and equation (3)
The manufacturing cost of the k-th type is calculated by calculating the sum of the CDk obtained in the above. In this way, the production cost for each product type can be obtained.

Next, the operation of the manufacturing cost calculation system will be described with reference to the flowchart of FIG. When the operator inputs a processing instruction to the arithmetic processing means 2 via the input device 5, the burden ratio calculating means 21 refers to the database 31 stored in the storage means 3 and uses the unique parameters of each manufacturing apparatus and the usage time for each type. Read the rate data (step S
1), the calculation of the equation (1) is performed to calculate the share ratio of each type of the common cost generated on the production line, and is stored in the database 31 as the share ratio data of each type. (Step S
2).

Next, the burden cost calculation means 22 refers to the database 31 to read out cost data by cost item, burden rate data for each type, use time rate data for each type of each manufacturing apparatus, and work time rate data for each type (step S1). S3) Based on these data, the calculation of the formula (2) and the calculation of the formula (3) are performed, the sum of the respective results is calculated, the manufacturing cost for each type of semiconductor chip is calculated, and the manufacturing cost data for each type is calculated. Is stored in the database 31 (step S4). The arithmetic processing means 2 outputs the type-specific manufacturing cost data stored in the database 31 to the display device 6, and the display device 6 displays the type-specific manufacturing cost data (step 5).

Next, the hardware configuration of the manufacturing cost calculation system will be described with reference to FIG. As shown in FIG. 3, the manufacturing cost calculation system 1 includes a CPU
(Central processing unit) 41, a memory 42, an input / output interface 43, an external storage device 44, and a communication interface 45. These are a computer system connected by a bus 46. The external storage device 44 is, for example, a readable and writable nonvolatile storage device such as a hard disk drive. Here, the input / output interface 43 is configured to be connectable to input / output devices such as the input device 5 and the display device 6, and the communication interface 45 is configured to be connectable to a communication network. The input device 5 is a data input unit of a computer, for example, a keyboard or a mouse is used. The display device 6 is a monitor display for displaying the output of the computer.

Here, the arithmetic processing means 2 comprises a CPU 41, a memory 42, an input / output interface 43, a communication interface 45, and a bus 46, and the storage means 3 comprises an external storage device 44. External storage device 44
Is a recording medium on which a manufacturing cost calculation program is recorded. The burden ratio calculation means 21 and the burden cost calculation means 22 load the manufacturing cost calculation program recorded in the external storage device 44 into the memory 42 and execute it by the CPU 41. It is realized by doing. In this embodiment, the same external storage device 44 is used for the recording medium on which the manufacturing cost calculation program is recorded and the storage means 3 for storing the database 31, but different external storage devices may be used for each. . In this case, the recording medium on which the manufacturing cost calculation program is recorded may be any computer-readable recording medium.

According to this embodiment, in the cost data for each item, which is obtained by classifying the costs incurred in the production line for each item, the items of the common expense portion which cannot be recorded for each type are allocated to each type. Therefore, it is possible to calculate the manufacturing cost for each product type of the semiconductor chip on a factory shipment basis. In addition, the common expense burden ratio for each product type is determined from the unique parameters of each manufacturing device and the usage time rate data for each product type in each manufacturing device, so the manufacturing cost reflects the usage status of each type of manufacturing device. And a result that is realistic.

Next, as a modified example of this embodiment, a manufacturing cost calculation system further including a unit cost calculation means for calculating a manufacturing cost per predetermined manufacturing unit based on a manufacturing cost for each type of semiconductor chip The manufacturing cost calculation system of FIG. In this case, the database 31 of the storage means 3 further stores product type-specific production data. Further, the arithmetic processing means 2 includes a storage means 3
The production cost and production data for each product calculated by the burden cost calculation means 22 are read from the database 31 of
Unit cost calculating means for calculating the manufacturing cost per predetermined manufacturing unit in each product type by dividing the product cost for each product type by the production amount for each product type is further provided. Here, the production data for each product type includes lot number data for each product type, wafer production number data for each lot, semiconductor chip number data per wafer for each product type, and yield data for each product type. These data stored in the storage means 3 are:
The input can be made from the input device using the production management data for each product type registered in the production management system of the semiconductor factory.

Here, the manufacturing cost per predetermined manufacturing unit includes the manufacturing cost of the minimum manufacturing unit before being divided into products, and the manufacturing cost of one product. Taking a semiconductor chip manufacturing cost calculation system as an example, a minimum manufacturing unit before dividing into products is a wafer, and a product is a semiconductor chip cut out from a wafer. Therefore, by dividing the manufacturing cost for each product type by the number of wafers produced for each product type, the manufacturing cost per wafer for each product type, that is, the manufacturing cost for the minimum manufacturing unit before being divided into products is calculated. Further, the manufacturing cost per semiconductor chip per product type, that is, the product cost per product type, is divided by the product of the number of semiconductor chips per wafer and the yield of semiconductor chips in the product type. 1
The manufacturing cost for each unit is calculated.

In this case, the manufacturing cost per wafer for each product type is calculated as shown in equation (4). In equation (4), WCk is the manufacturing cost per wafer of the k-th type, and CIk is k calculated by equation (2).
The production cost of the common expense portion allocated to the second type,
CDk is the manufacturing cost of the expense portion directly calculated for the k-th type obtained by equation (3), LNk is the number of production lots in the k-th type, and WNk is the number of wafers produced per lot in the k-th type.

[0033]

(Equation 4)

Further, the manufacturing cost per semiconductor chip for each product type is obtained by calculating the manufacturing cost per wafer for each product type calculated by equation (4) as shown in equation (5). It is calculated by dividing by the product of the number of semiconductor chips per chip and the yield of semiconductor chips of the type. In equation (5), CCk is the manufacturing cost per semiconductor chip of the k-th type, DN
k is the number of semiconductor chips per wafer in the k-th type, and Yk is the yield of semiconductor chips in the k-th type.

[0035]

(Equation 5)

Here, the unit cost calculation means reads out the production data for each product type including the production lot number data for each product type and the wafer production number data for each lot from the database 31 of the storage means 3, and outputs the production data for each product type and the burden cost. Formula (4) is calculated using the manufacturing cost data for each type of semiconductor chip calculated by the calculating means 22 to calculate the manufacturing cost per wafer of each type and stored in the database 31 as manufacturing cost data for each wafer. I do.

Further, when calculating the manufacturing cost per semiconductor chip for each product type, the unit cost calculating means uses the database 31 of the storage means 3 to manufacture the manufacturing cost data for each type of wafer and one wafer for each type. Reads out the data on the number of semiconductor chips per unit and the production amount data on each product type including the yield data on each product type, calculates the formula (5), calculates the manufacturing cost per semiconductor chip of each product type, and calculates the manufacturing cost per chip. Database 3 as data
1 is stored. The manufacturing cost data for each wafer and the manufacturing cost data for each chip stored in the database 31 are read out by the arithmetic processing means 2 and read out by the display device 6.
Is output to the display device 6.

The unit cost calculating means, like the burden rate calculating means 21 and the burden cost calculating means 22, stores the manufacturing cost calculating program recorded in the external storage device 44 in the memory 4.
2 is executed by the CPU 41. According to this modification, it is possible to calculate the manufacturing cost per wafer or semiconductor chip of each type from the calculated type-specific manufacturing cost and type-specific production amount data. In this case, since the production amount data for each product type includes the yield data for each product type, manufacturing costs per wafer or per semiconductor chip can be obtained that are realistic.

Here, the yield data for each product type may be a total value of past performance data in a predetermined period, or may be a performance value for each lot or wafer. When the total value of the past performance data in the predetermined period is used, the manufacturing cost per wafer or each semiconductor chip in this period can be calculated. In the case of the actual value for each lot or wafer, the past actual value and the latest actual value are used to estimate the fluctuation tendency of the manufacturing cost per wafer or semiconductor chip due to a change in the yield of the same product. It can be easily grasped. Also,
It is also possible to obtain the future production cost forecast of the semiconductor chip by using the future burden rate forecast and the yield forecast as data.

Here, the manufacture of the semiconductor chip has been described as an example. Therefore, in the calculation of the formulas (4) and (5) performed by the unit cost calculating means to calculate the manufacturing cost per a predetermined manufacturing unit, We used production lot number data, wafer production number data for each lot, semiconductor chip number data per wafer for each type, and yield data for each type.
The production amount for each predetermined production unit, which is divided from the production cost for each product type, is not limited to these, and may be any number of normal finished products. That is, depending on the product to be manufactured, only the number of products for each type may be used, or the product of the number of products for each type and the yield for each type may be used.

Further, in this embodiment, the common expense portion is allocated to each product by the equation (2). However, in the production line, the entire operation time of the production equipment is used for production of the product. It is also used for the production of prototypes and the processing of wafers for quality confirmation, etc., so that the sum of the burden rates of the respective products often does not become one. In such a case, it is also possible to allocate the difference as a part of the common cost to the product cost of each product and calculate the difference. In this case, the manufacturing cost of the common expense portion allocated to each product type may be calculated using Expression (6) instead of Expression (2). In the equation (6), m is the total number of varieties.

[0042]

(Equation 6)

The manufacturing cost calculation system according to this embodiment can also calculate the manufacturing cost for each lot. In this case, the data for each lot is further stored in the database 31 of the storage means 3, or the data for each lot is stored in the database 31 of the storage means 3 in place of the data for each product type, so that the data is used for the calculation. What is necessary is just to comprise. That is, the usage time rate data for each lot of each manufacturing apparatus is stored in the database 31 of the storage means 3,
The work time rate data for each lot of the workers of the production line may be stored, and the direct material cost data of the cost data for each item may be stored for each lot. In Equation (1), αk may be the k-th lot burden ratio with respect to all lots in a predetermined period, and Eki may be the k-th lot use time rate data in the i-th manufacturing apparatus. In this way, the burden ratio for each lot can be calculated in the same manner as the calculation of the manufacturing cost for each product type. Further, CIk in equation (2) is the manufacturing cost of the common expense part allocated to the k-th lot, and CDk in equation (3) is the manufacturing cost of the expense part directly recorded in the k-th lot, MDk
Is the direct material cost of the k-th lot, Eki is the usage time rate data of the k-th lot in the i-th manufacturing apparatus, Tk
Is the working time rate data of the k-th lot in the total working time of the worker who is directly subject to the labor cost, and the CI calculated by the equation (2)
The manufacturing cost of the k-th lot may be calculated by calculating the sum of k and CDk obtained by equation (3). In this way, the production cost for each lot can be calculated in the same manner as the calculation of the production cost for each product type.

Further, similarly, the manufacturing cost per one wafer or one semiconductor chip in the lot can be calculated from the manufacturing cost for each lot.
In this case, the manufacturing cost per wafer may be obtained by dividing the manufacturing cost for each lot by the wafer production number data for each lot. The manufacturing cost per semiconductor chip may be obtained by dividing the manufacturing cost per wafer by the product of data on the number of semiconductor chips per wafer and yield data per wafer. In this way, the manufacturing cost of each lot can be determined based on the burden ratio of each lot, and the manufacturing cost of each semiconductor chip can be determined according to the yield fluctuation.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 shows a second embodiment of the present invention.
FIG. 3 is a block diagram showing a configuration of a semiconductor chip manufacturing cost calculation system according to an embodiment of the present invention, and the same parts as those in FIG. The manufacturing cost calculation system 11 includes an arithmetic processing unit 2 and a storage unit 3, and has a communication network 52 connected to the input device 5, the display device 6, and the manufacturing management system 51 of the manufacturing line 54.
And are connected.

The arithmetic processing means 2 comprises:
The storage unit 3 includes a burden cost calculation unit 22, a unit cost calculation unit 23, a usage rate calculation unit 24, and a result data collection unit 25. The storage unit 3 includes a database 31 and a result data storage unit 32. The database 31 stores cost data by cost, which classifies and accumulates costs incurred in the manufacturing line for each cost item, unique parameters of each manufacturing apparatus installed in the manufacturing line, and usage time rate data for each product type. The type-specific work time rate data and the type-specific production amount data of the line operator are stored. here,
Product-specific production data includes product-specific production lot number data,
It has data on the number of wafers produced per lot for each type, data on the number of semiconductor chips per wafer for each type, yield data for each type, and the like. The actual data storage means 32 stores actual use time data for each lot for each type of each manufacturing apparatus.

Here, the communication network 52 is connected to terminals 56 corresponding to the respective manufacturing apparatuses 55 of the manufacturing line 54, and these terminals 56 are connected to the corresponding lots of the respective manufacturing apparatuses 55. A storage device 57 for storing the usage time is provided. In this case, it is desirable that the terminal 56 and the manufacturing apparatus 55 are connected by a communication line, and the terminal 56 automatically collects the actual use time data for each lot from the manufacturing apparatus 55 every time the production is performed. 5
5 may be input to the terminal 56 in accordance with the start and end of use. The production management system 51 communicates with the storage device 57 of these terminals 56 via the communication network 52.
, And collects the actual use time data for each lot for each type of manufacturing apparatus and stores the data in the storage device 53.

In such a configuration, the burden ratio calculating means 21, the burden cost calculating means 22, the unit cost calculating means 23
The data stored in the database 31 are the same as those described in the first embodiment, and a description thereof will be omitted. The performance data collection unit 25 is connected to the storage device 53 of the manufacturing management system 51 via the communication network 52
And collects the actual use time data for each lot for each type of manufacturing apparatus stored in the actual data storage unit 32.

The utilization rate calculating means 24 refers to the actual use time data for each lot for each type of each manufacturing apparatus stored in the actual data storage means 32 and refers to the actual use time for each lot for each type of each manufacturing apparatus during a predetermined period. After summing up the use time data and calculating the actual use time data of each type in each manufacturing apparatus, the operation of Expression (7) is performed, the type use time rate of each type of each manufacturing apparatus is calculated, and Database 31
Is stored as usage time rate data for each type. In equation (7), Eki is k in the i-th manufacturing apparatus.
ETik is the actual use time data of the k-th type in the i-th manufacturing apparatus, and m is the total number of the types.

[0050]

(Equation 7)

Next, the operation of the manufacturing cost calculation system of this embodiment will be described with reference to the flowchart of FIG. When the operator inputs a processing instruction to the arithmetic processing means 2 via the input device 5, the result data storage means 32 stores the type of each manufacturing device stored in the storage device 53 of the manufacturing management system 51 via the communication network 52. The actual use time data for each lot is collected and stored in the actual data storage means 32 (step S11). Next, the usage rate calculating means 24
After reading the actual use time data for each lot of each type of each manufacturing apparatus during the predetermined period from the actual data storage means 32 (step S12), totaling the data, and calculating the actual use time data for each type of each manufacturing apparatus, The calculation of (7) is performed to calculate the usage time rate for each type of each manufacturing apparatus, and is stored in the database 31 of the storage unit 3 as the usage time rate data for each type (step S13).

Next, the load ratio calculating means 21 reads the unique parameters of each manufacturing apparatus and the usage time rate data for each type with reference to the database 31 stored in the storage means 3 (step S14). The calculation is performed to calculate the share ratio of each type of the common cost generated in the production line, and the result is stored in the database 31 as the share ratio data of each type (step S15). Next, the burden cost calculation means 22 refers to the database 31 and reads out cost data by cost item, burden rate data for each type, use time rate data for each type of production equipment, and work time rate data for each type (step S1).
6) Based on these data, the calculation of the equation (2) and the calculation of the equation (3) are performed, and the sum of the respective results is calculated to calculate the manufacturing cost for each type of semiconductor chip. Is stored in the database 31 (step S17).

Next, the unit cost calculation means 23 stores the production lot data for each kind including the production lot number data for each kind and the wafer production number data for each lot from the database 31 of the storage means 3, and the production cost data for each kind. Are read out (step S18), the calculation of equation (4) is performed to calculate the manufacturing cost per wafer of each type, and stored in the database 31 as manufacturing cost data for each type of wafer (step S19).

Further, the unit cost calculating means 23 stores the manufacturing cost data for each wafer for each product type, the number of semiconductor chips per wafer for each product type, and the yield data for each product type from the database 31 of the storage means 3. The production amount data is read out (step S20), and equation (5) is obtained.
To calculate the manufacturing cost per semiconductor chip of each type and store it in the database 31 as manufacturing cost data for each chip (step S21). Next, the arithmetic processing means 2 reads out the manufacturing cost data for each type, the manufacturing cost data for each wafer, and the manufacturing cost data for each chip stored in the database 31 and reads them out.
And the display device 6 displays these data (step S22).

The hardware configuration of this manufacturing cost calculation system is the same as that of the first embodiment shown in FIG. Here, the burden rate calculating means 21, the burden cost calculating means 22, the unit cost calculating means 23, the utilization rate calculating means 24 and the performance data collecting means 25 store the manufacturing cost calculating program recorded in the external storage device 44 in the memory 42. This is realized by being loaded and executed by the CPU 41. Note that the manufacturing cost calculation program may be a single program,
It may be configured by an individual program that executes each processing of the burden cost calculation, the unit cost calculation, the usage rate calculation, and the actual data collection.

According to this embodiment, the manufacturing cost for each product type, the manufacturing cost for each wafer for each product type, and the manufacturing cost for each chip for each product type are calculated based on the actual use time of each product type for each product type. , Making a more accurate production plan. Further, since the actual use time data for each lot for each type of each manufacturing apparatus is directly input from the storage device 53 of the manufacturing management system 51 via the communication network 52, it is possible to reduce the data input by the operator from the input device. It becomes possible and work efficiency improves.

Here, the case of calculating the manufacturing cost for each product type has been described. However, the manufacturing cost calculation system according to this embodiment can also calculate the manufacturing cost of each lot. In this case, the usage rate calculating means 2
Reference numeral 4 refers to the actual data storage means 32, sums up the actual use time data for each lot of each manufacturing apparatus for a predetermined period, and then performs the same calculation as the equation (7) to calculate the actual use time data for each lot of each manufacturing apparatus. The rate may be calculated and stored as the use time rate data for each lot in the database 31 of the storage means 3. Here, Eki in equation (7) is the lot use time rate data of the k-th lot in the i-th manufacturing apparatus, ET
ik may be the actual use time data of the k-th lot in the i-th manufacturing apparatus, and m may be the total number of lots. By doing so, as described in the first embodiment,
The burden rate for each lot can be calculated in the same manner as the calculation of the production cost for each type, and the production cost for each lot can be calculated based on the burden rate for each lot.

Further, similarly, the manufacturing cost per wafer or per semiconductor chip in the lot can be calculated from the manufacturing cost for each lot.
In this case, the manufacturing cost per wafer may be obtained by dividing the manufacturing cost for each lot by the wafer production number data for each lot. The manufacturing cost per semiconductor chip may be obtained by dividing the manufacturing cost per wafer by the product of data on the number of semiconductor chips per wafer and yield data per wafer.

Further, the production management system 51 is configured to output the production lot number data for each type, the wafer production number data for each lot, the semiconductor chip number data per wafer for each type, and the yield data for each type. When the data is stored in the storage device 53, the performance data collection unit 25 reads out the data via the network 52 and writes the data to the database 31 of the storage unit 3 of the manufacturing cost calculation system 11. Is also good. In this case, the production cost for each product type, the production cost per wafer for each product type, and the In addition to calculating the manufacturing cost per chip, it is also possible to calculate the actual manufacturing cost per product in a certain period of a specific product type, the actual manufacturing cost per product in a specific lot, and the like. This makes it possible to easily grasp the tendency of the manufacturing cost to fluctuate due to a change in the yield of the same product type.

When the production management system 51 collects the actual work times of the workers of the production line for each product type and each lot and stores it in the storage device 53, the storage means of the production cost calculation system 11 Database 3 of 3
1 is configured to collect and store the actual work time for each product type and each lot from the storage device 53 of the manufacturing management system 51 via the network 52, and to replace this actual work time with Tk × LD in equation (3). The product of the hourly unit prices of the workers may be used. In this case, since the actual value can be used for the operation time, the accuracy of the manufacturing cost is further improved and the operation efficiency is also improved.

The collection of these performance data by the performance data collection means 25 may be performed sequentially with the execution of production. In addition, calculation of manufacturing costs for each product type and product 1
The use time for each product type, the work time for each product type, and the work time for each product sent from the production management system 51 to calculate the production cost per unit
An operator may be able to specify whether or not to use actual data such as the production amount for each type from the input device. In this case, even when there is no actual data as in the case of budgeting, it is possible to make a production plan based on market prediction, and it is possible to calculate profit and loss for each product type or for each product.

[0062]

As described above, the manufacturing cost calculation system according to the present invention relates to cost data classified by cost, which is obtained by classifying costs generated in the manufacturing line for each cost item, and the manufacturing apparatus installed in the manufacturing line. Storage means for storing the unique parameters and the time-of-use data for each cost calculation object in the manufacturing apparatus; reading the unique parameters relating to the manufacturing apparatus and the use-time rate data for each cost calculation object in the manufacturing apparatus from the storage means; A load ratio calculating means for calculating a load ratio for each cost calculation target for allocating the cost of the common expense portion in the cost data for each cost item for each cost calculation target; Allocate the cost of the common expense portion for each cost calculation target based on the calculated burden ratio for each cost calculation target Cost calculation means for calculating a manufacturing cost for each cost calculation target, so that costs incurred in a manufacturing line for manufacturing a plurality of types of products such as a semiconductor chip manufacturing line can be easily calculated for each cost calculation target. Can be calculated. As a result, it is possible to analyze and examine the profit situation for each product type or each lot, and it is possible to obtain a detailed production plan.

Further, since unit cost calculating means is provided,
It is possible to calculate the manufacturing cost per predetermined manufacturing unit for each product type, and to understand the tendency of manufacturing cost fluctuation due to the change in yield in a manufacturing line where the product yield fluctuates like a semiconductor chip manufacturing line. can get. In addition, since actual data collection means is provided, the actual cost collected by the production line is used to calculate the manufacturing cost for each product type, for each lot, for each minimum production unit before being divided into products, or for each product. As a result, a more accurate production plan can be made. Further, it is possible to reduce the data input by the worker, so that the effect of improving work efficiency can be obtained.

[Brief description of the drawings]

FIG. 1 is a block diagram showing the configuration of a semiconductor chip manufacturing cost calculation system according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a processing operation of the manufacturing cost calculation system illustrated in FIG. 1;

FIG. 3 is a diagram illustrating a hardware configuration of the manufacturing cost calculation system illustrated in FIG. 1;

FIG. 4 is a block diagram showing a configuration of a semiconductor chip manufacturing cost calculation system according to a second embodiment of the present invention.

FIG. 5 is a flowchart illustrating a processing operation of the manufacturing cost calculation system illustrated in FIG. 4;

[Explanation of symbols]

1, 11: manufacturing cost calculation system, 2: arithmetic processing means, 3: storage means, 5: input device, 6: display device, 21
... Burden ratio calculating means, 22. Burden cost calculating means, 23... Single item cost calculating means, 24... Usage rate calculating means, 25. ... memory, 43 ... input / output interface, 44 ... external storage device, 45 ... communication interface, 46 ... bus, 51 ... manufacturing management system,
52 communication network, 53, 57 storage device, 54
... production line, 55 ... production equipment, 56 ... terminal.

Claims (11)

[Claims] Claims: 1. Cost data classified by cost in which costs incurred in a manufacturing line are classified for each cost item, unique parameters related to manufacturing devices installed in the manufacturing line, and cost parameters for each cost calculation target in these manufacturing devices. Storage means for storing usage time rate data; reading out the unique parameters related to the manufacturing apparatus and usage time rate data for each cost calculation target in the manufacturing apparatus from the storage means; A load ratio calculation unit for calculating a load ratio for each cost calculation target for allocating the cost of the common expense portion for each of the cost calculation targets, and reading the cost itemized cost data from the storage unit;
Based on the burden ratio for each cost calculation target calculated by the burden ratio calculation unit, allocating the cost of the common expense portion to each of the cost calculation targets, and calculating a manufacturing cost for each of the cost calculation targets; A production cost calculation system comprising: 2. The manufacturing cost calculation system according to claim 1, wherein the manufacturing cost for each cost calculation target is a manufacturing cost for each product type or each lot. 3. The cost data according to claim 1, wherein the cost data for each cost item includes at least a depreciation cost and a power cost of a building and equipment of the manufacturing line, and the cost calculation unit calculates the cost calculation target. A manufacturing cost calculation system, wherein a depreciation cost and a power cost of a building and facilities of the manufacturing line are allocated to manufacturing costs for each of the cost calculation targets based on each burden rate. 4. The manufacturing cost calculation system according to claim 1, wherein the unique parameter related to the manufacturing apparatus is a purchase amount of the manufacturing apparatus. 5. The storage unit according to claim 1, wherein the storage unit further stores production amount data for each cost calculation target, and reads out the production amount data for each cost calculation target from the storage unit. Based on the manufacturing cost for each cost calculation target calculated by the burden cost calculation means,
A manufacturing cost calculation system further comprising unit cost calculation means for calculating a manufacturing cost per predetermined manufacturing unit in each cost calculation target. 6. The production method for each cost calculation object according to claim 5, wherein the production amount data for each cost calculation object includes yield data for each cost calculation object, and the unit cost calculation means includes the yield data for each cost calculation object. A manufacturing cost calculation system configured to calculate a manufacturing cost per predetermined manufacturing unit in each cost calculation target using quantity data. 7. The manufacturing method according to claim 5, wherein the manufacturing cost per the predetermined manufacturing unit is a manufacturing cost of a minimum manufacturing unit or a single product before dividing the product into products. Cost calculation system. 8. The production data storage unit according to claim 1, wherein actual use time data for each lot of each production device collected on the production line is stored, and A usage rate calculating means for calculating the usage time rate for each cost calculation target for each manufacturing apparatus based on the actual usage time data for each lot, and storing the cost calculation target usage time rate data in the storage means; A production cost calculation system, further comprising: 9. The actual data collection unit according to claim 8, wherein actual use time data for each lot of each of the manufacturing apparatuses collected on the production line is collected via a communication network and stored in the actual data storage unit. A manufacturing cost calculation system comprising: 10. The apparatus according to claim 9, wherein the performance data collecting means is further configured to collect performance data of the production amount data for each cost calculation target and store the performance data in the storage means. Manufacturing cost calculation system. 11. Cost data classified by cost, in which costs incurred in the manufacturing line are classified for each cost item, unique parameters relating to the manufacturing devices installed in the manufacturing line, and cost calculation targets in the manufacturing devices. Storage means for storing usage time rate data, and reading out the unique parameters related to the manufacturing apparatus and usage time rate data for each cost calculation target in the manufacturing apparatus from the storage means, A load ratio calculating means for calculating a load ratio for each cost calculation target for allocating the cost of the common expense portion for each of the cost calculation targets,
Reading the cost data by cost item from the storage means,
Based on the burden ratio for each cost calculation object calculated by the burden ratio calculation means, the cost of the common expense portion is allocated to each of the cost calculation objects, and the production cost for each of the cost calculation objects is calculated. And a computer-readable recording medium in which a manufacturing cost calculation program for causing a computer to function is recorded.