JP2002071579A - Method and device for inspecting film carrier tape for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for inspecting a film carrier tape for mounting electronic component capable of correctly and accurately performing quality inspections such as lead pattern failures on the film carrier tape for mounting electronic components of the specifications of a large number of rows. SOLUTION: When a reference origin O (0, 0) is set at the center 103a of a reference electronic component mounting part 102a, the distance between an electronic component mounting part adjacent in the widthwise direction and the reference location is (a), and the distance between an electronic component mounting part adjacent in the longitudinal direction and the reference location is (b); the locations of each electronic component mounting part is computed. On the basis of the locational information of the locations Pm, n (ma, nb) of the electronic component mounting parts, the size (x) in the widthwise direction and longitudinal size (y) of the electronic component mounting part, the inspection region data of the inspection region of each electronic component mounting part is computed. On the basis of the inspection region data of each electronic component mounting part, the inspecting device is moved in the widthwise direction X and/or in the longitudinal direction Y to inspect the inspection region of each electronic component mounting part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape (TAB (Tape Automate
g) Tape, T-BGA (Tape Ball Grid Array) tape,
CSP (Chip Size Package) tape, ASIC (Appli)
cation Specific Integrated Circuit) tape
A method for inspecting a film carrier tape for mounting an electronic component and a device for inspecting the film carrier tape for mounting an electronic component for detecting a failure of a wiring pattern of the film carrier tape for mounting an electronic component (hereinafter, simply referred to as “film carrier tape for mounting an electronic component”). About.

[0002]

2. Description of the Related Art With the development of the electronics industry,
The demand for printed wiring boards on which electronic components such as C (integrated circuits) and LSIs (large-scale integrated circuits) are mounted has been rapidly increasing, but there has been a demand for smaller, lighter, and more sophisticated electronic devices. Recently, TAB has been used as a mounting method for these electronic components.
A mounting method using a tape, a T-BGA tape, an ASIC tape, or the like is employed. In particular, a liquid crystal, such as a personal computer, which is required to have a high definition, a thin shape, and a narrow frame area of a liquid crystal screen is required. Display element (LC
D) is becoming increasingly important in the electronics industry.

[0003] In such a film carrier tape for mounting an electronic component, a pattern defect such as an electrical disconnection, a short circuit, a chip, or a protrusion of a lead is inspected in each manufacturing process and a final process of the film carrier tape for mounting an electronic component. Quality inspections have been conducted.

[0004]

In a conventional film carrier tape for mounting electronic components, one electronic component mounting portion is arranged in the width direction of the tape. Since the positions of the parts correspond to each other, it was possible to stop the conveyance of the film carrier tape for mounting electronic components on the basis of the sprocket holes and accurately position the film carrier tape with respect to an inspection device such as a microscope.

However, recently, in particular, the above B
As in the case of GA and CSP, in reality, a multi-row specification having a plurality of electronic component mounting portions in the width direction of a film carrier tape for mounting electronic components, which is called so-called multi-cavity, is in reality. That is, in the multi-piece film carrier tape 200 for mounting electronic components, as shown in FIG. 5, a plurality of electronic component mounting portions 202 are arranged in the width direction (column direction) and the longitudinal direction (frame direction). The electronic component mounting unit block 204 is formed, and the electronic component mounting unit blocks 204 are continuously arranged in the longitudinal direction with a certain interval therebetween.

In this case, as shown in FIG. 5, the interval between the sprocket holes 206 is, for example, 4.750 mm, while the longitudinal dimension of the electronic component mounting portion 202 is, for example, 6.250 mm. Therefore, since the position of the sprocket hole 206 and the position of the electronic component mounting portion 202 do not correspond to each other,
It is impossible to stop the transport of the film carrier tape for mounting electronic components on an inspection device such as a microscope and perform accurate positioning.

[0007] For this reason, conventionally, after stopping the transport of the film carrier tape for mounting electronic components on the basis of the sprocket hole, the inspection device such as a microscope is manually moved to the inspection area of the electronic component mounting portion to be inspected. It must be moved and inspected, which requires complicated work, and
The inspection device could not be moved to a specified location with high positional accuracy, and an accurate inspection could not be performed.

[0008] The present invention takes into account such a current situation,
For film carrier tapes for mounting multiple electronic components, such as GA and CSP, so-called multi-cavity specifications, the quality of the leads of each electronic component mounting area such as electrical disconnection, short-circuit, chipping, projections, and other pattern defects. It is an object of the present invention to provide a method for inspecting a film carrier tape for mounting electronic components and an apparatus for inspecting a film carrier tape for mounting electronic components, which can perform the inspection accurately and accurately.

Further, the present invention provides an electric disconnection of a lead,
Inspection method for film carrier tape for mounting electronic components, which can perform defective marking by punching, inking, etc. on the defective part accurately and accurately based on the result of quality inspection such as short circuit, chipping, protrusion and other pattern defects It is another object of the present invention to provide an inspection device for a film carrier tape for mounting electronic components.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned problems and objects in the prior art, and the method for inspecting a film carrier tape for mounting electronic parts according to the present invention is described below. An electronic component mounting section block in which a plurality of electronic component mounting sections are arranged in the width direction and the longitudinal direction is a wiring pattern of an electronic component mounting film carrier tape in which the electronic component mounting section blocks are continuously arranged at regular intervals in the longitudinal direction. What is claimed is: 1. A method for inspecting a film carrier tape for mounting an electronic component, the method comprising the steps of: detecting sprocket holes formed continuously in a longitudinal direction of the film carrier tape for mounting an electronic component; So that the block is located at the inspection position of the inspection device,
The transport of the electronic component mounting film carrier tape is stopped, and the reference position at the center of the electronic component mounting portion serving as the reference in the electronic component mounting portion block is set to the reference origin O.
As (0,0), a is the distance to the reference position of the electronic component mounting portions adjacent to each other in the width direction, and b is the distance to the reference position of the electronic component mounting portions adjacent to each other in the longitudinal direction. The position Pm, n (ma, nb) of the electronic component mounting portion is calculated, where m is the m-th position of the electronic component mounting portion in the width direction from the reference electronic component mounting portion, and n is
The n-th position of the electronic component mounting unit in the longitudinal direction from the electronic component mounting unit serving as a reference is shown. The position information of the position Pm, n (ma, nb) of each electronic component mounting unit, and the width of the electronic component mounting unit Based on the dimension x in the direction and the dimension y in the longitudinal direction,
Inspection area data of the inspection area of each electronic component mounting unit is calculated, and based on the inspection area data of each electronic component mounting unit, the inspection device is moved in the width direction X and / or the longitudinal direction Y, and each electronic component is mounted. The inspection area of the mounting unit is inspected.

In the inspection apparatus for a film carrier tape for mounting an electronic component according to the present invention, the electronic component mounting section block, in which a plurality of electronic component mounting sections are arranged in the width direction and the longitudinal direction, is separated by a predetermined distance in the longitudinal direction. An electronic component mounting film carrier tape inspection device for inspecting the wiring pattern of the electronic component mounting film carrier tape that is continuously arranged in a continuous manner in the longitudinal direction of the electronic component mounting film carrier tape. On the basis of the sprocket hole formed as a reference, the transport of the electronic component mounting film carrier tape is stopped so that the electronic component mounting block to be inspected is located at the inspection position of the inspection device, and the electronic component is mounted. The reference position at the center of the electronic component mounting portion serving as the reference in the mounting portion block is set to the reference origin O (0, 0,
0), the distance to the reference position of the electronic component mounting portions adjacent to each other in the width direction is a, and the distance to the reference position of the electronic component mounting portions adjacent to each other in the longitudinal direction is b. The position Pm, n (ma, nb) of the component is calculated, where m is the m-th position of the electronic component mounting portion in the width direction from the electronic component mounting portion serving as a reference, and n is the reference. The n-th position of the electronic component mounting portion in the longitudinal direction from the electronic component mounting portion is shown, and the position P of each of the electronic component mounting portions is shown.
Based on the position information of m, n (ma, nb), the width dimension x of the electronic component mounting part, and the longitudinal dimension y, arithmetic processing of the inspection area data of the inspection area of each electronic component mounting part is performed. And an inspection device movement control device for moving the inspection device in the width direction X and / or the longitudinal direction Y based on the position information and the inspection region data from the arithmetic processing device. Features.

[0012] With this configuration, each electronic component can be referenced with respect to the electronic component mounting portion serving as the reference in the electronic component mounting portion block, without reference to the sprocket hole of the film carrier tape for mounting electronic components. The position is calculated by the mounting unit, and the position information can be obtained.
Then, based on the position information, the dimension x in the width direction of the electronic component mounting portion, and the dimension y in the longitudinal direction, it can be obtained by performing arithmetic processing on the inspection region data of the inspection region of each electronic component mounting portion. it can.

Accordingly, by moving the inspection device in the width direction X and / or the longitudinal direction Y based on these data, the inspection area of each electronic component mounting portion can be obtained.
Accurate quality inspection can be performed with high positional accuracy.
In addition, the inspection method of the electronic component mounting film carrier tape of the present invention, based on the inspection result of the inspection region of each of the electronic component mounting unit, the inspection area of each electronic component mounting unit where a defect is detected, The defective marking is performed by moving the defective marking device in the width direction X and / or the longitudinal direction Y based on the inspection area data of the electronic component mounting section.

Further, according to the inspection apparatus for a film carrier tape for electronic component mounting of the present invention, based on the inspection result of the inspection region of each electronic component mounting section, the inspection area of each electronic component mounting section where a defect is detected is provided. A defect marking device for performing defect marking by moving in the width direction X and / or the longitudinal direction Y based on the inspection area data of each of the electronic component mounting units.

With this configuration, the defect is detected by moving the defect marking device in the width direction X and / or the longitudinal direction Y based on the inspection result of the inspection area of each electronic component mounting portion. In addition, the inspection area of each electronic component mounting unit can be positioned, and the inspection area of each electronic component mounting unit can be accurately inspected with good positional accuracy.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an inspection device for a film carrier tape for mounting electronic components according to the present invention. As shown in FIG. 1, reference numeral 10 denotes an inspection device for a film carrier tape for mounting electronic components according to the present invention.

As shown in FIG. 1, an inspection device 10 for a film carrier tape for mounting an electronic component includes
0, defective pattern inspection device 30, and marking device 4
0 and a winding device 50. The delivery device 20 is wound with a film carrier tape T for mounting an electronic component, which is a type of electronic component mounting film carrier tape T such as CSP or BGA, for which the manufacturing process has been completed, via a spacer S. The reel R thus mounted is mounted on the delivery drive shaft 22. Then, by driving a drive motor (not shown), the feed drive shaft 22 rotates, and the film carrier tape T for mounting electronic components is fed out from the reel R together with the spacer S. To be supplied to

As shown in FIG. 1, the feeding device 20 is provided with three position sensors 28 in the vertical direction. The lower position sensors allow the film carrier tape T for mounting electronic components to be loosened. When the lower end T 'of the portion is detected, the driving of the drive motor of the feeding device 20 is stopped to prevent the electronic component mounting film carrier tape from being excessively slack and coming into contact with the floor and being damaged. Has become. When the lower end T 'of the slack portion of the electronic component mounting film carrier tape T is detected by the upper position sensor, the drive motor of the feeding device 20 starts to be driven and a certain electronic component mounting film is started. The carrier tape is kept loose.

The film carrier tape T for mounting electronic components supplied to the defective pattern inspection device 30 is connected to a back tension gear 32 and a drive gear 34 provided in the defective pattern inspection device 30 via a guide roller 31. During the passage, the drive of the drive gear 34 is temporarily stopped, the supply of the electronic component mounting film carrier tape is stopped, and the back tension engaging with the sprocket hole of the electronic component mounting film carrier tape is stopped. The reverse rotation of the gear 32 accurately positions the film carrier tape for mounting electronic components at a predetermined position.

As shown in FIG. 2, a film carrier tape T for mounting electronic components such as BGA and CSP has a plurality of electronic components in a width direction of the film carrier tape for mounting electronic components. The reality is that the multi-row specification having a component mounting section has been adopted. That is, as shown in FIG. 2, in the multi-piece film carrier tape 100 for mounting electronic components, a plurality of electronic component mounting portions 102 are provided in the width direction (column direction) X and the longitudinal direction (frame direction) Y. The arrayed electronic component mounting block 104 is formed, and the electronic component mounting block 104 is continuously arrayed at a predetermined interval in the longitudinal direction.

In this case, as shown in FIG. 2, the interval between the sprocket holes 106 is, for example, 4.750 mm, while the longitudinal dimension of the electronic component mounting portion 102 is, for example, 6.250 mm. Therefore, the position of the sprocket hole 106 and the position of the electronic component mounting portion 102 do not correspond to each other.
It is impossible to stop the transport of the film carrier tape for mounting electronic components to an inspection device such as a CCD camera or a microscope to perform accurate positioning.

Therefore, in the present invention, first, as shown in FIG. 2, in the electronic component mounting portion 102 in the electronic component mounting portion block 104, the position of the sprocket hole 106 and the center of the electronic component mounting portion 102 The electronic component mounting unit 102a having the same position 103 is selected. The center 10a of the electronic component mounting unit 102a is positioned so that the center 103a of the electronic component mounting unit 102a is located at the inspection center position of the inspection apparatus.
The transport of the electronic component mounting film carrier tape is stopped with reference to the sprocket hole 106a whose position coincides with 3a.

In this state, as shown in FIG. 3, the reference position of the center 103a of the electronic component mounting portion 102a serving as the reference in the electronic component mounting portion block 104 is set to the reference origin OO.
(0, 0). The distance to the reference position of the electronic component mounting portions adjacent to each other in the width direction is defined as a, and the distance to the reference position of the electronic component mounting portions adjacent to each other in the longitudinal direction is defined as b. The position Pm, n (ma,
nb) is calculated.

For example, in the electronic component mounting film carrier tape 100 shown in FIG. 2, both a and b are 6.250.
mm. Here, m is the m-th position of the electronic component mounting portion in the width direction from the reference electronic component mounting portion, n
Indicates the n-th position of the electronic component mounting portion in the longitudinal direction from the reference electronic component mounting portion.

That is, as shown in FIG. 3, if the width direction is the X axis and the longitudinal direction is the Y axis, the reference origin O is P0,
0 = (0,0), and the center position of each electronic component mounting portion is P1,0 = (a, 0), P2,0 = (2a, 0),
P3,0 = (3a, 0),..., Pm, 0 = (ma,
0),... P0,1 = (0, b), P0,2 = (0,2
b), P0,3 = (0,3b),... Pm, n (m
a, nb).

Based on the position information thus obtained, the width dimension x of the electronic component mounting section 102, and the longitudinal dimension y, the inspection area data D of the inspection area of each electronic component mounting section is obtained. Is calculated. That is, D = (ma + Xa, nb
+ Yb) is obtained as the inspection area data. Here, Xa indicates the size of the product in the X direction, and Yb indicates the size of the product in the Y direction.

Then, based on the inspection area data of each electronic component mounting portion obtained in this manner, the defective pattern inspection device 30 is moved in the width direction X and / or the longitudinal direction Y by a known XY stage mechanism (not shown). Move it,
The inspection area of each electronic component mounting section (eg, starting from the oblique line D1 in FIG. 3) is inspected. The defective pattern inspection device 30 can visually inspect various quality inspections such as disconnection, short circuit, chipping, and protrusion of the wiring pattern of the film carrier tape for mounting electronic components as a stereo microscope.

However, the wiring pattern can be automatically implemented as follows. That is, the reflected light projected from the reflected light irradiation device 36 disposed below the electronic component mounting film carrier tape T in the defective pattern inspection device 30 is applied to the electronic component mounting film carrier tape T. Then, the reflected light reflected on the film carrier tape T for mounting electronic components is transferred to a CCD called a line sensor disposed below the film carrier tape T for mounting electronic components in the defective pattern inspection device 30.
The light is received by the camera 38. In this embodiment, the pattern inspection using the reflected light has been described. However, the present invention is not limited to this, and can be used for a pattern inspection using transmitted light, for example.

By the way, the defective pattern inspection apparatus 30
Then, as shown in FIG. 4, the lead wiring pattern information recognized by the CCD camera 38 is transmitted to the control device 80.
To be entered. In the control device 80, the input information is stored in a storage unit 82 such as a RAM, and a normal wiring pattern (master pattern) input in advance in the storage unit 82 is compared with a comparison operation unit 8.
4 are compared. If the comparison calculation unit 84 determines that the data is defective, the result is output to a display device 86 such as a CRT.

That is, when the comparison operation section 84 determines that the wiring pattern is defective, the information of the wiring pattern determined to be defective from the storage section 82 such as a RAM and the normal master pattern are stored in the image processing circuit 81. The image processing is performed by a pattern matching method, and is output to a display device 86 such as a CRT. The images are aligned and superimposed on the display device 86.

The information of the wiring pattern imaged (taken in) by the CCD camera 38 is converted into digital information by an A / D converter as disclosed in, for example, JP-A-6-27312 and JP-A-7-110863. The edge pattern data is obtained by converting the image into a gray level image and converted into a binary image. The edge data is compared with the edge data (binary information) of the master pattern of a non-defective product stored in advance. Inspection for defects.

When the defective pattern inspection device 30 determines that the position is defective, the position of the defective portion, that is, the position of the defective portion in the longitudinal direction and the width direction of the film carrier tape for mounting electronic components is separately input. Control device 90 of marking device 40 for marking a defect on a film carrier tape for mounting electronic components by king, punching, or the like.
Output to

As described above, the film carrier tape T for mounting electronic components, for which the defect of the wiring pattern has been inspected by the defect pattern inspection device 30, is subsequently transferred to the guide roller 3
It is supplied to the marking device 40 via 3 and 41. The film carrier tape T for mounting electronic components supplied to the marking device 40 is the same as that shown in FIG.
As shown in the figure, based on the detection information of the defective portion detected by the defective pattern inspection device 30 while passing through the guide roller 41 from the guide roller 41, that is, based on the inspection result of the inspection area of the electronic component mounting portion, Based on the inspection area data of each electronic component mounting unit, the marking device 40
Are moved in the width direction X and / or the longitudinal direction Y by a known XY stage mechanism (not shown).

In this way, ink or ink is applied to the defective portion (on the front surface or back surface of the film carrier tape for mounting electronic components).
Marking by punching or the like is performed accurately and with high positional accuracy. As described above, after marking is performed at a predetermined position of a defective portion on the front surface or the back surface of the electronic component mounting film carrier tape T by the marking device 40, the electronic component mounting film carrier tape T applies the guide roller 42 to the guide roller 42. After passing through, it is supplied to the next winding device 50.

As shown in FIG. 1, the film carrier tape T for mounting electronic parts supplied to the winding device 50 is provided.
The film carrier tape T for mounting an electronic component is wound on the reel R mounted on the winding drive shaft 52 via a guide roller 53 and driven by a drive motor (not shown). Can be On this occasion,
The spacer S fed from the reel R of the feeding device 20 is supplied to the reel R of the winding device 50 via the guide rollers 57 and 56 and the winding slack preventer 59 and is interposed between the electronic component mounting film carrier tapes. The electronic component mounting film carrier tapes are mounted so as to prevent the ink from adhering to another portion due to contact with each other and the electronic component mounting film carrier tape from being damaged.

As shown in FIG. 1, the winding device 50 is provided with three position sensors 51 in the vertical direction, similarly to the feeding device 20. When the lower end T 'of the slack portion of the mounting film carrier tape T is detected, the drive of the drive motor of the winding device 50 is stopped, and the electronic component mounting film carrier tape is too loose and comes into contact with the floor. To prevent damage. When the lower end T 'of the slack portion of the electronic component mounting film carrier tape T is detected by the upper position sensor, the drive motor of the winding device 50 is started to drive the electronic component mounting fixed. The slack of the film carrier tape is maintained.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to this. In the above embodiment, the center of the electronic component mounting portion was used as a reference.
Various changes can be made without departing from the object of the present invention, such as by providing a reference point appropriately in the electronic component and using the reference point as a reference.

[0038]

According to the present invention, each electronic component can be referenced with respect to the electronic component mounting portion, which is the reference in the electronic component mounting portion block, without reference to the sprocket holes of the film carrier tape for mounting electronic components. The position is calculated by the mounting unit, and the position information can be obtained.

Then, based on the position information, the dimension x in the width direction and the dimension y in the longitudinal direction of the electronic component mounting portion,
It can be obtained by performing arithmetic processing on the inspection area data of the inspection area of each electronic component mounting unit. Therefore, by moving the inspection device in the width direction X and / or the longitudinal direction Y based on these data, an accurate quality inspection can be performed with good positional accuracy on the inspection region of each electronic component mounting portion. .

Further, according to the present invention, a defect is detected by moving the defect marking device in the width direction X and / or the longitudinal direction Y based on the inspection result of the inspection region of each electronic component mounting portion. It can be positioned in the inspection area of each electronic component mounting part, and it is possible to perform an accurate quality inspection with high positional accuracy on the inspection area of each electronic component mounting part. It is an invention.

[Brief description of the drawings]

FIG. 1 is a front view of an inspection device for a film carrier tape for mounting electronic components according to the present invention.

FIG. 2 is a plan view illustrating a method of inspecting a film carrier tape for mounting electronic components according to the present invention.

FIG. 3 is a schematic plan view illustrating a method for inspecting a film carrier tape for mounting electronic components according to the present invention.

FIG. 4 is a schematic configuration diagram of an inspection device for a film carrier tape for mounting electronic components according to the present invention.

FIG. 5 is a plan view of a film carrier tape for mounting multiple electronic components.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Inspection device 20 Sending device 21 Guide roller 22 Drive shaft 28 Position sensor 30 Defective pattern inspection device 31 Guide roller 32 Back tension gear 33 Guide roller 34 Drive gear 36 Reflected light irradiation device 38 Camera 40 Marking device 41 Guide roller 42 Guide roller 50 Take-up device 51 Position sensor 52 Drive shaft 53 Guide roller 57 Guide roller 59 Dancer roller 80 Control device 81 Image processing circuit 82 Storage unit 84 Comparison operation unit 86 Display device 90 Control device 100 Film carrier tape for electronic component mounting 102 Electronic component mounting Part 102a Electronic part mounting part 103 Center 103a Center 104a Sprocket hole 104 Electronic part mounting part block 106 Sprocket hole 200 Electronic part mounting film carrier tape 2 2 electronic component mounting portion 204 electronic component mounting portion block 206 sprocket hole O reference origin Pm, n position R reel D inspection region data S spacer T film carrier tape X width direction Y longitudinal direction x dimension y dimension

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hirota Hagiwara 1-1-1 Hikoshima Nishiyamacho, Shimonoseki-shi, Yamaguchi Pref. M.C.S. DA15 EA11 EB01 ED11 5F044 MM00 MM03 MM14 MM40 MM48

Claims (4)

[Claims] An electronic component mounting film carrier tape in which a plurality of electronic component mounting blocks in which a plurality of electronic component mounting portions are arranged in a width direction and a longitudinal direction are continuously arranged at predetermined intervals in a longitudinal direction. A method for inspecting a film carrier tape for electronic component mounting for inspecting a defect of a wiring pattern of the above, wherein the inspection should be performed with reference to sprocket holes continuously formed in the longitudinal direction of the film carrier tape for electronic component mounting. The electronic component mounting unit block stops transporting the electronic component mounting film carrier tape so that the electronic component mounting unit block is located at the inspection position of the inspection device, and the center of the electronic component mounting unit serving as a reference in the electronic component mounting unit block. Is defined as the reference origin O (0,0), and the distance to the reference position of the electronic component mounting portions adjacent to each other in the width direction is defined as a, The position Pm, n (ma, nb) of each electronic component mounting part is calculated by setting the distance to the reference position of the electronic component mounting parts adjacent to each other in the hand direction as b, where m is the reference and The n-th position of the electronic component mounting portion in the width direction from the electronic component mounting portion, and n indicates the n-th position of the electronic component mounting portion in the longitudinal direction from the reference electronic component mounting portion. Inspection area data of the inspection area of each electronic component mounting section based on the position information of the position Pm, n (ma, nb) of the section, the width x of the electronic component mounting section, and the length y of the electronic component mounting section. The inspection device is moved in the width direction X and / or the longitudinal direction Y based on the inspection area data of each of the electronic component mounting sections, and the inspection area of each of the electronic component mounting sections is inspected. Of electronic component mounting film carrier tape Method. 2. An inspection area of each electronic component mounting section in which a defect is detected, based on an inspection result of an inspection area of each electronic component mounting section, based on an inspection area data of each electronic component mounting section. The method for inspecting a film carrier tape for mounting electronic components according to claim 1, wherein the defect marking is performed by moving the defective marking device in the width direction X and / or the longitudinal direction Y. 3. A film carrier tape for mounting an electronic component in which a plurality of electronic component mounting blocks each having a plurality of electronic component mounting portions arranged in a width direction and a longitudinal direction are continuously arranged at predetermined intervals in a longitudinal direction. An electronic component mounting film carrier tape inspection device for inspecting a defect of a wiring pattern of the electronic component mounting film carrier tape, wherein the inspection should be performed based on sprocket holes continuously formed in a longitudinal direction of the electronic component mounting film carrier tape. The electronic component mounting unit block stops transporting the electronic component mounting film carrier tape so that the electronic component mounting unit block is located at the inspection position of the inspection device, and the center of the electronic component mounting unit serving as a reference in the electronic component mounting unit block. Is defined as the reference origin O (0,0), and the distance to the reference position of the electronic component mounting portions adjacent to each other in the width direction is defined as a, The position Pm, n (ma, nb) of each electronic component mounting part is calculated by setting the distance to the reference position of the electronic component mounting parts adjacent to each other in the hand direction as b, where m is the reference and The n-th position of the electronic component mounting portion in the width direction from the electronic component mounting portion, and n indicates the n-th position of the electronic component mounting portion in the longitudinal direction from the reference electronic component mounting portion. Inspection area data of the inspection area of each electronic component mounting section based on the position information of the position Pm, n (ma, nb) of the section, the width x of the electronic component mounting section, and the length y of the electronic component mounting section. An inspection device movement control device for operating the inspection device in the width direction X and / or the longitudinal direction Y based on the position information and the inspection region data from the arithmetic processing device. Characterized by comprising The film carrier tape of the inspection apparatus. 4. An inspection area of each electronic component mounting section in which a defect is detected, based on an inspection result of the inspection area of each electronic component mounting section, based on an inspection area data of each electronic component mounting section. The inspection device for a film carrier tape for mounting electronic components according to claim 3, further comprising a defect marking device that moves in the width direction X and / or the longitudinal direction Y to perform defect marking.