JP2002049054A - Liquid crystal device, method for manufacturing the same and electronic instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress wiring resistance for packaging low in a liquid crystal display device. SOLUTION: The liquid crystal display device is constructed by sticking substrates 200, 300 together via a sealant 110 leaving a specified gap in between and by enclosing a liquid crystal 160 in the gap. Among the substrates, a transparent common electrode 214 is formed on a confronted surface of the substrate 200 and on the other hand, a segment electrode 314 is formed on a confronted surface of the substrate 300. Among the electrodes, the common electrode 214 is connected to wiring 350 formed on the substrate 300 via conductive particles 114 mixed in the sealant 110. The wiring 350 is made of a laminated film of a transparent conductive film 354 composed of the same conductive layer as the segment electrode 314 and a low resistance conductive film 352 composed of chromium or the like which is a material with lower resistance than the low resistance conductive film 352 is formed staying away from the part to which the conductive particles 114 are connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device with reduced wiring resistance, a method of manufacturing the same, and an electronic apparatus using the liquid crystal device for a display.

[0002]

2. Description of the Related Art As is well known, a liquid crystal display device is a CRT.
Compared to a display device using a (cathode ray tube), the display device is superior in weight, power consumption, and the like. Here, the liquid crystal display device generally has a configuration in which two substrates are bonded to each other with their electrode forming surfaces facing each other with a certain gap therebetween, and a liquid crystal is sandwiched in the gap. Driving methods can be broadly classified into two types: an active matrix type in which liquid crystal is driven by a switching element, and a passive matrix type in which liquid crystal is driven without using a switching element. Furthermore, the former active matrix type is used as a switching element.
A type using a three-terminal element such as a thin film transistor (TFT) and a thin film diode (TF)
D: Thin film diode) or the like using a two-terminal element.

In the active matrix type using a TFD element as a switching element or the passive matrix type, a scanning line (common electrode) is provided on one substrate and a data line (segment electrode) is provided on the other substrate. But,
It is a configuration formed respectively. Therefore, in these types, it is necessary to bond the FPC boards one by one to the two boards and supply the scanning signal (common signal) and the data signal (segment signal), respectively. This causes problems such as complexity and high cost. Therefore, in these types, the wiring or the electrode formed on the other substrate is connected to the wiring formed on the one substrate through a conductive material, that is, the wiring formed on the other substrate is connected. Alternatively, a configuration in which all of the electrodes are moved to one substrate, and one FP is
Techniques for joining C substrates have been proposed.

[0004]

However, in the above technique, the wiring formed on one substrate uses the same material as the transparent electrode for applying a voltage to the liquid crystal on the one substrate. Here, in general, ITO (Indium Tin Oxide) is used as a material of this kind of transparent electrode, but the sheet resistivity of this transparent conductive material is higher than that of a general metal. For this reason, when such a transparent conductive material is used as a connection wiring in a region other than the display region, there is a problem that the resistance is inevitably increased and the display quality is adversely affected.

Particularly, in recent years, in order to reduce the number of connection points between the liquid crystal panel and the FPC board, a driver IC for driving scanning lines (common electrodes) and data lines (segment electrodes) is mounted on the glass substrate of the liquid crystal panel. May be implemented. In such a case, it is necessary to supply various control signals and clock signals to the driver IC.
When the above-mentioned transparent conductive material is used for the wiring from the C substrate to the driver IC, the wiring resistance increases and the time constant increases, resulting in waveform dulling, amplitude reduction, and the like, resulting in a narrow operation margin. Also occur.

The present invention has been made in view of the above circumstances, and has as its object to provide a liquid crystal device having reduced wiring resistance formed on a substrate, a method of manufacturing the same, and a method of using the liquid crystal device for a display unit. Electronic equipment.

[0007]

Therefore, in a liquid crystal device according to one aspect of the present invention, a first substrate and a second substrate are arranged to face each other, and the first substrate and the second substrate A liquid crystal device in which liquid crystal is sealed in a gap between the substrate and a first transparent electrode provided on the first substrate; a first wiring provided on the second substrate; A conductive material for connecting the transparent electrode and the first wiring, wherein the first wiring includes a metal oxide film and a conductive film having a lower resistance than the metal oxide film. Features. According to this structure, the first wiring is composed of a stacked film of a chemically stable metal oxide film and a conductive film having a lower resistance value but a chemically unstable property. The resistance and the stability of the wiring can be reduced as compared with the case where any one of the single layers is used. Here, the conductive material is formed by coating a metal such as gold (Au) on the surface of non-conductive particles such as plastic, but the metal oxide film generally has better adhesion to the coated metal. Good. For this reason, in the above structure, it is preferable that, in the first wiring, the conductive film is formed so as not to be connected to the conductive material. Further, in the above-mentioned configuration, provided on the second substrate,
A driver IC for driving the liquid crystal, the driver IC including an output-side bump for supplying a signal, wherein the output-side bump is connected to the first wiring; It is also preferable that they are formed so as not to be connected to the driver IC. As described above, when the driver IC for driving the liquid crystal is mounted on the second substrate via the first wiring, the conductive material, and the first transparent electrode, the number of connection points to the outside can be reduced. When the driver IC is bonded to the wiring, a conductive particle dispersed in an adhesive is used. This conductive particle is, like the conductive material, a surface of non-conductive particles such as plastic. And a metal such as gold (Au). For this reason, if the conductive film is formed avoiding the connection portion with the driver IC, the metal oxide film comes into contact with the coating metal of the conductive material, and the adhesion is improved.

In the above structure, a second wiring provided on the second substrate and including a metal oxide film and a conductive film having a lower resistance value than the metal oxide film; A driver I provided on the substrate for driving the liquid crystal;
C, wherein the driver IC includes an input-side bump for inputting a signal, and the input-side bump includes the second bump.
It is also preferable that the conductive film connected to the second wiring and included in the second wiring is formed so as to avoid a connection portion with the driver IC. In this case, the second wiring is composed of a laminated film of a chemically stable metal oxide film and a conductive film having a lower resistance value but a chemically unstable property. The resistance of the wiring can be reduced as compared with the case of a single layer. For this reason, the signal is supplied to the driver IC for driving the liquid crystal through the low-resistance second wiring, so that the influence of a voltage drop or the like can be suppressed. Further, when a metal oxide film is formed at the connection portion with the driver IC, avoiding the conductive film having a low resistance, it is possible to improve the adhesion between the conductive material and the coating metal.

In the liquid crystal device having the second wiring and the IC driver on the second substrate, the first substrate is provided on one side of the second substrate and does not overlap with the first substrate. An overhanging area, and a second overhanging area provided on a side of the second substrate that intersects with the one side and does not overlap with the first substrate. It is preferable that the second wiring is provided in the first overhanging region, and is provided over both the first overhanging region and the second overhanging region. Further, in this aspect, the semiconductor device further includes an external circuit board connected to the second wiring at the second overhang region, and a conductive film included in the second wiring is provided on the external circuit board. It is desirable that the connecting portion is formed so as to avoid the connecting portion. In this case, it is possible to supply a signal to the IC driver from the external circuit board via the low-resistance second wiring.

[0010] Further, in the above configuration, it is preferable that a second transparent electrode provided on the second substrate and a driver IC connected to the second transparent electrode be included. In this case, a signal is supplied to the second transparent electrode by the driver IC. Here, second, the second substrate
In the liquid crystal device including the transparent electrode and the IC driver, the liquid crystal device is provided on the second substrate, includes a metal oxide film, and a conductive film having a lower resistance value than the metal oxide film, and is connected to the driver IC. A second wiring, a first overhanging region provided on one side of the second substrate and not overlapping the first substrate, and intersecting the one side on the second substrate. A second overhanging region provided on the side and not overlapping the first substrate, wherein the driver IC includes an input-side bump for inputting a signal from the second wiring, and Provided in the first overhang region,
The second wiring includes the first overhang region, and
A mode provided over both of the second overhanging regions is preferable. In this embodiment, the second wiring is formed of a laminated film of a chemically stable metal oxide film and a conductive film having a lower resistance value but a chemically unstable property.
As compared with the case where one of the single layers is used, the resistance and the stability of the wiring are reduced. For this reason, the signal is supplied to the driver IC via the low-resistance second wiring, so that the influence of a voltage drop or the like can be suppressed.
Further, in this aspect, it is preferable that the conductive film included in the second wiring is formed so as not to be connected to the driver IC. If a metal oxide film is formed at the connection portion with the driver IC so as to avoid the low-resistance conductive film, it is possible to improve the adhesion of the conductive material to the coating metal. The electronic device according to one embodiment of the present invention includes:
Since the liquid crystal device is provided, the wiring resistance is reduced, thereby preventing the display quality from being adversely affected and the operation margin of the drive circuit from being reduced.

On the other hand, in a liquid crystal device according to one embodiment of the present invention, a first substrate and a second substrate are arranged to face each other, and a liquid crystal is provided in a gap between the first substrate and the second substrate. Is a liquid crystal device in which a first transparent electrode provided on the first substrate, a first wiring provided on the second substrate, the first transparent electrode, and the first transparent electrode are provided. A conductive material for connecting the first wiring, a second transparent electrode provided on the second substrate, and a second wiring provided on the second substrate and connected to the second transparent electrode And the first or second
At least one of the wirings is characterized by including a metal oxide film and a conductive film having a lower resistance value than the metal oxide film. According to this configuration, both the first and second wirings are brought to the second substrate, so that connection to the outside is facilitated. Further, at least one of the first and second wirings is formed of a laminated film of a chemically stable metal oxide film and a conductive film having a lower resistance value but being chemically unstable. Therefore, the resistance and the stability of the wiring can be reduced as compared with the case where any one of the single layers is used. In this configuration, the semiconductor device further includes a driver IC provided on the second substrate for driving the liquid crystal, the driver IC including an output-side bump for supplying a signal, and the output-side bump being: Preferably, it is connected to the first or second wiring. Thus, the first or second
When the driver IC connected to the wiring is mounted on the second substrate, the number of connection points with the outside can be reduced. Further, in this configuration, it is preferable to further include an external circuit board for supplying a signal to each of the first and second wirings. In this case, since signals are supplied to the first and second wirings from the external circuit board, it is not necessary to mount an IC driver on the second board.

Further, in a liquid crystal device according to one aspect of the present invention, a first substrate and a second substrate are arranged to face each other, and a liquid crystal is provided in a gap between the first substrate and the second substrate. Wherein the first substrate is provided on one side of the second substrate and does not overlap with the first substrate; A second overhanging region provided on the side intersecting with the first substrate and not overlapping the first substrate, and a wiring provided over both the first overhanging region and the second overhanging region, The wiring is characterized by including a metal oxide film and a conductive film having a lower resistance value than the metal oxide film. According to this configuration, since the wiring is formed of a laminated film of a chemically stable metal oxide film and a conductive film having a lower resistance value, the wiring extends over both the first and second overhanging regions. Even if it is provided, the resistance of the wiring can be reduced.

Further, in a liquid crystal device according to one aspect of the present invention, a first substrate and a second substrate are arranged to face each other, and a gap between the first substrate and the second substrate is provided. A liquid crystal device in which liquid crystal is sealed, wherein a plurality of first transparent electrodes provided on the first substrate and the first transparent electrode adjacent to each other are provided with the first transparent electrode. A conductive light-blocking film provided in a non-conductive manner, and a wiring provided on the first substrate and connected to the first transparent electrode, wherein the wiring is substantially connected to the first transparent electrode. And a layer including substantially the same layer as the light-shielding film. In this configuration, the layer used as the light-shielding film in the first substrate also serves as a low-resistance conductive layer in the stacked wiring, so that the wiring can have low resistance without adding a special process. become.

On the other hand, in a liquid crystal device according to one embodiment of the present invention, a first substrate and a second substrate are arranged to face each other, and a liquid crystal is provided in a gap between the first substrate and the second substrate. Wherein the first transparent electrode is provided between the plurality of first transparent electrodes provided on the first substrate and the adjacent first transparent electrodes. A conductive light-shielding film provided in conduction, a wiring provided on the first substrate,
A second transparent electrode provided on the second substrate; and a conductive material for connecting the wiring and the second transparent electrode, wherein the wiring is substantially the same as the first transparent electrode. It is characterized by comprising a layer and a layer substantially the same as the light-shielding film. In this configuration, the layer used as the light-shielding film in the first substrate also serves as a low-resistance conductive layer in the stacked wiring, so that the wiring can have low resistance without adding a special process. become. Further, the second transparent electrode provided on the second substrate is connected to a wiring provided on the first substrate by a conductive material. For this reason, the outside only needs to be connected to the first substrate.

Further, according to a method of manufacturing a liquid crystal device according to one aspect of the present invention, a first substrate and a second substrate are arranged to face each other, and the first substrate and the second substrate are connected to each other. A method for manufacturing a liquid crystal device in which liquid crystal is sealed in a gap, comprising: providing a first transparent electrode on the first substrate; first wiring provided on the first and second substrates; A conductive material for connecting the first transparent electrode and the first wiring, wherein the first wiring includes a metal oxide film and a conductive film having a lower resistance than the metal oxide film. It is to be included. According to this method, the first wiring is composed of a laminated film of a chemically stable metal oxide film and a conductive film having a lower resistance than the first wiring. As compared with, the resistance of the wiring is reduced.

Still further, in a method of manufacturing a liquid crystal device according to one aspect of the present invention, a first substrate and a second substrate are placed so as to face each other, and the first substrate and the second substrate are connected to each other. A method of manufacturing a liquid crystal device in which liquid crystal is sealed in a gap between the first and second substrates, wherein a plurality of first transparent electrodes are provided on the first substrate;
Providing a conductive light-shielding film between the adjacent first transparent electrodes in a non-conductive manner with the first transparent electrode; and forming a wiring connected to the first transparent electrode, A step of providing the wiring on one substrate, wherein the wiring is formed to include a layer substantially the same as the first transparent electrode and a layer substantially the same as the light-shielding film. in this way,
Since the layer used for the light-shielding film in the first substrate also serves as a low-resistance conductive layer in the stacked wiring, the resistance of the wiring can be reduced without adding a special step.

On the other hand, in a method of manufacturing a liquid crystal device according to one embodiment of the present invention, a first substrate and a second substrate are arranged to face each other, and the first substrate and the second substrate are A method for manufacturing a liquid crystal device in which liquid crystal is sealed in a gap, comprising: providing a plurality of first transparent electrodes on the first substrate; Light shielding film,
A step of providing non-conduction with the first transparent electrode; a wiring provided on the first substrate; and a second wiring provided on the second substrate.
Connecting the transparent electrode with a conductive material,
The wiring is formed to include a layer substantially the same as the first transparent electrode and a layer substantially the same as the light-shielding film. According to this method, it is possible to reduce the resistance of the wiring without adding a special step, and further, it is only necessary to connect the outside to the first substrate.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

<First Embodiment> First, a liquid crystal display device according to a first embodiment of the present invention will be described. This liquid crystal display device functions as a reflective type when external light is sufficient, while it functions as a transmissive type by turning on a backlight when external light is insufficient.
It is of a transflective type.

<Overall Configuration> FIG. 1 is a perspective view showing the configuration of a liquid crystal panel of the liquid crystal display device. In addition,
In this figure, in order to make it easy to understand the configuration of the liquid crystal panel, the back side of the viewer is shown as the front side in the figure. FIG. 2 is a partial cross-sectional view showing the configuration in the case where the liquid crystal panel is broken along the X direction, with the observation side facing upward. For this reason, it should be noted that the vertical relationship between FIG. 1 and FIG. 2 is reversed.

As shown in these figures, the liquid crystal panel 100 is composed of a substrate 300 located on the observation side and a substrate 200 located on the back side thereof, which is slightly smaller than the substrate 300 on the observation side. The sealing material 110 mixed with the conductive particles 114 also serving as a bonding member is bonded with a certain gap kept therebetween, and for example, TN (Twis
In this configuration, a ted Nematic) type liquid crystal 160 is sealed. Here, the sealing material 110 is formed on one of the substrates along the inner peripheral edge of the substrate 200.
A portion is open for enclosing 60. For this reason, the opening portion is sealed with the sealing material 112 after the liquid crystal is sealed.

Now, the back side substrate (first substrate) 200
A plurality of common (scanning) electrodes 214 are formed extending in the X (row) direction on the surface facing the observation-side substrate 300, and A plurality of segment (data) electrodes 314 are formed to extend in the Y (column) direction on the surface facing the substrate 200 on the side. Therefore, in the present embodiment, the common electrode 214
Since a voltage is applied to the liquid crystal 160 by the two electrodes in a region where the and the segment electrode 314 intersect each other, the intersection region functions as a sub-pixel.

Also, the substrate (second substrate) 300 on the observation side
2 protruding from the rear substrate 200 on the opposite surface of
In a region corresponding to the side, a driver (drive circuit) IC 122 for driving the common electrode 214 and a driver IC 124 for driving the segment electrode 314
However, as described later, COG (Chip On Glass)
Implemented by technology. Furthermore, of these two sides,
Outside the area where the driver IC 124 is mounted, FP
A C (Flexible Printed Circuit) substrate 150 is joined.

Here, the common electrode 214 formed on the substrate 200 corresponds to the conductive particles 1 mixed in the sealing material 110.
Through 14, it is connected to one end of a wiring (first wiring) 350 formed on the substrate 300 on the observation side. On the other hand, the other end of the wiring 350 is connected to an output-side bump of the driver IC 122. That is, the driver IC 122 mounted on the substrate 300 on the observation side supplies a common signal to the common electrode 214 formed on the substrate 200 on the back side via a path of the wiring 350, the conductive particles 114, and the common electrode 214. It has a configuration. The driver I
Between the input side bump of C122 and the FPC board 150,
They are connected by a wiring (second wiring) 360.

On the other hand, the segment electrodes 314 formed on the substrate 300 on the observation side are drawn out of the seal frame as they are and connected to the output-side bumps of the driver IC 124. That is, the driver I mounted on the substrate 300
C124 is configured to directly supply a segment signal to a segment electrode 314 similarly formed on the substrate 300. A wiring (second wiring) 370 is provided between the input-side bump of the driver IC 124 and the FPC board 150.
Connected by That is, the FPC board 150
Sends various signals including a power supply to the driver 122 via the wiring 360 and to the driver 124 via the wiring 370.
Each is configured to supply.

The liquid crystal panel 100 actually has
As shown in FIG. 2, the polarizing plate 13 is
1 and a phase difference plate 133 are provided, while a polarizing plate 121 and a phase difference plate 123 are provided on the back side of the substrate 200 (the side opposite to the observer side), but these are not shown in FIG. are doing. Also, on the back side of the substrate 200,
A backlight for use as a transmissive type when there is little external light is provided.
Are not shown in FIG.

<Display Area> Next, the details of the display area in the liquid crystal panel 100 will be described. First, details of the substrate 300 on the observation side will be described. As shown in FIG. 2, a retardation plate 133 and a polarizing plate 131 are attached to the outer surface of the substrate 300. On the other hand, a plurality of strip electrodes 314 made of a transparent conductive material such as ITO are formed on the inner surface of the substrate 300 so as to extend in the Y direction (the direction perpendicular to the paper of the drawing). Further, the segment electrode 3
An alignment film 308 made of polyimide or the like is formed on the surface of the substrate. The alignment film 308 is subjected to a rubbing process in a predetermined direction before being bonded to the rear substrate 200. Note that the alignment film 308 is unnecessary outside the display region, and thus is not provided near and outside the region of the sealing material 110.

Next, the rear substrate 200 will be described. A retardation plate 123 and a polarizing plate 121 are attached to an outer surface of the substrate 200. On the other hand, a scattering resin layer 203 having undulations is formed on the inner surface of the substrate 200. The scattering resin layer 203 is formed by, for example, heat-treating a dot-patterned photoresist on the surface of the substrate 200 to soften an end of the photoresist, as described later.

Next, a reflection film 204 made of a reflective metal such as aluminum or silver is formed on the undulating surface of the scattering resin layer 203. Therefore, the surface of the reflection film 204 is also undulated reflecting the undulations of the scattering resin layer 203, so that the light incident from the observation side is appropriately scattered when reflected by the reflection film 204. In this embodiment, since the reflective film 204 also functions as a transmission type,
Opening 209 for transmitting light from the backlight
Are provided per sub-pixel, for example (see FIG. 3). In addition, without providing such an opening 209,
For example, a structure may be employed in which a part of incident light from the rear side is transmitted by forming a light-reflective metal such as aluminum with a relatively thin film thickness (20 nm to 50 nm).

Further, on the surface of the reflective film 204, a red color filter 205R, a green color filter 205G, and a blue color filter
05B are provided in a predetermined arrangement. In the present embodiment, the color filters 205R, 205
G and 205B have a stripe arrangement (see FIG. 3) suitable for display of a data system, and include R (red), G (green), and B
The three (blue) sub-pixels constitute one substantially square pixel, but this is not intended to limit the present invention.

Next, the color filters 205R,
A flattening film 207 made of an insulating material is provided on the surfaces of 05G and 205B to flatten the steps of the color filter and the undulations of the reflection film 204 and the like. A plurality of common electrodes 214 formed of a transparent conductive material such as ITO extend in the X direction (the horizontal direction in FIG. 2) on the surface planarized by the planarization film 207 and are formed in a belt shape. On the surface of the common electrode 214, an alignment film 208 made of polyimide or the like is formed. Note that, before bonding to the substrate 300 on the observation side,
A rubbing process is performed in a predetermined direction. Further, the color filters 205R, 205G, 205B, the flattening film 207, and the alignment film 208 of each color are unnecessary outside the display region, and are not provided near the seal material 110 and outside thereof.

<Near Sealing Material> Next, the liquid crystal panel 100
Among them, the vicinity of the region where the sealing material 110 is formed will be described with reference to FIGS. 3 and 4 in addition to FIG.
Here, FIG. 3 is a plan view when the detailed configuration of the wiring in the vicinity of the region is seen through from the observation side to the back side, and FIG. 4 is a cross-sectional view along AA ′. First, as shown in FIGS. 2 and 3, the common electrode 214 on the rear substrate 200 extends to a region where the sealing material 110 is formed, while the wiring on the observation substrate 300 is A transparent conductive film 354 constituting 350 extends to a region where the sealing material 110 is formed so as to face the common electrode 214. Therefore, the sealing material 1
By dispersing the spherical conductive particles 114 also serving as spacers in an appropriate ratio in 10, the common electrode 214 and the transparent conductive film 354 are electrically connected via the conductive particles 114. Become.

Here, as described above, the wiring 350
The common electrode 214 and the output-side bump of the driver IC 122 are electrically connected to each other on the facing surface of the observation-side substrate 300. It is composed.
Among them, the low-resistance conductive film 352 is made of a conductive layer made of a material having a lower resistance (for example, chromium) than the transparent conductive film 354, and the transparent conductive film 354 is made of the same conductive layer as the segment electrode 314. . Here, both the low-resistance conductive film 352 and the transparent conductive film 354 are patterned into substantially the same shape as shown in FIG.
However, in the region where the sealant 110 is formed, as shown in FIG. 2 or 3, the low-resistance conductive film 352 is not laminated, and only the transparent conductive film 354 is provided. That is, the low-resistance conductive film 352 is formed so as to avoid the bonding region with the conductive particles 114 in the sealing material 110.
In FIG. 2, the diameter of the conductive particles 114 is considerably larger than the actual diameter for the sake of convenience of explanation. Therefore, it appears that only one conductive particle 114 is provided in the width direction of the sealing material 110. As shown in FIG.
Many conductive particles 114 are arranged in the width direction of zero.

<Near the mounting area of the driver IC and the bonding area of the FPC board>
Area where the driver ICs 122 and 124 are mounted, FP
The vicinity of the region where the C substrate 150 is joined will be described. Here, FIG. 5A illustrates the driver 122 and the FP
FIG. 5B is a cross-sectional view showing the vicinity of the region where the C substrate 150 is joined, centering on the wiring. FIG. 5B is a cross-sectional view showing the vicinity of the region where the driver 124 is joined, centering on the wiring. FIG. 6 is a plan view of the wiring configuration in the mounting area of the driver IC 122 when viewed from the back side to the observation side, that is, a plan view of the mounting surface of the driver IC as viewed from above. is there. Note that, as described above, the substrate 30 on the observation side
In addition to the segment electrodes 314, the wires 350, 3
60 and 370 are provided. Here, the wirings 350 and 360 related to the driver IC 122 will be described as an example.

First, a wiring 350 for supplying a common signal from the driver IC 122 to the common electrode 214
Is composed of a laminated film of the low-resistance conductive film 352 and the transparent conductive film 354 as described above. As shown in FIG.
In the region where the driver IC 122 is mounted, only the transparent conductive film 354 is provided without providing the low-resistance conductive film 352. In other words, the low-resistance conductive film 352 is formed so as not to be connected to the driver IC 122.

The wiring 3 for supplying various signals supplied from the FPC board 150 to the driver IC 122
Reference numeral 60 denotes a laminated film of a low-resistance conductive film 362 and a transparent conductive film 364, similarly to the wiring 350. Among them, the low-resistance conductive film 362 is formed of the same conductive layer as the low-resistance conductive film 352 in the wiring 350, and the transparent conductive film 364 is formed of the segment electrode 314 and the transparent conductive film 354.
And the same conductive layer. Here, the low-resistance conductive film 362
Both the transparent conductive film 364 and the transparent conductive film 364 are patterned into substantially the same shape as each other as shown by the parenthesized symbols in FIG. However, in the region of the wiring 360 where the driver IC 122 is mounted and the region where the FPC board 150 is bonded, the low-resistance conductive film 362 is not provided as shown in FIGS. , Only the transparent conductive film 364. In other words, the reflective conductive film 362 is
Joint portion with driver IC 122 and FPC board 15
It is formed so as to avoid the junction with zero.

For such wirings 350 and 360,
The driver IC 122 is COG-mounted as follows, for example. First, on one surface of the driver IC 122 having a rectangular parallelepiped shape, a plurality of electrodes are provided on a peripheral portion thereof. deep. Then, with the up-down relationship shown in FIG. 5 upside down, first,
A sheet-like anisotropic conductive film in which conductive particles 134 are uniformly dispersed in an adhesive 130 such as epoxy is placed on a region of the substrate 300 on the observation side where the driver IC 122 is to be mounted. And a driver I having an electrode forming surface on the lower side.
C122 and the substrate 300 sandwich the anisotropic conductive film,
Then, after positioning the driver IC 122, the substrate 300 is pressed and heated through the anisotropic conductive film.

As a result, of the driver IC 122,
The output side bump 129a for supplying the common signal is connected to the wiring 3
The input-side bump 129b for inputting a signal from the FPC board 150 is provided on the transparent conductive film 354 constituting the FPC board 50.
The transparent conductive film 364 constituting the wiring 360 is
The connection is made electrically through the conductive particles 134 in the adhesive 130. At this time, the adhesive 130 also serves as a sealing material for protecting the electrode forming surface of the driver IC 122 from moisture, contamination, stress, and the like.

Here, the wirings 350 and 360 related to the driver IC 122 have been described as an example.
Various signals supplied from PC board 150
FIG. 4 also shows the wiring 370 for supplying
As shown in FIG.
The configuration is the same as that of the first embodiment. That is, the wiring 370
Is composed of a laminated film of a low-resistance conductive film 372 and a transparent conductive film 374, like the wiring 360.
The low-resistance conductive film 372 is made of the same conductive layer as the low-resistance conductive films 352 and 362 in the wirings 350 and 360, and the transparent conductive film 374 is the same conductive layer as the segment electrode 314 and the transparent conductive films 354 and 364. Consists of Here, both the low-resistance conductive film 372 and the transparent conductive film 374 are patterned into substantially the same shape as indicated by parentheses in FIG. However, of the wiring 370, the area where the driver IC 124 is mounted, and F
In the region where the PC board 150 is bonded, the low resistance conductive film 372 is not provided and only the transparent conductive film 374 is provided as shown in parentheses in FIG. 5A and FIG. 5B. In other words, the reflective conductive film 372 is connected to the driver I
The joint portion with C124 and the joint portion with FPC board 150 are formed so as to avoid each.

Then, such a segment electrode 31
4. The driver IC 124 is connected to the wiring 370 via the anisotropic conductive film, similarly to the driver IC 122. Also, for the wires 360 and 370,
When bonding the FPC board 150, an anisotropic conductive film is similarly used. Thus, in the FPC board 150, the wiring 154 formed on the base material 152 such as polyimide is different from the transparent conductive film 364 forming the wiring 360 and the transparent conductive film 374 forming the wiring 370.
Each is electrically connected via the conductive particles 144 in the adhesive 140.

<Manufacturing Process> Next, a manufacturing process of the above-described liquid crystal display device will be described. First, a manufacturing process of the substrate 300 on the observation side will be described with reference to FIG. Here, the segment electrode 314 and the wiring 3
The description will be made with respect to the inside of the seal frame (display area) and the seal material, centering on 50. In addition, for convenience of description, FIG. 7 is upside down with respect to FIGS. 2 and 5.

First, as shown in FIG.
A low-resistance metal layer 352 'is formed by depositing a metal (for example, chromium) having a lower resistance than a transparent metal oxide such as ITO by sputtering or the like on the entire inner surface of the "0". Subsequently, as shown in FIG. 3B, the low-resistance metal layer 352 ′ is patterned by photolithography and etching techniques to form a wiring 360, 370 other than the low-resistance conductive film 352 constituting the wiring 350. The low resistance conductive films 362 and 372 to be formed are formed.

Next, as shown in FIG. 3C, a transparent conductive layer 314 'made of ITO or the like is formed by sputtering or ion plating. Thereafter, as shown in FIG. 3D, the transparent conductive layer 314 ′ is patterned by photolithography and etching to form the segment electrode 314 and the wiring 350
A transparent conductive film 354 is formed. At this time, the wiring 360,
The transparent conductive films 362 and 372 which constitute 370 are also formed by patterning at the same time. Then, for example, after applying and printing a polyimide solution, it is baked to form an alignment film 308 as shown in FIG. After that, the alignment film 3
08 is subjected to a rubbing process.

Next, the manufacturing process of the rear substrate 200 will be described with reference to FIGS. First,
As shown in FIG. 8A, a negative photoresist is applied and baked on the entire inner surface of the substrate 200 to form a resin layer 20.
Form 3 ''. Next, the resin layer 203 ″ is exposed and developed using a photomask that locally transmits a large number of lights. As a result, as shown in FIG. 2B, a portion irradiated with light (a photosensitive portion) is removed in the seal frame, and a large number of projections 203a are formed.
The projections 203a may be formed by using a positive photoresist to cure the light-irradiated portions and remove the light-irradiated portions.

Next, as shown in FIG.
The substrate 200 on which 3a is formed is heated to a temperature equal to or higher than the thermal deformation temperature of the photoresist. By this heat treatment, the protrusion 203a is softened and the corner portion is rounded. This allows
The scattering resin layer 203 having relatively smooth irregularities is formed. The material (viscosity and film thickness) of the resin layer 203 ″, the shape of the protrusion 203a, the pitch, and the like are selected according to the scattering characteristics required for the scattering resin layer 203.

Further, as shown in FIG. 4D, a reflective layer 204 'made of a silver alloy or aluminum is formed by sputtering or the like. Subsequently, as shown in FIG. 3E, the reflective layer 204 'is patterned by using a photolithography technique and an etching technique to form the reflective film 204'.
4 is formed. During this patterning, the openings 209 are formed.
Are also formed at the same time.

Subsequently, after forming a resin layer colored in any one of R (red), G (green), and B (blue), patterning is performed by using a photolithography technique and an etching technique. A color filter for each color is formed. The other two color filters are formed by the same patterning. As a result, as shown in FIG. 9F, on the reflection film 209 in which the opening 209 is formed,
Color filter 2 corresponding to each of R, G, B colors
05R, 205G and 205B are formed. Next, as shown in FIG. 3G, a resin material such as an acrylic resin is applied or printed, and the resultant is baked to form a flattening film (overcoat) 207. Regarding the flattening film 207, color filters 205R, 205G, 205B,
It is formed so as to cover each part such as the reflective film 204 and so as not to cover a region where the sealant 110 is formed.

Subsequently, a transparent conductive layer such as ITO is formed on the entire inner surface of the substrate 200 on which the flattening film 207 is formed by using a sputtering method or an ion plating method. Then, the common electrode 214 is formed by patterning using a photolithography technique and an etching technique (see FIG. 2H). Then, for example, a polyimide solution is applied and printed, followed by baking to form an alignment film 208 as shown in FIG. After that, a rubbing treatment is performed on the alignment film 208.

Although the subsequent manufacturing process is not shown, the back side substrate 200 in which the alignment film 208 has been rubbed and the observation side substrate 300 in which the alignment film 308 has been rubbed in the same manner, The conductive particles 114 are bonded together by a seal material 110 in which the conductive particles 114 are appropriately dispersed.
The liquid crystal 160 is dropped into the opening of the sealing material 110 in a state close to a vacuum. Then, by returning to normal pressure, the liquid crystal 160 penetrates into the seal frame, and then the opening is sealed with the sealing material 112. Thereafter, as described above, by mounting the driver ICs 122 and 124 and the FPC board 150, the liquid crystal panel 100 as shown in FIG. 1 is obtained.

<Display Operation, etc.> Next, the display operation of the liquid crystal display device having such a configuration will be briefly described. First, the driver IC 122 described above is connected to the common electrode 214
, A selection voltage is applied in a predetermined order for each horizontal scanning period, while the driver IC 124 generates a segment signal corresponding to the display content of one row of sub-pixels located on the common electrode 214 to which the selection voltage is applied. Are supplied via the corresponding segment electrodes 314, respectively. At this time, the alignment state of the liquid crystal 160 in the region is controlled for each sub-pixel according to the voltage difference applied between the common electrode 214 and the segment electrode 314.

Here, in FIG. 2, external light from the observation side passes through the polarizing plate 131 and the phase difference plate 133,
It becomes a predetermined polarization state, and further, the substrate 300 on the observation side →
Segment electrode 314 → liquid crystal 160 → common electrode 214
→ Reflection film 20 through the path of color filter 205
4 is reached, reflected here, and follows the path that has just come.
Therefore, in the reflection type, the alignment state of the liquid crystal 160 is changed by the voltage difference applied between the common electrode 214 and the segment electrode 314, so that after the external light is reflected by the reflection film 204, the polarization plate 131 The amount of light that passes through and is finally viewed by the observer is controlled for each sub-pixel.

On the other hand, when a backlight (not shown) located on the back side of the substrate 200 is turned on, the light passes through the polarizing plate 121 and the phase difference plate 123 to be in a predetermined polarization state. Back side substrate 200 → Opening 2
The light exits to the observation side through a path of 09 → color filter 205 → common electrode 214 → liquid crystal 160 → segment electrode 314 → observation side substrate 300 → polarizing plate 131. Therefore, even in the transmission type, the liquid crystal 1 is not affected by the voltage difference applied between the common electrode 214 and the segment electrode 314.
The change in the orientation state of the opening 60 causes the opening 209 to change.
Of the light transmitted through the polarizer 131, the amount of light finally perceived by the observer is controlled for each sub-pixel.

As described above, according to the liquid crystal display device of the present embodiment, if the external light is sufficient, the liquid crystal display device is of the reflective type, and if the external light is weak, the backlight is turned on to be mainly of the transmissive type. Can be displayed. On the other hand, the wirings 350, 360, and 370 are configured to be respectively laminated with the transparent conductive films 354, 364, and 374, and the low-resistance conductive films 352, 362, and 372 formed of conductive layers with lower resistance. Therefore, the resistance is reduced as compared with the case of a single layer of a transparent conductive film or a single layer of a low resistance conductive film. In particular, the FPC board 150
The wiring 360 from the driver IC 122 to the input side bump of the driver IC 122 is provided with a driver IC 12 for supplying a common signal.
Since two power supply lines are included, a relatively high voltage is applied, and the wiring distance is longer than that of the wiring 370. Therefore, if the wiring 360 has a high resistance, the influence of the voltage drop cannot be ignored. On the other hand, in the wiring 360 according to the present embodiment, since the resistance is reduced by lamination, the influence of the voltage drop is reduced.

In this embodiment, the common electrode 214 provided on the rear substrate 200 is formed of the conductive particles 1.
It is connected to the output side of the driver IC 122 mounted on the observation side substrate 300 via the wiring 14 and the wiring 350. For this reason, in the present embodiment, the connection with the FPC board 150 is completed at one location on one side despite the passive matrix type. Therefore, the mounting process is simplified.

On the other hand, the sealing material 110 of the wiring 350
And the driver IC 12
In the region where 2 is mounted, the low-resistance conductive film 352 is not provided and only the transparent conductive film 354 is provided. In the area of the wiring 360 where the driver IC 122 is mounted and the area where the FPC board 150 is bonded,
Without providing the low-resistance conductive film 362, the transparent conductive film 364 is provided.
Similarly, of the wiring 370, the area where the driver IC 124 is mounted and the FPC board 1
In the region where 50 is bonded, only the transparent conductive film 374 is provided without providing the low-resistance conductive film 372.

This is because the conductive particles 114 mixed in the sealing material 110 and the conductive particles 134 and 144 dispersed in the adhesives 130 and 140 are made of gold (Au) on the surface of non-conductive particles such as plastic. )), But the adhesion to the coated metal is better in the case of the transparent conductive film than in the case of the low-resistance conductive film, and in the absence of the low-resistance conductive film below. It is. That is, if priority is given to lowering the resistance of the wiring, a configuration in which a transparent conductive film and a low-resistance conductive film are stacked is desirable. In such a configuration, a bonding process between substrates, a mounting process of a driver IC, FPC
The possibility that a connection failure occurs in the bonding process of the substrates increases. Therefore, in the present embodiment, only a transparent conductive film is provided without providing a low-resistance conductive film at a portion where the conductive particles are connected.

Further, from the viewpoint of simplification of the configuration, a configuration using the reflection film itself as an electrode is also conceivable.
Such a configuration is not employed in the present embodiment for the following reasons. That is, since the electrodes formed on the substrate on the observation side are required to be transparent, a transparent conductive material such as ITO is used. In this case, the polarization of the liquid crystal is biased by sandwiching the liquid crystal between different metals. For this reason, in the present embodiment, the same IT as the segment electrode 314 is used without using the reflective layer as a common electrode.
A transparent conductive material such as O is patterned and used as the common electrode 214.

<Application> In the above-described first embodiment, the common electrode 214 is driven by the driver IC 122 and the segment electrode 314 is driven by the driver IC 124. However, the present invention is not limited to this.
For example, as shown in FIG. 10, the present invention is also applicable to a type in which both are formed into one chip. In the liquid crystal display device shown in this figure, the common electrode 214
Are common to the first embodiment in that they are formed to extend in the X direction, but the upper half common electrode 214 is drawn out from one side, and the lower half common electrode 214 is drawn out from the other side. This is different from the first embodiment in that it is connected to the driver IC 126. Here, the driver IC 126 is the driver I in the first embodiment.
C122 and 124 are integrated into one chip, and therefore, the segment electrode 314 is also connected. And
The FPC board 150 transmits a signal for controlling the driver IC 126 from an external circuit (not shown) to the wiring 360.
(370). Note that FIG.
In the liquid crystal display device shown in (1), if the number of the common electrodes 214 is small, the common electrode 214 may be drawn out from only one side.

As shown in FIG. 11, the present invention can be applied to a type in which the driver IC is not mounted on the liquid crystal panel 100. That is, in the liquid crystal display device shown in this figure, the driver IC 126 is mounted on the FPC board 150 by a technique such as flip chip. In addition, TAB
(Tape Automated Bonding) technology and the driver I
C126 may be bonded with its inner leads, while it is bonded to the liquid crystal panel 100 with its outer leads. However, in such a configuration, as the number of pixels increases, the number of connection points with the FPC board 150 increases. Furthermore, in the first embodiment, the low-resistance conductive films 352, 362, and 372 are laminated as lower layers of the transparent conductive films 354, 364, and 374, respectively. However, the present invention is not limited to this. As shown in FIG. 12, the transparent conductive film 354 may be formed as a lower layer of the low-resistance conductive film 352 and both layers are stacked. Even in such a configuration, the wiring resistance can be reduced.

In addition, in the first embodiment, the passive matrix type is used in which the liquid crystal is driven without using the switching element, but the TFD is used for each sub-pixel (or pixel).
(Thin Film Diode: Thin Film Diode)
It is good also as a structure driven by these. For example, TF
When the D element is used, the display area of the substrate 300 on the observation side has a configuration as shown in FIG. That is, instead of the segment electrode 314, the rectangular pixel electrode 33 is used.
4 are arranged in a matrix, and each column of pixel electrodes 334 is connected to one data line 314 b via a TFD element 320.
Here, the TFD element 320 is formed of a first metal film 322 / an insulating film 324 formed by anodizing the first metal film 322 / a second metal film 326 when viewed from the substrate 300 side. , Metal / insulator / metal sandwich structure, so that the current-voltage characteristics are non-linear in both positive and negative directions. Also, at this time, the substrate 200 on the rear side is used.
Of the pixel electrodes 334 arranged in a matrix are opposed to each other. In such a configuration, the second metal 326
To the low-resistance conductive films 352, 362, and 3 in the embodiment.
Since it can be formed in the same layer as 72, the manufacturing process can be simplified accordingly.

Further, in the second embodiment, the transflective liquid crystal display device is used, but the opening 209 is not provided.
It may be a simple reflection type. In the case of the reflection type, a front light that irradiates light from the observation side may be provided as necessary instead of the backlight. In the embodiment, the conduction between the common electrode 214 and the wiring 350 is achieved by the conductive particles 114 mixed in the sealing material 110. It is good also as composition. On the other hand, since the common electrode 214 and the segment electrode 314 are in a relative relationship to each other, the common electrode may be formed on the substrate 300 on the observation side, and the segment electrode may be formed on the substrate 200 on the back side. In this configuration, the segment electrode formed on the rear substrate 200 is connected to the wiring 350 formed on the observation substrate 300 via the conductive particles 114 in the sealing material 110.

<Second Embodiment> In the first embodiment described above, the driver ICs 122 and 124 are mounted on the substrate 30 on the observation side.
0, the wiring 350, 360,
Although 370 is also provided on the substrate 300 on the observation side, the present invention is not limited to this, and can be applied to a case where a driver IC or wiring is provided on the back side. Therefore, a second embodiment in which the driver IC and the wiring are provided on the rear substrate will be described next.

FIG. 14 is a perspective view showing the overall configuration of a liquid crystal panel according to the second embodiment. As shown in this figure, the liquid crystal panel 100 according to the second embodiment is exactly the same in appearance as the first embodiment (see FIG. 1), but the observation side and the back side are completely opposite. That is, in the liquid crystal panel 100 according to the second embodiment, the back side is the substrate (the first side).
Substrate) 300, and the observation side becomes the substrate (second substrate) 200.

More specifically, FIG. 15 is a partial sectional view of the liquid crystal panel taken along the X direction, and FIG. 16 is a partial sectional view of the liquid crystal panel taken along the Y direction. As shown in the drawing, a plurality of common electrodes 214 are formed extending in the X (row) direction on the surface of the observation-side substrate 200 facing the substrate 300 on the back side.
A plurality of segment electrodes 314 are formed on a surface of the rear substrate 300 facing the observation substrate 200 so as to extend in the Y (column) direction. Also, the substrate 300 on the back side
In the two sides protruding from the substrate 200 on the observation side,
Driver IC 12 for driving common electrode 214
2, and the driver IC chip 124 for driving the segment electrode 314 is mounted by the COG technique in the same manner as in the first embodiment. On the outside, an FPC board 150 is joined.

Here, in the second embodiment, the common electrode 214 formed on the substrate 200 on the observation side is formed on the substrate 300 on the back side via the conductive particles 114 mixed in the sealing material 110. It is connected to one end of the wiring 350. On the other hand, the other end of the wiring 350 is connected to the driver IC 12
2 output side bumps. The wiring 36 formed on the substrate 300 extends from (the joint portion of) the FPC substrate 150 to the input-side bump of the driver IC chip 122.
It is routed by 0. On the other hand, the back side substrate 300
Are connected to the output-side bumps of the driver IC 124 as they are. Here, a low-resistance conductive film 312 is formed in the lower layer of the segment electrode 314 from the outside of the frame of the sealing material 110 to immediately before the output-side bump of the driver IC 124 to form the wiring 310. 14, see FIG. 16).
In addition, the driver I
The wiring up to the input side bump of the C chip 124 is routed by the wiring 370 formed on the substrate 300.

<Display Area> Next, the details of the display area in the liquid crystal panel 100 according to the second embodiment will be described. First, details of the substrate 200 on the observation side will be described. As shown in FIG. 15 or FIG.
A retardation plate 133 and a polarizing plate 131 are attached to the outer surface of the device. On the other hand, a common electrode 214 made of a transparent conductive material such as ITO is provided on the inner surface of the substrate 200 in the X direction (FIG. 1).
5, a plurality of strips are formed extending in the left-right direction on the paper surface and in FIG. 16 in the vertical direction on the paper surface). further,
On the surface of the common electrode 214 and the substrate 200, an alignment film 208 made of polyimide or the like is formed. Since the alignment film 208 is unnecessary outside the display region, it is not provided near the seal material 110 and outside thereof.

Next, the rear substrate 300 will be described. The retardation plate 123 and the polarizing plate 121 are attached to the outer surface of the substrate 300. On the other hand, an undulating scattering resin layer 303 is formed on the inner surface of the substrate 300. The scattering resin layer 303 is similar to the scattering resin layer 203 in the first embodiment, and further has a reflection film 304 formed on the undulating surface. Therefore,
Since the surface of the reflective film 304 also has undulations reflecting the undulations of the scattering resin layer 303, light incident from the observation side is appropriately scattered when reflected by the reflective film 304. The reflective film 304 is formed by patterning a reflective metal film such as aluminum or silver to have substantially the same width so as to overlap with the segment electrode 314 in plan view. Therefore, adjacent segment electrodes 314 are configured to be hardly capacitively coupled via the reflective film 304. Further, the liquid crystal display device according to the present embodiment is
Since the reflective film 304 also functions as a transmissive type, the reflective film 304 is provided with two openings 309 for transmitting light from a backlight at the time of patterning for each sub-pixel (see FIG. 17). .

Subsequently, on the surface of the reflective film 304, a red color filter 305R, a green color filter 305G, and a blue color filter 3 correspond to the region where the common electrode 214 and the segment electrode 314 intersect.
05B are formed in a stripe arrangement, and R (red), G
Three pixels of (green) and B (blue) subpixels constitute a substantially square pixel. Note that the point that the present invention is not limited to this is the same as in the first embodiment. On the other hand, on the boundaries between the color filters 305R, 305G, and 305B and on the outer peripheral edge that partitions the display area, a light-shielding film 302 in which a light-shielding metal layer such as chrome is patterned.
Are provided to prevent color mixing between sub-pixels and to function as a frame defining a display area.

Next, the color filters 305R, 305R,
A flattening film 307 made of an insulating material is provided on the surface of the light-transmitting film 05G, 305B and the light-shielding film 302 to flatten the unevenness of the color filter, the light-shielding film and the like. A segment electrode 314 made of a transparent conductive material such as ITO extends on the surface flattened by the flattening film 307 in the Y direction (the direction perpendicular to the plane of FIG. 15 and the horizontal direction of the plane of FIG. 16). A plurality of strips are formed. An alignment film 308 made of polyimide or the like is formed on the surface of the segment electrode 314 or the flattening film 307. Note that the alignment film 308 and the underlying flattening film 307 are
Since it is unnecessary outside the display area, it is not provided near and outside the area of the sealing material 110.

<Near the seal material, the mounting area of the driver IC, and the vicinity of the bonding area of the FPC board> As described above, in the liquid crystal panel 100 according to the second embodiment, unlike the first embodiment, the substrate 200 is located on the observation side, and the substrate 300 is located on the back side. Therefore, in the liquid crystal panel 100 according to the second embodiment, as shown in FIG. 17, the common electrode 214 and the segment electrode as shown in FIG. The upper and lower relationship of 314 corresponds to the first embodiment (FIG.
(See Reference). Note that FIG.
The cross-sectional view taken along the line AA ′ in FIG. 4 is on the coordinate axes shown in parentheses in FIG. 4 because the observation side and the back side are opposite to each other (the z direction is opposite). When the observation side is viewed upward, the orientation of the mounting surfaces of the drivers 122 and 124 is opposite to that of the first embodiment (see FIG. 5). For this reason, the plan view when the wiring configuration in the mounting area of the driver IC 122 is seen through from the observation side to the back side, that is, the plan view when the mounting surface of the driver IC is overlooked is shown in parentheses in FIG. This indicates that the observation side and the back side are opposite to each other (the z direction is opposite).

Therefore, the wiring 3 in the second embodiment
The configuration of 50, 360, and 370 is exactly the same as that of the first embodiment, but since it is provided on the back side, when the observation side is facing upward, the vertical relationship with the first embodiment appears to be opposite. Become. That is, the wirings 350, 360,
Reference numerals 370 denote low-resistance conductive films 352, 362, and 372 and a segment electrode 314, respectively, as in the first embodiment.
And a transparent conductive film 354, 364, 374 of the same layer. However, in the second embodiment, the low-resistance conductive films 352, 362, and 372 are formed of the same layer as the light-shielding film 302 described above. That is, in the present embodiment, the light-shielding metal layer such as chromium is patterned to form the light-shielding film 302 and the low-resistance conductive films 352, 362, and 3.
72 will be formed. Then, next, regarding the manufacturing process of such a substrate 300,
The explanation will be focused on 0.

<Manufacturing Process> For the sake of convenience, the description will be made with the segment electrode 314 and the wiring 350 as the center, inside the seal frame (display area), the seal material, and outside the seal frame. First, as shown in FIG. 19A, a negative photoresist is applied and baked on the entire inner surface of the substrate 300 to form a resin layer 303 ″. next,
The resin layer 303 ″ is exposed and developed using a photomask that locally transmits a large number of lights. As a result, as shown in FIG. 2B, the portion irradiated with light (the photosensitive portion) is removed in the seal frame, and a large number of protrusions 30 are formed.
3a will be formed. Note that this projection 303a
May be formed by using a positive photoresist to cure the light-irradiated portions while removing the non-light-irradiated portions.

Next, as shown in FIG.
The substrate 300 on which 3a is formed is heat-treated at a temperature equal to or higher than the thermal deformation temperature of the photoresist. By this heat treatment, the projection 303a is softened and the corner is rounded. This allows
The scattering resin layer 303 having relatively smooth irregularities is formed. The material (viscosity and film thickness) of the resin layer 303 ″, the shape of the protrusion 303 a, the pitch, and the like are selected according to the scattering characteristics required for the scattering resin layer 303.

Further, as shown in FIG. 4D, a reflective layer 304 'made of a silver alloy, aluminum, or the like is formed by sputtering or the like. Subsequently, as shown in FIG. 3E, the reflection layer 304 'is patterned by using a photolithography technique and an etching technique to form the reflection film 30'.
4 is formed. At the time of this patterning, the opening 309 is formed.
Are also formed at the same time.

Subsequently, after forming a resin layer colored in any one of R (red), G (green), and B (blue), patterning is performed by using a photolithography technique and an etching technique. A color filter for each color is formed. The other two color filters are formed by the same patterning. Thereby, as shown in FIG. 20F, the reflective film 309 having the opening 309 formed thereon is
Color filters 3 corresponding to each of R, G, B colors
05R, 305G, and 305B are formed.

Next, as shown in FIG.
A metal (for example, chromium) having a lower resistance than a transparent metal oxide such as ITO is deposited on the entire inner surface of 0 by sputtering or the like to form a low-resistance metal layer 302 '. Subsequently, as shown in FIG. 3H, the low-resistance metal layer 302 ′ is patterned by photolithography and etching to form a light-shielding film 302 in a display area in the seal frame. Outside the seal frame, the low-resistance conductive film 352 constituting the wiring 350
In addition, low-resistance conductive films 312, 362, and 372 forming the wirings 310, 360, and 370 are formed.

Next, as shown in FIG. 7I, a resin material such as an acrylic resin is applied or printed, and the resultant is baked to form a flattening film (overcoat) 307. The flattening film 307 includes color filters 305R and 305R.
5G, 305B, the reflective film 304, and the like, and are formed so as not to cover the region where the sealant 110 is formed.

Subsequently, as shown in FIG. 21J, the entire surface of the substrate 300 on which the planarizing film 307 is formed
A transparent conductive layer 314 ′ of TO or the like is formed by using a sputtering method, an ion plating method, or the like. Then, as shown in FIG. 9 (k), the transparent conductive layer 314 ′ is patterned by photolithography and etching to form the segment electrode 314, the transparent conductive film 354 forming the wiring 350, and the wiring 360. , 370 are formed. Then, for example, after applying and printing a polyimide solution, it is baked to form an alignment film 308 as shown in FIG. After that, a rubbing treatment is performed on the alignment film 308.

On the other hand, the manufacturing process of the substrate 200 on the observation side is not shown, but will be briefly described as follows. That is, first, a transparent conductive layer such as ITO is formed on the inner front surface of the substrate 200, and second,
This transparent conductive layer is patterned to form a common electrode 214
Third, after applying and printing a polyimide solution, baking is performed to form an alignment film 208, and the alignment film 2 is formed.
08 is subjected to a rubbing process.

Thereafter, the substrate 300 on the back side in which the alignment film 308 has been subjected to the rubbing treatment is similarly formed with the alignment film 20.
8 and the rubbing-processed substrate 200 on the observation side are bonded together by a sealing material 110 in which conductive particles 114 are appropriately dispersed. 160 is dropped. Then, by returning to normal pressure, the liquid crystal 160 penetrates into the seal frame, and then the opening is sealed with the sealing material 112. After this,
As described above, the driver ICs 122 and 124 and F
By mounting the PC board 150, the liquid crystal panel 100 as shown in FIG. 14 is obtained.

The display operation in the second embodiment is basically the same as in the first embodiment. That is, in the reflection type, external light from the observation side is reflected by the polarizing plate 131.
And a predetermined polarization state by passing through the phase difference plate 133, and further, the substrate 200 on the observation side → the common electrode 214.
→ liquid crystal 160 → segment electrode 314 → flattening film 307
→ Reflection film 30 through a route of color filter 305
4 is reached, reflected here, and follows the path that has just come.
On the other hand, in the transmission type, the irradiation light of the backlight (not shown) passes through the polarizing plate 121 and the phase difference plate 123 to be in a predetermined polarization state.
0 → opening 309 → color filter 305 → flattening film 3
The light is emitted to the observation side through a path of 07 → segment electrode 314 → liquid crystal 160 → common electrode 214 → substrate 200 on the observation side → polarizing plate 131. Therefore, in the second embodiment, similarly to the first embodiment, the amount of light that passes through the polarizing plate 131 and is finally visually recognized by an observer in both the reflection type and the transmission type is equal to the common electrode. Control is performed for each sub-pixel according to the voltage difference applied between 214 and the segment electrode 314.

According to the second embodiment, as in the first embodiment, the reflection type is provided when the external light is sufficient, and the backlight is turned on when the external light is weak. Therefore, display is possible in any case. Here, in the second embodiment, the wirings 350, 360, and 370 outside the display area are respectively
4, 364, 374 and a low-resistance conductive film 352, 362, 372 formed of the same light-shielding metal layer as the light-shielding film 302. As compared with the case, the resistance is reduced. Further, since the segment electrode 314 is laminated with the low-resistance conductive film 312 outside the seal frame, low resistance is achieved. Moreover, these low-resistance conductive films 3
12, 352, 362, and 372 are formed by patterning the same light-shielding metal layer as the light-shielding film 302 for preventing color mixing between the sub-pixels and defining the frame, so that it is not necessary to add a special manufacturing process. For this reason, in the second embodiment, the manufacturing process does not become complicated, so that the liquid crystal display device can be manufactured easily and at low cost.

In the second embodiment, the outer shape of the reflection film 309 is patterned in a band shape so as to have substantially the same shape as the segment electrode 314. This makes it difficult to capacitively couple through the capacitor. Furthermore, in the second embodiment, of the segment electrodes 314 formed on the substrate 300 on the back side, the driver I
A low-resistance conductive film 312 is formed under the portion immediately before the output-side bump of C124 to form a stacked wiring 310 (although the distance is short). Is being planned.

<Application> In the second embodiment described above, the first
The same application as the embodiment is possible. For example, as shown in FIG. 22, the driver ICs 122 and 124 are integrated into one chip by the driver IC 126 to form the common electrode 21.
4 and the segment electrode 314 may be driven. The driver IC is connected to the liquid crystal panel 10.
Instead of being mounted on the FPC board 150, it may be mounted on the FPC board 150 by a flip chip technique, a TAB technique, or the like. FIG. 23 is a perspective view showing an example in which the driver IC 126 formed into one chip is mounted on the FPC board 150.

Further, in the second embodiment, the transflective liquid crystal display device is used.
It may be a simple reflection type. In the case of the reflection type, a front light that irradiates light from the observation side may be provided as necessary instead of the backlight. In the embodiment, the conduction between the common electrode 214 and the wiring 350 is achieved by the conductive particles 114 mixed in the sealing material 110. It is good also as composition. On the other hand, since the common electrode 214 and the segment electrode 314 are in a relative relationship to each other, a configuration in which a segment electrode is formed on the observation-side substrate 200 and a common electrode is formed on the back-side substrate 300 may be employed. In this configuration, the segment electrode formed on the observation-side substrate 200 is connected to the wiring 350 formed on the back-side substrate 300 via the conductive particles 114 in the sealing material 110. In addition, in the second embodiment, similarly to the first embodiment, a TFD element is provided for each sub-pixel (or pixel),
It is good also as a structure driven by these.

<Others> In the first and second embodiments, the TN type liquid crystal is used, but the BTN (Bi-s
table Twisted Nematic) type, ferroelectric type and other bistable types with memory properties, polymer-dispersed types, and dyes that have anisotropy in the absorption of visible light in the major and minor axis directions of the molecule (Guest) is dissolved in liquid crystal (host) having a certain molecular arrangement, and GH in which dye molecules are arranged in parallel with the liquid crystal molecules.
(Guest host) type liquid crystal may be used. Also,
The liquid crystal molecules may be vertically aligned with respect to both substrates when no voltage is applied, and the liquid crystal molecules may be horizontally aligned with both substrates when voltage is applied. When no voltage is applied, the liquid crystal molecules are arranged in the horizontal direction with respect to both substrates, while when the voltage is applied, the liquid crystal molecules are arranged in the vertical direction with respect to both substrates. Is also good. As described above, the present invention can be applied to various types of liquid crystal or alignment method.

<Electronic Equipment> Next, some examples in which the above-described liquid crystal display device is used in specific electronic equipment will be described.

<Part 1: Mobile Computer> First, an example in which the liquid crystal display device according to this embodiment is applied to a mobile personal computer will be described. FIG. 24 is a perspective view showing the configuration of this personal computer. In the figure, a personal computer 1100 has a main body 110 having a keyboard 1102.
4 and a liquid crystal display unit 1106. The liquid crystal display unit 1106 is configured by adding a backlight (not shown) to the back of the liquid crystal panel 100 described above. Thus, if there is external light, the display can be visually recognized as a reflective type, and if the external light is insufficient, a backlight is turned on to be a transmissive type.

<2: Mobile Phone> Next, an example in which the liquid crystal display device is applied to a display section of a mobile phone will be described.
FIG. 25 is a perspective view showing the configuration of the mobile phone. In the figure, a mobile phone 1200 has a plurality of operation buttons 12.
In addition to the liquid crystal panel 02, the receiver 1204 and the mouthpiece 1206 are provided with the above-described liquid crystal panel 100. In addition, a backlight (not shown) for improving visibility is provided on the back surface of the liquid crystal panel 100 as necessary.

<Part 3: Digital Still Camera> Further, a digital still camera using a liquid crystal display device as a finder will be described. FIG. 26 is a perspective view showing the configuration of the digital still camera, but also simply shows the connection with an external device. An ordinary camera exposes a film with an optical image of a subject, while a digital still camera 1300 generates an image signal by photoelectrically converting an optical image of the object by an image sensor such as a CCD (Charge Coupled Device). It is. Here, case 1 in the digital still camera 1300
The liquid crystal panel 100 described above is provided on the back surface of the display 302, and is configured to perform display based on an image pickup signal by a CCD. Therefore, the liquid crystal panel 100 functions as a finder for displaying the subject. Case 1
A light receiving unit 1304 including an optical lens, a CCD, and the like is provided on the front side (the back side in the figure) of the 302.

Here, when the photographer checks the subject image displayed on the liquid crystal panel 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory of the circuit board 1308. . In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on a side surface of the case 1302.
As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 of the former, and a personal computer 1440 is connected to the input / output terminal 1314 of the latter for data communication as necessary. . Further, by a predetermined operation, the imaging signal stored in the memory of the circuit board 1308 is transmitted to the television monitor 1430.
And output to a personal computer 1440.

As the electronic apparatus, in addition to the personal computer shown in FIG. 24, the portable telephone shown in FIG. 25, and the digital still camera shown in FIG. 26, a liquid crystal television, a viewfinder type, a monitor direct-view type video tape recorder, Car navigation device, pager, electronic organizer, calculator, word processor, workstation, videophone, P
An OS terminal, a device including a touch panel, and the like can be given. Needless to say, the above-described display device can be applied as a display unit of these various electronic devices.

[0093]

As described above, according to the present invention, the wiring resistance formed on the substrate is the same as that of the transparent conductive film composed of the same layer as the transparent electrode and the low resistance conductive film composed of a lower resistance material. , It is possible to reduce the resistance of the wiring as compared with the case where it is composed of any single layer.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an entire configuration of a liquid crystal panel included in a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing a configuration when the liquid crystal panel is broken in an X direction.

FIG. 3 is a plan view showing a configuration of a pixel and a configuration near a sealing material in the liquid crystal panel.

FIG. 4 is a sectional view taken along line AA ′ in FIG.

FIGS. 5A and 5B are partial cross-sectional views each showing the vicinity of a mounting area of a driver IC in the same liquid crystal panel.

FIG. 6 is a partial plan view showing the vicinity of a mounting area for a driver IC on a substrate on the back side of the liquid crystal panel.

FIG. 7 is a view showing a manufacturing process of an observation-side substrate in the liquid crystal panel.

FIG. 8 is a diagram showing a manufacturing process of the rear substrate in the liquid crystal panel.

FIG. 9 is a diagram showing a manufacturing process of the rear substrate in the liquid crystal panel.

FIG. 10 is a perspective view showing a modification of the liquid crystal panel.

FIG. 11 is a perspective view showing another modified example of the liquid crystal panel.

FIG. 12 is a partial sectional view showing still another modification of the liquid crystal panel.

FIG. 13 is a partially enlarged perspective view showing an observation-side substrate in an application example of the liquid crystal panel.

FIG. 14 is a perspective view illustrating an entire configuration of a liquid crystal panel included in a liquid crystal display device according to a second embodiment of the present invention.

FIG. 15 is a partial cross-sectional view showing the configuration when the liquid crystal panel is broken along the X direction.

FIG. 16 is a partial cross-sectional view illustrating a configuration when the liquid crystal panel is broken along the Y direction.

FIG. 17 is a plan view showing a configuration of a pixel and a configuration near a sealing material in the liquid crystal panel.

FIG. 18 is a partial cross-sectional view showing the vicinity of a mounting area of a driver IC in the same liquid crystal panel.

FIG. 19 is a view illustrating a manufacturing process of the rear substrate in the liquid crystal panel.

FIG. 20 is a view illustrating a manufacturing process of the rear substrate in the liquid crystal panel.

FIG. 21 is a view illustrating a manufacturing process of the rear substrate in the liquid crystal panel.

FIG. 22 is a perspective view showing a modification of the liquid crystal panel.

FIG. 23 is a perspective view showing another modification of the liquid crystal panel.

FIG. 24 is a perspective view illustrating a configuration of a personal computer as an example of an electronic apparatus to which the liquid crystal panel according to the embodiment is applied.

FIG. 25 is a perspective view illustrating a configuration of a mobile phone as an example of an electronic apparatus to which the liquid crystal panel according to the embodiment is applied.

FIG. 26 is a perspective view showing the configuration of the back side of a digital still camera as an example of an electronic apparatus to which the liquid crystal panel according to the embodiment is applied.

[Explanation of symbols]

100: liquid crystal panel 110: sealing material 112: sealing material 114: conductive particles (conductive material) 122, 124, 126: driver ICs 129a, 129b: bumps 130, 140 ... adhesives 134, 144 ... conductive particles 150 ... FPC substrate 160 ... liquid crystal 200 ... substrates (first substrate) 203, 303 ... scattering resin layers 204, 304 ... -Reflective film 205R, 205G, 205B, 305R, 305G,
305B: color filters 208, 308: alignment films 209, 309: opening 214: common electrode 300: substrate (second substrate) 314: segment electrode 350, 360, 370 ... Wiring 352, 362, 372 ... Low resistance conductive film 354, 364, 374 ... Transparent conductive film 1100 ... Personal computer 1200 ... Cellular phone 1300 ... Digital still camera

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/30 338 G09F 9/30 338 343 343 343Z F-term (Reference) 2H091 FA14Y FA34Y GA02 GA11 GA13 MA10 2H092 GA38 GA39 GA45 GA48 GA60 HA03 HA06 JB21 JB54 KB04 NA28 5C094 AA31 BA03 BA43 CA19 EA04 EA05 EA07 JA05 5G435 AA17 BB12 BB15 CC09 EE40 EE47 HH12 HH15 KK05 KK10 KK10

Claims (19)

[Claims] 1. A liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. A first transparent electrode provided on one substrate, a first wiring provided on the second substrate, and a conductive material for connecting the first transparent electrode and the first wiring. The liquid crystal device, wherein the first wiring includes a metal oxide film and a conductive film having a lower resistance than the metal oxide film. 2. The liquid crystal device according to claim 1, wherein the conductive film is formed so as to avoid a connection portion with the conductive material. 3. A driver IC provided on the second substrate for driving the liquid crystal, the driver IC including an output-side bump for supplying a signal, wherein the output-side bump includes: 2. The liquid crystal device according to claim 1, wherein the conductive film is connected to the first wiring, and is formed so as to avoid a connection portion with the driver IC. 3. A second wiring provided on the second substrate, the second wiring including a metal oxide film and a conductive film having a lower resistance than the metal oxide film; and a second wiring provided on the second substrate. A driver IC for driving the liquid crystal, the driver IC including an input-side bump for inputting a signal, wherein the input-side bump is connected to the second wiring, The conductive film contained in the wiring of
The liquid crystal device according to claim 1, wherein the liquid crystal device is formed so as to avoid a connection portion with the liquid crystal device. 5. A first overhanging region provided on one side of the second substrate and not overlapping the first substrate, and a side of the second substrate intersecting the one side. And a second overhang region that does not overlap with the first substrate. The driver IC is provided at the first overhang region, and the second wiring is provided at the first overhang region. Overhang area, and
The liquid crystal device according to claim 4, wherein the liquid crystal device is provided over both of the second overhang regions. 6. An external circuit board connected to the second wiring at the second overhang region, wherein a conductive film included in the second wiring is connected to the external circuit board. The liquid crystal device according to claim 5, wherein the liquid crystal device is formed so as to avoid the portion. 7. The liquid crystal device according to claim 1, further comprising: a second transparent electrode provided on the second substrate; and a driver IC connected to the second transparent electrode. . 8. A second wiring provided on the second substrate, the second wiring including a metal oxide film, and a conductive film having a lower resistance than the metal oxide film, and connected to the driver IC. A first overhanging region provided on one side of the second substrate and not overlapping with the first substrate; and a second overhanging side provided on the second substrate and intersecting with the one side; A second overhanging region that does not overlap with the first substrate, wherein the driver IC includes an input-side bump for inputting a signal from the second wiring, and is provided in the first overhanging region. The second wiring includes the first overhang region, and
The liquid crystal device according to claim 7, wherein the liquid crystal device is provided over both of the second overhang regions. 9. The liquid crystal device according to claim 8, wherein the conductive film included in the second wiring is formed so as not to be connected to the driver IC. 10. An electronic apparatus comprising the liquid crystal device according to claim 1. 11. A liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. A first transparent electrode provided on one substrate, a first wiring provided on the second substrate, a conductive material for connecting the first transparent electrode and the first wiring, A second transparent electrode provided on a second substrate; and a second wiring provided on the second substrate and connected to the second transparent electrode, wherein the first or second wiring is provided. At least one of the liquid crystal devices includes a metal oxide film and a conductive film having a lower resistance value than the metal oxide film. 12. A driver IC provided on the second substrate and configured to drive the liquid crystal, wherein the driver IC includes an output-side bump for supplying a signal, and the output-side bump includes: The liquid crystal device according to claim 11, wherein the liquid crystal device is connected to the first or second wiring. 13. The liquid crystal device according to claim 11, further comprising an external circuit board for supplying a signal to each of the first and second wirings. 14. A liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. A first overhanging region provided on one side of the second substrate and not overlapping the first substrate; and a first overhanging region provided on the second substrate and intersecting with the one side; A second overhanging region that does not overlap with the substrate, and wiring provided over both the first overhanging region and the second overhanging region, wherein the wiring comprises a metal oxide film and the metal A liquid crystal device comprising: a conductive film having a lower resistance value than an oxide film. 15. A liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. A plurality of first transparent electrodes provided on one substrate; and a conductive light-shielding film provided between the adjacent first transparent electrodes so as to be non-conductive to the first transparent electrode; A wiring provided on the first substrate and connected to the first transparent electrode, wherein the wiring is substantially the same layer as the first transparent electrode; A liquid crystal device comprising the same layer. 16. A liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. A plurality of first transparent electrodes provided on one substrate; and a conductive light-shielding film provided between the adjacent first transparent electrodes so as to be non-conductive to the first transparent electrode; A wiring provided on the first substrate; a second transparent electrode provided on the second substrate; and a conductive material for connecting the wiring and the second transparent electrode. A liquid crystal device comprising: a layer substantially the same as the first transparent electrode; and a layer substantially the same as the light-shielding film. 17. A method for manufacturing a liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. Providing a first transparent electrode on the first substrate; connecting a first wiring provided on the first and second substrates; and connecting the first transparent electrode to the first wiring. A method of manufacturing a liquid crystal device, comprising: a conductive material; and a first wiring including a metal oxide film and a conductive film having a lower resistance value than the metal oxide film. 18. A method for manufacturing a liquid crystal device in which a first substrate and a second substrate are placed facing each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. Providing a plurality of first transparent electrodes on the first substrate; and providing a conductive light-shielding film between the adjacent first transparent electrodes so as to be non-conductive with the first transparent electrodes. Providing a wiring connected to the first transparent electrode on the first substrate, wherein the wiring is substantially the same layer as the first transparent electrode; A method for manufacturing a liquid crystal device, comprising: forming a light-shielding film and a substantially same layer. 19. A method for manufacturing a liquid crystal device in which a first substrate and a second substrate are arranged to face each other, and a liquid crystal is sealed in a gap between the first substrate and the second substrate. Providing a plurality of first transparent electrodes on the first substrate; and providing a conductive light-shielding film between the adjacent first transparent electrodes so as to be non-conductive with the first transparent electrodes. And a step of connecting a wiring provided on the first substrate and a second transparent electrode provided on the second substrate by a conductive material, wherein the wiring is formed by the first transparent electrode. A method for manufacturing a liquid crystal device, comprising: forming a layer substantially the same as an electrode; and a layer substantially the same as the light-shielding film.