JP2002043213A - Stage device and exposure system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the disturbance caused by a power supply member even when a stage main body moves. SOLUTION: A stage device is provided with the stage main body WS1 to which the power supply member 129 which supplies power is connected and moves on a surface plate 12 along a first stator. The device is also provided with a second stator 111 which is set up separately from the first stator and a power supply stage 115 which relays the power supply member 129 and moves synchronously to the stage main body WS1 along the second stator 111.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage device in which a stage body moves on a surface plate along a stator, and to expose a pattern of a mask on a substrate by using a mask and a substrate held by the stage device. More particularly, the present invention relates to a stage apparatus and an exposure apparatus suitable for use in a lithography process when manufacturing a device such as a liquid crystal display element or a semiconductor element.

[0002]

2. Description of the Related Art Conventionally, in a lithography process which is one of the manufacturing processes of a semiconductor device, a circuit pattern formed on a mask or a reticle (hereinafter referred to as a reticle) is coated with a resist (photosensitive agent) on a wafer. Alternatively, various exposure apparatuses for transferring the image onto a substrate such as a glass plate have been used. For example, as an exposure apparatus for a semiconductor device, a reticle pattern is projected onto a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of a pattern accompanying the high integration of an integrated circuit in recent years. A reduction projection exposure apparatus that performs reduction transfer is mainly used.

As this reduction projection exposure apparatus, a step-and-repeat type static exposure reduction projection exposure apparatus (so-called stepper) for sequentially transferring a reticle pattern to a plurality of shot areas (exposure areas) on a wafer.
And an improved version of this stepper.
No. 043, etc., a reticle and a wafer are synchronously moved in a one-dimensional direction to transfer a reticle pattern to each shot area on the wafer. Scanning steppers) are known.

In such a stepper or a scanning stepper, a table (stage body) holding a wafer by suction means such as negative pressure suction, which can be moved in the optical axis direction and leveled for focus position adjustment, is placed on the stage. In a state where these tables and stages are levitated by air bearings that are non-contact bearings,
It is moved on the surface plate by a drive device such as a linear motor. A movable mirror for reflecting the detection light is provided on the table, and the detection light is emitted from a position detecting device such as a laser interferometer disposed opposite to the movable mirror, based on the reflected light from the movable mirror. The position of the wafer is detected with high accuracy by measuring the distance from the stage. Similarly, in the case of a reticle, a movable mirror is provided on a reticle stage (stage main body) that holds the reticle by suction, a detection light is emitted from a position detecting device, and the distance between the reticle and the reticle stage is measured. Is detected with high accuracy.

[0005] To the stage main body such as the table and the reticle stage are connected pipes and wires as utility supply members to which various utilities are supplied. Specifically, piping for supplying air for air bearing as a utility, piping for supplying a negative pressure for suction means as a utility, piping for supplying a temperature adjusting medium such as Fluorinert as a utility, and even a leveling sensor. Wiring for supplying power as a utility, system wiring for supplying various control signals as a utility, and the like are connected to the stage body.

[0006] Incidentally, these utility supply members may apply a pulling force with the movement of the stage main body or generate a micro-vibration by a reaction force thereof, which may cause an error in the synchronization accuracy of the stage main body. Conventionally, the synchronization error caused by the micro-vibration has been neglected, but in recent years, as the exposure accuracy has advanced with the miniaturization of patterns, it has been necessary to take measures against this error. To solve this problem, a stage device shown in FIG. 8 is provided.

In the stage device 91 shown in this figure, movers 93, 93 move in the X direction along stators 92, 92 extending in the X direction, and are suspended between the movers 93, 93 and extend in the Y direction. Stator 95 provided on guide bar 94 of length
The stage main body 96 as a mover moves in the Y direction along the axis, and a piping tray 97 is disposed on the X side of the stage main body 96. The piping tray 97 is connected to the movers 93, 93 (or the guide bar 94), and is configured to move integrally with the stage main body 96 in the X direction. The air supplied from the utility supply member 98 is supplied to an air bearing provided on the stage body 96 so as to face the guide bar 94. The above-mentioned various supply members 98 connected to the stage main body 96 and a supply member 99 connected to one of the movable elements 93 are accommodated and supported in the piping tray 97. Then, in this stage device, the utility tray 98 moves along the X direction of the stage main body 96, thereby reducing the pulling force and vibration applied to the stage main body 96 by the utility supply member 98.

Similarly, a stage device described in Japanese Patent Application Laid-Open No. 8-63231 is provided as a stage device for reducing the pulling force and vibration applied to the stage main body 96 by the utility supply member 98. In this stage device, a mover provided on the stage body and a mover provided on a carrier / follower to which a cable as a utility supply member is connected simultaneously provide magnetic flux from the same magnetic track as a stator. In this way, the carrier /
The follower moves following and the cable removes the tensile force applied to the stage body.

[0009]

However, the conventional stage apparatus and exposure apparatus as described above have the following problems. Regarding the movement of the stage body 96 in the Y direction, as shown in FIG.
And the piping tray 97 relatively move, so that various disturbances are transmitted to the stage body 96 via the utility supply member 98. During the disturbance, for example, when the stage body 96 moves in the −Y direction, the contact of the utility supply member 98 with the piping tray 97 or the rubbing and hitting of the utility supply members 98 with each other is performed. Further, there are micro vibrations generated due to fluctuations in the internal pressure of the fluid in the utility supply member 98, transmission of floor vibrations, and the like, and this micro vibration may be transmitted to the stage body 96.

Among the disturbances, a static one is a drag caused by the deformation of the utility supply member 98, and this drag may be transmitted to the stage body 96. In particular, in recent years, the demand for a chemical clean for the power supply member 98 has been increased, and from the viewpoint of preventing internal fluid from permeating and preventing seepage, the power supply member 98 has a large thickness or a hardened material having a double structure. Has been adopted. Therefore, the drag of the utility supply member 98 tends to be further increased, and there is a concern that the influence on the stage body 96 will be increased.

On the other hand, when the carrier / follower and the stage main body are driven by using the same stator, fine vibration accompanying the movement of the carrier / follower is transmitted as disturbance to the stage main body via the stator, There is a problem that the movement control of the stage body is hindered. In particular, when the stator is installed on the surface plate, there is a problem that the vibration accompanying the movement of the carrier / follower is transmitted to the surface plate.

In such an exposure apparatus for exposing a mask pattern onto a substrate such as a wafer using a stage apparatus, if disturbances hinder the movement control of the stage body, the pattern is placed on the substrate. A problem that exposure cannot be performed with high accuracy occurs. Further, there is a problem that the guide bar 94 vibrates due to air blown from the air bearing provided on the stage body 96 to the guide bar 94. The kinematic viscosity coefficient of air is 15.
Since it is as low as 75 × 10 ⁻⁶ , there is a problem that it is difficult to improve the damping property when the guide bar 94 vibrates slightly.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and is capable of reducing disturbance (vibration) caused by a utility supply member and a gas bearing even when a stage body moves. An object of the present invention is to provide an exposure apparatus capable of exposing a mask pattern onto a substrate with high accuracy using this stage apparatus.

[0014]

In order to achieve the above object, the present invention employs the following structure corresponding to FIGS. 1 to 6 showing an embodiment. The stage device of the present invention includes a stage main body (WS1, WS2) to which a power supply member (129) for supplying power is connected and moves on the platen (12) along the first stator (83). In the stage device (1), the second stator (111) installed separately from the first stator (83), and the utility supply member (1).
29), and a power supply stage (115) that moves synchronously with the stage bodies (WS1, WS2) along the second stator (111).

Therefore, in the stage device of the present invention, the utility supply stage (115) is provided with the stage main body (WS1, WS1).
2), and the relative positional relationship between them is maintained, so that the generation of micro-vibration and drag due to the deformation of the utility supply member (129) can be suppressed, and the stage body (WS1, WS1)
2) It can be prevented from being transmitted as a disturbance. In the stage device of the present invention, since the second stator (111) along which the utility supply stage (115) is separated from the first stator (83), it is necessary to move the utility supply stage (115). The accompanying fine vibration can be prevented from being transmitted to the stage main bodies (WS1, WS2) via the first stator (83). Note that the second stator (111) is installed independently of the surface plate (12) in vibration so that the minute vibration accompanying the movement of the utility supply stage (115) is not transmitted to the surface plate (12). Preferably.

Further, according to the stage apparatus of the present invention, there is provided a stage apparatus (1) for moving a stage body (WS1, WS2) along a moving surface.
S1, WS2), the moving surface and the stage body (WS)
1, WS2) are provided in a non-contact manner and opposed to each other, and a chamber (4) for sealingly surrounding the stage device (1), and a supply device (150) for supplying helium to the gas bearing and the chamber (4). ).

Therefore, in the stage device of the present invention, the atmosphere in the chamber (4) can be formed with helium. It should be noted that the stage device has a plurality of stage bodies (W
S1 and WS2) can also be selected. in this case,
Since helium is supplied to the gas bearing, it is possible to suppress the vibration of one stage main body from adversely affecting the other stage main body.

The exposure apparatus according to the present invention is an exposure apparatus (10) for exposing a pattern of a mask (R) held on a mask stage (RST) to a substrate (W) held on a substrate stage (1). The stage device according to any one of claims 1 to 7 is used as at least one of the mask stage (RST) and the substrate stage (1).

Therefore, in the exposure apparatus of the present invention, it is possible to suppress the disturbance caused by the movement of the utility supply stage (115) from being transmitted to the mask (R) or the substrate (W). for that reason,
Position control between the mask (R) and the substrate (W) can be performed with high precision, and the pattern of the mask (R) can be formed on the substrate (W) by exposure with high precision.

Further, the exposure apparatus of the present invention includes a mask stage (RST) for moving the mask (R) and a substrate stage (1) for moving the substrate (W). (W) Exposure device (1)
(0), wherein at least one of the mask stage (RST) and the substrate stage (1) uses the stage device according to the ninth or tenth aspect.

Therefore, in the exposure apparatus of the present invention, the helium atmosphere in the chamber (4) can be maintained, and the helium is supplied to the gas bearing, so that the vibration of the stage bodies (WS1, WS2) adversely affects the exposure. Can be prevented.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a stage apparatus and an exposure apparatus according to the present invention will be described below with reference to FIGS. Here, for example, a scanning type exposure apparatus (scanning stepper) that transfers a circuit pattern of a semiconductor device formed on the reticle onto a wafer while synchronously moving a reticle as a mask and a wafer is used as the exposure apparatus. This will be described using an example of the case. In this exposure apparatus, the stage device of the present invention is applied to a wafer stage. In these figures, the same components as those in FIGS. 8 and 9 shown as conventional examples are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 1 shows a schematic configuration of a projection exposure apparatus 10 according to one embodiment. This projection exposure apparatus 10
Is a step-and-scan type scanning exposure type projection exposure apparatus.

The projection exposure apparatus 10 holds wafers W1 and W2 (appropriately used with the symbol W) as substrates on the surface plate 12 via wafer tables TB1 and TB2, and independently holds the wafers W1 and W2 in the X-axis direction and the W-axis direction. Wafer stage (stage main body) WS1, WS2 that moves in a two-dimensional direction in the Y-axis direction
(Substrate stage) 1 having a projection optical system PL disposed above the stage device 1, and a reticle R serving as a mask above the projection optical system PL mainly in a predetermined scanning direction, here, the Y-axis direction. The apparatus includes a stage device (mask stage) 2 having a reticle stage RST that is driven (in the direction perpendicular to the plane of FIG. 1), an illumination system 3 that illuminates the reticle R from above, and a control system that controls these components. Is housed in a chamber 4 in which temperature control and humidity control are performed.

The interior of the chamber 4 further includes a chamber 5
The stage device 1, the projection optical system PL, the stage device 2, and the illumination system 3 are accommodated in the chambers 5 to 8, respectively. The temperature inside the chambers 4 to 7 is controlled by a chamber control device 150 connected to the main control device 90 so as to be within a predetermined temperature range. As the temperature control method, for example, a method is adopted in which an inert gas photochemically reactive flows through each chamber in a temperature-controlled state. In this embodiment, helium is used as the inert gas. The partition wall between the chambers is provided with a transmission window (not shown) positioned on the optical path of the exposure light, so that the exposure light can be transmitted without any trouble.

The chamber control device 150 also supplies helium to helium bearings (gas bearings) 88 and 102 to be described later. The thermal conductivity of air is 26.14
For × 10 ^-3 to (W / (m / k) ), the thermal conductivity of helium is ^{15.5 × 10 -2 (W / (} m / k)),
By setting the inside of the chamber 4 to a helium atmosphere, fluctuations in the chamber 4 can be reduced. For this reason, an improvement in the position measurement accuracy of the stage devices 1 and 2 by the laser interference system described later can be expected.

As shown in FIG. 1, the illumination system 3 includes a light source unit 40, a shutter 42, a mirror 44, beam expanders 46 and 48, a first fly-eye lens 50, a lens 5
2, a vibration mirror 54, a lens 56, a second fly-eye lens 58, a lens 60, a fixed blind 62, a movable blind 64, relay lenses 66 and 68, and the like.

Here, the components of the illumination system will be described together with their operations. A laser beam emitted from a light source unit 40 including a KrF excimer laser as a light source and a dimming system (a dimming plate, an aperture stop, etc.)
After being transmitted, the light is deflected by a mirror 44, shaped into an appropriate beam diameter by beam expanders 46 and 48, and is incident on a first fly-eye lens 50. This first
The luminous flux incident on the fly-eye lens 50 is divided into a plurality of luminous fluxes by two-dimensionally arranged fly-eye lens elements, and each of the luminous fluxes is again separated from a different angle by the lens 52, the vibration mirror 54, and the lens 56. The light enters the second fly-eye lens 58.

The light beam emitted from the second fly-eye lens 58 reaches the fixed blind 62 installed at a position conjugate with the reticle R by the lens 60, where the cross-sectional shape is defined to a predetermined shape. Passes through a movable blind 64 disposed at a position slightly defocused from the conjugate plane of the reticle R, and is defined by the fixed blind 62 on the reticle R as uniform illumination light via relay lenses 66 and 68. The illumination area IA (see FIG. 2) having a predetermined shape, here a rectangular slit shape, is illuminated.

Next, the stage device 2 will be described.
The stage device 2 includes a reticle stage RST that holds a reticle R as a substrate on a reticle surface plate 32 and is movable in two-dimensional XY directions, and a reticle stage R
The reticle stage includes a linear motor (not shown) that drives the ST, and a reticle interferometer system 11 that manages the position of the reticle stage RST.

As shown in FIG. 2, on reticle stage RST, two (a plurality of) reticles R1, R2 are arranged in series in the scanning direction (Y-axis direction). The reticle stage RST is levitated and supported on a reticle surface plate 32 via a helium bearing or the like (not shown), and is minutely driven in the X-axis direction by a driving mechanism 30 (see FIG. 1) composed of a linear motor or the like (not shown). The micro-rotation in the direction and the scanning drive in the Y-axis direction are performed.

The drive mechanism 30 is a mechanism using a linear motor similar to the stage device 1 described later as a drive source, but is shown as a simple block in FIG. 1 for convenience of illustration and description. . For this reason, the reticles R1 and R2 on the reticle stage RST are selectively used, for example, in the case of double exposure, and any of the reticles can be synchronously scanned with the wafer side.

Although not shown, a reticle holder for attracting and holding the reticle R outside the pattern area is supported on the reticle stage RST, and a movable mirror 34 is located at the end on the + X side in the Y-axis direction. Two movable mirrors 35 and 37 are arranged so as to extend and be positioned at the end on the −Y side. Here, reticles R1 and R2 each having a size of 152.4 mm (6 inches) are arranged at intervals in the Y direction. The reticle stage RST, the reticle holder, and the movable mirrors 34, 35, and 37 are formed of a material (ceramic) having low thermal expansion.

Reflecting surfaces are formed on the surface on the + X axis side of the movable mirror 34 and on the -Y side of the movable mirrors 35 and 37 by aluminum evaporation or the like. An interferometer beam from an interferometer 36 indicated by a length measuring axis BI6X is emitted toward the reflecting surface of the movable mirror 34, and the interferometer 36 receives the reflected light and measures a relative displacement with respect to a reference surface. , The position of the reticle stage RST in the X direction is measured. here,
The interferometer having the length measuring axis BI6X actually has two interferometer optical axes that can be measured independently, and can measure the position of the reticle stage RST in the X-axis direction and the yawing amount. It has become.

The movable mirrors 35 and 37 are irradiated with interferometer beams indicated by length measuring axes BI7Y and BI8Y from a pair of double-pass interferometers (not shown), and the respective reflected lights reflected therefrom are respectively reflected by the respective double-pass interferometers. Received. Then, the measurement values of these double-pass interferometers are supplied to the stage control device (control device) 38 in FIG. 1, and the position of the reticle stage RST in the Y-axis direction is measured based on the average value. The information on the position in the Y-axis direction is based on a reticle stage RST and a wafer stage WS1 or W based on a measurement value of an interferometer having a wafer-side measurement axis BI3Y (described later).
It is used for calculation of the relative position with respect to S2, and synchronization control of the reticle and the wafer in the scanning direction (Y-axis direction) at the time of scanning exposure based on this. That is, in the present embodiment, the movable mirror 3
4, 35, 37, interferometer 36 and measuring axes BI7Y, BI
A reticle interferometer system 11 is constituted by a pair of double-pass interferometers indicated by 8Y.

Next, the stage device 1 will be described. As shown in FIG. 3, the stage device 2 includes a flat plate 13 a along the XY plane and +
A base plate 13 having a U-shape in side view and having protrusions 13b, 13b protruding in the Z direction, and a vibration isolator / vibration isolator, such as a pneumatic damper or a piezo damper, are provided to the protrusions 13b, 13b of the base plate 13. As a result, the surface plate 12 suspended independently in vibration and the surface of the surface plate 12 (moving surface) are levitated and supported via a non-contact bearing (helium bearing in the present embodiment) (not shown) and a linear motor. Etc., two wafer stages WS1 and WS2 that can move two-dimensionally independently along the upper surface of the surface plate 12, and a stage drive system 1 that drives these wafer stages WS1 and WS2.
4 and the wafer W via the wafer stages WS1 and WS2.
1, an interferometer system 9 for measuring the position of W2. The stage drive system 14 is controlled by the control device 38.

More specifically, a helium bearing (not shown) (for example, a vacuum preload type helium bearing) is provided at a plurality of places on the bottom surface of the wafer stages WS1 and WS2, and the wafer stages WS1 and WS2 The helium bearing is floated and supported opposite to the upper surface of the platen 12 with an interval of, for example, several microns maintained by the balance between the helium ejection force of the helium bearing and the vacuum preload.
When an air bearing is used as a gas bearing in a chamber in a helium atmosphere, the air supplied to the air bearing must be recovered using an exhaust device or the like to maintain the helium atmosphere. On the other hand, if a helium bearing is used, the above-described exhaust device or the like becomes unnecessary, and the device configuration can be simplified.

As shown in FIG. 2, wafer stage WS
1. On WS2, a Z · θ drive mechanism (not shown)
Wafer tables TB1 and TB2 that are minutely driven in the Z-axis direction and the θ-direction (rotational direction around the Z-axis) orthogonal to the XY plane, and perform movement in the optical-axis direction (Z-direction) and leveling adjustment for focus position adjustment. Are provided respectively. On wafer tables TB1 and TB2, wafer holders WH1 and WH1, which hold wafers W1 and W2 by negative pressure suction, respectively.
WH2 is detachably mounted by vacuum suction, kinematic coupling or the like. Also, the wafer table T
B1 and TB2 are provided with a temperature adjusting mechanism for maintaining a constant temperature. As this temperature adjustment mechanism,
Refrigerant supply source (not shown) for supplying refrigerant such as florinate
And a flow path through which the supplied refrigerant flows.

On the upper surfaces of wafer tables TB1 and TB2, reference mark plates F on which various reference marks are formed are formed.
M1 and FM2 are installed so as to be substantially the same height as wafers W1 and W2, respectively. These fiducial mark plates FM1 and FM2 are used, for example, for the respective wafer stages WS1 and W2.
It is used when detecting the reference position of S2. Since wafer stages WS1 and WS2 have substantially the same configuration, wafer stage WS1 will be mainly described below.

The stage drive system 14 includes a wafer stage W
Y motor Y that is a linear motor that drives S1 in the Y direction
M and an X motor XM that is a linear motor that drives the wafer stage WS1 in the X direction. These motors YM and XM drive wafer stage WS1 by Lorentz force generated by electromagnetic interaction.

The Y motor YM includes a stator 8 provided on the upper surface (+ Z) side of a long guide bar GB extending in the Y direction.
1 and a mover (not shown) provided on the wafer stage WS1. Then, the wafer stage WS
1 is a guide bar G by a helium bearing (not shown).
It is guided movably in the Y direction with a small clearance with respect to B. Here, a moving coil type linear motor is used as the Y motor YM, but a moving magnet type linear motor may be used.

As shown in FIG. 4, the X motor XM is provided with movable elements 82, 82 arranged at predetermined intervals on both sides of the guide bar GB in the Z direction and extending in the X direction ( 3) A stator block (first stator) 83 is provided with a stator 84 disposed so as to sandwich each of the movers 82 and 82. Although not shown in FIG. 4, a pair of stators 84 arranged on both sides of the guide bar GB in the Z direction is connected to connecting portions 83a provided at both ends of the stator block 83, as shown in FIG. 83a are integrally connected. In addition, the movers 82 and 8
2 and the stator block 83 (stator 84) are provided on both sides in the Y direction with the wafer stage WS1 interposed therebetween, but FIG. 1 shows only the + Y direction for convenience.

The movers 82 are mounted on both sides in the Z direction of a Y motor 87 such as a voice coil motor.
A core 89 provided at the tip of the guide bar GB is inserted between the Y motors 87, and drives the guide bar GB in the Y direction by the Lorentz force. The helium bearing 8 is attached to the Y motor 87 so as to face the guide bar GB.
8 are provided, and smoothly support the movement of the guide bar GB in a non-contact manner. And these movers 82, 8
2. The Y motor 87 and the core 89 are supported by the support plates 100 and 101.
And a helium bearing 102 provided on the stator block 83 so as to be opposed to the support plates 100 and 101 by the driving of the X motor XM. It is configured to move smoothly. The kinematic viscosity coefficient of helium is 1
2.24 × 10 ⁻⁵ (m ² / sec), almost eight times higher than air. Therefore, the helium bearings 88, 102
Even if the guide bar GB vibrates when helium is sprayed onto the guide bar GB, the attenuation accuracy is high or the vibration itself is reduced, so that the exposure accuracy does not decrease.

The stator block 83 includes the base plate 1
Both sides and the lower surface are movably held by U-shaped holding members 85, 85 respectively provided on the third 13b. Helium bearings 86 are disposed on the holding member 85 so as to face both side surfaces and the lower surface of the stator block 83, and smoothly support the movement of the stator block 83 in a non-contact manner.

On the upper and lower sides of the + X side end of the stator block 83, as shown in FIG. 5, movers 130 and 103 opening toward the wafer stage WS1 side.
Are arranged respectively. Then, the stator 105, which constitutes a voice coil motor together with the mover 130, is fixed on the projection 13 b of the base plate 13.
4 is supported. Similarly, a stator 106 constituting a voice coil motor together with the mover 103 is supported by a support 107 fixed on the flat plate portion 13 a of the base plate 13. The stator block 83 is driven in the X direction by a voice coil motor including the movers 130 and 103 and the stators 105 and 106.

On the other hand, various wirings and pipes are connected to the stage device 1. Specifically, a pipe for supplying and discharging a coolant for temperature adjustment, a pipe for supplying helium used for a helium bearing, a pipe for supplying a negative pressure (vacuum) for suctioning the wafer W1 under a negative pressure, and various sensors. Wiring for supplying power, system wiring for supplying various control signals and detection signals, and the like are provided for various driving devices and control devices. For example, for the wafer stage WS1, a temperature adjustment pipe, a pipe for sucking the wafer W1, a helium pipe for a helium bearing, a power wiring for supplying power to a leveling sensor, a distance sensor described below, and the like, A detection signal and a system wiring for driving a linear motor are connected. In the following description,
A description will be given assuming that these various utilities are supplied via a belt-shaped tube as a utility supply member.

As the tube, a tube having a large thickness or a hardened material having a double structure and having flexibility is used in order to satisfy a demand for chemical clean. This tube is used for the wafer stage W
It is connected to a centralized terminal (connector) 119 (see FIG. 6) provided on the −X side end face of wafer table TB1 on S1 (+ X side end face on wafer table TB2). The stage device 1 of the present embodiment is provided with synchronous stage devices DS1 and DS2 that perform synchronous movement corresponding to the wafer stages WS1 and WS2, respectively, via a tube connected to the wafer table TB1. In addition,
The synchronous stage device DS1 is configured to
The tube is relayed on the X side, and the synchronous stage device DS2
Although the tube is relayed on the + X side of the wafer stage WS2, the following description mainly describes the synchronous stage device DS1.

As shown in FIG. 6, the synchronous stage device DS
Reference numeral 1 denotes an X guide 108 which extends and is installed in the X direction.
08, moving bodies 109 and 109 (moving bodies on the −Y side are not shown) movably fitted to the X guides 108 and 108,
Stators (second stators) 111, 111 installed in parallel with the outside of each X guide 108, and stators 11
X motor 120 which is a linear motor together with 1, 111
112, 112 (the mover on the −Y side is not shown), and the stator 113 and the concentrated terminal support arranged along the Y direction on the −X side of the wafer stage WS1 on the surface plate 12. It is mainly composed of a member 114 and a synchronous stage (utility supply stage) 115 as a mover constituting a Y motor 121 which is a linear motor together with the stator 113.

The X guides 108 are arranged on the flat plate portion 13a of the base plate 13 on both sides in the Y direction with the platen 12 interposed therebetween. Extending portions 110, 110 extending to the + Y side (−Y side from the moving body not shown) are fixed to the upper portions of the moving bodies 109, 109, respectively. It is suspended downward from the parts 110 and 110. In addition, each extension portion 110, 110 is located outside the stator 111, 111,
16 and 116 are suspended, and the base end is
The support frames 117, 117, which are fixed to the base plates 10, 110, and whose leading ends are on the −X side of the base end and protrude from the base 12 in the + Z direction, are erected so as to face each other with the base 12 therebetween. Have been.

The stator 113 is mounted on the support frame 1.
The centralized terminal support member 114 is suspended between the distal ends of the support members 117 and 117, and is fixed to the distal ends of the support frames 117 and 117 via support plates 118 and 118 on the −X side of the stator 113.

Although not shown in FIG. 6, the synchronous stage device DS2 has a configuration similar to that of the synchronous stage device D1 and the stator 11 of the synchronous stage device DS2.
Reference numeral 3 is disposed on the + X side of wafer stage WS2, and centralized terminal support member 114 is disposed on the + X side of stator 113. The moving body 1 of the synchronous stage device DS2
09 and 109 and the movers 112 and 112 are the moving bodies 109 and 109 and the mover 1 of the synchronous stage device DS1.
X guide 108 and stator 11 identical to 12 and 112
1 and move independently of each other.

The positions of the movers 112 and 112 in the X direction, that is, the positions of the synchronous stage 115 in the X direction are detected by a linear encoder (not shown) and output to the stage controller 38. Further, the distance between wafer stage WS1 and synchronization stage 115 is different from wafer stage WS1.
The distance is detected by a distance sensor (detection device) (not shown) including a capacitance type sensor, a photo sensor, and the like provided in the first stage and output to the stage controller 38.

The X motor 120 and the Y motor 121 may be either a moving coil type linear motor or a moving magnet type linear motor. Further, the Y motor YM, 121, the X motor XM,
The drive of 120 is controlled by the stage control device 38.

The X motor 1 is connected to the centralized terminals 116, 116.
X tubes 122, 122 for supplying various utilities used for driving the motor 20 are connected. The centralized terminal 116 located on the + Y side has a wafer stage WS1.
(And wafer table TB1) is connected to a Y tube 123 that supplies various utilities used for driving and the like. The X tube 122 and the Y tube 123 are connected to each other so that the central terminal 116 is sufficiently bent so as not to cause any trouble even when the central terminal 116 is moved in the X direction by the X motor 120.

Further, the utilities supplied by the Y tubes 123 correspond to the Y tubes 126 to 124 connected to the centralized terminals 124 and 124 supported by the centralized terminal support member 114 and the centralized terminals 125 provided on the synchronous stage 115, respectively.
The wafer stage WS1 is connected to a centralized terminal 125 and a centralized terminal 119 provided on the wafer table TB1 via a Y tube (power supply member) 129 connected thereto.
(Wafer table TB1). The Y tube 128 is connected to the centralized terminal 125 with sufficient bending so as not to hinder the movement of the centralized terminal 125 by the Y motor 121 in the Y direction. In addition, Y tube 129
Also, the wafer stage WS1 and the synchronization stage 115 are connected with sufficient bending so as not to cause any trouble even when driven with a time difference.

The interferometer system 9 includes a wafer holder WH1
And the wafer holder WH
Moving mirrors 20 and 21 disposed in a predetermined positional relationship with 1;
The moving mirrors 22, 23 (see FIG. 2) held by the table TB2 common to the wafer holder WH2 and arranged in a predetermined positional relationship with the wafer holder WH2 (see FIG. 2), and an interferometer indicated by a length measurement axis BI1X as shown in FIG. Interferometer 1 for beam irradiation
6, an interferometer 18 for irradiating an interferometer beam indicated by a measurement axis BI2X, and, as shown in FIG.
And an interferometer (both not shown) for irradiating an interferometer beam indicated by BI5Y.

The movable mirror 20 is disposed so as to extend in the Y-axis direction at the -X side edge on the table TB1. The surface on the -X side is formed by depositing aluminum on a ceramic base material. The reflecting surface reflects the interferometer beam emitted from the interferometer 16. The movable mirror 22 is disposed to extend in the Y-axis direction at the + X-side edge on the table TB2, and the + X-side surface is also formed by subjecting a ceramic base material to aluminum evaporation and irradiating from the interferometer 18. The reflection surface reflects the interferometer beam to be reflected. And the interferometers 16 and 18 are
By receiving the reflected light from 0 and 22 respectively,
The relative displacement of each reflecting surface from the reference position is measured, and the wafer stages WS1, WS2 (therefore, wafers W1, W2)
Is measured in the X-axis direction. here,
The interferometers 16 and 18 are three-axis interferometers having three optical axes as shown in FIG.
1. In addition to measurement in the X-axis direction of WS2, tilt measurement and θ
Measurement is possible. The output value of each optical axis can be measured independently. Wafer stages WS1, WS2
Since the tables TB1 and TB2 for performing the θ rotation and the minute drive and the tilt drive in the Z-axis direction are below the reflection surface, the drive amounts during the tilt control of the wafer stage are all monitored by these interferometers 16 and 18. can do.

Similarly, the movable mirror 21 is disposed at the + Y side edge of the table TB1 so as to extend in the X-axis direction.
Numeral 3 is provided on the + Y side edge of the table TB2 so as to extend in the X-axis direction. On each + Y side surface, a ceramic base material is subjected to aluminum evaporation, and the length measurement axes BI3Y to BI5Y are provided.
The reflecting surface reflects the interferometer beam emitted from the interferometer having the following. Here, the length measurement axis BI3Y intersects perpendicularly with the X axis at the projection center of the projection optical system PL, and the length measurement axis B3Y.
I4Y and BI5Y intersect perpendicularly with the X axis at the respective detection centers of the alignment systems 24a and 24b.

In the case of the present embodiment, the position measurement in the Y direction of the wafer stages WS1 and WS2 at the time of exposure using the projection optical system PL requires the projection center of the projection optical system, that is, the length measurement axis BI3Y passing through the optical axis AX. Of the interferometer of
Wafer stage WS1 when using alignment system 24a
In the Y direction position measurement, the measurement value of the detection center of the alignment system 24a, that is, the interferometer measurement of the length measurement axis BI4Y passing through the optical axis SX is used, and the Y direction position measurement of the wafer stage WS2 when the alignment system 24b is used. The measurement value of the detection center of the alignment system 24b, that is, the measurement value of the interferometer of the length measurement axis BI5Y passing through the optical axis SX is used. In addition,
Each interferometer of the length measurement axes BI3Y, BI4Y, and BI5Y for Y measurement is a two-axis interferometer having two optical axes,
In addition to the measurement of the wafer stages WS1 and WS2 in the Y-axis direction, tilt measurement is possible. The output value of each optical axis can be measured independently.

In this embodiment, as described later,
While one of the wafer stages WS1 and WS2 is performing the exposure sequence, the other is performing the wafer exchange and the wafer alignment sequence. At this time, the output value of each interferometer is set so that there is no interference between the two stages. The movement of the wafer stages WS1 and WS2 is managed by the stage controller 38 in response to a command from the main controller 90 based on the above.

Next, the projection optical system PL will be described. Here, the projection optical system PL includes a plurality of lens elements having a common optical axis in the Z-axis direction,
Predetermined reduction ratio in both sides telecentric, for example, 1/4
Is used. Therefore, the moving speed of the wafer stage in the scanning direction during the step-and-scan scanning exposure is １ ／ of the moving speed of the reticle stage.

As shown in FIG. 1, off-axis type alignment systems 24a and 24b having the same function are provided on both sides of the projection optical system PL in the X-axis direction.
Are located at the same distance from the optical axis center of the projection optical system PL (coincident with the projection center of the reticle pattern image). These alignment systems 24a,
4b is an LSA (Laser Step Alignment) system, FIA
(Filed Image Alignment) system, LIA (Laser Interfe)
rometric Alignment) system and can measure the X and Y two-dimensional positions of the reference marks on the reference mark plates FM1 and FM2 and the alignment marks on the wafers W1 and W2. is there.

Information from each alignment sensor constituting these alignment systems 24a and 24b is A / D converted by an alignment control device 80, and a digitized waveform signal is subjected to arithmetic processing to detect a mark position.
The result is sent to the main controller 90, and the main controller 90 instructs the stage controller 38 to perform synchronous position correction at the time of exposure according to the result.

Further, in the exposure apparatus 10 of the present embodiment,
Although not shown in FIG. 1, exposure for observing a reticle mark (not shown) on the reticle R and marks on the reference mark plates FM1 and FM2 at the same time above the reticle R via the projection optical system PL. TTR using wavelength (Throug
h The Reticle) A pair of reticle alignment microscopes each including an alignment optical system are provided. The detection signals of these reticle alignment microscopes are supplied to main controller 90. A configuration equivalent to that of the reticle alignment microscope is disclosed in, for example, Japanese Patent Application Laid-Open No. 7-176468.

Next, the control system will be described with reference to FIG. This control system mainly includes a main controller 90 that controls the entire apparatus as a whole, and includes an exposure controller 70, a stage controller 38, and the like under the main controller 90. Here, the operation of the projection exposure apparatus 10 according to the present embodiment at the time of exposure will be described focusing on the operation of each of the above components of the control system.

Prior to the start of the synchronous scanning of the reticle R and the wafer (W1 or W2), the exposure controller 70 instructs the shutter driver 72 to drive the shutter driver 74 to drive the shutter 42. To open. Thereafter, in response to an instruction from the main controller 90, the stage controller 3
8, reticle R and wafer (W1 or W2), that is, reticle stage RST and wafer stage (WS1
Or WS2) synchronous scanning (scan control) is started. The synchronous scanning is performed by measuring the length measuring axis BI3Y and the length measuring axis BI1X or BI2X of the above-described interferometer system and measuring length axes BI7Y and BI8Y and the length measuring axis BI of the reticle interferometer system.
The monitoring is performed by controlling the reticle driving unit 30 and each linear motor constituting the driving system of the wafer stage by the stage controller 38 while monitoring the measurement value of 6X.

When both stages are controlled at a constant speed within a predetermined allowable error, the exposure control device 70
Instruct the laser control unit 76 to start pulse emission. Thus, the illumination light from the illumination system 3 illuminates the rectangular illumination area IA of the reticle R on which the pattern is chromium-deposited on the lower surface, and the image of the pattern in the illumination area is divided by the projection optical system PL into 1 /. A wafer (W1 or W1) which has been reduced by a factor of 4 and has its surface coated with photoresist.
2) Projection exposure on top. Here, as is clear from FIG. 2, the illumination area IA is compared with the pattern area on the reticle.
The width of the slit in the scanning direction is narrow, and by synchronously scanning the reticle R and the wafer (W1 or W2) as described above,
An image of the entire surface of the pattern is sequentially formed in a shot area on the wafer.

Next, the operation of the stage device 1 will be described. When the wafer stage WS1 moves in the X direction according to an instruction from the stage control device 38, the X motor XM
Are moved relative to the stators 84 in the X direction, so that the guide bar GB moves in the X direction together with the wafer stage WS1. Here, when the guide bar GB moves, the support plates 100 and 101 that integrally support the movers 82 also move, but operate smoothly due to the presence of the air bearing 102.

Further, for example, + X of wafer stage WS1
When moving in the direction, the stator block 83 moves in the opposite direction (−X direction) with respect to the holding members 85, 85 due to the reaction force generated by the movement of the wafer stage WS1.
Therefore, the law of conservation of momentum works, and the wafer stage W
The reaction force at the time of acceleration / deceleration in S1 is absorbed by the movement of the stator block 83, and the position of the center of gravity in the stage device 1 is substantially fixed in the X direction.

Note that the movers 82, 82 and the stators 84, 8
4, the mover side (wafer stage WS1, guide bar GB, movers 82, 82, support plate 1)
00, 101, etc.) and the stator side (stator block 83, stators 84, 84), unless the stator block 83 moves to a position based on the weight ratio, the law of conservation of momentum is not maintained, and the center of gravity of the stage device 1 is not maintained. The position will fluctuate. Therefore, in the present embodiment, when the stator block 83 moves due to the reaction force, the stator block 83
By driving the voice coil motor while monitoring the position of, the position of the stator block 83 is adjusted via the movers 130 and 103, and the position of the center of gravity of the stage device 1 is maintained.

Similarly, wafer stage WS1 moves in the Y direction by the mover of Y motor YM relatively moving in the Y direction with respect to stator 81 along guide bar GB.
When the wafer stage WS1 moves in, for example, the + Y direction, the guide bar GB moves in the opposite direction (−Y direction) with respect to the Y motor 87 due to the reaction force generated by the movement of the wafer stage WS1. Therefore, the law of conservation of momentum works, and the reaction force at the time of acceleration / deceleration of the wafer stage WS1 is absorbed by the movement of the guide bar GB, and the stage device 1
Is substantially fixed also in the Y direction.

By the coupling between the mover and the stator 81, the guide bar GB moves to a position based on the weight ratio between the mover side (such as the wafer stage WS1) and the stator side (such as the guide bar GB). For this purpose, the position of the guide bar GB is adjusted by driving the voice coil motor while monitoring the position of the guide bar GB, and the position of the center of gravity of the stage device 1 is maintained.

In the present embodiment, as described above,
When the wafer stage WS1 is moved by the driving of the Y motor YM and the X motor XM, the synchronous stage 115 follows and moves synchronously. That is, wafer stage WS1
Is moved in the X direction, the X motor 120 is driven by the instruction of the stage control device 38, so that the extension portion 11
The synchronous stage 115 along with the support frame 117 and the stator 113 moves in the X direction along the X guide 108 at the same speed as the wafer stage WS1.

Similarly, when moving wafer stage WS1 in the Y direction, synchronous motor 115 is driven by Y motor 121 in accordance with an instruction from stage controller 38, so that synchronous stage 115 moves along stator 113 and moves in the same manner as wafer stage WS1. Move in the Y direction at speed. Therefore, when wafer stage WS1 moves two-dimensionally along the XY plane, synchronous stage 115 can move synchronously while maintaining a constant distance from wafer stage WS1. Therefore, the wafer stage WS1 (wafer table TB1) and the synchronous stage 1
The Y-tube 129 stretched between the wafer stage WS1 and the wafer stage WS1 is routed together with the wafer stage WS1 without being subjected to tensile load or compressive load. At this time, the distance between the wafer stage WS1 and the synchronization stage 115 is monitored by a distance sensor to prevent interference between the stages WS1 and 115, and to prevent the distance from being too large and being pulled by the Y tube 129 beforehand. Can be.

Regarding the movement of synchronous stage 115, stage control device 38 starts synchronous stage 115 earlier with a slight time difference from wafer stage WS1. Thus, it is possible to prevent the tensile force and the drag of the Y tube 129 from being applied as in the case where the wafer stage WS1 is started first. It is conceivable to start the wafer stage WS1 and the synchronization stage 115 at the same time.
9 may act. Therefore, by starting the synchronous stage 115 first, the drag of the Y tube 129 is prevented from reaching the wafer stage WS1.

The vibration generated by the movement of the synchronous stage 115, for example, the reaction force due to the driving of the movable element 112 of the X motor 120 and the vibration caused by the deformation of the Y tube 128 due to the movement of the synchronous stage 115 in the Y direction. Is transmitted to the wafer stage WS1 via the Y tube 129 and the base plate 13 in a very small amount. This vibration is low-frequency vibration, and is generated by rubbing or hitting of the tube.
Because it is not a high frequency vibration that adversely affects the movement of S1,
It does not hinder stage movement control.

Subsequently, two wafer stages WS1, W
The parallel processing in S2 will be described. In the present embodiment, while exposing the wafer W2 on the wafer stage WS2 via the projection optical system PL, the wafer is exchanged on the wafer stage WS1, and the alignment operation and the autofocus are performed following the wafer exchange. / Auto leveling is performed. The position control of the wafer stage WS2 during the exposure operation is performed based on the measurement values of the measurement axes BI2X and BI3Y of the interferometer system, and the wafer stage WS2 on which the wafer exchange and the alignment operation are performed.
1 is controlled by the measurement axes BI1X, B1 of the interferometer system.
This is performed based on the measured value of I4Y.

While the above-mentioned wafer exchange and alignment operations are being performed on the wafer stage WS1 side, the wafer stage WS2 side uses two reticles R1 and R2 to continuously perform step and step changing exposure conditions. and·
Double exposure is performed by a scanning method. In the exposure sequence and the wafer exchange / alignment sequence performed in parallel on the two wafer stages WS1 and WS2, the previously completed wafer stage is in a waiting state, and when both operations are completed, the wafer stages WS1 and WS2 are completed. WS2
Is controlled to move. The wafer W2 on the wafer stage WS2 for which the exposure sequence has been completed is replaced at the loading position, and the wafer W1 on the wafer stage WS1 for which the alignment sequence has been completed.
, An exposure sequence is performed under the projection optical system PL.

As described above, while the wafer exchange and the alignment operation are performed on one wafer stage, the exposure operation is performed on the other wafer stage. When both operations are completed, the operations are switched. By doing so, it is possible to greatly improve the throughput.

In the stage device of the present embodiment, since synchronous stage 115 moves synchronously with movement of wafer stage WS1, no disturbance such as rubbing or hitting occurs on Y tube 129, and movement with respect to wafer stage WS1 does not occur. Control can be maintained with high accuracy. In the present embodiment, stator 111 driven when synchronous stage 115 moves is provided separately from stator 84 (stator block 83) driven when wafer stage WS1 moves. Therefore, it is possible to prevent micro-vibration (particularly, high-frequency vibration) accompanying the movement of the synchronization stage 115 from being transmitted to the wafer stage WS1 via the stator, and to control the movement of the wafer stage WS1 with high accuracy.

In particular, in the present embodiment, since the stator 111 is installed independently of the surface plate 12 in terms of vibration,
It is also possible to prevent the minute vibration accompanying the movement of the synchronization stage 115 from being transmitted to the surface plate 12 and hindering the movement control of the wafer stage WS1. Therefore, in the exposure apparatus of the present embodiment, the reticle R and the wafer W are synchronously moved and the reticle R
When exposing the pattern on the wafer W, the position control and the movement control of the wafer stages WS1 and WS2 can be performed with high accuracy, and the pattern can be formed on the wafer with high accuracy.

In the stage apparatus and the exposure apparatus of the present embodiment, synchronous stage 115 is
Since the wafer stage WS1 is started with a time lag, it is possible to prevent the tensile force or the drag of the Y tube 129 from being applied as a disturbance when the wafer stage WS1 is started. Further, as in the present embodiment, a plurality of wafer stages WS1, W2
When S2 is provided, for example, the guide bar GB may be slightly vibrated by the movement of the wafer stage WS1, and the fine vibration may be transmitted to the wafer stage. However, as described above, in the present embodiment, a helium bearing using helium having a high kinematic viscosity is employed as a non-contact bearing (gas bearing). For this reason, the guide bar G
Since the damping property is high even when B is vibrated, the wafer stage WS2 is not adversely affected by the vibration of the guide bar GB.

In the present embodiment, since the synchronous stage 115 is synchronously moved in two dimensions on the XY plane with respect to the wafer stage WS1, the synchronous stage 115 moves the wafer as in the case of the step-and-scan method or the step-and-repeat method. It is possible to cope with a case where the stage WS1 moves two-dimensionally, and it is possible to enhance versatility. Further, when a plurality of wafer stages are provided as in the double stage system, a synchronous stage is provided for each stage, thereby preventing any stage from being affected by disturbance due to deformation of the Y tube 129 or the like. (Reduction), and the versatility can be further improved. Moreover, in the present embodiment, a plurality (two) of the synchronization stages 115 are
The use of the stator 111 contributes to downsizing and cost reduction of the apparatus.

Further, in this embodiment, since the distance between wafer stage WS1 and synchronization stage 115 is monitored by the distance sensor, both stages WS1, 115 are monitored.
It is also possible to prevent the mutual interference or the excessive separation from applying the tensile force of the Y tube 129 beforehand.

In the above embodiment, an example of a double stage type provided with two wafer stages is used. However, the present invention is not limited to this, and one or three or more wafer stages are provided. Configuration may be used. In the above-described embodiment, the synchronous stage 115 (the synchronous stage devices DS1, DS2) is provided only in the stage device 1 (the wafer stages WS1, WS2). However, the present invention is not limited to this, and the stage device 2 (the reticle stage) is not limited to this. RST) may be provided with a synchronization stage having the same configuration as the stage device 1.

In the above embodiment, the stage apparatus of the present invention is applied to the wafer stage of the projection exposure apparatus 10. However, in addition to the projection exposure apparatus 10, a transfer mask drawing apparatus and position coordinates of a mask pattern are used. It is also applicable to precision measuring devices such as measuring devices.

The substrate of the present embodiment is used not only for semiconductor wafers W1 and W2 for semiconductor devices, but also for glass substrates for liquid crystal display devices, ceramic wafers for thin film magnetic heads, and exposure apparatuses. An original mask (reticle, synthetic quartz, silicon wafer) or the like is applied.

As the projection exposure apparatus 10, a step-and-scan type scanning exposure apparatus (scanning stepper; US Pat. No. 5,473,410) for scanning and exposing the pattern of the reticle R by synchronously moving the reticle R and the wafer W is used. In addition, the present invention can be applied to a step-and-repeat type projection exposure apparatus (stepper) that exposes the pattern of the reticle R while the reticle R and the wafer W are stationary and sequentially moves the wafer W stepwise.

The type of the projection exposure apparatus 10 is not limited to an exposure apparatus for manufacturing a semiconductor device for exposing a semiconductor device pattern onto a wafer W, but may be an exposure apparatus for manufacturing a liquid crystal display element, a thin film magnetic head, an image pickup device (CCD). ) Or an exposure apparatus for manufacturing a reticle.

The magnification of the projection optical system PL may be not only a reduction system but also an equal magnification system or an enlargement system. Further, As the projection optical system PL, using a material which transmits far ultraviolet rays such as quartz and fluorite as the glass material when using a far ultraviolet ray such as an excimer laser, catadioptric system, or in the case of using the F ₂ laser or X-ray An optical system of a refraction system (a reticle R of a reflection type is also used). When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It is needless to say that the optical path through which the electron beam passes is in a vacuum state.

A linear motor (USP 5,623,853 or USP) is mounted on wafer stages WS1, WS2 and reticle stage RST.
P5, 528, 118), any of an air levitation type using an air bearing and a magnetic levitation type using Lorentz force or reactance force may be used. Also,
Each of the stages WS1, WS2, and RST may be of a type that moves along a guide, or may be a guideless type without a guide. In addition, the synchronous stage device DS
1, the DS2 also has a configuration in which the synchronization stage 115 moves in the X direction with the X guides 108 and 108 as guides, but this is not always necessary and a configuration without a guide may be employed.

As a driving mechanism of each of the stages WS1, WS2, and RST, a magnet unit (permanent magnet) having a two-dimensionally arranged magnet is opposed to an armature unit having a two-dimensionally arranged coil. WS1, WS
2. A planar motor for driving the RST may be used. In this case, one of the magnet unit and the armature unit is connected to stages WS1, WS2, and RST, and the other of the magnet unit and the armature unit is connected to stages WS1, WS2.
2. It may be provided on the moving surface side (base) of the RST.

As described in JP-A-8-166475 (US Pat. No. 5,528,118), the reaction force generated by the movement of wafer stages WS1 and WS2 is not transmitted to projection optical system PL. It may be used to mechanically escape to the floor (ground). The present invention is also applicable to an exposure apparatus having such a structure. As described in JP-A-8-330224 (US Pat. No. 6,020,710), a reaction force generated by the movement of the reticle stage RST is not transmitted to the projection optical system PL. You may escape to the floor (earth).
The present invention is also applicable to an exposure apparatus having such a structure.

As described above, the projection exposure apparatus 10 according to the embodiment of the present invention can perform various mechanical sub-systems including each component listed in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to keep Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electric systems to ensure these various accuracy Are adjusted to achieve electrical accuracy. The process of assembling the various subsystems into the exposure apparatus includes mechanical connection, wiring connection of an electric circuit, and piping connection of a pneumatic circuit between the various subsystems. It goes without saying that there is an assembling process for each subsystem before the assembling process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured.
It is desirable that the exposure apparatus be manufactured in a clean room in which the temperature, cleanliness, and the like are controlled.

Micro devices such as semiconductor devices are:
As shown in FIG. 7, a step 201 for designing the function and performance of a micro device, a step 202 for manufacturing a mask (reticle) based on the design step, a step 203 for manufacturing a wafer from a silicon material, and a step 203 of the above-described embodiment. An exposure processing step 204 of exposing a reticle pattern to a wafer by the projection exposure apparatus 10, and a device assembling step (a dicing step, a bonding step,
(Including a package process) 205, an inspection step 206, and the like.

[0096]

As described above, in the stage apparatus according to the first aspect, the power supply stage for relaying the power supply member is provided along the second stator provided separately from the first stator. It is configured to move synchronously with the main body. Accordingly, in this stage device, disturbance such as rubbing and hitting does not occur on the utility supply member, and a minute vibration (particularly, high frequency vibration) accompanying the movement of the utility supply stage is transmitted to the stage body via the stator. Therefore, the effect that the movement control with respect to the stage body can be maintained with high accuracy can be obtained.

The stage device according to claim 2 is configured such that the second stator is installed independently of the surface plate in vibration. Thus, in this stage device, it is possible to obtain an effect that it is possible to prevent a minute vibration accompanying the movement of the utility supply stage from being transmitted to the surface plate and hindering the movement control of the stage body.

The stage device according to claim 3 is configured such that the stage body and the utility supply stage move two-dimensionally. As a result, this stage device can cope with a case where the stage body moves two-dimensionally, as in the case of the step-and-scan method or the step-and-repeat method, and has the effect of increasing versatility.

The stage device according to the fourth aspect is configured such that a plurality of utility supply stages are provided corresponding to each of the plurality of stage bodies. Thus, in this stage device, it is possible to prevent (reduce) the disturbance due to the deformation of the utility supply member from acting on any of the stages, and it is possible to increase the versatility.

The stage device according to claim 5 is configured such that a plurality of utility supply stages move along the same second stator. As a result, in this stage device,
This has the effect of contributing to downsizing and cost reduction of the device.

The stage device according to claim 6 is configured such that the control device starts the utility supply stage with a time difference with respect to the stage body. Thus, in this stage device, an effect is obtained in which the pulling force or the drag of the utility supply member can be prevented from being applied as a disturbance when the stage body is started.

The stage device according to claim 7 is configured such that the detecting device detects the distance between the stage body and the utility supply stage. Thereby, in this stage device, an effect is obtained that both stages can be prevented from interfering with each other or from being applied with a tensile force due to excessive separation.

The exposure apparatus according to claim 8 has a configuration in which the stage device according to any one of claims 1 to 7 is used as at least one of a mask stage and a substrate stage. Accordingly, in this exposure apparatus, the position control and the movement control of the mask or the substrate can be performed with high precision, and the effect that the pattern can be formed on the substrate with high precision can be obtained.

Since the stage device according to the ninth aspect has the supply device for supplying helium to the gas bearing and the chamber, the helium atmosphere in the chamber can be maintained with a simple configuration.

In the stage device according to the tenth aspect, since helium is supplied to the gas bearing, the vibration of one stage main body does not adversely affect the other stage main body.

According to the exposure apparatus of the eleventh aspect, the helium atmosphere in the chamber can be maintained with a simple configuration, and the helium is supplied to the gas bearing so that the vibration of the stage body does not adversely affect the exposure. . Therefore, a highly accurate exposure apparatus can be realized.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of the present invention, and is a schematic configuration diagram of a projection exposure apparatus.

FIG. 2 is an external perspective view showing a positional relationship between two wafer stages, a reticle stage, a projection optical system, and an alignment system.

FIG. 3 is an external perspective view of a stage device provided with a wafer stage and a synchronization stage.

FIG. 4 is a cross-sectional view of a linear motor part that drives a wafer stage in an X direction.

FIG. 5 is a front view in which a stator block is held by a holding member.

FIG. 6 is a view showing an embodiment of the present invention, and is an external perspective view of a synchronous stage device.

FIG. 7 is a flowchart illustrating an example of a semiconductor device manufacturing process.

FIG. 8 is an external perspective view illustrating an example of a conventional stage device.

FIG. 9 is a schematic front view showing a relationship between movement of a stage main body and a utility supply member.

[Explanation of symbols]

R Reticle (mask) RST Reticle stage (mask stage) WS1, WS2 Wafer stage (stage main body) W, W1, W2 Wafer (substrate) 1 Stage device (substrate stage) 2 Stage device (mask stage) 4 Chamber 10 Projection exposure apparatus (Exposure device) 12 Surface plate 38 Stage control device (control device) 83 Stator block (first stator) 86, 88, 102 Helium bearing (gas bearing) 111 Stator (second stator) 115 Synchronous stage (power) Supply stage) 129 Utility supply member (Y tube) 150 Chamber control device (Supply device)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F078 CA02 CA08 CB05 CB12 CB15 CC11 5F031 CA02 CA05 HA12 HA13 HA38 HA53 HA55 HA57 JA02 JA06 JA09 JA14 JA17 JA28 JA29 JA30 JA32 JA38 KA06 KA07 KA08 LA03 LA08 LA10 LA18 MA27 NA04 5F046 A BA05 CC01 CC18

Claims (11)

[Claims] 1. A stage device having a stage main body connected to a power supply member for supplying a power and moving on a surface plate along a first stator, wherein the stage device is installed separately from the first stator. A stage apparatus comprising: a second stator; and a power supply stage that relays the power supply member and moves synchronously with the stage body along the second stator. 2. The stage device according to claim 1, wherein the second stator is installed independently of the surface plate in vibration. 3. The stage device according to claim 1, wherein the stage main body and the utility supply stage move two-dimensionally. 4. The stage device according to claim 1, wherein a plurality of the stage main bodies are provided so as to be movable independently of each other, and the utility supply stage corresponds to each of the plurality of stage main bodies. A stage device, wherein a plurality of stage devices are provided. 5. The stage device according to claim 4, wherein the plurality of utility supply stages move along the same second stator. 6. The stage device according to claim 1, further comprising a control device that starts the utility supply stage with a time difference with respect to the stage main body. 7. The stage device according to claim 1, further comprising a detection device that detects a distance between the stage main body and the utility supply stage. 8. An exposure apparatus for exposing a pattern of a mask held on a mask stage to a substrate held on a substrate stage, wherein at least one of the mask stage and the substrate stage is used. An exposure apparatus using any one of the stage devices described above. 9. A stage device for moving a stage main body along a moving surface, wherein a gas bearing is provided between the moving surface and the stage main body so as to face the moving surface and the stage main body in a non-contact manner, A stage device comprising: a chamber that hermetically surrounds the stage device; and a supply device that supplies helium to the gas bearing and the chamber. 10. The stage device according to claim 9, wherein the stage device has a plurality of stage bodies. 11. An exposure apparatus, comprising: a mask stage for moving a mask; and a substrate stage for moving a substrate, wherein at least one of the mask stage and the substrate stage includes: An exposure apparatus using the stage device according to claim 9.