JP2001308148A - Apparatus and method for alignment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out a correct alignment of upper and lower cameras of an upper and lower simultaneous observation camera by calculating a quantity of relative deviation between the upper and lower cameras. SOLUTION: (1) A calibration camera is installed on the same supporter as setting a tool. (2) A target mark is installed below the calibration camera. (3) The upper and lower simultaneous observation camera is installed below a movable target mark. (4) A target mark is installed on a table below the upper and lower simultaneous observation camera. (5) The movable target mark and the target mark on the table are recognized by the calibration camera. (6) The movable target mark is recognized by the upper camera of the upper and lower simultaneous observation camera. (7) The target mark on the table is recognized by the lower camera of the upper and lower simultaneous observation camera. (8) A quantity of relative deviation between the upper and lower cameras is calculated to align the upper and lower cameras with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alignment device and an alignment method for an electronic component and a substrate in an apparatus for mounting an electronic component such as a semiconductor chip or a solder ball on a substrate or the like. The present invention has a special feature in a calibration mechanism and a calibration method for aligning an electronic component, a substrate, and the like, which are employed for maintaining mounting accuracy in a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art Conventionally, a positioning method using, for example, a flip chip bonding apparatus is based on reading a wiring pattern or a recognition mark of a substrate with a first observation camera, and reading a wiring pattern or a recognition mark on a separate second camera.
Read the wiring pattern and the recognition mark of the semiconductor chip with the observation camera, perform image processing, and move and align the semiconductor chip and the substrate based on the calculation result.

However, in this method, the relative positional relationship of the observation camera changes due to temperature changes such as thermal expansion of the mounting member for the observation camera, thermal expansion of the ball screw used as the moving means, and other conditions, and the accurate position is changed. It was not possible to perform the alignment, and it was necessary to detect and correct the positional relationship between elements such as an observation camera necessary for the alignment.

Further, there is a method in which the first and second cameras for alignment are performed by a simultaneous observation camera in response to a demand for improvement in productivity of the electronic component mounting apparatus. There was a problem with the calibration method.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a positioning device for an electronic component mounting apparatus, which employs a simultaneous upper and lower observation camera to improve productivity, and also provides an upper observation section and a lower side of the upper and lower simultaneous observation camera. It is an object of the present invention to provide a positioning apparatus and a positioning method that can calculate a relative displacement amount of an observation unit and perform accurate corrected positioning at high speed.

[0006]

The present invention employs the following means to solve the above-mentioned problems. First, a device for mounting electronic components on a substrate or the like is installed such that a tool for holding the electronic components and a table for mounting the substrate or the like are relatively movable.
It shall be mounted after mutual alignment.

[0007] Second, a calibration camera supported on the same support as the tool is provided. Third, a target mark is provided below the calibration camera and is movable relative to the calibration camera. Fourth, a simultaneous upper and lower observation camera is provided below the movable target mark and is movable relative to the movable target mark. Fifth, a target mark formed on a table below the upper and lower simultaneous observation camera is provided.

Sixth, a target mark movable on the calibration camera and a target mark on the table are recognized. Seventh, the movable target mark is recognized by the upper observation unit of the upper and lower simultaneous observation camera. 8th
Next, the target mark on the table is recognized by the lower observation unit of the upper and lower simultaneous observation camera. Ninth, the relative position deviation between the upper observation unit and the lower observation unit of the upper and lower simultaneous observation camera is calculated based on each recognition result, and alignment is performed.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing an embodiment of a bonding apparatus to which the present invention is applied, and FIG. 2 is an explanatory view of a main part showing the movement of a positioning apparatus.

The bonding apparatus includes a bonding section located at an upper part of FIG. 1, a bonding stage located at a lower part of FIG. 1, a moving target 3 located at a lower part of the bonding part, and a left part of FIG. It has a simultaneous upper and lower observation camera 4.

[0011] The bonding portion is a bonding tool 1
1, a calibration camera 2, and a Z-axis driving device 1 for moving both in the Z-axis direction (vertical direction). The bonding tool 11 corresponds to a tool for holding electronic components. In this embodiment, the bonding tool 11 is a member that sucks a semiconductor chip, moves the semiconductor chip, and bonds the semiconductor chip to a substrate.

The bonding tool 11 and the calibration camera 2 are both fixed to the same support 12 while maintaining their Z-axis (vertical axis) in parallel. The movement of the camera 2 is synchronized.

The Z-axis driving device 1 includes a bonding tool 1
The main purpose is to move the first in the Z-axis direction.

The bonding stage includes an XY stage 7 serving as a table on which a substrate is
The axial direction (substantially the front-back direction in FIG. 1) and the X-axis direction (in FIG. 1,
It has a Y-axis driving device 72 and an X-axis driving device 73 that move in the (horizontal direction). A motor is used as a drive source for both drive units 72 and 73.

The XY stage 7 has a target mark 71
Is provided. Therefore, the movement of the XY stage 7 and the movement of the target mark 71 are synchronized. In addition, as the target mark 71 in the embodiment, a cross figure as shown in FIG. 2 is used as a simple example.

In the present invention, it is sufficient that the tool (the bonding tool 11 in the present embodiment) and the table (the XY stage 7 in the present embodiment) can be relatively moved. Reference numeral 11 denotes movement only in the Z-axis (vertical direction), and the XY stage 7 moves only in the X-axis and Y-axis plane directions.

The moving target 3 has a target mark 3 on a display plate attached to the tip of the rod 33 of the approach mechanism 32.
1 is provided. The target mark 31 of the moving target 3 is provided at the same position on the front and back surfaces. If the display portion of the target mark 31 is transparent, it is not necessary to provide the target mark 31 on the front and back, and only one of them is sufficient. The same cross figure as the target mark 71 of the XY stage 7 is used. Note that an air cylinder is used for the entry mechanism 32.

The moving target 3 has a bonding portion and X
Between the Y-stages 7, it is installed below the calibration camera 2 so as to be able to move forward and backward. According to the embodiment, the movement relationship between the calibration camera 2 and the target mark 31 of the moving target 3 is determined according to the embodiment.
Is the Z-axis movement, and the target mark 31 is the Y-axis movement (movement in the front-back direction). Of course, the target mark 31
May be X-axis movement (lateral movement).

The upper / lower simultaneous observation camera 4 is provided with an upper camera 5 serving as an upper observation section on the upper surface of a body attached to the tip of the rod 43 of the approach mechanism 42, and a lower camera 6 serving as a lower observation section on the lower surface. is there. In addition, upper and lower simultaneous observation camera 4
For example, a camera using two mirrors and leading two cameras to one camera, or a camera having two CCD cameras arranged with their back surfaces facing each other can be considered.

The upper / lower simultaneous observation camera 4 is installed at a position below the target mark 31 of the moving target 3 and is movable in the X-axis direction by an approach mechanism 42. The approach mechanism 42 uses a motor as a drive source in the embodiment. still,
The approach direction is not limited to the X-axis direction.

In the present invention, the upper and lower simultaneous observation camera 4, the calibration camera 2, the target mark 31 of the moving target 3, the target mark 71 on the XY stage 7
The upper camera 5 and the lower camera 6 of the upper and lower simultaneous observation camera 4 are calibrated by using. Hereinafter, the calibration method will be described with reference to FIGS.

First, the operation of the Y-axis driving device 72 and the X-axis driving device 73 causes the XY stage 7 to start moving to the calibration position. The calibration position refers to a position indicated by a vertical dashed line in FIGS. 3 to 5, and specifically refers to a position determined by the target mark 31 of the moving target 3. This movement is originally an operation in the second process, but it takes time for the XY stage 7 to move to the calibration position, so the movement is started before the first process.

The first step is a step of checking the amount of deviation of the Z axis. Calibration camera 2 by Z axis drive mechanism 1
Moves to the observation height of the target mark 31 of the moving target 3. On the other hand, the target mark 31 at the retreat position moves to the calibration position. FIG. 3 is a schematic perspective view showing the state.

Thereafter, the calibration camera 2 captures an image of the target mark 31 and confirms a displacement x1 (displacement in the X-axis direction) and y1 (displacement in the Y-axis direction) with respect to the Z-axis target mark 31. The Z-axis shift amount means the shift amount of the calibration camera 2 from the viewpoint of confirmation, but at the same time, the bonding tool 1
It is also a shift amount of 1. After the confirmation work, the target mark 31 moves to the retreat position.

The second step is a step of confirming the amount of displacement of the XY stage 7. The deviation of the XY stage 7 is confirmed by the calibration camera 2 and the target mark 71 on the XY stage 7.

First, after the XY stage 7 that has started moving reaches the calibration position, the calibration camera 2 moves to the observation height of the target mark 71 on the XY stage 7. FIG. 4 is a schematic perspective view showing this state. Then, the calibration camera 2 captures an image of the target mark 71 on the XY stage 7, and the displacement amount x2 of the calibration camera 2 with respect to the target mark 71 on the XY stage 7 (the displacement amount in the X-axis direction). And y2 (the amount of deviation in the Y-axis direction) are confirmed. This is the shift amount of the XY stage 7. The shift amounts x2 and y2 are determined in consideration of the Z-axis shift amount x1 (the shift amount in the X-axis direction) and y1 (the shift amount in the Y-axis direction) in the first process. Become.

The third step is a step of confirming the amount of displacement of the upper camera 5 in the upper and lower simultaneous observation camera 4. The amount of deviation between the upper camera 5 and the target mark 31 of the moving target 3 is confirmed. First, the target mark 31 moves to the calibration position. At the same time, the upper and lower simultaneous observation camera 4 moves to the observation position. FIG. 5 is a schematic perspective view showing this state. Here, the upper camera 5 captures the image on the lower surface side of the target mark 31, and confirms the displacement amount x3 (the displacement amount in the X-axis direction) and the displacement amount y3 (the displacement amount in the Y-axis direction) of the upper camera 5 with respect to the target mark 31.

The fourth step is a step of checking the amount of displacement of the lower camera 6 of the upper and lower simultaneous observation camera 4. The amount of displacement between the lower camera 6 and the target mark 71 on the XY stage 7 is confirmed. That is, the lower camera 6 captures the image of the target mark 71 on the XY stage 7 at the same position as in the third step, and the lower camera 6 is displaced x4 from the target mark 71 on the XY stage 7 (displacement in the X-axis direction). And y4 (the amount of displacement in the Y-axis direction) are checked.

Thereafter, the target mark 31 moves to the retreat position, and the upper and lower simultaneous observation camera 4 also moves to the retreat position.

As a result of confirming the above-mentioned deviation amount, x1 to x4 (X
The relative displacement between the upper camera 5 and the lower camera 6 can be calculated based on the target mark 31 based on the displacement in the axial direction) and y1 to y4 (the displacement in the Y-axis direction). Thus, the alignment between the semiconductor chip and the substrate can be corrected based on the deviation amount.

[0031]

Since the present invention is configured as described above, in a positioning device for an electronic component mounting apparatus, the productivity can be improved by employing a simultaneous upper and lower observation camera, and the position of the upper and lower simultaneous observation camera can be improved. Since the amount of relative displacement between the upper observation unit and the lower observation unit can be calculated and corrected, an alignment apparatus and an alignment method capable of performing accurate alignment at high speed are provided.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a bonding apparatus to which the present invention is applied.

FIG. 2 is an explanatory view of a main part showing the movement of a positioning device.

FIG. 3 is a schematic perspective view showing a state in which a shift amount of the Z axis is confirmed.

FIG. 4 is a schematic perspective view showing a time when a shift amount of the XY stage is confirmed.

FIG. 5 is a schematic perspective view showing a state in which the amount of displacement of the upper and lower simultaneous observation camera is confirmed.

[Explanation of symbols]

 1. . . . . . . . 1. Z-axis drive device . . . . . . . Calibration camera 3. . . . . . . . Moving target . . . . . . . 4. Simultaneous top and bottom observation camera . . . . . . . Upper camera 6. . . . . . . . Lower camera 7. . . . . . . . XY stage 11. . . . . . . Bonding tool 12. . . . . . . Supports 31, 71. . . . Target mark 32, 42. . . . Approach mechanism 33, 43. . . . Rod 72. . . . . . . Y-axis driving device 73. . . . . . . X-axis drive

Claims (2)

[Claims] An apparatus for mounting an electronic component on a substrate or the like by positioning a tool for holding an electronic component and a table on which a substrate or the like is mounted so as to be able to move relative to each other. A calibration camera supported by the support, a target mark installed below the calibration camera and movable relative to the calibration camera, and a movable target mark installed below the movable target mark And the upper and lower simultaneous observation camera which is relatively movable, and the target mark formed on the table below the upper and lower simultaneous observation camera are provided, and the target mark movable by the calibration camera and the target mark on the table are provided. Recognizes and moves the target mark that can be moved by the upper observation part of the upper and lower simultaneous observation camera. And recognizes the target mark on the table by the lower observation part of the upper and lower simultaneous observation camera, and calculates the relative position shift between the upper observation part and the lower observation part of the upper and lower simultaneous observation camera based on each recognition result. And a positioning device. 2. An apparatus for mounting an electronic component on a substrate or the like by positioning a tool for holding an electronic component and a table on which a substrate or the like is mounted so as to be movable relative to each other, and mounting the electronic component on the substrate or the like. A calibration camera supported by a support and a target mark movable relative to the calibration camera below the calibration camera are provided, and the displacement of the calibration camera in the XY direction is determined by the calibration camera and the target mark. Check and set the target mark movable below the movable target mark, the upper and lower simultaneous observation camera that can move relatively, and the target mark on the table below the upper and lower simultaneous observation camera. Check the table deviation with the target mark of Check the displacement of the upper observation part of the upper and lower simultaneous observation camera with the camera and the movable target mark, and check the deviation of the lower observation part of the upper and lower simultaneous observation camera with the upper and lower simultaneous observation camera and the target mark on the table. Based on the result of each shift amount confirmation, calculate the relative shift amount of the upper observation unit and the lower observation unit of the upper and lower simultaneous observation camera,
A positioning method characterized by performing positioning.