JP2001234029A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JP2001234029A JP2001234029A JP2000047439A JP2000047439A JP2001234029A JP 2001234029 A JP2001234029 A JP 2001234029A JP 2000047439 A JP2000047439 A JP 2000047439A JP 2000047439 A JP2000047439 A JP 2000047439A JP 2001234029 A JP2001234029 A JP 2001234029A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- compound
- thermosetting resin
- component
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 42
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 47
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000004312 hexamethylene tetramine Substances 0.000 claims abstract description 17
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims abstract description 17
- 239000005011 phenolic resin Substances 0.000 claims abstract description 15
- WTAVYBAEMMFITK-UHFFFAOYSA-N 3,4-dihydro-2h-1,3-benzoxazine Chemical group C1=CC=C2OCNCC2=C1 WTAVYBAEMMFITK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 43
- 239000000203 mixture Substances 0.000 claims description 42
- 229920003986 novolac Polymers 0.000 claims description 38
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 20
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 150000003141 primary amines Chemical class 0.000 claims description 14
- -1 hydroxyphenylene groups Chemical group 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 150000004982 aromatic amines Chemical class 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- QRAOZQGIUIDZQZ-UHFFFAOYSA-N 4-methyl-7-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)-2,3-dihydro-1,4-benzoxazine Chemical compound C=1C=C2N(C)CCOC2=CC=1B1OC(C)(C)C(C)(C)O1 QRAOZQGIUIDZQZ-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- 235000019256 formaldehyde Nutrition 0.000 claims 3
- 238000013329 compounding Methods 0.000 abstract description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 238000001723 curing Methods 0.000 description 19
- 239000000047 product Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 238000009472 formulation Methods 0.000 description 11
- 238000003786 synthesis reaction Methods 0.000 description 11
- 238000003756 stirring Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 6
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 6
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 150000005130 benzoxazines Chemical group 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000004992 toluidines Chemical class 0.000 description 2
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- MOEFFSWKSMRFRQ-UHFFFAOYSA-N 2-ethoxyphenol Chemical compound CCOC1=CC=CC=C1O MOEFFSWKSMRFRQ-UHFFFAOYSA-N 0.000 description 1
- CGACGSHTSCXSSO-UHFFFAOYSA-N 2h-1,3-benzoxazine Chemical group C1=CC=C2C=NCOC2=C1 CGACGSHTSCXSSO-UHFFFAOYSA-N 0.000 description 1
- BGDOLELXXPTPFX-UHFFFAOYSA-N 3,4-dihydro-2h-1,2-benzoxazine Chemical group C1=CC=C2ONCCC2=C1 BGDOLELXXPTPFX-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 101100325793 Arabidopsis thaliana BCA2 gene Proteins 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 102100033040 Carbonic anhydrase 12 Human genes 0.000 description 1
- 102100033041 Carbonic anhydrase 13 Human genes 0.000 description 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 1
- 101000867855 Homo sapiens Carbonic anhydrase 12 Proteins 0.000 description 1
- 101000867860 Homo sapiens Carbonic anhydrase 13 Proteins 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical compound COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、速硬化性に極めて
優れ、成形材料用途に有用な熱硬化性樹脂組成物に関す
る。TECHNICAL FIELD The present invention relates to a thermosetting resin composition which is extremely excellent in quick-curing property and is useful for molding materials.
【0002】[0002]
【従来の技術】フェノール樹脂成形材料は、耐熱性、耐
久性、電気及び機械的性能に優れることから、自動車部
品、電子・電機部品、あるいは厨房部品などに幅広く利
用されている。これらの成形材料を成形する際の成形時
間は、生産コストに大きな影響を及ぼす。すなわち硬化
時間を従来品と比較し短縮できれば、成形工程のハイサ
イクル化が達成され、また作業性を向上させることで、
更に生産性を高めることが可能である。2. Description of the Related Art Phenolic resin molding materials are widely used in automobile parts, electronic and electric parts, kitchen parts, etc. because of their excellent heat resistance, durability, electric and mechanical performance. The molding time for molding these molding materials has a significant effect on production costs. In other words, if the curing time can be shortened compared to conventional products, a high cycle of the molding process is achieved, and by improving workability,
Further, the productivity can be increased.
【0003】これまでにフェノールノボラック樹脂成形
材料の硬化時間を短縮するために、フェノールノボラッ
ク樹脂とヘキサメチレンテトラミンからなる樹脂組成物
の様々な改良がなされてきた。たとえば、フタル酸、安
息香酸、及びサリチル酸等の各種カルボン酸、パラトル
エンスルホン酸、及びベンゼンスルホン酸等の各種スル
ホン酸等の酸性物質を樹脂組成物に混合する方法、前述
の酸性物質と塩基性物質の複合塩を樹脂組成物に混合す
る方法、又は通常のランダムノボラックの代わりにハイ
オルトノボラックを使用する、もしくは併用する方法が
挙げられる。これらの方法を用いることにより、ある程
度の硬化時間の短縮が達成されるが、硬化物の強度が低
下する、加熱時に前記酸性物質より発生するガスが放出
されることにより、金型の汚染や作業環境に影響を及ぼ
す等の欠点があった。[0003] In order to shorten the curing time of a phenol novolak resin molding material, various improvements of a resin composition comprising a phenol novolak resin and hexamethylenetetramine have been made. For example, phthalic acid, benzoic acid, and various carboxylic acids such as salicylic acid, p-toluenesulfonic acid, and a method of mixing acidic substances such as various sulfonic acids such as benzenesulfonic acid in the resin composition, the above-mentioned acidic substance and basic Examples include a method of mixing a complex salt of a substance with a resin composition, and a method of using a high ortho novolak in place of a normal random novolak, or a method of using a combination thereof. By using these methods, the curing time can be shortened to some extent, but the strength of the cured product is reduced, and the gas generated from the acidic substance is released at the time of heating, thereby contaminating the mold and working. There are disadvantages such as affecting the environment.
【0004】一方、3,4−ジヒドロ−2H−1,3−
ベンゾオキサジン構造を有する化合物は、フェノール化
合物と開環反応によって結合することが知られており
(J.Am.Chem.Soc.,3423(1965))、硬化時間短縮を目的
とした添加剤と異なり、加熱硬化時にガスが放出されな
いことが知られている。On the other hand, 3,4-dihydro-2H-1,3-
Compounds having a benzoxazine structure are known to bind to phenolic compounds by a ring-opening reaction (J. Am. Chem. Soc., 3423 (1965)), unlike additives intended to shorten the curing time. It is known that no gas is released during heat curing.
【0005】また、特開平9−272786号公報にお
いて、ジヒドロベンゾオキサジン環を有する熱硬化性樹
脂とノボラック型フェノール樹脂からなる熱硬化樹脂性
組成物が開示されており、ヘキサメチレンテトラミンを
少量添加する事で、この組成物が迅速に硬化することが
示されているが、その硬化特性は、満足できるものでは
なかった。Japanese Patent Application Laid-Open No. Hei 9-272786 discloses a thermosetting resin composition comprising a thermosetting resin having a dihydrobenzoxazine ring and a novolak-type phenol resin, in which a small amount of hexamethylenetetramine is added. This shows that the composition cures quickly, but its cure properties were not satisfactory.
【0006】[0006]
【発明が解決しようとする課題】本発明は、従来の速硬
化技術の欠点を解決すべく鋭意検討されたもので、強度
等の硬化物特性を低下させることなく、成形時の硬化時
間を短縮できる熱硬化性樹脂組成物を提供することを目
的とする。DISCLOSURE OF THE INVENTION The present invention has been intensively studied in order to solve the drawbacks of the conventional rapid curing technology, and shortens the curing time during molding without deteriorating the properties of the cured product such as strength. It is an object of the present invention to provide a thermosetting resin composition that can be used.
【0007】[0007]
【課題を解決するための手段】本発明者は、ノボラック
型フェノール樹脂と分子内に3,4−ジヒドロ−2H−
1,3−ベンゾオキサジン構造を有する化合物及びヘキ
サメチレンテトラミンを必須成分とすることによって、
強度等の硬化物物性を損なわずに、硬化時間を短縮する
ことを可能とした熱硬化性樹脂組成物を見出し、本発明
を完成するに至った。Means for Solving the Problems The present inventors have developed a novolak type phenol resin and 3,4-dihydro-2H-
By using a compound having a 1,3-benzoxazine structure and hexamethylenetetramine as essential components,
The present inventors have found a thermosetting resin composition capable of shortening the curing time without impairing the physical properties of the cured product such as strength, and have completed the present invention.
【0008】すなわち、本発明は、 (1) ノボラック型フェノール樹脂(A)、分子内に
3,4−ジヒドロ−2H−1,3−ベンゾオキサジン構
造を有する化合物(B)及びヘキサメチレンテトラミン
(C)を必須成分とし、且つ、前記成分(A)と成分
(B)の合計量に占める成分(A)の割合が80重量%
以上99.5重量%以下、成分(B)の割合が0.5重
量%以上20重量%以下であり、且つ成分(A)と成分
(B)の合計量100g中に含まれる3,4−ジヒドロ
−2H−1,3−ベンゾオキサジン環の数が0.005
個以上0.09個以下になる範囲で配合され、成分
(C)の配合量が成分(A)と成分(B)の合計量10
0重量部に対して7重量部以上25重量部以下で配合さ
れることを特徴とする熱硬化性樹脂組成物、That is, the present invention relates to (1) a novolak-type phenol resin (A), a compound (B) having a 3,4-dihydro-2H-1,3-benzoxazine structure in a molecule, and a hexamethylenetetramine (C) ) As an essential component, and the ratio of the component (A) to the total amount of the component (A) and the component (B) is 80% by weight.
Not less than 99.5% by weight, the proportion of component (B) is not less than 0.5% by weight and not more than 20% by weight, and the amount of 3,4-containing in the total amount of 100 g of component (A) and component (B) 0.005 of dihydro-2H-1,3-benzoxazine rings
The component (C) is added in an amount of not less than 0.09 and not more than 0.09, and the total amount of the component (A) and the component (B) is 10
A thermosetting resin composition characterized by being mixed in an amount of 7 parts by weight or more and 25 parts by weight or less with respect to 0 parts by weight,
【0009】(2) ノボラック型フェノール樹脂
(A)が、ホルムアルデヒド類(F)とフェノール
(P)とのモル比(F/P比)が0.4〜0.95で合
成される、ランダムノボラック、ハイオルトノボラック
又はこれらの混合物であり、かつ該ノボラック型フェノ
ール樹脂中の遊離フェノール量が10重量%以下である
(1)項記載の熱硬化性樹脂組成物、(2) A random novolak in which a novolak type phenol resin (A) is synthesized at a molar ratio (F / P ratio) of formaldehyde (F) to phenol (P) of 0.4 to 0.95. The thermosetting resin composition according to (1), which is a high-ortho novolak or a mixture thereof, and wherein the amount of free phenol in the novolak-type phenol resin is 10% by weight or less.
【0010】(3) 分子内に3,4−ジヒドロ−2H
−1,3−ベンゾオキサジン構造を有する化合物(B)
が、フェノール性水酸基のオルト位の少なくとも一方に
水素が結合しているヒロドロキシフェニレン基を分子中
に2個以上有する化合物(D)と、一級アミンと、ホル
ムアルデヒドとを、該化合物(D)のフェノール性水酸
基1モルに対して1級アミンを0.5モル以上1.0モ
ル以下、及びホルムアルデヒドを一級アミン1モル当た
り2モルの割合で反応させることにより合成されたもの
である(1)項又は(2)項記載の熱硬化性樹脂組成
物、(3) 3,4-dihydro-2H in the molecule
Compound (B) having -1,3-benzoxazine structure
Is a compound (D) having two or more hydroxyphenylene groups in which hydrogen is bonded to at least one of the ortho positions of the phenolic hydroxyl group in the molecule, a primary amine and formaldehyde, (1) synthesized by reacting a primary amine at a ratio of 0.5 mol or more and 1.0 mol or less and a formaldehyde at a ratio of 2 mol per 1 mol of the primary amine with respect to 1 mol of the phenolic hydroxyl group. The thermosetting resin composition according to item or (2),
【0011】(4) 一級アミンが、式(1)で表され
る芳香族アミンである(1)項、(2)項、又は(3)
項記載の熱硬化性樹脂組成物、(4) The primary amine is an aromatic amine represented by the formula (1), (1), (2) or (3)
Item thermosetting resin composition,
【化2】 (式中、R1〜R5は水素又は炭素数10個以下のアルキ
ル基を表す。)Embedded image (In the formula, R 1 to R 5 represent hydrogen or an alkyl group having 10 or less carbon atoms.)
【0012】(5) 一級アミンが、炭素数10個以下
の脂肪族アミンである(1)項、(2)項、又は(3)
項記載の熱硬化性樹脂組成物、(5) The primary amine is an aliphatic amine having 10 or less carbon atoms, (1), (2) or (3).
Item thermosetting resin composition,
【0013】(6) 一級アミンが、炭素数10個以下
の脂環式アミンである(1)項、(2)項、又は(3)
項記載の熱硬化性樹脂組成物、(6) The primary amine is an alicyclic amine having 10 or less carbon atoms, (1), (2) or (3).
Item thermosetting resin composition,
【0014】(7) 化合物(D)が、ビスフェノール
Aである(1)項、(2)項、(3)項、(4)項、
(5)項、又は(6)項記載の熱硬化性樹脂組成物、(7) The compound (D) is bisphenol A, (1), (2), (3), (4),
(5) or the thermosetting resin composition according to (6),
【0015】(8) 化合物(D)が、ビスフェノール
F単独、またはビスフェノールF位置異性体の混合物で
ある(1)項、(2)項、(3)項、(4)項、(5)
項、又は(6)項記載の熱硬化性樹脂組成物、(8) The compound (D) is bisphenol F alone or a mixture of bisphenol F regioisomers (1), (2), (3), (4) and (5)
Item, or the thermosetting resin composition according to (6),
【0016】(9) 化合物(D)が、数平均分子量8
00以下のフェノールホルムアルデヒド樹脂である
(1)項、(2)項、(3)項、(4)項、(5)項、
又は(6)項記載の熱硬化性樹脂組成物、である。(9) The compound (D) has a number average molecular weight of 8
(1), (2), (3), (4), (5)
Or the thermosetting resin composition as described in (6).
【0017】[0017]
【発明の実施の形態】本発明で用いるノボラック型フェ
ノール樹脂(成分(A))は、フェノールとホルムアル
デヒドとを、酸性から中性の領域で反応させて得られる
ものである。また、このノボラック型フェノール樹脂
は、硬化性、耐熱性、或いは可とう性付与等の目的で変
性されたものでも良い。BEST MODE FOR CARRYING OUT THE INVENTION The novolak type phenol resin (component (A)) used in the present invention is obtained by reacting phenol and formaldehyde in an acidic to neutral range. The novolak-type phenol resin may be modified for the purpose of imparting curability, heat resistance, or flexibility.
【0018】このような変性剤としては、クレゾール、
キシレノール、ブチルフェノール及びノニルフェノール
等のアルキルフェノール類、さらにカテコール、レゾル
シノール、及びヒドロキノン等の多価フェノール類、ビ
スフェノールA、ビスフェノールF及びビスフェノール
等の多核フェノール類、トルエン、キシレン及びメシチ
レン等の芳香族炭化水素、桐油及び亜麻仁油等の乾性
油、ジシクロペンタジエン等を挙げることができ、これ
らの1種又は2種以上を組み合わせても良い。[0018] Such modifiers include cresol,
Alkylphenols such as xylenol, butylphenol and nonylphenol, polyhydric phenols such as catechol, resorcinol, and hydroquinone; polynuclear phenols such as bisphenol A, bisphenol F and bisphenol; aromatic hydrocarbons such as toluene, xylene and mesitylene; tung oil And drying oils such as linseed oil, dicyclopentadiene, etc., and one or more of these may be used in combination.
【0019】また、成分(A)において、変性剤として
挙げたフェノール化合物を含むフェノール類(P)と反
応させるホルムアルデヒド(F)の仕込みモル比(F/
P)は0.4〜0.95が望ましく、更に望ましくは
0.65〜0.9で有り、ランダムノボラック、ハイオ
ルトノボラック、またはこれらの混合物のいずれでも良
く、樹脂中の遊離フェノール量は、10重量%以下が望
ましい。Further, in the component (A), the charged molar ratio (F / F) of formaldehyde (F) to be reacted with a phenol (P) containing a phenol compound mentioned as a modifier.
P) is preferably from 0.4 to 0.95, more preferably from 0.65 to 0.9, and may be any of random novolak, high ortho novolak, or a mixture thereof. It is desirably 10% by weight or less.
【0020】本発明で用いる分子内に3,4−ジヒドロ
ー2H−1,3−ベンゾオキサジン構造を有する化合物
(成分(B))は、3,4−ジヒドロ−2H−1,3−
ベンゾオキサジン構造を有する化合物であれば、特に限
定されるものではなく、より好ましくは、フェノール性
水酸基のオルト位の少なくとも一方に水素が結合してい
るヒドロキシフェニレン基を分子中に2個以上有する化
合物と、一級アミンと、ホルムアルデヒドとを該化合物
のフェノール性水酸基1モル対して1級アミンを0.5
モル以上1.0モル以下、及びホルムアルデヒドを一級
アミン1モル当たり2モルの割合で用いて反応させるこ
とにより合成される。The compound having a 3,4-dihydro-2H-1,3-benzoxazine structure (component (B)) in the molecule used in the present invention is 3,4-dihydro-2H-1,3-
It is not particularly limited as long as it is a compound having a benzoxazine structure, and more preferably, a compound having two or more hydroxyphenylene groups in which hydrogen is bonded to at least one of the ortho positions of the phenolic hydroxyl group in the molecule. , A primary amine and formaldehyde with respect to 1 mol of the phenolic hydroxyl group of the compound, and
It is synthesized by reacting using not less than 1.0 mole and not more than 1.0 mole, and 2 moles of formaldehyde per mole of primary amine.
【0021】本発明で用いる成分(B)は、フェノール
性水酸基を有する化合物と、一級アミン、及びホルムア
ルデヒドとを上記の当量比で、溶媒中又は無溶媒で、7
0℃以上130℃以下で反応させることによって高収率
で得られるが、高純度で目的とする化合物を得るため
に、各原料化合物の仕込み当量比を、0.5当量以下の
範囲で調節したり、反応後の粗生成物を塩基性、中性も
しくは酸性の溶液で洗浄したり、蒸留あるいは再結晶等
の一般的な手段で精製することは全く差し支えない。The component (B) used in the present invention comprises a compound having a phenolic hydroxyl group, a primary amine and formaldehyde in the above-mentioned equivalence ratio, in a solvent or without a solvent.
It is obtained in a high yield by reacting at 0 ° C. or more and 130 ° C. or less, but in order to obtain a target compound with high purity, the equivalent ratio of each raw material compound is adjusted within a range of 0.5 equivalent or less. It is perfectly acceptable to wash the crude product after the reaction with a basic, neutral or acidic solution, or to purify it by general means such as distillation or recrystallization.
【0022】成分(B)を合成するのに用いられる、フ
ェノール性水酸基を有する化合物としては、フェノール
をはじめとして、クレゾール、キシレノール、エチルフ
ェノール、ブチルフェノール及びノニルフェノール等の
アルキルフェノール類、メトキシフェノール、及びエト
キシフェノール等のアルコキシフェノール類、ビスフェ
ノールA、ビスフェノールF及びその位置異性体、ビス
フェノールS等の2価フェノール類、フェノールホルム
アルデヒド樹脂類が挙げられ、好ましくは、ビスフェノ
ールA、ビスフェノールF及びその位置異性体等、数平
均分子量800以下のフェノールホルムアルデヒド樹脂
が挙げられる。Examples of the compound having a phenolic hydroxyl group used for synthesizing the component (B) include phenol, alkylphenols such as cresol, xylenol, ethylphenol, butylphenol and nonylphenol, methoxyphenol and ethoxyphenol. And the like, bisphenol A, bisphenol F and its positional isomers, dihydric phenols such as bisphenol S, and phenol formaldehyde resins. Preferred are bisphenol A, bisphenol F and its positional isomers. Phenol formaldehyde resins having an average molecular weight of 800 or less are exemplified.
【0023】また、ホルムアルデヒド源としては、パラ
ホルム、ホルマリン水溶液、あるいはトリオキサン等が
挙げられる。Examples of the formaldehyde source include paraform, an aqueous formalin solution, and trioxane.
【0024】一級アミン化合物としては、メチルアミ
ン、エチルアミン、ブチルアミン、ヘキシルアミン等の
炭素数が10個以下の脂肪族アミン、シクロヘキシルア
ミン等の炭素数が10個以下の脂環式アミン、アニリ
ン、トルイジン等の式(1)で表される芳香族アミン類
等が好ましく用いられる。特に好ましくは、メチルアミ
ン、シクロヘキシルアミン、又はアニリンが用いられ
る。Examples of the primary amine compound include aliphatic amines having 10 or less carbon atoms such as methylamine, ethylamine, butylamine and hexylamine, alicyclic amines having 10 or less carbon atoms such as cyclohexylamine, aniline and toluidine. Aromatic amines represented by the formula (1) are preferably used. Particularly preferably, methylamine, cyclohexylamine or aniline is used.
【0025】本発明の樹脂組成物における成分(B)の
配合割合は、成分(A)と成分(B)の合計量に占める
成分(A)の割合が80重量%以上99.5重量%以
下、成分(B)の割合が0.5重量%以上20重量%以
下であり、且つ成分(A)と成分(B)の合計量100
g中に含まれる3,4−ジヒドロ−2H−1,3−ベン
ゾオキサジン環の数が、0.005個以上0.09個以
下になる範囲で配合される。特に、本発明の樹脂組成物
においては、成分(A)と成分(B)の合計量に対する
成分(B)の配合量が、0.5重量%以上5重量%未満
の配合量でも、本発明の目的を達するに十分な効果が得
られることが特徴である。これより少ないと硬化時間の
短縮効果が十分発揮されず、また、これより多いと硬化
作用が多きすぎ、樹脂組成物製造時に、組成物が部分的
にゲルする等の問題が生じ、結果として、硬化物の強度
低下等を導くため望ましくない。成分(B)は、1種類
で用いても良いが、用途に応じて2種類以上を組み合わ
せて使用しても良い。The compounding ratio of the component (B) in the resin composition of the present invention is such that the ratio of the component (A) to the total amount of the components (A) and (B) is 80% by weight or more and 99.5% by weight or less. And the proportion of the component (B) is 0.5% by weight or more and 20% by weight or less, and the total amount of the component (A) and the component (B) is 100%.
The number of 3,4-dihydro-2H-1,3-benzoxazine rings contained in g is 0.005 or more and 0.09 or less. In particular, in the resin composition of the present invention, even if the compounding amount of the component (B) with respect to the total amount of the component (A) and the component (B) is from 0.5% by weight to less than 5% by weight, the present invention The feature is that a sufficient effect can be obtained to achieve the purpose. If less than this, the effect of shortening the curing time is not sufficiently exhibited, and if it is more than this, the curing action is too much, and during the production of the resin composition, a problem such as partial gelation of the composition occurs, and as a result, This is undesirable because it leads to a decrease in the strength of the cured product. Component (B) may be used alone or in combination of two or more depending on the application.
【0026】本発明で用いるヘキサメチレンテトラミン
(成分(C))は、通常、粉末状で用いられ、成分
(A)と成分(B)との合計量100重量部に対して、
7〜25重量部が配合される。成分(C)の配合量が、
これより少ないと架橋点が少なくなるため、硬化物の強
度が低下する等の問題が生じることがある。これより多
いと、成分(C)の分解によるガス発生量が多くなる、
また、反応しきれない過剰量の成分(C)が樹脂組成物
の硬化物中に残存し、硬化物特性を低下させる等の問題
を生じ、望ましくない。The hexamethylenetetramine (component (C)) used in the present invention is usually used in the form of a powder, and based on 100 parts by weight of the total amount of the components (A) and (B).
7 to 25 parts by weight are blended. The amount of the component (C) is
If the amount is less than this, the number of cross-linking points decreases, which may cause a problem such as a decrease in the strength of the cured product. If it is more than this, the amount of gas generated by decomposition of the component (C) increases,
In addition, an excessive amount of the component (C) that cannot be reacted remains in the cured product of the resin composition, causing problems such as deterioration of cured product characteristics, which is not desirable.
【0027】本発明の熱硬化性樹脂組成物には、必要に
応じて充填材として、有機充填材、無機充填材、離型
剤、着色剤等を配合することができる。有機又は無機充
填材としては、木粉、パルプ粉、各種織物粉砕物、熱硬
化性樹脂硬化物・成形品の粉砕品などの有機質粉末、シ
リカ、アルミナ、水酸化アルミニウム、ガラス、タル
ク、クレー、マイカ、炭酸カルシウム、カーボン等の無
機質粉末、ガラス繊維、カーボン繊維などの無機質繊維
などが挙げられる。これら充填材は1種または2種以上
用いることができる。In the thermosetting resin composition of the present invention, an organic filler, an inorganic filler, a release agent, a colorant, and the like can be added as a filler if necessary. As organic or inorganic fillers, wood powder, pulp powder, various crushed fabrics, organic powders such as thermosetting resin cured products and crushed molded products, silica, alumina, aluminum hydroxide, glass, talc, clay, Examples include inorganic powders such as mica, calcium carbonate, and carbon, and inorganic fibers such as glass fiber and carbon fiber. One or more of these fillers can be used.
【0028】本発明の熱硬化性樹脂組成物は、前記各成
分を一般的な方法で混合し、熱ロールあるいはニーダー
などの公知の技術によって混練して製造できる。The thermosetting resin composition of the present invention can be produced by mixing the above components by a general method and kneading the mixture by a known technique such as a hot roll or a kneader.
【0029】本発明の熱硬化性樹脂組成物は、耐熱性、
耐久性、電気及び機械的性能を必要とする、自動車部
品、電子・電気部品、あるいは厨房部品などの成形材料
に用いることができる。The thermosetting resin composition of the present invention has heat resistance,
It can be used for molding materials such as automobile parts, electronic / electric parts, and kitchen parts that require durability, electric and mechanical performance.
【0030】[0030]
【実施例】以下に本発明を説明するために実施例を示す
が、これによって本発明を限定するものではない。The following examples are provided to illustrate the present invention, but do not limit the present invention.
【0031】まず、実施例に使用した成分(B)の合成
例を示す。 (合成例1)撹拌羽根、ジムロート冷却管、温度計を備
えた300mlのセパラブルフラスコに、88%パラホ
ルム27g(0.8mol)、o−トルイジン43g
(0.4mol)、ビスフェノールA46g(0.2m
ol)、及び1,4−ジオキサン50mlを仕込み、撹
拌しながら、80℃になるまで徐々に昇温し、80℃で
5時間反応させた。反応後の溶液に、トルエン1000
mlを加え、分液ロートを用いて、1000mlのイオン
交換水で2回洗浄した。無水硫酸ナトリウムで水分を除
去した後、減圧下でトルエンを留去する事によって、化
合物(a)を得た。1H−NMRを用いた分析で、この
化合物1g中に含まれる3,4−ジヒドロ−2H−1,
3−ベンゾオキサジン環は、3.9×10-3個であっ
た。First, an example of the synthesis of the component (B) used in the examples will be described. (Synthesis Example 1) 27 g (0.8 mol) of 88% paraform and 43 g of o-toluidine were placed in a 300 ml separable flask equipped with a stirring blade, a Dimroth condenser, and a thermometer.
(0.4 mol), 46 g of bisphenol A (0.2 m
ol) and 50 ml of 1,4-dioxane, and gradually heated to 80 ° C. while stirring, and reacted at 80 ° C. for 5 hours. To the solution after the reaction, add toluene 1000
Then, the mixture was washed twice with 1000 ml of ion-exchanged water using a separating funnel. After removing water with anhydrous sodium sulfate, the compound (a) was obtained by distilling off toluene under reduced pressure. By analysis using 1 H-NMR, it was confirmed that 3,4-dihydro-2H-1,
The number of 3-benzoxazine rings was 3.9 × 10 −3 .
【0032】(合成例2)撹拌羽根、ジムロート冷却
管、温度計を備えた300mlのセパラブルフラスコ
に、ビスフェノールF40g(0.2mol)、アニリ
ン37g(0.4mol)、37%ホルマリン水溶液6
5g(0.8mol)、及びトルエン50mlを仕込
み、撹拌しながら、徐々に昇温し、80℃で4時間反応
させた。その後、反応系中の水とトルエンを、100℃
を越えないように減圧除去する事によって、化合物
(b)を得た。1H−NMRを用いた分析で、この化合
物1g中に含まれる3,4−ジヒドロ−2H−1,3−
ベンゾオキサジン環は、3.8×10-3個であった。(Synthesis Example 2) In a 300 ml separable flask equipped with a stirring blade, a Dimroth condenser, and a thermometer, 40 g (0.2 mol) of bisphenol F, 37 g (0.4 mol) of aniline, and a 37% aqueous solution of formalin 6
5 g (0.8 mol) and 50 ml of toluene were charged, and the temperature was gradually raised while stirring, and the reaction was carried out at 80 ° C. for 4 hours. Then, the water and toluene in the reaction system were heated at 100 ° C.
The compound (b) was obtained by removing under reduced pressure so as not to exceed. Analysis using 1 H-NMR revealed that 3,4-dihydro-2H-1,3-
The number of benzoxazine rings was 3.8 × 10 −3 .
【0033】(合成例3)撹拌羽根、ジムロート冷却
管、温度計を備えた300mlのセパラブルフラスコ
に、37%ホルマリン水溶液62g(0.76g)、p
−トルイジン41g(0.38mol)、ノボラック型
フェノール樹脂(数平均分子量600,OH当量10
4)50g、1,4−ジオキサン100mlを仕込み、
均一な溶液になるまで、室温で撹拌した。その後、この
混合物を撹拌しながら、90℃になるまで、徐々に昇温
し、90℃で6時間反応させた。得られた反応混合物
に、トルエン1000mlを加えて、分液ロートを用い
て、1000mlのイオン交換水で2回洗浄した。無水硫
酸ナトリウムで水分を除去した後、減圧下でトルエンを
留去する事によって、化合物(c)を得た。1H −N
MRを用いた分析で、この化合物1g中に含まれる3,
4−ジヒドロ−2H−1,3−ベンゾオキサジン環は、
3.5×10-3個であった。(Synthesis Example 3) In a 300 ml separable flask equipped with a stirring blade, a Dimroth condenser, and a thermometer, 62 g (0.76 g) of a 37% aqueous solution of formalin, p
-41 g (0.38 mol) of toluidine, novolak type phenol resin (number average molecular weight 600, OH equivalent 10
4) 50 g and 100 ml of 1,4-dioxane were charged,
Stir at room temperature until a homogeneous solution is obtained. Thereafter, the temperature of the mixture was gradually raised to 90 ° C. while stirring, and the mixture was reacted at 90 ° C. for 6 hours. To the obtained reaction mixture, 1000 ml of toluene was added, and the mixture was washed twice with 1000 ml of ion-exchanged water using a separating funnel. After removing water with anhydrous sodium sulfate, toluene was distilled off under reduced pressure to obtain a compound (c). 1 H-N
Analysis using MR revealed that 3 g contained in 1 g of this compound
The 4-dihydro-2H-1,3-benzoxazine ring is
It was 3.5 × 10 -3 pieces.
【0034】(合成例4)撹拌羽根、ジムロート冷却
管、温度計を備えた300mlのセパラブルフラスコに、3
7%ホルマリン水溶液65g(0.8mol)、ビスフ
ェノールA46g(0.2mol)、及びジオキサン1
00mlを仕込み、室温で、均一な溶液になるまで撹拌
した。この溶液に、シクロヘキシルアミン40g(0.
4mol)をゆっくりと加え、更に室温で1時間撹拌し
た。その後、徐々に80℃まで昇温し、4時間反応させ
た。得られた反応溶液に、1000mlのシクロヘキサ
ンを加え、イオン交換水1000mlで2回洗浄し、無
水硫酸ナトリウムで乾燥した。シクロヘキサンを減圧除
去する事によって、化合物(d)を得た。1H−NMR
を用いた分析で、この化合物1g中に含まれる3,4−
ジヒドロ−2H−1,3−ベンゾオキサジン環は、3.
9×10-3個であった。Synthesis Example 4 A 300 ml separable flask equipped with a stirring blade, a Dimroth condenser, and a thermometer was charged with 3
65 g (0.8 mol) of a 7% formalin aqueous solution, 46 g (0.2 mol) of bisphenol A, and dioxane 1
Then, the mixture was stirred at room temperature until a homogeneous solution was obtained. To this solution was added 40 g of cyclohexylamine (0.
4 mol) was added slowly, and the mixture was further stirred at room temperature for 1 hour. Thereafter, the temperature was gradually raised to 80 ° C., and the reaction was performed for 4 hours. To the obtained reaction solution, 1000 ml of cyclohexane was added, washed twice with 1000 ml of ion-exchanged water, and dried over anhydrous sodium sulfate. Compound (d) was obtained by removing cyclohexane under reduced pressure. 1 H-NMR
Analysis showed that 3,4-compounds contained in 1 g of this compound
The dihydro-2H-1,3-benzoxazine ring has a structure of 3.
9 × 10 −3 pieces.
【0035】(合成例5)撹拌羽根、ジムロート冷却
管、温度計を備えた300mlのセパラブルフラスコ
に、37%ホルマリン水溶液65g(0.8mol)、
1,4−ジオキサン50mlを仕込み、室温で撹拌する。
ここに40%メチルアミン水溶液31g(0.4mo
l)、引き続きフェノール38g(0.4mol)と
1,4−ジオキサン50mlの溶液を、ゆっくりと滴下
し、十分に反応するまで、室温で撹拌する。この混合溶
液を昇温し、60℃で6時間反応する。反応後の溶液
に、n−ヘキサン1000mlを加え、分液ロートを用
いて、1000mlのイオン交換水で2回洗浄した、無
水硫酸ナトリウムで水分を除去した後、減圧下にてn−
ヘキサンを留去する事によって、化合物(e)を得た。
1H−NMRを用いた分析で、この化合物1g中に含ま
れる3,4−ジヒドロ−2H−1,3−ベンゾオキサジ
ン環は、7.1×10-3個であった。(Synthesis Example 5) 65 g (0.8 mol) of a 37% aqueous solution of formalin was placed in a 300 ml separable flask equipped with a stirring blade, a Dimroth condenser, and a thermometer.
50 ml of 1,4-dioxane are charged and stirred at room temperature.
Here, 31 g of a 40% aqueous methylamine solution (0.4 mol
l) Subsequently, a solution of 38 g (0.4 mol) of phenol and 50 ml of 1,4-dioxane was slowly added dropwise, and the mixture was stirred at room temperature until it was sufficiently reacted. This mixed solution is heated and reacted at 60 ° C. for 6 hours. To the solution after the reaction, 1000 ml of n-hexane was added, and the mixture was washed twice with 1000 ml of ion-exchanged water using a separatory funnel. After removing water with anhydrous sodium sulfate, n-hexane was added under reduced pressure.
The hexane was distilled off to obtain a compound (e).
According to analysis using 1 H-NMR, the number of 3,4-dihydro-2H-1,3-benzoxazine rings contained in 1 g of the compound was 7.1 × 10 −3 .
【0036】次に成分(A)、成分(B)、及び成分
(C)を配合し、樹脂組成物を得た後、特性評価を行っ
た、実施例にて各種の特性を測定するために使用した測
定方法について、以下に説明する。 1.ゲルタイム測定 150℃に保った熱板上に、1gの試料をのせ、スパチ
ュラで、常時かき混ぜながら、スパチュラを持ち上げて
も、樹脂組成物が糸を引かなくなるまでの時間を測定し
た。この時間が短いほど、硬化が速いことを示す。 2.キュラストメーターによる硬化度の測定 170℃に設定したキュラストメーター(株式会社オリ
エンテック社製、JSRキュラストメーター S.D
型)に、実施例で得られた熱硬化性樹脂組成物を5.0
g仕込み、硬化速度と最大トルクを測定した。硬化速度
は、最大トルクの10%から90%に達するまでの傾き
であり、下記式で導かれ、単位は、N・m/sである。 硬化速度(N・m/s)=(最大トルク(N・m)×
0.9−最大トルク(N・m)×0.1)÷(最大トル
クの90%のトルク値に達した時間(s)−最大トルク
の10%のトルク値に達した時間(s)) また、最大トルクは、測定温度における弾性を示すパラ
メータで、値が大きいほど熱時弾性が高い。 3.曲げ強さ、及び熱時の曲げ強さの測定 樹脂組成物を、トランスファー成形機を用いて、170
℃5分の成形で曲げ試験片を作成し、JISK6911
に従い、常温での曲げ強さ、及び120℃での曲げ強さ
を測定した。Next, after blending the components (A), (B) and (C) to obtain a resin composition, the characteristics were evaluated. In order to measure various characteristics in Examples, The measurement method used is described below. 1. Gel time measurement A sample of 1 g was placed on a hot plate kept at 150 ° C, and the time until the resin composition did not pull the yarn even when the spatula was lifted while constantly stirring with a spatula was measured. The shorter the time, the faster the curing. 2. Measurement of Curing Degree by Curast Meter Curast Meter (Orientec Co., Ltd., JSR Curast Meter SD
Mold), the thermosetting resin composition obtained in the example was 5.0
g, the curing speed and the maximum torque were measured. The curing speed is a gradient from 10% to 90% of the maximum torque and is derived from the following equation, and the unit is N · m / s. Curing speed (Nm / s) = (maximum torque (Nm) x
0.9−maximum torque (N · m) × 0.1) ÷ (time at which torque value reaches 90% of maximum torque (s) −time at which torque value reaches 10% of maximum torque (s)) The maximum torque is a parameter indicating the elasticity at the measurement temperature. The larger the value, the higher the elasticity at the time of heating. 3. Measurement of flexural strength and flexural strength during heating The resin composition was measured for 170
A bending test piece was prepared by molding at ℃ 5 minutes, and JIS K6911
, The flexural strength at room temperature and the flexural strength at 120 ° C were measured.
【0037】(実施例1)成分(A)として、F/P=
0.82、遊離フェノール5wt%、オルト−パラ比
0.75のノボラック型フェノール樹脂(以下ノボラッ
クXと表記する)49g、及び F/P=0.75、遊
離フェノール6wt%、オルト−パラ比2.3のノボラ
ック型フェノール樹脂(以下ノボラックYと表記する)
49g、成分(B)として、合成例1で得られた化合物
(a)を2g、成分(C)として、ヘキサメチレンテト
ラミン20gを配合し、ミキサーでドライブレンドする
ことによって組成物を得た。この組成物の150℃での
ゲルタイムは、43秒であった。またこの組成物に同重
量の炭酸カルシウムを、ミキサーでドライブレンドし、
これを用いてキュラストメーター測定、及び常温及び1
20℃での曲げ強さを測定した。得られたキュラストメ
ーター硬化速度は、7.40×102N・m/s、最大
トルクは7.65×104N・m、常温における曲げ強
さは、77MPa、120℃における曲げ強さは、34
MPaであった。配合及び結果を表1にまとめた。(Example 1) As the component (A), F / P =
0.82, 5 g of free phenol, 49 g of novolak type phenol resin having an ortho-para ratio of 0.75 (hereinafter referred to as novolak X), and F / P = 0.75, 6 wt% of free phenol, and ortho-para ratio of 2 Novolak-type phenol resin (hereinafter referred to as novolak Y)
49 g, 2 g of the compound (a) obtained in Synthesis Example 1 as the component (B), and 20 g of hexamethylenetetramine as the component (C) were dry-blended with a mixer to obtain a composition. The gel time of this composition at 150 ° C. was 43 seconds. In addition, the same weight of calcium carbonate is dry-blended with a mixer to this composition,
Use this to measure the curast meter,
The flexural strength at 20 ° C. was measured. The resulting curastometer curing rate is 7.40 × 10 2 N · m / s, the maximum torque is 7.65 × 10 4 N · m, the flexural strength at room temperature is 77 MPa, and the flexural strength at 120 ° C. Is 34
MPa. The formulations and results are summarized in Table 1.
【0038】(実施例2)実施例1において用いたノボ
ラックXの49gを72gに、ノボラックYの49gを
24gに、化合物(a)2gを合成例2で得られた化合
物(b)4gに、ヘキサメチレンテトラミン20gを1
5gに代えた以外は、実施例1と同様にして、組成物を
得て評価を行った。配合及び結果を表1に示す。(Example 2) 49 g of novolak X used in Example 1 was added to 72 g, 49 g of novolak Y was added to 24 g, and 2 g of compound (a) was added to 4 g of compound (b) obtained in Synthesis Example 2. 1 g of 20 g of hexamethylenetetramine
A composition was obtained and evaluated in the same manner as in Example 1 except that the composition was changed to 5 g. The formulations and results are shown in Table 1.
【0039】(実施例3)実施例1で用いたノボラック
X49g及びノボラックY49gをノボラックX85g
に、化合物(a)2gを合成例3で得られた化合物
(c)15gに、ヘキサメチレンテトラミンの20gを
10gに代えた以外は、実施例1と同様にして、組成物
を得て評価を行った。配合及び結果を表1に示す。Example 3 Novolak X49 g and Novolak Y49 g used in Example 1 were converted to Novolak X85 g.
A composition was obtained and evaluated in the same manner as in Example 1 except that 2 g of the compound (a) was replaced with 15 g of the compound (c) obtained in Synthesis Example 3, and 20 g of hexamethylenetetramine was replaced with 10 g. went. The formulations and results are shown in Table 1.
【0040】(実施例4)実施例1で用いたノボラック
X49g及びノボラックY49gをノボラックX92.
5gに、化合物(a)2gを合成例4で得られた化合物
(d)7.5gに、ヘキサメチレンテトラミンの20g
を15gに代えた以外は、実施例1と同様にして、組成
物を得て評価を行った。配合及び結果を表1に示す。Example 4 Novolak X49g and Novolak Y49g used in Example 1 were replaced with Novolak X92.
20 g of hexamethylenetetramine was added to 7.5 g of the compound (d) obtained in Synthesis Example 4 and 2 g of the compound (a) to 5 g.
Was changed to 15 g, and a composition was obtained and evaluated in the same manner as in Example 1. The formulations and results are shown in Table 1.
【0041】(実施例5)実施例1で用いたノボラック
X49g及びノボラックY49gをノボラックX88g
に、化合物(a)2gを合成例5で得られた化合物
(e)12gに、ヘキサメチレンテトラミンの20gを
10gに代えた以外は、実施例1と同様にして、組成物
を得て評価を行った。配合及び結果を表1に示す。Example 5 Novolak X49 g and Novolak Y49 g used in Example 1 were converted to Novolak X88 g.
A composition was obtained and evaluated in the same manner as in Example 1, except that 2 g of the compound (a) was replaced with 10 g of 12 g of the compound (e) obtained in Synthesis Example 5 and 20 g of hexamethylenetetramine. went. The formulations and results are shown in Table 1.
【0042】(比較例1)ノボラックX100g、ヘキ
サメチレンテトラミン15gのみを配合し、以下実施例
1と同様の方法で、組成物を得て評価を行った。配合及
び結果を表1に示す。Comparative Example 1 Only 100 g of Novolak X and 15 g of hexamethylenetetramine were blended, and a composition was obtained and evaluated in the same manner as in Example 1 below. The formulations and results are shown in Table 1.
【0043】(比較例2)ノボラックXを75g、及び
ノボラックYを25g、ヘキサメチレンテトラミン15
gのみを配合し、以下実施例1と同様の方法で、組成物
を得て評価を行った。配合及び結果を表1に示す。Comparative Example 2 75 g of novolak X, 25 g of novolak Y, and 15 g of hexamethylenetetramine
g was blended, and a composition was obtained and evaluated in the same manner as in Example 1 below. The formulations and results are shown in Table 1.
【0044】(比較例3)実施例1で用いたボラックX
49g及びノボラックY49gをノボラックX80g
に、化合物(a)の2gをを20gに、ヘキサメチレン
テトラミンの20gを5gに代えた以外は、実施例1と
同様にして、組成物を得て評価を行った。配合及び結果
を表1に示す。(Comparative Example 3) Volak X used in Example 1
Novolak X 80 g
Then, a composition was obtained and evaluated in the same manner as in Example 1 except that 2 g of the compound (a) was changed to 20 g and 20 g of hexamethylenetetramine was changed to 5 g. The formulations and results are shown in Table 1.
【0045】(比較例4)実施例1で用いたボラックX
49g及びノボラックY49gをノボラックX75g
に、化合物(a)2gを化合物(b)25gに、ヘキサ
メチレンテトラミンの20gを8gに代えた以外は、実
施例1と同様にして、組成物を得て評価を行った。配合
及び結果を表1に示す。Comparative Example 4 Volak X used in Example 1
Novolak X 75 g with Novolak Y 49 g
Then, a composition was obtained and evaluated in the same manner as in Example 1, except that 2 g of the compound (a) was changed to 25 g of the compound (b) and 20 g of hexamethylenetetramine was changed to 8 g. The formulations and results are shown in Table 1.
【0046】(比較例5)実施例1で用いた化合物
(a)をパラトルエンスルホン酸に変えた以外は、実施
例1と同様にして、組成物を得て評価を行った。配合及
び結果を表1に示す。Comparative Example 5 A composition was obtained and evaluated in the same manner as in Example 1 except that the compound (a) used in Example 1 was changed to paratoluenesulfonic acid. The formulations and results are shown in Table 1.
【0047】(比較例6)実施例1で用いたノボラック
X49g及びノボラックY49gをノボラックX92.
5gに、化合物(a)2gをサリチル酸7.5gに、ヘ
キサメチレンテトラミンの20gを15gに変えた以外
は、実施例1と同様にして、組成物を得て評価を行っ
た。配合及び結果を表1に示す。(Comparative Example 6) Novolak X49g and Novolak Y49g used in Example 1 were replaced with Novolak X92.
A composition was obtained and evaluated in the same manner as in Example 1 except that 5 g, 2 g of the compound (a) was changed to 7.5 g of salicylic acid, and 20 g of hexamethylenetetramine was changed to 15 g. The formulations and results are shown in Table 1.
【0048】[0048]
【表1】 [Table 1]
【0049】実施例と従来例である比較例1及び2を比
較すると、本発明の樹脂組成物は、大幅に硬化時間の短
縮が可能であるとともに、成形物の常温及び120℃で
の曲げ強さ、キュラストメーターにおける最大トルクは
ほぼ同等である。比較例4〜6ではゲルタイムやキュラ
ストメーター硬化速度は実施例と同等であるが、キュラ
ストメーター最大トルク及び常温、120℃での曲げ強
さが低下していることが分かる。Comparing the examples with the comparative examples 1 and 2, which are conventional examples, the resin composition of the present invention can greatly reduce the curing time, and has a flexural strength at room temperature and 120 ° C. of a molded product. The maximum torque in the curast meter is almost the same. In Comparative Examples 4 to 6, the gel time and the curing speed of the curast meter are the same as those in the examples, but it can be seen that the maximum torque of the curast meter and the bending strength at normal temperature and 120 ° C. are reduced.
【0050】[0050]
【発明の効果】本発明によれば、強度等の硬化物特性を
低下させることなく、成形時の硬化時間を短縮する事が
可能な熱硬化性樹脂組成物を得ることができ、これは成
形材料等の用途に好適である。According to the present invention, it is possible to obtain a thermosetting resin composition capable of shortening the curing time during molding without deteriorating the properties of the cured product such as strength. It is suitable for applications such as materials.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) //(C08L 61/06 (C08L 61/06 61:34) 61:34) Fターム(参考) 4J002 CC031 CC282 EN046 EU186 EU237 GN00 GQ00 4J033 CA02 CA11 CA12 CA13 CA18 CA19 CA31 CA37 CA42 CB03 FA01 FA02 FA04 FA11 HA07 HA12 HA28 HB01 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // (C08L 61/06 (C08L 61/06 61:34) 61:34) F-term (Reference) 4J002 CC031 CC282 EN046 EU186 EU237 GN00 GQ00 4J033 CA02 CA11 CA12 CA13 CA18 CA19 CA31 CA37 CA42 CB03 FA01 FA02 FA04 FA11 HA07 HA12 HA28 HB01
Claims (9)
子内に3,4−ジヒドロ−2H−1,3−ベンゾオキサ
ジン構造を有する化合物(B)及びヘキサメチレンテト
ラミン(C)を必須成分とし、且つ、前記成分(A)と
成分(B)の合計量に占める成分(A)の割合が80重
量%以上99.5重量%以下、成分(B)の割合が0.
5重量%以上20重量%以下であり、且つ成分(A)と
成分(B)の合計量100g中に含まれる3,4−ジヒ
ドロ−2H−1,3−ベンゾオキサジン環の数が0.0
05個以上0.09個以下になる範囲で配合され、成分
(C)の配合量が成分(A)と成分(B)の合計量10
0重量部に対して7重量部以上25重量部以下で配合さ
れることを特徴とする熱硬化性樹脂組成物。1. A novolak-type phenol resin (A), a compound (B) having a 3,4-dihydro-2H-1,3-benzoxazine structure in a molecule, and hexamethylenetetramine (C) as essential components, and The ratio of the component (A) to the total amount of the components (A) and (B) is 80% by weight or more and 99.5% by weight or less, and the ratio of the component (B) is 0.
The number of 3,4-dihydro-2H-1,3-benzoxazine rings is 5% by weight or more and 20% by weight or less and contained in 100 g of the total amount of the component (A) and the component (B).
It is blended in a range of at least 05 and at most 0.09, and the blending amount of component (C) is 10 (total amount of component (A) and component (B)).
A thermosetting resin composition, which is blended in an amount of 7 to 25 parts by weight based on 0 part by weight.
ホルムアルデヒド類(F)とフェノール(P)とのモル
比(F/P比)が0.4〜0.95で合成される、ラン
ダムノボラック、ハイオルトノボラック又はこれらの混
合物であり、かつ該ノボラック型フェノール樹脂中の遊
離フェノール量が10重量%以下である請求項1記載の
熱硬化性樹脂組成物。2. A novolak type phenol resin (A) comprising:
A random novolak, a high ortho novolak, or a mixture thereof, which is synthesized at a molar ratio (F / P ratio) of formaldehydes (F) and phenol (P) of 0.4 to 0.95; The thermosetting resin composition according to claim 1, wherein the amount of free phenol in the phenol resin is 10% by weight or less.
3−ベンゾオキサジン構造を有する化合物(B)が、フ
ェノール性水酸基のオルト位の少なくとも一方に水素が
結合しているヒロドロキシフェニレン基を分子中に2個
以上有する化合物(D)と、一級アミンと、ホルムアル
デヒドとを、該化合物(D)のフェノール性水酸基1モ
ルに対して一級アミンを0.5モル以上1.0モル以
下、及びホルムアルデヒドを一級アミン1モル当たり2
モルの割合で反応させることにより合成されたものであ
る請求項1又は請求項2記載の熱硬化性樹脂組成物。3. The method according to claim 1, wherein 3,4-dihydro-2H-1,
A compound (B) having a 3-benzoxazine structure, a compound (D) having two or more hydroxyphenylene groups in which hydrogen is bonded to at least one of the ortho positions of the phenolic hydroxyl group in a molecule, and a primary amine And formaldehyde with 0.5 mol or more and 1.0 mol or less of primary amine and 1 mol of formaldehyde with respect to 1 mol of phenolic hydroxyl group of compound (D).
The thermosetting resin composition according to claim 1, wherein the composition is synthesized by reacting at a molar ratio.
族アミンである請求項1、請求項2、又は請求項3記載
の熱硬化性樹脂組成物。 【化1】 (式中、R1〜R5は、水素又は炭素数10個以下のアル
キル基を表す。)4. The thermosetting resin composition according to claim 1, wherein the primary amine is an aromatic amine represented by the formula (1). Embedded image (In the formula, R 1 to R 5 represent hydrogen or an alkyl group having 10 or less carbon atoms.)
族アミンである請求項1、請求項2、又は請求項3記載
の熱硬化性樹脂組成物。5. The thermosetting resin composition according to claim 1, wherein the primary amine is an aliphatic amine having 10 or less carbon atoms.
式アミンである請求項1、請求項2、又は請求項3記載
の熱硬化性樹脂組成物。6. The thermosetting resin composition according to claim 1, wherein the primary amine is an alicyclic amine having 10 or less carbon atoms.
請求項1、請求項2、請求項3、請求項4、請求項5、
又は請求項6記載の熱硬化性樹脂組成物。7. The compound according to claim 1, wherein the compound (D) is bisphenol A.
Or the thermosetting resin composition according to claim 6.
またはビスフェノールF位置異性体の混合物である請求
項1、請求項2、請求項3、請求項4、請求項5、又は
請求項6記載の熱硬化性樹脂組成物。8. The compound (D) is bisphenol F alone,
7. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition is a mixture of bisphenol F positional isomers.
のフェノールホルムアルデヒド樹脂である請求項1、請
求項2、請求項3、請求項4、請求項5、又は請求項6
記載の熱硬化性樹脂組成物。9. The compound according to claim 1, wherein the compound (D) is a phenol formaldehyde resin having a number average molecular weight of 800 or less.
The thermosetting resin composition according to the above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000047439A JP2001234029A (en) | 2000-02-24 | 2000-02-24 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000047439A JP2001234029A (en) | 2000-02-24 | 2000-02-24 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001234029A true JP2001234029A (en) | 2001-08-28 |
Family
ID=18569689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000047439A Pending JP2001234029A (en) | 2000-02-24 | 2000-02-24 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001234029A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005005541A1 (en) * | 2003-07-10 | 2005-01-20 | Asahi Organic Chemicals Industry Co., Ltd. | Phenol resin composition |
CN104356084A (en) * | 2014-10-22 | 2015-02-18 | 苏州太湖电工新材料股份有限公司 | Preparation method of benzoxazine compound |
CN117551245A (en) * | 2024-01-10 | 2024-02-13 | 山东永创材料科技有限公司 | A kind of ablation-resistant thermosetting phenolic resin and preparation method thereof |
-
2000
- 2000-02-24 JP JP2000047439A patent/JP2001234029A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005005541A1 (en) * | 2003-07-10 | 2005-01-20 | Asahi Organic Chemicals Industry Co., Ltd. | Phenol resin composition |
CN104356084A (en) * | 2014-10-22 | 2015-02-18 | 苏州太湖电工新材料股份有限公司 | Preparation method of benzoxazine compound |
CN117551245A (en) * | 2024-01-10 | 2024-02-13 | 山东永创材料科技有限公司 | A kind of ablation-resistant thermosetting phenolic resin and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5012003B2 (en) | Low melt viscosity phenol novolac resin, its production method and its use | |
TWI414561B (en) | With benzo A thermosetting resin composition and a method for producing the same, and a molded body and a hardened body thereof | |
JP5476762B2 (en) | Phenol resin, process for producing the resin, epoxy resin composition containing the resin, and cured product thereof | |
JP2001234029A (en) | Thermosetting resin composition | |
TW201623432A (en) | Epoxy resin composition | |
JP6423316B2 (en) | New aldehyde-containing resin | |
JP4726172B2 (en) | Thermosetting resin composition | |
JP2009286888A (en) | Thermosetting resin composition, thermosetting resin molding material, and cured product of the same | |
JP5268404B2 (en) | Phenol polymer, its production method and its use | |
JP2001064480A (en) | Thermosetting resin composition | |
JP3236382B2 (en) | Production method of phenolic resin | |
JPH09263617A (en) | Heat-resistant phenolic resin | |
JP3429090B2 (en) | Thermosetting resin composition and cured product thereof | |
JP2579405B2 (en) | Epoxy resin curing agent | |
JP2000178332A (en) | Thermosetting resin composition | |
JP2008214498A (en) | Aldehyde group-containing phenolic resin composition, phenolic resin composition containing the same, and molding material | |
JP7619551B1 (en) | Benzoxazine compounds and their uses | |
JP4487334B2 (en) | Thermosetting resin composition and molding material using the same | |
JP2010241877A (en) | Liquid phenol-based curing agent, composition, cured product, and use of the same | |
JP3986025B2 (en) | Epoxy resin composition and semiconductor sealing material | |
JP2001146545A (en) | Thermosetting resin composition | |
JPS6056168B2 (en) | Manufacturing method of amine modified product | |
TW202323244A (en) | Novel benzoxazine compound, resin raw material composition containing the same, curable resin composition and cured product thereof | |
JPH09255746A (en) | Heat-resistant phenol resin | |
JP4359960B2 (en) | Epoxy resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061206 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090120 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090519 |