JP2001229861A - X-ray image detector and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flat-surface-type X-ray image tube that is free from deformation in welded portion between an envelope and an input lid. SOLUTION: An X-ray image detector 1 has an envelope 3 consisting of an input phosphor screen, a photoelectric surface, an electron multiplier, and an output window for holding an X-ray amplifying structure vacuum, an input lid 2 connected to the envelope in an airtight manner for holding an input phosphor screen, and auxiliary members 13, 12 joined to a flange portion 3a of the envelope and a flange portion 2a of the input lid. Both of the auxiliary members are joined through a joining material 14 to keep the inside of the envelope vacuum and airtight. Use of the auxiliary members prevents input lid deformation which can be caused by an exhaust process and long use thereof as well as the ablation of the joined portion formed of the joining material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a radiation X
The present invention relates to an X-ray image detector that converts an image obtained by a line into an optical or electrical image signal.

[0002]

2. Description of the Related Art In general, X-rays are useful for examining the internal structure of a human body or an object, and the transmission density distribution of X-rays irradiated on a human body or an object, that is, an X-ray intensity distribution or an X-ray image is visible light. Devices for converting an image or an electrical image signal corresponding to X-rays are widely used.

[0003] As devices for converting an X-ray image into a visible light image or an electric image signal, an X-ray image tube (X-ray image intensifier) and an X-ray vidicon (X-ray image detector) have been developed. .

[0004] At present, there has been reported an example in which an electron multiplier is used in a vacuum vessel to reduce the thickness, that is, the depth of an electron tube such as an X-ray image tube or a video tube.

For example, US Pat. No. 3,394,261 discloses a configuration in which a micro channel plate (MCP) having a function of amplifying electrons is added to a picture tube.

The MCP, or electron multiplier, has a structure in which a plurality of metal plates having a predetermined thickness and a plurality of through holes formed at predetermined intervals in a plane direction are laminated via an insulating material. It is said that the S / N (signal-to-noise) ratio can be improved.

In the structure of the X-ray image tube, a flange portion is provided on each of the input lid holding the input fluorescent screen and the envelope containing the electron multiplier, and the respective flange portions are fixed by welding. Planar structures are widely used today.

[0008]

In the flat X-ray image tube described above, a welding step of welding the envelope and the input cover and a baking step after welding (a step of exhausting the impurity gas in the envelope). In (2), there is a problem that the flange portion is deformed, the distance between the input phosphor screen and the electron multiplier changes, and the output image is distorted.

On the other hand, when the joining of the input cover and the envelope and the evacuation of the joined body are performed (evacuated) in the same reduced-pressure atmosphere (vacuum chamber), a normal welding technique cannot be used, and thus a low melting point metal is used. Is interposed between the input lid and the envelope as a sealing material, and heat welding is conceivable.

However, in the flat X-ray image tube described above, due to its structure, a large atmospheric pressure is applied to the main surface of the input lid, and the stress concentrates on the flange portion. Since the joint made of the low melting point metal does not have sufficient resistance to the concentration of the stress, there is a possibility that embrittlement may occur in the joint such as peeling of the sealing material. Note that when peeling occurs, the degree of peeling gradually increases, so that there is a problem that the object cannot be observed.

As a result, there is a problem that the input surface and the output surface are relatively deformed to cause a distortion in a detected image, thereby causing performance degradation.

An object of the present invention is to provide a flat type X-ray image tube capable of improving the stress resistance of a joint between an envelope and an input lid and thereby detecting a good image without distortion. It is.

[0013]

SUMMARY OF THE INVENTION The present invention has been made based on the above-mentioned problems, and has an envelope provided with a flange portion in an opening, and is joined to the flange portion of the envelope. An input cover having a flange portion, and holding the vacuum integrally with the inside of the envelope; an input fluorescent surface formed on the main surface of the input cover and converting X-rays incident from the outside into fluorescent light;
A photocathode that is arranged in the envelope and converts fluorescence generated by the input phosphor screen into photoelectrons, and a metal plate that is arranged in the envelope and has a plurality of holes formed in a plane direction is an insulating material. Having a structure in which a plurality of layers are laminated while being insulated, and a predetermined voltage is applied to each metal plate, so that an electron multiplier that amplifies photoelectrons emitted from the photoelectric surface, And an output window for converting the photoelectrons amplified by the electron multiplier to a visible light image and outputting the same to the outside, and at least one of the flange portion of the envelope and the flange portion of the input lid. An X-ray image detector is provided, wherein the flange portion has a joining auxiliary member fixed to the joint surface by welding, and the joining auxiliary member or the flange portion and the joining auxiliary member are joined by a joining material. Things.

Further, the present invention has an envelope provided with a flange portion in an opening, and a flange portion joined to the flange portion of the envelope, and is integrally formed with the inside of the envelope. An input lid for holding a vacuum, formed on a main surface inside the input lid,
An input phosphor screen for converting X-rays incident from the outside into fluorescent light, a photoelectric face disposed in the envelope, for converting the fluorescence generated by the input phosphor screen into photoelectrons, and disposed in the envelope. A metal plate having a plurality of holes formed in a plane direction is laminated in a plurality of stages while insulating with an insulating material. When a predetermined voltage is applied to each metal plate, the metal plate is emitted from the photoelectric surface. X having an electron multiplier for amplifying the photoelectrons, and an output window disposed in the envelope and for converting the photoelectrons amplified by the electron multiplier to a visible light image and outputting the same to the outside.
In the method for manufacturing a line image detector, a step of welding a ring-shaped joining auxiliary member to the flange portion of the envelope, including a joining material or a joining material on a surface of the envelope opposite to the flange portion. A step of forming a thin layer of a material made of an alloy, a step of welding a ring-shaped joining auxiliary member to the flange portion of the input cover, a surface of the input cover opposite to the flange portion,
Forming a thin layer of a material made of a bonding material or an alloy containing the bonding material, arranging a bonding material between the bonding auxiliary members, and forming the envelope and the input in a vacuum chamber or a reduced-pressure atmosphere. A method for manufacturing an X-ray image detector, comprising applying a predetermined pressure and heat to a lid.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic diagram illustrating a flat X-ray image detector to which an embodiment of the present invention is applied.

As shown in FIG. 1, an X-ray image detector 1
Is an input window 2 from which an X-ray source (not shown) is emitted and through which an X-ray transmitted through the observation target is input; an envelope 3 capable of maintaining the inside thereof in a vacuum by being sealed with the input window 2; An input surface 4 is provided at a predetermined position in a vacuum container constituted by a gas 3 and is converted from an X-ray incident from an input window 2 into electrons, and is output from an input surface 4 in an envelope 3. X-ray amplification comprising an electron multiplier 5 provided at a predetermined position where electrons can reach and an output substrate (output window) 6 for converting electrons amplified by the electron multiplier 5 into visible light and outputting the visible light. It has a structure. Note that a power supply unit 7 for supplying a predetermined voltage to a plurality of metal plates in the electron multiplier 5 is formed at a predetermined position of the envelope 3.

As shown in FIG. 2, each of the input window 2 and the envelope 3 has a flange 2a formed integrally with the input window 2 and a flange 3a provided on the envelope 3. ing.

Each of the flanges 2a and 3a is made of a readily available metal material (such as stainless steel).
Reinforcing members 12 and 13 each having a predetermined cross-sectional area and being a block formed in a ring shape are welded. The material of the portion of the input window 2 through which X-rays pass is, for example, A
1 (aluminum) or Ti (titanium), and the reinforcing member 12 and the flange portion 2a are fixed by welding. On the other hand, the envelope 3 is made of, for example, glass, and is previously formed of, for example, a metal material having a thermal expansion coefficient close to that of glass, and is formed integrally with the envelope 3 by a flange portion 3a.
On the other hand, the reinforcing member 13 is fixed by welding.

The reinforcing members 12 and 13 (that is, the input window 2 and the envelope 3) are joined by a joining material 14 made of In (indium) or an indium alloy (In-Sb or In-Ag). In this case, as a joining method, a joining material 14 is arranged between the two auxiliary members 12 and 13, and a predetermined pressure is applied to each of the input lid 2 and the envelope 3.
Or by applying a given pressure and a given heat at the same time,
The input lid 2 and the envelope 3 are joined.

The surfaces of the reinforcing members 12 and 13 facing each other, that is, the bonding surfaces 12a and 13a are formed, for example, by a honing process using white alumina having an average particle diameter of 600 to 700 μm to form a bonding material 14 of In or the like.
The surface roughness is 4 in average roughness Ra so that
It has been pretreated to a roughness of about 7 μm (the maximum roughness is approximately 50 μm). Prior to bonding, thin layers 12b and 13b of In are provided on the respective bonded surfaces 12a and 13a that have been honed. Thereby, at the time of joining with the joining material 14, the whole area is favorably joined.

The bonding material 14 is preferably indium or an alloy containing indium among the low melting point metals. Also, the joining surfaces 12a, 13 of the reinforcing members 12, 13
As the thin layers 12b, 13b formed on the
A low melting point metal of the same kind as 4 or an alloy containing the same is suitable. In particular, in this embodiment, a material obtained by mixing indium with silver (Ag) at a predetermined ratio was used.

One of the reinforcing members 12 and 13 (generally, the reinforcing member 13 also serves as a holding portion for the joining material) has a cross-sectional shape having a depth of about 0.5 mm having a substantially semicircular or rectangular shape. A groove and a flat portion formed in the vicinity thereof are provided over the entire circumference, and the groove and the flat portion can increase an adhesion area of a sealing material made of indium. Airtightness (degree of vacuum) is ensured.

Each of the reinforcing members 12 and 13 has the size of the electron multiplier 5 and the output board 6, that is, the inner diameter of the envelope 3, the thickness of the flange 2 a of the input lid 2, and the stress of the bent portion. A cross-sectional area and a joint area with the flange portion, which are determined from such factors as the above, are required, and an optimum cross-sectional shape and joint area are given according to the diameter of the electron multiplier 5.

Further, the joining reinforcing members 12, 13 formed as a block body directly connect the flange portions 2a, 2b to each other.
Since the stress concentrated on the flange portion and the vicinity thereof can be absorbed as compared with the case of surface joining, the stress directly applied to the joining portion by indium can be reduced. For this reason, the stress resistance of the junction between the input lid and the envelope can be improved, and high-quality image detection without distortion can be performed even in long-term use in the atmosphere.

Next, a method of joining the input cover 3 and the envelope will be described.

First, a ring-shaped joining auxiliary member 13 is fixed to the flange 3a of the envelope 3 by welding. Similarly, a ring-shaped joining auxiliary member 12 is fixed to the flange portion 2a of the input lid 2 by welding. It has been confirmed that a predetermined joining strength can be obtained by providing the joining auxiliary members 13 and 12 on at least one of the flange portions 3a and 2a.

Next, each of the joining auxiliary members 12, 13
After the roughness of the joint surfaces 12a and 13a is roughened by honing, a thin layer of In is formed by using an ultrasonic soldering iron at a frequency of 5 to 10 kHz at about 150 ° C. (temperature near the melting point of In or (Or higher temperature). When the above-described frequency is applied in a state where In becomes a liquid, the oxidization film on the surfaces of the bonding surfaces 12a and 13a is destroyed by cavitation of the liquid In, and pure In
Is formed on the bonding surfaces 12a and 13a. As a result, a thin layer of In which cannot be easily peeled off from the joining surfaces 12a, 13a of the individual joining auxiliary members is formed on the joining surfaces 12a, 13a as compared with the case where In is simply pressurized. When the joining auxiliary member 13 (12) is provided only on one of the flange portions 3a (2a), the thin layer of pure In is formed, for example, by the joining surface 13a of the joining auxiliary member 13 and the flange portion 2a of the input window 2. Needless to say, it is provided on the joining surface 12a of the joining auxiliary member 12 and the flange 3a of the envelope 3.

Next, the electron multiplier 5 and the output substrate 6 are set in the envelope 3, and each power supply line is connected to the power supply unit 7.

Hereinafter, the joining surface 13a of the joining auxiliary member 13 of the flange 3a of the envelope 3 formed with the thin layer of In (when the joining auxiliary member 12 is used only for the flange 2a of the input lid 2, A lump of In or an alloy containing In is set as a bonding material 14 on a predetermined plane of the flange portion 3 a), and a power supply line of the input surface 4 is connected to the power supply 7. Temporarily fix to 3.

Next, the whole in which the envelope 3 and the input cover 2 are temporarily fixed is placed in a vacuum chamber (reduced pressure atmosphere).
A predetermined pressure, or a predetermined pressure and a predetermined heat, are simultaneously applied from both sides of the flange portion 2a and the flange portion 3a of the envelope 3.

Hereinafter, the X-ray image detector 1 is provided by evacuating the impurity gas in the vacuum vessel constituted by the input lid 2 and the envelope 3.

The lump of In or the alloy containing In used as the above-mentioned joining material has a ring shape capable of making contact with the joining auxiliary member 13 (flange portion 3b) over the entire circumference, and has a sectional shape. , A circular or flat plate is used.
In this case, only the thin layer of In previously formed on each of the joining auxiliary member 13 (flange portion 3b) and the joining auxiliary member 12 (flange portion 2a) may be used. Although different from the above-described steps, by setting the shape of the joining auxiliary member 13 (flange portion 3a of the envelope 3) to be optimal, the joining auxiliary member 12 on the flange portion 2a side of the input lid 2 and It is also possible to omit both of the thin layers of In provided on the bonding surface 12a in advance.

The melting point of In is 156 ° C.
Due to heating in the evacuation process after joining the input lid 2 and the envelope 3, the envelope when only the joining surfaces 12 a and 13 a (or the flange portion 2 a and the joining auxiliary member 12 are used) prior to the joining material 14. Flange part 3a)
When the thin layers 12b and 13b provided in the above are composed only of In, there is a possibility that the joint portions are peeled off. On the other hand, in order to increase the input sensitivity, the fluorescent material constituting the input fluorescent screen 41 of the input screen 4 is temporarily heated to 200 ° C. or higher, preferably 2 ° C.
It is necessary to heat and activate to a temperature in the range below 50 ° C. In the evacuation step, the temperature to be heated is about 450 ° C. (at least about 300 ° C.) in order to exhaust the inside of the vacuum vessel to a predetermined vacuum degree. The fluorescent material forming the input fluorescent screen 41 has a temperature of 250.
Above ℃, loss due to re-evaporation (sensitivity decreases)
For this reason, the upper limit of the heating temperature is usually suppressed to about 250 ° C. also in the evacuation step.

Taking these factors into consideration, at the joint between the input lid 2 and the envelope 3, the joining material 14 and / or the thin layers 12 b, 13 b are respectively prevented so that the joining material 14 does not peel off by heating. The material used for the bonding material 14 and the thin layers 12b and 13b is made of pure In to increase the melting point of pure In.
From the bonding material 14 and the thin layer 1
2b and 13b can be prevented from undesirably peeling off at any of the joints.

In detail, the use of an alloy in which Ag is added to In is as described above. The melting point increases as the amount of Ag mixed increases. When the amount exceeds 35%, I
When the hardness of the n-Ag alloy becomes very hard and the respective flange portions of the input lid 2 and the envelope 3 are slightly deformed, it is impossible to cope with the deformation and the vacuum tightness may be deteriorated. Therefore, the upper limit of the mixing amount of Ag is 35% by weight percentage.
Less than On the other hand, in order that the melting point temperature does not fall below 200 ° C., the mixing amount of Ag is required to be about 5% by weight.

From these, the melting point temperature of In or the In alloy used for the bonding material 14, the thin layers 12b and 13b provided between the bonding material and the bonding surface (the bonding auxiliary member or the flange portion) is determined according to the required specifications. It is set arbitrarily according to the characteristics.

For example, when providing an X-ray image detector,
When importance is attached to the vacuum tightness, the joining surfaces 12a, 13a
Each has a pure In or Ag content of about 10%.
The thin layers 12b and 13b are formed using an Ag alloy, and pure In or Ag of about 10% is used as the bonding material 14.
It is preferable to join the input lid 2 and the envelope 3 using an alloy.

On the other hand, when the input fluorescent screen 41 is sufficiently activated to increase the sensitivity, the joining surface 12a on the input lid 2 side is used.
And a thin layer 1 made of an In-Ag alloy containing about 10% of Ag.
2b is formed, and Ag is applied to the joint surface 13a on the side of the envelope 3.
The thin layer 13b is formed by using an In-Ag alloy of about 5%, and the In-Ag alloy of about 20% Ag is used for the bonding material 14, so that the vacuum airtightness is high and the input phosphor screen 41 is formed.
X-ray image detector in which the fluorescent material is sufficiently activated can be provided. In addition, similar characteristics are obtained, for example, by forming a thin layer 12b on the joining surface 12a on the input lid 2 side using an In-Ag alloy of about 10% Ag, and forming a thin layer 12b on the joining surface 13a on the envelope 3 side.
Thin layer 13b using an In-Ag alloy with Ag of about 25%
To form the two flange portions without using the bonding material 14.
It can also be obtained by direct joining.

The thin layers 12b and 13b having various characteristics described above can be easily formed by using the above-described ultrasonic soldering iron and setting the heating temperature and the frequency optimally.

FIG. 3 is a schematic diagram for explaining the configuration of the electron multiplier incorporated in the X-ray image detector described with reference to FIGS.

X-rays R radiated from an X-ray source (not shown)
However, an X-ray R ₁ given a concentration distribution by passing through an observation target, for example, a human body, is incident on the input surface 4.

The input surface 4 is provided on a substrate 40 made of, for example, Al.
CsI of a predetermined thickness (hereinafter referred to as an input phosphor film formed of cesium iodide and hereinafter referred to as Csl film) 41, Is of a predetermined thickness
A transparent conductive film 42 such as TO (a thin film of indium-tin oxide) and K (potassium), Cs (cesium) or N
a (sodium) and the like are stacked in order, are incident on the input window 2,
The X-ray _{R 1} incident on the CsI film 41 through the 0 and converts the fluorescent _{R 2.}

The fluorescence R ₂ moves from the CsI film 41 toward the transparent conductive film 42, passes through the transparent conductive film 42, and passes through the photoelectric surface 43.
, Is converted into photoelectrons E by the photocathode 43, is released into a vacuum, and is accelerated by the potential difference V ₁ applied between the CsI film 41 on the input face 4 and the electron multiplier 5 to increase the number of electrons. It reaches the multiplier 5.

The electron multiplier 5 includes a plurality of metal plates 5 having a predetermined thickness in which a plurality of through holes 50 are formed at predetermined intervals in a plane direction, for example, a plurality of metal plates 5 made of soft iron or an invar alloy.
1 and a plurality of glass beads or bead-shaped insulators 52 located between the metal plates 51. The insulator 52 is joined to a predetermined position of the metal plate 51 by a frit glass 53 having a low melting point. In addition, each metal plate 51 is connected to V ₂ via the power supply unit 7 of the envelope 3.
Potential difference of a magnitude represented by ~V _n are given.

In many cases, the photoelectrons E reaching the electron multiplier 5 collide with the inner wall of the through hole 50 of the metal plate 51 on the input surface 4 side, and one or more electrons E _{2 due} to a secondary electron amplification phenomenon. And the potential difference V ₂ -applied between the respective metal plates 51
The accelerating voltage V _a between V _n and the final stage of the metal plate 51 and the output substrate 6, toward the metal plate 51 of the next stage (or output board 6), are accelerated sequentially, any of the metal plate 51 Colliding with the inner wall of the through-hole 50 of one or more electrons E ₂
Becomes

By repeating the collision and the generation of secondary electrons, the photoelectrons E incident on the electron multiplier 5 are gradually amplified, and the electron multiplier 5 outputs the output fluorescent screen 6 of the output substrate 6.
Released towards 1. At this time, the emitted electrons E ₂
Is proportional to the amount of incident photoelectrons E, the material of the metal plate 51, the thickness of the metal plate 51, the shape of the hole in the metal plate 51, the thickness of the insulator 52 (the distance between the metal plates 51), And a potential difference V _{2 to} V _n applied between the insulator 52 and the metal plate 51.
And a final stage of the metal plate 51 is dependent on the electric field distribution generated according to the acceleration voltage V _a between the output board 6, and the amplification factor is determined by the number of layers of the metal plate 51 is laminated.

The output substrate 6 includes a glass plate 60 and a glass plate 6.
The output fluorescent film 61 of a predetermined thickness provided on the side of the electron multiplier 5 and the light reflective metal film 6 provided on the electron multiplier 5 side of the output fluorescent film 61 and made of, for example, aluminum.
It consists of two, the accelerating voltage V _a, with attracting electron multiplier 5 photoelectrons E ₂ is amplified by and output toward an output image corresponding to photoelectrons E ₂ to the outside.

That is, the photoelectrons E ₂ are output from the output phosphor screen 61.
Visible light with a luminance and are accelerated by the potential difference V _a applied between the last stage of the metal plate 51 of the electron multiplier 5 collides with the output phosphor film 61, corresponds to the energy obtained by the potential difference V _a It is converted to R _3, and reaches the output face of the glass plate 60 of the output board 6.

In this manner, X from outside the input window 2
The line (X-ray image) R ₁ is amplified by the electron multiplier 5 and is applied to a visible light image R _{3 on} an output surface of an output substrate 6 which is a glass substrate.
Is output as

The visible light image R ₃ is output to the output substrate 6 at the same magnification as that incident on the incident surface on the input window 2 side of the envelope 3 without being undesirably distorted. .

As described above, in the X-ray image detector of the present invention, the input lid provided with the input fluorescent screen and the envelope in which the electron multiplier is inserted are each provided with a flange. By joining via a reinforcing member which is a ring-shaped block body welded to the portion, deformation of the flange portion due to heat applied at the time of joining and deformation in a subsequent exhaust process are prevented.

Further, since the reinforcing member is provided with a thin layer of an indium alloy containing silver prior to the joining, the joining is favorably performed.
In long-term use, no peeling occurs at the joint.

Therefore, there is provided an X-ray image detector capable of obtaining a bright observation image due to the amplification effect of the electron multiplier of the observation object without distortion.

[0055]

As described above, in the X-ray image detector of the present invention, an X-ray image detector capable of obtaining an observation image without distortion on a large screen is formed at low cost and in a small size.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an example of an X-ray image detector according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view for explaining in detail a joint between an envelope and an input lid of the X-ray image detector shown in FIG. 1;

FIG. 3 is a schematic diagram illustrating the operation of the X-ray image detector shown in FIGS. 1 and 2.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... X-ray image detector, 2 ... Input window, 2a ... Flange part, 3 ... Enclosure (vacuum container), 3a ... Flange part, 4 ... Input surface, DESCRIPTION OF SYMBOLS 5 ... Electron multiplier 6 ... Output board 7 ... Power supply part 12 ... Reinforcement member 12a ... Joining surface 12b ... Thin layer 13 ... Reinforcement 13a: joining surface, 13b: thin layer, 14: joining material, 40: substrate, 41: CsI film (input fluorescent film), 42: transparent conductive film, 43 ... Photoelectric surface, 50 ... Through hole, 51 ... Metal plate (conductive layer), 52 ... Glass beads (Insulator), 53 ... Frit glass, 60 ... Glass substrate, 61 ... an output fluorescent film, 62 ... a light reflecting film.

Continuing from the front page (72) Inventor Hiroyuki Aida 1385-1, Shimoishigami, Otawara-shi, Tochigi Prefecture F-term in Toshiba Nasu Electron Tube Factory (reference) 5C012 AA05 BC03 5C032 AA01 AA07 BB18 5C037 GG05 GH16

Claims (10)

[Claims] 1. An envelope having a flange provided in an opening, and a flange joined to the flange of the envelope, and maintaining a vacuum integrally with the interior of the envelope. An input cover, an input fluorescent surface formed on the main surface inside the input cover for converting X-rays incident from the outside into fluorescent light, and a fluorescent light generated by the input fluorescent surface, A photoelectric surface to be converted into a metal plate having a structure in which a plurality of layers are stacked while insulating a metal plate having a plurality of holes formed in the surface direction, which is arranged in the envelope, is insulated by an insulating material. By applying a voltage, an electron multiplier that amplifies the photoelectrons emitted from the photocathode, and disposed in the envelope,
An output window that converts the photoelectrons amplified by the electron multiplier to a visible light image and outputs the converted image to the outside, and at least one of the flange portion of the envelope and the flange portion of the input cover has a flange portion. An X-ray image detector, comprising: a joining auxiliary member welded and fixed to a joining surface thereof, wherein the joining auxiliary member or the flange portion and the joining auxiliary member are joined by a joining material. 2. The method according to claim 1, wherein the bonding material is a low melting point metal or an alloy containing a low melting point metal.
Line image detector. 3. A surface to which each of the joining auxiliary members provided on the flange portion of the envelope, the flange portion of the input cover, or each flange portion is connected,
3. The X-ray image detector according to claim 2, wherein a thin layer made of an alloy containing the low melting point metal is provided. 4. The X-ray image detector according to claim 2, wherein the bonding material is indium or an indium alloy containing indium. 5. A groove for ensuring a degree of vacuum when said envelope and said input lid are joined along at least one of said joining auxiliary member and said flange portion. 2. A flat portion is provided.
An X-ray image detector according to any one of claims 1 to 4. 6. At least one of the joining auxiliary member and the flange portion is made of an alloy containing the low melting point metal in order to secure a degree of vacuum when the envelope and the input lid are joined. The X-ray image detector according to claim 5, further comprising a thin film. 7. The X-ray image detector according to claim 1, wherein said joining auxiliary member includes stainless steel. 8. An envelope having a flange provided at an opening, and a flange joined to the flange of the envelope, and maintaining a vacuum integrally with the interior of the envelope. An input cover, an input fluorescent surface formed on the main surface inside the input cover for converting X-rays incident from the outside into fluorescent light, and a fluorescent light generated by the input fluorescent surface, A photoelectric surface to be converted into a metal plate having a structure in which a plurality of layers are stacked while insulating a metal plate having a plurality of holes formed in the surface direction, which is arranged in the envelope, is insulated by an insulating material. By applying a voltage, an electron multiplier that amplifies the photoelectrons emitted from the photocathode, and disposed in the envelope,
In a method for manufacturing an X-ray image detector having an output window for converting photoelectrons amplified by the electron multiplier to a visible light image and outputting the converted image to the outside, a ring-shaped joining auxiliary member is provided on a flange portion of the envelope. Welding a step of forming a thin layer of a joining material or an alloy containing a joining material on a surface of the envelope opposite to the flange portion, a ring-shaped joining to the flange portion of the input lid. Welding the auxiliary member, forming a thin layer of a material made of a bonding material or an alloy containing the bonding material on a surface of the input lid opposite to the flange portion, and bonding a bonding material between the bonding auxiliary members. A method of manufacturing an X-ray image detector, comprising: arranging the envelope and applying a predetermined pressure and heat to the envelope and the input cover in a vacuum chamber or a reduced-pressure atmosphere. 9. The method for manufacturing an X-ray image detector according to claim 8, wherein said bonding material contains a low melting point metal. 10. The method for manufacturing an X-ray image detector according to claim 9, wherein said bonding material is indium or an indium alloy containing indium.