JP2001211499A - Manufacture of damper and speaker unit using the damper - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability in the case of forming a lead wire on a small diameter resin damper. SOLUTION: The lead wire including at least a tinsel wire 13 is mounted in the injection molding metallic molds 17 and 18 of the damper, the injection molding metal mold is closed and resin 19 is injected, when the resin 19 is cured, the resin 19 is extracted from the metal mold, and the tinsel wire over the opening 10 of a metal mold inner circumference where a voice coil bobbin is mounted is cut off and connected to an external lead-through terminal 16. Both external lead-through terminals connected to the tinsel wire may be mounted besides the wire 13. Also, as one of method for mounting the tinsel wire, may be pasted or printed onto an insulating sheet of a flexible film, etc., and be mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a resin-made speaker damper and a speaker device using the damper.

[0002]

2. Description of the Related Art The structure of a general dynamic speaker is shown in FIG. The driving principle of the diaphragm 24 is well known. In the illustrated dynamic speaker, a lead wire 22 pulled out from the voice coil 21 and a tinsel wire 23 are soldered by eyelets 25 where a diaphragm 24 is installed, and one of the tinsel wires 23 is connected to an external lead terminal. 26 is soldered.

[0003] Many dampers are obtained by impregnating a woven fabric of cotton or aramid fibers with a phenol resin, and heating and pressing the phenol resin. However, the damper has a softer displacement for long-term use, and also has anisotropy due to woven fabric,
In particular, there is a disadvantage that rolling tends to occur at a large amplitude. In order to solve this, there has been conventionally proposed a method of obtaining a damper by injection molding a resin.

[0004]

The resin damper is useful because a small-diameter speaker can be driven with a large amplitude. However, when the diameter is small, a lead wire connecting the voice col 21 and the external lead-out terminal 26 is used. Is difficult to assemble on the damper or in the damper. Therefore, the lead wire 22 is manually laid on the diaphragm 24 and the eyelet 25 is connected to the external lead-out terminal 26 by hand. Therefore, the work was complicated, and the workability for the wiring of the kinshi wire was poor.

The present invention has been made in view of the above circumstances, and in a speaker device using a damper formed by injection molding of a resin, a lead wire is connected to an injection molding die in advance and an external lead terminal connected to the lead wire. And a lead wire can be easily formed on the damper even in a small-diameter resin damper by injection molding on the damper, thereby improving the workability, and a method of manufacturing a damper that facilitates automation and It is an object to provide a speaker device using the damper.

[0006]

According to a first aspect of the present invention, there is provided a speaker device using a damper obtained by injection molding a resin. And an external lead-out terminal connected to the lead wire is placed and injection-molded on the external lead-out terminal. According to a second aspect of the present invention, there is provided the speaker device according to the first aspect, wherein the lead wire is adhered or printed on an insulating sheet, and the lead wire is mounted on a mold and obtained by injection molding. Features. Furthermore, a speaker device according to a third aspect is the speaker device according to the first or second aspect, wherein the lead wire is a kinshi wire. According to a fourth aspect of the present invention, there is provided a speaker device according to the second or third aspect, wherein a flexible film is used as the insulating sheet.

As a result, a lead wire can be easily formed on a small-diameter resin damper even when the damper is used.
A speaker device that can output a large amplitude while having a small aperture can be provided.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a speaker damper in which a resin is injected into a speaker damper-shaped mold and the damper is molded by resin molding. And a step of mounting a lead terminal connected to the lead wire, and a step of injecting the resin into the mold.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a speaker damper in which a resin is injected into a mold having a speaker damper shape, and the damper is formed by resin molding. Having an opening for mounting a voice coil bobbin in the portion, placing a lead wire across the opening in the mold, injecting the resin into the mold, and injecting the resin. Removing the mold and removing the portion of the lead wire present in the opening later.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a speaker damper in which a resin is injected into a speaker damper-shaped mold and the damper is formed by resin molding. Having an opening for mounting a voice coil bobbin, a step of mounting a tinsel wire and an external lead-out terminal connected to the tinsel wire across the opening in the mold, and Injecting the resin,
Removing the mold after the injection and removing a portion of the tinsel wire and the external lead-out terminal connected to the tinsel wire present in the opening. The method of manufacturing a damper according to claim 8 is the same as the method of claim 6 or 7.
Wherein the mold has a shape having a cavity in which no resin is present in the molded speaker damper. Further, the method for manufacturing a damper according to claim 9 is the same as the method according to claims 5 to 8,
The lead wire is characterized in that an external lead-out terminal is connected to a tinsel wire and the lead-out terminal is mounted on the mold. The method for manufacturing a damper according to claim 10 is the same as the method according to claim 9.
Wherein the lead wire is mounted on a flexible film, and the flexible film is mounted on the mold.

Thus, the lead wire including at least the tinsel wire is placed in the injection molding die of the damper, the injection molding die is closed, the resin is injected, and when it is solidified, it is taken out of the die and the voice coil bobbin is removed. By cutting the tinsel wire extending over the opening on the inner periphery of the mold where the tinsel wire is mounted and connecting it to an external lead wire, the workability of wiring the tinsel wire is improved, and automation is facilitated.

[0012]

FIG. 1 is a view cited for explaining a method of manufacturing a damper according to the present invention. As shown in the drawing, among the injection molding dies 17 and 18 used here, the fixed die 18 has an opening 10 for mounting a voice coil bobbin on an inner peripheral portion.

As shown in FIG. 1A, before the injection molding dies 17 and 18 are assembled, a tinsel wire 13 used as a lead wire is placed across the opening 10 as shown in FIG. Although only the tinsel wire is placed first, both the tinsel wire 13 and the external lead-out terminals connected to the tinsel wire 13 may be placed. In addition, as one of the methods for placing the tinsel wire 13, it may be attached to an insulating sheet such as a flexible film or printed, and then placed.

Next, as shown in FIG.
18 is closed, and the resin 19 is injected through a gate provided on one surface of the fixed mold 18. And both molds 17,
After closing the injection molding 18 and elapse of a predetermined time after injection molding, the solidified tinsel wire 13 is removed from the molds 17 and 18. (C) shows the injection molding dies 17, 1 which are pressure-molded as described above.
XY of the voice coil bobbin attached to the opening 10
FIG. Finally, as shown in (d), the tinsel wire 13 extending to the opening 10 on the inner periphery where the voice coil bobbin is mounted is cut into two wires, and the external lead-out terminal 16 is connected. As can be seen from (c) and (d), the injection molds 17 and 18 have a shape such that the molded speaker damper has a cavity 20 in which no resin is present.

[0015]

As described above, according to the present invention, a lead wire including at least a tinsel wire is placed in an injection molding die of a damper, the injection molding die is closed, and the resin is injected and solidified. By taking out from the mold, cutting the tinsel wire across the opening inside the die where the voice coil bobbin is mounted, and connecting it to the external lead wire, the workability of the tinsel wire wiring is improved, and automation is improved. Also becomes easier. In addition, since there is no eyeball solder on the cone paper, a beautiful appearance can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram cited for explaining a method of manufacturing a damper according to the present invention.

FIG. 2 is a diagram illustrating a structure of a general dynamic speaker.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Opening 13 Kinshi wire 16 External lead-out terminal 17 (18) Injection mold 19 Resin 20 Cavity

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masaru Nakagawa, 954, Shiomachi, Murokawa-cho, Mogami-gun, Yamagata Prefecture Inside of Mogami Denki Co., Ltd. (72) Inventor: Kiyomi Shimizu, Shimoya, Murokawa-cho, Mogami-gun, Mogami-gun, Yamagata 954 Shiono F-term in Mogami Denki Co., Ltd. (Reference) 5D012 BA08 BC02 BC03 BC04 CA07 FA04 FA06 HA03 JA02

Claims (10)

[Claims] 1. A speaker device using a damper formed by injection molding of a resin, wherein a lead wire and an external lead-out terminal connected to the lead wire are previously mounted on an injection molding die, and the molded product is injection molded. Speaker device using a damper. 2. The speaker device using a damper according to claim 1, wherein the lead wire is adhered or printed on an insulating sheet, and the lead wire is mounted on the injection molding die and obtained by injection molding. 3. The speaker device according to claim 1, wherein the lead wire is a tinsel wire. 4. The speaker device using a damper according to claim 2, wherein a flexible film is used as the insulating sheet. 5. A method of manufacturing a speaker damper in which a resin is injected into a speaker damper-shaped mold and the damper is formed by resin molding, wherein a lead wire is provided in the mold and a lead terminal connected to the lead wire. And a step of injecting the resin into the mold. A method of manufacturing a damper, comprising: 6. A method of manufacturing a speaker damper in which a resin is injected into a mold having a speaker damper shape and a damper is formed by resin molding, wherein the mold has an opening for mounting a voice coil bobbin on an inner peripheral portion. A step of placing a lead wire across the opening in the mold; a step of injecting the resin into the mold; and removing the mold after the injection to remove the lead wire. Removing a portion existing in the opening. 7. A method of manufacturing a speaker damper in which a resin is injected into a speaker damper-shaped mold and the damper is formed by resin molding, wherein the mold has an opening for mounting a voice coil bobbin on an inner peripheral portion. Placing a tinsel wire and an external lead-out terminal connected to the tinsel wire across the opening in the die; injecting the resin into the die; Removing the mold and removing the portion of the tinsel wire and the external lead-out terminal connected to the tinsel wire present in the opening. 8. The method for manufacturing a damper according to claim 6, wherein the mold has a shape in which a resin-free cavity is formed in a molded speaker damper. 9. The method for manufacturing a damper according to claim 5, wherein the lead wire is configured such that an external lead-out terminal is connected to a tinsel wire and the lead-out terminal is mounted on the mold. 10. The method according to claim 9, wherein the lead wire is mounted on a flexible film, and the flexible film is mounted on the mold.