JP2001210785A - Mounting method of semiconductor integrated circuit and case for mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor integrated circuit, which can improve reliability and mounting efficiency. SOLUTION: A plurality of semiconductor integrated circuits 6 comprising a plurality of pads 7 on their bottom surfaces and upper surfaces are mounted in multiple stages in vertical direction. Here, the semiconductor integrated circuit 6 is heated while it is housed in a mounting case 1 whose size fits to the outline of it, so that a printed board 3 and the semiconductor integrated circuit 6 are electrically connected each other and a plurality of stacked semiconductor integrated circuits 6 are electrically connected each other collectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor integrated circuit suitable for high-density mounting on a printed circuit board and a mounting case used for the mounting method.

[0002]

2. Description of the Related Art In recent years, due to the miniaturization of semiconductor packages, semiconductor integrated circuits such as BGA (ball grid array) and CSP (chip scale package) having a plurality of connection pads on the bottom surface have been widely used. I have.

Further, with the miniaturization of digital electronic devices, it has become necessary to mount packages used in the semiconductor integrated circuit at a high density.

[0004] Therefore, for example, Japanese Patent Application Laid-Open No. 9-69587
A semiconductor integrated circuit is proposed, in which a pad for electrical connection is provided on the upper surface of a BGA component and can be stacked in a vertical direction and mounted.

[0005]

However, as to the mounting method of the stackable BGA package described above, no efficient mounting method has been proposed so far.

Therefore, in the method of stacking the packages and soldering the packages to each other and then mounting the packages on a printed circuit board, or the method of soldering the packages one by one, the heat history of the semiconductor integrated circuit increases and the reliability is secured. However, there is a problem that the mounting efficiency is low and the mounting efficiency is low.

Further, if the connection between the mother substrate and the semiconductor integrated circuit has a BGA-like terminal structure, the mother substrate to be connected includes vias for drawing out wiring from the BGA,
Thin pattern, IVH substrate (Inner Via Hall: closed hole substrate) or BVH substrate (Blind Via Hall: closed hole substrate)
There is a problem that it becomes very expensive, such as a multilayer substrate or a build-up substrate, having high definition specifications.

For example, when manufacturing a board unit on which only one BGA is mounted, only one BGA is used.
Due to the GA alone, a mother board cannot be created with a two-layer board, and a situation occurs in which a four-layer board or a build-up board must be adopted, resulting in a significant increase in cost. there were.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and a first object of the present invention is to secure reliability and enhance mounting efficiency. An object of the present invention is to provide a mounting method of a semiconductor integrated circuit which can be performed.

A second object of the present invention is to provide a method and a case for mounting a semiconductor integrated circuit capable of ensuring reliability, improving mounting efficiency, and reducing costs. Is to provide.

[0011]

According to a first aspect of the present invention, there is provided a method for mounting a semiconductor integrated circuit.
A method for mounting a plurality of semiconductor integrated circuits having a plurality of connection pads on a bottom surface and an upper surface in a vertically multi-stage manner while electrically connecting the semiconductor integrated circuits, wherein the semiconductor integrated circuit is mounted on the semiconductor integrated circuit. By heating in a state where the semiconductor integrated circuit is accommodated in a mounting case adapted to the external size, the electric connection between the printed circuit board and the semiconductor integrated circuit and the electric connection between a plurality of stacked semiconductor integrated circuits are collectively performed. It is characterized by the following.

According to a second aspect of the present invention, there is provided a semiconductor integrated circuit mounting method according to the first aspect, wherein the mounting case has a cylindrical shape. It is characterized by the following.

According to a third aspect of the present invention, there is provided a semiconductor integrated circuit mounting method according to the first or second aspect, wherein the mounting case is made of a conductive material. Alternatively, the cover is made of a material having electromagnetic wave absorption, and a lid made of a material having conductivity or electromagnetic wave absorption is covered and fixed by the conductive fixing material.

In order to achieve the first object, a semiconductor integrated circuit mounting method according to a fourth aspect of the present invention is the semiconductor integrated circuit mounting method according to the third aspect, wherein the conductive fixing material is a conductive adhesive. It is characterized by being an agent.

According to a fifth aspect of the present invention, there is provided a method of mounting a semiconductor integrated circuit, wherein the conductive fixing material is solder. It is characterized by the following.

According to a sixth aspect of the present invention, there is provided a semiconductor integrated circuit mounting method according to the first aspect.
4. The method for mounting a semiconductor integrated circuit according to 2 or 3,
The mounting case is provided with a bottom plate on the lower surface, connection pads with a printed board are provided on the lower surface of the bottom plate, and connection pads with a semiconductor integrated circuit are provided on the upper surface of the bottom plate. Heating one or more semiconductor integrated circuits in the mounting case, thereby electrically connecting the printed circuit board and the semiconductor integrated circuits to each other and connecting the plurality of stacked semiconductor integrated circuits to each other. The electrical connection is performed collectively.

According to another aspect of the present invention, there is provided a semiconductor integrated circuit having a plurality of connection pads on a bottom surface or a plurality of connection pads on a bottom surface and an upper surface. A method for mounting a semiconductor integrated circuit in which one or a plurality of semiconductor integrated circuits having a vertical direction are mounted in multiple stages while electrically connecting the semiconductor integrated circuit, the semiconductor integrated circuit being mounted on the semiconductor integrated circuit in accordance with an outer size of the semiconductor integrated circuit. By heating in a state housed in a case, the electrical connection between the printed circuit board and the semiconductor integrated circuit and the electrical connection between a plurality of stacked semiconductor integrated circuits can be collectively performed. The terminal for connection with the mother board of the mounting case is a lead for surface mounting.

In order to achieve the second object, a method for mounting a semiconductor integrated circuit according to claim 8 is the method for mounting a semiconductor integrated circuit according to claim 7, wherein the mounting case and the mother board are connected to each other. The arrangement of the connection terminals is arranged in four directions along the sides of the mounting case.

According to a ninth aspect of the present invention, there is provided a method of mounting a semiconductor integrated circuit according to the seventh aspect, wherein the mounting case is mounted on a mother board. The arrangement of the connection terminals is arranged in two directions along two parallel sides of the mounting case.

According to another aspect of the present invention, there is provided a semiconductor integrated circuit mounting case having a plurality of connection pads on a bottom surface or a plurality of connection pads on a bottom surface and an upper surface. A case for mounting a semiconductor integrated circuit, which is used when mounting one or more semiconductor integrated circuits having pads in multiple stages in a vertical direction while maintaining electrical connection, wherein the semiconductor integrated circuit has an outer size of the semiconductor integrated circuit. By heating in a state accommodated in the mounting case, the electrical connection between the printed circuit board and the semiconductor integrated circuit and the electrical connection between a plurality of stacked semiconductor integrated circuits can be collectively performed. A surface mounting lead is provided as a terminal for connecting the mounting case of the semiconductor integrated circuit to a mother board.

In order to achieve the second object, a semiconductor integrated circuit mounting case according to claim 11 is a semiconductor integrated circuit mounting case according to claim 10,
An arrangement of terminals for connection of the mounting case to the mother board is arranged in four directions along the sides of the mounting case.

According to a twelfth aspect of the present invention, there is provided a semiconductor integrated circuit mounting case according to the tenth aspect.
An arrangement of terminals for connection of the mounting case to the mother board is arranged in two directions along two parallel sides of the mounting case.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) First, the first embodiment of the present invention will be described.
An embodiment will be described with reference to FIGS.

FIG. 1 is a diagram for explaining a method of mounting a semiconductor integrated circuit according to the present embodiment. The mounting method for mounting a semiconductor integrated circuit by the method of mounting a semiconductor integrated circuit according to the present embodiment. FIG. 2 is a perspective view of a use case. In FIG. 1, reference numeral 1 denotes a rectangular cylindrical mounting case having upper and lower surfaces opened according to the external size of the semiconductor integrated circuit, and is made of metal in the present embodiment. Reference numeral 2 denotes mounting legs for mounting to a printed circuit board, which will be described later, and protrudes from the lower four corners of the mounting case 1.

FIG. 2 is a perspective view of a printed circuit board on which the mounting case 1 shown in FIG. 1 is mounted. In FIG.
Denotes a printed circuit board. When a semiconductor integrated circuit (described as BGA here) is mounted on the printed circuit board 3, the connection pad 4 is located at a position corresponding to the connection pad of the BGA.
Is provided. The printed circuit board 3 is provided with mounting holes 5 at positions corresponding to the mounting legs 2 of the mounting case 1 shown in FIG. The mounting legs 2 are fitted and fixed in these mounting holes 5.

FIG. 3 shows the mounting case 1 shown in FIG.
FIG. 4 is a perspective view showing a state where the display device is attached to the upper surface of a printed circuit board 3 shown in FIG. The mounting leg 2 of the mounting case 1 is inserted and fixed in the mounting hole 5 of the printed circuit board 3.

FIG. 4 is a perspective view showing a state in which two BGAs having connection pads on the bottom surface (lower surface) and the upper surface are housed (inserted) in the mounting case 1 shown in FIG. In the figure, reference numeral 6 denotes a BGA, 7 denotes connection pads provided on the bottom and top surfaces of the BGA 6, and 8 denotes a semiconductor chip provided at the center of the BGA 6.

FIG. 5 shows a case 1 in which two BGAs 6 are mounted.
It is a perspective view showing the state stored and arranged inside. As shown in the figure, two BGAs 6 are stored and arranged in the mounting case 1 in a stacked manner. Connection between the connection pads 4 of the printed circuit board 3 and the connection pads 7 on the bottom surface of the BGA 6 disposed at the bottom and the connection pads 7 on the top surface of the BGA 6 disposed at the bottom and the bottom surface of the BGA 6 disposed thereon The position of the mounting pad 7 is coaxial with the size of the opening on the upper surface of the mounting case 1.

FIG. 6 is a sectional view showing a state in which the BGA 6 is housed and arranged in the mounting case 1. As shown in the figure, it can be seen that two BGAs 6 are positioned by the mounting case 1. It can also be seen that the connection pads 4 on the upper surface of the printed circuit board 3 and the connection pads 7 on the bottom surface of the lowermost BGA 6 match each other. In FIG. 6, between the connection pads 4 on the upper surface of the printed circuit board 3 and the connection pads 7 on the bottom surface of the lowermost BGA 6, and between the connection pads 7 on the upper surface of the lower BGA 6 and the bottom surface of the BGA 6 thereon. A solder ball 9, which is a conductive fixing material, is interposed between the pad 7 and the pad 7.

FIG. 7 is a sectional view showing a state after the printed circuit board 3 in the state of FIG. 6 has been heated by a reflow furnace. As shown in FIG.
0 between the two BGAs 6, 6 and the bottom BGA 6
It can be seen that the printed circuit board 3 and the printed circuit board 3 are electrically connected and fixed.

As described above, by mounting a semiconductor integrated circuit (BGA) using the mounting case according to the present embodiment, it is possible to easily and accurately mount a structure in which semiconductor integrated circuits are stacked. it can. Further, since the mounting of the semiconductor integrated circuit is completed by one heating in the reflow furnace, the heat history of the semiconductor integrated circuit is reduced, and the reliability is improved.

Second Embodiment Next, a second embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. In FIGS. 8 to 10, FIG.
The same parts as those in FIG. 7 are denoted by the same reference numerals.

FIGS. 8 and 9 are perspective views showing a state in which two BGAs 6 are housed and arranged in the mounting case 1 in the semiconductor integrated circuit mounting method according to the present embodiment. 5 differs from FIG. 5 of the first embodiment described above in that a cover 11 is covered on the upper opening of the mounting case 1 in the configuration of FIG. 5 to form a shield configuration.

FIG. 8 is a perspective view showing a state in which the top surface of the mounting case 1 is covered with the lid 11. That is, a lid 11 made of a conductive or electromagnetic wave absorbing material is covered with a conductive fixing material such as a conductive adhesive or solder on the upper surface of a mounting case 1 made of a conductive or electromagnetic wave absorbing material. By coating and fixing, unnecessary radiation generated from the BGA 6 can be shielded.

FIG. 9 is a perspective view showing a state where the lid 11 is fixedly covered on the upper surface of the mounting case 1 from the state of FIG.
As shown in FIG.
The shield structure is formed by covering and fixing the cover 1, and unnecessary radiation generated from the BGA 6 stacked and mounted inside the mounting case 1 can be shielded.

FIG. 10 shows the mounting case 1 from the state of FIG.
FIG. 6 is a cross-sectional view showing a state in which a lid 11 is covered and fixed on the upper surface of the device. As shown in the figure, it can be seen that the BGA 6 is shielded by the lid 11 covered and fixed on the upper surface of the mounting case 1.

(Third Embodiment) Next, a third embodiment of the present invention will be described.
An embodiment will be described with reference to FIGS.

FIG. 11 is a perspective view of a mounting case for mounting a semiconductor integrated circuit by the method for mounting a semiconductor integrated circuit according to the present embodiment. In FIG. 1, reference numeral 1a denotes a rectangular cylindrical mounting case having upper and lower surfaces opened to match the outer size of the semiconductor integrated circuit, and is made of metal in the present embodiment. A bottom plate 12 is provided inside the mounting case 1a.
The bottom plate 12 closes an opening on the lower surface of the mounting case 1a. On the upper surface of the bottom plate 12, a connection pad 13 for connection to the BGA 6 which is a semiconductor integrated circuit is provided.

Incidentally, the mounting case 1 according to the present embodiment.
a is not provided with the mounting leg 2 as in the first embodiment described above.

FIG. 12 shows the mounting case 1a shown in FIG.
FIG. 3 is a perspective view of the device viewed from the lower surface side. As shown in the drawing, pads 14 for connection to a printed board are provided on the lower surface of the bottom plate 12 of the mounting case 1a, and solder balls 9 are arranged thereon.

FIG. 13 shows a mounting case 1a shown in FIG.
FIG. The connection pads 13 provided on the upper surface of the bottom plate 12 of the mounting case 1a and the connection pads 14 provided on the lower surface of the bottom plate 12 are electrically connected in a one-to-one relationship. The solder balls 9 are arranged on the connection pads 14 provided on the lower surface of the bottom plate 12.

FIG. 14 shows the mounting case 1a shown in FIG.
FIG. 5 is a cross-sectional view showing a state in which two BGAs 6 as semiconductor integrated circuits are arranged therein and mounted on a printed circuit board 3a.

The printed circuit board 3 according to the present embodiment
a is not provided with the mounting hole 5 as in the first embodiment described above.

FIG. 15 is a sectional view showing a state after heating through the reflow furnace in the state of FIG. As shown in FIG. 1, the connection pads 4 provided on the printed circuit board 3a and the mounting case 1 are formed of solder 10 in which solder balls 9 are melted.
The connection pads 14 provided on the lower surface of the bottom plate 12 of FIG. 1A, and the connection pads 13 provided on the upper surface of the bottom plate 12 of the mounting case 1a and the lower surface of the BGA 6 disposed at the lowest position. It can be seen that the connection pads 7 are connected to each other and that the two BGAs 6, 6 are connected to each other.

As described above, by mounting the semiconductor integrated circuit (BGA) using the mounting case 1a according to the present embodiment, the mounting is completed by one heating step and the semiconductor integrated circuits are stacked. The structure can be easily mounted.

In FIGS. 14 and 15, reference numeral 8 denotes a BG
A semiconductor chip provided at the center of A6.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS.

FIG. 16 is a perspective view of a mounting case for mounting a semiconductor integrated circuit by the method for mounting a semiconductor integrated circuit according to the present embodiment. In the figure, reference numeral 1b denotes a rectangular box-shaped mounting case having an upper surface opened to match the outer size of the semiconductor integrated circuit, and is made of metal in the present embodiment.

Incidentally, the mounting case 1 in the present embodiment.
a is not provided with the mounting leg 2 as in the first embodiment described above.

Reference numeral 15 denotes a bottom plate of the mounting case 1b, here a printed wiring board. Pads 16 for mounting a BGA 6 which is a semiconductor integrated circuit are provided on the bottom plate 15. The four sides of the bottom plate 15 are provided with surface mounting leads 17.
Are provided like QFPs, and are electrically connected to pads (connection pads) 16 for mounting the BGA 6.

FIG. 17 shows the mounting case 1b shown in FIG.
FIG. As shown in the figure, it can be seen that surface mounting leads 17 are provided in four directions like QFP from each side of the bottom plate 15.

FIG. 18 shows the mounting case 1b shown in FIG.
FIG. 4 is a perspective view showing a state in which is mounted on a mother board. In the figure, reference numeral 6 denotes a semiconductor integrated circuit to be mounted, which is a BGA here. The BGA 6 has connection pads 7 on the upper and lower surfaces so that two BGAs 6 can be mounted in the vertical direction. The BGA 6 is provided with a semiconductor chip 8 at the center.

The size of the opening of the mounting case 1b is BGA
When the BGA 6 is inserted into the mounting case 1b, the inner surface of the mounting case 1b causes the connection pads 7 of the BGA 6 to be connected.
And the position of the bottom plate 15 of the mounting case 1b and the pad 16 for mounting the BGA 6 are set to be coaxial.
Reference numeral 18 denotes a mother board on which the mounting case 1b is mounted. On the upper surface of the mother board 18, connection pads 19 connected to the surface mounting leads 17 provided on the bottom plate 15 of the mounting case 1 b are provided.

FIG. 19 shows that two BGAs 6, 6 are inserted into the mounting case 1b and the bottom plate 15 of the mounting case 1b is inserted.
FIG. 6 is a cross-sectional view showing a state where the mounting is performed by aligning the position of the surface mounting lead 17 provided on the mother board 18 with the connection pad 19 provided on the upper surface of the motherboard 18. As shown in the figure,
Two BGAs 6 are stacked and arranged in the mounting case 1b, and solder balls 9 are arranged on connection pads 7 provided on the lower surface of the BGA 6.

FIG. 20 shows the mother substrate 18 in the state shown in FIG.
FIG. 3 is a cross-sectional view illustrating a state after heating by a reflow furnace. As shown in FIG.
It can be seen that the connection pads 7 and the BGA mounting pads 16 provided on the bottom plate 15 of the mounting case 1b are connected to each other. At the same time, the surface mounting leads 17 provided on the bottom plate 15 of the mounting case 1b are provided.
And connection pads 19 provided on the upper surface of the mother substrate 18
Are electrically connected by a normal surface mounting method using solder.

As described above, by mounting a semiconductor integrated circuit (BGA) using the mounting case of this embodiment, a structure in which semiconductor integrated circuits are stacked can be simply and accurately mounted. . Further, since the mounting is completed by one heating in the reflow furnace, the heat history to the semiconductor integrated circuit is reduced, and the reliability can be improved. Furthermore, since the connection between the mounting case and the motherboard is performed using surface-mount type leads, it is possible to mount on a low-cost two-layer board that does not use vias or high-definition patterns for drawing out wiring. it can.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS.

In FIGS. 21 to 23, the same parts as those in FIGS. 16 to 20 of the fourth embodiment are denoted by the same reference numerals.

FIG. 21 is a perspective view of a mounting case for mounting a semiconductor integrated circuit by the method for mounting a semiconductor integrated circuit according to the present embodiment. In this embodiment, the arrangement of the surface mounting leads 17 is the same as that of the bottom plate 15 of the mounting case 1b.
Are provided on two parallel sides of the SOP like the bottom plate 15.
Are electrically connected to pads 16 for mounting the BGA 6 provided on the upper surface of the BGA 6.

FIG. 22 shows the mounting case 1b shown in FIG.
FIG. As shown in the figure, it can be seen from the two parallel sides of the bottom plate 15 that the surface mounting leads 17 are provided in an SOP manner.

FIG. 23 shows a mounting case 1b shown in FIG.
FIG. 4 is a perspective view showing a state in which is mounted on a mother board. In the figure, reference numeral 6 denotes a semiconductor integrated circuit to be mounted, which is a BGA here. The BGA 6 has connection pads 7 on the upper and lower surfaces so that two BGAs 6 can be mounted in the vertical direction. The BGA 6 is provided with a semiconductor chip 8 at the center.

In the state shown in FIG.
Is inserted into the mounting case 1b and then heated for solder connection by a reflow furnace in the same manner as in the above-described fourth embodiment, so that a plurality of BGAs 6 are made SOP-like and low-definition and low-cost. Can be mounted on the mother substrate 18 by heating once.

(Sixth Embodiment) Next, a sixth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. 24 and 25.

In FIGS. 24 and 25, the same parts as those in FIGS. 19 and 20 of the fourth embodiment are denoted by the same reference numerals.

FIGS. 24 and 25 are the same as FIGS. 19 and 20 of the above-described fourth embodiment in the method of mounting a semiconductor integrated circuit according to the present embodiment.

This embodiment differs from the fourth embodiment in the shape of the surface mounting lead. The lead 17a for surface mounting according to the present embodiment is the same as the lead 1 for surface mounting of the gull wing type according to the fourth embodiment.
Unlike the 7 type, it is a J-lead type.

As shown in FIG. 25, it can be seen that the BGA 6, the mounting cage 1b, and the connection pads 19 of the mother board 18 are electrically connected simultaneously by one heating in the reflow furnace.

As described above, by mounting the semiconductor integrated circuit using the mounting cage 1b according to the present embodiment, the mounting is completed by one heating step and the semiconductor integrated circuit is stacked. The mounting can be easily performed, and further, by using the surface mounting leads, the mounting can be performed on the motherboard without using an expensive high-definition wiring board.

[0070]

As described in detail above, according to the semiconductor integrated circuit mounting method of the present invention, reliability can be ensured, and
Mounting efficiency can be improved.

According to the semiconductor integrated circuit mounting method and the mounting case of the present invention, reliability can be ensured, mounting efficiency can be increased, and cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a mounting case used in a method of mounting a semiconductor integrated circuit according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a printed circuit board to which the mounting case shown in FIG. 1 is attached.

FIG. 3 is a perspective view showing a state where the mounting case shown in FIG. 1 is mounted on the printed circuit board shown in FIG. 2;

FIG. 4 is a perspective view showing a state where a semiconductor integrated circuit (BGA) is housed and arranged in a mounting case shown in FIG. 3;

5 is a perspective view showing a state in which a semiconductor integrated circuit (BGA) is housed and arranged in the mounting case shown in FIG. 3;

6 is a cross-sectional view showing a state where a semiconductor integrated circuit (BGA) is housed and arranged in the mounting case shown in FIG. 3;

7 is a cross-sectional view showing a state after a semiconductor integrated circuit (BGA) is housed and arranged in a mounting case shown in FIG. 3 and heated.

FIG. 8 is a perspective view showing a state where a lid is covered on a mounting case used in a method of mounting a semiconductor integrated circuit according to a second embodiment of the present invention.

FIG. 9 is a perspective view showing a state where a lid is covered on a mounting case used in a method of mounting a semiconductor integrated circuit according to a second embodiment of the present invention.

FIG. 10 is a perspective view showing a state after a lid is covered and heated for a mounting case used in a method of mounting a semiconductor integrated circuit according to a second embodiment of the present invention.

FIG. 11 is a perspective view of a mounting case used in a method of mounting a semiconductor integrated circuit according to a third embodiment of the present invention.

FIG. 12 is a perspective view of the mounting case shown in FIG. 11 as viewed from a lower surface side.

FIG. 13 is a sectional view of the mounting case shown in FIG. 11;

FIG. 14 is a cross-sectional view showing a state where the BGA is housed and arranged in the mounting case shown in FIG. 11 and mounted on a printed circuit board.

FIG. 15 is a cross-sectional view showing a state after the BGA is housed and placed in the mounting case shown in FIG. 11, placed on a printed circuit board, and heated.

FIG. 16 is a perspective view of a mounting case used in a method of mounting a semiconductor integrated circuit according to a fourth embodiment of the present invention.

FIG. 17 is a plan view of the mounting case shown in FIG. 16;

18 is a perspective view showing a state in which the mounting case shown in FIG. 16 is placed on a mother board and a BGA is housed and arranged in the mounting case.

19 is a cross-sectional view showing a state where the BGA is housed and arranged in the mounting case shown in FIG. 11 and the mounting case is mounted on the motherboard.

20 is a cross-sectional view showing a state after the BGA is housed and arranged in the mounting case shown in FIG. 11, and the mounting case is placed on a mother board and heated.

FIG. 21 is a perspective view of a mounting case used in a method of mounting a semiconductor integrated circuit according to a fifth embodiment of the present invention.

FIG. 22 is a plan view of the mounting case shown in FIG. 21;

23 is a perspective view showing a state in which the mounting case shown in FIG. 21 is placed on a motherboard and a BGA is housed and arranged in the mounting case.

24 is a cross-sectional view showing a state where the BGA is housed and arranged in the mounting case shown in FIG. 21 and the mounting case is mounted on the motherboard.

25 is a cross-sectional view showing a state after the BGA is housed and arranged in the mounting case shown in FIG. 21 and the mounting case is placed on a motherboard and heated.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mounting case 1a Mounting case 1b Mounting case 2 Mounting leg 3 Printed circuit board 3a Printed circuit board 4 Connection pad 5 Mounting hole 6 Semiconductor integrated circuit (BGA) 7 Connection pad 8 Semiconductor chip 9 Solder ball 10 Solder 11 Cover 12 Bottom plate 13 Connection pad 14 Connection pad 15 Bottom plate 16 Mounting pad 17 Lead for surface mounting 17a Lead for surface mounting 18 Mother board 19 Connection pad

Claims (12)

[Claims] 1. A method for mounting a plurality of semiconductor integrated circuits having a plurality of connection pads on a bottom surface and an upper surface in a vertically multi-stage manner while electrically connecting the plurality of semiconductor integrated circuits. By heating the semiconductor integrated circuit in a mounting case adapted to the external size of the semiconductor integrated circuit, the printed circuit board and the semiconductor integrated circuit are electrically connected to each other and the plurality of stacked semiconductor integrated circuits are electrically connected to each other. A packaged semiconductor integrated circuit. 2. The method according to claim 1, wherein the mounting case has a cylindrical shape. 3. The mounting case is made of a conductive or electromagnetic wave absorbing material, and a cover made of a conductive or electromagnetic wave absorbing material is covered and fixed by a conductive fixing material. Claim 1.
Or the mounting method of the semiconductor integrated circuit according to 2. 4. The method according to claim 3, wherein the conductive fixing material is a conductive adhesive. 5. The method according to claim 3, wherein the conductive fixing material is solder. 6. A bottom plate is provided on a lower surface of the mounting case, pads for connection to a printed circuit board are provided on a lower surface of the bottom plate, and an upper surface of the bottom plate is provided for connection with a semiconductor integrated circuit. Pads are provided, and by heating the one or more semiconductor integrated circuits stored in the mounting case, the printed circuit board and the semiconductor integrated circuits are electrically connected to each other and a plurality of stacked semiconductor integrated circuits are stacked. 4. The method of mounting a semiconductor integrated circuit according to claim 1, wherein the electrical connection between the semiconductor integrated circuits is performed collectively. 7. A semiconductor integrated circuit having a plurality of connection pads on a bottom surface or a single or a plurality of semiconductor integrated circuits having a plurality of connection pads on a bottom surface and an upper surface are mounted in multiple stages in a vertical direction while making electrical connection. A method of mounting a semiconductor integrated circuit, wherein the semiconductor integrated circuit is heated in a state where the semiconductor integrated circuit is housed in a mounting case corresponding to the outer size of the semiconductor integrated circuit, so that a printed board and the semiconductor integrated circuit are electrically connected to each other. The connection and the electrical connection among the plurality of stacked semiconductor integrated circuits can be performed collectively, and the connection terminal of the semiconductor integrated circuit with the mother board of the mounting case is a lead for surface mounting. Characteristic mounting method of a semiconductor integrated circuit. 8. The semiconductor integrated circuit according to claim 7, wherein the arrangement of the connection terminals of the mounting case with the mother board is arranged in four directions along the sides of the mounting case. Implementation method. 9. The semiconductor according to claim 7, wherein an arrangement of terminals for connection of the mounting case to a mother board is arranged in two directions along two parallel sides of the mounting case. How to mount an integrated circuit. 10. A semiconductor integrated circuit having a plurality of connection pads on a bottom surface or a single or a plurality of semiconductor integrated circuits having a plurality of connection pads on a bottom surface and an upper surface are mounted in multiple stages in a vertical direction while making electrical connection. A printed circuit board and the semiconductor integrated circuit by heating the semiconductor integrated circuit in a state where the semiconductor integrated circuit is accommodated in the mounting case according to the external size of the semiconductor integrated circuit. The electrical connection of the semiconductor integrated circuit and the electrical connection of a plurality of stacked semiconductor integrated circuits can be collectively performed, and as a terminal for connection with the mother board of the mounting case of the semiconductor integrated circuit, for surface mounting. A case for mounting a semiconductor integrated circuit, wherein leads are provided. 11. The semiconductor integrated circuit according to claim 10, wherein the arrangement of the terminals for connection of the mounting case to the motherboard is arranged in four directions along the sides of the mounting case. Mounting case. 12. An arrangement of terminals for connection of the mounting case to a mother board in two directions along two parallel sides of the mounting case.
0. A case for mounting the semiconductor integrated circuit according to 0.