JP2001297973A - Positioning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a positioning device by which the air space of a static pressure bearing is not reduced by the own weight of a support even in the case of the static pressure bearing has a pressure in a vertical direction. SOLUTION: The positioning device is provided with a top plate 4 supported by a base plate 1 and a static pressure bearing opposed to it at least in one direction with respect to the base plate 1, and has a force generating mechanism which makes moving elements including the base plate 1 or the top 4 generate a force in the reverse direction of the force G. The force generating mechanism generates a force in the reverse direction of a specified force by porous pads 7u and 7d as static pressure bearing mechanism or a magnetic force. The supply pressure is individually adjusted for the opposed static pressure bearings.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning apparatus having a guide structure using a hydrostatic bearing which is frequently used in a projection exposure apparatus, various precision processing machines, various precision measuring instruments and the like used in a lithography process such as semiconductor manufacturing. It is about.

[0002]

2. Description of the Related Art In a projection exposure apparatus, various precision processing machines, various precision measuring instruments, and the like used in a lithography process such as semiconductor manufacturing, a substrate such as a wafer to be exposed, a workpiece, or a workpiece is measured with high precision. Positioning is required. In recent years, a positioning device having a guide configuration using a hydrostatic bearing has been frequently used.

A first conventional example is disclosed in, for example,
No. 67823 discloses a positioning device having a guide configuration using a hydrostatic bearing. In the first conventional example, the support direction of the hydrostatic bearing is mostly horizontal, and in order to increase the so-called bearing rigidity, which is the rigidity in the support direction, a hydrostatic bearing opposed from both sides is configured. Generally, it is a so-called constraint type.

As a second conventional example, there is a positioning device having a guide structure using a hydrostatic bearing disclosed in, for example, Japanese Patent Application Laid-Open No. 3-245932, and an X-stage which is a moving body in a horizontal plane direction. The hydrostatic bearings configured in the lateral direction are also of a constrained type and are guided in the horizontal direction.

[0005]

However, according to the above prior art, the following problems may occur depending on the method of use. For example, a case where the first conventional example is used in a plane including a vertical plane will be described with reference to FIG. FIG. 8 is a sectional view of a positioning device according to a conventional example. Here, 1 indicates a base plate, 2 indicates a guide member, and 3 indicates a bearing holding member. Reference numeral 4 denotes a top plate, 5 denotes a Z linear motor, and 6 denotes a θ linear motor. In addition, 7
Denotes a hydrostatic bearing, 10 denotes a supply tube, and 15 denotes a wafer. The arrow in the figure indicates the direction of gravity, and G is the gravitational acceleration.

In the case of FIG. 8, the direction of support by the hydrostatic bearing is vertical. Hydrostatic bearing 7, since that will support the weight m of the top plate 4 is movable body, a gap h _u and the lower gap h _d above the hydrostatic bearing 7 is not a same. Then, assuming that the bearing rigidity is k, a variation of mg / 2k occurs. In particular, in the first conventional example, due to this variation, the upper gap h _u becomes smaller than the target, and as a result, the required stroke of the positioning device may not be sufficient.

The above applies to the second conventional example, and the clearance of the lateral guide of the x stage is reduced by the weight of the x stage. In the worst case, the upper clearance _hu becomes zero, and troubles such as contact of the hydrostatic bearing occur.

The present invention has been made in view of the above-mentioned problems of the prior art. Even in a static pressure bearing having a restraining direction in the vertical direction, the gap (air gap) of the bearing is limited. It is an object of the present invention to provide a positioning device that is not reduced by its own weight.

[0009]

In order to achieve the above object, a positioning device according to the present invention comprises a base plate, a hydrostatic bearing provided opposite to the base plate, and the hydrostatic bearing. A top plate supported in at least one predetermined direction with respect to the base plate;
The movable body including the base plate or the top plate has a force generating mechanism for generating a force in a direction opposite to the predetermined direction.

In the present invention, the predetermined direction is a vertical direction, and the force in the predetermined direction includes the gravity of the movable body.

Further, it is preferable that the force generating mechanism is the static pressure bearing and generates the reverse force by static pressure. Further, it is preferable that the force generating mechanism generates the reverse force by a magnetic force. Further, it is preferable that the supply pressures of the opposed hydrostatic bearings are independently adjusted. Preferably, the opposed hydrostatic bearing is further divided into a plurality of parts, and the supply pressure is independently adjusted.

It is preferable that the static pressure bearing forms a part or the whole of a cylinder provided in the positioning device. The positioning device may be configured to move the top plate in a central axis direction of the cylinder with respect to the base plate.
And a second drive mechanism for rotating the top plate around the center axis of the cylinder with respect to the base plate. Further, it is preferable that the first drive mechanism is disposed at at least three places at different positions in the circumferential direction of the cylinder, and the top plate is inclined with respect to the base plate. Further, it is preferable that the second drive mechanism is arbitrarily disposed between at least three first drive mechanisms. Preferably, the first drive mechanism and / or the second drive mechanism is a linear motor.
Further, the hydrostatic bearing may have a planar shape. And it is preferable that the said static pressure bearing is a porous throttle type. Further, the hydrostatic bearing can have an exhaust mechanism.

[0013] The positioning device of the present invention is characterized in that a y-stage having a degree of freedom in the y-direction, which is a direction along the vertical direction, and a first surface opposing both surfaces of the y-stage being guide surfaces.
An x stage having a degree of freedom in an x direction, which is a direction intersecting the y stage with the y stage by the hydrostatic bearing,
A z-direction and / or a z-axis rotation direction which is mounted on the x-stage and has a cylindrical shape, and which intersects a surface including the x-direction and the y-direction by a second hydrostatic bearing opposed thereto. And at least three z stages provided between the x stage and the fine stage, each having a degree of freedom, and driven in the z direction.
A positioning device comprising a drive mechanism and a z-axis rotation drive mechanism driven in the z-axis rotation direction, wherein a force in a predetermined direction is applied in the y-direction, wherein between the y-stage and the x-stage, or A force generating mechanism is provided between the x stage and the fine movement stage for generating a force in a direction opposite to the force in the predetermined direction.

The y direction is a vertical direction, and the force in the predetermined direction includes gravity of a movable body including the x stage and / or the fine movement stage. Further, it is preferable that the force generating mechanism is the first and / or second static pressure bearing, and generates a force in a direction opposite to the force in the predetermined direction by a static pressure. Further, it is preferable that the force generating mechanism generates a force in a direction opposite to the force in the predetermined direction by a magnetic force.

The supply pressures of the opposing first hydrostatic bearings can be independently adjusted. Also,
The supply pressures of the opposing second hydrostatic bearings can be independently adjusted. Further, the force generating mechanism includes:
Preferably, the adjustment is made in accordance with the fluctuation of the force in the predetermined direction. The force generating mechanism is preferably an electromagnet. Further, it is preferable to use the positioning device.

A method of manufacturing a semiconductor device using an exposure apparatus according to the present invention comprises the steps of: installing a manufacturing apparatus group for various processes including the exposure apparatus in a semiconductor manufacturing plant; and performing a plurality of processes using the manufacturing apparatus group. And a step of manufacturing

A step of connecting the group of manufacturing apparatuses via a local area network; and a step of data communication between at least one of the group of manufacturing apparatuses between the local area network and an external network outside the semiconductor manufacturing plant. And the step of performing.

Further, a database provided by a vendor or a user of the exposure apparatus is accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory. And data communication via the external network to perform production management.

A semiconductor manufacturing plant accommodating the exposure apparatus of the present invention includes a manufacturing apparatus group for various processes including the above-described exposure apparatus, a local area network connecting the manufacturing apparatus group, and a local area network connected to the outside of the factory. The information processing apparatus may include a gateway that enables access to an external network, and may enable data communication of information on at least one of the manufacturing apparatuses.

The method for maintaining an exposure apparatus according to the present invention is a method for maintaining an exposure apparatus installed in a semiconductor manufacturing plant,
A step of providing a maintenance database connected to an external network of a semiconductor manufacturing plant by a vendor or a user of the exposure apparatus, and a step of permitting access to the maintenance database from the inside of the semiconductor manufacturing factory via the external network. Transmitting the maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network.

The exposure apparatus according to the present invention is the exposure apparatus, wherein a display, a network interface,
A computer that executes network software, so that the maintenance information of the exposure apparatus can be data-communicated via a computer network.

Furthermore, the network software provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed. Then, it is possible to obtain information from the database via the external network.

[0023]

[Effects] Even if a predetermined force such as gravity acts in the supporting direction of the restraint type static pressure bearing, the gap between the static pressure bearings is not reduced by the force generating mechanism. Therefore, the performance of the hydrostatic bearing is not impaired, and the original characteristics of the positioning device can be exhibited.

[0024]

Next, embodiments of the present invention will be described with reference to the drawings. [First Embodiment] FIG. 1 is a longitudinal sectional view of a positioning apparatus for a wafer lifting stage according to a first embodiment of the present invention. The vertical direction (vertically downward) is as shown by the arrow, and G indicates the gravitational acceleration. The vertical direction of the paper is defined as the x-axis, and the vertical direction of the paper, which is the vertical direction, is defined as the y-axis. And the x axis, y
A plane including the axis is defined as an xy plane, and a direction perpendicular to the xy plane is defined as z.
Axis. The tilt stage holds a wafer 15 as a substrate, and has at least four degrees of freedom of z, θx, θy, and θz. The holding target is not limited to the wafer.

FIG. 2 is an xy plan view of the wafer tilt stage positioning apparatus according to the present embodiment, and FIG. 3 is a sectional view taken along line A-C of FIG. By the way, FIG. 1 shows A in FIG.
-B corresponds to a cross-sectional view. Hereinafter, FIGS. 1, 2, and 3
The first embodiment will be described with reference to FIG.

The positioning apparatus according to the present embodiment includes a base plate 1 serving as an xy stage member, a guide member 2 serving as a cylindrical support mechanism provided integrally with the base plate 1, and a guide member 2 perpendicular to the base plate 1. A cylindrical bearing holding member 3 which fits on the outer peripheral surface of the guide member 2 which is a supporting surface, a top plate 4 integrally connected to the left end of the bearing holding member 3 in the figure, and a top plate 1 Three Z linear motors 5a to 5c as a first drive mechanism for moving toward and away from (moving in the direction of the central axis of the cylinder)
And one θ linear motor 6 as a second drive mechanism for rotating the top plate 4 with respect to the base plate 1 (rotating around the central axis of the cylinder). Further, 7u and 7d are porous pads, 8u and 8d are supply grooves, 10u and 10d are supply tubes, and 11a, 11b and 11c are displacement sensors, respectively. Further, the top plate 4 is provided with a chuck 14 for holding the wafer 15 by suction and a position measuring mirror 16.

An outer peripheral surface of the guide member 2 and an inner peripheral surface of the bearing holding member 3 are formed by a porous (cylindrical) porous restriction type hydrostatic bearing mechanism held on the outer peripheral surface of the guide member 2. Are supported in a non-contact manner by the static pressure of the pressurized fluid ejected from the quality pads 7u and 7d. Therefore, the top plate 4, which is a movable body in the present embodiment, is reciprocally movable along the z-axis, and is rotatable around the z-axis (θz). Further, it is possible to tilt the z-axis within the range of the bearing gap between the porous pads 7u and 7d. Further, by reducing the dimension of the porous pads 7u and 7d in the z-axis direction, the tolerance of the tilt angle (θx, θy) with respect to the z-axis can be increased.

The pressure supply to the porous pads 7u and 7d is divided into an upper part (7u) and a lower part (7d). The upper porous pad 7u is supplied with a supply groove 8u and a supply tube 10u. High pressure air is supplied by an upper pressure regulator (not shown). Also, the lower porous pad 7d
High-pressure air is supplied from the lower pressure regulator (not shown) through the supply groove 8d and the supply tube 10d.
The upper supply pressure and the lower supply pressure can be adjusted independently.

Next, an actual adjustment method will be described. First, the nominal gap between the porous pads 7u and 7d and the guide member 3 is measured in advance by itself. The nominal gap is about 7 μm. Next, the pressure supplied to the upper porous pad 7u and the lower porous pad 7d is reduced to zero while the base plate 1 is fixed to the xy plane while being incorporated in the positioning device described above. As a result, the upper porous pad 7u of the top plate 4 lands on the guide member 2 of the base plate 1. At this time, the bearing surfaces of the porous pads 7u and 7d and the guide member 2
It is a matter of course that it is assumed that are parallel. The position of the top plate 4 in the y direction in this state is measured by, for example, a laser interferometer using the mounted position measurement mirror 16. Next, the upper supply pressure and the lower supply pressure are adjusted to a constant pressure. At this time, if the floating amount of the top plate 4 is about 5 μm, the upper supply pressure is further increased, and the lower supply pressure is decreased, so that the floating amount is adjusted to 7 μm, which is the nominal gap. Also at this time, it is needless to say that the bearing surfaces of the porous pads 7u and 7d and the guide member 2 are in parallel. By this adjustment, the top plate 4 can be used with respect to the base plate 1 without reducing the gap of one of the hydrostatic bearings. Also, there is almost no decrease in bearing rigidity.

In the present embodiment, the porous pads 7u,
Even if 7d is used integrally, there is no problem if the supply grooves 8u and 8d are completely divided into two. Further, the porous pads 7u,
There is no problem if the 7d is divided into two parts as in this embodiment, or into many parts for convenience of manufacture. Also, there is no problem if an orifice throttle or a self-generated throttle is used as the hydrostatic bearing, instead of being porous.

The Z linear motors 5a to 5c are arranged outside the bearing holding member 3 at equal intervals in the circumferential direction of the cylinder. The mover 5d of each of the Z linear motors 5a to 5c has a permanent magnet on the inner surface. In addition, each Z linear motor 5a
The stators 5e to 5c are coils fixed to the base plate 1, and are connected to a predetermined drive circuit by wiring (not shown).
The mover 5d is driven in the z-axis direction according to the amount of current supplied from the drive circuit. If the amount of current supplied to each of the Z linear motors 5a to 5c is the same, the top plate 4 moves in the z-axis direction while maintaining its flatness. By individually changing the amount of current supplied to each of the Z linear motors 5a to 5c, the flatness of the top plate 4, that is, the tilt angle with respect to the z-axis can be changed.

As shown in FIG. 1, the θ linear moke 6 is disposed between any two of the Z linear motors 5a to 5c adjacent to each other, and the mover 6a has a permanent magnet on the inner surface. The stator 6b of the θ linear motor 6 is a coil fixed to the base plate 1, is connected to a predetermined drive circuit by wiring (not shown), and moves the movable element 6a in accordance with the amount of current supplied from the drive circuit. It is driven in the circumferential direction of the plate 4, and the top plate 4
Rotate around an axis.

The base plate 1 has three non-contact displacement sensors 11a to 11c adjacent to the Z linear motors 5a to 5c. Each of the displacement sensors 11a to 11c has a detection end facing the illustrated lower surface of the top plate 4, and detects a change in the position of the top plate 4 in the z-axis direction. The output of each of the displacement sensors 11a to 11c is
By feeding back to the above-described drive circuit, fine movement positioning of the top plate 4 can be automatically performed.

In this embodiment, the Z linear motors 5a to 5c and the θ linear motor 6 are individually driven on the base plate 1. Further, since the top plate 4 and the base plate 1 are not in contact with each other, there is no possibility that a large vibration is generated while the top plate 4 is moving. In this embodiment, the Z linear motors 5a to 5c
Although three places are provided at different positions in the circumferential direction of the cylinder, the present invention is not limited to three places, and a plurality of places may be suitably provided.

When the flatness of the top plate 4 is changed,
That is, when the tilt angle with respect to the z-axis is changed (when the top plate 4 is inclined with respect to the base plate 1), the bearing gap between the porous pads 7u and 7d changes accordingly. However, in a positioning device that performs focusing and final positioning of the exposure device, such a change is very small, and there is no risk that the porous pads 7u and 7d and the guide member 2 come into contact with each other.

FIG. 4 is an enlarged sectional view showing the bearing gap portion of FIG. 1 in this embodiment in an enlarged manner. 4, the same reference numerals as those in FIGS. 1 to 3 indicate the same components as those in FIGS. As shown in FIG. 4, for example, when the diameter d of the bearing surface of the porous pad 7, the dimension w in the z-axis direction, and the dimensions h ₁ and h ₂ of both ends of the bearing gap, d = 200 mm, w
= 20 mm, fine adjustment amount α of tilt angle of top plate 4 is 3 × 1
If it is 0 ^-4 rad, the variation (h ₁ -h ₂ ) / 2 of the dimension of the bearing gap (gap) is about 3 μm. However, as described above, there is no problem because the gap size of the porous pad 7 is set to 7 μm. The stroke length of the mover of each linear motor can be up to about 5 mm.

[Second Embodiment] In the above-described first embodiment, the radial hydrostatic bearing has been described. In this embodiment, an xy stage device using a flat hydrostatic bearing will be described. FIG. 5 shows xy using a flat hydrostatic bearing.
FIG. 3 is a longitudinal sectional view of a stage positioning device. 5, the same reference numerals as those in FIGS. 1 to 3 indicate the same components as those in FIGS.

As a configuration of the xy stage positioning device, for example, a moving guide device disclosed in Japanese Patent Application Laid-Open No. Hei 3-245932 is preferable, and a tilt stage as in the first embodiment is mounted. The y stage 60 has a degree of freedom about one axis in the y direction, which is the vertical direction. Reference numeral 51 denotes an x stage, which is guided by a combination of a hydrostatic bearing pad 55 and a suction magnet 56 with respect to a reference surface 50, and can move on an xy plane. The tilt stage, which is the fine movement stage described in the first embodiment, is mounted on the base plate 1 integrally formed with the x stage. Here, the porous pad 7 used for the positioning device of the tilt stage is used.
u and 7d are used as a second hydrostatic bearing mechanism. x stage 51
Is a plane porous pad 57 which is a first hydrostatic bearing mechanism.
u, 57d constrain the y stage 60.
At this time, the upper planar porous pad 57u and the lower planar porous pad 57d are supplied independently.
Adjustment can be performed so that the gap of the hydrostatic bearing formed on the upper planar porous pad 57u is not narrowed by the weight of the tilt stage and / or the x stage.

[Third Embodiment] In this embodiment, as in the second embodiment, the first and second hydrostatic bearings to be used are independently supplied and the supply pressure is adjusted independently. This makes it possible to support the weight of the movable body (top plate or the like) without narrowing the gap between the hydrostatic bearings. As a third embodiment, a case where another supporting mechanism (force generating mechanism) may be provided instead of air for supporting its own weight will be described. For example, FIG. 6 shows an example in which the movable body is supported by its own weight using a magnetic force. 6, the same reference numerals as those in FIGS. 1 to 3 denote the same components as those in FIGS.

In the radial hydrostatic bearing of the tilt stage described in the first embodiment and the planar hydrostatic bearing of the xy stage described in the second embodiment, the lower porous pad 7d and the lower Flat porous pad 57d
Are provided with permanent magnets 12, 62 or an electromagnet. Then, by generating magnetic attraction, it is possible to eliminate the own weight. At this time, the guide member 2 and the y stage 60 must be magnetic materials.

[Fourth Embodiment] In the first to third embodiments described above, most are used at atmospheric pressure.
However, for example, when used in a reduced pressure atmosphere, FIG.
The present invention may be applied to a hydrostatic bearing having an exhaust mechanism as shown in FIG. FIG. 7 is a vertical sectional view of an xy stage positioning device using a hydrostatic bearing having an exhaust mechanism used in a reduced-pressure atmosphere in the fourth embodiment. 7, the same reference numerals as those in FIGS. 1 to 3 indicate the same components as those in FIGS. The working fluid ejected from the hydrostatic bearing pad 7 passes through the exhaust groove 21 and is exhausted from the tube 23 connected to the exhaust pump.

[Fifth Embodiment] In the first to fourth embodiments described above, when the constrained type hydrostatic bearing in the conventional example is configured in the vertical direction, the gap between the hydrostatic bearings due to its own weight of the support is used. Is an example of one of them becoming narrower. However, the present invention can be applied to a case where a certain force (predetermined force) acts on the surface of the constrained type hydrostatic bearing and one of the gaps of the hydrostatic bearing is narrowed even if it is not in the vertical direction.

[Sixth Embodiment] In the above-mentioned conventional example, it is expected that the weight of the supported object is constant and the fluctuation amount is not so large. However, for example, there is no problem if the present invention is applied to a positioning device that holds and positions an object that is not a wafer but is heavier and has a large amount of fluctuation. In such a case, there is no problem even if a servo system capable of adjusting the supply pressure to the hydrostatic bearing in accordance with the fluctuation of the force applied to the hydrostatic bearing.

At this time, the time constant of the servo system must be low. For example, if an electromagnet as in the third embodiment is used, a servo system with a fast time constant can be constructed. .

Seventh Embodiment FIG. 14 is a perspective view showing a case where the positioning apparatus according to the present invention is mounted on an XY stage for positioning in a substantially vertical plane, and FIG.
3 is a YZ plane partial cross-sectional view of FIG. A base plate 719 is disposed substantially horizontally, and a surface plate 720 is mounted substantially vertically. A Y stage 721 that is reciprocally movable in the Y-axis direction (vertical or an approximate direction thereof) along a standing reference surface 720a of the surface plate 720, and an X that is reciprocally movable in the X-axis direction on the Y stage 721. The stage 722 includes a pair of Y linear motors 723 (only one of the pair is shown), which are first driving means for moving the Y stage 721 in the Y axis direction, and an X stage 722 in the X axis direction. An XY stage having an X linear motor 724 as a second driving means for moving is constituted.

The base plate 720 is an XY guide which is a reference surface for supporting the back surfaces of the Y stage 721 and the X stage 722 in a non-contact manner through an air pad 725 and a magnetic pad 731 which are partially shown hydrostatic bearing devices. It has a surface 720a. A Y stage 72 is provided at one end of the surface plate 720 in the X-axis direction.
Y guide 72 which is a yaw guide that guides 1 in the Y-axis direction
6 (indicated by a two-dot chain line), and the Y guide 726
Between the guide surface 726a and the Y stage 721, an air pad 727 and a magnetic pad 72 which are a yaw guide static pressure bearing device
8 keeps it out of contact. The magnetic pad 728 has a function of generating a preload in a direction opposite to the levitation force of the air pad 727 to maintain a desired gap and obtain a desired bearing rigidity. When both Y linear motors 723 are driven, the Y stage 721 moves along the Y guide 726 on the XY guide surface 720a of the surface plate 720.

The Y stage 721 has a pair of Y sliders 72.
1a and 721b and a frame body composed of an X linear motor stator 724b supported at both ends thereof. In the Y stage 721, the back surfaces of both Y sliders 721a and 721b face the XY guide surface 720a of the platen 720, and the air pad 72
5, supported in a non-contact manner via a magnetic pad (not shown). The operation of the magnetic pad is as described above. The side surface 721c of the Y slider 721a faces the Y guide surface 726a of the Y guide 726, and is guided in a non-contact manner via the air pad 727 and the magnetic pad 728 as described above. The operation of the magnetic pad is as described above. Both Y sliders 721a and 721b are integrally connected to Y linear motor mover 723a by connecting plate 729, respectively.

The X stage 722 is a hollow frame, and an X linear motor stator 724b penetrates the hollow portion. An air pad 732 of a hydrostatic bearing device is provided in a hollow portion of the X stage 722. The X stage 722 is provided on both sides 724c and 724d of the X linear motor stator 724b through which the air pad 732 passes through the hollow portion.
And is supported by the X linear motor stator 724b in a non-contact manner.

Both Y linear motors 723 are connected to the Y slider 7 of the Y stage 721 via the connecting plate 729 as described above.
It has a Y linear motor mover 723a integrally connected to 21a and 721b, and a Y linear motor stator 723b penetrating through the opening. Then, both Y linear motors 723 apply Y current to each Y linear motor movable element 723a by the current supplied to each Y linear motor stator 723b.
An axial thrust is generated to move the Y stage 721 and the X stage 722 in the Y axis direction.

An X linear motor mover 724a for moving the X stage 722 in the X axis direction is fixed in a hollow portion of the X stage. The X-axis motor thrust is generated in the X-axis direction by the current supplied to the X linear motor stator 724b, and the X stage 722 is used as a reference for both side surfaces 724c and 724d of the X linear motor stator 724b and the platen 720. It is movable in the X-axis direction using the surface 720a as a guide.

A counter mass mechanism 733, which is a self-weight compensating mechanism for canceling (cancelling) the weights of the Y stage 721 and the X stage 722, has Y sliders 721a, 721a at one end.
21b, ie, a Y stage 721, and a belt 735 as a plurality of connecting members for suspending a counter mass 734 at the other end.
And a pulley 736 that wraps and supports the counter mass 734 so that the weight of the counter mass 734 is balanced with the weight of the entire stage movable portion including the Y stage 721 and the X stage and the top plate 704 and the like held thereon. Is set. The counter mass 734 has a counter mass yaw guide surface 726b provided in parallel with the Y guide 726 by an air pad 740 and a magnetic pad 741 provided on the side surface 734a.
Is supported in a non-contact manner.
The second reference surface 720b on the opposite side to 0a is also supported in a non-contact manner by an air pad and a magnetic pad (not shown). The operation of the magnetic pad is as described above.

An actuator 737 is provided at the connection between the belt 735 and the Y stage 721, that is, the Y sliders 721a and 721b. Actuator 73
Reference numeral 7 denotes an air supply port (not shown), and an upper end of a bellows 737a has a first housing 73 integrated with the Y stage 721.
7b, and the lower end of the bellows 737a is
5 is coupled to a second housing 737c coupled to the lower end of the fifth housing 737c. The pressure in the left and right bellows 737a is changed by individually changing the pressure of the air supplied to the air supply port, thereby adjusting the tension of the belt 735 or the change in the effective length of the belt. Cancels (compensates) the rotational moment due to the change in the center of gravity due to the movement. Further, the belt 73 is formed by an air pressure damper effect.
Vibration propagating from No. 5 to the Y stage 721 is effectively removed.

The counter mass 734 is provided with a pair of counter mass linear motors 742 as third driving means, and a Y linear motor 7 as first driving means.
By adjusting the absolute value to be the same in the opposite direction to the acceleration given to the acceleration 23, the vibration component (counter mass 73) that could not be completely removed by the effect of the actuator 737 described above.
(Disturbance caused by the natural frequency of No. 4) can be completely removed.

The position of the X stage 722 in the Y-axis direction and the X-axis direction is determined by a position sensor (not shown) which receives the reflected light from the Y length measuring mirror 738 and the X length measuring mirror 739 provided integrally with the top plate 704. Is measured by With the XY stage in the above configuration, the X stage 722 is positioned with high accuracy in a substantially vertical plane. Therefore, the top plate 70
The work fixed to the work chuck 705 attached to the work 4 is positioned with high accuracy in a substantially vertical plane with respect to the X axis, the Y axis, the Z axis, and a total of six degrees of freedom around each axis.

14 and 15, 702 is a guide member, 703 is a radial hydrostatic bearing, 704 is a top plate, 7
05 is a work table, 706 is a stopper member, 707
Is a Z linear motor, 708 is a θ linear motor, 709 is a bellofram cylinder, 710 is a linear encoder, 71
Reference numeral 1 denotes a capacitance displacement meter.

[Embodiment of Semiconductor Production System] Next, a device such as a semiconductor (I
An example of a production system for a semiconductor chip such as C or LSI, a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, etc.) will be described. In this method, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 9 shows the entire system cut out from a certain angle. In the figure, reference numeral 101 denotes a business establishment of a vendor (apparatus supply maker) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing plant, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment,
It is assumed that flattening equipment and the like and post-processing equipment (assembly equipment, inspection equipment, etc.) are used. In the business office 101, a host management system 10 for providing a maintenance database of manufacturing equipment
8. It has a plurality of operation terminal computers 110 and a local area network (LAN) 109 connecting these to construct an intranet or the like. Host management system 1
Reference numeral 08 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the business office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote manufacturing factories of semiconductor manufacturers as users of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 connecting them to construct an intranet or the like, and a host as a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
Host management system 107 provided in the storage system 02 to 104
Has a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, access from the LAN 111 of each factory to the host management system 108 on the vendor 101 side via the Internet 105 is possible, and only users limited by the security function of the host management system 108 are permitted to access. In particular,
Via the Internet 105, status information indicating the operation status of each manufacturing apparatus 106 (for example, the symptom of the manufacturing apparatus in which a trouble has occurred) is notified from the factory side to the vendor side, and response information corresponding to the notification (for example, (Information for instructing a coping method for the trouble, software and data for coping), and maintenance information such as the latest software and help information can be received from the vendor side. Each factory 1
02-104 and the vendor 101 and the data communication on the LAN 111 in each factory, a communication protocol (TC) generally used on the Internet is used.
P / IP) is used. Instead of using the Internet as an external network outside the factory, it is also possible to use a dedicated line network (such as ISDN) that is not accessible from a third party and has high security. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access from a plurality of factories of the user to the database.

FIG. 10 is a conceptual diagram showing the entire system of the present embodiment cut out from another angle than that of FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. Data communication of the information of the manufacturing apparatus. In contrast, this example
A factory provided with a plurality of manufacturing apparatuses of a plurality of vendors is connected to a management system of each of the plurality of manufacturing apparatuses via an external network outside the factory, and data communication of maintenance information of each of the manufacturing apparatuses is performed. In the figure, reference numeral 201 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device maker), and a manufacturing line for performing various processes, such as an exposure apparatus 202 and a resist processing apparatus 20 in the manufacturing line of the factory.
Third, a film forming apparatus 204 is introduced. FIG.
In the case of 0, only one manufacturing factory 201 is illustrated, but actually, a plurality of factories are similarly networked. Each device in the factory is connected by a LAN 206 to form an intranet or the like, and a host management system 205 manages the operation of the production line. On the other hand, the exposure apparatus maker 210,
Resist processing equipment maker 220, film forming equipment maker 230
Each of the offices of the vendor (equipment supplier) is provided with host management systems 211, 221, and 231 for performing remote maintenance of the supplied equipment. As described above, these are the maintenance database and the gateway of the external network. Is provided. The host management system 205 that manages each device in the user's manufacturing factory and the management systems 211, 221, and 231 of the vendors of each device are connected by the external network 200 as the Internet or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment in the manufacturing line, the operation of the manufacturing line is stopped, but remote maintenance is performed from the vendor of the troubled equipment via the Internet 200. As a result, quick response is possible, and downtime of the production line can be minimized.

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory includes a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 11 on a display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 4.
01, serial number 402, trouble subject 40
3. Information such as date of occurrence 404, degree of urgency 405, symptom 406, coping method 407, progress 408, etc. is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes a hyperlink function 41 as shown in the figure.
0, 411, 412, allowing the operator to access more detailed information on each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and provide information for the factory operator. An operation guide (help information) can be pulled out. Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a manufacturing process of a semiconductor device using the above-described production system will be described. FIG.
Shows the flow of the entire semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and an assembly process (dicing,
Bonding), an assembly process such as a packaging process (chip encapsulation) and the like. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Also, between the pre-process factory and the post-process factory,
Information for production management and equipment maintenance is communicated via the Internet or a dedicated line network.

FIG. 13 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer.
Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0063]

Since the present invention is configured as described above, the following effects can be obtained. Even if a predetermined force such as gravity acts on one of the static pressure bearings in the constrained type, the static pressure bearing does not become narrower, and the static pressure bearing can be used with a desired design value. Further, troubles such as contact of the hydrostatic bearing can be avoided. Therefore, the original characteristics of the positioning device can be exhibited.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a positioning apparatus for a wafer lifting stage according to a first embodiment of the present invention.

FIG. 2 is an xy plan view of the stage device of FIG.

FIG. 3 is a cross-sectional view of the stage device taken along line AC in FIG. 2;

FIG. 4 is an enlarged cross-sectional view showing an enlarged part of a bearing gap of FIG. 1 in the first embodiment.

FIG. 5 is a longitudinal sectional view of an xy stage positioning device using a planar hydrostatic bearing according to a second embodiment.

FIG. 6 is an example of supporting the dead weight by using the magnetic force in the third embodiment, which is an xy using a planar hydrostatic bearing.
FIG. 3 is a longitudinal sectional view of a stage positioning device.

FIG. 7 is a vertical sectional view of an xy stage positioning device using a hydrostatic bearing having an exhaust mechanism used in a reduced-pressure atmosphere in a fourth embodiment.

FIG. 8 is a sectional view of a positioning device according to a conventional example.

FIG. 9 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from a certain angle.

FIG. 10 is a conceptual view of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from another angle.

FIG. 11 is a diagram showing a specific example of a user interface in a semiconductor device production system using an exposure apparatus according to an embodiment of the present invention.

FIG. 12 is a diagram illustrating a flow of a device manufacturing process by the exposure apparatus according to one embodiment of the present invention.

FIG. 13 is a diagram illustrating a wafer process by the exposure apparatus according to one embodiment of the present invention.

FIG. 14 is a perspective view of a positioning device according to an eighth embodiment of the present invention.

FIG. 15 is a partial cross-sectional view of FIG.

[Explanation of symbols]

1: Base plate, 2: Guide member, 3: Bearing holding member, 4: Top plate, 5a, 5b, 5c: Z linear motor, 6: θ linear motor, 6a: mover of θ linear motor 6, 6b: θ Stator of linear motor 6, 7: hydrostatic bearing pad (porous pad), 7a: upper porous pad, 7d: lower porous pad, 8u, 8d: supply groove, 9u, 9d: supply pipe, 10
u, 10d: supply tubes, 11a, 11b, 11c:
Displacement sensor, 12, 62: permanent magnet, 14: (wafer)
Chuck, 15: wafer, 16: position measuring mirror, 2
1: exhaust groove, 22: exhaust pipe, 23: tube, 50: reference plane, 51: X stage, 56: suction magnet, 57u: upper plane porous pad, 57d: lower plane porous pad,
60: y stage, h _u: clearance above the hydrostatic bearing, h _d: under hydrostatic bearing gap, alpha: fine adjustment amount of tilt angle of the top plate 4,
w: dimension of the porous pads 7u, 7d in the z-axis direction, 10
1: business establishment of vendor, 102, 103, 104: manufacturing factory, 105: internet, 106: manufacturing equipment, 10
7: Factory host management system, 108: Vendor side host management system, 109: Vendor side local area network (LAN), 110: Operation terminal computer, 111: Factory local area network (LA)
N), 200: external network, 201: manufacturing apparatus user's manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus, 204: film forming apparatus, 205: factory host management system, 206: factory local area network (LAN), 210: exposure apparatus maker, 211:
Host management system for the office of the exposure equipment manufacturer, 22
0: resist processing equipment maker, 221: host management system at the business office of the resist processing equipment maker, 230: film forming equipment maker, 231: host management system at the business office of the film forming equipment maker, 401: model of manufacturing equipment, 402 : Serial number, 403: Trouble subject, 404: Date of occurrence, 405: Urgency, 406: Symptom, 407: Remedy,
408: progress, 410, 411, 412: hyperlink function, 702: guide member, 703: radial static pressure bearing, 704: top plate, 705: work table, 706:
Stopper member, 707: Z linear motor, 708: θ linear motor, 709: Velofram cylinder, 710: Linear encoder, 711: Capacitance displacement meter, 719: Base plate, 720: Surface plate, 720a: Reference surface, 720b : Reference surface, 721: Y stage, 721a, 721b: Y slider, 721c: Side surface of Y slider, 722: X stage, 723: Y linear motor, 723a: Y linear motor mover, 723b: Y linear motor stator, 724:
X linear motor, 724a: X linear motor mover, 7
24b: X linear motor stator, 724c, 724d:
Both sides of X linear motor stator, 725: air pad,
726: Y guide, 726a: Y guide surface, 726b:
Counter Mayo guide surface, 727: air pad, 72
8: magnetic pad, 729: connecting plate, 731: magnetic pad, 732: air pad, 733: counter mass mechanism,
734: counter mass, 734a: side of counter mass, 735: belt, 736: pulley, 737: actuator, 737a: bellows, 737b: first housing, 737c: second housing, 738: mirror for Y length measurement, 739: X length measuring mirror, 740: Air pad, 741: Magnetic pad.

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) G05D 3/00 G12B 5/00 T G12B 5/00 H01L 21/30 503A 515G 531J (72) Inventor Minoru Matsui Ota, Tokyo 3-30-2 Kushita Maruko F term in Canon Inc. (reference) 2F078 CA01 CA08 CB05 CB09 CB12 CB13 CB16 3J102 AA01 AA02 BA04 BA08 BA11 BA15 BA17 CA03 DA06 DA09 DA10 EA02 EA07 EA12 EA18 EA22 CC02 CC18 CC19 GA11 GA12 5H303 AA06 BB03 BB09 DD04 DD10 DD12 EE04 QQ03

Claims (30)

[Claims] A base plate, a hydrostatic bearing provided opposite to the base plate, and a top plate having the hydrostatic bearing and supported in at least one predetermined direction with respect to the base plate. A positioning device, comprising a force generating mechanism for generating a force in a direction opposite to the predetermined direction on a movable body including the base plate or the top plate. 2. The positioning device according to claim 1, wherein the predetermined direction is a vertical direction, and the force in the predetermined direction is the gravity of the movable body. 3. The positioning device according to claim 1, wherein the force generating mechanism is the static pressure bearing, and generates the opposite force by a static pressure. 4. The positioning device according to claim 1, wherein the force generating mechanism generates the reverse force by a magnetic force. 5. The positioning device according to claim 1, wherein a supply pressure of each of the opposed hydrostatic bearings is adjusted independently. 6. The positioning device according to claim 5, wherein the opposed hydrostatic bearing is further divided into a plurality of parts, and the supply pressure is adjusted independently of each other. 7. The positioning device according to claim 1, wherein the hydrostatic bearing forms part or all of a cylinder provided in the positioning device. 8. A positioning device, comprising: a first drive mechanism for moving the top plate in a direction of a center axis of the cylinder with respect to the base plate; and a center of the cylinder relative to the base plate with respect to the base plate. The positioning device according to any one of claims 1 to 7, further comprising: a second drive mechanism that rotates around an axis. 9. The apparatus according to claim 1, wherein the first drive mechanism is provided at at least three places at different positions in the circumferential direction of the cylinder, and the top plate is inclined with respect to the base plate. 9. The positioning device according to any one of 8. 10. The apparatus according to claim 10, wherein the second driving mechanism has at least three
The positioning device according to any one of claims 1 to 9, wherein the positioning device is arbitrarily disposed between the first driving mechanisms disposed at different positions. 11. The positioning device according to claim 1, wherein the first drive mechanism and / or the second drive mechanism is a linear motor. 12. The positioning device according to claim 1, wherein the hydrostatic bearing has a planar shape. 13. The positioning device according to claim 1, wherein said hydrostatic bearing is a porous throttle type. 14. The positioning device according to claim 1, wherein the hydrostatic bearing has an exhaust mechanism. 15. A y-stage having a degree of freedom in the y-direction, which is a direction along the vertical direction, and a first hydrostatic bearing opposed on both sides of the y-stage as a guide surface to the y-stage. An x-stage having a degree of freedom in the x-direction, which is a direction intersecting with the y-direction, mounted on the x-stage, having a cylindrical shape and facing the x-direction by a second hydrostatic bearing opposed thereto; A fine movement stage having a degree of freedom in a z direction and / or a z axis rotation direction that is a direction intersecting a plane including the y direction, and a fine movement stage provided between the x stage and the fine movement stage; A positioning device comprising at least three driven z-drive mechanisms and a z-axis rotation drive mechanism driven in a z-axis rotation direction, wherein a force in a predetermined direction is applied in the y direction; And wherein between the x stage or a positioning apparatus characterized by having a force generating mechanism for generating a force of predetermined direction of the force in the opposite direction between the x stage and the fine stage. 16. The positioning device according to claim 15, wherein the y direction is a vertical direction, and the force in the predetermined direction is a gravity of a movable body including the x stage and / or the fine movement stage. . 17. The apparatus according to claim 17, wherein the force generating mechanism includes the first and / or
17. The positioning device according to claim 15, wherein the positioning device is a second static pressure bearing, and generates a force in a direction opposite to the force in the predetermined direction by a static pressure. 18. 18. The positioning device according to claim 15, wherein the force generating mechanism generates a force in a direction opposite to the force in the predetermined direction by a magnetic force. 19. The positioning device according to claim 15, wherein the supply pressures of the opposing first hydrostatic bearings are independently adjusted. 20. The positioning device according to claim 15, wherein the supply pressures of the opposed second hydrostatic bearings are adjusted independently of each other. 21. The apparatus according to claim 1, wherein the force generating mechanism is adjusted in accordance with a change in the force in the predetermined direction.
21. The positioning device according to any one of 20. 22. The positioning device according to claim 21, wherein the force generating mechanism is an electromagnet. 23. An exposure apparatus using the positioning apparatus according to claim 1. 24. A step of installing a group of manufacturing apparatuses for various processes including the exposure apparatus according to claim 23 in a semiconductor manufacturing plant, and a step of manufacturing a semiconductor device by a plurality of processes using the group of manufacturing apparatuses. A semiconductor device manufacturing method, comprising: 25. A step of connecting the manufacturing equipment group by a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing factory. 25. The method according to claim 24, further comprising the step of: 26. A semiconductor manufacturing factory different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 26. The production control is performed by performing data communication with the external device via the external network.
3. The method for manufacturing a semiconductor device according to item 1. 27. A group of manufacturing apparatuses for various processes including the exposure apparatus according to claim 23, a local area network connecting the group of manufacturing apparatuses, and an external network outside the factory can be accessed from the local area network. A semiconductor manufacturing plant having a gateway to perform data communication of information on at least one of the manufacturing apparatus groups. 28. The semiconductor device according to claim 2, which is installed in a semiconductor manufacturing plant.
3. The maintenance method for an exposure apparatus according to 3, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing plant; and A step of permitting access to the maintenance database via the external device, and a step of transmitting maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network. Method. 29. The exposure apparatus according to claim 23, wherein: a display; a network interface;
An exposure apparatus, further comprising: a computer that executes network software, and enabling data communication of maintenance information of the exposure apparatus via a computer network. 30. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. The exposure apparatus according to claim 29, wherein information can be obtained.