JP2001279424A - Masking device and thin film deposition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a masking device and a thin film deposition method in which a thin film can easily be deposited on a face having ruggedness with a pattern of high precision. SOLUTION: This masking device is used for depositing a thin film on a face having ruggedness. The masking device has recessed parts 11 and projected parts 12 which can follow ruggedness of the face and has an opening 13 for thin film deposition penetrating from one side to the confronted other side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a masking device used for forming a thin film on a surface having irregularities and a method for forming a thin film using the masking device.

[0002]

2. Description of the Related Art Electronic parts such as piezoelectric vibrating parts are disclosed in, for example, Japanese Utility Model Application Laid-Open No. 62-37438, and
As disclosed in Japanese Patent Application Publication No. 276/276, etc., as a case for accommodating a piezoelectric resonator, a convex supporting step for a resonance element is provided on an inner peripheral edge of a bottomed concave, and a concave with a bottom, a supporting step, and an outer periphery In some cases, a structure in which electrodes are continuously formed on a surface is employed.

However, it is extremely difficult to form continuous electrodes on the bottomed concave portion, the supporting step portion, and the outer peripheral surface having uneven steps between them. For example, it is almost impossible to print in a concave portion by a screen printing method well known as an electrode forming means. Further, in the case of printing application using the flow of the conductive paste into the concave portion, the paste accumulates on the inner peripheral edge, the film thickness becomes uneven, and cracks or the like occur during baking.

[0004] Recently, with the miniaturization and high precision of components, the necessity of forming a thin film electrode on an electronic component by a thin film forming technique such as vapor deposition or sputtering has increased. However, a method of forming a thin film in a limited area on a surface having irregularities has not yet been known.

For this reason, as disclosed in Japanese Utility Model Laid-Open Publication No. 62-37438 and Japanese Patent Laid-Open Publication No. 7-192276, a convex supporting step for a resonance element is provided on the inner peripheral edge of the bottom recess. Although the piezoelectric resonator storage case is known to have various advantages, it cannot be mass-produced industrially.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a masking apparatus and a method for forming a thin film, which can easily form a thin film on an uneven surface with a high-precision pattern.

[0007]

In order to solve the above-mentioned problems, a masking apparatus according to the present invention is used for forming a thin film on a surface having unevenness, and the masking device follows the unevenness on one surface. And a thin film forming opening penetrating from the one surface to the other surface facing the other surface.

In forming a thin film on a surface having irregularities, the masking device according to the present invention is applied to the surface having irregularities of the object, and vapor deposition is performed on the surface having irregularities of the object through the opening of the masking device. Alternatively, a thin film is formed by sputtering.

Since the masking device according to the present invention has the irregularities following the irregularities of the surface having irregularities of the object, the masking device can be brought into close contact with the surface of the object on which the thin film is to be formed. In this state, through the opening formed in the masking device, the surface of the target
Since a thin film is formed by vapor deposition or sputtering, a wraparound phenomenon or the like can be avoided, and a thin film can be easily and accurately formed in a region defined by an opening.

[0010]

FIG. 1 is a perspective view of a masking device according to the present invention. The drawing is shown with the surface to be contacted with the surface on which the thin film is to be formed facing up. The illustrated masking device is applied to, for example, one case used in a piezoelectric vibrating component.

FIG. 2 is a view showing an example of such a case. The case 2 has a convex portion 22 on the outer periphery of a concave portion 21 with a bottom, and has a surface having irregularities. Concave bottom 2
The electrodes are continuously formed on the first and the convex portions 22.

In FIG. 1, a masking device 1 according to the present invention has a concave portion 11 and a convex portion 12 that follow the irregularities of a case 2 and an opening for thin film formation penetrating from one surface to the other opposite surface. It has a part 13. Although the number of the openings 13 is three in the drawing, the number and shape are determined according to the number and pattern of the thin films required in the case 2.
The concave portion 11 of the masking device 1 contacts the convex portion 22 of the case 2 with a minimum gap, and the convex portion 12 also contacts the concave portion 21 of the case 2 with a minimum gap.

FIG. 3 is a view showing a process of forming a thin film electrode on the case 2 shown in FIG. 2 using the masking device shown in FIG. As shown in the figure, when forming a thin film on the uneven surface of the case 2, the concave portion 2 of the case 2 is formed.
The masking device 1 according to the present invention is applied to the surface having the concave portions 21 and the convex portions 22 of the case 2 through the opening 13 of the masking device 1 by vapor deposition or sputtering. Form. Reference numeral 3 is a spacer, and reference numeral 4 is a back plate, which prevents a thin film from being formed on unnecessary portions.

The masking device 1 includes a recess 21 of the case 2.
Since the masking device 1 has the concave portion 11 and the convex portion 12 that follow the convex portion 22, the masking device 1 can be brought into close contact with the surface of the case 2 where the thin film is to be formed. In this state, through the opening 13 formed in the masking device 1, the uneven surface of the case 2 is vapor-deposited or sputtered.
Since the thin film is formed, it is possible to easily and highly accurately form the thin film in the region defined by the opening 13 while avoiding the wraparound phenomenon and the like. There is no problem even if the concave portion 21 and the convex portion 22 exist in the region defined by the opening 13.

FIG. 4 is a perspective view of the case 2 obtained through the thin film forming step shown in FIG.
Are formed so that thin films 23, 24 and 25 are continuous.

FIG. 5 shows another example of a masking apparatus according to the present invention and a method of forming a thin film using the same. In the masking device shown in FIG. 5, the inner edges 131 of the openings 13 on both sides are retracted from the edges 221 of the convex portions 22 of the case 2.

FIG. 6 is a perspective view of the case 2 obtained by the thin film forming method using the masking device shown in FIG. The thin films 23 and 25 on both sides are formed to extend on the convex portions 22 on both sides.

FIG. 7 is a view showing another embodiment of the masking apparatus according to the present invention. FIG. 7A is a perspective view of the masking apparatus as viewed from the upper side (the side opposite to the abutting surface), and FIG. ) Is a perspective view seen from the lower surface side (contact surface side). 2. Description of the Related Art In the manufacture of electronic components, an aggregate in which many electronic components are arranged on the same substrate is often used. FIG. 7 shows a masking device applied to such an assembly. In the embodiment, the same base 100 is provided with four masking portions 101 to 104. Inside the masking units 101 to 104,
A further subdivided masking element is included.

FIG. 8 shows a part of the subdivided masking elements inside the masking units 101 to 104. FIG.
, Each of the masking elements Q1 to Q4 has the structure shown in FIG.

FIG. 9 is a perspective view of a case assembly to which the masking device shown in FIGS. 7 and 8 is applied. A large number of recesses 201 are arranged in the case assembly 200.
The periphery of the concave portion 201 is a convex portion 202.

FIG. 10 shows the case assembly 200 shown in FIG.
FIG. 4 is a view showing a thin film forming process for the present invention. As shown in the drawing, the substrate 100 of the masking device for an assembly is brought into contact with the case assembly 200, and a thin film is formed by a thin film forming technique such as evaporation or sputtering.

FIG. 11 is a perspective view of a case assembly on which a thin film is formed by the thin film forming method shown in FIG. On one surface of the case assembly 200, a thin film 203 that is continuous with each of the concave portions 201 and the convex portions 202 around the concave portions 201 is formed. In order to obtain a single case from the case assembly 200 illustrated in FIG. 11, the case assembly 200 may be divided along the cutting lines XX and YY.

In the embodiment, the case where the thin film is formed on the case and the case assembly has been described, but it goes without saying that the present invention is not limited to such a use. The present invention
It can be widely applied when a thin film is formed on a surface having irregularities.

[0024]

As described above, according to the present invention, it is possible to provide a masking apparatus and a thin film forming method capable of easily forming a thin film on an uneven surface with a high-precision pattern.

[Brief description of the drawings]

FIG. 1 is a perspective view of a masking device according to the present invention.

FIG. 2 is a perspective view showing an example of a case to which a masking device according to the present invention is applied.

FIG. 3 is a view showing a process of forming a thin-film electrode on the case shown in FIG. 2 using the masking device shown in FIG. 1;

FIG. 4 is a perspective view of a case obtained through the thin film forming step shown in FIG.

FIG. 5 is a view showing another example of the masking apparatus according to the present invention and a method of forming a thin film using the same.

6 is a perspective view of a case obtained by a thin film forming method using the masking device shown in FIG.

FIG. 7 is a perspective view showing another embodiment of the masking device according to the present invention.

8 is a perspective view showing a part of a subdivided masking element inside a masking unit in the masking device shown in FIG. 7;

9 is a perspective view of a case assembly to which the masking device as shown in FIGS. 7 and 8 is applied.

FIG. 10 is a view showing a thin film forming step for the case assembly 200 shown in FIG. 9;

FIG. 11 is a perspective view of a case assembly on which a thin film is formed by the thin film forming method shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Masking apparatus 11 Concave part 12 Convex part 13 Opening

Claims (3)

[Claims] 1. A masking apparatus used for forming a thin film on a surface having irregularities, wherein at least one surface has irregularities that follow the irregularities, and the other surface facing the other surface from the one surface. A masking device having a penetrating thin film forming opening. 2. A method of forming a thin film on a surface having irregularities, wherein a masking device is applied to the surface having irregularities, wherein the masking device is as described in claim 1, and And a method of forming a thin film on the surface having the irregularities by vapor deposition or sputtering. 3. The method according to claim 2, wherein the depth of the concave portion of the masking device is equal to the depth of the concave portion on the surface having the irregularities.