JP2001274179A - Chip mounter and method of manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounter which can reduce the defective mounting of semiconductor chips by surely performing chip mounting operation, even on a tape carrier having narrow clamping intervals. SOLUTION: This chip mounter which mounts a semiconductor chip, such as a CSP, etc., is provided with clampers 7 and 8. When the tape carrier TC is carried in and a tape substrate TK1 moves to a prescribed mounting position, the clampers 7 and 8 move downwardly and respectively vacuum chuck tape substrates TK2 and TK3. The clamper 7 clamps a chip-mounting area on the rear surface of the substrate TK2 adjoining the downstream side of the substrate TK1 and the clamper 8 clamps a chip-mounting area on the rear surface of the substrate TK3 adjoining the upstream side of the substrate TK1. Therefore, the clampers 7 and 8 can sufficiently secure rigidity and stably clamp the tape carrier TC, even when the arranging pitch of the chip mounting areas on the carrier TC is small.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for improving the mounting accuracy of a chip mounter, and more particularly, to a CSP (Chi).
The present invention relates to a technology that is effective when applied to the mounting of a semiconductor chip used in, for example, a p-size package.

[0002]

2. Description of the Related Art According to studies made by the present inventor, for example, a semiconductor device of the CSP type uses a tape substrate formed on a tape carrier as a printed wiring substrate on which a semiconductor chip is mounted. is there. In this case, when mounting the semiconductor chip on the tape substrate,
A chip mounter is used.

[0003] The chip mounter recognizes the mounting position of the substrate tape conveyed by the product conveying section or the substrate tape attached to the carrier jig by an optical camera or the like, and then mounts the semiconductor chip on the substrate tape by the mount stage. Then, heat and a load are applied by the mount head to join the substrate tape and the semiconductor chip.

Further, at the time of position recognition by the optical camera and mounting of the semiconductor chip by the mount head, the tape substrates near both sides of the mounting position where the semiconductor chip is mounted are pressed and fixed from above and below by a clamper.

[0005] An example of this type of mounter, which is described in detail, is published on November 26, 1999 by Press Journal Co., Ltd., and edited by Koyo Sato (ed.), "2000 Latest Semiconductor Process Technology," Special Issue No. 18, 1999. roll
No. 13, P311. This document describes the configuration of the CSP mounter and the like.

[0006]

However, the present inventor has found that the above-described chip mounter-based chip mount technology has the following problems.

[0007] With the miniaturization of semiconductor devices, the interval between semiconductor chips mounted on a tape substrate is becoming narrower, and the clamp area of the tape substrate is also becoming narrower. As a result, the clamper itself becomes thinner, and there is a problem that the clamper becomes insufficient in rigidity.

If the rigidity of the clamper is insufficient, the tape substrate may be bent, causing an error in position recognition, etc., resulting in poor position accuracy when mounting the semiconductor chip, and poor bonding in the subsequent bonding process. This may cause the reliability of the semiconductor device to deteriorate.

An object of the present invention is to securely mount a chip even with a tape carrier having a small clamping interval.
It is an object of the present invention to provide a chip mounter and a method for manufacturing a semiconductor device, which can significantly reduce mounting defects of a semiconductor chip.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, a chip mounter according to the present invention comprises a mounting means for mounting a semiconductor chip and a semiconductor chip mounted on the mounting means in a chip mounting area on a main surface of a tape substrate repeatedly formed on a tape carrier. A mounting tool for mounting, a transport means for transporting the tape carrier, and when the mounting tool mounts the semiconductor chip, a second tape substrate adjacent to the downstream side of the first tape substrate on which the semiconductor chip is mounted and an upstream side. Adjacent third
And a clamp means for fixing the back surface of the chip mount area on the tape substrate.

Further, the chip mounter of the present invention comprises a mounting means for mounting a semiconductor chip and a semiconductor chip mounted on the mounting means in a chip mounting area of a tape substrate main surface repeatedly formed on a tape carrier. A mounting tool for mounting, a transport means for transporting the tape carrier, and when the mounting tool mounts the semiconductor chip, a second tape substrate adjacent to the downstream side of the first tape substrate on which the semiconductor chip is mounted and an upstream side. Adjacent third
And a suction fixing means for sucking and fixing the back surface of the chip mounting area on the tape substrate.

Further, according to the present invention, there is provided a chip mounter in which a mounting means for mounting a semiconductor chip and a semiconductor chip mounted on the mounting means are mounted on a chip mounting area of a tape substrate main surface repeatedly formed on a tape carrier. A mounting tool for mounting, a transport means for transporting the tape carrier, and when the mounting tool mounts the semiconductor chip, a second tape substrate adjacent to the downstream side of the first tape substrate on which the semiconductor chip is mounted and an upstream side. Adjacent third
A suction fixing means for sucking and fixing the back surfaces of the chip mounting areas on the tape substrate, respectively; and a second and third tape substrate main means provided below the suction fixing means, when the mounting tool mounts the semiconductor chip. Jetting means for jetting air to the chip mount area on the surface.

Further, a method of manufacturing a semiconductor device according to the present invention
A step of preparing a carrier tape in which a tape substrate to which an elastic material and an adhesive are bonded is repeatedly formed in the chip mounting area, and a step of preparing a semiconductor chip to be mounted in the chip mounting area of the tape substrate; A step of mounting a semiconductor chip on a mounting means, a step of transporting the tape carrier to a mounting position of the tape substrate, and a second tape substrate adjacent to a downstream side of the first tape substrate on which the semiconductor chip is mounted And a step of adsorbing and fixing the back surface of the chip mount area in the third tape substrate adjacent to the upstream side and the third tape substrate, respectively, while adsorbing and fixing the second and third tape substrates by the adsorption fixing means. The semiconductor chip is mounted on a chip mounting area on the main surface of the first tape substrate by a mounting tool. The method of manufacturing a semiconductor device characterized by a step.

Further, according to the method of manufacturing a semiconductor device of the present invention, there is provided a step of preparing a tape carrier in which a tape substrate to which an elastic material and an adhesive are bonded is repeatedly formed in a chip mounting region; A step of preparing a semiconductor chip to be mounted in the region, a step of mounting the semiconductor chip on the mounting means, and a step of transporting the tape carrier to a mounting position of a tape substrate,
A step of adsorbing and fixing the back surfaces of the chip mounting areas of the second tape substrate adjacent to the downstream side of the first tape substrate on which the semiconductor chip is mounted and the third tape substrate adjacent to the upstream side by the suction fixing means, respectively; , Second,
A step of injecting air into the chip mount area on the main surface of the third tape substrate by means of an injection means, and fixing the chips on the main surface of the first tape substrate while fixing the second and third tape substrates by suction fixing means and air injection means Mounting the semiconductor chip on the mounting area with a mounting tool.

As described above, even if the mounting pitch of the semiconductor chips mounted on the tape substrate of the tape carrier becomes small, the clamping means can reliably and stably clamp the tape carrier, and the positional accuracy is good. And a stable chip mount can be achieved.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic explanatory view of a chip mounter according to one embodiment of the present invention, and FIG. 2 is a view showing a mount stage, a clamper, and a mount head provided in the chip mounter according to one embodiment of the present invention. FIG.

In the present embodiment, the chip mounter 1
Is a package of the same size as the chip size,
A semiconductor chip used for the CSP type semiconductor device is mounted. As shown in FIG. 1, the chip mounter 1 is provided with a cassette lifter 2 on the left front side.

The cassette lifter 2 stores the semiconductor wafers W attached to the wafer ring R, and the semiconductor wafers W are sequentially taken out of the cassette lifter 2 by a wafer take-out mechanism.

On the right side of the cassette lifter 2, a wafer holder 3 is provided. The wafer holder 3 fixes and positions the semiconductor wafer W taken out of the cassette lifter 2.

A transfer arm 4 is provided on the front side of the wafer holder 3. The transfer arm 4 transfers the semiconductor wafer W stuck on the wafer ring R from the cassette lifter 2 to the wafer holder 3. This wafer holder 3
A pickup mechanism for picking up the cut semiconductor chips CH one by one is provided below the semiconductor chip CH.

The transfer head 5 is located above the wafer holder 3.
Is provided. The transfer head unit 5 sucks and fixes the semiconductor chip CH picked up by the pickup mechanism, for example, with a collet or the like, and transfers the semiconductor chip CH to the vicinity of a mount stage (mounting means) 6 described later.

A mount stage 6 is provided behind the wafer holder 3. This mount stage 6
The semiconductor chip CH sucked from the semiconductor wafer W by the moving head is fixed and moved to the mounting area.

In the tape substrate TK, for example, copper foil wirings serving as leads are formed on the upper surface of a tape-like film made of polyimide, and these are successively used as a tape carrier TC.

On both left and right sides of the mount stage 6, clampers (clamping means, suction fixing means) 7, 8 are provided, respectively. The clampers 7 and 8 clamp the tape substrate TK and prevent the tape substrate TK from bending.
In the vicinity of the clampers 7 and 8, a tape carrier TC is provided.
Is provided.

Above the mount stage 6, a mount head (mount tool) 9 is provided. The mount head unit 9 attaches the semiconductor chip CH to the tape substrate TK.
This is a mount tool to be mounted on.

On the right side of the mount head 9,
A position recognition camera 10 is provided, and the position recognition camera 10 captures an image for recognizing a mounting position of the tape substrate TK.

A loader 11 is provided obliquely to the left behind the cassette lifter 2. The loader 11 is provided with a reel around which the tape carrier TC before the semiconductor chip CH is mounted is wound.

An unloader 12 is provided on the right side of the mount stage 6. The unloader 12 is provided with a reel for winding the tape carrier TC on which the semiconductor chip CH is mounted.

The mount stage 6, the clamper 7,
8 and the configuration of the mount head unit 12 will be described.

As shown in FIG. 2, heaters 13 and 14 are provided on the mount stage 6 and the mount head 12.
Are provided respectively. The semiconductor chip CH is mounted on the tape substrate TP by the heat of the heaters 13 and 14 and the load of the mount head unit 12. On the surface of the mount stage 6, a suction fixing portion 6a is provided.
The semiconductor chip CH mounted on the mount stage 6 is suctioned by the suction fixing portion 6a.

The mount stage 6 is provided with a stage driving mechanism 15. Stage drive mechanism 15
Moves the mount stage 6 in the X direction, the Y direction, the Z direction, and the θ direction.

The mount head unit 7 is provided with a head unit driving mechanism 16 which moves the mount head unit 7 in the X and Y directions.
The clampers 7 and 8 attract and fix the tape carrier TC. The clampers 7 and 8 are connected to a vacuum suction mechanism, an electromagnetic valve for performing vacuum control of the clamper, and the like.

On the surface of the tape substrate TK, an adhesive material SZ is provided in advance in a chip mounting area where the semiconductor chip CH is mounted via an elastomer (elastic material) MS.
Is applied.

Next, the operation of the present embodiment will be described with reference to FIG. 1 and FIG.

First, the semiconductor wafer W stuck on the wafer ring R stored in the cassette lifter 2 is transferred to a predetermined position of the wafer holder 3 by the transfer arm 4 and is positioned and fixed.

Then, the semiconductor chips CH of the semiconductor wafer W fixed by the wafer ring set 4 are picked up one by one by the pickup mechanism of the wafer holder 3.

The semiconductor chip CH picked up is
It is conveyed to the vicinity of the mount stage 6 while being fixed by suction by the collet of the transfer head unit 5. The stage drive mechanism 15 receives the semiconductor chip CH transported by moving the mount stage 6 from the collet of the transfer head unit 5, mounts the semiconductor chip CH, and moves to a regular position where the semiconductor chip CH is mounted.

The tape carrier TC is transported by the sprocket roller, and the tape substrate (first tape substrate) TK1 on which the semiconductor chip CH is mounted is transported to a predetermined mounting position. Thereafter, the clampers 7 and 8 move downward to vacuum-clamp and clamp the tape carrier TC.

The clamper 7 provided on the left side clamps the chip mount area on the back surface of the tape substrate (second tape substrate) TK2 adjacent to the left side (downstream side) of the tape substrate TK1 in FIG. 2, and is provided on the right side. The clamper 8 can prevent the tape carrier TC from being bent by clamping the chip mount area on the back surface of the tape substrate (second tape substrate) TK3 adjacent to the right side (upstream side) of the tape substrate TK1.

Accordingly, since the size of the clampers 7 and 8 can be increased to about the chip mounting area, the rigidity of the clampers 7 and 8 can be sufficiently secured even when the chip mounting pitch of the tape carrier TC is small. Thus, the tape carrier TC can be stably clamped.

Here, the clampers 7, 8 when a plurality of tape substrates TK are formed in the width direction of the tape carrier TC.
Will be described.

For example, as shown in FIG. 3, when four tape substrates TK are formed in the width direction of the tape carrier TC, the clamper 7 is disposed on the downstream side of the tape substrate TK1 on which the semiconductor chip CH is to be mounted. 4 next to
The chip mount area on the back surface of the two tape substrates TK2 is clamped. The clamper 8 provided on the right side clamps the chip mount area on the back surface of the four tape substrates TK3 adjacent to the upstream side of the tape substrate TK1.

Therefore, even if the tape carrier TC is a wide tape carrier formed with a plurality of tape substrates TK in the width direction, the tape carrier TC can be reliably clamped.

When the tape carrier TC is affixed to a carrier jig or the like, a portion where the elastomer and the adhesive are not applied is the tape carrier TC.
In this case, the tape carrier TC has a step, so that the tape carrier TC cannot be fixed by suction.

At this time, the tape carrier T is driven only by the other clamper without operating the vacuum suction mechanism of one of the clampers 7 and 8 corresponding to that position.
C is fixed by adsorption.

For example, the tape carrier T to which the elastomer and the adhesive are not bonded immediately below the clamper 8
When C is located, the vacuum carrier of the clamper 8 is not operated, and the tape carrier T is
C is fixed by adsorption.

Then, the image of the tape substrate TK1 is captured by the camera 10 for position recognition, and
Then, the head drive mechanism 16 moves the mount head unit 12 so that the mount head unit 12 is located immediately above the tape substrate TK1 to be mounted.

The mount head unit 12 is a tape substrate TK1
The head drive mechanism 16 moves the mount head 12 downward again. At the same time, the stage drive mechanism 15 moves the mount stage 6 upward.

The mount stage 6 and the mount head section 12 are heated to a certain temperature by the heaters 13 and 14, respectively. The semiconductor chip CH and the tape substrate TK1 are thermally connected to each other via the elastomer MS and the adhesive SZ. And are bonded by load.

Thereafter, the vacuum suction of the clampers 7 and 8 is stopped by the electromagnetic valves, and the tape carrier TC is transported by the sprocket roller until the left (downstream) tape substrate TK2 on which the semiconductor chip CH is mounted comes to the mounting position. Is done.

By repeating these operations, the semiconductor chips CH are mounted on the individual tape substrates TK. Then, the tape carrier TC on which the semiconductor chip CH is mounted is wound around a reel provided on the unloader 12 and stored.

Thus, according to the present embodiment, even if the chip mounting pitch of the semiconductor chip CH is reduced, the clampers 7, 8 are reliably and stably provided.
C can be clamped, the mounting height of the semiconductor chip CH becomes constant, and stable mounting with good positional accuracy can be achieved.

Further, since the space for the clampers 7 and 8 can be increased, it is possible to flexibly cope with a change in the chip mounting pitch of the tape carrier TC.

Further, in the present embodiment, the chip mount areas on the back surfaces of the tape substrates TK2 and TK3 located on both sides of the tape substrate TK1 on which the semiconductor chip CH is mounted are sucked and fixed by the clampers 7 and 8, respectively. However, for example, as shown in FIG. 4, air nozzles (injection means) 17 may be provided below the clampers 7 and 8, respectively.

The air nozzle 17 jets compressed air heated to room temperature or a certain temperature toward the tape substrates TK2 and TK3. This makes it possible to more reliably prevent the tape carrier TC from bending.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the invention. Needless to say, it can be changed.

For example, in the above-described embodiment, the chip mounter in the case where the mounting surface of the tape carrier TC faces downward has been described. For example, as shown in FIG. It may be configured to be mounted on the upper part.

In this case, the clampers 7, 8 and the mount head 9 are located below, and the mount stage 6
Are respectively provided so as to be located above. Further, since the clampers 7 and 8 are provided above the tape carrier TC, the clamp can be more reliably clamped by the weight of the tape carrier TC, and the mounting failure of the semiconductor chip CH can be greatly reduced.

[0062]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1) According to the present invention, sufficient rigidity can be ensured by the clamping means provided on the chip mounter even if the mounting pitch of the semiconductor chips is reduced, and the tape carrier can be reliably and stably held. Can be clamped.

(2) In the present invention, according to the above (1), the mounting height of the semiconductor chip becomes constant, and the chip mounting can be performed stably with good positional accuracy.
Reliability in a semiconductor device such as a CSP can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view of a chip mounter according to an embodiment of the present invention.

FIG. 2 is a configuration explanatory view of a mount stage, a clamper, and a mount head provided in a chip mounter according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing an example of a clamp by a clamper when a plurality of tape substrates TK are formed in a width direction of a tape carrier used in a chip mounter according to another embodiment of the present invention.

FIG. 4 is an explanatory diagram showing an example of a configuration of a mount stage, a clamper, and a mount head provided in a chip mounter according to another embodiment of the present invention.

FIG. 5 is an explanatory diagram showing another example of a configuration of a mount stage, a clamper, and a mount head provided in a chip mounter according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip mounter 2 Cassette lifter 3 Wafer holder 4 Transfer arm 5 Transfer head part 6 Mount stage (mounting means) 6a Suction fixing part 7, 8 Clamper (clamp means, suction fixing means) 9 Mount head part (mount tool) 10 Position recognition Camera 11 Loader 12 Unloader 13, 14 Heater 15 Stage drive mechanism 16 Head drive mechanism 17 Air nozzle (injection means) R Wafer ring W Semiconductor wafer CH Semiconductor chip TC Tape carrier TK Tape substrate MS Elastomer (elastic material) SZ adhesive

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Tomoji Suda 3-3-2 Fujibashi, Ome-shi, Tokyo Within Hitachi Tokyo Electronics Co., Ltd. (72) Inventor Kazunori Higuchi 3-2-2 Fujibashi, Ome-shi, Tokyo Hitachi East F term in Kyoto Electronics Co., Ltd. (reference) 5F047 AA17 BA21 BB16 FA36 FA51 FA79 FA90

Claims (5)

[Claims] A mounting means for mounting a semiconductor chip, a mounting tool for mounting the semiconductor chip mounted on the mounting means on a chip mounting area of a main surface of a tape substrate repeatedly formed on a tape carrier, Transport means for transporting the tape carrier; a second tape substrate adjacent to a downstream side of the first tape substrate on which the semiconductor chip is mounted when the mount tool mounts the semiconductor chip; and a first tape. A chip mounter comprising: a clamp means for fixing a back surface of a chip mount area in a third tape substrate adjacent to an upstream side of the substrate. 2. A mounting means for mounting a semiconductor chip, a mounting tool for mounting the semiconductor chip mounted on the mounting means in a chip mounting area of a main surface of a tape substrate repeatedly formed on a tape carrier, Transport means for transporting the tape carrier; a second tape substrate adjacent to a downstream side of the first tape substrate on which the semiconductor chip is mounted when the mount tool mounts the semiconductor chip; and a first tape. A chip mounter comprising: a suction fixing means for sucking and fixing the back surface of the chip mounting area in the third tape substrate adjacent to the upstream side of the substrate. 3. A mounting means for mounting a semiconductor chip, a mounting tool for mounting the semiconductor chip mounted on the mounting means on a chip mounting area of a main surface of a tape substrate repeatedly formed on a tape carrier, Transport means for transporting the tape carrier; a second tape substrate adjacent to a downstream side of the first tape substrate on which the semiconductor chip is mounted when the mount tool mounts the semiconductor chip; and a first tape. Suction fixing means for sucking and fixing the back surface of the chip mounting area on the third tape substrate adjacent to the upstream side of the substrate, and provided below the suction fixing means, and the mounting tool mounts the semiconductor chip. At this time, the first,
And a jetting means for jetting air to a chip mount area on the main surface of the second tape substrate. 4. A step of preparing a carrier tape in which a tape substrate to which an elastic material and an adhesive are bonded is repeatedly formed in a chip mounting area, and preparing a semiconductor chip to be mounted in a chip mounting area of the tape substrate. Performing the step of: mounting the semiconductor chip on a mounting means; transferring the tape carrier to a mounting position of the tape substrate; adjoining the semiconductor chip on the downstream side of the first tape substrate. A step of adsorbing and fixing the back surfaces of the chip mounting areas of the second tape substrate and the third tape substrate adjacent to the first tape substrate on the upstream side of the first tape substrate, respectively; While holding the third tape substrate by suction, the semiconductor chip is placed in the chip mounting area on the main surface of the first tape substrate. The method of manufacturing a semiconductor device characterized by a step of mounting by the mounting tool. 5. A step of preparing a tape carrier in which a tape substrate to which an elastic material and an adhesive are bonded is repeatedly formed in a chip mounting region, and preparing a semiconductor chip to be mounted in a chip mounting region of the tape substrate. Performing the step of: mounting the semiconductor chip on a mounting means; transferring the tape carrier to a mounting position of the tape substrate; adjoining the semiconductor chip on the downstream side of the first tape substrate. A step of adsorbing and fixing the back surfaces of the chip mounting areas of the second tape substrate that fits and the third tape substrate that is adjacent to the upstream side of the first tape substrate by using an adsorbing and fixing unit; and the second and third tape substrates. A step of injecting air into the chip mount area on the main surface by an injecting means, the suction fixing means, and air injection Mounting the semiconductor chip on a chip mounting area on the main surface of the first tape substrate by a mounting tool while fixing the second and third tape substrates by means. .