JP2001247657A - Epoxy resin composition and electrical laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the wet heat resistance and adhesive properties of an epoxy resin composition used for electrical laminates. SOLUTION: A linear bisphenol-A epoxy resin having an Mw of 5,000-50,000, a cresol-novolak epoxy resin, and a compound having phenol and triazine backbones are compounded as essential ingredients.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition and a laminate, and more particularly, it is useful as a paint, a composition for encapsulating a semiconductor, or a varnish for a laminate. The present invention relates to a flame-retardant epoxy resin composition which can provide a laminate having excellent adhesion, heat resistance and moisture resistance as a varnish for), and a laminate having both of these properties.

[0002]

2. Description of the Related Art Epoxy resins have been widely used mainly for electric and electronic material parts because of their excellent adhesion and electrical properties (insulating properties).

[0003] Although glass epoxy laminates are used for these electric and electronic material components, the laminates are becoming more multilayered and thinner with the miniaturization and higher performance of electric and electronic equipment. In addition, a semiconductor package on which an IC chip is directly mounted has many high-temperature processing steps. Therefore, a laminate has a high glass transition temperature (hereinafter, Tg), a heat and moisture resistance, a copper foil, and the like for withstanding such high-temperature processing. Good adhesion between layers of glass cloth is required.

Therefore, as a method of increasing Tg, a technique using a polyfunctional epoxy resin and a dicyandiamide or phenol novolak resin as a curing agent is generally known.

[0005] However, the combination of a polyfunctional epoxy resin and dicyandiamide is not good in hygroscopicity.
The moisture and heat resistance was not good even in the combination of the polyfunctional epoxy and the polyfunctional phenol.

Various techniques using a bismaleimide resin have been studied as a technique for a laminate resin having a high Tg. Such a technique is improved in terms of heat resistance, but is resistant to moisture and heat. However, the adhesiveness was still insufficient, and the adhesion in electric laminates was also reduced.

In order to improve the resistance to moisture and heat in electric laminates, for example, JP-A-11-22
No. 8670 discloses a technique for improving the moisture absorption heat resistance of a laminated board by blending a polyfunctional epoxy resin with a linear high molecular weight bisphenol type epoxy resin.

[0008]

However, Japanese Patent Application Laid-Open No.
In the invention described in Japanese Patent No. 228670, the Tg is as low as about 170 ° C. by the TMA method in order to use it for a package substrate or the like, and the compounding amount of the polyfunctional epoxy resin must be increased in order to increase the Tg. As a result, a decrease in adhesion was inevitable.

That is, the problem to be solved by the present invention is:
Heat resistance of the molded article in the epoxy resin composition, excellent properties of water resistance, and epoxy resin composition capable of imparting moisture and heat resistance and adhesion performance in electrical laminate applications, and
An object of the present invention is to provide an electric laminate having both moisture resistance and heat resistance and adhesion.

[0010]

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a bisphenol type epoxy resin (A) having a specific molecular weight is used as an epoxy resin, and an epoxy resin having an average number of functional groups of 2.5 or more. Epoxy resin (B) and compound (C) having a phenol skeleton and a triazine skeleton
By making the epoxy resin composition containing as an essential component, the heat resistance of the molded article, the water resistance is dramatically improved, and furthermore, it is found that the moisture resistance and heat resistance and the adhesiveness in electric laminates are improved, The present invention has been completed.

[0011]

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bisphenol type epoxy resin (A) having a weight average molecular weight of 5,000 to 50,000 in terms of polystyrene, an average number of functional groups of 2.5.
The present invention relates to an epoxy resin composition and an electric laminate, wherein the epoxy resin (B) and the compound (D) having a phenol skeleton and a triazine skeleton are essential components.

The bisphenol type epoxy resin (A) having a weight average molecular weight in terms of polystyrene of 5,000 to 50,000 used in the present invention is not particularly limited, but is not limited to gel permeation chromatography (hereinafter referred to as G).
If the weight average molecular weight in terms of polystyrene in the measurement by PC) is less than 5,000, the effect of lowering Tg and improving the adhesiveness is not exhibited. On the other hand, the weight average molecular weight is 5000
If it exceeds 0, the impregnating property to the glass cloth will be deteriorated, and the resin flow during the formation of the laminated board will be deteriorated, and eventually, the adhesion and the moisture and heat resistance will be reduced.

From the viewpoint of the balance between these properties, the weight average molecular weight of the bisphenol type epoxy resin (A) is 200
It is preferably in the range of 00 to 45000.

The method for producing the bisphenol-type epoxy resin (A) is not particularly limited. For example, a bifunctional bisphenol-type epoxy resin (a1) and a bifunctional phenol (a2) are linearly polymerized. It can be obtained by: Examples of (a1) include a bifunctional epoxy resin selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin and halides thereof, and bisphenols (a2) Examples include bisphenol A, bisphenol F, bisphenol S, and bifunctional phenols selected from halides thereof. Among these, those obtained by polymerization of bisphenol A type epoxy resin and bisphenol A are preferable from the viewpoint of further improving the adhesiveness and the heat and humidity resistance.

Next, the epoxy resin (B) having an average number of functional groups of 2.5 or more is not particularly limited.
Specifically, a phenol novolak type epoxy resin, a brominated phenol novolak type epoxy resin, an orthocresol novolak type epoxy resin, a bisphenol A novolak type epoxy resin, a bisphenol AD novolak resin and other novolak type epoxy resins, and a tricyclodecene oxide group. Epoxy resin having, cycloaliphatic epoxy resin such as epoxidized dicyclopentadiene-type phenol resin, glycidyl ester dimer acid, glycidyl ester type epoxy resin such as triglycidyl ester, tetraglycidylaminodiphenylmethane, triglycidyl p-aminophenol, Triglycidyl-p-
Glycidylamine type epoxy resins such as aminophenol, tetraglycidyl metaxylylenediamine, tetraglycidylbisaminomethylcyclohexane, heterocyclic epoxy resins such as triallyl isocyanurate and triglycidyl isocyanurate, phloroglysinol triglycidyl ether, trihydroxy Biphenyl triglycidyl ether, trihydroxyphenylmethane triglycidyl ether, glycerin triglycidyl ether,
2- [4- (2,3-epoxypropoxy) phenyl]
-2- [4- [1,1-bis [4- (2,3-epoxypropoxy) phenyl] ethyl] phenyl] propane,
1,3-bis [4- [1- [4- (2,3-epoxypropoxy) phenyl] -1- [4- [1- [4- (2,
3-functional epoxy resin such as 3-epoxypropoxy) phenyl] -1-methylethyl] phenyl] ethyl] phenoxy] -2-propanol, tetrahydroxyphenylethanetetraglycidyl ether, tetraglycidylbenzophenone, bisresorcinol tetraglycidyl ether, tetra Examples thereof include tetrafunctional epoxy resins such as glycidoxybiphenyl. The average number of functional groups in the epoxy resin (B) is preferably 2.5 to 10 from the viewpoint of a balance between mechanical properties and heat resistance.

Of these, novolak type epoxy resins or cycloaliphatic epoxy resins are preferred because of the good balance between mechanical properties and heat resistance. Among the latter, epoxidized dicyclopentadiene type phenol resins are preferred. The effect of improving the moisture resistance and the electrical characteristics becomes remarkable. When flame retardancy is required, it is useful to use a brominated phenol novolak type epoxy resin or a tetrabromobisphenol type epoxy resin as appropriate.

The epoxy resin (B) having an average number of functional groups of 2.5 or more is not limited to one kind in use, and two or more kinds can be used in combination.
Along with each of the above epoxy resins, some of the following compounds, namely, n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, P.I. Monofunctional epoxy compounds such as Sec-butylphenyl glycidyl ether, glycidyl methacrylate, vinylcyclohexene monoepoxide, etc. may be used.

Next, the compound (C) having a phenol skeleton and a triazine skeleton imparts heat resistance, water resistance, and adhesion to electric laminates, and further imparts a halogen-free flame retardancy. Can be expressed.

The compound (C) having such a phenol skeleton and a triazine skeleton is not particularly limited, but various compounds obtained by a condensation reaction of a triazine compound, a phenol, and an aldehyde can be used. It is preferably used as a mixture of compounds (hereinafter, abbreviated as “mixture (c)”).

Here, the phenol skeleton represents a phenol structural site derived from phenols, and the triazine skeleton represents a triazine structural site derived from a triazine compound.

The phenols used here include:
There is no particular limitation, for example, phenol, o
Polyhydric compounds such as alkyl phenols such as cresol, m-cresol, p-cresol, xylenol, ethylphenol, butylphenol, nonylphenol, and octylphenol; bisphenol A, bisphenol F, bisphenol S, bisphenol AD, tetramethylbisphenol A, resorcinol, and catechol; Examples include phenols, naphthols such as monohydroxynaphthalene and dihydroxynaphthalene, and other phenylphenols and aminophenols. These phenols can be used alone or in combination of two or more. However, phenol is preferable because the final cured product is excellent in flame retardancy and excellent in reactivity with an amino group-containing triazine compound.

Next, the compound containing a triazine ring is not particularly limited, but is preferably the following general formula 1 or isocyanuric acid.

[0023]

Embedded image

(In the general formula 1, R ₁ , R ₂ and R ₃ represent an amino group, an alkyl group, a phenyl group, a hydroxyl group, a hydroxylalkyl group, an ether group, an ester group, an acid group, an unsaturated group, a cyano group Represents one of the following.)

Among the compounds represented by the above general formula 1, melamine, acetamate, and the like, in which two or three of R ₁ , R ₂ , and R ₃ are amino groups, because of their excellent reactivity. Amino group-containing triazine compounds represented by guanamine derivatives such as guanamine and benzoguanamine are preferred.

These compounds are not limited to one kind in use, and two or more kinds can be used in combination.

The aldehyde is not particularly limited, but formaldehyde is preferred from the viewpoint of easy handling. Formaldehyde includes, but is not limited to, formalin, paraformaldehyde, and the like as typical sources.

Among the mixtures (c) obtained by subjecting these triazine compounds, phenols and aldehydes to a condensation reaction, particularly, the triazine compounds are represented by the above-mentioned guanamine derivatives such as melamine, acetoguanamine and benzoguanamine. (Hereinafter abbreviated as "mixture (c ')") using an amino group-containing triazine compound is preferable because the effect of improving flame retardancy is remarkable.

Examples of the mixture (c ′) include: c1: a condensation reaction product of an amino group-containing triazine compound, a phenol and an aldehyde, c2: a condensation reaction product of an amino group-containing triazine compound and an aldehyde C3: a condensation reaction product of a phenol and an aldehyde, c4: a phenol, c5: a mixture of an amino group-containing triazine compound, and

[0030] _{-X-NH-CH 2 -NH- (} c6) in the mixture _{-X-NH-CH 2 -Y- (} c7) ( wherein, X is a triazine skeleton, Y represents a phenol skeleton.) Containing (c6) / (c7) at a ratio of 0.6 or less greatly improves the flame-retardant effect, and is compatible with the epoxy resin (A) and heat-resistant. It is preferable from the viewpoint of excellent properties.

In the mixture (c '), phenols (c4), which are unreacted components, and an amino group-containing triazine compound (c
5) may slightly remain, but is preferably in a range of 3% by weight or less.

In the present invention, the mixture obtained by subjecting a triazine compound, a phenol and an aldehyde to a condensation reaction, or a mixture (c ′) using an amino group-containing triazine compound as the triazine compound is a mixture (c ′). The nitrogen atom content in c) or the mixture (c ′) is preferably 5% by weight or more, especially 8% by weight or more, and the softening point measured in glycerin by a ball and ring method is 50 ° C. or more, preferably 80 ° C. or higher is preferred. In addition, 150 ° C measured with a cone plate type viscometer
The melt viscosity at 0.1 Pas or more, preferably 0.3 Pas
The above is preferred.

In the present invention, a curing accelerator (D) is preferably used in combination with the above (A) to (C), if necessary.

As the curing accelerator (D), any known and commonly used curing accelerators can be used, and examples thereof include tertiary amines such as benzyldimethylamine, imidazole, metal salts of organic acids, Lewis acids, and amine complex salts. These may be used alone or in combination of two or more.

The composition of the present invention may further use an organic solvent (E) in addition to the above-mentioned components. Particularly, as the composition for an electric laminate, the organic solvent (E) is indispensable. It becomes the component of. Here, the organic solvent (E) that can be used is
Although not particularly limited, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropyl alcohol, n-butanol, methoxypropanol, methyl cellosolve, ethyl carbitol, ethyl acetate, xylene, toluene, cyclohexanol, N, N-dimethylformamide and the like can be mentioned, and these solvents can be appropriately used as a mixture of two or more solvents.

The amount of the organic solvent to be used is not particularly limited, but particularly for an electric laminate, from the viewpoint of impregnating the glass cloth, it is in the range of 20 to 80% by weight in terms of solid content. Is preferred.

The epoxy resin composition of the present invention may further contain various additives, flame retardants, fillers, and the like, if necessary.

The above-mentioned epoxy resin composition of the present invention comprises:
It is extremely useful for electric laminates, but it can be used for various purposes such as adhesives, casting, paints, etc. by adjusting various other components. Sealing, lamination,
It is applicable to applications such as paints, especially for glass epoxy laminates and IC encapsulants, and because of its excellent metal adhesion, it can also be used as a coating epoxy resin composition suitable for resists and paint applications.

For electrical laminates, they are particularly useful as so-called build-up laminate compositions such as resin-coated copper foils because of their excellent adhesion to copper foil.

The method for producing a laminate from the above-described epoxy resin composition of the present invention is not particularly limited, and it can be produced by a known and commonly used method. A method of impregnating the resin composition at a ratio of a resin amount of 30 to 70% by weight to form a prepreg, and then heating and pressing 1 to 10 of the prepregs to obtain a prepreg is used.

[0041]

EXAMPLES Next, the present invention will be described specifically with reference examples, examples and comparative examples. In the examples, “parts” and “%” are all based on weight unless otherwise specified.
In addition, each test followed the following method. [Peel strength] Based on JIS-K6481. [Interlayer peel strength] Based on JIS-K6481. [Tg (glass transition temperature)] Measured by TMA method. Temperature rise rate 10 ° C / min [Water absorption: Weight change (wt%) before and after treatment at 121 ° C / 100% humidity by PCT (pressure cooker test) is measured as water absorption] [Soldering resistance to moisture absorption; PCT treatment] The resulting laminate was immersed in a 260 ° C. solder bath for 30 seconds, and its state change was observed.] Criteria: ◎: no change in appearance, Δ: with measling,
×: Swelling occurred

Synthesis Example 1 Compound (C) having a phenol skeleton and a triazine skeleton was synthesized by the following method. 94 parts of phenol,
To 15 parts of melamine and 5 parts of benzoguanamine, 45 parts of 41.5% formalin and 0.4 parts of triethylamine were added, the pH in the system was adjusted to 8.2, and the temperature was gradually raised to 100 ° C. while paying attention to heat generation. . After reacting at 100 ° C for 5 hours, remove water at normal pressure to 120 ° C while removing water.
The temperature was raised over time. Next, after reacting for 3 hours under reflux, the temperature was raised to 140 ° C. over 2 hours while removing water under normal pressure. After reacting for 3 hours under reflux, the temperature was raised to 160 ° C. over 2 hours while removing water under normal pressure. After further reacting under reflux for 3 hours, the temperature was raised to 180 ° C. over 2 hours while removing water under normal pressure. Next, unreacted phenol was removed under reduced pressure to obtain a compound having the phenol skeleton and a triazine skeleton.

This compound is hereinafter referred to as aminotriazine novolak resin. The obtained aminotriazine novolak resin has a nitrogen content of 14% and a hydroxyl equivalent of 135 g /
eq and the ratio of the following structural sites described in the specification is -X-NH-CH2-NH- (c6) -X-NH-CH2-Y- (c7) (wherein X is a triazine skeleton, and Y is (Indicating a phenol skeleton) (c6) / (c7) = 0.07.

Example 1 13 parts of a linear bisphenol A type epoxy resin having a polystyrene equivalent weight average molecular weight of 30,000 and an epoxy equivalent of 3,500 g / eq, and an epoxy equivalent of 206 g /
eq bisphenol A novolak epoxy resin 42
Of a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 400 g / eq and 43 parts of an aminotriazine novolak resin described in Synthesis Example 1 were dissolved in a mixed solvent of methyl cellosolve and methyl ethyl ketone to prepare a varnish. To this varnish was added a curing accelerator, 2-ethyl-4-methylimidazole, to prepare a mixed solution having a nonvolatile content (NV) of 55%. The amount of the curing accelerator was set such that the gel time of the prepreg became 120 seconds at 170 ° C.

Thereafter, using each mixed solution,
Glass cloth WEA 7628 H258N as base material
[Nittobo Co., Ltd.] was impregnated and dried at 160 ° C. for 3 minutes to prepare a prepreg having a resin content of 40%.

Next, eight prepregs thus obtained were laminated and cured under the conditions of a pressure of 3.9 MN / m 2, a heating temperature of 170 ° C. and a heating time of 120 minutes to produce a laminate. Next, the above various evaluation tests were performed. Table 1 shows the results.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 1 shows the results.

Example 2 13 parts of a linear bisphenol A type epoxy resin having a polystyrene equivalent weight average molecular weight of 30,000 and an epoxy equivalent of 3,500 g / eq, and an epoxy equivalent of 277 g / eq.
42 parts of a dicyclopentadiene type epoxy resin of eq, 45 parts of a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 400 g / eq, and 36 parts of an aminotriazine novolak resin described in Synthesis Example 1 were dissolved in a mixed solvent of methyl cellosolve and methyl ethyl ketone. The varnish was adjusted. A prepreg and a laminate were produced from this varnish in the same manner as in Example 1. Next, the above various evaluation tests were performed. Table 1 shows the results.

Regarding the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 1 shows the results.

Example 3 10 parts of a linear bisphenol A type epoxy resin having a weight average molecular weight in terms of polystyrene of 21,000 and an epoxy equivalent of 2500 g / eq, and an epoxy equivalent of 216 g /
45 parts of a cresol novolak epoxy resin of eq, 45 parts of a tetrabromobisphenol A epoxy resin having an epoxy equivalent of 400 g / eq, and 44 parts of an aminotriazine novolak resin described in Synthesis Example 1 were dissolved in a mixed solvent of methyl cellosolve and methyl ethyl ketone. The varnish was adjusted. A prepreg and a laminate were produced from this varnish in the same manner as in Example 1. Next, the above various evaluation tests were performed. Table 1 shows the results.

Regarding the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 1 shows the results.

Example 4 8 parts of a linear bisphenol A epoxy resin having a polystyrene equivalent weight average molecular weight of 42,000 and an epoxy equivalent of 9000 g / eq, and an epoxy equivalent of 206 g / e
Bisphenol A novolak epoxy resin 47
Varnish was prepared by dissolving 45 parts of a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 400 g / eq and 46 parts of an aminotriazine novolak resin described in Synthesis Example 1 in a mixed solvent of methyl cellosolve and methyl ethyl ketone. A prepreg and a laminate were produced from this varnish in the same manner as in Example 1.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 1 shows the results.

Example 5 10 parts of a linear bisphenol A type epoxy resin having a polystyrene equivalent weight average molecular weight of 30,000 and an epoxy equivalent of 3,500 g / eq, and an epoxy equivalent of 216 g /
35 parts of a cresol novolak epoxy resin of eq, 10 parts of a glycidylamine type epoxy resin having an epoxy equivalent of 143 g / eq, 45 parts of a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 400 g / eq, and an aminotriazine novolak described in Synthesis Example 1. A varnish was prepared by dissolving 47 parts of a resin in a mixed solvent of methyl cellosolve and methyl ethyl ketone. A prepreg and a laminate were produced from this varnish in the same manner as in Example 1.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 1 shows the results.

Comparative Example 1 55 parts of a bisphenol A novolak type epoxy resin having an epoxy equivalent of 206 g / eq, and an epoxy equivalent of 400 g
A varnish was prepared by dissolving 45 parts of a tetrabromobisphenol A-type epoxy resin of 40 g / eq and 40 parts of a phenol novolak resin having a hydroxyl equivalent of 105 g / eq in a mixed solvent of methyl cellosolve and methyl ethyl ketone. A prepreg and a laminate were prepared from this varnish in the same manner as in Examples 1 to 5.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 2 shows the results.

Comparative Example 2 55 parts of a dicyclopentazineene-type epoxy resin having an epoxy equivalent of 277 g / eq, 45 parts of a tetrabromobisphenol A-type epoxy resin having an epoxy equivalent of 400, and 33 parts of a phenol novolak resin having a hydroxyl equivalent of 105 were used in methyl cellosolve. And a mixed solvent of methyl ethyl ketone to prepare a varnish. A prepreg and a laminate were prepared from this varnish in the same manner as in Examples 1 to 5.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 2 shows the results.

Comparative Example 3 55 parts of a cresol novolak type epoxy resin having an epoxy equivalent of 216 g / eq, and an epoxy equivalent of 400 g / eq
Tetrabromobisphenol A type epoxy resin 45
And 35 parts of a bisphenol A novolak resin having a hydroxyl equivalent of 115 were dissolved in a mixed solvent of methyl cellosolve and methyl ethyl ketone to prepare a varnish. A prepreg and a laminate were prepared from this varnish in the same manner as in Examples 1 to 5.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 2 shows the results.

Comparative Example 4 55 parts of a cresol novolak type epoxy resin having an epoxy equivalent of 216 g / eq, and an epoxy equivalent of 400 g / eq
Tetrabromobisphenol A type epoxy resin 45
Part, aminotriazine novolak resin 4 described in Synthesis Example 1
Three parts were dissolved in a mixed solvent of methyl cellosolve and methyl ethyl ketone to prepare a varnish. This varnish was used in Example 1
A prepreg and a laminated board were produced in the same manner as in Examples 5 to 5.

About the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 2 shows the results.

Comparative Example 5 10 parts of a linear bisphenol A type epoxy resin having a polystyrene equivalent weight average molecular weight of 30,000 and an epoxy equivalent of 3,500 g / eq, and an epoxy equivalent of 216 g
/ Eq cresol novolak type epoxy resin 45 parts,
Tetrabromobisphenol A having an epoxy equivalent of 400
A varnish was prepared by dissolving 45 parts of a type epoxy resin and 33 parts of a phenol novolak resin having a hydroxyl equivalent of 105 g / eq in a mixed solvent of methyl cellosolve and methyl ethyl ketone. A prepreg and a laminate were prepared from this varnish in the same manner as in Examples 1 to 5.

With respect to the obtained laminate, peel strength, delamination strength, flame retardancy, Tg (glass transition temperature), PCT
Each property of water absorption and solder resistance was tested. Table 2 shows the results.

[0066]

[Table 1]

[0067]

[Table 2]

[0068]

According to the present invention, an epoxy resin composition which is excellent in heat resistance and water resistance of a molded article in an epoxy resin composition, and which can impart wet heat resistance and adhesion performance in electric laminates. The present invention can provide an article and an electric laminate having both moisture and heat resistance and adhesion.

Accordingly, the composition of the present invention can be used in various fields such as electric electronics, adhesives, casting, and paints, and is particularly useful in electric lamination applications.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01B 3/40 H01B 3/40 P 17/60 17/60 J H05K 1/03 610 H05K 1/03 610L F Terms (reference) 4J002 CC28Y CD00X CD05W FD14Y FD156 FD207 4J036 AA05 AD08 AF06 DA04 FB08 5G305 AA06 AB24 AB26 AB34 BA13 BA25 BA26 CA15 CA16 CA17 CA27 CA32 CA51 5G333 AA05 AB12 AB21 CB12 CC03 DA04 DA11 DA23 FB14 FB03

Claims (8)

[Claims] 1. A polystyrene-equivalent weight average molecular weight of 5
Bisphenol type epoxy resin (A) having an average number of functional groups of 2.5 or more (B), and a compound (C) having a phenol skeleton and a triazine skeleton, which are 000 to 50,000, are essential components. Epoxy resin composition. 2. The composition according to claim 1, wherein the epoxy resin (B) having an average number of functional groups of 2.5 or more is a novolak type epoxy resin. 3. The composition according to claim 2, wherein the novolak type epoxy resin has an average number of functional groups of 2.5 to 10. 4. A polystyrene-equivalent weight average molecular weight of 5
The mixing ratio of the bisphenol-type epoxy resin (A) having a molecular weight of 000 to 50,000 and the epoxy resin (B) having an average number of functional groups of 2.5 or more is (A) / (B) =
4. The composition according to claim 1, wherein the composition is in the range of 1/1 to 1/10. 5. The compound according to claim 1, wherein the compound (C) having a phenol skeleton and a triazine skeleton has a structure in which a triazine compound, a phenol, and an aldehyde are subjected to a condensation reaction. A composition according to claim 1. 6. A compound (C) having a phenol skeleton and a triazine skeleton comprising: c1: a condensation reaction product of an amino group-containing triazine compound with a phenol and an aldehyde; c2: a condensation reaction of an amino group-containing triazine compound with an aldehyde A condensation reaction product, c3: a condensation reaction product of phenols and aldehydes, c4: a mixture of phenols, and c5: an amino group-containing triazine compound, wherein -X-NH-CH _{2 is} contained in the mixture. -NH- (c6) (wherein, X is a triazine skeleton, Y represents a phenol _{skeleton.) -X-NH-CH 2} -Y- (c7) comprising a structural moiety is (c6) / (c7) 0 . The composition according to any one of claims 1 to 5, wherein the composition is used as a mixture containing at a ratio of 6 or less. 7. The composition according to claim 1, comprising a curing accelerator (D) and an organic solvent (E). 8. An electric laminate, wherein a cloth-like substrate is impregnated with the epoxy resin composition according to claim 1 and then laminated and heated and pressed. .