JP2001135652A - Coating device and method of bonding paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To providing a coating device of bonding paste that has improved operability and can obtain improved coating quality, and its coating method. SOLUTION: In the coating method of bonding paste for drawing and coating the bonding paste by moving a coating nozzle while discharging the bonding paste from the coating nozzle at a position where the chip of a substrate is mounted, a drawing pattern for indicating the pattern of a coating line in a coating area is displayed on a screen 60 when setting the drawing pattern used for controlling a traveling means for moving the coating nozzle, and drawing setting data for indicating the relative relationship between chip sizes Lx and Ly and each drawing element is inputted for each drawing element (diagonal cross element E1, horizontal line element E2, and vertical line element E3) for composing the drawing pattern, thus editing the drawing pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for applying a bonding paste for applying a bonding paste for chip bonding to a substrate.

2. Description of the Related Art In a die bonding process for manufacturing a semiconductor device, a bonding paste (hereinafter simply referred to as "paste") for bonding a semiconductor chip to a substrate such as a lead frame is applied. The application of the paste is performed by guiding the paste discharged from the dispenser to an application nozzle and applying the paste into the application area of the substrate. As one of the coating methods, drawing coating is known in which coating is performed by discharging a paste while moving a coating nozzle within a coating area.

In this drawing application, since the required coating pattern differs depending on the shape and size of the chip to be bonded, it is necessary to set the coating conditions such as the drawing pattern at the time of drawing according to the bonding target. There is. However, in the conventional bonding paste application apparatus, the setting of the drawing pattern at the time of performing the above-described drawing application requires troublesome operations such as complicated data input each time, and the operability is poor, and the appropriate setting is performed. If not, there is a problem that good coating quality cannot be obtained. Therefore, an object of the present invention is to provide a coating apparatus and a coating method for a bonding paste which are excellent in operability and can obtain good coating quality.

According to a first aspect of the present invention, there is provided a bonding paste coating apparatus for drawing and applying a bonding paste by moving a coating nozzle while discharging the bonding paste from a coating nozzle at a chip mounting position on a substrate. A paste coating apparatus, comprising: a coating nozzle that discharges paste from a coating port to apply the paste to a substrate; a moving unit that relatively moves the coating nozzle with respect to the substrate; and a moving unit that moves the moving nozzle based on a drawing pattern. The image processing apparatus further includes control means for controlling the image forming apparatus, and drawing pattern setting means for setting the drawing pattern. The drawing pattern setting means edits the drawing pattern for each drawing element constituting the drawing pattern. 3. The bonding paste application method according to claim 2, wherein the bonding paste is drawn and applied by moving the application nozzle while discharging the bonding paste from the nozzle at a chip mounting position on the substrate, wherein the coating paste is drawn. In setting a drawing pattern used for controlling the moving means for moving the nozzle, the drawing pattern is edited for each drawing element constituting the drawing pattern. According to the present invention, at the time of setting a drawing pattern used for controlling the moving means for moving the application nozzle, by editing the drawing pattern for each drawing element constituting the drawing pattern, the preset drawing pattern can be changed as needed. It can be easily corrected, and an appropriate drawing pattern according to the application target can be set with good operability to ensure good application quality.

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a die bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of a control system of the die bonding apparatus, and FIG. FIG. 4 is a flowchart of a drawing pattern editing process of the paste application, FIG. 5A is an explanatory diagram of the drawing pattern, FIG. 5B is a diagram showing drawing elements of the drawing pattern,
FIG. 6 is a view showing a drawing pattern editing processing screen of the paste application. First, the structure of the die bonding apparatus will be described with reference to FIG. In FIG. 1, a wafer sheet 2 is held by a chip supply unit 1 by a holding table (not shown). A large number of chips 3 as semiconductor elements are attached to the wafer sheet 2. A transport path 5 is provided on the side of the chip supply unit 1, and the transport path 5 transports a lead frame 6 as a substrate, and positions the lead frame 6 at a paste application position and a bonding position. A bonding head 4 is provided above the chip supply unit 1, and the bonding head 4 is moved horizontally and vertically by a moving mechanism (not shown). A paste application unit 9 is provided on the side of the transport path 5. The paste application unit 9 is configured by mounting an application nozzle 18 on a moving table 10 via an L-shaped bracket 15. Coating nozzle 18
Is connected to a dispenser 16 which is a paste discharge means fixedly arranged on a stationary plate 21 by a tube 17 which is a flexible tube member, and further connected to a discharge control valve 19 via an air tube 20. ing.
As shown in FIG. 2, the dispenser 16 includes a piston 32 reciprocally driven by a motor 31 through a paste 7 in a syringe 26 mounted on an upper surface of the manifold block 25.
Is to be ejected. The suction of the paste 7 from the syringe 26 and the discharge by the piston 32 are controlled by a first valve 27 driven by a reciprocating drive mechanism 28 and a second valve 30 driven by a reciprocating drive mechanism 29. The inside of the syringe 26 is pressurized by air supplied from an air source 33 via a valve 34,
By driving the dispenser 16, the paste 7 is pressure-fed to the application nozzle 18 via the tube 17. The ink is discharged from an application port provided at the lower end of the application nozzle 18 and applied to the application area 6 a of the lead frame 6. The discharge of the paste from the application nozzle 18 is controlled by a discharge control valve 19. Moving table 10
Is constructed by stacking an X-axis table 12 on a Y-axis table 11 and further vertically connecting a Z-axis table 14 via an L-shaped bracket 13. Y
Axis table 11, X-axis table 12, Z-axis table 14
Are the Y-axis motor 11a, the X-axis motor 12a,
A shaft motor 14a is provided. By driving the X-axis motor 12a, the Y-axis motor 11a, and the Z-axis motor 14a, the application nozzle 18 moves horizontally and vertically on the lead frame 6. Therefore, the moving table 10 serves as moving means for moving the application nozzle 18 relatively to the lead frame 6. The mounting position of the chip 3 on the upper surface of the lead frame 6 is an application area 6a where the paste 7 is applied. The application nozzle 18 is positioned in the application area 6a, and the application nozzle 18 is moved while discharging the paste 7 from the application nozzle 18, so that the paste 7 for chip bonding is drawn in a predetermined drawing pattern in the application area 6a. Applied. After the application of the paste, the lead frame 6 is sent to the bonding position 8 on the transport path 5 and positioned. Then, the chip 3 picked up from the chip supply unit 1 is bonded to the paste 7 applied in the application area 6a by the nozzle 4a of the bonding head 4. Next, a configuration of a control system of the die bonding apparatus will be described with reference to FIG. In FIG. 2, a dispenser driving unit 40 includes:
Motor 31 for driving piston 32, first valve 27
Then, the reciprocating mechanisms 28 and 29 for reciprocating the second valve 30 are driven to control the discharge of the paste 7 by the dispenser 16. Discharge control valve driver 41
Controls the control air supplied to the application nozzle 18 by driving the opening and closing of the discharge control valve 19 to open and close the application nozzle 18. The Z-axis motor drive unit 42, the Y-axis motor drive unit 43, and the X-axis motor drive unit 44 drive the Z-axis motor 14a, the Y-axis motor 11a, and the X-axis motor 12a of the moving table 10, respectively. The bonding head driving unit 45 drives the bonding head 4 for bonding the chip 3. The storage unit 46 stores programs and application pattern data necessary for the operation and processing of each unit.
The control unit 47 controls the operation of each unit based on the program stored in the storage unit 46. The operation / input unit 48 is an input means such as a keyboard and a mouse, and inputs control commands and data. The display unit 49 is a display device, and displays a screen when an operation is input. Next, the processing function of the paste application processing of the die bonding apparatus will be described with reference to FIG. Each part surrounded by a frame 46 in FIG. 3 indicates the contents of data stored in the storage unit 46 shown in FIG. In addition, among the elements shown in FIG. 3, the input processing unit 50, the display processing unit 51, the speed pattern calculation unit 5
5, the coordinate data calculation unit 56, and the drawing processing unit 58 indicate processing performed by the control unit 47 illustrated in FIG. First, each individual storage unit constituting the storage unit 46 will be described. The chip size storage unit 52 stores the size of the chip to be bonded, that is, data on the width and length of the chip 3. The drawing pattern storage unit 53 includes the following three storage units. The drawing setting data storage unit 53a stores data necessary for setting a drawing pattern, that is, numerical data for setting a geometric shape of each application line forming the drawing pattern. Here, these data are stored for each chip size and type, and further, data defining what calculation formula is used for setting the geometric shape is stored. The speed pattern calculation formula storage unit 53b stores a calculation formula for calculating a speed pattern for each drawing pattern. The coordinate data calculation formula storage unit 53c stores, for each drawing pattern, a calculation formula for calculating coordinates of a passing point or a turning point of the drawing pattern. The coordinate data calculation unit 56 calculates coordinate data for displaying the drawing pattern on the screen using the calculation formula stored in the coordinate data calculation formula storage unit 53c. The coordinate data storage unit 54 stores the coordinate data calculated by the coordinate data calculation unit 56. This coordinate data is also used when a drawing pattern is graphically displayed on the monitor screen of the display unit 49. The speed pattern calculation unit 55 includes a moving unit that moves the application nozzle based on the drawing pattern, that is, the Z-axis motors 14a and Y of the moving table 10.
The speed patterns of the shaft motor 11a and the X-axis motor 12a are calculated. This speed pattern calculation is performed using the speed pattern calculation formula in the speed pattern calculation formula storage unit 53b.
The speed pattern storage unit 57 stores the speed pattern calculated by the speed pattern calculation unit 55. The drawing processing unit 58 controls the X-axis motor driving unit 4 based on the speed pattern.
4. The Y-axis motor drive unit 43, the Z-axis motor drive unit 42, the discharge control valve drive unit 41, and the dispenser drive unit 40 are driven to move the application nozzle 18 based on the speed pattern and to paste the paste from the application nozzle 18. A process for performing drawing application to be discharged is performed. The input processing unit 50
It processes an operation input signal input from the operation / input unit 48, outputs a control command to each unit, and writes data in the storage unit 46. The display processing unit 51 processes the data stored in the storage unit 46 and causes the display unit 49 to display an editing screen for setting a drawing pattern. The setting of the drawing pattern is performed by inputting data on this display screen. That is, the operation / input unit 48, the input processing unit 50, the display processing unit 51, and the display unit 49 constitute a drawing pattern setting unit for setting a drawing pattern. Next, the drawing pattern editing process will be described with reference to FIGS. Here, an example in which the paste 7 is drawn and applied in a pattern in which two cross lines are combined in the application area 6a as shown in FIG. 5A will be described.
That is, in this example, the drawing pattern is a cross line (straight line AC and straight line BD) crossing in the diagonal direction of the application area 6a as shown in (a), (b), and (c) of FIG. Diagonal cross element E1 and horizontal line element E2
(The straight line FH) and the vertical line element E3 (the straight line EG), and these diagonal cross elements E1,
The horizontal line element E2 and the vertical line element E3 are drawing elements constituting this drawing pattern. This drawing pattern editing process is performed for each drawing element (a diagonal cross element E1, a horizontal line element E2, and a vertical line element E3 in this example) that constitutes a reference drawing pattern set in advance as a basic pattern. The drawing pattern is set by setting the actual positions and dimensions of the elements. That is, here, the drawing pattern is set by editing each drawing element. This editing process is performed on a screen displayed on the display unit 49. In FIG. 6, a screen 60 shows a display frame 6 indicating an application area corresponding to a chip to be bonded.
1 is displayed, and in the display frame 61, each drawing element constituting the drawing pattern is displayed. This drawing pattern is an example of a drawing pattern serving as a reference when performing drawing application on such a square application area.
When setting the drawing pattern corresponding to the actual chip to be coated, it is necessary to set the specific position and length of each coating line, that is, the position coordinates for specifying the coating line. This setting is performed by inputting drawing setting data described below. As shown in FIG. 6, the position coordinates of each application line are all determined based on the chip sizes Lx and Ly to be bonded. That is, when editing the drawing pattern, first, the input frames 62 and 63 are displayed on the screen 60.
The chip sizes Lx and L indicating the X and Y dimensions of the chip
y is input. Next, drawing setting data indicating the position and length of each application line forming the drawing pattern in a relative relationship with the chip sizes Lx and Ly is input for each drawing element. That is, when setting the diagonal cross element E1, the dimensions a and b indicating the distance between the end point of the diagonal cross line and the end point of the chip outer shape (the end point of the application area) are expressed in the form of percentages of the chip sizes Lx and Ly. Input in the input fields 64 and 65. Similarly, dimensions d and c indicating the horizontal line element E2 and the vertical line element E3 are input to the input frames 66 and 67 in the form of percentages of the chip sizes Lx and Ly. Dimensions a, b, c,
For the input of d, the length may be directly input as a numerical value. Next, the paste application thickness t is input to the input box 68, and all data input is completed. As described above, when setting the drawing pattern, by setting the length and position of the paste application line individually for each drawing element, the setting of the paste application amount distribution can be set higher according to the type and size of the chip. It is possible to do it in degrees. Hereinafter, individual flows of the drawing pattern setting process will be described with reference to FIG. First, an editing screen is displayed (ST1).
As a result, the drawing pattern editing screen shown in FIG. 6 is displayed, and enters an input waiting state (ST2). Then, the type of input data is determined (ST3). Here, when the already set drawing setting data is used as it is, or when the already set drawing setting data is completely corrected, an edit end command is input, and a speed pattern described later is calculated. When the data for correcting the already set drawing setting data is input, the processing for correcting the drawing setting data is performed (ST4). Here, the above-described drawing setting data is input to each input frame. Next, the coordinate data calculation unit 56 calculates the coordinate data of each application line constituting the drawing element based on the reference drawing pattern and the data that has been corrected and input (ST5). And (ST
Returning to 1), the screen 60 is again displayed based on the coordinate data calculated in (ST5) and stored in the coordinate data storage unit 54.
The application line of the drawing pattern newly set above is displayed. If it is confirmed on the screen 60 that the shape of the drawing pattern is good, the editing operation is terminated. Then, an edit end command is input in (ST3), and a speed pattern is calculated based on the newly edited drawing pattern (ST6). The calculation result is stored in the speed pattern storage unit 57. The application of the paste to the chip is performed based on the stored speed pattern.
The newly set drawing setting data is stored and registered in the drawing setting data storage unit 53a in association with data such as the name, type, and size of the chip (ST).
7). In this way, by editing the drawing pattern for each drawing element on the display screen, the distribution of the paste application amount in the application area 6a can be set more precisely according to the target chip, and the reference drawing Compared to the case where the drawing pattern is set by simply enlarging / reducing the pattern in proportion to the chip size, more appropriate setting of the drawing pattern can be performed with good operability. By applying the paste based on the drawing pattern appropriately set according to the target chip in this manner,
Good coating quality can always be ensured.

According to the present invention, when a drawing pattern used for controlling a moving means for moving a coating nozzle is set, the drawing pattern is edited for each drawing element constituting the drawing pattern, so that the previously set drawing pattern can be set. Can be easily corrected as needed, and an appropriate drawing pattern according to the target chip can be set with good operability, so that good coating quality can be ensured.

[Brief description of the drawings]

FIG. 1 is a perspective view of a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the die bonding apparatus according to the embodiment of the present invention;

FIG. 3 is a functional block diagram showing processing functions of a paste coating process of the die bonding apparatus according to the embodiment of the present invention;

FIG. 4 is a flowchart of a drawing pattern editing process of paste application according to one embodiment of the present invention;

5A is a diagram illustrating a drawing pattern according to an embodiment of the present invention. FIG. 5B is a diagram illustrating drawing elements of the drawing pattern according to the embodiment of the present invention.

FIG. 6 is a view showing a drawing pattern editing processing screen of paste application according to the embodiment of the present invention;

[Explanation of symbols]

 3 Chip 6 Lead frame 6a Application area 7 Paste 10 Moving table 16 Dispenser 18 Application nozzle 47 Control unit 53 Drawing pattern storage unit 58 Drawing processing unit

Claims (2)

[Claims] 1. A bonding paste coating apparatus for drawing and applying a bonding paste by moving the coating nozzle while discharging the bonding paste from a coating nozzle at a chip mounting position on a substrate, wherein the bonding paste is discharged from an application port. A coating nozzle for coating the substrate,
Moving means for moving the coating nozzle relative to the substrate, control means for controlling the moving means based on a drawing pattern, and drawing pattern setting means for setting the drawing pattern; drawing pattern setting means Is a bonding paste coating apparatus for editing a drawing pattern for each drawing element constituting the drawing pattern. 2. A bonding paste application method for drawing and applying a bonding paste by moving an application nozzle while discharging the bonding paste from a nozzle at a chip mounting position of a substrate, wherein a moving means for moving the application nozzle is provided. A method for applying a bonding paste, comprising editing a drawing pattern for each drawing element constituting the drawing pattern when setting the drawing pattern used for control.