JP2001127426A - Connection method and connection structure for circuit conductors of flat conductor wiring board - Google Patents
Connection method and connection structure for circuit conductors of flat conductor wiring boardInfo
- Publication number
- JP2001127426A JP2001127426A JP30971099A JP30971099A JP2001127426A JP 2001127426 A JP2001127426 A JP 2001127426A JP 30971099 A JP30971099 A JP 30971099A JP 30971099 A JP30971099 A JP 30971099A JP 2001127426 A JP2001127426 A JP 2001127426A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- circuit
- flat conductor
- conductor wiring
- circuit conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 151
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000011810 insulating material Substances 0.000 claims abstract description 22
- 238000005452 bending Methods 0.000 claims abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 7
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 7
- 239000010962 carbon steel Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 4
- 102100022749 Aminopeptidase N Human genes 0.000 description 1
- 101100116283 Arabidopsis thaliana DD11 gene Proteins 0.000 description 1
- 101000757160 Homo sapiens Aminopeptidase N Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【課題】 金属結合することができ、接続信頼性に優
れ、接続作業を容易に行うことができる平型導体配線板
の回路導体の接続方法及び接続構造を提供する。
【解決手段】 回路導体21、31における所望の接続
領域が相互に重なり合う位置で平型導体配線板20、3
0を重ね合わせて、線条の接続部材11を接続領域にお
いて重ね合わせた回路導体21、31を貫通させ、この
接続部材11の両端部を各平型導体配線板20、30の
表面に沿って同一方向に折り曲げて折曲部11a、11
bを形成した後に、この接続部材11の両折曲部11
a、11bを加熱すると共に加圧して、接続領域におい
て介在する軟化又は溶融した絶縁材28a、38aを隣
接する領域に押し出しながら、各折曲部11a、11b
と回路導体21、31並びに回路導体21、31同士を
直接接触させる。
PROBLEM TO BE SOLVED: To provide a connection method and a connection structure of a circuit conductor of a flat conductor wiring board which can be metal-bonded, have excellent connection reliability, and can easily perform connection work. SOLUTION: Flat conductor wiring boards 20, 3 are provided at positions where desired connection regions in circuit conductors 21, 31 overlap each other.
0 are superimposed to penetrate the circuit conductors 21 and 31 in which the linear connection members 11 are superposed in the connection area, and both ends of the connection members 11 are formed along the surfaces of the flat conductor wiring boards 20 and 30. Bend in the same direction and bend 11a, 11
b, the two bent portions 11 of the connecting member 11
a, 11b are heated and pressurized to extrude the softened or melted insulating material 28a, 38a interposed in the connection area to the adjacent area, while bending each of the bent parts 11a, 11b.
And the circuit conductors 21 and 31 and the circuit conductors 21 and 31 are brought into direct contact with each other.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、車体や電気機器等
に装着される平型導体配線板の回路導体の接続方法及び
接続構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a structure for connecting circuit conductors of a flat conductor wiring board mounted on a vehicle body or an electric device.
【0002】[0002]
【従来の技術】近時、車両や電気機器等が高機能化する
のに伴って、それらの制御を行う回路が複雑になり、車
体や電気機器内に多くの配線を行う必要が生じている。
このため、薄い絶縁フィルム等の絶縁材によって銅箔等
からなる回路導体を被覆した所謂FPC(flexib
le printed circuit)、FFC(f
lexible flat cable)等の平型導体
配線板が、非常に薄い形状であることから、狭い空間部
で幅方向に配置して複雑な配線をする上で好適であるた
め、多用されるようになっている。2. Description of the Related Art In recent years, as vehicles and electric equipment have become more sophisticated, circuits for controlling them have become more complicated, and it has become necessary to provide more wiring in a vehicle body and electric equipment. .
For this reason, a so-called FPC (flexible) in which a circuit conductor made of copper foil or the like is covered with an insulating material such as a thin insulating film.
le printed circuit), FFC (f
Since flat conductor wiring boards such as flexible flat cables have a very thin shape, they are suitable for arranging in the width direction in a narrow space portion and performing complicated wiring, and thus have been widely used. ing.
【0003】ところで、2つの平型導体配線板の回路導
体同士を接続する場合には、各平型導体配線板の所望の
接続領域における絶縁材の被覆を剥離して回路導体を露
出させ、露出した回路導体同士を半田付けして電気的に
接続する方法(従来例1)をとったり、又は回路導体の
所望の接続領域が相互に重なり合うように平型導体配線
板を重ね合わせた後、金属ピンを接続領域に貫通させて
接続する方法(従来例2)をとったりする。When circuit conductors of two flat conductor wiring boards are connected to each other, the covering of the insulating material in a desired connection region of each of the flat conductor wiring boards is peeled off to expose the circuit conductors. After soldering the circuit conductors to each other to electrically connect the circuit conductors (conventional example 1), or overlapping the flat conductor wiring boards so that the desired connection regions of the circuit conductors overlap with each other, the metal pins (Prior Art 2).
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記し
た従来例1の接続方法による場合には、所望の接続領域
における絶縁材の被覆を剥離して回路導体を露出させる
作業が面倒で煩わしく、作業自体も細かく難しいもので
あるため、作業性が悪く作業時間が長くなるという問題
が生じる。However, in the case of the connection method of the prior art 1 described above, the work of exposing the circuit conductor by peeling off the coating of the insulating material in the desired connection area is cumbersome and troublesome. However, the workability is poor and the work time is prolonged.
【0005】上記した従来例2の接続方法による場合に
は、充分な接触面積を確保することができず接触抵抗が
大きくなり、又一方では接続信頼性が低下するという問
題が生じる。[0005] In the case of the connection method of the above-mentioned conventional example 2, there is a problem that a sufficient contact area cannot be secured, contact resistance increases, and connection reliability decreases.
【0006】本発明は、こうした従来技術の課題を解決
するものであり、金属結合することができ、接続信頼性
に優れ、接続作業を容易に行うことができる平型導体配
線板の回路導体の接続方法及び接続構造を提供すること
を目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and is capable of performing metal connection, excellent connection reliability, and easy connection work. It is an object to provide a connection method and a connection structure.
【0007】[0007]
【課題を解決するための手段】本発明の接続方法は、回
路導体を絶縁材により被覆してなる複数の平型導体配線
板の回路導体同士を相互に電気的に接続するものであっ
て、上記回路導体における所望の接続領域が相互に重な
り合う位置で複数の平型導体配線板を重ね合わせて、線
条の接続部材を接続領域において重ね合わせた回路導体
を貫通させる第1工程と、上記接続部材の両端部を各平
型導体配線板の表面に沿って同一方向に折り曲げて折曲
部を形成する第2工程と、上記接続部材の両折曲部を加
熱すると共に加圧して、各折曲部と回路導体並びに回路
導体間に介在する軟化又は溶融した絶縁材を他の領域に
押し出しながら、接続領域において各折曲部と回路導体
並びに回路導体同士を直接接触させる第3工程とを包含
する。A connecting method according to the present invention is to electrically connect circuit conductors of a plurality of flat conductor wiring boards each having a circuit conductor covered with an insulating material. A first step of superposing a plurality of flat conductor wiring boards at positions where desired connection regions in the circuit conductor overlap with each other, and penetrating the circuit conductor in which the linear connection members are superposed in the connection region; A second step in which both ends of the member are bent in the same direction along the surface of each flat-type conductor wiring board to form a bent portion; A third step of directly contacting each bent portion with the circuit conductor and the circuit conductor in the connection region while extruding the softened or molten insulating material interposed between the bent portion and the circuit conductor and the circuit conductor into another region. I do.
【0008】この方法によれば、複数本の回路導体を被
覆する絶縁材を剥離することなく、回路導体における所
望の接続領域が相互に重なり合う位置で複数の平型導体
配線板を重ね合わせて、線条の接続部材を接続領域にお
いて重ね合わせた回路導体を貫通させることによって、
回路導体と接続部材が貫通部で接触して導通する。そし
て、次に上記接続部材の両端部を各平型導体配線板の表
面に沿って同一方向に折り曲げて折曲部を形成した後
に、上記接続部材の両折曲部を加熱すると共に加圧する
と、各折曲部と回路導体並びに回路導体間に介在する絶
縁材が高温になり軟化又は溶融して他の領域に押し出さ
れ、接続領域において各折曲部と回路導体並びに回路導
体同士が直接接触する。このため、充分な接触面積を確
保することが可能となり、かつ接続信頼性に優れたもの
となる。しかも、回路導体を被覆する絶縁材を剥離する
必要がなく、接続作業を短時間で確実に行うことが可能
となる。According to this method, a plurality of flat conductor wiring boards are overlapped with each other at a position where desired connection areas of the circuit conductors overlap with each other without peeling off an insulating material covering the plurality of circuit conductors. By penetrating the circuit conductor in which the connecting members of the filaments are overlapped in the connection area,
The circuit conductor and the connecting member are brought into contact with each other at the penetrating portion to conduct. Then, after bending both ends of the connection member in the same direction along the surface of each flat conductor wiring board to form a bent portion, heating and pressing both the bent portions of the connection member are performed. , Each bent portion and the circuit conductor and the insulating material interposed between the circuit conductors become high temperature and are softened or melted and extruded into other regions, and the respective bent portions and the circuit conductors and the circuit conductors directly contact each other in the connection region. I do. For this reason, a sufficient contact area can be ensured, and the connection reliability is excellent. Moreover, there is no need to peel off the insulating material covering the circuit conductor, and the connection operation can be reliably performed in a short time.
【0009】本発明の接続構造は、回路導体を絶縁材に
より被覆してなる複数の平型導体配線板の回路導体同士
を相互に電気的に接続する平型導体配線板の回路導体で
あって、上記回路導体における所望の接続領域が相互に
重なり合う位置で重ね合わされた複数の平型導体配線板
に対し、線条の接続部材が接続領域において重ね合わせ
た回路導体を貫通すると共に、この接続部材の両端部を
各平型導体配線板の表面に沿って同一方向に折り曲げた
折曲部が形成されており、接続領域において各折曲部と
回路導体並びに回路導体間に介在する絶縁材が他の領域
に押し出されて、各折曲部と回路導体並びに回路導体同
士が直接接触している。A connection structure according to the present invention is a circuit conductor of a flat conductor wiring board for electrically connecting circuit conductors of a plurality of flat conductor wiring boards each having a circuit conductor covered with an insulating material. A plurality of flat conductor wiring boards superposed at positions where desired connection regions in the circuit conductor overlap with each other, a linear connection member penetrates the circuit conductor overlapped in the connection region, and the connection member Are formed in the same direction along the surface of each flat conductor wiring board at both ends of the flat conductor wiring board. , And the bent portions are in direct contact with the circuit conductors and the circuit conductors.
【0010】この接続構造によれば、各折曲部と回路導
体並びに回路導体同士が直接接触するため、充分な接触
面積を確保することが可能となり、かつ接続信頼性に優
れたものとなる。According to this connection structure, since each bent portion and the circuit conductor and the circuit conductor are in direct contact with each other, a sufficient contact area can be ensured and the connection reliability is excellent.
【0011】上記した本発明の接続方法において、上記
接続部材が低融点金属で被覆されている構成にすると、
上記第3工程において、接続部材に被覆されている低融
点金属が通電により発熱溶解した後に上記回路導体との
接合界面で凝固するため、金属結合により接合がより強
固なものとなり、接触抵抗が一層低減されるので、接続
信頼性をさらに向上させることが可能となる。In the connection method of the present invention described above, when the connection member is coated with a low melting point metal,
In the third step, the low-melting-point metal coated on the connection member is heated and melted by energization, and then solidifies at the bonding interface with the circuit conductor. Therefore, the bonding becomes stronger due to metal bonding, and the contact resistance is further increased. Since it is reduced, the connection reliability can be further improved.
【0012】また、上記接続部材が銅、銅合金、鉄、炭
素鋼、ステンレス鋼又は合金鋼からなる構成とする。Further, the connecting member is made of copper, copper alloy, iron, carbon steel, stainless steel or alloy steel.
【0013】上記接続部材が、銅又は銅合金からなる構
成にすると、銅及び銅合金は電気抵抗が小さいため、接
続部における回路抵抗の低減を図ることが可能となる。When the connecting member is made of copper or a copper alloy, the electric resistance of the copper and the copper alloy is small, so that the circuit resistance at the connecting portion can be reduced.
【0014】また、上記接続部材が、鉄、炭素鋼、ステ
ンレス鋼又は合金鋼からなる構成にすると、これらの材
料は機械的強度が高いので、線条の接続部材を平型導体
配線板に貫通させる際に座屈することがなく、接続作業
をより確実に行うことが可能となる。Further, when the connecting member is made of iron, carbon steel, stainless steel or alloy steel, since these materials have high mechanical strength, the connecting member of the filament passes through the flat conductor wiring board. The connection work can be performed more reliably without buckling at the time of the connection.
【0015】[0015]
【発明の実施の形態】以下に、本発明の実施の形態を図
面に基づいて具体的に説明する。Embodiments of the present invention will be specifically described below with reference to the drawings.
【0016】本発明の平型導体配線板の回路導体の接続
方法及び接続構造は、回路導体を絶縁材により被覆して
なる複数の平型導体配線板を重ねて、各配線板の回路導
体同士を線条の接続部材を用いて相互に電気的に接続す
るものである。A method and a structure for connecting circuit conductors of a flat conductor wiring board according to the present invention are described in which a plurality of flat conductor wiring boards each having a circuit conductor covered with an insulating material are superposed on each other, and Are electrically connected to each other using a linear connecting member.
【0017】図1〜図3は、この平型導体配線板の回路
導体の接続方法及び接続構造の一例を具体的に示してい
る。FIGS. 1 to 3 specifically show an example of a connection method and a connection structure of circuit conductors of the flat conductor wiring board.
【0018】まず、第1工程として、図2の(a)及び
(b)に示すように、図1(a)に示す並行する複数本
の回路導体21〜27を絶縁材28により被覆してなる
平型導体配線板20と、並行する複数本の回路導体31
〜37を絶縁材38により被覆してなる平型導体配線板
30とを、回路導体21〜27、31〜37における所
望の接続領域が相互に重なり合う位置で平型導体配線板
20、30を重ね合わせて、図2(b)に示すように、
絶縁材28、38を剥離することなく、線条の接続部材
11を接続領域において重ね合わせた回路導体21、3
1を貫通させる。これにより、回路導体21、31と接
続部材11が貫通部11cで接触して導通する。ここ
で、線条の接続部材11の幅寸法は、回路導体21、3
1の幅より狭くなっている。First, as a first step, as shown in FIGS. 2A and 2B, a plurality of parallel circuit conductors 21 to 27 shown in FIG. And a plurality of parallel circuit conductors 31
And the flat conductor wiring boards 20 and 30 in which the desired connection regions in the circuit conductors 21 to 27 and 31 to 37 overlap with each other. In addition, as shown in FIG.
The circuit conductors 21, 3 in which the linear connecting members 11 are overlapped in the connecting region without peeling the insulating materials 28, 38
1 through. As a result, the circuit conductors 21 and 31 and the connection member 11 come into contact with each other at the penetrating portion 11c to conduct electricity. Here, the width dimension of the linear connecting member 11 is
1 is narrower.
【0019】次に、第2工程として、図2(c)に示す
ように、平型導体配線板20、30を貫通する接続部材
11の両端部を各平型導体配線板20、30の表面に沿
って同一方向に折り曲げて折曲部11a、11bを形成
する。Next, as a second step, as shown in FIG. 2C, both ends of the connecting member 11 penetrating the flat conductor wiring boards 20 and 30 are brought into contact with the surface of each of the flat conductor wiring boards 20 and 30. To form the bent portions 11a and 11b.
【0020】次に、第3工程として、図1(b)及び図
2(d)に示すように、絶縁材28、38を介して複数
の回路導体21、31を挟む両折曲部11a、11b
を、抵抗溶接ヘッド41、42等で加熱すると共に図示
矢印方向に加圧して、折曲部11aと回路導体21の間
及び折曲部11bと回路導体31の間並びに回路導体2
1と回路導体31の間に介在する軟化又は溶融した絶縁
材28a、38aを隣接する領域に押し出しながら、図
2(e)に示すように、接続領域において折曲部11a
と回路導体21及び折曲部11bと回路導体31並びに
回路導体21と回路導体31同士を直接接触させる。Next, as a third step, as shown in FIGS. 1B and 2D, both bent portions 11a sandwiching a plurality of circuit conductors 21 and 31 via insulating materials 28 and 38, 11b
Is heated by resistance welding heads 41, 42 and the like and pressurized in the direction of the arrow shown in the figure, between the bent portion 11a and the circuit conductor 21, between the bent portion 11b and the circuit conductor 31, and between the bent portion 11b and the circuit conductor 31 and the circuit conductor 2
While extruding the softened or melted insulating materials 28a and 38a interposed between the first and the circuit conductors 31 into the adjacent region, as shown in FIG.
And the circuit conductor 21, the bent portion 11b and the circuit conductor 31, and the circuit conductor 21 and the circuit conductor 31 are brought into direct contact with each other.
【0021】上記した接続方法及び接続構造によれば、
図3に示すように、接続領域において折曲部11aの表
面S1と回路導体21の表面S2及び折曲部11bの表
面S4と回路導体31の表面S5並びに回路導体21a
の表面S3と回路導体31aの表面S6同士を直接接触
させることができ、充分な接触面積を確保することがで
き、かつ接続信頼性に優れたものとなる。しかも、回路
導体21〜27、31〜37を被覆する絶縁材28、3
8を剥離する必要がなく、接続作業を短時間で確実に行
うことができる。According to the above connection method and connection structure,
As shown in FIG. 3, the surface S1 of the bent portion 11a, the surface S2 of the circuit conductor 21, the surface S4 of the bent portion 11b, the surface S5 of the circuit conductor 31, and the circuit conductor 21a in the connection region.
Surface S3 of the circuit conductor 31a and the surface S6 of the circuit conductor 31a can be brought into direct contact with each other, a sufficient contact area can be secured, and the connection reliability is excellent. Moreover, the insulating materials 28, 3 covering the circuit conductors 21-27, 31-37
8 does not need to be peeled off, and the connection operation can be reliably performed in a short time.
【0022】この接続方法において、上記接続部材11
が錫、半田等の低融点金属で被覆されている構成にする
と、上記第3工程において、接続部材11に被覆されて
いる低融点金属が通電により発熱溶解した後に回路導体
21、31との接合界面で凝固するため、金属結合によ
り接合がより強固なものとなり、接触抵抗が一層低減さ
れるので、接続信頼性をさらに向上させることができ
る。In this connection method, the connection member 11
Is coated with a low-melting-point metal such as tin, solder, or the like, in the third step, after the low-melting-point metal coated on the connecting member 11 is heated and melted by energization, it is joined to the circuit conductors 21 and 31. Since the solidification occurs at the interface, the bonding becomes stronger due to the metal bonding, and the contact resistance is further reduced, so that the connection reliability can be further improved.
【0023】また、上記接続部材11が銅、銅合金、
鉄、炭素鋼、ステンレス鋼又は合金鋼からなる構成とす
る。The connecting member 11 is made of copper, copper alloy,
The structure is made of iron, carbon steel, stainless steel or alloy steel.
【0024】上記接続部材11が、銅又は銅合金からな
る構成にすると、銅及び銅合金は電気抵抗が小さいた
め、接続部における回路抵抗の低減を図ることができ
る。If the connecting member 11 is made of copper or a copper alloy, the electric resistance of the copper and the copper alloy is small, so that the circuit resistance at the connecting portion can be reduced.
【0025】また、上記接続部材11が、鉄、炭素鋼、
ステンレス鋼又は合金鋼からなる構成にすると、これら
の材料は機械的強度が高いので、線条の接続部材11を
平型導体配線板20、30に貫通させる際に座屈するこ
とがなく、接続作業をより確実に行うことができる。The connecting member 11 is made of iron, carbon steel,
When made of stainless steel or alloy steel, since these materials have high mechanical strength, they do not buckle when penetrating the linear connection member 11 through the flat conductor wiring boards 20 and 30, so that the connection work is not performed. Can be performed more reliably.
【0026】尚、上記接続部材11の先端を尖った形状
にすると、重ねた平型導体配線板20、30の一方の表
面から、接続部材11を打ち込んで接続領域における回
路導体21、31を貫通させるのが容易となる。If the tip of the connection member 11 is formed into a pointed shape, the connection member 11 is driven from one surface of the stacked flat conductor wiring boards 20 and 30 to penetrate the circuit conductors 21 and 31 in the connection area. It is easy to do.
【0027】以上、本発明の平型導体配線板の接続方法
及び接続構造は、上記した実施形態の具体的構成に限定
されるものではなく、必要に応じ適宜構成又は工程を変
形、追加又は削除した構成としてもよいことは言うまで
もない。As described above, the connection method and connection structure of the flat conductor wiring board of the present invention are not limited to the specific structure of the above-described embodiment, and the structure or steps may be modified, added or deleted as needed. Needless to say, such a configuration may be adopted.
【0028】例えば、上記では、平型導体配線を2層重
ねて接続する場合の例を示したが、本発明はこれに限定
されるものではなく、平型導体配線板を3層以上重ねて
接続する場合にも適用できることは言うまでもない。For example, in the above, an example in which two layers of flat conductor wiring are connected to each other is shown. However, the present invention is not limited to this, and three or more layers of flat conductor wiring are stacked. It goes without saying that the present invention can be applied to the case of connection.
【0029】[0029]
【発明の効果】以上説明したように、本発明の平型導体
配線板の回路導体の接続方法及び接続構造によれば、複
数本の回路導体を被覆する絶縁材を剥離することなく、
回路導体における所望の接続領域が相互に重なり合う位
置で複数の平型導体配線板を重ね合わせて、線条の接続
部材を接続領域において重ね合わせた回路導体を貫通さ
せ、この接続部材の両端部を各平型導体配線板の表面に
沿って同一方向に折り曲げて折曲部を形成した後に、こ
の接続部材の両折曲部を加熱すると共に加圧して、接続
領域において介在する軟化又は溶融した絶縁材を隣接す
る領域に押し出しながら、接続部材の各折曲部と回路導
体並びに回路導体同士を直接接触させるため、充分な接
触面積を確保することができ、接続信頼性に優れたもの
となる。しかも、回路導体を被覆する絶縁材を剥離する
必要がないので、接続作業を短時間で確実に行うことが
できる。As described above, according to the method and structure for connecting circuit conductors of the flat conductor wiring board of the present invention, the insulating material covering the plurality of circuit conductors can be removed without peeling.
A plurality of flat conductor wiring boards are superimposed at positions where desired connection regions in the circuit conductor overlap with each other, and the circuit conductor in which the linear connection members are superposed in the connection region penetrates, and both ends of this connection member are After bending in the same direction along the surface of each flat conductor wiring board to form a bent portion, both bent portions of this connecting member are heated and pressed to soften or melt the insulating material interposed in the connection region. Since each bent portion of the connecting member is brought into direct contact with the circuit conductors and the circuit conductors while extruding the material to the adjacent region, a sufficient contact area can be secured and the connection reliability is excellent. In addition, since it is not necessary to peel off the insulating material covering the circuit conductor, the connection operation can be reliably performed in a short time.
【0030】上記接続部材が低融点金属で被覆されてい
る構成にすると、上記第3工程において、接続部材に被
覆されている低融点金属が加熱により発熱溶解した後に
接合界面で凝固するため、金属結合により接合がより強
固なものとなり、接触抵抗が一層低減されるので、接続
信頼性をさらに向上させることができる。When the connecting member is coated with a low melting point metal, the low melting point metal coated on the connecting member solidifies at the joining interface after being heated and melted by heating in the third step. The bonding further strengthens the bonding and further reduces the contact resistance, so that the connection reliability can be further improved.
【0031】上記接続部材が、銅又は銅合金からなる構
成にすると、銅及び銅合金は電気抵抗が小さいため、接
続部における回路抵抗の低減を図ることができる。When the connecting member is made of copper or a copper alloy, the electric resistance of the copper and the copper alloy is small, so that the circuit resistance at the connecting portion can be reduced.
【0032】また、上記接続部材が、鉄、炭素鋼、ステ
ンレス鋼又は合金鋼からなる構成にすると、これらの材
料は機械的強度が高いので、接続部材の接続ピンを平型
導体配線板に貫通させる際に座屈することがなく、接続
作業をより確実に行うことができる。When the connecting member is made of iron, carbon steel, stainless steel or alloy steel, since these materials have high mechanical strength, the connecting pins of the connecting member penetrate the flat conductor wiring board. The connection work can be performed more reliably without buckling at the time of the connection.
【図1】本発明の平型導体配線板の回路導体の接続方法
を示す斜視図であって、(a)は第1工程及び第2工程
を、(b)は第3工程を表す。FIG. 1 is a perspective view showing a method of connecting circuit conductors of a flat conductor wiring board of the present invention, wherein (a) shows a first step and a second step, and (b) shows a third step.
【図2】本発明の平型導体配線板の回路導体の接続方法
を示す断面図であって、(a)及び(b)は第1工程
を、(c)は第2工程を、(d)及び(e)は第3工程
を、図1(a)のP−P断面又は図1(b)のQ−Q断
面で表す。FIGS. 2A and 2B are cross-sectional views showing a method of connecting circuit conductors of the flat conductor wiring board of the present invention, wherein FIGS. 2A and 2B show a first step, FIG. 2C shows a second step, and FIG. ) And (e) represent the third step by a PP section in FIG. 1 (a) or a QQ section in FIG. 1 (b).
【図3】本発明の平型導体配線板の回路導体の接続方法
による接続部の詳細を示す断面図である。FIG. 3 is a cross-sectional view showing details of a connection portion according to a method of connecting circuit conductors of the flat conductor wiring board of the present invention.
11 接続部材 11a、11b 折曲部 11c 貫通部 20、30 平型導体配線板 21〜27、31〜37 回路導体 28、38 絶縁材 DESCRIPTION OF SYMBOLS 11 Connection member 11a, 11b Bent part 11c Penetration part 20, 30 Flat-type conductor wiring board 21-27, 31-37 Circuit conductor 28, 38 Insulation material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤井 淳彦 愛知県名古屋市南区菊住1丁目7番10号 株式会社ハーネス総合技術研究所内 Fターム(参考) 5E344 AA02 AA21 BB02 BB05 CC08 CD13 DD07 DD11 EE21 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Atsuhiko Fujii 1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi F-term in Harness Research Institute, Inc. (reference) 5E344 AA02 AA21 BB02 BB05 CC08 CD13 DD07 DD11 EE21
Claims (6)
数の平型導体配線板の回路導体同士を相互に電気的に接
続する平型導体配線板の回路導体の接続方法であって、 上記回路導体における所望の接続領域が相互に重なり合
う位置で複数の平型導体配線板を重ね合わせて、線条の
接続部材を接続領域において重ね合わせた回路導体を貫
通させる第1工程と、 上記接続部材の両端部を各平型導体配線板の表面に沿っ
て同一方向に折り曲げて折曲部を形成する第2工程と、 上記接続部材の両折曲部を加熱すると共に加圧して、各
折曲部と回路導体並びに回路導体間に介在する軟化又は
溶融した絶縁材を他の領域に押し出しながら、接続領域
において各折曲部と回路導体並びに回路導体同士を直接
接触させる第3工程とを包含することを特徴とする平型
導体配線板の回路導体の接続方法。1. A method of connecting circuit conductors of a flat conductor wiring board, wherein the circuit conductors of a plurality of flat conductor wiring boards each having a circuit conductor covered with an insulating material are electrically connected to each other. A first step of superimposing a plurality of flat conductor wiring boards at positions where desired connection regions in a circuit conductor overlap with each other, and penetrating a circuit conductor in which a linear connection member is superposed in the connection region; A second step of bending both ends of the connecting member in the same direction along the surface of each flat conductor wiring board to form a bent portion, and heating and pressurizing both bent portions of the connection member, thereby forming each bent portion. A third step of directly contacting each bent portion with the circuit conductor and the circuit conductor in the connection region while extruding the softened or molten insulating material interposed between the portion and the circuit conductor and the circuit conductor into another region. Characterized by Connection method for circuit conductors on flat conductor wiring boards.
いる請求項1記載の平型導体配線板の回路導体の接続方
法。2. The method according to claim 1, wherein the connection member is coated with a low melting point metal.
鋼、ステンレス鋼又は合金鋼からなる請求項1又は請求
項2記載の平型導体配線板の回路導体の接続方法。3. The method according to claim 1, wherein said connecting member is made of copper, copper alloy, iron, carbon steel, stainless steel or alloy steel.
数の平型導体配線板の回路導体同士を相互に電気的に接
続する平型導体配線板の回路導体の接続構造であって、 上記回路導体における所望の接続領域が相互に重なり合
う位置で重ね合わされた複数の平型導体配線板に対し、
線条の接続部材が接続領域において重ね合わせた回路導
体を貫通すると共に、この接続部材の両端部を各平型導
体配線板の表面に沿って同一方向に折り曲げた折曲部が
形成されており、 接続領域において各折曲部と回路導体並びに回路導体間
に介在する絶縁材が他の領域に押し出されて、各折曲部
と回路導体並びに回路導体同士が直接接触していること
を特徴とする平型導体配線板の回路導体の接続構造。4. A connection structure of circuit conductors of a flat conductor wiring board, wherein the circuit conductors of a plurality of flat conductor wiring boards each having a circuit conductor covered with an insulating material are electrically connected to each other. For a plurality of flat conductor wiring boards superimposed at positions where desired connection regions in circuit conductors overlap each other,
The connecting member of the wire penetrates the circuit conductor overlapped in the connection area, and a bent portion is formed by bending both ends of the connecting member in the same direction along the surface of each flat conductor wiring board. In the connection area, each bent portion and the circuit conductor and the insulating material interposed between the circuit conductors are extruded to other regions, and each bent portion, the circuit conductor and the circuit conductor are in direct contact with each other. Connection structure of circuit conductors on flat conductor wiring boards.
いる請求項4記載の平型導体配線板の回路導体の接続構
造。5. The connection structure for circuit conductors on a flat conductor wiring board according to claim 4, wherein said connection member is covered with a low melting point metal.
鋼、ステンレス鋼又は合金鋼からなる請求項4又は請求
項5記載の平型導体配線板の回路導体の接続構造。6. The connection structure for circuit conductors of a flat conductor wiring board according to claim 4, wherein said connection member is made of copper, copper alloy, iron, carbon steel, stainless steel or alloy steel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30971099A JP3751487B2 (en) | 1999-10-29 | 1999-10-29 | Connection method and connection structure of circuit conductor of flat conductor wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30971099A JP3751487B2 (en) | 1999-10-29 | 1999-10-29 | Connection method and connection structure of circuit conductor of flat conductor wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001127426A true JP2001127426A (en) | 2001-05-11 |
JP3751487B2 JP3751487B2 (en) | 2006-03-01 |
Family
ID=17996368
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---|---|---|---|
JP30971099A Expired - Fee Related JP3751487B2 (en) | 1999-10-29 | 1999-10-29 | Connection method and connection structure of circuit conductor of flat conductor wiring board |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003006600A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Formation method for rf-id medium using conductive staple |
JP2003006594A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Formation method for rf-id medium using both-side tape |
JP2011074983A (en) * | 2009-09-30 | 2011-04-14 | Hitachi Automotive Systems Ltd | Transmission control apparatus, and mechanically and electrically integrated type electronic control apparatus |
JP2015233125A (en) * | 2014-05-13 | 2015-12-24 | Amテクノワークス株式会社 | Structure for connecting flexible substrates with each other, method of connecting flexible substrates with each other, connection member for flexible substrate, structure for connecting flexible display substrates with each other, and method of connecting flexible display substrates with each other |
-
1999
- 1999-10-29 JP JP30971099A patent/JP3751487B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003006600A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Formation method for rf-id medium using conductive staple |
JP2003006594A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Formation method for rf-id medium using both-side tape |
JP2011074983A (en) * | 2009-09-30 | 2011-04-14 | Hitachi Automotive Systems Ltd | Transmission control apparatus, and mechanically and electrically integrated type electronic control apparatus |
JP2015233125A (en) * | 2014-05-13 | 2015-12-24 | Amテクノワークス株式会社 | Structure for connecting flexible substrates with each other, method of connecting flexible substrates with each other, connection member for flexible substrate, structure for connecting flexible display substrates with each other, and method of connecting flexible display substrates with each other |
Also Published As
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---|---|
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