JP2001111158A - Optical communication module and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical communication module having a structure in which an assembly can be quickly made without depending on a shape of a radiation fin; and its manufacturing method. SOLUTION: An optical communication module 10 is constituted by arraying an optical element array 18 structured by arraying a plurality of optical elements, and a plurality of optical fibers 16b, and comprises: an optical fiber array 16 optically connected to the optical element array 18; a semiconductor electronic device 20 electrically connected to the optical element array 1 8; a wiring substrate 22 for supplying an electric signal to the semiconductor electronic device 20; a mounting member 12 for mounting the optical element array 18, the optical fiber array 16, the semiconductor electronic device 20, and the wiring substrate 22; and a radiation fin 24 arranged on the mounting member 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical communication module and a method for manufacturing the same, and more particularly, to an optical communication module suitably used for optical parallel data transmission and a method for manufacturing the same.

[0002]

2. Description of the Related Art With the recent increase in speed and capacity of optical communication, the need for optical parallel data transmission has increased. In order to realize optical parallel data transmission, it is necessary for an optical communication module to include a plurality of optical elements. However, with the increase in the number of optical elements and the amount of data transmission, optical elements and control ICs are required.
Etc., the amount of heat generated increases. Since the increase in the amount of generated heat causes deterioration of characteristics of the optical communication module such as generation of noise, it is necessary to efficiently release generated heat to the outside to stabilize the operation.

[0003]

The inventor of the present invention has conceived of constructing an optical communication module by directly mounting components such as an optical element and a control IC on a metal radiating fin.

[0004] However, as described above, with the growing need for optical parallel data transmission, the applications of the optical communication module have been diversified, and it is conceivable that the mounting space will be further diversified. Therefore, the inventor thinks that realizing a configuration in which the shape of the radiation fins can be freely changed according to the mounting space will be an issue for the future optical communication module.

However, in the above-described optical communication module, since the housing for the components such as the optical element and the control IC is provided on the radiating fin, when the shape of the radiating fin is changed, the shape is changed according to the shape of the radiating fin. Change the assembly jig,
Even when the same assembly jig is used, it may take a long time to fix the radiation fin to the jig.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an optical communication module having a structure that allows quick assembly without depending on the shape of the radiation fin, and a method of manufacturing the same.

[0007]

An optical communication module according to the present invention comprises an optical element array in which a plurality of optical elements are arranged and an optical element array in which a plurality of optical fibers are arranged. Optical fiber array optically coupled, semiconductor electronic device electrically connected to optical element array, wiring board for providing electric signal to semiconductor electronic device, optical element array, optical fiber array, semiconductor A mounting member for mounting an electronic device and a wiring board, and a radiation fin provided on the mounting member are provided.

This optical communication module has a mounting member for mounting a semiconductor electronic device or the like, separately from the heat radiation fins. Therefore, this optical communication module has a structure that can be assembled by an assembling jig prepared according to the mounting member without depending on the shape of the radiation fin.

The optical communication module according to the present invention further includes a positioning member having an optical element array mounting area for mounting the optical element array and an optical fiber array mounting area for mounting the optical fiber array. The optical element array and the optical fiber array are mounted on the member, and the optical element array and the optical fiber array are mounted on the optical element array mounting area and the optical fiber array mounting area of the positioning member, respectively. It may be characterized in that it is mounted on a computer.

By providing the above positioning member, the positioning between the optical element array and the optical fiber array becomes easy.

Further, in the optical communication module of the present invention, the linear expansion coefficient of the mounting member may take a value between the linear expansion coefficient of the radiation fin and the linear expansion coefficient of the semiconductor electronic device.

When the difference in the coefficient of linear expansion between the mounting member and the semiconductor electronic device is large, an excessive stress may be generated, which may affect the characteristics of the semiconductor electronic device. The difference in the linear expansion coefficient between the mounting member and the semiconductor electronic device can be reduced as compared with a case where the mounting member is formed of the same material as the radiation fin having a large expansion coefficient.

Further, a method of manufacturing an optical communication module according to the present invention is characterized in that a semiconductor electronic device, a positioning member on which an optical element array is mounted, and a wiring board are mounted on a mounting member. And electrically connecting the semiconductor electronic device and the wiring board, further mounting the optical fiber array on the positioning member, and then disposing the radiation fins on the mounting member.

In this method for manufacturing an optical communication module, an optical element array, a semiconductor electronic device, and a wiring board are mounted on a mounting member, and electrical connection is established between them. After that, since the radiation fins are arranged on the mounting member, if an assembly jig corresponding to the mounting member is prepared, the assembly can be performed promptly without depending on the shape of the radiation fin.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of an optical communication module according to the present invention will be described below with reference to the accompanying drawings. Note that the same components are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is an exploded perspective view of the optical communication module according to the embodiment, and FIG. 2 is a perspective view of the optical communication module according to the embodiment.

As shown in FIGS. 1 and 2, the optical communication module 10 includes a platform (positioning member) 14, an optical fiber array 16, and an optical element on a mounting surface 12a provided on the lower surface of a package (mounting member) 12. The array (18 in FIGS. 6, 9 and the like), the semiconductor electronic device 20, and the wiring board 22 are mounted, and the radiating fins 24 are disposed on the radiating fin mounting surface 12b on the upper surface of the package 12. Then, the optical fiber array 16 is supported from below by the bottom piece 26, and is sandwiched between the package 12. Hereinafter, each component will be described in detail.

FIG. 3 is a perspective view of the package 12 as viewed from the mounting surface 12a. The package 12 is made of copper-tungsten alloy (CuW), copper, or metallized aluminum nitride (AlN), silicon carbide (SiC).
And has a substantially rectangular parallelepiped shape having a sufficiently large volume as compared with the platform 14, the optical fiber array 16, the optical element array 18, the semiconductor electronic device 20, and the like. . The mounting surface 12a of the package 12 has a concave platform mounting area 12c for mounting the platform 14, a convex semiconductor electronic device mounting area 12d for mounting the semiconductor electronic device 20, and a concave wiring board for mounting the wiring board 22. A mounting area 12e is formed. A pair of side edges of the package mounting surface 12a is provided with a concave portion 12f into which the convex portion (26a in FIG. 1) of the bottom piece 26 fits. On the other hand, the radiation fin disposition surface 12b side of the package 12 has a substantially flat planar shape. The package 12 has a hole 12g communicating the mounting surface 12a and the radiation fin disposition surface 12b. Before attaching the radiation fin 24, the semi-fixed resistor (see FIG. 22d) can be adjusted.

FIG. 4 is a perspective view of the optical fiber array 16 as viewed from below, and FIG. 5 is a perspective view of the optical fiber array 16 as viewed from above. Optical fiber array 16
Are 12 optical fibers 16b of the same length on a substrate 16a.
Are arranged in parallel and at equal intervals, and two pins 16c of the same length are arranged on both outer sides of the twelve optical fibers 16b in parallel with the optical fibers 16b. More specifically, on the substrate 16a, 12 optical fiber insertion V-grooves extending from one side to the other side opposite thereto are formed in parallel and at equal intervals. Each of the fibers 16b is inserted into and bonded to the optical fiber insertion V-groove. Here, the optical fiber 16b
And the length of the V-groove for inserting an optical fiber are equal,
6b is arranged such that both ends thereof are aligned with both side surfaces of the substrate 16a. Further, two pin insertion grooves are formed on the substrate 16a so as to sandwich the optical fiber insertion V groove, and each of the two pins 16c is inserted into the pin insertion groove. Here, the pin 16c is longer than the pin insertion groove, and the pin 16c is arranged such that one end protrudes from the side surface of the substrate 16a.

The optical element array (18 in FIG. 6, FIG. 9, etc.)
It is configured by arranging 12 optical elements. The optical element
It is at least one of a light emitting element and a light receiving element.
Examples of the light emitting element include a semiconductor laser and a light emitting diode. Examples of the light receiving element include a pin photodiode and an avalanche photodiode. The optical element array 18 is mounted on an optical element array mounting area 14b of a platform (14 in FIG. 6) described later.

FIG. 6 is a perspective view of the platform 14. The platform 14 is made of silicon and has a substantially flat plate shape. On one main surface of the platform 14, an optical fiber array mounting area 14a on which the optical fiber array 16 is mounted, an optical element array mounting area 14b on which the optical element array 18 is mounted, and an optical fiber array mounting area 14a. A linear groove 14c that partitions off the element array mounting area 14b is formed. In the optical fiber array mounting area 14a, grooves 14d and 14e for arranging optical fibers 16b and two pins 16c, respectively, constituting the optical fiber array 16 are provided with the grooves 14c.
And are formed vertically. Therefore, Platform 1
The optical fiber array 16 is mounted on the optical fiber 4 so that the optical fiber 16b and the two pins 16c are arranged in the grooves 14d and 14e, and a light emitting surface or a light incident surface is formed along the edge of the groove 14c. By mounting the optical element array 18 such that the optical elements are arranged, the positioning between the optical fiber array 16 and the optical element array 18 is performed, and the 12 optical elements of the optical element array 18 and the 12 optical elements are arranged. Fiber 16b
And are optically coupled. This platform 1
4 is a platform mounting area 12 of the package 12
c. Therefore, each of the optical fiber array 16 and the optical element array 18 is
4 to be mounted on the package 12.

As shown in FIG. 1, the semiconductor electronic device 20 performs a predetermined processing on a received signal and outputs the processed signal, for example, a device capable of analog signal processing.
Devices capable of digital signal processing, preamplifiers, and the like. For example, when the optical communication module 10 is a light emitting module, the semiconductor electronic device 20 is the optical element array 1
8 is built in. On the other hand, when the optical communication module 10 is a light receiving module, the semiconductor electronic device 20 has a built-in amplifier circuit for amplifying an electric signal output from the optical element array 18. Here, the semiconductor electronic device 20 and each of the plurality of optical elements of the optical element array 18 are connected by a printed wiring 14f provided on the platform 14. Therefore, when the optical communication module 10 is a light emitting module, the driving signals from the semiconductor electronic device 20 can control the turning on / off of the plurality of light emitting elements of the optical element array 18 independently. On the other hand, when the optical communication module 10 is a light receiving module, the semiconductor electronic device 20 can independently process electric signals sent from the plurality of light receiving elements of the optical element array 18. The semiconductor electronic device 20 is mounted on the semiconductor electronic device mounting area 12d of the package 12.

As shown in FIG. 7, the wiring board 22 has a configuration in which a plurality of pins 22c are provided around a board 22b on which a printed wiring 22a is provided. Here, the pin 22
The semiconductor electronic device 20 is electrically connected to the semiconductor electronic device 20 via the printed wiring 22a, so that the semiconductor electronic device 20 can be externally controlled.

The bottom piece 26 is made of polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyether sulfone (PES), polyether imide (PE).
I) and the like, and has a substantially rectangular parallelepiped shape as shown in FIG. A concave optical fiber array support region 26b for supporting the optical fiber array 16 from below is formed at the longitudinal center portion of the bottom piece 26, and the package is arranged so as to sandwich the optical fiber array support region 26b. A pair of convex portions 26a that fit into the 12 concave portions 12f are formed. Furthermore, bottom piece 2
A pair of stud pins 26c for positioning and fixing to a substrate to be mounted is provided on the lower surface of the substrate 6.

As shown in FIG. 1, the heat dissipating fins 24 have a structure in which a plurality of fins 24b are erected on a substrate 24a having substantially the same area as the package 12 to achieve sufficient heat conduction. Has become. The heat radiation fins 24 are made of a metal having a high thermal conductivity such as aluminum (Al) or copper, and are fixed to the heat radiation fin mounting surface 12b on the upper surface of the package 12 via an adhesive having a high heat conductivity. In this case, another member having high thermal conductivity may be interposed between the package 12 and the radiation fins 24. The shape of the radiating fins 24 is not limited to that shown in FIG. 1, but can be variously changed in accordance with the space in which the fins 24 are mounted. For example, the number, shape, size, and the like of the fins 24b can be arbitrarily changed.

Here, in the optical communication module 10 according to the present embodiment, the linear expansion coefficient of the package 12 preferably takes a value between the linear expansion coefficient of the radiation fins 24 and the linear expansion coefficient of the semiconductor electronic device 20. . That is, package 1
It is preferable that the coefficient of linear expansion of 2 is equal to or larger than the coefficient of linear expansion of the semiconductor electronic device 20 and smaller than the coefficient of linear expansion of the radiation fin 24. When the difference in the coefficient of linear expansion between the package 12 and the semiconductor electronic device 20 is large, the characteristics of the semiconductor electronic device 20 may be deteriorated by the generated stress. Since the semiconductor electronic device 20 mounted on the package 12 is formed of a material having a low linear expansion coefficient such as silicon, the linear expansion coefficient of the package 12 needs to be as small as possible.

On the other hand, the radiation fin 24 and the package 1
2, it is necessary to increase the heat conductivity to increase the heat radiation efficiency.
Large coefficient of linear expansion. A material such as CuW having a high thermal conductivity and a small linear expansion coefficient is extremely expensive.

Therefore, the package 12 is formed from an expensive material such as CuW having a high thermal conductivity and a small linear expansion coefficient, and the radiation fins 24 are formed from a material such as Al having a high thermal conductivity. Is set to a value between the linear expansion coefficient of the heat radiation fins 24 and the linear expansion coefficient of the semiconductor electronic device 20, the package 12 and the semiconductor electronic device 20 can be efficiently radiated. Can be reduced, and the cost of the module as a whole can be prevented from increasing.

In the optical communication module 10 according to this embodiment, the platform 14 and the optical fiber array 16 overlap each other to form an MT connector.
An optical interface with an external optical transmission line is performed via the MT connector.

Next, a method for manufacturing the optical communication module 10 according to the present embodiment will be described.

First, as shown in FIG.
The package 12 is placed and fixed on an assembly table 30 as an assembly jig with the mounting surface 12a side of the package upward. At this time,
Since the heat dissipating fin mounting surface 12b of the package 12 has a planar shape, the package 12 can be easily mounted and fixed on the flat assembly table 30. Then, the semiconductor electronic device 20 is mounted on the semiconductor electronic device mounting area 12d of the package 12.

Next, as shown in FIG. 9, the platform 14 having the optical element array 18 mounted on the optical element array mounting area 14b is mounted on the platform mounting area 12c of the package 12.

Next, as shown in FIG.
The wiring board 22 is mounted on the second wiring board mounting area 12e. Then, the semiconductor electronic device 20 and the optical element array 1
6, the semiconductor electronic device 20 and the wiring board 2
2 are electrically connected by wire bonding.

Next, as shown in FIG. 11, the optical fiber array 16 is mounted on the platform 14 so that the optical fiber 16b and the two pins 16c are arranged in the grooves 14d and 14e, respectively. The optical element 18 and the optical fiber 16b of the optical fiber array 16 are optically coupled.

Next, as shown in FIG. 12, the bottom piece 26 is placed over the optical fiber array 16 so that the projection 26a of the bottom piece 26 fits into the recess 12f of the package 12. Then, the module before completion is removed from the jig, and the semi-fixed resistor 22 d on the wiring board 22 is adjusted through the hole 12 g of the package 12.

Finally, through an adhesive having high thermal conductivity,
The radiation fins 24 are fixed to the radiation fin mounting surface 12b of the package 12 to complete the assembly. The completed drawing is shown in Fig. 2.
Shown in

Next, the operation and effects of the optical communication module 10 and the method of manufacturing the same according to the present embodiment will be described.

The optical communication module 10 according to the present embodiment
Are separated from the heat radiation fins 24 by the semiconductor electronic device 20.
And a package 12 for mounting the same. Therefore, if an assembling jig corresponding to the package 12 is prepared, even if the shape of the radiating fins 24 is changed according to the mounting space, the assembling can be performed quickly without depending on the shape of the radiating fins 24. Can be done.

In particular, the package 12 has a support surface supported by a jig, and the heat dissipating fin mounting surface 12
Since b has a planar shape, the package 12 can be mounted and fixed on an assembly base 30 having a very simple structure composed of a flat surface, and components such as the semiconductor electronic device 20 can be easily assembled.

The optical communication module 10 according to the present embodiment includes a platform 14 on which an optical element array 18 and an optical fiber array 16 are mounted, and the platform 14 is mounted on the package 12, so that the optical element array 18 is mounted. And optical fiber array 16 in package 1
The positioning of the optical element array 18 and the optical fiber array 16 is easier than in the case where the optical fiber array 16 is directly arranged. As a result, the positioning accuracy between the optical element array 18 and the optical fiber array 16 is improved, and the optical coupling efficiency between the optical element array 18 and the optical fiber array 16 is improved.

In the optical communication module 10 according to the present embodiment, the package 12 is formed of an expensive material such as CuW having a high thermal conductivity and a small linear expansion coefficient.
By forming the radiation fins 24 from a material having high thermal conductivity such as Al, the linear expansion coefficient of the package 12 takes a value between the linear expansion coefficient of the radiation fins 24 and the linear expansion coefficient of the semiconductor electronic device 20. Like that. Therefore, the package 12 and the semiconductor electronic device 2 can be efficiently radiated.
By reducing the difference between the coefficient of linear expansion and zero, the possibility that the characteristics of the semiconductor electronic device 20 deteriorate due to stress can be reduced, and the cost of the module as a whole can be suppressed from increasing.

In the optical communication module 10 according to this embodiment, the optical element array 18 and the optical fiber array 16
Generated from the semiconductor device 20 and the semiconductor electronic device 20 can be efficiently released through the package 12 and the heat radiation fins 24, so that the characteristics of the optical element array 18, the semiconductor electronic device 20, and the like due to a rise in temperature are deteriorated. Is prevented. The optical element array 18 and the optical fiber array 16
Since the heat generated from the semiconductor device 20 and the semiconductor electronic device 20 can be efficiently released, the optical elements of the optical element array 18 or the optical fibers 16b of the optical fiber array 16 can be arranged at a high density. 10 is realized.

In the method for manufacturing an optical communication module according to the present embodiment, the semiconductor electronic device 20, the platform 14 on which the optical element array 18 is mounted, and the wiring board 22 are mounted on the package 12, and wire bonding is performed. Thereafter, the optical fiber array 16 is further mounted, and then the heat radiation fins 24 are disposed on the package 12. Therefore, if an assembly jig corresponding to the package 12 is prepared, the heat radiation fins 24 may be arranged according to the mounting space. Even if the shape is changed, the assembly can be performed promptly without depending on the shape of the radiation fin 24.

[0044]

According to the optical communication module of the present invention, a mounting member for mounting a semiconductor electronic device or the like is provided separately from the heat radiation fins. Therefore, if an assembly jig corresponding to the mounting member is prepared, the assembly can be performed promptly without depending on the shape of the radiation fin.

According to the method of manufacturing an optical communication module of the present invention, the optical element array, the semiconductor electronic device, and the wiring board are mounted on a mounting member, and after electrical connection is established between them, the optical device array is further subjected to optical communication. Since the fiber array is mounted, and then the radiation fins are arranged on the mounting member, if an assembly jig corresponding to the mounting member is prepared, the assembly can be performed promptly without depending on the shape of the radiation fin. It can be carried out.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an optical communication module.

FIG. 2 is a perspective view of an optical communication module.

FIG. 3 is a perspective view of a package.

FIG. 4 is a perspective view of an optical fiber array.

FIG. 5 is a perspective view of an optical fiber array.

FIG. 6 is a perspective view of a platform.

FIG. 7 is a perspective view of a wiring board.

FIG. 8 is a perspective view showing a state where a semiconductor electronic device is mounted on a package on an assembly stand.

FIG. 9 is a perspective view showing a state where a platform on which an optical element array is further mounted is mounted on the package of FIG. 8;

FIG. 10 is a perspective view showing a state in which a wiring board is further mounted on the package of FIG. 9;

FIG. 11 is a perspective view showing a state in which an optical fiber array is further mounted on the package of FIG. 10;

FIG. 12 is a perspective view showing a state in which a bottom piece is further mounted on the package of FIG. 11;

[Explanation of symbols]

10: Optical communication module, 12: Package, 14: Platform, 14a: Optical fiber array mounting area,
14b: Optical element array mounting area, 16: Optical fiber array, 16b: Optical fiber, 18: Optical element array, 20:
Semiconductor electronic devices, 22: wiring board, 24: radiating fins.

Claims (4)

[Claims] An optical element array configured by arranging a plurality of optical elements; an optical fiber array configured by arranging a plurality of optical fibers and optically coupled to the optical element array; A semiconductor electronic device electrically connected to the optical element array; a wiring board for providing an electrical signal to the semiconductor electronic device; the optical element array, the optical fiber array, the semiconductor electronic device, and the wiring board An optical communication module, comprising: a mounting member on which the device is mounted; and a radiation fin disposed on the mounting member. 2. A positioning member having an optical element array mounting area for mounting the optical element array and an optical fiber array mounting area for mounting the optical fiber array, wherein the positioning member is mounted on the mounting member. Each of the optical element array and the optical fiber array is mounted on each of the optical element array mounting area and the optical fiber array mounting area of the positioning member, so that The optical communication module according to claim 1, wherein the optical communication module is mounted on the mounting member. 3. The linear expansion coefficient of the mounting member takes a value between a linear expansion coefficient of the heat radiation fin and a linear expansion coefficient of the semiconductor electronic device. The optical communication module as described in the above. 4. A semiconductor electronic device, a positioning member on which an optical element array is mounted, and a wiring board mounted on a mounting member, between the mounted semiconductor electronic device and the optical element array, and on the semiconductor electronic device. Electrically connecting the wiring board with the wiring board, further mounting an optical fiber array on the positioning member, and thereafter disposing a radiation fin on the mounting member. .