JP2001156490A - Light transmissive electromagnetic wave shielding material and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light transmissive electromagnetic wave shielding material that exhibits functions such as transparence, electromagnetic wave shielding effect and visibility excellently, and a manufacturing method therefor. SOLUTION: A hydrophilic transparent resin layer 2 is laminated on a transparent substrate 1, and an electroless plated layer 4 is laminated in a pattern shape on the hydrophilic transparent resin layer 2, and a black pattern part is formed on the hydrophilic transparent resin layer 2 under the electroless plated layer 4, in the light transmissive electromagnetic wave shielding material. In this shielding material, only the top surface of the electroless plated layer 4 is covered with a black electro-plated layer 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-transmitting electromagnetic wave shielding material capable of shielding electromagnetic waves and capable of seeing through a display surface of a CRT, a plasma display panel, or the like, and a manufacturing method thereof. It is about the method.

[0002]

2. Description of the Related Art Conventionally, as disclosed in Japanese Patent No. 2,717,734, a hydrophilic transparent resin layer 32 is laminated on a transparent substrate 31, and electroless plating is performed on the hydrophilic transparent resin layer 32. There is a light-transmitting electromagnetic wave shielding material in which a layer 34 is laminated in a pattern such as a fine mesh, and a black pattern portion 36 is formed in the hydrophilic transparent resin layer 32 below the electroless plating layer 34 (see FIG. 1). ). This translucent electromagnetic wave shielding material has a black surface on one side and a metallic luster on the other surface, but when it is placed on the front of a CRT, for example, it is arranged so that the black surface is on the observer side. .

[0003]

However, in this translucent electromagnetic wave shielding material, the light emitted from the CRT is reflected on the surface of the electroless plated layer having the metallic luster and illuminates the CRT surface again. However, there is a drawback that the CRT image may have poor visibility.

In order to solve this drawback, that is, to improve the visibility by suppressing the surface reflection of the metal on the upper surface 35, there is a method of treating a surface having a metallic luster as follows, for example. (1) A method of forming a rough surface by roughening with sand blasting, etc., (2) A method of forming a black film by oxidation treatment, (3) A method of coating a rough film by printing, etc., (4) A printing of a black film. How to coat.

However, in any of the methods (1) to (4), a physical impact or a chemical change is applied to the hydrophilic transparent resin layer or the electroless plating layer, so that the transparency of the hydrophilic transparent resin layer is reduced. In addition, the electromagnetic wave shielding effect has been reduced due to damage to the electroless plating layer. In addition, if the conductivity of the electroless plating layer is reduced, there is a problem that it is difficult to take a ground.

In particular, in the methods (3) and (4), it is difficult to coat the uneven film or the black film only on the portion where the electroless plating layer exists (so-called patterning). Further, in this case, in order not to form the uneven film or the like only in the portion of the electroless plating layer which takes the ground in order to take the ground, a resist step or the like is required, resulting in poor productivity.

Further, the black electroplating layer is formed not only on the exposed upper surface opposite to the surface on which the black pattern portion is formed in the electroless plating layer, but also on the side surface 39.
When the pattern is covered, the line width of the pattern tends to increase, and the transmittance as an electromagnetic wave shielding material tends to decrease.

[0008]

According to the present invention, in order to solve the above-mentioned problems, (1) a hydrophilic transparent resin layer is laminated on a transparent substrate, and a hydrophilic transparent resin layer is formed on the hydrophilic transparent resin layer. A translucent electromagnetic wave in which an electrolytic plating layer is laminated in a pattern, a black pattern portion is formed on the hydrophilic transparent resin layer below the electroless plating layer, and a black electroplating layer covering the electroless plating layer is laminated. In the shield material, the black electroplating layer was configured to cover only the upper surface of the electroless plating layer.

In order to solve the above problems, the present invention provides (2) a hydrophilic transparent resin layer laminated on a transparent substrate, and an electroless plating layer formed on the hydrophilic transparent resin layer. Laminated in a pattern, a black pattern portion is formed on the hydrophilic transparent resin layer below the electroless plating layer, an electroplating layer is laminated on the electroless plating layer, the electroless plating layer and the electroplating layer In the translucent electromagnetic wave shielding material having a black electroplating layer covering the electroplating layer, the black electroplating layer is configured to cover only the upper surface of the electroplating layer.

According to the present invention, the black electroplating layer in the above (1) or (2) is preferably a nickel-based, chromium-based, tin-based,
It was composed of a rhodium-based or ruthenium-based metal.

According to the present invention, in order to solve the above problems, (4) (A) a hydrophilic transparent resin layer is formed on a transparent substrate, and (B) a hydrophilic transparent resin layer is formed on the transparent transparent resin layer. An electrolytic plating layer is formed to blacken the hydrophilic transparent resin layer as viewed from the back side, (C) a black electroplating layer is formed on the electroless plating layer, and (D) a resist having a desired pattern is formed on the electroless plating layer. And (E) removing the black electroplating layer in the portion where the resist portion is not formed by etching and forming the hydrophilic transparent resin layer under the electroless plating layer into a black pattern as viewed from the back side. (F) The resist portion was removed from the black electroplated layer.

According to the present invention, in order to solve the above problems, (5) (A) a hydrophilic transparent resin layer is formed on a transparent substrate, and (B) a hydrophilic transparent resin layer is formed on the transparent transparent resin layer. Forming an electrolytic plating layer and blackening the hydrophilic transparent resin layer from the back side, (C) forming an electroplating layer on the electroless plating layer,
(D) forming a black electroplating layer on the electroplating layer,
(E) forming a resist portion having a desired pattern on the black electroplating layer, and (F) etching away the black electroplating layer in a portion where the resist portion is not formed and removing the hydrophilic portion under the electroless plating layer. The transparent resin layer was formed into a black pattern as viewed from the back side, and (G) the resist portion on the black electroplated layer was removed from the black electroplated layer.

According to the present invention, the black electroplating layer in the above (4) or (5) is preferably a nickel-based, chromium-based, tin-based,
It was composed of a rhodium-based or ruthenium-based metal.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings with reference to embodiments. FIG. 1 shows Patent No. 2,71
It is sectional drawing of the translucent electromagnetic wave shielding material of 7,734 gazettes. 2 and 3 are cross-sectional views showing an embodiment of the translucent electromagnetic wave shielding material of the present invention. 4 and 5 are cross-sectional views showing each step of the method for manufacturing a translucent electromagnetic wave shielding material according to the present invention. 1 is a transparent substrate, 2 is a hydrophilic transparent resin layer, 4 is an electroless plating layer, 5 is a resist portion, 6 is a black pattern portion, 7 is an electroplating layer, 8 is a black electroplating layer, and 9 is a side surface. I have.

Hereinafter, the manufacturing method of the present invention will be mainly described. First, a hydrophilic transparent resin layer 2 is formed on a transparent substrate 1 (see FIGS. 4A and 5A).

As the transparent substrate 1, glass, acrylic resin, polycarbonate resin, polyethylene resin, AS
There are plate-like and film-like substrates made of resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, cellulose acetate resin, polysulfone resin, polyethersulfone resin, polyvinyl chloride resin, and the like. The shape of the transparent substrate 1 is not necessarily required to be flat, but may be curved.

The hydrophilic transparent resin layer 2 only needs to be capable of being blackened in a subsequent electroless plating step, and is suitably made of a vinyl alcohol resin, an acrylic resin, a cellulose resin, or the like. For example, as a vinyl alcohol resin,
Ethylene-vinyl alcohol copolymer, vinyl acetate-vinyl alcohol copolymer and the like are preferable. Further, as the acrylic resin, polyhydroxyethyl acrylate, polyhydroxypropyl acrylate, polyhydroxyethyl methacrylate, polyhydroxypropyl methacrylate, polyacrylamide, polymethylolacrylamide, a copolymer thereof, or the like is preferable. Further, as the cellulosic resin, nitrocellulose, acetylcellulose, acetylpropylcellulose, acetylbutylcellulose and the like are preferable. Examples of a method for forming the hydrophilic transparent resin layer 2 include spin coating, roll coating, die coating, dip coating, and bar coating.

Next, an electroless plating layer 4 is formed on the hydrophilic transparent resin layer 2 (see FIGS. 4B and 5B).
By this step, the hydrophilic transparent resin layer 2 is blackened. Specifically, the hydrophilic transparent resin layer 2 is immersed in a chemical plating catalyst solution such as a palladium catalyst solution. Alternatively, a palladium compound or a silver compound serving as a plating nucleus for electroless plating may be dispersed and contained in the hydrophilic transparent resin layer 2 in advance. In this case, it is not necessary to immerse the hydrophilic transparent resin layer 2 in the chemical plating catalyst solution. Next, the hydrophilic transparent resin layer 2 on which the electroless plating nuclei are formed is immersed in an electroless plating solution to form an electroless plating layer 4. By this electroless plating, the hydrophilic transparent resin layer 2 is blackened.
Suitable types of electroless plating are copper and nickel. When using highly conductive copper, the electroless plating layer 4
The film thickness is preferably 0.2 μm to 5 μm. When the thickness is less than 0.2 μm, the electromagnetic wave shielding effect is low. When the thickness is more than 5 μm, it becomes difficult to pattern fine lines by etching.

Further, an electroplating layer 7 can be further formed on the surface of the electroless plating layer 4 in order to increase the plating film forming speed (see FIG. 5C). When the electroplating layer 7 is used in combination, a shielding material having a high electromagnetic wave shielding effect can be quickly formed. When using the electroplating layer 7 together,
The thickness of the electroless plating layer 4 may be 0.5 μm or less. In this case, the role of the electroless plating layer 7 is to form black on the lower surface of the electroless plating layer 7 and to form a base conductive layer for the electroplating layer 7.

In the present invention, it was confirmed that a method of forming a black electroplating layer so as to cover only the upper surfaces of the electroless plating layer or the electroless plating layer and the electroplating layer was confirmed to be suitable. Further, it was confirmed that the black electroplating layer was more optimal if it was made of a nickel-based, chromium-based, tin-based, rhodium-based, or ruthenium-based metal.

A method for manufacturing a light-transmitting electromagnetic wave shielding material according to the first embodiment of the present invention will be described with reference to steps (A) to (F) shown in FIGS. 4A to 4F.

First, as shown in FIG. 4A, a hydrophilic transparent resin layer 2 is formed on the entire surface of a transparent substrate 1 (step (A)).

Next, as shown in FIG. 4B, an electroless plating layer 4 is formed on the entire surface of the hydrophilic transparent resin layer 2, and the hydrophilic transparent resin layer 2 is viewed from the back side (ie, from the lower side in FIG. 4B). (Step (B)).

Next, as shown in FIG. 4C, a black electroplating layer 8 is formed on the entire surface of the electroless plating layer 4 by plating using, for example, the following black electronickel plating solution (step ( C)). Hereinafter, an example of the above-described black electro-nickel plating solution will be described. <Black electro nickel plating solution> Nickel sulfate 100 g / L Nickel ammonium sulfate 30 g / L Zinc sulfate 15 g / L Sodium thiocyanate 10 g / L

The plating temperature at the time of plating with the black electrolytic nickel plating solution is suitably from 30 ° C. to 70 ° C. If the temperature is lower than 30 ° C., the reaction hardly proceeds, and if the temperature exceeds 70 ° C., it is difficult to control the plating solution. The current density at the time of the above plating is 0.1.
1A / sq. Decimeter to 5A / sq. Decimeter are suitable. If the thickness is less than 0.1 A / square decimeter, it is difficult to form a film, and if it exceeds 5 A / square decimeter, the black electroplated layer 8 becomes brittle, which is not preferable.

Next, as shown in FIG. 4D, a resist portion 5 having a desired pattern is formed on the black electroplated layer 8 (step (D)). The resist portion 5 is not removed when the plating layer is removed in a later step, and is preferably made of a polyvinyl cinnamate resin, a polyisoprene resin, a quinonediazide resin, or the like. The pattern of the resist portion 5 is designed so that the transparency and conductivity of the light-transmitting electromagnetic wave shielding material are ensured. The resist portion 5 is preferably formed on the black electroplating layer 8 by a printing method or a photolithography method.

Next, as shown in FIG. 4E, a portion of the black electroplating layer 8 where the resist portion 5 is not formed is formed.
Is removed by etching, and the hydrophilic transparent resin layer 2 under the electroless plating layer 4 is formed into a black pattern as viewed from the back side (step (E)). By this step, a black pattern portion 6 corresponding to the black electroplating layer 8 is formed below the patterned black electroplating layer 8. In addition, the hydrophilic transparent resin layer 2 at the portion where the black electroplating layer 8 is removed, that is, the portion where the black color is removed, shows translucency. The etching solution used for the above-mentioned etching is appropriately selected depending on the kind of metal constituting the black electroplating layer 8. For example, if the metal forming the black electroplating layer 8 is nickel, copper, or tin, an aqueous ferric chloride solution may be used as the etchant. If the metal forming the black electroplating layer 8 is chromium-based, It is preferable to use a mixed solution of ceric ammonium nitrate, perchloric acid and water as an etching solution.

Then, the resist portion 5 is further removed from the black electroplated layer 8 by dissolution and removal with an aqueous alkali solution or an organic solvent (step (F)). As a result, a translucent electromagnetic wave shielding material as shown in FIG. 4F is obtained.

In the manufacturing method of the first embodiment, the black electroplating layer 8 is selectively laminated only on the conductive portion, that is, the electroless plating layer 4 by the electric action. There is no physical impact or chemical change on the transparent resin layer 2 or the electroless plating layer 4. For this reason,
The transparency of the hydrophilic transparent resin layer 2 does not decrease, and the electromagnetic wave shielding effect does not decrease due to the damage of the electroless plating layer 4. In addition, the conductivity of the electroless plating layer 4 does not decrease, and it is not difficult to take the ground.

In the manufacturing method according to the first embodiment,
Since the black electroplating layer 8 covers only the upper surface of the patterned electroless plating layer 4, the side surface 9 of the electroless plating layer 4
Since there is no black electroplating layer 8, there is no increase in the pattern line width, and there is no decrease in transmittance due to the formation of the black electroplating layer 8. In particular, when the thickness of the electroless plating layer 4 is 5 μm or less, the transmittance of the light-transmitting electromagnetic wave shielding material does not decrease, and the visibility decreases due to the exposure of the side surfaces of these layers when viewed obliquely. You can manufacture untitled products.

Next, a method for manufacturing a transparent electromagnetic wave shielding material according to a second embodiment of the present invention will be described with reference to steps (A) to (G) shown in FIGS. 5A to 5G.

First, as shown in FIG. 5A, a hydrophilic transparent resin layer 2 is formed on the entire surface of a transparent substrate 1 (step (A)).

Next, as shown in FIG. 5B, an electroless plating layer 4 is formed on the entire surface of the hydrophilic transparent resin layer 2, and the hydrophilic transparent resin layer 2 is viewed from the back side (ie, from the lower side in FIG. 5B). (Step B)).

Next, as shown in FIG. 5C, an electroplating layer 7 is formed on the entire surface of the electroless plating layer 4 (step (C)).

Next, as shown in FIG. 5D, a black electroplating layer 8 is formed on the entire surface of the electroplating layer 7 by plating using, for example, the following black electronickel plating solution (step (D)). )). Hereinafter, an example of the above-described black electro-nickel plating solution will be described. <Black electrolytic nickel plating solution> Nickel sulfate 80 g / L Nickel ammonium sulfate 50 g / L Zinc sulfate 30 g / L Sodium thiocyanate 20 g / L

The plating temperature at the time of plating with the black electro-nickel plating solution is suitably 30 ° C. to 70 ° C. If the temperature is lower than 30 ° C., the reaction hardly proceeds, and if the temperature exceeds 70 ° C., it becomes difficult to control the plating solution. The current density during the plating is suitably from 0.1 A / sq. Decimeter to 5 A / sq. Decimeter. If the thickness is less than 0.1 A / square decimeter, it is difficult to form a film, and if it exceeds 5 A / square decimeter, the black electroplated layer 8 becomes brittle.

Next, as shown in FIG. 5E, a resist portion 5 having a desired pattern is formed on the black electroplated layer 8 (step (E)). The resist portion 5 is not removed together when the plating layer is removed in a later step, and is preferably made of a polyvinyl cinnamate resin, a polyisoprene resin, a quinonediazide resin, or the like. The pattern of the resist portion 5 is designed so that the transparency and conductivity of the light-transmitting electromagnetic wave shielding material are ensured. The resist section 5 may be formed by a printing method or a photolithography method.

Next, the black electroplating layer 8 where the resist portion 5 is not formed is removed by etching, and the hydrophilic transparent resin layer 2 under the electroless plating layer 4 is formed into a black pattern as viewed from the back side. (Step (F)). By this step, a black pattern portion 6 corresponding to the non-removed portion of the patterned electroless plating layer 4 is formed below the non-removed portion. Further, the portion of the electroless plating layer 4 from which the above-described removed portion has been removed, that is, the portion of the hydrophilic transparent resin layer 2 from which black has been removed shows translucency. The etchant used for the above etching is appropriately selected depending on the type of metal constituting the black electroplating layer 8, the electroplating layer 7, and the electroless plating layer 4. For example, if the metal constituting the black electroplating layer 8, the electroplating layer 7, and the electroless plating layer 4 is nickel, copper, or tin, an aqueous ferric chloride solution may be used as an etchant. If the metal constituting the layer 8, the electroplating layer 7, and the electroless plating layer 4 is chromium, a mixed solution of ceric ammonium nitrate, perchloric acid and water may be used as an etchant.

Then, the resist portion 5 is further removed from the black electroplated layer 8 by dissolving and removing the resist portion with an aqueous alkali solution or an organic solvent. Thereby, a translucent electromagnetic wave shielding material as shown in FIG. 5G is obtained.

In the second embodiment, the black electroplated layer 8 is selectively laminated only on the conductive portion, that is, the electroless plated layer 4 by the electric action.
There is no physical impact or chemical change on the hydrophilic transparent resin layer 2 or the electroless plating layer 4. For this reason, the transparency of the hydrophilic transparent resin layer 2 does not decrease, and the electromagnetic wave shielding effect does not decrease due to the damage of the electroless plating layer 4. In addition, the conductivity of the electroless plating layer 4 does not decrease, and it is not difficult to take the ground.

In the second embodiment, since the black electroplating layer 8 covers only the upper surface of the patterned electroplating layer 7, the side surface 9 of the electroplating layer 7 and the side surface 9 of the electroless plating layer 4 are formed. Has no black electroplating layer 8,
There is no increase in the pattern line width, and there is no decrease in transmittance due to the formation of the black electroplated layer 8. In particular, when the total thickness of the electroless plating layer 4 and the electroplating layer 7 is 5 μm or less, the transmittance of the translucent electromagnetic wave shielding material does not decrease, and
When viewed obliquely, it is possible to manufacture a layer having no problem that the visibility is reduced by exposing the side surfaces of these layers.

The above manufacturing methods of the first and second embodiments can be appropriately selected and used as needed.

In each of the above embodiments, the black electroplating layer 8 is made of a nickel-based, chromium-based, tin-based, rhodium-based, or ruthenium-based metal, or any alloy thereof. Can be.

Example 1 (See FIGS. 2 and 4 according to the first embodiment) First, a methanol solution of polyhydroxypropyl acrylate and a palladium catalyst was applied on a glass plate having a thickness of 3 mm, and the solution was applied for 45 minutes. Dried at 90 ° C. Then 40
After electroless copper plating at ℃, washed with water and dried. Subsequently, a black electroplating layer was formed using the following black electronickel plating solution. <Black electro-nickel plating solution> Nickel sulfate 70 g / L Nickel ammonium sulfate 40 g / L Zinc sulfate 20 g / L Sodium thiocyanate 15 g / L Plating temperature was 30 ° C and current density was 1 A / square decimeter. Next, a line width of 20 μm and a pitch of 200 μm
Was formed by photolithography. Note that the resist portion 5 was provided with a solid portion on the outer frame of the glass plate in order to take an earth portion around the lattice pattern (see FIG. 6). Next, the resist was etched with an aqueous solution of ferric chloride, washed with water and dried, and then the resist was removed. In the obtained translucent electromagnetic wave shielding material, the light reflectance of the black electroplated layer was 8%, and the visibility was extremely high.

<Example 2> (See FIGS. 3 and 5 according to the second embodiment) Thickness 188 μm
Then, a dichloromethane-dimethylformamide mixed solution containing cellulose acetate and a silver catalyst was applied onto a PET film of m and dried at 100 ° C. for 3 minutes. Then 5
Electroless nickel plating was performed at 5 ° C. to obtain an electroless plating layer having a thickness of 0.3 μm, and the hydrophilic transparent resin layer was blackened when viewed from the back surface. Next, a 2 μm-thick electrolytic copper plating layer was formed on the entire surface of the electroless plating layer by electrolytic copper plating. Then, electroplating was carried out under the following conditions to form a black electroplated layer on the entire surface of the electroplated copper layer. Stannous chloride 19 g / L Nickel chloride 40 g / L Copper pyrophosphate 3 g / L Potassium pyrophosphate 215 g / L Additive 5 g / L Current density 0.5 A / square decimeter, temperature for 90 seconds was 37 ° C. Next, a resist portion having a lattice pattern with a line width of 20 μm and a pitch of 280 μm was formed thereon by photolithography. Next, this was etched with an aqueous ferric chloride solution, washed with water, dried, and then the resist was removed. The obtained translucent electromagnetic wave shielding material is
The reflectance as viewed from the black plating layer side was 10%, and the visibility was extremely high.

[0046]

According to the translucent electromagnetic wave shielding material and the method for manufacturing the same of the present invention, the black electroplated layer is formed by a conductive portion (electroless plated layer or electroless plating layer) patterned by an electric action. Layer and the electroplating layer), the following effects can be obtained. (1) Since no physical impact or chemical change is given to the hydrophilic transparent resin layer and the electroless plating layer, or the hydrophilic transparent resin layer, the electroless plating layer and the electroplating layer, the hydrophilic transparent resin layer Of the electroless plating layer does not decrease, and the electromagnetic wave shielding effect does not decrease due to damage to the electroless plating layer. In addition, since the conductivity of the electroless plating layer does not decrease, there is no problem that grounding is difficult to take. (2) Since the black electroplating layer is formed on the metallic glossy surface, the visibility from the metallic glossy surface can be improved. Therefore, the metallic glossy surface can be used facing the observer, and the grounding surface can be directed to the observer side and the panel side, so that the degree of freedom of use can be expanded.

Further, there are the following effects. That is, in this case, since there is no black electroplating layer on the side surface of the electroless plating layer or the side surface of the electroplating layer, there is no increase in the pattern line width, and there is no decrease in transmittance due to the formation of the black electroplating layer. .

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of a conventional light-transmitting electromagnetic wave shielding material.

FIG. 2 is a partial cross-sectional view showing one embodiment of the translucent electromagnetic wave shielding material of the present invention.

FIG. 3 is a partial cross-sectional view showing one embodiment of the translucent electromagnetic wave shielding material of the present invention.

FIG. 4 is a cross-sectional view showing one step of a method for manufacturing a translucent electromagnetic wave shielding material of the present invention.

FIG. 5 is a cross-sectional view showing one step of a method for manufacturing a translucent electromagnetic wave shielding material of the present invention.

FIG. 6 is a plan view showing one embodiment of a translucent electromagnetic wave shielding material of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent substrate 2 Hydrophilic transparent resin layer 4 Electroless plating layer 5 Resist part 6 Black pattern part 7 Electroplating layer 8 Black electroplating layer 9 Side surface

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C25D 7/00 C25D 7/00 Z 5E321 G02B 1/10 G02B 1/10 Z F term (Reference) 2K009 BB02 BB11 CC14 CC24 CC34 DD01 DD12 EE03 4F100 AB01D AB13D AB16 AB16D AB21D AG00 AJ04 AK01B AK25 AK42 AT00A BA04 BA07 BA10A BA10D EH46 EH462 EH71 EH71C EH71D EH712 EJ15 EJ152 EJ86 GB41 JBNJJBJA01 JB05 JB05 JB05 JB05 JB05 JB05A EA04 4K024 AA02 AA03 AA07 AA09 AA12 AB04 AB13 AB17 BA12 BA15 BB21 BB28 FA07 FA08 GA16 4K044 AA12 AA16 AB02 BA02 BA06 BA08 BA10 BA21 BB02 BB15 BB16 BC14 CA15 CA18 CA53 5E321 AA04 BB23 BB25 GG01

Claims (6)

[Claims] 1. A hydrophilic transparent resin layer is laminated on a transparent substrate, an electroless plating layer is laminated on the hydrophilic transparent resin layer in a pattern, and a hydrophilic transparent resin layer below the electroless plating layer is formed on the transparent transparent resin layer. In a translucent electromagnetic shielding material in which a black pattern portion is formed and a black electroplating layer covering the electroless plating layer is laminated, the black electroplating layer covers only the upper surface of the electroless plating layer. Characteristic translucent electromagnetic wave shielding material. 2. A hydrophilic transparent resin layer is laminated on a transparent substrate, an electroless plating layer is laminated on the hydrophilic transparent resin layer in a pattern, and a hydrophilic transparent resin layer below the electroless plating layer is formed on the transparent transparent resin layer. A black pattern portion is formed, an electroplating layer is laminated on the electroless plating layer, and a translucent electromagnetic wave shielding material in which a black electroplating layer covering the electroless plating layer and the electroplating layer is laminated. A transparent electromagnetic wave shielding material, wherein a black electroplating layer covers only the upper surface of the electroplating layer. 3. The light-transmitting electromagnetic wave shielding material according to claim 1, wherein the black electroplating layer is made of a nickel-based, chromium-based, tin-based, rhodium-based, or ruthenium-based metal. (A) forming a hydrophilic transparent resin layer on a transparent substrate; and (B) forming an electroless plating layer on the hydrophilic transparent resin layer and viewing the hydrophilic transparent resin layer from the back side. (C) forming a black electroplating layer on the electroless plating layer, (D) forming a resist portion having a desired pattern on the electroless plating layer, and (E) a portion where the resist portion is not formed. Removing the black electroplated layer by etching, and forming the hydrophilic transparent resin layer under the electroless plated layer into a black pattern as viewed from the back side, and (F) removing the resist portion from the black electroplated layer. A method for producing a light-transmitting electromagnetic wave shielding material, comprising: 5. A hydrophilic transparent resin layer is formed on (A) a transparent substrate, and (B) an electroless plating layer is formed on the hydrophilic transparent resin layer so that the hydrophilic transparent resin layer is viewed from the back side. Blackening, (C) forming an electroplating layer on the electroless plating layer, (D) forming a black electroplating layer on the electroplating layer, and (E) forming a resist portion of a desired pattern on the black electroplating layer. (F) etching away the black electroplating layer in the portion where the resist portion is not formed, and forming the hydrophilic transparent resin layer under the electroless plating layer into a black pattern as viewed from the back side, (G) A method for manufacturing a light-transmitting electromagnetic wave shielding material, comprising: removing the resist portion on the black electroplated layer from the black electroplated layer. 6. The production of a light-transmitting electromagnetic wave shielding material according to claim 4, wherein the black electroplating layer is made of a nickel-based, chromium-based, tin-based, rhodium-based, or ruthenium-based metal. Method.