JP2001143029A - Manufacturing method of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an IC card which has a solid structure antenna, having high sensitivity, directivity and reliability. SOLUTION: Plural linear antenna line patterns 32 are formed on a sheet 31 for a card substrate, and conductive adhesive layers 341aa or the like are formed on both the end parts of each pattern 32. Then an insulating layer 33 is formed on the sheet 31, excluding the adhesive layers, and an IC chip 42 is mounted on a prescribed conductive adhesive layer. Then the sheet 31 is folded and the conductive layers formed on the end parts on the mutually different sides of these adjacent patterns 32 are joined together. Then the joined conductive adhesive layers are mutually connected by heat treatment, to form a solid structure antenna line 41.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card, and more particularly to a card substrate, an IC chip mounted on the card substrate, and a three-dimensionally structured antenna wire formed on the card substrate and connected to the IC chip. And a method of manufacturing an IC card having:

[0002]

2. Description of the Related Art In recent years, IC cards having antenna lines for exchanging information without contact have been used in the fields of transportation, finance, distribution, and the like. When high sensitivity is particularly required in this type of IC card, an IC card having a three-dimensionally structured antenna line formed on a card substrate is used.

FIGS. 8 to 13 are perspective views showing an example of a conventional method for manufacturing an IC card. First, an insulating plastic sheet is cut to form a card substrate 1 having a size of one IC card 10 (see FIG. 8). Then, a conductive paste is applied on the card substrate 1 to form the antenna line pattern 2 (see FIG. 9). The antenna wire pattern 2 formed here is a three-dimensional antenna wire 1
1 and a second forming portion 22 for connecting the three-dimensionally structured antenna wire 11 with the IC chip 12 and the capacitor 13.

A plurality of first forming portions 21 (3 in this example)
The present embodiment has a configuration in which the linear patterns 21a, 21b, and 21c are arranged in parallel at predetermined intervals. The one end 21aa of the end pattern 21a is formed to be bifurcated so that it can be connected to the IC chip 12 and the capacitor 13, respectively. 2nd formation part 22
Has a configuration in which one linear pattern 22a is arranged in parallel along the arrangement direction of each pattern 21a, 21b, 21c of the first forming portion 21. One end 22aa of the pattern 22a on the pattern 21a side of the first forming portion 21 is formed to be forked so as to be connectable to the IC chip 12 and the capacitor 13, respectively.

Next, each pattern 21 of the first forming portion 21
An insulating paste is applied so as to cross the substantially central portions of a, 21b, and 21c to form an insulating layer 3 (see FIG. 10). Then, the IC chip 12 and the capacitor 13 are
One end 21aa of the pattern 21a of the first forming part 21 and one end 22aa of the pattern 22a of the second forming part 22 are electrically connected and mounted on the card substrate 1 (see FIG. 11).

Next, a conductive paste is applied on the insulating layer 3 to form the antenna line pattern 2 (see FIG. 12). The antenna line pattern 2 formed here is constituted by the third forming portion 23 which becomes the three-dimensional structure antenna line 11. The third forming portion 23 is formed of the respective ends of the patterns 21a, 21b, and 21c of the first forming portion 21 on different sides of the adjacent pattern, that is, the other end 21ab of the pattern 21a.
23a connecting the other end 21bb of the pattern 21b to one end 21ba of the pattern 21b and the pattern 23 connecting the other end 21bb of the pattern 21b to the one end 21ca of the pattern 21c.
b, and a pattern 23c connecting the other end 21cb of the pattern 21c and the other end 22ab of the pattern 22a of the second forming portion 22.

Through the above steps, each of the patterns 21a, 21b, 21 of the first forming portion 21 is formed by using the insulating layer 3 as an intermediate layer.
c and each pattern 23a, 23b, 23 of the third forming portion 23
The spiral three-dimensional antenna wire 11 is formed at c. Finally, an exterior label is attached to the surface of the card substrate 1 to complete the final IC card 10 (see FIG. 13). still,
In the above-described example, the insulating plastic sheet is cut and the card substrate 1 having the size of one IC card 10 is formed, and then the final IC card 10 is manufactured. After forming a plurality of sets of antenna line patterns 2 and the like on the above, the insulating plastic sheet may be cut for each set to manufacture a plurality of final IC cards 10.

[0008]

In the conventional method for manufacturing the IC card 10 described above, the first forming portion 21 is formed on the card substrate 1 by applying a paste material in order to form the three-dimensionally structured antenna line 11. , Insulating layer 3, third forming section 2
3 are sequentially stacked, and the respective ends of the first forming portion 21 and the third forming portion 23 are connected.

Therefore, the first forming part 21 and the third forming part 2
Since it is difficult to use a conductor plate or a conductor film having a low high-frequency resistance for 3, the antenna impedance increases, and the sensitivity and directivity of the three-dimensional antenna wire 11 may not satisfy desired characteristics. On the other hand, if an insulating plate or an insulating film having high magnetic permeability is used for the insulating layer 3 in order to enhance the sensitivity and directivity of the three-dimensional antenna wire 11, the thickness of the insulating layer 3 becomes too large. Poor connection between the ends of the forming portion 21 and the third forming portion 23 may occur, and the reliability of the three-dimensional antenna wire 11 may be reduced.

The present invention has been made in view of the above-mentioned circumstances, and has as its object to provide a method for manufacturing an IC card having a three-dimensionally structured antenna line having high sensitivity, directivity, and reliability.

[0011]

According to the present invention, there is provided a card board, and an IC mounted on the card board.
A method of manufacturing an IC card having a C chip and a three-dimensional antenna line formed on the card substrate and connected to the IC chip, wherein a virtual bending line is set on a card substrate sheet, On the card substrate sheet, a plurality of linear antenna line patterns that are inclined at a predetermined angle with respect to the bending line with the bending line as a center line, and that are arranged in parallel at a predetermined interval from each other, Forming, forming a conductive adhesive layer on both ends of each antenna wire pattern, on one side of the bending line, and on the card board sheet excluding the conductive adhesive layer Forming an insulating layer, mounting the IC chip on the predetermined conductive adhesive layer, folding the card board sheet along the bending line, and determining the difference between adjacent antenna line patterns. It is matched the conductive adhesive layer between which is formed at the end of that side, and connected by heat-treating the conductive adhesive layer is matched, is accomplished by forming the three-dimensional structure antenna line.

According to the above construction, the card board sheet is folded together with the plurality of discontinuous linear antenna wire patterns formed on the card board sheet, and predetermined ends of the antenna wire patterns are connected. A spiral three-dimensional structure antenna line is formed. For this reason, it is possible to use a conductor plate or a conductor film having a small high-frequency resistance for the antenna wire pattern, and it is possible to enhance the sensitivity and directivity of the three-dimensionally structured antenna wire. Furthermore, in order to increase the sensitivity and directivity of the three-dimensional antenna wire, it is necessary to securely connect each end of the antenna wire pattern even if an insulator plate or an insulator film with high magnetic permeability is used for the insulating layer. And the reliability of the three-dimensionally structured antenna line can be improved.

[0013]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description in the following description. It is not limited to these forms unless otherwise stated.

1 to 7 are perspective views showing an embodiment of a method for manufacturing an IC card according to the present invention. First, for example, polyethylene terephthalate (PET), polyimide (P
A flexible insulating plastic sheet (sheet for card substrate) made of I) or the like is cut to produce a card substrate 31 twice as large as one IC card 40. That is, when the card substrate 31 is bent along a virtual bending line B indicated by a one-dot chain line in the drawing, it is created so as to have the size of one IC card 40.

At this time, a bending line B
When the card substrate 31 is bent by the above, the IC chip 42 mounted on the card substrate 31a on one side and the card substrate 31b on the other side
A punched hole 31c having a size that does not make contact with 2 is provided in the card substrate 31b on the other side (see FIG. 1). Thereby, IC
The chip 42 can be stored in the hole 31c.
The mounting of the C chip 42 can be stabilized, and the thickness of the entire IC card 40 can be prevented from increasing, thereby achieving uniformity.

Then, a conductor plate or a conductor film made of, for example, copper (Cu), aluminum (Al) or the like having a low high frequency resistance is etched or attached on the card substrate 31 to form an antenna line pattern 32 ( (See FIG. 2). Antenna wire pattern 3 formed here
2 is a first forming portion 321 to be the three-dimensional structure antenna wire 41
And a second forming portion 322 for connecting the three-dimensionally structured antenna wire 41 to the IC chip 42 and the capacitor 43.

The first forming portion 321 includes a plurality (three in this example) of linear patterns 321a, 321b, and 321.
c are inclined at a predetermined angle θ with respect to the bending line B about the bending line B as a center line, and are arranged in parallel with a predetermined interval d therebetween. The one end 321aa of the end pattern 321a is formed in two forks so that it can be connected to the IC chip 42 and the capacitor 43, respectively.

The second forming portion 322 includes a single linear pattern 322a formed by each of the patterns 321 of the first forming portion 321.
a, 321b, and 321c are arranged in parallel along the arrangement direction. Then, one end 3 of the pattern 322a on the pattern 321a side of the first forming portion 321
22aa is bifurcated so that it can be connected to the IC chip 42 and the capacitor 43, respectively.

Next, the first forming part 321 and the second forming part 3
22 patterns 321a, 321b, 321c and 3
Both ends 321aa, 321ab, 321ba of the 22a,
321bb, 321ca, 321cb and 322aa,
322ab is coated with a conductive adhesive, and the conductive adhesive layer 34
1aa, 341ab, 341ba, 341bb, 341
ca, 341cb and 342aa, 342ab are formed.

Thereafter, the conductive adhesive layers 341aa, 341ab, and 341b are located on one side of the bending line B.
a, 341bb, 341ca, 341cb and 342a
a, manganese (Mn) -zinc (Zn) ferrite (50M
n, 50Zn), Supermalloy (5Mo, 79Ni),
A high-permeability insulating plate or film made of 78 permalloy (78.5Ni) is attached to form an insulating layer 33 (see FIG. 3). Then, the IC chip 42 and the capacitor 43 are connected to the pattern 321a of the first forming portion 321.
Of one end 321aa and pattern 3 of second forming portion 322
It is mounted on the card substrate 31 by being electrically connected to one end 322aa of the 22a (see FIG. 4).

Next, the card substrate 31 is bent at the bending line B (see FIG. 5), and the conductive patterns at the ends of the patterns 321a, 321b and 321c of the first forming portion 321 on the different side of the adjacent pattern. The conductive adhesive layer, that is, the conductive adhesive layer 341ab and the conductive adhesive layer 341ba, the conductive adhesive layer 341bb and the conductive adhesive layer 341ca, and the conductive adhesive layer 341cb and the conductive adhesive layer 342ab of the second formation portion 322 are matched. . Then, the matched conductive adhesive layers 341ab and 341ba and 341bb and 341c
a, and 341cb and 342ab are joined by thermocompression bonding by hot pressing or roll hot pressing (see FIG. 6).

Through the above steps, each pattern 321a, 321 of the first forming portion 321 is formed by using the insulating layer 33 as an intermediate layer.
A spiral three-dimensional structure antenna wire 41 is formed only by b and 321c. Thereby, the three-dimensional antenna wire 41 can be formed by a conductor plate or a conductor film having a small high-frequency resistance, and the insulating layer 33 can be formed by a highly permeable insulator plate or an insulator film. Since it is possible to concentrate on the center of the three-dimensional antenna wire 41, the sensitivity of the three-dimensional antenna wire 41 can be increased. Finally, an external label is attached to the surface of the card board 31,
The final IC card 40 is completed (see FIG. 7).

In the above example, the insulating plastic sheet is cut to produce a card substrate 31 twice as large as one IC card 40, and then the final IC card 40 is manufactured. However, after forming a plurality of sets of antenna wire patterns 32 and the like on the insulating plastic sheet, the insulating plastic sheet is cut into each set, and is twice as large as one IC card 40. After the card substrate 31 is prepared, a plurality of final IC cards 40 may be manufactured.

[0024]

As described above, according to the present invention, an I-wire having a three-dimensional antenna having high sensitivity, directivity and high reliability is provided.
You can get a C card.

[Brief description of the drawings]

FIG. 1 is a first perspective view showing an embodiment of a method for manufacturing an IC card of the present invention.

FIG. 2 is a second perspective view showing an embodiment of the method for manufacturing an IC card of the present invention.

FIG. 3 is a third perspective view showing an embodiment of the method for manufacturing an IC card of the present invention.

FIG. 4 is a fourth perspective view showing an embodiment of the method for manufacturing an IC card of the present invention.

FIG. 5 is a fifth perspective view showing the embodiment of the method for manufacturing an IC card of the present invention.

FIG. 6 is a sixth perspective view showing an embodiment of the method for manufacturing an IC card of the present invention.

FIG. 7 is a seventh perspective view showing the embodiment of the method for manufacturing an IC card of the present invention.

FIG. 8 shows a first example of a conventional method for manufacturing an IC card.
FIG.

FIG. 9 shows a second example of a conventional method for manufacturing an IC card.
FIG.

FIG. 10 is a third perspective view showing an example of a conventional method for manufacturing an IC card.

FIG. 11 is a fourth perspective view showing an example of a conventional method for manufacturing an IC card.

FIG. 12 is a fifth perspective view showing an example of a conventional method for manufacturing an IC card.

FIG. 13 is a sixth perspective view showing an example of a conventional method for manufacturing an IC card.

[Explanation of symbols]

31: Card board, 31c: Drilled hole, 3
2 ... antenna line pattern, 321 ... first forming part, 322 ... second forming part, 321 a, 321 b, 3
21c, 322a ... pattern, 33 ... insulating layer,
341aa, 341ab, 341ba, 341bb, 3
41ca, 341cb, 342aa, 342ab ...
Conductive adhesive layer, 40: IC card, 41: three-dimensional antenna wire, 42: IC chip, 43: capacitor

Claims (8)

[Claims] A card substrate; an IC chip mounted on the card substrate; and an IC chip formed on the card substrate.
A three-dimensional antenna line connected to a C chip
A method for manufacturing a C card, comprising: forming a plurality of linear antenna wire patterns on a card substrate sheet; forming a conductive adhesive layer on both ends of each of the antenna wire patterns; An insulating layer is formed on the card substrate sheet excluding the conductive adhesive layer, the IC chip is mounted on the predetermined conductive adhesive layer, and the card substrate sheet is bent and adjacent to the IC chip. Forming the three-dimensionally structured antenna wire by matching the conductive adhesive layers formed on the end portions on the different sides of the antenna wire pattern, and connecting the matched conductive adhesive layers by heat treatment. A method for manufacturing an IC card. 2. A hole having a size such that the card board sheet does not contact the IC chip when the card board sheet is bent is formed in the card board sheet before forming the antenna line pattern. 2. The method for manufacturing an IC card according to claim 1, wherein the IC card is provided. 3. The IC card according to claim 1, wherein a plurality of sets of the three-dimensionally structured antenna wires and the like are formed on the card board sheet, and then the card board sheet is cut into sets to form an IC card. The manufacturing method of the described IC card. 4. The method according to claim 1, wherein the card substrate sheet is a single IC.
The method for manufacturing an IC card according to claim 1, wherein the IC card is cut into a size capable of forming a card. 5. A card board, an IC chip mounted on the card board, and the I chip formed on the card board.
A three-dimensional antenna line connected to a C chip
A method for manufacturing a C card, wherein a virtual folding line is set on a card board sheet, and a predetermined angle with respect to the folding line is set on the card board sheet with the folding line as a center line. Forming a plurality of linear antenna wire patterns that are inclined and arranged in parallel at a predetermined interval from each other; forming a conductive adhesive layer on both ends of each of the antenna wire patterns; Forming an insulating layer on the card substrate sheet except for the conductive adhesive layer on one side of the boundary, and mounting the IC chip on the predetermined conductive adhesive layer; The card substrate sheet is bent at the bending line to match the conductive adhesive layers formed on the different ends of the adjacent antenna line patterns, and heat-treats the matched conductive adhesive layers. And forming a three-dimensionally structured antenna line. 6. A hole having a size such that the card board sheet does not contact the IC chip when the card board sheet is bent is formed in the card board sheet before forming the antenna line pattern. The method of manufacturing an IC card according to claim 5. 7. The IC card according to claim 5, wherein a plurality of sets of the three-dimensionally structured antenna wires and the like are formed on the card board sheet, and then the card board sheet is cut into sets to form an IC card. The manufacturing method of the described IC card. 8. The method according to claim 1, wherein the card substrate sheet is a single IC.
6. The method for manufacturing an IC card according to claim 5, wherein the IC card is cut into a size capable of forming a card.