JP2001026321A - Separating and cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily separate and cut a thin material body of high adhesiveness by comprising a separating means for separating stacked thin material bodies by horizontally displacing the thin material bodies moving from a lower part to an upper part, and an adsorption pad for adsorbing the separated uppermost thin material body for cutting the same. SOLUTION: This separating and cutting device 100 in which a cassette including a plurality of IC cards 20 is set, is formed in such manner that the IC cards 20 are successively pushed up by an elevator mechanism 110 installed inside thereof, and the cassette 10 is positioned and fixed by fixing rollers 120, 122. A claw part 130 provided with a plurality of air blow communication openings inside thereof and a base part 132 are inserted into the cassette 10 at an upper part of the cassette 10, and a plurality of IC cards 20 are horizontally displaced by the action of the air blown out from the claw part 130. Then the separated uppermost IC card is sucked by an suction pad 134 to be cut.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a separating and cutting apparatus for separating and cutting a laminated thin plate one by one from the top.

[0002]

2. Description of the Related Art Conventionally, after a thin plate-like object such as an IC card is manufactured, it is stored in a storage container and transported.
Then, for example, using an IC card issuing machine,
When writing necessary data into the C card, the necessary data is written after separating and cutting out the IC cards one by one from the storage container. Similarly, when a predetermined symbol or the like is stamped on the surface of an IC card using a stamping machine, the IC card is separated from the storage container one by one and cut out, and the predetermined symbol or the like is cut out. It is engraved. Also, when printing a predetermined pattern, character, or the like on the surface of an IC card using a printing machine, an I
After separating and cutting out the C cards one by one, predetermined characters and the like are engraved.

[0003] The separation and cut-out device is used to separate and cut out IC cards one by one from a storage container when processing an IC card or the like. As a conventional separation and cutout device, an upper cutout type and a lower cutout type are known. The upper cut-out type separation and cut-out device pushes up the IC card in the storage container from below and blows the air blow on the IC card at the top, and forcibly presses the IC card with a baffle plate while pulling it up with the suction pad. And cut it into one piece. Further, the separation and cutout device of the bottom cutout method presses the IC card downward from above, and presses the rotating first roller on the lower surface of the IC card at the lowermost stage to remove the IC card from the storage container.
The card is taken out and a second card provided outside the storage container
Is rotated in the opposite direction to the first roller, and is brought into contact with the upper surface of the taken out IC card, so that when two or more IC cards are taken out at the same time, the first and second rotating directions are opposite to each other. This is to separate the two IC cards which are brought into close contact with each other by the second roller.

[0004]

However, there is a problem that the conventional upper cut-out type separation cut-out device cannot be used for a thin plate-like object having good flatness and extremely high adhesion. there were. For example, the front and back surfaces of an IC card are made of a plastic material such as polycarbonate. Before printing characters or the like on the surface, the surface has no irregularities and is flat, so that the adhesion is extremely good. Things. When such thin sheet-like objects with good adhesion are stacked, there is no gap where the air of the air blow enters between the overlapped objects, and many are adsorbed in a state where they stick together, so when they hit the baffle plate There was a problem that it could not be easily bent and could not be separated.

On the other hand, in the separation and cutting device of the lower cutting method, there is a problem that the gap between the upper and lower rollers needs to be adjusted according to the thickness of the object to be separated and cut. For example, as an IC card, the thickness is 0.25 mm, 0.45 mm, 0.5 mm, 0.7
Because there are various thicknesses such as 6 mm, IC
Separation and cut-out processing cannot be performed collectively for those with different card thicknesses.Each time the card thickness is different, the gap between rollers must be adjusted, and there is no general versatility. there were.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a separation and cutting apparatus which can surely separate and cut a thin plate-like object having good adhesion and does not require an adjusting operation for objects having different thicknesses.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a separating and cutting apparatus for separating and cutting one sheet-like object from a plurality of sheet-like objects stacked vertically. Separating means for separating the stacked sheet-shaped objects, which is disposed above the plurality of sheet-shaped objects, and which mechanically shifts the sheet-shaped object moving upward from the bottom, to separate the stacked sheet-shaped objects; and And a suction pad that is arranged above the thin plate-shaped object and that sucks and cuts out the thin plate-shaped object stacked on the uppermost portion separated by the separating means. With this configuration, the stacked thin plate-like objects are effectively separated by shifting the stacked thin plate-like objects in the horizontal direction by the separating and cutting device means, and can be cut out one by one by the suction pad.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a separation and cutting device according to an embodiment of the present invention will be described below with reference to FIGS. In the following description, an IC card will be described as an example of a thin plate-shaped object, but the present invention can be similarly applied to a thin and elastic thin plate-shaped object other than an IC card. First, the overall configuration of the separation and cutting device according to the present embodiment will be described with reference to FIG. FIG. 1 is a side view showing the entire configuration of the separation and cutting device according to one embodiment of the present invention.

[0009] The cassette 10 in which a plurality of IC cards 20 are stored is set in the separating and cutting apparatus 100.
The separation and cutting device 100 is used by being arranged near a device such as an IC card issuing machine.

The separating and cutting device 100 has an elevator mechanism 110 inside. Elevator mechanism 110
Has an arm 112 that can move up and down in the Z direction.
A push-up portion 114 is provided at the tip of the arm 112. Since the push-up portion 114 has a size smaller than the inner diameter of the cassette 10, it can be inserted into the cassette 10. The push-up portion 114 engages with the IC card 20 which is a thin plate-like object in the cassette 10 or a protection plate arranged at the bottom of the IC card, and sequentially pushes the IC card 20 upward. it can. The cassette 10 includes fixed rollers 120 and 122,
Is positioned and fixed by being pressed against the cassette fixing hole 16 provided in the.

In the upper part of the cassette 10, a claw 13
0, the base 132 is inserted into the cassette 10.
By using the claw portion 130 and the base portion 132, the plurality of IC cards 20 are shifted in the horizontal direction, and then the uppermost IC card is sucked by the suction pad 134, and
The card 20 is separated and cut out. The detailed configurations of the claw portion 130 and the base portion 132 will be described later with reference to FIG.

As will be described later with reference to FIG. 3, the claw portion 130 has a light emitting means, and the base 132 has a light receiving means. The signal from the light receiving unit is output to the control unit 140, and the control unit 140 sets the uppermost IC card 20 at the upper end of the cassette 10 such that
It controls the elevator mechanism 110.

Next, the configuration of the cassette 10 used in the separation and cutting device according to the present embodiment will be described with reference to FIG. FIG. 2 is a perspective view showing a configuration of a cassette used in the separation and cutting device according to one embodiment of the present invention.

The cassette 10 is made of an iron sheet material, for example, S
The PC is formed into a square pipe shape by bending. The cassette 10 has a structure without protrusions on the surface. The IC card which is a thin plate-shaped object stored in the cassette 10 has, for example, a length of 85.6 mm and a width of 55.6 mm.
4.0 mm and thickness t = 0.45 to 0.76 mm.

The cassette 10 is an IC having a thickness of 0.45 mm.
Based on the ability to hold 1000 cards, the total length L
1 is 500 mm. The inner diameter is set to a size that allows the IC card to be inserted smoothly, with a gap of about 1 mm all around the IC card, the inner diameter length L2 is 88 mm, and the width L3 is 56 mm. Note that there is no particular problem with this dimension as long as there is a gap of 0.5 mm or more with respect to the IC card. The thickness of the cassette 10 is t = 2 mm, and is galvanized for the purpose of rust prevention.

A stop hole 12 is formed in a side surface of the cassette 10. Eighteen stop holes 12 are formed in the longitudinal direction of the cassette 10 at a pitch P of 27 mm. At the same height position in the longitudinal direction, four stop holes 12 are provided.
a, 12b, 12c, and 12d are formed. The four claws provided on the stopper engage with these stopper holes 12a, 12b, 12c, and 12d, so that the stopper can be fixed to the cassette 10.

At four corners on the bottom side of the cassette 10, bent portions 14a, 14b, 14c and 14d are formed.
A protection plate is placed on the bent portion 14, and an IC card, which is a thin plate-like object, is placed on the protection plate to prevent the plate-like object from falling off the bottom of the cassette 10. ing.

On the bottom side surface of the cassette 10, there are formed cassette fixing holes 16a, 16b and 16c. The cassette 10 can be set as it is in an IC card issuing machine or an engraving machine in addition to storing and transporting a plate-like object. Therefore, when setting the cassette 10 in an IC card issuing machine or an engraving machine, the cassette fixing holes 16a,
16b and 16c are used for fixing the cassette 10. As shown in FIG. 1, a fixing roller 120 is pressed against the cassette fixing hole 16a, and the cassette fixing hole 1a is pressed.
The fixed rollers 122 are pressed against 6b and 16c, and the cassette 10 is positioned and fixed.

Further, an arm insertion window 18 is provided on a side surface of the cassette 10. As shown in FIG. 1, the arm insertion window 18 is used to move the IC card in the cassette 10 sequentially upward when the cassette 10 is set in the separation and cutting device.
Arm 112 can be moved to all positions of the cassette 10. In addition, in the arm insertion window 18,
The claw 132 shown in FIG. 1 is inserted. Further, a window 19 is formed on the upper side surface of the cassette 10. Window 1
9 is provided for inserting the base 130 of the separation and cutting device 100.

Next, a detailed configuration of a main part of the separation and cutting device according to the present embodiment will be described with reference to FIGS. FIG. 3 is an enlarged side view of a main part of the separation and cutting device according to one embodiment of the present invention, and FIG. 4 is an enlarged plan view of a main part of the separation and cutting device according to one embodiment of the present invention.

As shown in FIG. 3, a plurality of IC cards 20 are accommodated in the cassette 10. The tip of the claw portion 130 of the separation and cutting device 100 is inserted into the inside of the cassette 10 through a window 19 formed in the cassette 10. The claw portion 130 has an inclined portion 130A on its lower surface side.
It has. When the IC card 20 moves upward from below (Z direction in the figure), the inclined portion 130A prevents the movement in the Z direction and moves upward in the longitudinal direction of the IC card 20 (X direction in the figure). Side IC card 20A, 20B, 20
It has the function of mechanically shifting C. Also, the claw portion 13
0 is an air blow communication port B1, B2, B
3 and B4. Air blow communication port B1, B
2, B3 and B4, as shown in FIG.
Is provided at a position deviated upward in the figure from the center line in the short side direction of the figure. Air blow communication port B1, B2, B
One end of each of B3 and B4 is open to the inclined portion 130A of the claw portion 130, and the other end is connected to the blower 136. The air compressed by the blower 136 is supplied to the air blow communication ports B1, B1 provided on the inclined portion 130A of the claw portion 130.
B2, B3, and B4 are blown out from the open ends, and the inclined portion 130
A is applied between the ends of the IC cards 20A, 20B, and 20C displaced by A and between the IC cards 20A, 20B, and 20C.
Separate 20B and 20C.

The tip of the base 132 of the separation and cutting device 100 is inserted through an arm insertion window 18 provided on the side surface of the cassette 10 shown in FIG. The base 132 has an inclined portion 132A on the upper side thereof, which is opposed to the inclined portion 130A of the claw portion 130. The inclined portion 132 </ b> A
IC card 20 displaced by zero inclined portion 130A
Hold the deviation.

The uppermost IC card 20A separated by the inclined portion 130A and the air blow is attached to the suction pad 1A.
It is adsorbed by 34 and cut out. Suction pad 13
4 is lower than the center line of the short side direction of the IC card 20 in the figure as shown in FIG.
1, B2, B3, and B4 are provided at positions deviated in the direction opposite to the direction of deviation of the open ends, that is, at diagonal positions with respect to the blowing position of the air blow. The suction pad 134 is an IC
The card 20 is provided to be inclined with respect to the stacking direction of the cards 20 (the Z direction in the figure). The uppermost I by the suction pad 134
When the next IC card 20B is lifted together with the IC card 20A during the suction of the C card 20A,
Using the brush 138 attached to the base 132, the end surface of the next IC card 20B is brought into contact with and scraped off to cut out the IC card. In addition, the lower IC card 20B has a function of preventing the lower IC card 20A from jumping out together with the upper IC card 20A.

A light emitting means 150 such as a light emitting diode is provided above the claw portion 130 of the separation and cutting device 100, and a light emitting diode such as a light receiving diode is provided above the base 132 in opposition to the light emitting means 150. Light receiving means 152 is provided. When the IC card 20 in the cassette 10 is lifted upward by the elevator apparatus 110 shown in FIG. 1 and the uppermost IC card 20A interrupts the optical path from the light emitting means 150 to the light receiving means 152, the light receiving means 152
Is supplied to the control means 140 and the control means 1
40 stops the movement of the elevator apparatus 110. Thus, the elevator device 110 is controlled so that the uppermost IC card of the IC card 20 is located at a predetermined position.

The claw 130 and the base 132 are respectively
It is formed of a metal material such as SUS or aluminum. The protrusion dimension L4 of the claw portion 130 is
If the length in the longitudinal direction of the IC card 20 is 85.6 mm, the length is 10 mm. If the protrusion dimension L4 is short,
In some cases, separation and cutting of the two closely attached IC cards may not be performed sufficiently, which will be described later with reference to FIG.

Next, a separation and cutout mechanism of the IC card 20 using the separation and cutout device 100 according to the present embodiment will be described with reference to FIGS. 3 and 4 indicate the same parts. As shown in FIG. 5, the interval between the claw portion 130 and the base portion 132 is
It is adjusted to the size of about. When the length L5 of the long side of the card 20 is 85.6 mm, the claw portion 130 and the base portion 132
Is set to, for example, 86 mm.

The claw portion 130 has a slope 13 on its lower surface.
0A. The inclined portion 130A is provided for the IC card 20.
Moves from below to above (in the Z direction in the figure).
In the longitudinal direction of the IC card 20 (X direction in the figure; horizontal direction), the upper and lower I
It has the function of sequentially and mechanically shifting the C cards 20A, 20B, 20C. Also, the claw portion 130 has
An air blow communication port B is provided. One end of the air blow communication port B is open to the inclined portion 130A of the claw portion 130, and the other end is connected to a blower.

The air compressed by the blower blows out from the opening end of the air blow communication port B provided on the inclined portion 130A of the claw portion 130, and the ends of the IC cards 20A, 20B, 20C shifted by the inclined portion 130A and IC cards 20A, 20B, 20
Separate C.

As described with reference to FIG.
A position detection sensor composed of the light receiving means 152 and the light receiving means 152 is provided, and the IC card is used by using the elevator device 110 shown in FIG. It controls the raising of the card 20.

As shown in FIGS. 3 and 4, the air blow communication ports B have four air blow communication ports B1, B.
2, B3 and B4, but only one of them is shown here. By providing a plurality of air blow communication ports, it is possible to supplement the stopping accuracy of the ascending position of the IC card 20 and the inclination of the IC card 20.

Next, as shown in FIG.
The IC card 20A at the position of
The air effectively hits the shifted part between 0B and
The upper and lower IC cards 20A and 20B can be easily separated.

Next, as shown in FIG. 7, the obliquely attached suction pad 134 is positioned diagonally to a position other than the center of the IC card 20, particularly, as shown in FIG. To suck the uppermost IC card 20A. Accordingly, it is possible to prevent the IC card 20A separated by air from coming into close contact with the lower IC card 20B due to the pressing force of the suction pad 134.

Next, as shown in FIG.
When 4 is raised, the IC card 20A is bent by the claw portion 130 and cut out so as to be rolled up. Here, claw 1
When the protrusion length L4 of 30 is shortened, the two closely attached IC cards are bent at the same time, and the bending is not large, so that the IC card is taken out in close contact.
Assuming that the protrusion L4 of the claw portion 130 is 10 mm, 2
When two closely attached IC cards are bent at the same time, the amount of bending becomes large. Therefore, if a certain amount of time is left in the bent state, the lower IC card is naturally separated and falls.

Next, as shown in FIG.
When the card 20A passes through the claw portion 130, the card 20A is restored to a flat plate shape, and the cutting is completed. Further, during the ascent process by the suction pad 134, the end of the IC card 20A is
Rubbed by 38. Therefore, when the uppermost IC card 20A is sucked by the suction pad 134, even if the lower IC card 20B is lifted while being attached to the IC card 20A, the IC cards 20A, 20B are brushed by the brush 138. Of the IC card 2 sucked by the suction pad 134 by rubbing the end of the IC card 2
0A is taken out as it is, but the IC card 2 under it
OB can be scraped off and fall to cut out the IC card 20A. Also, the brush 138 has a lower I
It is also possible to prevent the C card 20B from jumping out.

At this time, the next IC card 20B that has reached the position of the air blow AB is the lower IC card 20C.
The air effectively hits the portion shifted between the upper and lower IC cards 20B and 20C, and the upper and lower IC cards 20B and 20C can be easily separated.

As described above, in the present embodiment, the thin plate-like object such as an IC card vertically stacked is mechanically shifted in the horizontal direction by using the inclined portion 130A of the claw portion 130. Therefore, even when the adhesion between the thin plate-shaped objects is good, it can be effectively separated. In addition, since the upper cutout method is used, even when a thin object such as an IC card having a different thickness is cut out, the work of adjusting the roller gap in the lower cutout can be made unnecessary. Furthermore, since a vertically stacked thin plate-like object such as an IC card is mechanically displaced in the horizontal direction, air is applied to the displaced portion. Can be separated. In addition, since the position where the suction pad is applied to a thin plate-like object such as an IC card is shifted from the center position of the thin plate-like object, it can be cut out effectively without re-adhering to the lower object. it can. Furthermore, by setting the suction pad pressing position to a diagonal position with respect to the air blow ejection position, the pressing force of the suction pad can prevent the lower surface from being brought into close contact with the lower object again. Can be cut out. Also, since the suction pad is pressed against the sheet-like object from a direction inclined with respect to the stacking direction of the sheet-like object,
It is possible to prevent the object from being in close contact with the lower object again, and it is possible to effectively cut out the object.

As described above, by using the separation and cutting device according to the present embodiment, a thin plate-shaped object is shifted by blowing air to separate it, and is taken out by a suction pad, so that an object such as a card having high adhesion can be obtained. It can be accurately separated into individual sheets and handled at high speed. Further, the same mechanism can cope with various kinds of objects having different thicknesses, and it is not necessary to use equipment exclusively.

[0038]

According to the present invention, it is possible to reliably separate and cut a thin plate-like object having good adhesion, and to separate and cut an object having a different thickness without the need for adjustment work.

[Brief description of the drawings]

FIG. 1 is a side view showing the entire configuration of a separation and cutting device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a cassette used in the separation and cut-out device according to one embodiment of the present invention.

FIG. 3 is an enlarged side view of a main part of the separation and cutting device according to the embodiment of the present invention.

FIG. 4 is an enlarged plan view of a main part of the separation and cutting device according to one embodiment of the present invention.

FIG. 5 is an explanatory diagram of a separation and cutout mechanism of an IC card using the separation and cutout device according to one embodiment of the present invention.

FIG. 6 is an explanatory diagram of a separation and cutout mechanism of an IC card using the separation and cutout device according to one embodiment of the present invention.

FIG. 7 is an explanatory diagram of a separation and cutout mechanism of an IC card using the separation and cutout device according to one embodiment of the present invention.

FIG. 8 is an explanatory diagram of a separation and cutout mechanism of an IC card using the separation and cutout device according to one embodiment of the present invention.

FIG. 9 is an explanatory diagram of a separation and cutout mechanism of an IC card using the separation and cutout device according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Cassette 20 ... IC card 100 ... Separation and cutting-out apparatus 110 ... Elevator apparatus 130 ... Claw part 130A ... Inclined part 132 ... Stand part 132A ... Inclined part 134 ... Suction pad 136 ... Blower 138 ... Brush 150 ... Light emitting means 152 ... Light receiving means

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takeji Shiokawa 1st Horiyamashita, Hadano-shi, Kanagawa Prefecture Inside the Enterprise Server Division of Hitachi Ltd. (72) Inventor Satoshi Nakagawa 1st Horiyamashita, Hadano-shi, Kanagawa Corporation Hitachi Server Enterprise Server Division (72) Inventor Shoji Nakakuki 2-9-1, Aisemachi, Hitachi City, Ibaraki Prefecture Inside Hitachi Equipment Engineering Co., Ltd. (72) Hiroyuki Shioda 2-9-1, Aisemachi, Hitachi City, Ibaraki Prefecture No. Hitachi Equipment Engineering Co., Ltd. F-term (reference) 3F030 AA04 AB04 CC02 3F343 FA15 FB09 GA01 GA08 GB01 GC04 GD04 HA12 HB04 HD16 JB02 JD03 JD18 JD27 JD28

Claims (3)

[Claims] 1. A separation and cutting device for separating and cutting one sheet-like object from a plurality of sheet-like objects stacked in a vertical direction, wherein the separation-cutting device is disposed above a plurality of stacked sheet-like objects, and from bottom to top. Separating means for mechanically displacing the sheet-like object moving in the horizontal direction to separate the stacked sheet-like objects; andseparating means arranged on the plurality of stacked sheet-like objects and separated by the separating means. And a suction pad for sucking and cutting the thin plate-like object laminated on the uppermost part. 2. The separation and cutting device according to claim 1, further comprising air blow means for blowing air to the thin plate-like object shifted in the horizontal direction by said separating means. 3. The separation and cutting device according to claim 1, wherein the suction pad sucks the thin plate-shaped object at a position away from the center of the thin plate-shaped object.