JP2001024213A - Reflection type optical sensor and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflection type optical sensor of simple structure with improved performance using an optical fiber, and a method for manufacturing it at low cost by obtaining many pieces using an aggregate board. SOLUTION: This sensor contains a structure wherein a board 9 is mounted with a light-emitting element 2 and a photo-detecting element 3, which are separated by a light-intercepting board 41, where translucent sealing resin 11 fills to enclose the elements in, and a sensor head 42 wherein optical fibers 44 and 45 are inserted in resin 43 is laminated thereon. By using an aggregate board for manufacture, the aggregate board is mounted with a lot of light- emitting elements and photo-detecting elements, and an aggregate light- intercepting board is bonded, and the sealing resin fills to enclose each element in, and an aggregate sensor head wherein the optical fiber is inserted in the resin is laminated thereon, and then this aggregate is cut vertically and horizontally to obtain many pieces of reflection type optical sensor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflection type optical sensor for detecting light reflected from the surface of an object to be detected and a method of manufacturing the same.

[0002]

2. Description of the Related Art A reflection type optical sensor is a sensor for detecting the presence or absence of an object in a non-contact manner.
It is used to detect the position of paper, film, etc., and the edge.
FIG. 9 shows a principle configuration of a reflection type optical sensor, in which a package 1 includes a light emitting element 2 (for example, an infrared LED) and a light receiving element 3.
(E.g., a phototransistor), and the light-receiving element 3 detects light emitted from the light-emitting element 2 as shown by an arrow and reflected by the object 4 to be detected. As a result, the output from the light receiving element 3 changes according to the presence or absence and the position of the object 4 in the vicinity of the reflection type optical sensor, and this is used as a detection signal.

FIG. 10 shows an example of a reflection type optical sensor proposed by the present inventors. FIG. 10 (A) shows the appearance, and FIG.
The cross section is shown in FIG. A light-shielding frame 10 formed of a light-shielding resin on a substrate 9 made of an epoxy resin or the like containing glass fiber.
The light-shielding frame 10 has two windows 8 having through holes. As shown in FIG. 3B, the light emitting element 2 and the light receiving element 3 are die-bonded to the conductive pattern on the substrate 9 inside each window 8 and wire-bonded with a metal wire 13 to form a light-transmitting seal on the window 8. Both elements are encapsulated by filling a sealing resin 11. The conductive portion 12 on the side surface of the substrate 9 is formed by forming a conductive layer in an arc-shaped depression by a through-hole technique, thereby connecting the conductive pattern on the upper surface of the substrate 9 to the terminal electrode on the lower surface of the substrate. The light emitted from the light emitting element 2 exits through the window 8 on the light emitting element side and irradiates the object to be detected, and the reflected light from the object surface returns from the window 8 on the light receiving element side to reach the light receiving element 3 and is detected. .

The reflection type optical sensor shown in FIG. 11 has also been proposed by the present inventors. FIG. 11A is a perspective view, and FIG. 11B is a sectional view taken along line BB of FIG. Like the previous one in FIG.
The light emitting element 2 and the light receiving element 3 are mounted on
This is sealed in the sealing resin 11, but unlike FIG. 10, the light shielding frame 10 is not used,
The side surface of the trapezoidal sealing resin 11 is covered with a light shielding film 14 such as a metal plating layer. The upper surface of the sealing resin 11 has no light-shielding film, and the entire surface is a window through which light enters and exits.

FIG. 12 shows a reflection type optical sensor disclosed in Japanese Patent Application Laid-Open No. 8-297011. The sensor head 21 has a pair of optical fibers 25, 2 in through holes 23, 24 of the base 22.
6 through which each is held by pressure fitting or bonding. The optical fiber 25 has an output end 27, and the other end is connected to the light source 29. On the other hand, the optical fiber 26 has an input end 28, and the other end has a light intensity detecting means 30.
Connected to. The end faces of the output end 27 and the input end 28 of the optical fiber are cut at an angle to the axis of the optical fiber, and are arranged so as to be in contact with each other or close to each other. This sensor head 21 is
, The light emitted from the light source 29 is
The reflected light from the surface of the object 31 enters the optical fiber 26 from the input end 28, is transmitted to the light intensity detecting means 30, and is detected.

[0006]

Among the above-mentioned conventional reflection-type optical sensors, those shown in FIGS. 10 and 11 are simple in structure and can be manufactured using a large collective substrate. In other words, a large number of regions to be individual substrates 9 are arranged in rows and columns on the collective substrate, and
After mounting the light-receiving element 3 and the collective light-shielding frame, the collective light-shielding frame is adhered to the collective substrate, and the sealing resin 11 is filled in the window of the collective light-shielding frame. After filling, only the sealing resin layer is half-diced while forming a slope, the light shielding film 14 is plated on the side surface of the sealing resin 11, and then the whole is vertically and horizontally diced with a cutter. The part becomes an individual reflection type optical sensor. Therefore, although the productivity is very good, since light is scattered or absorbed in the sealing resin, performance such as detection sensitivity and detection accuracy and light use efficiency cannot be made very high.

FIG. 12 shows an optical fiber 25,
Since the light is confined to this by using the 26, the detection performance and the light use efficiency can be improved. However, as the configuration of the sensor head 21, the optical fibers 25 and 26 are inserted into the through holes 23 and 24 of the base 22. Also, a structure for connecting the other ends of the optical fibers 25 and 26 to the light source 29 and the light intensity detecting means 30 is necessary, and they must be individually manufactured one by one. It cannot be efficiently manufactured collectively like products, resulting in high costs. The present invention solves these problems, and realizes a reflection type optical sensor which has a high performance by using an optical fiber with a simple structure, and a method of manufacturing the same at a low cost by using a multi-unit using a collective substrate. is there.

[0008]

In the photoreflector of the present invention, a light emitting element and a light receiving element are mounted on a substrate and sealed in a translucent sealing resin. However, the difference is that a sensor head in which two optical fibers on the light emitting side and the light receiving side are inserted in a resin is laminated thereon. In order to prevent the two optical elements from directly acting on each other, a light-shielding plate is placed between the two elements on the substrate to separate the sealing resin. The two optical fibers sealed in the resin penetrate the upper and lower surfaces of the resin,
The upper and lower end surfaces of the optical fiber are part of the upper and lower surfaces of the sensor head.

The end faces of the two optical fibers are close to each other and substantially adjacent to each other on the surface of the sensor head, and are separated from each other on the bonding surface with the sealing resin on the opposite side. Facing the light receiving element. Accordingly, the projections of the two optical fibers in directions of two parallel planes including the axes of the two optical fibers intersect at an angle. The distance between these two parallel planes is at least equal to the sum of the radii of both optical fibers. That is, when the two optical fibers are extended beyond their end faces, the two optical fibers pass each other without abutting each other.

The production of such a reflection-type optical sensor is carried out using a large-sized collective substrate which, when divided vertically and horizontally, becomes a substrate for a large number of reflective-type optical sensors, for example, a collective substrate of 100 to 200 mm square. A large number of light emitting elements and light receiving elements are mounted on the conductive pattern surface of the collective substrate, and a light-shielding plate is bonded in a bank shape on the substrate between the light emitting elements and light receiving elements. Then, the entire surface of the collective substrate is filled with a light-transmitting sealing resin at substantially the same height as the light-shielding plate to encapsulate these element groups. A light emitting element and a light receiving element are aligned thereon, and a resin sensor head in which an optical fiber is sealed is adhered. However, this sensor head is not provided with a large number of elements for one optical sensor.
A required number of collective sensor heads connected in one row are arranged in a necessary number and used. If the assembly thus formed is cut vertically and horizontally and divided into light-emitting elements and light-receiving elements, and light-emitting side optical fibers and light-receiving side optical fibers are paired,
Each small piece is a completed reflection type optical sensor.

As described above, in the manufacture of the reflection type optical sensor using the collective substrate, a collective sensor head in which a number of sensor heads are connected in one line is used. It is manufactured efficiently by the method described above. That is, a plurality of optical fibers each having a length many times as long as the length of one sensor head are attached to a resin molding die or container in two rows. The installation method is that the optical fibers are parallel to each other in each row and take a predetermined fixed interval,
Optical fibers are arranged between the rows so as to be substantially in contact with each other while intersecting at the predetermined angle, and resin is injected into the optical fibers and solidified. Therefore, a resin plate in which many optical fibers are sealed in a staggered manner is obtained. If this resin plate is cut and divided into strips by a cutter along a parallel line group passing through the intersections of the optical fibers and a parallel line group passing through the middle of these parallel line groups, each strip-shaped piece is assembled It becomes a collective sensor head for attachment to a substrate. By these methods, a large number of reflection-type optical sensors can be efficiently manufactured.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. Note that the same reference numerals are used for the same kind of parts and parts including the above description. FIG.
1 is a first embodiment of the reflection type optical sensor of the present invention, and FIG. 1 (A) is a transparent perspective view. Light emitting element 2 on substrate 9
And the light receiving element 3 are mounted respectively, and the light shielding plate 4 is provided between the two elements.
1 is provided to prevent both elements from directly affecting each other, and these are sealed in a light-transmitting sealing resin 11. A sensor head 42 is bonded and laminated thereon, and the sensor head 42 has a light emitting side optical fiber 44 and a light receiving side optical fiber 45 inserted in a resin 43, and the optical fibers 44 and 45 penetrate the resin 43. Both ends are resin 43
Is exposed as a part of the upper and lower surfaces.

FIG. 1B is a front view as viewed from the front left of FIG. 1A, and FIG. 1C is a top view of FIG. 1A, all of which are drawn in perspective. As shown in these figures, the light emitting element 2 and the light receiving element 3 are die-bonded to the conductive pattern 15 of the substrate 9,
Wire bonding is performed with a metal wire 13. Reference numeral 16 denotes a terminal electrode on the upper surface of the substrate, which is connected to a terminal electrode provided on the lower surface of the substrate 9 by a conductive portion 12 on the side surface of the substrate, though not shown in the drawing. The terminal electrodes on the lower surface of the substrate are for mounting the reflection type optical sensor on the circuit board of another device. Thus, the reflection type optical sensor of the present invention is of a type suitable for surface mounting on a circuit board. The conductive portion 12 has a conductive film on the surface of the arc-shaped depression provided at the edge of the substrate 9, and in the manufacturing process, this portion was a full-circle through hole.

As can be seen, the optical fibers 44 and 45
Intersect at a fixed angle, and the end face of the optical fiber is connected to the light emitting element 2 at the joint surface between the sensor head 42 and the sealing resin 11.
And the light receiving element 3, respectively, and the sensor head 42
On the upper surface, the end faces of the optical fibers are close to each other and almost adjacent to each other. Thus, when the upper surface of the sensor head 42 is brought close to the object to be detected, the light emitted from the light emitting element 2 irradiates the surface of the object through the optical fiber 44, and the reflected light enters from the end face of the adjacent optical fiber 45, and the light is emitted from the sensor. And is detected by the light receiving element 3.

As a feature of the present invention, two optical fibers 44 and 45 are arranged as follows. That is, FIG.
As can be seen from FIG. 2, when two planes parallel to each other are respectively passed through the axes of the optical fibers 44 and 45,
If the distance a between the planes is equal to or greater than the sum of the respective radii of the two optical fibers, and if the diameters of the two optical fibers are the same, then a is equal to or greater than the diameter. When they extend, they pass each other without hitting each other. The intersection angle between the two optical fibers is arbitrarily determined in consideration of the focal length, light conversion efficiency, and the like. With this configuration, an extremely convenient manufacturing method can be realized as described later.

In the embodiment of the reflection type optical sensor shown in FIG. 1, the light-transmitting sealing resin layer 11 enclosing the light emitting element 2 and the light receiving element 3 is exposed on the side of the reflection type optical sensor. Part of the light emitted from the light emitting element 2 and the light returned to the light receiving element 3 may be scattered by the sealing resin 11 and leak from the side surface.
The second embodiment shown in FIG. 2 eliminates such leakage and increases the light use efficiency and detection sensitivity to prevent interference with other components. Here, a light-shielding frame 46 made of a light-shielding resin is provided on the substrate 9 so that the sealing resin 11 is not exposed on the side surface of the optical sensor. The light-shielding frame 46 has two large through holes. The light-emitting element 2 and the light-receiving element 3 are accommodated in the respective holes, and these elements are filled with the sealing resin 11 to enclose each element. This eliminates light leakage from the side of the optical sensor. The portion of the wall between the two through holes of the light shielding frame 46 is similar to the light shielding plate 41 in FIG.
And the light receiving element 3 do not directly interact with each other.

FIG. 3 shows a third embodiment of the present invention, which also has a structure for preventing light leakage from the side surface of the optical sensor. Although the configuration of the first embodiment of FIG. 1 is included as it is, the surface of the sealing resin that appears on the side surface of the optical sensor is covered with a light shielding film 47 made of a thin layer of a light shielding material. The light shielding film 47 is, for example, a nickel plating film formed by electroless plating, thereby preventing light leakage.

Next, a method for manufacturing the reflection type optical sensor of the present invention will be described with reference to FIG. In FIG. 4, first, a large collective substrate 51 is prepared. This is one in which a large number of regions that become individual reflection-type optical sensors at the time of completion are arranged vertically and horizontally in a matrix and provided with conductive patterns 15 and through holes 52, and are divided by vertical and horizontal dividing lines 53 and 54. The section corresponds to one reflection-type optical sensor. And light emitting element 2
Group and the light receiving element 3 group are die-bonded to the conductive pattern 15,
Wire bonding is performed with the metal wire 13. The material of the collective substrate is an epoxy resin containing glass fiber mixed with a black pigment, and for example, if the collective substrate has a size of 100 to 200 mm square, it can be divided into about 1,000 reflective optical sensors. .

Next, the collective light shielding plate 55 is bonded to the collective substrate 51. The collective light-shielding plate 51 is a molded product of a light-shielding resin and has a frame shape having a number of horizontal bars 55a, and the portion of the horizontal bar 55a later becomes the light-shielding plate 41 in FIG. What is indicated by a two-dot chain line 56 on the collective substrate 51 is the position where the collective light shielding plate 55 is aligned. One section on the collective substrate 51 includes one light emitting element 2 and one light receiving element 3, and is arranged so as to be separated by the horizontal bar 55 a of the collective light shielding plate 55.

Next, a translucent resin such as an epoxy resin is injected between the horizontal bars 55a of the collective light-shielding plate 55 adhered to the collective substrate 51, and is filled to substantially the same height as the upper surface of the collective light-shielding plate 55. . The collective light shielding plate 55 is a light-emitting element
Since the height of the light receiving element 3 and the height of the light receiving element 3 including the metal wire 13 are used, each element including the metal wire is completely sealed in the resin by filling the resin. The resin filled in this way becomes the sealing resin 11 in FIG. At the time of injection of the sealing resin, processing such as closing the through hole with a tape material is performed as necessary so that the resin does not flow out of the through hole 52 of the collective substrate 51.

Next, as described above, the horizontal bar 5
After filling the sealing resin between 5a, collective sensor head 57
Glue. The collective sensor head 57 is a rectangular parallelepiped formed by connecting a number of the sensor heads 42 shown in FIG. 1 in a row. Therefore, the collective sensor head 57 includes a number of pairs of the light emitting side optical fiber 44 and the light receiving side optical fiber 45. After the sealing resin is filled in the collective substrate 55, an adhesive is applied, and a number of collective sensor heads 57 are arranged and adhered while aligning the lower end surfaces of the optical fibers 44 and 45 with the light emitting element 2 and the light receiving element 3. Optical fiber 44, 45
The adhesive is applied to the upper surface of the sealing resin at a position away from the light emitting element 2 and the light receiving element 3 so that the adhesive does not adhere to the lower end surface of the light emitting element 2. The application of the adhesive may be performed by any method,
It is convenient to apply a mask material on the sealing resin surface so that the adhesive does not adhere to unnecessary portions. Screen printing is also good. In FIG. 4, the dividing lines 53a, 54a
One section of the collective sensor head 57 divided by is the one sensor head 42 in FIG.

An assembly obtained by laminating the collective substrate 51, the collective light shielding plate 55, and the collective sensor head 57 together with a sealing resin filling step is formed by dividing lines 53 and 54 (that is, 53a, 53a).
If dicing for cutting along 54a) is performed, each of the obtained small pieces becomes a completed reflective optical sensor. The through hole 52 provided in the collective substrate 51 of FIG.
In the completed product of FIG. 1, the conductive portion 12 in which the conductive material is coated in the depressions
Becomes In this way, the reflection type optical sensor of the present invention can be manufactured very efficiently by multi-cavity production.

Although the above description is of a method of manufacturing the first embodiment shown in FIG. 1, the second embodiment having the light-shielding frame 46 shown in FIG. It is manufactured by a process. However, in this case, the collective light-shielding frame 58 shown in FIG. 5 is used instead of the collective light-shielding plate 55 of FIG. This is a grid-like shape with a number of windows, dividing lines 53b, 5
One section by 4b is equivalent to one completed product. The light-shielding frame 58 is adhered to the collective substrate 51 shown in FIG. 4, the window frame is filled with a sealing resin, and the light emitting element 2 and the light receiving element 3 are sealed. Then, as described above, if an assembly in which the assembly sensor head 57 is joined is formed and diced, the assembly light-shielding frame 58 is
3b, 54b, and the sealing resin 1 as shown in FIG.
The periphery of 1 is surrounded by a light-shielding frame 46, and a reflection-type optical sensor with no light leakage can be obtained.

As shown in FIG. 3, the reflection type optical sensor in which the side surface of the sealing resin 11 is covered with the light-shielding film 47 is manufactured by using the above-described embodiment of FIG.
The light-shielding film may be coated on the surface of the sealing resin 11 that appears on the side surface, but it is much more efficient to include the light-shielding film in the collective substrate process. As in the embodiment of FIG. 1, the steps shown in FIG. When an assembly in which the assembly components are stacked is formed, first, the assembly sensor head 57 and the sealing resin layer under the assembly sensor head 57 are half-diced along the dividing lines 53a and 54a from the top until they reach the substrate. With this, although the collective substrate 51 is still integrated, since the sealing resin and the sensor head have side surfaces, the collective substrate is immersed in a plating solution by electroless nickel plating to form a nickel film, and the like. As shown in FIG. 3, a light shielding film 47 is formed on the side surface of the sealing resin 11.

At this time, the unnecessary portion of the light-shielding film is masked. For example, the terminal electrode on the rear surface of the collective substrate and the conductive portion on the inner surface of the through hole are not covered with the light-shielding film material. Affix the sheet material. Although the light-shielding film is not provided on the upper surface of the sensor head, a method of masking the surface to prevent plating or a method of removing the plating layer by etching or the like after plating with the side surface may be used. Although the light shielding film 47 is required on the side surface of the reflection type optical sensor as shown in FIG. 3, it is inconvenient to prevent the plating by masking the side surface of the sensor head 42. Since there is no need to prevent this, a light-shielding film including the sensor head 42 may be formed on the side surface of the optical sensor. Thereafter, when the collective substrate 51 is fully diced along the dividing lines 53 and 54, the reflection type optical sensor of FIG. 3 is completed.

As shown in FIGS. 1 to 3, the sensor head 42 of the reflection type optical sensor of the present invention has a die-shaped resin 4.
3, optical fibers 44 and 45 are inserted, but in the manufacturing process using the collective substrate 51 shown in FIG. 4, a collective sensor head 57 connected with a number of sensor heads is used. A method of manufacturing the collective sensor head 57 will be described. First, as shown in FIG. 6, a collective sensor head plate 59 is manufactured by insert-molding a group of optical fibers 44 and 45, which are many times longer than the optical fibers included in the completed reflection optical sensor, in a resin 43. FIG. 1A is a top view, and FIG. 1B is a front view.

The optical fibers 44 and the optical fibers 45
The optical fibers 44 and the optical fibers 45 intersect at a fixed angle. The crossing angle is the same as the crossing angle between the optical fiber 44 and the optical fiber 45 in FIG. FIG.
(B) shows the dividing line 60, which is a parallel line group passing through the intersection of the optical fiber groups and a parallel line group in the middle thereof when viewed from the front, and the interval between the dividing lines 60 is uniform. Dividing line 60
The pitch of the parallel optical fiber group along is set equal to the interval between the dividing lines 54 of the collective substrate 51 in FIG. .

The thickness of the collective sensor head plate 59 shown in FIG. 6A is equal to the vertical width of the reflection type optical sensor in FIG. The distance a in FIG.
The distance between the plane including the axes of the four groups and the plane including the axes of the optical fibers 45 is the same as a in FIG. 1C and substantially equal to the sum of the radii of the two optical fibers. And the optical fiber 45 group cross each other almost in contact with each other. Such a collective sensor head plate 59
Is manufactured by injecting and solidifying a resin into a molding die or container in which the optical fiber 44 group and the optical fiber 45 group are crossed and attached.

Next, the collective sensor head plate 59 is connected to the dividing line 6.
Cut with a cutter along 0. This cutting is performed precisely because it also serves as finishing processing of the end face of the optical fiber appearing on the cut surface. If a plurality of collective sensor head plates 59 are cut and fixed, the cutting can be efficiently performed.

The rectangular parallelepiped pieces obtained by cutting the collective sensor head plate 59 along the dividing lines 60 are shown in FIG. . . When the odd-numbered ones are turned upside down and the rectangular parallelepipeds are shifted to the left and right as shown in FIG. 7, each part obtained by dividing each rectangular parallelepiped by a vertical dividing line 61 is the same, and Sensor heads. Therefore, each rectangular parallelepiped of FIG. 7 becomes the collective sensor head 57 used in the collective substrate process of FIG. By forming and dividing the collective sensor head plate 59 as shown in FIG.
The collective sensor head 57 can be manufactured efficiently. 6B, when the parallel line group passing through the intersection of the optical fiber group and the intermediate parallel line group are defined as described above, the corresponding parallel line is the dividing line 60. Can also be pulled in the vertical direction perpendicular to, but it is obvious which should be taken.

The idea of the collective sensor head plate 59 of FIG. 6 is further advanced by the collective sensor head block 6 of FIG.
2. This is a resin block in which optical fibers 44 and 45 are inserted in such a manner that a number of integrated sensor head plates 59 are stacked and integrated. FIG. 8A is a top view,
(B) is a front view, and as shown in (A), an optical fiber 4
There are several rows in which the 4th and 45th groups intersect and form a pair. This collective sensor head block 62 is
By cutting at 0 and further cutting at the dividing line 63, a large number of collective sensor heads 57 used in the process of FIG. 4 are obtained.

When the collective sensor head block 62 of FIG. 8 is used, the collective parts of the sensor head used in the collective substrate process of FIG. 4 are not divided by the dividing line 63 of FIG. 6) may be used by turning the plate upside down every other sheet as in the case of the collective sensor head plate 59 of FIG. 6 described above. This is also plate-shaped, but, unlike the collective sensor head plate 59 of FIG. 6, it expands in a direction orthogonal to this. FIG.
Are separated from each other by grooves along the dividing line 53a. However, if the plate-like members described above are used, they are connected and have no grooves. Is bonded onto the collective light-shielding plate 55, and when dicing the aggregate, the sensor head layer is also cut in the direction along the dividing line 53a.

According to the collective sensor head block 62 of FIG. 8, a collective part including a large number of sensor heads can be obtained by one molding, but the molding die or the container becomes complicated, and the optical fiber This method is not always advantageous because it increases the time and labor for attaching the. Whether to use the collective sensor head plate 59 in FIG. 6 or the collective sensor head block 62 in FIG. 8 is preferably determined according to the actual situation.

While the circuit components completed as a reflection type optical sensor have been described above, there are also circuit components whose configuration is a reflection type optical sensor. For example, there is a circuit component called an optical microphone, which includes a reflective optical sensor and a vibrating film, which is an object to be detected, arranged near the sensor head, and converts the vibration of the vibrating film due to sound or the like into an optical signal. It is converted and processed. The reflection-type optical sensor and the method of manufacturing the same according to the present invention extend to components including a reflection-type optical sensor in a part of the configuration, such as an optical microphone.

[0035]

As described above, since the reflection type optical sensor obtained by the present invention forms an optical path with an optical fiber, the light use efficiency is improved and a high performance optical sensor can be obtained. In addition, it has a simple structure and is suitable for miniaturization and thinning. In terms of manufacturing, manufacturing is promoted using collective components such as collective boards, and finally cut and divided to obtain many products at once. High productivity and reduced manufacturing costs. As described above, according to the present invention, it is possible to provide an inexpensive reflection type optical sensor suitable for surface mounting, which is ultra-small, high-performance, highly reliable.

[Brief description of the drawings]

FIG. 1 shows a perspective view of a reflective optical sensor of the present invention;
(A) is a perspective view, (B) is a front view, and (C) is a top view.

FIG. 2 is a perspective view showing another reflection type optical sensor of the present invention in a see-through manner.

FIG. 3 is a perspective view perspectively showing still another reflection type optical sensor of the present invention.

FIG. 4 is a perspective view showing a method for manufacturing the reflection type optical sensor of the present invention.

FIG. 5 is a perspective view of a collective light shielding frame used for manufacturing the reflection type optical sensor of the present invention.

6A and 6B show a collective sensor head plate used for manufacturing the reflection type optical sensor of the present invention, wherein FIG. 6A is a top view and FIG. 6B is a front view.

FIG. 7 is a collective sensor head obtained by dividing the collective sensor head plate of FIG. 6;

8A and 8B show a collective sensor head block used for manufacturing the reflection type optical sensor of the present invention, wherein FIG. 8A is a top view and FIG.
Is a front view.

FIG. 9 is a diagram illustrating the basic configuration of a reflection type optical sensor.

10A and 10B show a conventional reflection-type optical sensor, in which FIG. 10A is a perspective view, and FIG. 10B is a sectional view taken along line BB of FIG.

11A and 11B show another conventional reflection-type optical sensor, in which FIG. 11A is a perspective view and FIG. 11B is a cross-sectional view taken along the line BB of FIG.

FIG. 12 is a drawing of another conventional reflection type optical sensor.

[Explanation of symbols]

 Reference Signs List 2 light emitting element 3 light receiving element 8 window 9 substrate 10, 46 light shielding frame 11 sealing resin 12 conductive part 14, 47 light shielding film 15 conductive pattern 16 terminal electrode 21, 42 sensor head 25, 26, 44, 45 optical fiber 41 light shielding plate 43 Resin 51 Collective board 52 Through hole 55 Collective light shielding plate 57 Collective sensor head 58 Collective light shielding frame 59 Collective sensor head plate 62 Collective sensor head block

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F065 AA01 AA03 AA12 AA67 BB01 CC02 DD02 FF22 FF44 GG12 GG15 JJ01 JJ15 JJ26 LL02 LL03 PP22 QQ28 5F089 BA01 BA02 BB03 BC11 BC17 CA03 CA20 EA03 EA10

Claims (10)

[Claims] 1. A light-emitting element, a light-receiving element, and a light-shielding plate for separating both optical elements are mounted on a circuit board, and both optical elements are sealed in a sealing resin. A sensor head in which optical fibers are embedded through the upper and lower surfaces of the resin, and the sensor heads are stacked, wherein end surfaces of the two optical fibers are close to each other on the surface of the sensor head, and a bonding surface with the sealing resin on the opposite side. Are separated from each other and face the light emitting element and the light receiving element, respectively, and the projection of the two axes in two parallel plane directions including the axes of the two optical fibers is at a certain angle, and
A reflective optical sensor, wherein the distance between the planes is equal to or greater than the sum of the radii of the two optical fibers. 2. The reflection type optical sensor according to claim 1, wherein a periphery of the sealing resin layer is surrounded by a light shielding frame. 3. The reflection type optical sensor according to claim 1, wherein a light shielding film is coated around the sealing resin layer. 4. The method of manufacturing a reflection type optical sensor according to claim 1, wherein the light emitting element group and the light receiving element group are mounted on a collective substrate including a large number of product regions in a matrix, and are located in the same product region. A collective light-shielding plate that collectively has a portion of a light-shielding plate that separates the light-emitting element and the light-receiving element is adhered to the collective substrate, and the collective substrate is filled with a translucent sealing resin at substantially the same height as the collective light-shielding plate. Then, the light emitting element group and the light receiving element group are encapsulated, and two reflection type optical sensors are provided on the collective light shielding plate and the sealing resin.
A required number of sensor heads each including a plurality of optical fiber-encapsulated sensor heads are bonded together, and the obtained assembly is cut lengthwise and crosswise to obtain a large number of products. Method of manufacturing optical sensor. 5. The method of manufacturing a reflection type optical sensor according to claim 2, wherein the light emitting element group and the light receiving element group are mounted on a collective substrate including a large number of product regions in a matrix, and are located in the same product region. A collective light-shielding frame having collectively a light-shielding plate part separating a light-emitting element and a light-receiving element and a window frame part along a dividing line of a product area, and the window frame part along the dividing line only remains on both sides after cutting. Are bonded to the collective substrate, and the light emitting element group and the light receiving element group are sealed by filling a translucent sealing resin in the window frame at substantially the same height as the collective light shielding frame. The reflection type optical sensor 1 is mounted on the collective light shielding frame and the sealing resin.
A required number of sensor heads each including a plurality of sensor heads in which two optical fibers are sealed in resin are bonded together, and the resulting assembly is cut lengthwise and crosswise to obtain a large number of products. A method for manufacturing a reflection type optical sensor. 6. The method of manufacturing a reflection type optical sensor according to claim 3, wherein the light emitting element group and the light receiving element group are mounted on a collective substrate including a large number of product regions in a lattice shape, and are located in the same product region. A collective light-shielding plate that collectively has a portion of a light-shielding plate that separates the light-emitting element and the light-receiving element is adhered to the collective substrate, and the collective substrate is filled with a translucent sealing resin at substantially the same height as the collective light-shielding plate. Then, the light emitting element group and the light receiving element group are encapsulated, and two reflection type optical sensors are provided on the collective light shielding plate and the sealing resin.
A required number of sensor heads including a plurality of sensor heads in which the optical fiber is sealed in resin are adhered by a required number, and the sensor head layer and the light shielding plate layer of the obtained assembly are vertically and horizontally halved until almost reaching the substrate. Dicing, covering the side of the sealing resin that appeared in the groove created by half dicing with a light-shielding film, and then cutting the aggregate substrate vertically and horizontally to take a large number of products. Production method. 7. The method of manufacturing a reflection-type optical sensor according to claim 4, wherein the collective sensor head comprises a plurality of sensor heads connected in one row. Manufacturing method of sensor. 8. The method of manufacturing a reflection-type optical sensor according to claim 4, wherein the collective sensor head comprises a plurality of sensor heads connected in a matrix. Manufacturing method of sensor. 9. The method of manufacturing a reflection-type optical sensor according to claim 7, wherein the collective sensor head includes two optical fiber groups each having a length many times as large as a completed dimension, and each optical fiber group having the same axis. The two planes including the axes of the two optical fiber groups are parallel to each other and are parallel to each other at a constant interval, and the distance between the two planes is equal to or greater than the sum of the radii of the optical fibers belonging to each of the two optical fiber groups. The two optical fiber groups are supported in a mold or a container so that the projections of the two optical fibers in the two plane directions intersect at a certain angle, and are filled with a resin, solidified into a plate shape, and parallel through the intersection of the optical fibers in the projection. A method for manufacturing a reflection-type optical sensor, wherein the method is obtained by cutting along a line group and a parallel line group passing through the middle of the parallel line group. 10. The method of manufacturing a reflection type optical sensor according to claim 8, wherein the collective sensor head has two optical fiber groups whose lengths are many times the completed dimensions, and each of the optical fiber groups has the same axis. The two planes including the axes of the two optical fiber groups are parallel to each other and are parallel to each other at a constant interval, and the distance between the two planes is equal to or greater than the sum of the radii of the optical fibers belonging to each of the two optical fiber groups. A plurality of sets are supported so that the projections of the two optical fibers in the two plane directions intersect at a predetermined angle are arranged in parallel at a predetermined interval, and are supported in a mold or a container. Solidified into a block shape, and cut along a parallel plane group passing through the intersection of the optical fibers in the projection and a parallel plane group passing through the middle of the parallel planes. Method for producing a morphism type optical sensor.