JP2001089870A - Solid plating material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a solid plating material used for depositing a low electric resistance film on a metallic surface, reducing the contact resistance and reducing the loss of the micro-electric current at the time of energizing. SOLUTION: With particles having the particle size of 30 to 300 μm as neuclei, the surfaces are deposited with a coating film composed of a metallic material having hardness lower than that of the material of the above particles and electric resistance value lower than that of the material of an object to be treated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an inexpensive metal material other than commonly used electrode metal materials, such as gold, silver, and copper, which has an electrical performance equivalent to that of gold, silver, copper, etc. by a solid plating method. The present invention relates to a solid plating material for processing into an electrode metal material to which is added.

[0002]

2. Description of the Related Art In order to impart corrosion resistance and rust resistance to metal products such as mechanical parts, a plating material for rust prevention made of a soft metal such as zinc or a zinc alloy is applied to the surface of the article to be treated. A mechanical plating method for plating an article to be processed is described in, for example, Japanese Patent Publication No.
As disclosed in JP-A-38870, the mechanical plating method involves projecting a metal to be plated by mixing particles of zinc, copper, aluminum or an alloy thereof with other particles. Japanese Patent Application Laid-Open No. 56-45372 discloses a solid plating material comprising iron as a core and a double coating of zinc or a zinc alloy around the core. It is just a thing to give.

As described above, in the conventional solid plating material for the purpose of rust prevention, an inexpensive metal material other than the electrode metal material is replaced by an electrode metal material provided with the same electrical performance as gold, silver, copper, etc. by the solid plating method. Cannot be processed. The purpose of rust prevention by the conventional mechanical plating method is to prevent rust against moisture and moisture in the atmosphere, and when electricity is supplied in a special corrosive environment such as in an oxidizing atmosphere or in such an environment. Therefore, it is impossible to prevent rust for a long time because the fine residual fine particles of iron-based particles used in the processing promote corrosion, and there is also a problem with the corrosion resistance of the plating material itself such as zinc. there were. For this reason, in order to improve the electrical characteristics of the electrode, electroplating is generally used to form a low electrical resistance metal on the surface of the electrode material to be processed, and the electroplating is a wet process, which involves many steps and costs. However, a simple and inexpensive method has been demanded.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and it is possible to form a low electric resistance layer at a time at a low cost while having excellent corrosion resistance. It is an object of the present invention to provide a solid plating material that can be used.

[0005]

The solid plating material according to the present invention which has solved the above problems has a particle diameter of 30%.
A basic structure wherein a coating film made of a metal material having hardness of lower than that of the material of the particle and lower electric resistance value of the material to be processed is formed on the surface of the particle having a particle size of ~ 300 µm as a core. And In such a solid plating material, true specific gravity is 2 to 15 as core particles, and particle hardness is 400 to 2000 Hv.
The invention using claim 2 is defined as the invention according to claim 2, and those using a single or an alloy thereof as the metal forming the coating film in these inventions are considered as the invention according to claim 3, and The invention according to claim 4, wherein one or two or more kinds selected from gold, silver, copper, and Ni are used as the metal for forming the coating film in each of the inventions described above. At
The invention using a cemented carbide as the core particles is defined as the invention according to claim 5.

[0006] In the case of the above-mentioned structure, when the particles are projected toward the object to be processed by using air pressure, the core particles are harder than the object to be processed, so that the surface of the object to be processed has an appropriate surface roughness. (Anchor pattern generation effect) occurs, and mechanical plastic deformation occurs due to the anchor portion (partial scratching effect), and has a lower hardness than the material of the particles formed on the surface of the core particles. In addition, a coating film made of a metal material having a lower electric resistance value than the material to be processed is transferred and rolled at the same time as the material to be processed. A metal surface layer made of a low material will be obtained. In addition, a metal surface layer is formed on the surface of the object to be processed while removing an oxide film generated on the surface of the object to be processed such as aluminum by the air pressure for projecting the solid plating material and increasing the contact resistance value. Is formed, the contact resistance value is remarkably reduced, and the electrode metal material having improved electrical performance can be processed.

Further, in the case of a solid plating material composed entirely of a single material such as gold, silver or copper, the hardness of the particles is lower than that of the article to be processed, so that the anchor pattern effect as described above cannot be obtained. In addition, a uniform and strong metal surface layer cannot be obtained, and noble metals such as gold and silver are expensive, uneconomical and cannot achieve their intended purpose. Hardness is 400-2000H
v By using particles of higher hardness than the material to be processed, such as glass, steel, cemented carbide, etc., a low electric resistance layer with excellent corrosion resistance can be formed at once at a low cost. .

In the present invention, the hardness of the core particles may be 400 to 20 as long as the hardness is higher than that of a metal material having an electric resistance lower than that of the material to be processed which is a coating film.
Usually, the range of 00Hv is used. For this reason, glass beads, steel, cemented carbide, high-speed steel, etc. are suitable as the core particles. Optimal.

Further, the reason why the particle diameter of the core particles in the present invention is 30 to 300 μm is that the anchor pattern effect as described above cannot be obtained even if the particle hardness is higher than that of the article to be processed when the particle diameter is 30 μm or less. For this reason, a uniform and strong metal surface layer cannot be obtained. On the other hand, if large particles exceeding 300 μm are used, the surface roughness of the article to be treated becomes large and an electrode that requires a low contact resistance value is required. Is not suitable. The shape of the particles is spherical, which is the most suitable from the viewpoint of the coating property to the particles and the transfer property to the article to be processed, but there is no problem if the substantially approximate size such as cylindrical, polyhedral, or grit is in this range. . The true specific gravity of the particles in the present invention is set to 2 to 15, because the true specific gravity of the particles as described above is within the above numerical value,
The most suitable true specific gravity is 11 from running cost and transferability.
~ 15.

Further, in the present invention, gold, silver, copper, and Ni can be used as the metal forming the coating film as long as the metal has a low electric resistance. Gold, which has good electric resistance, and silver, which has good oxidation resistance, good electric resistance and relatively good ductility, are most suitable.

[0011]

Next, a preferred embodiment of the present invention will be described with reference to three examples.

Example 1 Gold was used as a material for forming a coating film having a low electric resistance value, and spherical particles made of a cemented carbide having a particle diameter of 100 μm were used as particles serving as nuclei of a solid plating material. Spherical particles made of gold, which is a metal material having a lower hardness than the particle material and a lower electric resistance value than the material to be processed, are plated to form a coating film, and a solid plating material according to the present invention is obtained. Was. This solid plating material is JIS of 30mm in diameter and 4mm in thickness.
0.1% for the mirror-polished workpiece consisting of SS400.
The projection process was performed at an air pressure of 2 MPa to obtain an electrode metal material. A uniform gold coating film is uniformly formed on the surface of the electrode metal material thus obtained,
When this contact resistance was measured, it was found to be about 1 /
It was 3. When immersed in dilute hydrochloric acid,
Since the core particles were a cemented carbide, there was no change without oxidation or corrosion, and it was confirmed that the particles had excellent corrosion resistance and a low electric resistance layer. In addition, at the time of the projection processing on the material to be processed, the solid plating material described above was a cemented carbide having a core of 14.8 Hv with a true specific gravity of particles as heavy as 14.8.
Even at a low projection pressure of about 2 MPa, a sufficient anchor pattern effect can be obtained, so that a metal surface layer made of a material having a lower electric resistance than a uniform and strong material to be processed can be obtained on the surface of the workpiece. .

[0012]

Example 2 Silver was used as a material for forming a coating film having a low electric resistance value, and 100 μm particles made of cemented carbide were used as particles serving as nuclei of a solid plating material. Thus, a solid plating material according to the present invention was obtained. This solid plating material was subjected to a projection process at an air pressure of 0.2 MPa to a mirror-polished workpiece made of a J1S AlO8O material having a diameter of 30 mm and a thickness of 4 mm to obtain an electrode metal material. A uniform silver coating film was uniformly formed on the surface of the electrode metal material thus obtained, and the contact resistance was measured to be about 1/7 that of the untreated one. Further, when this was immersed in dilute hydrochloric acid, it was confirmed that, as in the case of Example 1, there was no change in oxidation or corrosion, and that it had excellent corrosion resistance and a low electric resistance layer. Was.

[0013]

Example 3 Gold was used as a material for forming a coating film having a low electric resistance value, and glass beads of 250 μm were used as particles serving as nuclei of a solid plating material. A solid plating material according to the invention was obtained. This solid plating material was subjected to a projection process at an air pressure of MPa on a mirror-polished material of JIS SS400 having a diameter of 30 mm and a thickness of 4 mm to obtain an electrode metal material. A uniform gold coating film was uniformly formed on the surface of the electrode metal material thus obtained, and it was confirmed that the same effect as in Example 1 was obtained.

In the embodiment, the coating material is added by electroplating. However, the present invention is not limited to such a method, and the coating layer may be formed by physical vapor deposition such as vacuum vapor deposition or ion plating, or by chemical vapor deposition such as pyrazma CVD or optical CVD. These metal layers may be formed by vapor deposition or mechanical action. Further, the relationship between the electric resistance value of the material to be processed and the material forming the coating film used in the above-described embodiment is SS40.
0>A1080>Au> C1100 ≧ Cu> Ag, and the abrasion relationship of core particles is as follows: cemented carbide <steel <glass beads.

In each of the above embodiments, the coating film on the surface of the core particles is formed by electroplating. In addition to electroplating, a physical vapor deposition method such as vacuum deposition or ion plating is used. Even if the plasma CV
D, It may be formed by a chemical vapor deposition method such as photo CVD or by a mechanical action.

Table 1 shows the experimental results of the present invention.

[Table 1]

The evaluation method in Table 1 was performed as follows. 1. Regarding the adhesion, the degree of adhesion of the coating material to the surface of the article to be treated was observed, and those having good adhesion were evaluated as good, those slightly adhering as good, and those not formed as poor. 2. With respect to the contact resistance, relative evaluation was made assuming that the contact resistance at the time of the material of the article to be treated was 1 and that the case where each value was reduced was reduced, and the case where the value was the same was the same and the case where it was increased. 3. The corrosion resistance was immersed in dilute hydrochloric acid, and the relative evaluation of the state of hydrogen generation from the surface was performed as compared with the state of the material of the article to be treated. In the table, columns A1 to A9 of the materials used for the particles serving as nuclei used the conditions shown in Table 2.

[0018]

[Table 2]

[0019]

As is apparent from the above description, the present invention is based on particles having a particle diameter of 30 to 300 μm, and has a surface having a lower hardness than the material of the particles and an electric resistance value higher than that of the material to be treated. Because a coating film made of a low metal material is formed, an inexpensive metal material is processed by a solid plating method into an electrode metal material having the same corrosion resistance and low electric resistance layer as gold, silver, copper, etc. There is an advantage that the material can be changed to a material suitable for an electrode material through which a current flows.

Claims (5)

[Claims] 1. A coating film composed of a metal material having a particle diameter of 30 to 300 μm as a nucleus and having a lower hardness than the material of the particle and a lower electric resistance value than a material to be processed is formed on the surface thereof. A solid plating material, characterized in that: 2. The particle has a hardness of 400 to 2000 Hv and a true specific gravity of the particle of 2 to 15.
3. The solid plating material according to item 1. 3. The solid plating material according to claim 1, wherein the metal forming the coating film is a single metal or an alloy thereof. 4. The method according to claim 1, wherein the metal forming the coating film is gold,
The solid plating material according to any one of claims 1 to 3, wherein the material is at least one of silver, copper, and Ni. 5. The solid plating material according to claim 1, wherein the core particles are a cemented carbide.