JP2001088088A - Method and device for separating unit substrate from flexible original plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a cost to use for general purpose and compact size and weight. SOLUTION: This device 1 for separating a unit substrate from an original plate is formed so that the unit substrate 11 is connected to the flexible original plate 10 through a number of connection parts 13 provided in a slit 12 formed along the outer shape of the unit substrate. The device comprises Y-direction moving means 3 moving the original plate in a Y-direction as one direction, X-direction moving means 5 moving a cutter 22 in an X-direction crossed at right angle to the Y-direction in the surface direction of the original plate, and Z-direction moving means 25 moving the cutter in a Z-direction crossed at right angle to the X-Y plane. Then, the original plate is moved in the Y- direction and the cutter is moved in the X-direction for positioning, and the cutter is moved in the Z-direction to cut off the connection part so as to disconnect the unit substrate from the original plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for separating a single substrate from a novel flexible original plate. More specifically, the present invention relates to a technology for reducing cost, providing versatility, and reducing the size and weight.

[0002]

2. Description of the Related Art Conventionally, a single substrate has been separated from an aggregate substrate having a large number of single substrates formed on a flexible original plate by using a hydraulic press and a mold.

[0003] That is, a dedicated punching die is prepared which is adapted to the shape of a single substrate formed on the collective substrate,
The punching die was mounted on a hydraulic press machine to perform the pressing process.

[0004]

However, in the above-mentioned prior art, there is a problem that both the press and the mold are expensive and the running cost is high.

Further, when switching the collective substrate, it is necessary to request a mold maker to produce a new mold, and the operation is interrupted.

Further, the maintenance of the mold must be requested to the mold maker, and a spare for the mold must be prepared in order not to interrupt the work.
It is disadvantageous in terms of cost.

Further, there is a problem that the press machine and the mold are large and heavy, and there is a problem that there is no versatility since it is a dedicated machine.

[0008] Therefore, an object of the present invention is to reduce the cost, provide versatility, and reduce the size and weight.

[0009]

SUMMARY OF THE INVENTION According to the present invention, there is provided a method for separating a single substrate from a flexible original plate, wherein the single substrate is formed on the flexible original plate along the outer shape of the single substrate. A method for separating a single substrate from the original plate connected via a number of connecting portions interposed in the middle of the slit, wherein the connecting portion is cut by a cutting blade moving in a direction orthogonal to a surface direction of the original plate. In this method, the single substrate is cut off from the original plate.

Therefore, in the method of separating a single substrate from a flexible original plate according to the present invention, it is sufficient to drive the cutting blade to separate the single substrate, so that a large-scale apparatus is not required, and the cost is low. It can be configured to be small and lightweight. In addition, there is no need to request a specialized manufacturer for maintenance, and for example, replacement can be easily performed by using a commercially available cutter blade. Furthermore, if a small robot is used, it is possible to cope with the change of the single substrate to be separated by only changing the program.

Further, in order to solve the above-mentioned problems, the present invention provides an apparatus for separating a single substrate from a flexible original plate, wherein the single substrate is formed in the flexible original plate in the middle of a slit formed along the outer shape of the single substrate. A device for separating a single substrate from the original plate connected via a number of interposed connecting portions, wherein a Y-direction moving means for moving the original plate in one direction, the Y direction, and a cutting blade are provided. X direction moving means for moving in the X direction orthogonal to the Y direction in the plane direction of the original plate, and Z direction moving means for moving the cutting blade in the Z direction orthogonal to the XY plane, wherein the original plate is provided. The positioning is performed by moving the cutting blade in the Y direction and the X direction, and the cutting blade is moved in the Z direction to cut the connecting portion to separate the single substrate from the original plate.

Therefore, in the apparatus for separating a single substrate from a flexible original plate according to the present invention, the cutting blade and X, Y,
What is necessary is just to prepare each moving means in the Z direction, and it is possible to configure the apparatus inexpensively and small and light. In addition, there is no need to request a specialized manufacturer for maintenance, and for example, replacement can be easily performed by using a commercially available cutter blade. Furthermore, if you use a small robot,
The change of the single board to be separated can be dealt with only by changing the program.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method and an apparatus for separating a single substrate from a flexible original plate according to the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows an outline of a separating apparatus 1 using an XY robot.

The XY robot 2 has a moving table 3 which moves in one direction on the upper surface of the base 2a, that is, in the direction of arrow Y. A rail section 4 is bridged across the moving area of the moving table 3, and the tool moving table 5 is supported on the rail section 4 so as to be movable in the X direction orthogonal to the Y direction. The tool moving table 5 supports a vertical moving table 6 that moves in a Z direction orthogonal to the XY plane.

The substrate receiving table 7 and the cutter unit 8 are mounted on the XY robot 2 as described above, and the separating apparatus 1 is configured.

The substrate receiving table 7 is mounted on the moving table 3, and the flexible collective substrate 9 is mounted on the upper surface of the substrate receiving table 7.

As shown in FIG. 2, the flexible collective substrate 9 has a large number of single substrates 11,
Are formed along the slits 12, 12,... Formed along the outer shape of the single substrates 11, 11,. It is connected through the. One positioning hole 14 and two long holes 15, 15 are formed at the corners of the original plate 10, and when the flexible assembly substrate 9 is placed on the substrate receiving table 7, these positioning holes 14 and the long holes 15 are formed. The holes 15, 15 are in the substrate receiving table 7.
The flexible assembly board 9 is inserted into the positioning pins 16, 16, 16, which are provided upright, to roughly position the flexible assembly board 9 with respect to the board receiving table 7. Furthermore, each single substrate 1
Each of the two single positioning holes 17, 17,... Is formed at a position close to the outside of the slits 12, 12,.

Each of the connecting portions 13, 1 of the flexible collective substrate 9 mounted thereon is
At the positions corresponding to 3,...
.. Are formed, and the single unit positioning holes 17, 1 are formed.
At positions corresponding to 7,..., Guide pin relief holes 19,
19,... Are formed.

The cutter unit 8 includes the unit base 2
0 and a large number of cutter blades 22 between the unit bottom plate 21,
Are supported so as to be vertically movable. The four corners of the unit base 20 and the unit bottom plate 21 are connected by connecting rods 23, 23,.

A cutter blade mounting plate 24 is vertically movably mounted in the space between the unit base 20 and the unit bottom plate 21. 4 of cutter blade mounting plate 24
Sleeves 24a, 24a,... Are attached to the corners, and the sleeves 24a, 24a,.
The outer fitting is slidably supported by 3, 23,. A cutter cylinder 25 is attached to the upper surface of the unit base 20, and the cutter cylinder 25 moves the cutter blade mounting plate 24 up and down, that is, in the Z direction.

The cutter blade 2 is attached to the cutter blade mounting plate 24.
2, 22, ... are attached. The cutter blades 22, 22,...
Are attached at positions corresponding to 3, 13,.... The cutter blade 22 is detachably attached to a cutter blade attachment plate 24 via a cutter blade attachment base 26 shown in FIG. The cutter blade mounting base 26 has an inverted L-shape in side surface shape, and has a positioning pin 26a protruding from the upper surface and a fixing screw hole 26b formed therein. A vertically extending groove 26c is formed in a vertically extending portion, and a commercially available cutter blade 22 is engaged with the groove 26c and fixed by a fixing screw 26d in a state where the cutter blade 22 is positioned. The positioning pins 26a of the cutter mounting base 26 are fitted into positioning holes (not shown) formed in the cutter blade mounting plate 24, and fixing screws (not shown) provided on the cutter blade mounting plate 24 are provided. By being screwed into the fixing screw hole 26b, the cutter blade 22
Is attached to the cutter blade attachment plate 24. Therefore, when it is necessary to replace the cutter blade 22, the cutter blade mounting base 26 is removed from the cutter blade mounting plate 24, and the cutter blade 22 of the cutter blade mounting base 26 is replaced with a new one. Base 26
Can be attached to the cutter blade attachment plate 24 again.
The cutter blade 22 can be easily replaced, and the maintenance property is good.

The cutter blade mounting plate 24 supports guide pins 27 corresponding to the single positioning holes 17 formed in the flexible board 9. The tips 27a, 27a of the guide pins 27, 27 are formed in a tapered shape.

Further, vacuum units 28, 28 are supported on the cutter blade mounting plate 24. Suction heads 28a, 28a of the vacuum units 28, 28
Are movable with respect to the main portions 28c, 28c, and are urged downward by coil springs 28d, 28d externally fitted to the main portions 28c, 28c.

The above-mentioned unit bottom plate 21 has the above-mentioned cutter blades 22, 22,.
Are formed to penetrate the base 7 and the vacuum units 28, 28 downward.
Further, at the four corners of the lower surface of the unit bottom plate 21, the feet 30,
Are protruded, and the feet 30, 30,...
A contact member (not shown) having a cushioning property and a frictional force, such as felt, is attached to the lower surface of.

The cutter unit 8 is supported by the vertical moving table 6 of the XY robot 2.

Next, a procedure for separating the single substrate 11 from the flexible collective substrate 9 will be described with reference to FIGS.

First, the flexible collective substrate 9 is placed on the substrate receiving table 7 in a state where it is positioned.

Next, the moving table 3 and the tool moving base 5 are moved in the Y direction and the X direction, respectively, so that the cutter blades 22, 22,.
The connecting portions 13, 1 of the unitary substrate 11 to be separated from the
3, so that they come to positions corresponding to.

Then, the vertical moving table 6 is driven, and the cutter unit 8 descends, that is, moves in the Z direction, and the legs 30, 30,.
2 (a position where the feet 30, 30,... Abut) is shown in FIG. 2, and the flexible assembly board 9 is pressed against the board receiving base 7 by the feet 30, 30,. (See FIG. 3). Here, the lowering of the vertical moving table 6 stops.

Next, the cutter cylinder 25 is driven, the cutter blade mounting plate 24 is lowered, and accordingly, the cutter blades 22, 22,..., The guide pins 27, 27 and the vacuum units 28, 28 are lowered. To go. Then, first, the tip portions 27a, 27 of the guide pins 27, 27
a is inserted into the single unit positioning holes 17 provided in the vicinity of the single substrate 11 to accurately position the single substrate 11 with respect to the cutter unit 8. After the single substrate 11 is positioned with respect to the cutter unit 8, the cutter blades 22, 22,.
.. begins to cut and vacuum units 28, 2
The eight suction heads 28a, 28a are brought into contact with the single substrate 11 (see FIG. 4).

When the cutter blade mounting plate 24 is further lowered therefrom, the connecting portions 13, 1
Are cut by the cutter blades 22, 22,..., And the single substrate 11 is separated from the original plate 10 of the flexible aggregate substrate 9 (see FIG. 5). Note that FIG.
Are inserted into the cutter escape holes 18, 18,... Of the substrate receiving base 7, and the guide pins 27, 27 are connected to the substrate receiving base. 7 are inserted into the guide pin escape holes 19, 19.
Tip portions 28b, 28b of vacuum units 28, 28
As the coil springs 28d, 28d are compressed, they rise relatively to the main parts 28c, 28c, and the suction heads 28a, 28a are kept in a state of elastic contact with the single substrate 11.

As shown in FIG. 5, when the separation of the single substrate 11 is completed, the cutter mounting plate 24 is raised to the position shown in FIG. 3, and the entire cutter unit 8 is raised. It is to be noted that, as the cutter blades 22, 22,.
・ ・ Even if something goes up with you,
The unitary substrate 11 abuts on the unit bottom plate 21 and cannot move upward any more, so that it remains on the substrate receiving table 7 without fail.

The cutter unit 8 which has been lifted up is moved to a position corresponding to the single substrate 11 to be separated next by the movement of the moving table 3 and the tool moving table 5, where the single substrate 11 is separated according to the above procedure. Done. Then, such a procedure is repeated, and the single board 1 provided on the flexible collective board 9 is repeated.
1, 11,... Perform all separation.

Then, all the single substrates 11, 11,...
The remaining portion (the so-called discarded substrate) of the original plate 10 from which the is cut off is discharged by the discharge unit 31 attached to the base 2a while being sucked by the vacuum units 28, 28.
And automatically discharged by the discharge unit 31.

On the other hand, the separated single substrates 11, 11,... Remaining on the substrate receiving table 7 are taken out to the outside by a suitable take-out means.

As described above, the single substrate 11 is separated from the flexible collective substrate 9 one after another.

The above-described apparatus for separating a single substrate from a flexible original plate does not require expensive molds or hydraulic presses, and can be manufactured at extremely low cost. In addition, maintenance such as replacement of the cutter blade 22 having deteriorated sharpness can be performed without requesting a specialist.
The operation can be easily performed, the running cost is not required, and the operation interruption time can be shortened. As a result, the single substrate can be provided at a very low cost.

When the type of the flexible collective board to be separated is changed, the cutter unit 8 and the board receiving base 7 are changed to those adapted to the new flexible collective board, and the XY robot 2 is newly provided. It can be handled only by teaching the moving points corresponding to the flexible collective board, and is extremely easy to use.

Further, the XY robot can be configured using a small and lightweight XY robot, and can be easily installed and used at a desired place.

If an XY robot is used, the robot has general versatility, and can be used for other purposes when the work of separating a single substrate is not performed.

It should be noted that the shapes and structures of the respective parts shown in the above-described embodiments are merely examples of the specific embodiments to be carried out when carrying out the present invention. The scope should not be construed as limiting.

[0043]

As is apparent from the above description, the method for separating a single substrate from a flexible original plate according to the present invention is characterized in that the single substrate is formed on the flexible original plate by a slit formed along the outer shape of the single substrate. A method for separating a single substrate from the original plate connected via a number of connecting portions interposed in the middle, wherein the connecting portion is cut by a cutting blade moving in a direction orthogonal to a surface direction of the original plate. And separating the single substrate from the original plate.

Therefore, in the method of separating a single substrate from a flexible original plate according to the present invention, it is sufficient to drive the cutting blade to separate the single substrate, so that a large-scale device is not required, and the cost is reduced. It can be configured to be small and lightweight. In addition, there is no need to request a specialized manufacturer for maintenance, and for example, replacement can be easily performed by using a commercially available cutter blade. Furthermore, if a small robot is used, it is possible to cope with the change of the single substrate to be separated by only changing the program.

Further, in the apparatus for separating a single substrate from a flexible original plate according to the present invention, the single substrate is connected to the flexible original plate via a number of connecting portions interposed in the middle of a slit formed along the outer shape of the single substrate. A device for separating a single substrate from the original plate that is connected to the original plate, wherein a Y-direction moving means for moving the original plate in one direction, the Y direction, and a cutting blade, the Y direction in the surface direction of the original plate. An X-direction moving means for moving the cutting blade in the X direction orthogonal to the first direction, and a Z for moving the cutting blade in the Z direction perpendicular to the XY plane
Directional moving means, the original plate is moved in the Y direction, and the cutting blade is moved in the X direction to perform alignment, and the cutting blade is moved in the Z direction.
In which the connecting portion is cut to separate the single substrate from the original plate.

Therefore, in the apparatus for separating a single substrate from a flexible original plate according to the present invention, the cutting blade and X, Y,
What is necessary is just to prepare each moving means in the Z direction, and it is possible to configure the apparatus inexpensively and small and light. In addition, there is no need to request a specialized manufacturer for maintenance, and for example, replacement can be easily performed by using a commercially available cutter blade. Furthermore, if you use a small robot,
The change of the single board to be separated can be dealt with only by changing the program.

According to the third aspect of the present invention, the Y-direction moving means and the X-direction moving means move the workpiece in the Y direction, and the tool moving table moves the tool in the X direction. Is constituted by the moving table and the tool moving table of the XY robot having the above-mentioned features, and therefore, it is advantageous in that it is small and lightweight and has versatility.

According to the fourth aspect of the present invention, the plurality of cutting blades unitized as a cutting blade unit are moved by the X-direction moving means and the Z-direction moving means. A plurality of connecting portions can be cut, and workability is improved.

According to the fifth aspect of the present invention, since the plurality of cutting blades are provided corresponding to the connecting portions, one single substrate can be cut at a time.

In the invention described in claim 6, since a plurality of single substrates are formed on the original plate, the plurality of single substrates can be quickly separated by a continuous operation or a single operation.

According to the seventh aspect of the present invention, there is provided a guide pin which moves integrally with the cutting blade, and the guide pin is fitted into a positioning hole formed in the original plate prior to the cutting blade. Since the relative positioning of the cutting blade and the connecting portion is performed in combination, the connecting portion can be reliably cut.

According to the invention described in claim 8, the cutting blade unit having a plurality of cutting blades is provided with a unit bottom plate having a blade insertion hole through which the cutting blade is inserted on a side close to the flexible original plate. When the connecting portion is cut, the cutting blade is inserted through the blade insertion hole to cut the connecting portion, and then the cutting blade is moved in a direction away from the original plate. Can be prevented from moving with the cutting blade.

According to the ninth aspect of the present invention, since the cutting blade is configured to be detachable from the cutting blade unit, it is possible to easily and inexpensively replace the cutting blade.

[Brief description of the drawings]

FIG. 1 shows an embodiment of an apparatus for separating a single substrate from a flexible original plate according to the present invention, and FIG. 1 is an overall schematic perspective view.

FIG. 2 is a plan view showing an outline of a flexible collective substrate.

FIG. 3 is a schematic side view showing an operation of separating a single substrate from an aggregate substrate together with FIGS. 4 and 5, and FIG. 3 shows a state where the cutter unit 8 descends and presses the aggregate substrate.

FIG. 4 shows a state where the cutter blade has descended and has begun to cut the connecting portion of the collective substrate.

FIG. 5 shows a state where cutting has been completed.

FIG. 6 is an enlarged perspective view showing a cutter blade mounting base.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Device for separating a single substrate from a flexible original plate, 2 ... XY robot, 3 ... Moving table (Y direction moving means), 5 ... Tool moving table (X direction moving means), 6 ...
Vertical moving table (Z direction moving means), 8: cutter unit (cutting blade unit), 10: original plate, 11: single substrate, 1
2 ... slit, 13 ... connecting part, 17 ... single unit positioning hole (positioning hole), 21 ... unit bottom plate, 22 ... cutter blade (cutting blade), 25 ... cutter cylinder (Z direction moving means), 27 ... guide pin, 29 … Insertion hole (blade insertion hole)

Claims (9)

[Claims] 1. A method of separating a single substrate from the original plate, wherein the single substrate is connected to a flexible original plate via a plurality of connecting portions interposed in a slit formed along the outer shape of the single substrate. A method of separating a single substrate from a flexible original plate, wherein the single substrate is separated from the original plate by cutting the connecting portion by a cutting blade moving in a direction orthogonal to a surface direction of the original plate. 2. A device for separating a single substrate from the original plate, wherein the single substrate is connected to a flexible original plate via a plurality of connecting portions interposed in a slit formed along the outer shape of the single substrate. And a Y-direction moving means for moving the original plate in the Y direction which is one direction; an X-direction moving means for moving a cutting blade in an X direction orthogonal to the Y direction in a surface direction of the original plate; Z direction moving means for moving the cutting blade in a Z direction orthogonal to the XY plane, wherein the original plate is moved in the Y direction, and the cutting blade is moved in the X direction to position the cutting blade. An apparatus for separating a single substrate from a flexible collective substrate, wherein the single substrate is separated from an original plate by moving in a Z direction to cut the connection portion. 3. The XY robot according to claim 1, wherein the Y-direction moving means and the X-direction moving means move a workpiece in the Y direction, and a tool moving table moves the tool in the X direction. 3. The apparatus for separating a single substrate from a flexible original plate according to claim 2, comprising a table and a tool moving table. 4. The flexible original plate according to claim 2, wherein a plurality of cutting blades unitized as a cutting blade unit are moved by the X-direction moving means and the Z-direction moving means. For separating a single board from a 5. The apparatus for separating a single substrate from a flexible original plate according to claim 4, wherein the plurality of cutting blades are provided corresponding to the connecting portions. 6. The apparatus for separating a single substrate from a flexible original plate according to claim 2, wherein a plurality of single substrates are formed on the original plate. 7. A guide pin which moves integrally with the cutting blade, wherein the guide pin fits into a positioning hole formed in the original plate prior to the cutting blade, and connects the cutting blade to the connecting portion. 3. The apparatus for separating a single substrate from a flexible original plate according to claim 2, wherein the relative positioning is performed. 8. A cutting blade unit having a plurality of cutting blades is provided with a unit bottom plate having a blade insertion hole through which the cutting blade is inserted on a side adjacent to a flexible original plate. The cutting of the unitary board from the flexible original plate according to claim 4, wherein the cutting blade is moved in a direction away from the original plate by cutting the connecting portion by passing through the blade insertion hole. apparatus. 9. The apparatus according to claim 4, wherein the cutting blade is configured to be detachable from the cutting blade unit.