JP2001076550A - Flame resistant flat cable, heat sealing tape and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve flame resistance, heat resistance and durability by constituting an anchor coat layer of a multifunctional compound, a polyester resin and a polyurethane resin having a specific glass transition point range, constituting a heat sealing tape layer of a filler and a polyester resin of a specific rate, and providing a high polymer plasticizer having average molecular weight of a specific range. SOLUTION: A polyester resin and a polyurethane resin having a glass transition point of 20 deg.C to 120 deg.C are included in an anchor coat(AC) layer 2. A heat seal(HS) layer 3 is composed of 80 to 20 wt.% of a filler mainly composed of flame resistance and 20 to 80 wt.% of a resin component mainly composed of a polyester resin, and 0.1 to 10 wt.% of a high polymer plasticizer having average molecular weight of 2,500 to 10,000 is included in 100 wt.% of a polyester resin. A resin component of the heat seal layer 3 requires performance excellent in a shape, an adhesive property and flexibility, and an adipic acid, an azelaic acid and a sebacic acid are used as the plasticizer to be added.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant flat cable, an HS tape, and a method for producing the same, and more particularly, to the provision of a flame-retardant flat cable excellent in flame retardancy, heat resistance and durability. And

[0002]

2. Description of the Related Art Conventionally, flat cables are often used for electronic parts such as liquid crystal display devices, mobile phones, copiers, printers, automobiles, home electric appliances, computers, and electronic devices. These flat cables are
It is composed of two HS tapes composed of a film-like base material, an AC layer and an HS layer, and a large number of conductors sandwiched between the two tapes by heat sealing.

[0003]

The conventional flat cable made of vinyl chloride has excellent flame retardancy and has been widely used.
However, since the polyvinyl chloride flat cable has no adhesiveness to the conductor, the conductor in the cable has the disadvantage of being cut in a short time in a bending test or a sliding test. It has been replaced by polyester resins. However, since a film-like base material (polyethylene terephthalate-based film: PET or polyamide-based film) and a polyester-based heat sealant are easily flammable, it is generally difficult to add a large amount of flame retardant to the polyester-based heat sealant. Although it has been burned, there has been a problem that the adhesion of the HS layer to the conductor is reduced, or the conductor protrudes from the end of the cable when heated.

[0004] In the above flat cable, the adhesiveness of the HS layer to the conductor is an important factor for the phenomenon that the conductor is disconnected in the cable during bending or sliding.
When the adhesiveness between the S layer and the conductor is low, the conductor is easily broken.
It is preferable to use a polyester resin having a low Tg for adhesion of the HS layer to the conductor. However, the HS layer made of the low Tg polyester has a problem that the conductor protrudes due to thermal durability and resin shrinkage. To prevent the conductor from projecting, adding a polyester resin having a high Tg to the HS layer is effective, but has an effect of reducing the adhesion of the HS layer to the conductor.

[0005] Another factor is the ratio of the heat sealant (V) to the filler (F) constituting the HS layer. That is, when F is increased, the protrusion of the conductor tends to be suppressed, but when F is too large, the adhesion of the HS layer to the conductor is reduced. Therefore, V and F are implemented in a very narrow range, but it is actually difficult to satisfy both at the same time. Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art and to provide a flame-retardant flat cable excellent in flame retardancy, heat resistance, durability and the like.

[0006]

The above object is achieved by the present invention described below. That is, the present invention relates to a flat cable including two HS tapes composed of a film-like base material, an AC layer and an HS layer, and a conductor that is heat-sealed and sandwiched between the two tapes. A polyfunctional compound having an isocyanate group, a blocked isocyanate group and / or a carbodiimide group,
Is composed of a polyester resin and a polyurethane resin at 20 ° C. to 120 ° C., and the HS layer is formed of a filler 80 to 2
0% by weight and 20 to 80% by weight of a resin component containing a polyester resin as a main component.
Provided is a flame-retardant flat cable, an HS tape and a method for producing the same, characterized by containing 0.1 to 10 parts by weight of a polymer plasticizer having an average molecular weight of 2,500 to 10,000 per 100 parts by weight. I do.

According to the present invention, a layer composed of a polyester resin having a high Tg and a soft polyurethane resin is provided as an AC layer together with a polyfunctional compound, and a polyester resin and a polymer plasticizer are optionally added to the HS layer in the HS layer. By adding the polyfunctional compound, it is possible to obtain a satisfactory result that simultaneously satisfies the adhesiveness of the HS layer to the conductor and the prevention of the protrusion of the conductor.

The production of the flame-retardant flat cable of the present invention is carried out by a heat sealing method.
g By forming an AC layer made of a polyester resin and a urethane resin, it is possible to reduce the heat shrinkage action of the HS layer applied thereon and to reduce the protrusion of the conductor by this effect. Further, the adhesion of the HS layer to the conductor is achieved by adding a polymer plasticizer.
This is achieved by adding a crosslinking agent to the S layer. As a result, there is an effect that physical properties excellent in heat resistance and bending resistance are imparted, and deformation such as shrinkage, twist, and warpage is reduced. In the above operation, the solution forming the AC layer penetrates into the underlying film-like substrate and / or the HS layer thereon, and the AC layer penetrates into the film-like substrate and / or the HS layer thereon. A further improved physical property was exhibited. In this case, in order to form the AC layer, the solvent of the solution has an affinity for the film-shaped substrate and the HS layer, swells or dissolves them, and at least a part of the AC component is transferred to the film-shaped substrate and the HS layer. It is considered to have penetrated.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the present invention will be described in more detail with reference to embodiments. FIG. 1 is a diagram illustrating a flame-retardant flat cable of the present invention and its manufacture. As shown in FIG. 1B, the flat cable according to the present invention includes two HS tapes A composed of a film-like base material 1, an AC layer 2 and an HS layer 3, and a heat between the two tapes A. And the conductor B sandwiched and sealed.
There is a characteristic in the configuration of the tape. Accordingly, the conductor B is the same as a conventionally known conductor, and a detailed description thereof will be omitted. The HS tape will be described in detail below.

As the film-like base material used in the present invention, any film usually used for forming a flat cable can be used, and most preferred is a biaxially stretched polyethylene terephthalate (PET) film, Polybutylene terephthalate films and polyamide films are also preferred. The film thickness is 5-200μ
m, preferably 15 to 100 μm.
If it is less than 5 μm, it is difficult to apply the AC layer to the surface, and if it exceeds 200 μm, it is not practical. The surface treatment of the film is not always necessary, but a treatment such as a corona discharge treatment or an oxidation treatment may be performed.

In the present invention, an AC layer is formed on one surface of the film-like substrate. As the resin for the AC layer, T
Polyester (PES) resin and polyurethane resin (PU) having a g of 20 to 120 ° C., preferably 30 to 100 ° C.
, Preferably PES / PU (weight ratio)
= 0.7 / 0.3 to 0.3 / 0.7. PE
If S exceeds 0.7, the adhesion of the AC layer to the film-like substrate becomes weak, and if it is less than 0.3, the protrusion of the conductor due to shrinkage of the HS layer increases. The AC layer includes a polyfunctional compound described below.

An HS layer is formed on the surface of the AC layer. H
As for the physical properties of the resin component for the S layer, in all environments where flat cables are used, excellent performance is required in terms of shape, adhesiveness, and flexibility, that is, flexibility, bending properties, sliding properties, etc. Is done. Therefore, the Tg of the polyester resin component, which is the main component of the HS layer, needs to be lower than the temperature of the environment where the flat cable is used. Specifically, Tg is about 20 ° C. or less, preferably 10 ° C. or less. Also, when adapting the flat cable to a high-temperature use environment, for example,
A high Tg polyester resin having a Tg of 40 ° C. or higher, preferably 60 ° C. or higher can be used in combination. Even in this case, if the amount of the high Tg polyester resin is too large, the adhesiveness of the HS layer to the conductor is significantly reduced, so that the content thereof is 10% by weight or less of the resin component.

The plasticizer added to the HS layer has a molecular weight of about 2,2.
About 500 to 10,000 polymer plasticizers, particularly preferably polyester plasticizers, specifically, adipic acid, azelaic acid, sebacic acid, phthalic acid, etc., and ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol , 1,3-butylene glycol, neopentyl glycol, glycerin, and other dihydric or trihydric alcohols, and a monobasic acid and the like, and a liquid polyester plasticizer at room temperature. When the molecular weight is less than 2,500, it has an effect on adhesiveness, but there are problems such as migration of plasticizer and extractability, and there is a problem in long-term durability stability (change over time) of the flat cable. If it exceeds 2,000, the original properties as a plasticizer are lost.

The amount of the plasticizer added is in the range of 0.1 to 10 parts by weight based on 100 parts by weight of the polyester resin. When the amount is less than 0.1 part by weight, the adhesion of the HS layer to the conductor is weak. However, there is a problem in the durability of the conductor in the cable (for example, the conductor is easily broken by bending or sliding), and if it exceeds 10 parts by weight, the conductor from the end of the flat cable may protrude when left in heat. The degree becomes large and causes troubles such as poor contact when the cables are connected to each other.

Plasticizers other than those described above, for example, having a molecular weight of 400
~ 3,000 epoxy fatty acid esters, molecular weight about 1,
Epoxy plasticizers such as epoxidized fats and oils of 000 to 5,000, or phthalic esters such as dioctyl phthalate, dibutyl phthalate, diphenyl phthalate and dicyclohexyl phthalate; aliphatics such as butyl oleate and glycerin monooleate; Monobasic acid esters, di-n-hexyl adipate, di-2-adipate
Aliphatic dibasic esters such as ethylhexyl, diethylhexyl azelate, dibutyl sebacate, 2-ethylhexyl sebacate, dihydric alcohol esters such as diethylene glycol dibenzoate, triethylene glycol di-2-ethyl butyrate, and acetyl ricinoleic acid Oxy acid esters such as butyl, butylene glycol bis (butyl phthalate) butyl phthalate, acetyl tributyl citrate and the like, and phosphate esters such as tributyl phosphate, tri 2-ethylhexyl phosphate, triphenyl phosphate, tricresyl phosphate and the like. These plasticizers may be mixed and used in a range of 50% by weight or less based on the high-molecular weight plasticizer. Although it is not clear what is expected from the plasticizer, it is considered that the adhesive is effective for the adhesive effect at the time of heat sealing and for alleviating the distortion of the film.

The polyfunctional compound is added to the AC layer or further to the HS layer. The addition to the AC layer is preferably about 1 to 20 times the equivalent of the reactive group of the resin, and the addition to the AC layer aims at bonding the film-like base material and the HS layer. H
The addition to the S layer is added to improve the heat resistance and the like related to the conductor bonding when connected for a long time. They are used alone or in combination.

Examples of the polyfunctional compound include, for example, tolylene diisocyanate (TDI), 4,4'-diphenylmethane diisocyanate (MDI), xylene diisocyanate (XDI), hexamethylene diisocyanate (HDI), and isophorone diisocyanate (IPD).
I) and their burettes, adducts with trimethylolpropane, etc .; isocyanates such as isocyanate trimers; and alcohols or phenols (ethanol, isopropanol, n-butanol, phenol, nitrophenol, etc.). Lactams (ε-caprolactam, etc.) and blocked isocyanates blocked with active methylene compounds (diethyl malonate, methyl acetoacetate, ethyl acetoacetate, acetylacetone). Further, examples thereof include carbodiimide-based cross-linking agents such as polytoluene carbodiimide, poly 4,4-diphenylmethane carbodiimide, polyisophorone carbodiimide, polyhexane carbodiimide and derivatives thereof synthesized from the above isocyanates.

The above polyfunctional compound has 2 to 6 isocyanate groups, blocked isocyanate groups and / or
Alternatively, it preferably has a carbodiimide group. Further, the polyfunctional compound is preferably used after being dissolved or dispersed in a solvent. The solvent used cannot be specified because it differs depending on the reactivity of the functional group of the polyfunctional compound, but water, methanol, ethanol, propyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethylformamide, N-methylpyrrolidone, methyl ethyl ketone, acetone, methyl isobutyl Single or mixed solvents such as ketone, ethyl acetate, propyl acetate, toluene, xylene, cyclohexane, methylcyclohexane and hexane are used.

In some cases, the reaction rate of the polyfunctional compound can be adjusted by adding an alcohol. For example, by blocking the isocyanate group with a lower alcohol or phenol, stabilization of the isocyanate group or titanium chelate is stabilized by isopropyl alcohol. In such a case, since the polyfunctional compound can be handled as a one-part solution, it is effective for adding to the AC layer solution or the HS layer solution. The amount of the polyfunctional compound to be added is 0.05 to 100 parts by weight of the polyester resin.
The range is from 10 to 10 parts by weight. Preferably it is in the range of 0.1 to 5 parts by weight. It was also found that the combined use with a plasticizer was effective (durability and adhesiveness).

Among the filler components constituting the HS layer, aluminum hydroxide, magnesium hydroxide, antimony oxide, red phosphorus, zinc borate, zirconium-based, tin-based, and halogen-based flame retardants: tetrabromobisphenol A (TBA), hexabromocyclododecane, bis (tribromophenoxy) ethane, TBA epoxy oligomer, TBA carbonate oligomer, ethylenebistetrabromophthalimide, ethylenebispentabromodiphenyl, tribromophenylmaleimide, tetrabromopentaerythritol, tris (pentane (Bromobenzyl) isocyanurate, phosphoric acid-based flame retardant: trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, octyl diphenyl phosphate Tricresyl phosphate, cresyl phosphate, triphenyl phosphate, tris (chloroethyl) phosphate, tris (2-chloropropyl) phosphate, tris (2,3-dichloropropyl) phosphate, tris (2,3-dibromopropyl) phosphate, Tris (2,3-dibromochloropropyl) phosphate, bis (2,3-dibromopropyl), 2,3-dichloropropyl phosphate, bis (chloropropyl) monooctyl phosphate, guanidine phosphate and its derivatives, guanyl phosphate Urea and its derivatives, as well as sulfamic acid and its derivatives, alone or in combination.

Other fillers include polyamide waxes, silica fine particles, talc, calcium carbonate,
Organic pigments, inorganic pigments such as titanium oxide, carbon, and wax can be added as needed. Filler of HS layer (F)
Is in the range of 80 to 20% by weight. If F is more than 80% by weight, it will not adhere. If it is less than 20% by weight, the protrusion of the conductor will be large, and the HS layer itself will not be flame retardant. .

The HS tape of the present invention can be obtained by forming an AC layer on a film-like substrate using the above-mentioned materials, and then forming an HS layer. Each of the AC layer and the HS layer is formed by applying and drying an organic solvent solution or dispersion containing the above components. Coating can be achieved by a general coating method. For example, a bar coater, a die coater, a roll coater, a gravure method, a flow coater method, a reverse method, a spray method, etc. can be used.
It is preferable to apply the HS layer immediately after applying and drying the C layer (in-line method).

The coating amount of the AC layer is 0.05 to 10 μm in thickness.
m, preferably 0.1 to 5 μm.
If it is less than 0.05 μm, the conductor protrudes, and if it exceeds 10 μm, it exceeds the practical range, and in some cases, there is a problem in flame retardancy. The coating amount of the HS layer is 5 to 200 μm in thickness,
Preferably it is 10 to 100 μm. If it is less than 5 μm, it is difficult to bond the conductor, and there is a problem in flame retardancy. 2
If it exceeds 00 μm, a large amount of energy is required to evaporate the solvent during drying, which is not practical. The solid content of the solution for the AC layer is 2 to 60% by weight, and the solid content of the solution for the HS layer is 5%.
If it is less than the above range, the coating amount cannot be increased due to viscosity. On the other hand, if it exceeds the above range, it is difficult to disperse the filler in the solution.

The HS tape of the present invention is formed as described above. As shown in FIGS. 1a and 1b, an appropriate conductor B is sandwiched between two sheets of the HS tape A of the present invention, and the HS tapes are heat-sealed with each other through, for example, a hot roll (180 ° C.). A flame-retardant flat cable is obtained.

[0025]

Next, the present invention will be described more specifically with reference to examples and comparative examples. Examples 1 to 5 and Comparative Examples 1 to 4 (Material) Film-form base material: Biaxially stretched polyester film (PET) having a thickness of 25 μm −1 AC layer forming solution −1: (solid content 40% by weight) Solution A A polyester resin having a Tg of 40 ° C. and a polyol-based urethane resin (solids weight ratio 1: 1, hydroxyl value = 10 mg)
(KOH / g) in methyl ethyl ketone / toluene. Liquid B: TDI + HDI Liquid A / liquid B = 1/3 (OH group / NCO group, equivalent ratio)

-2 solution for forming AC layer-2, solution A; polyester having a Tg of 5 ° C (hydroxyl value = 3 mg KO)
H / g) in methyl ethyl ketone / toluene. B liquid: TDI + HDI A liquid / B liquid = 1: 4 (OH group / NCO group, equivalent ratio) HS layer forming paint: Polyester (V) having Tg of 10 to 20 ° C., silica, calcium carbonate, aluminum hydroxide, bromine-based In the filler (F) comprising a flame retardant and antimony trioxide, V / F = 45/55 (weight ratio), and a liquid dissolved and dispersed in a solvent of methyl ethyl ketone / toluene = 1/1 (solid content 45% by weight, average Particle size 0.45μ
m).

(Preparation of HS Tape) The above solution for forming an AC layer was applied to a PET film so as to have a dry weight of 0.5 g / m ^2, and air-dried for 5 minutes. Apply at ² to 80
Dry for 2 hours. Table 1 shows the content of the plasticizer and the crosslinking agent (polyfunctional compound) in the AC layer and the HS layer.

Test Method [Evaluation Items] HS / HS T-peel strength test: Heat-sealed surfaces of HS tapes were bonded with a heat sealer (temperature: 150).
C, pressure: 3 Kg / cm ² , time: 3 seconds), and T-peel strength (g / width 10 mm) is compared by a tensile test. HS / T-peel strength test between conductors: T-peel strength (g) between the heat-sealed surface of the HS tape and a copper foil having a thickness of 100 μm
/ Width 10 mm). Cable heat resistance test: conductor (width x thickness = 0.8 mm x 5
0 μm) were sandwiched between two HS tapes each having a width of 25 cm, and a flat cable was produced through a hot roll (180 ° C.). Cut this flat cable into 25cm,
Place in a dryer at 10 ° C. for 72 hours. Observe the extent of the conductor protruding from both ends of the flat cable with a microscope and compare the protruding length from the photograph. Table 1 shows the results.

[0029]

[Table 1]

From the results in Table 1 above, Comparative Examples 1 to 3
Is the result of the presence or absence of a plasticizer and a crosslinking agent, and there is a problem in adhesiveness or heat resistance. Comparative Example 4 is a comparison of the effect of the AC layer. The conventional product was not added with the cross-linking agent of Comparative Example 4. However, this had an adhesive property of the example, but was inferior in heat resistance (150 μm). degree). A crosslinking agent was added to increase the heat resistance, but the adhesiveness was reduced. This makes the crosslinking agent H
It is considered that the film-like base material and the AC delamination are affected by the addition to the S layer.

On the other hand, it can be seen from the examples that both the heat resistance (shrink resistance) and the adhesiveness are good by forming the AC layer of high TgPES and urethane resin. Although the reason is not clear, the heat resistance (heat shrinkage) of high TgPES
It is presumed that the improvement in the adhesion and the improvement in the adhesiveness between the film-like substrate and the AC layer by the urethane resin are related to the fact that the decrease in the adhesiveness is small even if a crosslinking agent is added to the HS layer.
The AC layer made of only high TgPES excluding the urethane resin has low adhesiveness as described above.

[0032]

According to the present invention as described above, a flame-retardant flat cable excellent in flame retardancy, heat resistance, durability and the like, and an HS tape can be provided.

[Brief description of the drawings]

FIG. 1 is a view for explaining the configuration and production of a flame-retardant flat cable and HS tape of the present invention.

[Explanation of symbols]

 1: Film substrate 2: AC layer 3: HS layer A: HS tape B: Conductor

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yaichiro Hori 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Kiyoshi Oguchi 1-chome, Ichigaya-cho, Shinjuku-ku, Tokyo No. 1 Dai Nippon Printing Co., Ltd. F term (reference) 5G311 CB01 CD03 5G315 CA03 CB02 CC08 CD01 CD08

Claims (11)

[Claims] 1. Two heat-sealable tapes (hereinafter, referred to as HS tapes) each comprising a film-like substrate, an anchor coat layer (hereinafter, referred to as an AC layer), and a heat-sealing layer (hereinafter, referred to as an HS layer). In a flat cable composed of a conductor sandwiched by heat sealing between two tapes, the AC layer has a polyfunctional compound having an isocyanate group, a blocked isocyanate group and / or a carbodiimide group, a glass transition temperature (hereinafter referred to as Tg). ) Is 20
80 to 20% by weight of a filler (hereinafter simply referred to as a filler) composed of a polyester resin and a polyurethane resin at a temperature of from 120 ° C to 120 ° C, and the HS layer is mainly composed of a flame retardant.
And a resin component 20 to 8 containing a polyester resin as a main component.
0% by weight, and an average molecular weight of 2,500 to 0.1 to 10 parts by weight based on 100 parts by weight of the polyester resin.
A flame-retardant flat cable containing from 10,000 to 10,000 polymeric plasticizers. 2. The flame-retardant flat cable according to claim 1, wherein the film-shaped base material is polyethylene terephthalate (hereinafter referred to as PET), polybutylene terephthalate and / or a polyamide film. 3. The flame-retardant flat cable according to claim 1, wherein the HS layer contains 0.05 to 5 parts by weight of the polyfunctional compound based on 100 parts by weight of the resin component in the HS layer. 4. The flame-retardant flat cable according to claim 1, wherein the polyfunctional compound has 2 to 6 isocyanate groups, blocked isocyanate groups and / or carbodiimide groups in the molecule. . 5. The flame-retardant flat cable according to claim 1, wherein the polymer plasticizer is a polyester polymer plasticizer. 6. The method according to claim 1, wherein the AC layer is a film-like substrate and / or H
The flame-retardant flat cable according to any one of claims 1 to 5, which penetrates into the S layer. 7. A film-like base material, comprising an AC layer and an HS layer, wherein the AC layer has a polyfunctional compound having an isocyanate group, a blocked isocyanate group and / or a carbodiimide group, and has a Tg of 20 ° C. to 120 ° C. The HS layer comprises a polyester resin and a polyurethane resin, and the HS layer comprises 80 to 20% by weight of a filler and 20 to 80% by weight of a resin component containing a polyester resin as a main component. .1 to 10
An HS tape comprising a weight part of a high molecular weight plasticizer having an average molecular weight of 2,500 to 10,000. 8. An AC layer having a thickness of 0.05 to 5 μm and HS
The HS according to claim 7, wherein the layer has a thickness of 5 to 200 m.
tape. 9. The method according to claim 1, wherein the AC layer comprises a film-like substrate and / or H
The HS tape according to claim 7, which has penetrated into the S layer. 10. A method for producing an HS tape comprising a film-like substrate, an AC layer and an HS layer, wherein the film-like substrate has a polyfunctional compound having an isocyanate group, a blocked isocyanate group and / or a carbodiimide group. And applying a solution containing a polyester resin and a polyurethane resin having a Tg of 20 to 120 ° C. to form an AC layer. Then, a filler of 80 to 20% by weight and a resin component mainly containing the polyester resin of 20 to 80% by weight And an average molecular weight of 2,500 to 10,000 based on 0.1 to 10 parts by weight based on 100 parts by weight of the polyester resin.
A method for producing an HS tape, comprising applying and drying a filler dispersion solution containing a polymer plasticizer of No. 00, and simultaneously or successively performing heat crosslinking. 11. A solution for forming an AC layer comprises a polyfunctional compound having an isocyanate group, a blocked isocyanate group and / or a carbodiimide group, and a Tg of from 20 to 12.
It is contained in an amount of 1 to 20 times the equivalent of the reactive group of the polyester resin component and the polyurethane resin component at 0 ° C., and has a solid content of 2
60% by weight, and a filler dispersion solution forming the HS layer is composed of 80 to 20% by weight of a filler and 20 to 80% by weight of a resin component mainly containing a polyester resin,
0.1 to 1 with respect to 100 parts by weight of the polyester resin
The method for producing an HS tape according to claim 10, comprising 0 part by weight of a polymer plasticizer having an average molecular weight of 2,500 to 10,000 and having a solid content of 5 to 75% by weight.