JP2001068904A - High frequency electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the degree of design freedom of a wiring base board by adopting a configuration for the base board such that an input/output electrode is provided at three or more positions of the base board having a couple of input/output system so as to provide the degree of freedom to a layout of electronic components. SOLUTION: One input/output terminal of a BPF(band pass filter) mounted on an upper side of the wiring base board 112 conduct to a land pattern 202, which is branched to input/output patterns 206, 208 via an input/output pattern 204 at a pattern branch point 221 and connected respectively to input/output electrodes 211, 213. The other terminal of the BPF is similarly branched and connected to input/output electrodes 212, 214. A pattern length between the pattern branch point 221 and the input/output electrodes 211, between the pattern branch point 221 and the input/output electrodes 213, between the pattern branch point 222 and the input/output electrodes 212, and between the pattern branch point 222 and the input/output electrodes 214 is designed to be (2n-1)/4 wavelength of center frequency of the BPF, where n is 1, 2, 3,....

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency electronic component such as a dielectric filter used for a wireless communication device such as a portable telephone or a relay amplifier.

[0002]

2. Description of the Related Art In recent years, in the field of wireless communication, miniaturization of devices has been rapidly promoted as typified by terminal devices such as mobile phones. Therefore, miniaturization and high performance of the electronic components constituting these components have become issues, and demands for electronic components having high mounting efficiency and high degree of freedom in mounting have been increasing in the design of wiring boards. FIG.
It is an external appearance perspective view of the conventional dielectric filter used for this kind of radio | wireless communication equipment etc. This dielectric filter includes a base substrate 302 made of a dielectric on which electronic component elements such as a dielectric coaxial resonator are mounted on an upper surface, and a base substrate 3 made of a dielectric.
It is composed of a metal cover 301 provided on the upper surface of 02 and an input / output electrode 303.

FIG. 10 is a bottom view of the base substrate 302 of the dielectric filter shown in FIG. An input / output electrode film-like input / output electrode 303 is formed on one end of the base substrate 302, and an output / input electrode film-like input / output electrode 303 is formed on the other end of the base substrate 302. I have. Each of the input / output electrodes 303 is formed on the upper and lower surfaces of the base substrate 302, and electrically connects the input / output electrodes 303 on the upper and lower surfaces through electrode films formed on the end surfaces of the base substrate 302. Further, ground electrodes 404 are formed on the upper and lower surfaces of the base substrate 302 other than the input / output electrodes 303, and the upper and lower surfaces are electrically connected via the electrode film 402 formed on the end surface and the through holes 401. Such a conventional dielectric filter is used by being surface-mounted on a wiring board, and includes a pattern of the wiring board and input / output electrodes 303 of the base substrate 302, and a ground pattern of the wiring board and the base board 3.
The ground electrode 404 of 02 is soldered and mounted on a wiring board. 403 is a through hole.

[0004]

However, in the prior art as described above, the position of the input / output electrode 303 formed on the base substrate 302 of the dielectric filter is not shown in FIG.
As shown in FIG. 7, the first and second substrates are formed to face each other in the lateral direction (the longitudinal direction of the base substrate 302). Such a positional relationship depends on the size of the electronic component elements mounted on the upper surface of the base substrate 302 and the positional relationship. That is, the base substrate
Since the input / output electrodes 303 formed on the 302 are uniquely determined, this is one restriction on the wiring board design, and deprives the freedom of arrangement on the wiring board. Further, the input / output electrode 303
In order to meet the demands for providing a substrate in an arbitrary direction, it is necessary to prepare a dedicated base substrate as needed, and there is a problem that a new cost and time are required to cope with the requirement.

Japanese Patent Laid-Open Publication No. Hei 10-28004 discloses a structure in which input terminals are provided using corners of a base substrate so that input / output terminals can be taken out either vertically or horizontally. Have been. But,
Also in this technique, the degree of freedom in arranging electronic component elements has not been solved at all.

The present invention has been made in view of such circumstances, and a purpose thereof is to provide a configuration in which input / output electrodes (terminals) are provided at three or more locations on a base substrate having a pair of input / output systems. Another object of the present invention is to provide a high-frequency electronic component capable of improving the degree of freedom in designing a wiring board by providing flexibility in the arrangement of electronic components.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a base substrate on which electronic circuit component elements are mounted, wherein one or both of an input pattern and an output pattern are stripped. The line is branched into a plurality of lines, and the branch electric length is (2n-1) of the used frequency wavelength.
/ 4 times (where n = 1, 2, 3,...)
This is a high-frequency electronic component comprising at least one input / output electrode. Thus, depending on the combination of the input / output electrode positions, it is possible to use the input / output lines in a plurality of patterns in a drawing arrangement, and the unused input / output pattern portions act as short-stubs of 1/4 wavelength at the operating frequency. Becomes very large and can be ignored as wiring.

That is, in the high-frequency electronic component according to the first aspect of the present invention, the terminal of the electronic component element mounted on one surface of the base substrate is connected to a predetermined portion of the input / output pattern wiring formed on the other surface of the base substrate. In the high-frequency electronic component connected to the position of the input / output pattern wiring and configured to be electrically connected to the wiring board, the input / output pattern wiring formed on the base substrate is the input side pattern wiring or the output side. At least one of the side pattern wirings is branched into two or more systems, and the ends of each branched input / output pattern wiring are formed as three or more input / output terminals on a base substrate, and the branched input / output pattern is formed. The electrical length to each input / output terminal of the wiring is (2
(n-1) / 4 times. However, it is assumed that n = 1, 2, 3,...

That is, for example, the input / output pattern wiring branches into two systems for each of the input-side pattern wiring and the output-side pattern wiring, and the terminals of the branched input-side pattern wiring are arranged at the front end and the left end of the base substrate. Then, the terminals of the branched output side pattern wiring are arranged at the front end and the right end of the base substrate. Of course, which is the input side pattern wiring,
Either may be the output side pattern wiring. By doing so, when this high-frequency electronic component is mounted on a wiring board, inputs and outputs can be taken out from any direction, so that the mounting layout of the wiring board and the wiring routing on the wiring board side are free, The degree of freedom in design is improved. Also, the electrical length of the input / output pattern wiring is (2n-1) / 4 times the operating frequency wavelength (where n = 1, 2, 3
..), Which does not affect the characteristics at the operating frequency, and has a frequency having a wavelength of (2n−1) / 4 times (where n = 1, 2, 3,...) The operating frequency wavelength. Since it has an attenuation characteristic, unnecessary waves can be suppressed.

Further, in the high-frequency electronic component according to the second aspect of the present invention, the terminals of the electronic component element mounted on one surface of the base substrate laminated in three or more layers are provided on any layer of the base substrate. A layer on which input / output pattern wiring is formed in a high-frequency electronic component connected to a predetermined position of the formed input / output pattern wiring and configured such that terminals of the input / output pattern wiring are electrically connected to a wiring board. Is laminated between the upper surface layer and the lower surface layer in at least one layer, and the input / output pattern wiring is branched into two or more systems in at least one of the input-side pattern wiring and the output-side pattern wiring, and Of the input / output pattern wiring of
The electrical length of each of the branched input / output pattern wirings formed at three or more input / output terminals on the base substrate to each of the input / output terminals is (2n-1) / 4 of the operating frequency wavelength.
It is characterized in that it is formed to be doubled. However, it is assumed that n = 1, 2, 3,...

That is, the present invention is obtained by laminating three or more base substrates, and the operation and effects are exactly the same as those of the first embodiment. However, in the case of the present invention, it is not necessary to make the wiring board in which the pattern corresponding to the mounting surface of the base board is removed as in the first invention, and it is possible to mount the wiring board without making any work. Since it is possible, the degree of freedom in design is further improved. Further, in the case of the present invention, the length of the branched input / output pattern does not depend on the conditions such as the dielectric constant and the substrate thickness of the wiring substrate on which the base substrate is mounted, and the substrate condition of the base substrate, that is, the dielectric constant, Only the interlayer thickness and strip line width are used,
It can be designed to have a length of / 4 wavelength. That is, the second
According to the invention, the degree of freedom of design on the wiring board side is further improved because the circuit board is not dependent on the conditions of the wiring board on which the base board is mounted.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an exploded view showing the entire configuration of a dielectric filter according to a first embodiment of the present invention. First, the first embodiment will be described with reference to FIG. In this embodiment, the dielectric filter is a five-stage bandpass filter (BPF). That is, quarter-wave type dielectric coaxial resonators 101 to 1
05 is tuned so as to resonate at a predetermined frequency, and a metal connection terminal 107 is provided in an inner conductor hole 106 forming an inner conductor of the dielectric coaxial resonators 101 to 105. It is press-fitted from the open end sides of 101 to 105 and is brought into contact with the inner conductor to conduct electricity.

The dielectric coaxial resonator 1 of the connection terminal 107
Portions protruding from 01 to 105 to the outside are connected to a coupling pattern 109 formed on a coupling substrate 108 for coupling the dielectric coaxial resonators 101 to 105 by soldering or the like. The coupling between the dielectric coaxial resonators 101 to 105 in this embodiment is capacitive coupling using a gap between the coupling patterns 109. Also, the bonding substrate 108
The column-shaped input / output pins 111 keep the distance from the base substrate 112 and the land patterns 114, 1 of the base substrate 112.
Electrical connection is made with through holes 116 and 117 having 15.
That is, the input / output pins 111 are
0 and the through holes 116 and 117 of the base substrate 112, and are connected and fixed by soldering or the like.

The upper surface of the base substrate 112 has portions other than the land patterns 114 and 115 and the through holes 116 and 117,
An earth electrode 113 is formed. The ground electrode 113 is formed on the electrode film 11 formed on the end face of the base substrate 112.
8, and through-hole 11 formed with ground electrode 113
Due to 9, it is electrically connected to the ground electrode on the lower surface of the base substrate 112. The cover 120 is fixed to the ground electrode 113 on the base substrate 11 by soldering or the like.

FIG. 2 is a bottom view of the base substrate 112 of the dielectric filter shown in FIG. Ground board 2 shown in shaded area
01 is electrically connected to the ground electrode 113 on the upper surface of the base substrate 112 by the electrode film 118 and the through hole 119 on the end face of the substrate. One end of the input / output of the BPF mounted on the upper surface of the base substrate 112 is electrically connected to the land pattern 202 on the lower surface of the base substrate 112 through the through hole 116. At a branch point 221, the input / output patterns 206 and 208 are branched. The input / output pattern 206 is connected to the input / output electrode 211 at the substrate end, and the input / output pattern 208 is connected to the input / output electrode 213 at the substrate end.
Each of them forms a connection terminal portion with the outside. Further, the other end of the input / output terminal of the BPF mounted on the upper surface of the base substrate 112 is electrically connected to the land pattern 203 on the lower surface of the base substrate 112 through the through hole 117. Through the input / output patterns 207 and 209 at a pattern branch point 222. The input / output pattern 207 is connected to the input / output electrode 212 at the end of the substrate, and the input / output pattern 209 is connected to the input / output electrode 214 at the end of the substrate, all of which form connection terminals with the outside.

Also, the input / output electrodes from the pattern branch point 221
Between 211, between the pattern branch point 221 and the input / output electrode 213, between the pattern branch point 222 and the input / output electrode 212, and between the pattern branch point 222 and the input / output electrode 214, the respective pattern lengths are: At the time of mounting the wiring board, it is designed so that the wavelength becomes １ ／ wavelength of the center frequency of the dielectric filter mounted on the upper surface of the base substrate 112.

Therefore, when the dielectric filter of this embodiment is mounted on a wiring board, for example, when one end of the input / output of the dielectric filter is used as the input / output electrode 211 and the other end is used as the input / output electrode 214, , Unused input / output electrodes 213.2
Connect 12 to the ground plane of the wiring board. At this time, the unused input / output pattern portion, that is, the pattern branch point 221 is used.
From the pattern branch point 222 to the input / output electrode 212 via the input / output pattern 207 because of the function as a 波長 wavelength short stub at the used frequency. It becomes very large and can be ignored as wiring. Also, at twice, four times,... The used frequency, n / 2 wavelengths (n = 1, 2,
3) can act as short stubs, thereby attenuating twice, four times, etc. frequency components.

When the dielectric filter of this embodiment is mounted on a wiring board, when it is desired to draw input / output lines from the same direction, a combination of input / output electrodes 211 and 212 is used.
When it is desired to pull out from the opposite direction, the input / output electrode 21
When it is desired to use a combination of 3,214 and draw out the input and output so as to change the direction by 90 degrees, the input and output electrodes 211 and 21
A combination of four or a combination of input / output electrodes 212 and 213 may be used. In this manner, a single type of base substrate can meet a plurality of mounting layout requirements.

Next, a second embodiment of the present invention will be described. FIG. 5 is a side view of a base substrate 701 applied to the second embodiment of the present invention. It is assumed that the dielectric filter described in the first embodiment is mounted on the upper surface of the base substrate 701. The base substrate 701 is a three-layer substrate including an A layer 702 on the upper surface of the base substrate, a B layer 704 on the lower surface of the base substrate, and a C layer 703 as the middle layer of the base substrate. The electrode film 705 on the end face of the substrate conducts between the A layer 702 and the B layer 704, and conducts between the A layer 702, the B layer 704, and the C layer 703 in the input / output terminal portion.

FIG. 6 is a pattern diagram of each layer of the base substrate 701 shown in FIG.
(A) is an A layer 702, (b) is a C layer 703, and (c) is a B layer 704.
FIG. 6A, the base substrate A layer 702
Are the land patterns 801,
802, input / output electrodes 803, 804, 805, 806 of base substrate 701, ground electrode 807, electrode film 80 on the end face of the substrate for conducting with other layers
8. It comprises through holes 809 and 810 which are electrically connected to the C layer 703.

The base substrate C layer 703 of FIG. 6B connects the input / output terminal at one end of the dielectric filter mounted on the base substrate from the A layer 702 to the land pattern 821 via the through hole 809. . Then, the land pattern 821 branches to the input / output patterns 825 and 827 at the pattern branch point 829 via the input / output pattern 823. The input / output pattern 825 is connected to the input / output electrode 803 at the substrate end, and the input / output pattern 827 is connected to the input / output electrode 805 at the substrate end, and both are connected as electrode films on the substrate end surface. Further, the input / output terminal at the other end of the dielectric filter mounted on the base substrate is conducted from the A layer 702 to the land pattern 822 via the through hole 810. Thus, the land pattern 822 branches to the input / output patterns 826 and 828 at the pattern branch point 830 via the input / output pattern 824. The input / output pattern 826 is connected to the input / output electrode 804 at the end of the board, and the input / output pattern 828 is
Are connected to input / output electrodes 806 at the substrate end, and both are connected as electrode films at the substrate end surface.

The B layer 704 in FIG. 6C includes a through hole 811 that is electrically connected to the ground electrode 807 of the A layer 702, and a ground electrode 831.
And input / output electrodes 803, 804, 805, and 806. These electrodes are electrically connected to the electrodes of the A layer 702 and the C layer 703 at the end face of the substrate. With the base substrate 701 having such a configuration, the portion between the pattern branch point 829 and the input / output electrode 803, the portion between the pattern branch point 829 and the input / output electrode 805, and the pattern branch point 830
Between the input / output electrode 804 and the pattern branch point 830 to the input / output electrode 806,
A strip line is formed between the ground electrode 807 of the A layer 702 and the ground electrode 831 of the B layer 704. Therefore, the length of the branched input / output pattern depends on the substrate conditions of the base substrate 701, that is, the dielectric constant, the interlayer thickness, regardless of the conditions such as the dielectric constant and the substrate thickness of the wiring substrate on which the base substrate 701 is mounted. Only the strip line width can be designed to have a length of 1/4 wavelength of the working frequency. That is, according to the second embodiment, the degree of freedom of design on the wiring board side is further improved because it is not dependent on the condition of the wiring board on which the base board is mounted.

FIG. 7 is a diagram showing an example of a layout of mounting the high-frequency electronic component of the present invention on a wiring board. The electronic components according to the first and second embodiments can be mounted as shown in FIG. That is, the wiring board 910
Has an earth pattern 913, an input pattern 911, and an output pattern 912. However, in the case of the base substrate form as in the first embodiment, the mounting surface of the base substrate 901 uses a branch pattern on the lower surface of the base substrate at the time of mounting, such as removing a pattern except for a portion to which the solder 914 is attached. It is necessary that the condition be determined in advance so that the wavelength becomes １ ／ wavelength. In the example of this figure, a base substrate 901 covered with a cover 902 is laid out at a corner of a wiring substrate 910. At this time, the input and output of the base substrate 901 may be performed using a combination of the input and output electrodes 903 and 906, and the other input and output electrodes 904 and 905 may be soldered to the ground pattern 913 of the wiring board together with the electrodes on the other end surfaces of the base substrate. Only.

FIG. 3 is an equivalent circuit of a dielectric filter using the base substrate of the first embodiment and the second embodiment. That is, dielectric coaxial resonators 501 to 505, coupling capacitances between resonators 507 to 510, input / output matching capacitors 506 and 511,
Input / output pattern model 521 for 1/4 wavelength input / output line
This is a five-stage bandpass filter having 522, 523, and 524. I / O pattern model 52
1,524 are used, and the input / output pattern models 522,523 of the input / output lines that are not actually used are shown as being used as ground terminals.

FIG. 4 is a comparison characteristic diagram between a dielectric filter using the base substrate of the present invention and a conventional dielectric filter using the base substrate. The horizontal axis represents the frequency (MHz), the left vertical axis represents the transmission characteristic (dB) of the filter, and the right vertical axis represents the reflection characteristic (dB) of the filter. The basic characteristics of the filter are center frequency 947.5MHz, bandwidth 25MHz,
It has an attenuation characteristic of 35 dB or more at a center frequency of ± 32.5 MHz. In the figure, the transmission characteristic of the conventional dielectric filter is 602 and the reflection characteristic is 604, and the transmission characteristic of the dielectric filter to which the present invention is applied is 601 and the reflection characteristic is 603.

From this characteristic diagram, it can be seen that there is no change in the characteristics near the pass band and in the main attenuation region even when the input / output configuration of the present invention is used. Also, the number of input / output patterns not used as input / output lines is almost twice the center frequency (1895
It can be seen that it acts as a short stub of 波長 wavelength (around MHz) and suppresses unnecessary waves near double frequency.

As described above, according to the base substrate of the present invention, a plurality of branched input / output lines (input / output patterns) are formed at a quarter wavelength of the working frequency,
Although the effect as shown in FIG. 4 was obtained, the same effect can be obtained even if the input / output line length is 3/4 wavelength, 5/4 wavelength... In other words, it is clear that the same effect can be obtained by setting the (2n-1) / 4 wavelength so that the input / output line length does not affect the operating frequency. However, n = 1, 2, 3,...
And In the first and second embodiments described above, both ends of the input and output are divided into two, but the number of branches per one end can be set freely.

FIG. 8 is a pattern diagram showing an example of a base substrate of the present invention having one branch at one end. When the layer corresponding to the C layer of the second embodiment is the C layer 1001, the through holes 1002 and 1003 that are electrically connected to the input and output of the A layer on the upper surface of the base substrate are electrically connected to the land patterns 1004 and 1005. . The input / output pattern extracted from the land pattern 1004 is branched into three at a pattern branch point 1010 and connected to input / output electrodes 1006, 1007, and 1008 on the end face of the substrate. The land pattern 1005 at the other end is connected to the input / output electrode 1009 on the end face of the substrate. In this way, three branches can be formed at one end. The condition of the electrical length of the branched input / output pattern is designed in the same manner as in the second embodiment.

The embodiment described above is an example for describing the present invention, and the present invention is not limited to the above embodiment, and various modifications are possible within the scope of the invention. is there. For example, FIG. 8 shows the pattern on the surface corresponding to the layer C of the second embodiment, but it is apparent that the configuration can be realized also by the configuration having the input / output pattern on the lower surface as in the first embodiment. It is easy to imagine that both the input and output sides can have an arbitrary number of branches.
Furthermore, in the above-described first and second embodiments, a five-stage band-pass filter using a dielectric coaxial resonator has been described as an example. However, the number of resonator stages is not limited. The present invention can be applied not only to the dielectric filter but also to various electronic circuits having a base substrate having input / output terminals.

[0030]

As described above, in the high-frequency electronic component of the present invention, for example, a high-frequency electronic component element is mounted on the upper surface, and input / output terminals are formed on the base substrate at the lower end. The base substrate is configured to be soldered to a wiring substrate via input / output terminals. In addition, since the input / output terminals are provided at a plurality of locations, a single type of base board can cope with a plurality of input / output lead-out directions. It is possible to improve the degree of freedom in designing such as routing. Furthermore, by providing an inner layer on the base substrate, forming an input / output pattern branched to this inner layer, and providing input / output at a plurality of locations, without limiting the board condition of the wiring board as a mounting partner. ,
Can be implemented freely.

Further, there is no need to prepare a plurality of base substrates having different input / output terminal directions, and there is an advantage in terms of parts management and manufacturing cost. In addition, since the input / output terminals not used as input / output have an electrical length of (2n-1) / 4 times (where n = 1, 2, 3,...) The used frequency wavelength, It does not affect the properties. That is, (2n-1) / 4 times the operating frequency wavelength (where n =
..) Have an attenuation characteristic at frequencies having wavelengths of 1, 2, 3...

[Brief description of the drawings]

FIG. 1 is an exploded view showing an entire configuration of a dielectric filter according to a first embodiment of the present invention.

FIG. 2 is a bottom view of a base substrate 112 of the dielectric filter shown in FIG.

FIG. 3 is an equivalent circuit of a dielectric filter using the base substrate according to the embodiment of the present invention.

FIG. 4 is a comparison characteristic diagram between a dielectric filter using a base substrate of the present invention and a dielectric filter using a conventional base substrate.

FIG. 5 is a side view of a base substrate 701 applied to a second embodiment of the present invention.

6A and 6B are pattern diagrams in which each layer of the base substrate 701 shown in FIG. 5 is viewed from the lower surface direction of the base substrate.
2, (b) is a pattern diagram of the C layer 703, and (c) is a pattern diagram of the B layer 704.

FIG. 7 is a diagram showing an example of a mounting layout of the high-frequency electronic component of the present invention on a wiring board.

FIG. 8 is a pattern diagram showing an example of a base substrate of the present invention having three branches at one end.

FIG. 9 is an external perspective view of a conventional dielectric filter.

FIG. 10 shows a base substrate 302 of the dielectric filter shown in FIG.
FIG.

[Explanation of symbols]

101-105 Dielectric coaxial resonator 106 Conductor hole in dielectric coaxial resonator 107 Connection terminal 108 Coupling board 109 Coupling pattern 110 Coupling board hole 111 I / O pin 112,701,901 Base board 113,201,807,831 Earth electrode 114,115,202,203,801,802,821,822,1004,1005 Land pattern 116,117,119,809,810,811,1002 , 1003 Through hole 118,705,808 Electrode film on substrate end face 120,902 Cover 204 ~ 209,823 ~ 828 Input / output pattern 211 ~ 214,803 ~ 806,903 ~ 906,1006 ~ 1009 Input / output electrode 221,222,829,830,1010 Pattern branch point 501 ~ 505 Dielectric coaxial resonator model 506 ~ 511 Coupling capacitance 521 ~ 524 Input / output pattern model 702 Base board A layer 703 Base board C layer 704 Base board B layer 910 Wiring board 911 Wiring board input line 912 Wiring board output line 913 Wiring board ground pattern 914 Solder 1001 Base board C layer

Claims (2)

[Claims] 1. A terminal of an electronic component element mounted on one surface of a base substrate is connected to a predetermined position of an input / output pattern wiring formed on the other surface of the base substrate. In the high-frequency electronic component configured to be electrically connected to a wiring board, the input / output pattern wiring formed on the base substrate is branched into at least one of an input-side pattern wiring and an output-side pattern wiring into two or more systems. The ends of each of the branched input / output pattern wirings are formed as three or more input / output terminals on the base substrate. The electrical length of the branched input / output pattern wiring to each of the input / output terminals is A high-frequency electronic component formed to be (2n-1) / 4 times the operating frequency wavelength. However,
It is assumed that n = 1, 2, 3,... 2. A terminal of an electronic component element mounted on one surface of a base substrate laminated on three or more layers is connected to a predetermined position of an input / output pattern wiring formed on any layer of the base substrate. In the high-frequency electronic component configured such that the terminal of the input / output pattern wiring is electrically connected to a wiring board, the layer on which the input / output pattern wiring is formed is disposed between an upper surface layer and a lower surface layer. The input / output pattern wiring is stacked in at least one layer, and the input / output pattern wiring is branched into at least one of an input-side pattern wiring and an output-side pattern wiring into two or more systems. The electrical length of each of the branched input / output pattern wirings formed on the substrate as three or more input / output terminals to each of the input / output terminals is (2n-1) / operating frequency wavelength. High-frequency use electronic parts which is characterized in that it is formed so as to be doubled. However,
It is assumed that n = 1, 2, 3,...