JP2000502238A - Method of manufacturing contacts suitable for flip chip assembly of electrical components - Google Patents

Abstract

(57) [Summary] In a method of manufacturing a contact suitable for a flip chip assembly of a SAW element, a conductive structure (3) provided on a substrate (1) is sealed by a cover (2). Is formed, a brazeable film (4) is formed which contacts the pads of the conductive structure (3).

Description

DETAILED DESCRIPTION OF THE INVENTION       Method of manufacturing contacts suitable for flip chip assembly of electrical components   The invention provides a flip-chip assembly of an electrical component according to the preamble of claim 1. The present invention relates to a method for producing a contact suitable for a lead.   In the earlier German patent application P4445411.9, the component structure on the substrate is encapsulated. A sealing structure for an electronic component with a cap is described. The cap is formed by a cover provided on the substrate, and this cover It has a space to store it in the construction area. Such a sealed structure is a part Protects the structure from surrounding influences, so that the electronic components thus sealed have different It can be further used directly without using a vessel.   As the miniaturization progresses, the required container volume is minimum and the structural height is low. Goods are required. Such requests can be made, for example, by telephone cards or credit cards. Imposed when electronic components are applied to chip cards such as cards. Doi ahead A component with a sealing structure according to the patent application meets these requirements optimally. In particular, This is the case when the components are implemented in a configuration suitable for flip chip assembly. is there.   Conventionally, components suitable for flip chip assembly are containers, especially ceramic containers Mounted inside. In this case, the bumps (bars) should be Must be provided with a selectively brazeable membrane with Is necessary, and this step is particularly necessary for a surface acoustic wave (SAW) element. Very high potential for short circuit due to overlapping planar finger structures There is a problem.   An object of the present invention is to provide a flip chip assembly without damaging the component structure. To provide a method capable of producing a brazeable membrane for suitable contact is there.   This object is achieved in a method of the type mentioned at the beginning according to the invention by the features of claim 1. It is solved by the characteristics of the sign.   A further configuration of the present invention is the subject matter of claim 2.   Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.   FIG. 1 shows a schematic diagram of a surface acoustic wave (SAW) component manufactured by the method of the present invention. FIG. 2 shows a partial schematic plan view of the component of FIG.   In FIG. 1, a SAW component generally includes a piezoelectric substrate 1 and a conductive structure provided thereon. 3 which is, for example, the connection of an interdigital converter, a resonator or a reflector. Tactile fingers can be targeted. As noted in the earlier German patent application As shown, the conductive structure 3 is covered by the cap 2 Protects the structure from environmental influences and the parts are directly It can be used further.   According to the invention, the flip-chip assembly for the electrical contact of the conductive structure 3 is provided. Making contact suitable for Lee is performed. As can be seen schematically from FIG. 2 is provided with a window 6 through which terminals (not shown) of the conductive structure 3 are provided. A brazingable film 4 is provided which is in contact with a connection surface, a so-called pad. Brazing possible In this case, the transparent film 4 also rests on the part of the cover 2 as is evident from FIG. You. The film 4 capable of being soldered is, for example, a chromium / chromium copper / copper / gold film. It can be.   According to one embodiment of the present invention, to form a brazeable membrane, first a brazeable A film made of a substance is deposited on the entire surface, that is, on the entire cover 2, and this film is then Structured individual brazeable membranes 4, each in contact with a pad of conductive structure 3, Occurs.   According to another embodiment, the electrically solderable membrane 4 also has a dimensioning mechanism. It can also be deposited through a mask.   After making the brazeable membrane 4, the window 6 will come into contact with the brazeable membrane 4. Bump 7 is inserted and brazed to the membrane 4. Parts are electrically connected via the bumps 7 Can be mounted on circuits.   In the method according to the invention, the solderable film 4 and the bumps 7 make the component structure environmentally friendly. With the advantage that it is made only after attaching the cover 2 that protects from the effects I have. Therefore, the component structure is affected by the process of making brazing films and bumps. No longer damaged by sound. Yet another advantage is the brazeable membrane Is made in a large area, and its dimensions are therefore relative to that of the pad (not shown). The point is that it can be enlarged.   In order to avoid structuring of the film 4 deposited over the entire surface, the window 6 of the cover 2 , It functions as a mask for the conductive film 4 and at the same time is deposited on its edges It can be formed not to be.

────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventors Steltzl, Alois             Germany Day-81549 Mün             Hen Traunsteinstrasse             33 (72) Kruger, Hans, inventor             Germany Day-81737 Mün             Hen Pera Strasse 13

Claims (1)

[Claims] 1. The conductive structure (3) provided on the substrate (1) is formed by a cap-shaped cover (2). --Electrical components that are sealed against environmental influences, especially those that operate with acoustic surface waves To produce contacts suitable for flip-chip assembly of products (SAW devices) After the cover (2) is made, the cover (2) is passed through the window (6). To form a solderable film (4) in contact with the terminal connection surface (pad) of the conductive structure (3). A connection suitable for flip-chip assembly of electrical components characterized by being formed Manufacturing method of touch. 2. First, a film made of a brazeable material is deposited over the entire surface, and a Barrel films are solderable individual films (in each case in contact with the pads of the conductive structure (3)) Method according to claim 1, characterized in that structure (4) is effected. 3. 2. The method according to claim 1, wherein the conductive film is deposited through a mask. The described method. 4. The size of the conductive film (4) is larger than the size of the pad of the conductive structure (3). The method according to any one of claims 1 to 3, wherein: 5. A bump (7) is formed in the window of the cover (2) in contact with the film (4) that can be soldered. The method according to claim 1, wherein the method is performed. 6. A conductive film (4) is deposited over the entire surface, with the cover (2) being electrically conductive. The film deposited on the conductive film (4) is electrically non-conductive with the film deposited on the cover (2). 4. The method according to claim 1, wherein the mask is used as connected to a mask. A method according to any one of the preceding claims.