JP2000326486A - Ic card surface treating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To treat a printing surface of an IC card so as not to generate cutting unevenness or a cutting pattern in a rotating direction of a roll. SOLUTION: The IC card surface treating apparatus comprises a conveyor 2 for placing an IC card 1 to continuously convey the card 1, a blasting mechanism 3 for blasting abrasives 7 to a surface of the conveyed card 1 to polish a satin-like surface, a liquid cleaning agent injecting mechanism 4 for cleaning the polished card 1 with a liquid cleaning agent 9, and a gas injecting mechanism 5 for drying the cleaned card 1 with warm air 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card used for an identification card, a cash card, a prepaid card, etc., and more particularly to a modification of a printing surface for printing a photograph, a picture, a character, etc. on the surface of the IC card. The present invention relates to a surface treatment apparatus for removing a print of a quality or a printed surface.

[0002]

2. Description of the Related Art There are contact type or non-contact type IC cards, and these IC cards have high security and large storage capacity, and thus have been widely used for identification cards, cash cards, prepaid cards and the like. Used.

[0003] This IC card incorporates expensive components such as IC chips, terminals, and antenna coils, so that the manufacturing cost is high, and if a defective product occurs, a large loss occurs. The causes of this defective product include, when printing photographs, pictures, characters, etc. on the surface of the IC card, the surface condition of the printing surface, insufficient ink fixing power due to surface contamination, unevenness, and the like.
Or, misalignment of printing, misalignment of colors, stain on a plate, and the like can be mentioned. Conventionally, when such a defect occurs, a method in which a roll having a polishing layer on its surface is pressed against a printing surface and rotated to scrape off the printing surface and reuse the roll is used.

[0004]

However, in the above-mentioned conventional IC card, when a printing failure occurs,
By adopting the method of shaving off the printing surface with a roll, shaving unevenness and shaving pattern in the direction of roll rotation occur on the shaved surface, so when printing again on that surface, the shaving pattern occurs and the shaving There is a problem that the contact pressure changes due to the reduced thickness.

The present invention has been made in view of the above problems, and has as its object to provide an IC card surface treatment apparatus capable of performing a surface treatment without shaving unevenness or a shaving pattern in the roll rotation direction on the IC card surface. .

[0006]

In order to achieve the above object, the invention according to claim 1 of the present invention is directed to an IC card surface treatment apparatus, comprising: transport means for continuously moving an IC card; Surface polishing means, a means for cleaning a surface-treated IC card, and a means for drying the cleaned IC card.

According to the first aspect, the surface treatment means uses an IC.
By polishing the surface of the card, it becomes possible to make the surface matte or to remove the poorly printed surface.
Further, the IC card after the surface treatment is continuously transported by the transporting means to be washed and dried.

According to a second aspect of the present invention, the conveying means comprises a belt conveyor.

According to the second aspect of the present invention, since the conveying means is constituted by a belt conveyor, the surface treatment can be performed while the IC card is placed on the upper surface of the belt and continuously moved.

[0010] In a third aspect of the present invention, the surface treatment means comprises an I
It is characterized by comprising an abrasive blast mechanism for polishing the surface of the C card.

According to the third aspect of the present invention, the abrasive blasting mechanism causes the abrasive particles to collide with the surface of the workpiece at a high speed. The surface can be uniformly removed regardless of the thickness and the like. In addition, by appropriately selecting the material of the abrasive and the size, shape, or collision speed of the particles, the processing time can be controlled, and the processing surface can be made into a matte surface suitable for printing. Becomes As a result, the surface treatment can be performed even after the IC card is created or after the printing process, so that the printed surface has no shaved pattern. Therefore, the matte treatment of the surface by the conventional press working is not required.

The invention according to a fourth aspect is characterized in that the cleaning means comprises a liquid cleaning agent spraying mechanism for cleaning the surface of the IC card with a liquid cleaning agent.

According to the fourth aspect, it is possible to clean the abrasive and the polishing debris attached to the surface of the IC card by the surface treatment with the liquid cleaning agent sprayed by the cleaning means.

The invention according to claim 5 is characterized in that the drying means comprises a gas injection mechanism for drying the surface of the IC card with gas.

According to the fifth aspect, the liquid adhering to the surface due to the cleaning is blown off by the gas ejected from the gas ejecting mechanism, so that the IC card can be dried.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a conceptual diagram of an IC card surface treatment apparatus showing an embodiment of the present invention.

An IC card surface treatment apparatus according to the present invention comprises:
A belt conveyor 2 which is a conveying means for mounting and continuously conveying the IC card 1, and a surface treatment means continuously provided in the process order facing the upper surface of the IC card 1 moved by the belt conveyor 2. A blasting mechanism 3 for a certain abrasive, a liquid cleaning agent ejecting mechanism 4 as a means for cleaning the IC card 1 surface-treated by the blasting mechanism 3, and a drying means for the IC card 1 cleaned by the ejecting mechanism 4. And a gas injection mechanism 5.

The transport means can place the IC card 1 and continuously transport it. For example, a belt conveyor 2 is generally used.

The blast mechanism 3 causes the abrasive particles to collide with the surface of the transferred IC card 1 on the belt conveyor from the ejection unit 6 at a high-speed ejection 7 so that the IC card 1 The surface of the paper is processed into a satin finish suitable for printing. In the blasting mechanism 3, the material of the abrasive and the size and shape of the particles can be appropriately selected and used in accordance with the printing situation.

The blast mechanism 3 includes a drive blast method in which a gas is passed through the abrasive, and a wet blast method in which a gas and a liquid are passed through the abrasive in two phases. The surface treatment may be performed by using any method. In the case of the wet blast method, since a liquid is used, processing heat and static electricity generated on the surface of the IC card 1 by polishing are removed by the liquid, and the liquid becomes a buffer between the abrasive and the surface of the IC card 1. As a result, the abrasive is prevented from being embedded in the surface of the IC card 1. Therefore, it is preferable to employ a wet blast method.

Further, the cleaning means 4 is provided with a liquid cleaning agent.
It comprises a liquid cleaning agent spraying section 8 for cleaning the surface of the C card 1. IC card 1 by surface treatment with blast mechanism 3
Injection unit 8 of cleaning means for removing abrasives and polishing debris attached to the surface
Cleaning is performed by the action of the liquid cleaning agent 9 ejected from the nozzle.

The drying means 5 comprises a gas injection unit 10 for drying the surface of the IC card 1 with gas. The liquid adhering to the surface due to the cleaning is blown off by the gas ejected from the gas ejecting unit 10 to dry the IC card 1.

Next, the processing of the surface of the IC card 1 by the IC card surface processing apparatus having the above configuration will be described.

First, an IC card 1 such as an identification card, a cash card, a prepaid card, or the like in which expensive components such as an IC chip, a terminal, and an antenna coil are built is manufactured by a manufacturing device (not shown).

This IC card 1 is, as shown in FIG.
It is placed on the upper surface of the traveling belt conveyor 2 with the processing surface facing upward, and is continuously conveyed from the carry-in port A to the carry-out port B of the apparatus.

The IC card 1 carried by the belt conveyor 2 from the transfer port A into the surface treatment device is supplied as a liquid and gas from the jetting unit 6 provided in the blast mechanism 3 which is a surface treatment means as a first step. Abrasive is sprayed at high speed together with 7
Is done. By the high-speed jetting 7, the abrasive is jetted at a high speed for a predetermined time, and the surface is processed into a predetermined matte finish. The processing time in this case is set according to the shape and size of the abrasive 7.

The surface-treated IC card 1 is automatically conveyed by a belt conveyor 2 into a liquid cleaning agent jetting mechanism 4 which is a cleaning means, and jetted from an jetting section 8 provided in the jetting mechanism 4. Abrasives and swarf adhering to the surface of the IC card 1 are removed by a liquid detergent such as hot water 9 or the like.

The IC card 1 whose surface has been cleaned is conveyed by a belt conveyor 2 into a gas injection mechanism 5 as drying means. After being dried by a gas injected from an injection unit 10 provided in the gas injection mechanism 5, for example, hot air 11,
The sheet is conveyed and discharged from the discharge port B, and the surface treatment is completed.

By thus reducing the series of steps, it is possible to treat the surface before printing into a satin finish suitable for fixing the ink for printing photographs, pictures, characters, and the like. Then, it is possible to similarly delete the printing surface when a printing failure occurs, and to reprocess the printing surface in a satin state.

[0031]

According to the present invention, the surface is uniformly deleted regardless of the transport direction, the surface shape, the thickness, etc. of the IC card and the matte surface having a roughness suitable for printing is processed. Can be. This surface treatment can be applied not only to the matte finish on the surface of the IC card before printing, but also to the matte finish on the post-printed surface in the case of printing failure by removing the printed surface in the same way. Becomes

By appropriately selecting the size, shape, collision speed, and the like of the abrasive, the processing time and the roughness of the processed surface can be manipulated, and the processing time can be set in advance. This eliminates the need for the conventional matting of the surface by press working, so that the machined surface has no shaving pattern.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of an IC card surface treatment apparatus showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC card 2 ... Belt conveyor 3 ... Blast mechanism 4 ... Liquid cleaning agent injection mechanism 5 ... Gas injection mechanism A ... Carrying in B ... Carrying out

Claims (5)

[Claims] 1. A transporting means for continuously moving an IC card, a surface treating means for polishing a surface of the transported IC card, a cleaning means for a surface-treated IC card, and a drying of the cleaned IC card. Means for treating an IC card surface. 2. The IC card surface treatment device according to claim 1, wherein said conveying means comprises a belt conveyor. 3. The IC card surface treatment apparatus according to claim 1, wherein said surface treatment means comprises an abrasive blast mechanism for polishing the surface of the IC card. 4. The cleaning means according to claim 1, wherein said cleaning means comprises a liquid cleaning agent.
2. The IC card surface treatment device according to claim 1, further comprising a liquid cleaning agent spraying mechanism for cleaning the surface of the C card. 5. The drying means injects a gas to produce the I
2. The IC card surface treatment apparatus according to claim 1, further comprising a gas injection mechanism for drying a surface of the C card.