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JP2000319442A5 - - Google Patents

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Publication number
JP2000319442A5
JP2000319442A5 JP1999132755A JP13275599A JP2000319442A5 JP 2000319442 A5 JP2000319442 A5 JP 2000319442A5 JP 1999132755 A JP1999132755 A JP 1999132755A JP 13275599 A JP13275599 A JP 13275599A JP 2000319442 A5 JP2000319442 A5 JP 2000319442A5
Authority
JP
Japan
Prior art keywords
insulating material
laminated
porous
porous insulating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999132755A
Other languages
Japanese (ja)
Other versions
JP4110669B2 (en
JP2000319442A (en
Filing date
Publication date
Priority claimed from JP13275599A external-priority patent/JP4110669B2/en
Priority to JP13275599A priority Critical patent/JP4110669B2/en
Application filed filed Critical
Priority to US09/539,929 priority patent/US20030129379A1/en
Publication of JP2000319442A publication Critical patent/JP2000319442A/en
Priority to US10/784,982 priority patent/US20040241419A1/en
Priority to US10/785,413 priority patent/US7303811B2/en
Publication of JP2000319442A5 publication Critical patent/JP2000319442A5/ja
Priority to US11/516,045 priority patent/US7311966B2/en
Priority to US11/802,557 priority patent/US20070275222A1/en
Publication of JP4110669B2 publication Critical patent/JP4110669B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (7)

微細な連続孔を有する多孔質構造を持ち、空孔率が１５−８０％である高耐熱性樹脂フィルムからなる多孔質絶縁材料。A porous insulating material comprising a highly heat-resistant resin film having a porous structure having fine continuous pores and a porosity of 15 to 80%. 誘電率が２．５以下である請求項１に記載の多孔質絶縁材料。The porous insulating material according to claim 1, wherein the dielectric constant is 2.5 or less. 高耐熱性樹脂フィルムがポリイミドフィルムである請求項１に記載の多孔質絶縁材料。The porous insulating material according to claim 1, wherein the high heat resistant resin film is a polyimide film. 請求項１に記載の多孔質絶縁材料の片面あるいは両面に耐熱性の接着剤層を積層し、さらにその上に保護フィルムを設けた積層体。The laminated body which laminated | stacked the heat resistant adhesive bond layer on the one side or both surfaces of the porous insulating material of Claim 1, and also provided the protective film on it. 請求項１に記載の多孔質絶縁材料の片面あるいは両面に直接あるいは耐熱性の接着剤層を介して電子回路用の導電性金属層を積層した積層体。The laminated body which laminated | stacked the electroconductive metal layer for electronic circuits on the one or both surfaces of the porous insulating material of Claim 1 directly or through the heat-resistant adhesive layer. 電子回路用の導電性金属箔の片面に多孔質化したポリイミド前駆体多孔質フィルムを重ね合わせた後、加熱乾燥してイミド化を完了させることによって得られるものである請求項５に記載の積層体。The lamination according to claim 5, which is obtained by superimposing a porous polyimide precursor porous film on one side of a conductive metal foil for an electronic circuit and then heating and drying to complete imidization. body. 請求項１に記載の多孔質絶縁材料の片面に無機あるいは金属基板を他の面に導電性金属層をそれぞれ耐熱性の接着剤層を介して積層した積層体。A laminate in which an inorganic or metal substrate is laminated on one side of the porous insulating material according to claim 1 and a conductive metal layer is laminated on the other side via a heat-resistant adhesive layer.
JP13275599A 1999-04-23 1999-05-13 Porous insulating material and laminate thereof Expired - Fee Related JP4110669B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP13275599A JP4110669B2 (en) 1999-05-13 1999-05-13 Porous insulating material and laminate thereof
US09/539,929 US20030129379A1 (en) 1999-04-23 2000-03-31 Porous insulating film and its laminates
US10/784,982 US20040241419A1 (en) 1999-04-23 2004-02-25 Porous insulating film and its laminates
US10/785,413 US7303811B2 (en) 1999-04-23 2004-02-25 Porous insulating film and its laminates
US11/516,045 US7311966B2 (en) 1999-04-23 2006-09-06 Porous insulating film and its laminates
US11/802,557 US20070275222A1 (en) 1999-04-23 2007-05-23 Porous insulating film and its laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13275599A JP4110669B2 (en) 1999-05-13 1999-05-13 Porous insulating material and laminate thereof

Publications (3)

Publication Number Publication Date
JP2000319442A JP2000319442A (en) 2000-11-21
JP2000319442A5 true JP2000319442A5 (en) 2005-09-15
JP4110669B2 JP4110669B2 (en) 2008-07-02

Family

ID=15088808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13275599A Expired - Fee Related JP4110669B2 (en) 1999-04-23 1999-05-13 Porous insulating material and laminate thereof

Country Status (1)

Country Link
JP (1) JP4110669B2 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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JPH0637042U (en) * 1992-10-22 1994-05-17 三井造船株式会社 Rear skirt structure of air cushion boat
JP4557376B2 (en) * 2000-06-19 2010-10-06 日東電工株式会社 Method for producing porous body and porous body
JP4557409B2 (en) * 2000-11-13 2010-10-06 日東電工株式会社 Porous polyimide production method and porous polyimide
JP2002201305A (en) * 2001-01-05 2002-07-19 Teijin Ltd Polyimide porous film and method for producing the same
JP4507419B2 (en) * 2001-02-22 2010-07-21 日東電工株式会社 Method for producing breathable adhesive sheet and breathable adhesive sheet
JP4701339B2 (en) * 2001-02-22 2011-06-15 日東電工株式会社 Method for producing breathable adhesive sheet
JP2002337268A (en) * 2001-05-21 2002-11-27 Nitto Denko Corp Metal foil laminate and its manufacturing method
US7060349B2 (en) * 2002-09-24 2006-06-13 Fuji Xerox Co., Ltd. Resin composition, process for producing the same and electrophotographic fixing member
JP2003201596A (en) * 2002-01-10 2003-07-18 Nitto Denko Corp Method of depositing metallic layer and metallic foil stacked matter
EP1561561B1 (en) 2002-11-12 2011-10-12 Daicel Chemical Industries, Ltd. Process for producing porous film and porous film
JP2004260038A (en) * 2003-02-27 2004-09-16 Nitto Denko Corp Method for forming compound insulation layer and method for manufacturing wiring board
EP1672011A4 (en) * 2003-09-25 2009-04-15 Daicel Chem Chemical-resistant porous film
EP1885779B1 (en) * 2005-05-27 2010-10-27 Fujifilm Corporation Method for producing self-assembled construction
KR20090003249A (en) 2006-02-20 2009-01-09 다이셀 가가꾸 고교 가부시끼가이샤 Porous film and layered product including porous film
JP4821411B2 (en) * 2006-04-05 2011-11-24 宇部興産株式会社 Polyimide film with heat-sealability only on one side, single-sided copper-clad laminate
CN100445322C (en) * 2006-08-21 2008-12-24 浙江大学 Ultralow dielectric constant polyimide film and its preparation method
JP2009166378A (en) * 2008-01-17 2009-07-30 Sun A Kaken Co Ltd Laminate and package for microwave heating
JP5430249B2 (en) * 2009-06-23 2014-02-26 キヤノン株式会社 Method for producing porous polymer membrane and porous polymer membrane produced by the production method
KR20120025003A (en) * 2009-08-20 2012-03-14 도요 보세키 가부시키가이샤 Electrically insulating sheet and method for producing same
JP5644151B2 (en) * 2010-03-23 2014-12-24 宇部興産株式会社 LAMINATE MANUFACTURING METHOD AND LAMINATE
JP5528250B2 (en) 2010-07-30 2014-06-25 日東電工株式会社 Method for manufacturing printed circuit board
JP2012182116A (en) * 2011-02-03 2012-09-20 Nitto Denko Corp Electric insulating resin sheet for motor, and method of manufacturing the same
JP5916498B2 (en) * 2011-06-06 2016-05-11 日東電工株式会社 Polyimide porous body and method for producing the same
JP2015015451A (en) * 2013-06-03 2015-01-22 宇部興産株式会社 Conductive member
KR101778739B1 (en) 2016-01-22 2017-09-14 에스케이씨 주식회사 Anisotropic thermally conductive film, laminate sheet using same and method of preparing same
JP6700846B2 (en) * 2016-02-23 2020-05-27 東京応化工業株式会社 Wiring board laminate, wiring board, and method for manufacturing wiring board laminate
CN108329689B (en) * 2018-03-08 2020-09-15 哈尔滨理工大学 Low-dielectric-constant polyimide porous film and preparation method thereof
JP6858902B2 (en) * 2020-04-27 2021-04-14 東京応化工業株式会社 A method for manufacturing a laminated body for a wiring board, a wiring board, and a laminated body for a wiring board.

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