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JP2000353442A - Contact structure of electromagnetic relay and its manufacture - Google Patents

Contact structure of electromagnetic relay and its manufacture

Info

Publication number
JP2000353442A
JP2000353442A JP11161878A JP16187899A JP2000353442A JP 2000353442 A JP2000353442 A JP 2000353442A JP 11161878 A JP11161878 A JP 11161878A JP 16187899 A JP16187899 A JP 16187899A JP 2000353442 A JP2000353442 A JP 2000353442A
Authority
JP
Japan
Prior art keywords
contact
electromagnetic relay
layer
pure gold
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11161878A
Other languages
Japanese (ja)
Other versions
JP4051821B2 (en
Inventor
Minoru Fukumori
稔 福森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP16187899A priority Critical patent/JP4051821B2/en
Publication of JP2000353442A publication Critical patent/JP2000353442A/en
Application granted granted Critical
Publication of JP4051821B2 publication Critical patent/JP4051821B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To stabilize contact by preventing increase in contact resistance while enhancing stick resistance. SOLUTION: Opening and closing of a pair of fixed contact 6 and a movable contact 10 is repeated several hundred times by actuating an electromagnetic relay, in order to provide a transfer part 6c of pure gold transferred from the first pure gold layer 10a of the movable contact 10 at a position making contact with the movable contact 10 on the surface of the first layer 6 of the fixed contact 6 of silver and palladium. Since the contact points of both contacts are made of pure gold, both contacts are prevented from increasing the contact resistance between them and are stabilized. Also, since a very small amount of pure gold is used to form the transfer part 6c, there is not pussibility of welding (stick) between the first layer 10a of the movable contact 10 and the transfer part 6c by vibration, and stick resistance can be enhanced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電磁継電器の接点
構造並びにその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact structure of an electromagnetic relay and a method of manufacturing the same.

【0002】[0002]

【従来の技術】近年、微少な電流・電圧を開閉する通信
用の電磁継電器では、小型化に伴って接点圧並びに接点
開離力が約10グラム以下というような非常に小さな値
になってきている。このような従来の電磁継電器の接点
構造は、図7に示すように金・銀合金の第1層30a,
31aと、純銀の第2層30b,31bと、銅・ニッケ
ル合金の第3層30c,31cとで各接点30,31が
構成され、電磁継電器の通電状態に応じて各接点30,
31が第1層30a,31aの表面で接触開離するもの
であった。
2. Description of the Related Art In recent years, in electromagnetic relays for communication for opening and closing minute currents and voltages, the contact pressure and the contact opening force have become extremely small, such as about 10 g or less, with the miniaturization. I have. As shown in FIG. 7, the contact structure of such a conventional electromagnetic relay includes a first layer 30a of a gold-silver alloy,
31a, second layers 30b, 31b of pure silver, and third layers 30c, 31c of copper / nickel alloy constitute the respective contacts 30, 31, and each of the contacts 30, 31 according to the energized state of the electromagnetic relay.
No. 31 contacted and separated on the surfaces of the first layers 30a and 31a.

【0003】[0003]

【発明が解決しようとする課題】ところで、常閉側の接
点対に上記従来の接点構造が用いられた場合、あるいは
常開側の接点対に上記従来の接点構造が用いられ且つ接
点対が接触状態で長時間保持された場合、接点開離力が
小さいために外部からの振動によって接触状態の接点間
が融着(スティック)してしまい、接点開離不能、又は
接点開閉不良が生じるという問題がある。
When the conventional contact structure is used for a normally closed contact pair, or when the conventional contact structure is used for a normally open contact pair and the contact pairs are in contact with each other. If the contact is held for a long time, the contact separating force is so small that the external contacts vibrate (stick) between the contacts in the contact state due to external vibration, and the contact cannot be opened or the contact cannot be opened and closed properly. There is.

【0004】上記問題を解決するために、第1層30
a,31aの銀の含有率を増大することが考えられる。
しかしながら、銀の含有率を増やすと空気中の硫黄や塩
素と銀が結合することで接点に有機被膜が形成され、こ
の有機被膜が第1層30a,31aの接触面に存在する
ことで接点間の接触抵抗が増大するという問題が生じ
る。
In order to solve the above problem, the first layer 30
It is conceivable to increase the content of silver in a and 31a.
However, when the content of silver is increased, the sulfur and chlorine in the air combine with silver to form an organic film on the contact, and this organic film is present on the contact surface between the first layers 30a and 31a, so that the contact between the contacts is reduced. A problem arises that the contact resistance increases.

【0005】一方、接点の開離時に生じるアークによっ
て上記有機被膜を除去する方法が考えられるが、例えば
上述の通信用の電磁継電器のようにアークが生じない程
度の負荷条件で使用される場合には、アークによる有機
被膜の除去は不可能である。
On the other hand, a method of removing the organic coating by an arc generated when the contacts are opened can be considered. However, for example, in the case where the electromagnetic relay for communication is used under a load condition in which an arc is not generated, such as the above-mentioned electromagnetic relay for communication. However, it is impossible to remove the organic coating by an arc.

【0006】本発明は上記問題に鑑みて為されたもので
あり、その目的とするところは、接触抵抗の増大を防い
で安定化できるとともに耐スティック性の向上が図れる
電磁継電器の接点構造及びその製造方法を提供すること
にある。
The present invention has been made in view of the above problems, and an object of the present invention is to provide a contact structure of an electromagnetic relay which can stabilize by preventing an increase in contact resistance and can improve stick resistance, and a contact structure thereof. It is to provide a manufacturing method.

【0007】[0007]

【課題を解決するための手段】請求項1の発明は、上記
目的を達成するために、接点対を開閉する電磁継電器の
接点構造において、前記接点対の互いに対向する接点表
面部の一方に略純金層が設けられるとともに他方に金や
銀よりも表面が硬い金属層が設けられ、前記金属層の相
手側接点との接触面に当該相手側接点の前記略純金層の
一部を転写した転写部が形成されたことを特徴とし、接
点対は略純金層と略純金層の一部を転写した転写部とで
接触導通することとなり、接触抵抗の増大を防いで安定
化できるとともに、転写部が表面の硬い金属層の当該表
面に部分的に形成されるものであるから、振動によって
略純金層と融着する虞が無く、従来例に比較して耐ステ
ィック性の向上が図れる。
According to a first aspect of the present invention, there is provided a contact structure of an electromagnetic relay for opening and closing a contact pair, wherein the contact structure is provided on one of contact surface portions of the contact pair opposed to each other. A transfer in which a pure gold layer is provided and a metal layer whose surface is harder than gold or silver is provided on the other side, and a part of the substantially pure gold layer of the mating contact is transferred to a contact surface of the metal layer with the mating contact. The contact pair is contact conductive between the substantially pure gold layer and the transfer portion to which a part of the substantially pure gold layer has been transferred, thereby preventing the contact resistance from increasing and stabilizing the transfer portion. Is partially formed on the surface of the hard metal layer, there is no possibility of fusing with the substantially pure gold layer by vibration, and the stick resistance can be improved as compared with the conventional example.

【0008】請求項2の発明は、請求項1の発明におい
て、前記金属層の表面部位にビッカース硬さが35以上
である金属材料を用いたことを特徴とし、請求項1の発
明と同様の作用を奏する。
A second aspect of the present invention is the same as the first aspect of the invention, wherein a metal material having a Vickers hardness of 35 or more is used for a surface portion of the metal layer. It works.

【0009】請求項3の発明は、請求項2の発明におい
て、前記金属材料を銀・パラジウム合金又は銀・ニッケ
ル合金又は銀・銅合金としたことを特徴とし、実施形態
2の発明の望ましい実施態様である。
A third aspect of the present invention is characterized in that, in the second aspect of the present invention, the metal material is a silver / palladium alloy, a silver / nickel alloy or a silver / copper alloy. It is an aspect.

【0010】請求項4の発明は、請求項1又は2又は3
の発明において、前記略純金層の厚みを5±3〔μm〕
の範囲としたことを特徴とし、請求項1又は2又は3の
発明の作用に加えて、転写部の厚み寸法を1〔μm〕よ
りも大きくない程度にできる。
[0010] The invention of claim 4 is the invention of claim 1 or 2 or 3.
In the invention, the thickness of the substantially pure gold layer is 5 ± 3 [μm].
In addition to the effects of the first, second or third aspect of the present invention, the thickness of the transfer portion can be made not to be larger than 1 [μm].

【0011】請求項5の発明は、請求項1〜4の何れか
の発明において、前記転写部が、前記接点の金属層の表
面に点在するまだら状に形成されたことを特徴とし、接
点対の接触面積が小さいことから融着の虞が無く、また
仮に融着しても僅かな力で剥がすことができるために開
閉不良などの不具合が生じることがない。
According to a fifth aspect of the present invention, in any one of the first to fourth aspects of the present invention, the transfer portion is formed in a mottled shape scattered on the surface of the metal layer of the contact. Since the contact area of the pair is small, there is no danger of fusing, and even if fusing, it can be peeled off with a small force, so that problems such as poor opening and closing do not occur.

【0012】請求項6の発明は、請求項1〜4の何れか
の発明において、前記転写部が、前記接点の金属層の表
面に薄膜状に形成されたことを特徴とし、転写部に対す
る相手側接点の食い込み量が少ないことから融着の虞が
無く、また仮に融着しても僅かな力で剥がすことができ
るために開閉不良などの不具合が生じることがない。
According to a sixth aspect of the present invention, in any one of the first to fourth aspects of the present invention, the transfer portion is formed in a thin film on the surface of the metal layer of the contact. Since there is little bite into the side contact, there is no danger of fusion, and even if it is fused, it can be peeled off with a small force, so that there is no problem such as poor opening and closing.

【0013】請求項7の発明は、請求項1〜6の何れか
の発明において、開離時にアークが生じないような電圧
及び電流が前記接点対に印加されることを特徴とし、請
求項1〜6の何れかの発明の望ましい実施態様である。
According to a seventh aspect of the present invention, in any one of the first to sixth aspects of the present invention, a voltage and a current are applied to the pair of contacts so that an arc is not generated at the time of opening. It is a desirable embodiment of any one of the inventions of Nos.

【0014】請求項8の発明は、上記目的を達成するた
めに、接点対を開閉する電磁継電器の接点構造の製造方
法であって、前記接点対の互いに対向する接点表面部の
一方に略純金層が設けられるとともに他方に金や銀より
も表面が硬い金属層が設けられ、前記接点対の開閉が繰
り返されて前記金属層の相手側接点との接触面に当該相
手側接点の純金層の一部が転写されることを特徴とし、
接点対は略純金層と略純金層の一部を転写した転写部と
で接触導通することとなり、接触抵抗の増大を防いで安
定化できるとともに、転写部が表面の硬い金属層の当該
表面に部分的に形成されるものであるから、振動によっ
て純金層と融着する虞が無く、従来例に比較して耐ステ
ィック性の向上が図れ、しかもこのような転写部が電磁
継電器を繰り返し動作させるだけで容易に形成すること
ができる。
According to an eighth aspect of the present invention, there is provided a method for manufacturing a contact structure of an electromagnetic relay for opening and closing a contact pair, the method comprising: A metal layer whose surface is harder than gold or silver is provided on the other side, and the opening and closing of the contact pair is repeated, and the contact surface of the metal layer with the mating contact is formed of the pure gold layer of the mating contact. It is characterized by being partially transcribed,
The contact pair is brought into contact conduction between the substantially pure gold layer and the transfer portion to which a portion of the substantially pure gold layer has been transferred, thereby preventing the contact resistance from increasing and stabilizing the transfer portion. Since it is formed partially, there is no danger of fusing with the pure gold layer due to vibration, so that the stick resistance can be improved as compared with the conventional example, and such a transfer portion repeatedly operates the electromagnetic relay. Can be easily formed.

【0015】[0015]

【発明の実施の形態】以下、図面を参照して本発明の一
実施形態を詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

【0016】図5は本実施形態の接点構造を採用した電
磁継電器の一例を示す分解斜視図である。この電磁継電
器Ryは、鉄心1が略コ字状に形成され、この鉄心1が
両側片1aを上向きにして配置される。この鉄心1には
合成樹脂製のコイルボビン(図示せず)が一体成形され
る。つまり、鉄心1がコイルボビンにインサート成形さ
れる。ここで、鉄心1の磁極となる両側片1aの先端部
はコイルボビンから露呈させてある。このコイルボビン
の胴部にはコイル(図示せず)が巻装される。そして、
上記鉄心1の両側片1aの間には直方体状の永久磁石2
が取り付けられる。この永久磁石2は中央部と両端部と
が異極に着磁されている。以下、鉄心1、コイルボビ
ン、コイル及び永久磁石2からなる部材を電磁石ブロッ
クと呼ぶ。この電磁石ブロックは、端子4と共に合成樹
脂でモールドしてボディブロック5として一体形成され
る。上記端子4は、基端に固定接点6が形成された固定
接点端子41と、基端に後述する接点ばね7のヒンジば
ね片7aが固着される共通接点端子42と、コイルに通
電を行うコイル端子43とからなり、電磁石ブロック3
の両側に、固定接点端子41,共通接点端子42及びコイ
ル端子43がそれぞれ植設される。
FIG. 5 is an exploded perspective view showing an example of an electromagnetic relay employing the contact structure of the present embodiment. In the electromagnetic relay Ry, the iron core 1 is formed in a substantially U-shape, and the iron core 1 is arranged with the both side pieces 1a facing upward. A coil bobbin (not shown) made of synthetic resin is integrally formed with the iron core 1. That is, the iron core 1 is insert-molded on the coil bobbin. Here, the tip portions of both side pieces 1a serving as the magnetic poles of the iron core 1 are exposed from the coil bobbin. A coil (not shown) is wound around the body of the coil bobbin. And
A rectangular parallelepiped permanent magnet 2 is provided between both side pieces 1a of the iron core 1.
Is attached. The permanent magnet 2 is magnetized in different polarities at the center and both ends. Hereinafter, a member including the iron core 1, the coil bobbin, the coil, and the permanent magnet 2 is referred to as an electromagnet block. The electromagnet block is molded as a body block 5 integrally with the terminal 4 by molding with a synthetic resin. The terminal 4, the fixed contact terminals 4 1 stationary contact 6 to the proximal end is formed, the common contact terminal 4 2 the hinge spring piece 7a of the contact spring 7 to be described later to the proximal end is fixed, the energized coil a coil terminal 4 3 for performing the electromagnet block 3
On both sides of the fixed contact terminals 4 1, the common contact terminal 4 2 and the coil terminals 4 3 are implanted respectively.

【0017】上記ボディブロック5の永久磁石2上には
接極子9が配設される。接極子9は平板状に形成され、
下面の中央に形成された突条(図示せず)を揺動支点と
して、永久磁石2上に揺動(シーソ動)自在に載置され
る。この接極子9の長手方向両側には一体に接点ばね7
が取り付けられる。この接点ばね7は、両端部が二股に
分割されるとともに分割された各先端部7bの下面(固
定接点6に対向する面)に各々可動接点10が固着され
ている。一方、接点ばね7の略中央部には、略コ字型に
形成されたヒンジばね片7aが一体に設けてある。
An armature 9 is disposed on the permanent magnet 2 of the body block 5. The armature 9 is formed in a flat plate shape,
The projection (not shown) formed at the center of the lower surface is used as a swing fulcrum, and is mounted on the permanent magnet 2 so as to swing (seesaw). Contact springs 7 are integrally formed on both sides of the armature 9 in the longitudinal direction.
Is attached. The contact spring 7 has both ends divided into two parts, and a movable contact 10 is fixed to a lower surface (a surface facing the fixed contact 6) of each of the divided end portions 7b. On the other hand, a substantially U-shaped hinge spring piece 7a is integrally provided substantially at the center of the contact spring 7.

【0018】ところで、上記接極子9と2本の接点ばね
7とを合成樹脂でモールドして接極子ブロック8として
一体成形してある。合成樹脂製の成型部8aから外側へ
突出したヒンジばね片7aは、ボディブロック5の上面
中央側縁部に配置された上記共通接点端子42の固着片
4aにそれぞれ固着され、これにより2本の接点ばね7
がそれぞれボディブロック5両側に植設された2本の共
通接点端子42に電気的に接続される。さらに、このヒ
ンジばね片7aは、接極子9が鉄心1の側片の一方に吸
引されたときに生じるたわみにより、接極子9に復帰力
を付与する働きもある。そして、ボディブロック5の永
久磁石2上に接極子ブロック8を載置し組み立てた状態
で、下面が開口する箱状に形成されたケース11を被嵌
して電磁継電器Ryが構成される。
The armature 9 and the two contact springs 7 are molded from a synthetic resin to be integrally formed as an armature block 8. The hinge spring piece 7a of a synthetic resin molded portion 8a projecting outward is fixed respectively to the fixing piece 4a of the upper surface center side edge disposed a the common contact terminal 4 and second bodies block 5, thereby two Contact spring 7
Are electrically connected to two common contact terminals 42 implanted on both sides of the body block 5, respectively. Further, the hinge spring piece 7a also has a function of giving a restoring force to the armature 9 by bending generated when the armature 9 is attracted to one of the side pieces of the iron core 1. Then, in a state where the armature block 8 is mounted on the permanent magnet 2 of the body block 5 and assembled, an electromagnetic relay Ry is configured by fitting a box-shaped case 11 having an open lower surface.

【0019】この電磁継電器Ryは、例えば図6に示す
ように、コイル端子43間にスイッチSWを介して直流
電源Eが接続され、共通接点端子42に負荷電源LEの
陰極が接続されるとともに、固定接点端子41に負荷L
を介して負荷電源LEの陽極が接続される。ここで、負
荷電源LEの電源電圧Voは10V以下、電磁継電器R
y及び負荷Lに流れる負荷電流Iが10mA以下であっ
て、固定接点6と可動接点10の開離時にアークが発生
しないような条件で電磁継電器Ryを使用する。而し
て、この電磁継電器Ryでは、スイッチSWをオンして
コイルへの通電が行われると磁化の向きに応じて接極子
9の長手方向の一端部が鉄心1端部の磁極面に吸引され
て接極子ブロック8が揺動し、鉄心1→接極子9→永久
磁石2→鉄心1の閉磁路が形成され、2本の接点ばね7
のうち揺動中心よりも鉄心1端部に吸引された側にある
接点ばね7の先端部7bに固着された可動接点10がボ
ディブロック5の固定接点6と接触し、上記吸引された
側と反対側にある接点ばね7の先端部7bに固着された
可動接点10が固定接点6と開離する。この状態でコイ
ルへの通電が停止されると、永久磁石2の磁力により上
記閉磁路がそのまま維持され、接極子9が鉄心1の一方
の磁極面に接触した状態が保たれる。また、コイルへの
通電方向を逆向きにすれば、接極子9は鉄心1の他方の
端部磁極面に吸引され、固定接点6に接触していた可動
接点10は開離し、反対側の可動接点10が固定接点6
に接触する。この状態においても通電を停止した後、そ
のままの状態が維持され、いわゆる双安定動作が行われ
る。
[0019] The electromagnetic relay Ry, for example, as shown in FIG. 6, the DC power source E is connected through a switch SW between the coil terminals 4 3 is connected the cathode of the common contact terminal 4 2 to the load power LE is together with the load L to the fixed contact terminals 4 1
Is connected to the anode of the load power supply LE. Here, the power supply voltage Vo of the load power supply LE is 10 V or less, and the electromagnetic relay R
The electromagnetic relay Ry is used under conditions that the y and the load current I flowing through the load L are 10 mA or less and no arc is generated when the fixed contact 6 and the movable contact 10 are opened. Thus, in the electromagnetic relay Ry, when the switch SW is turned on to energize the coil, one end in the longitudinal direction of the armature 9 is attracted to the magnetic pole surface at the end of the iron core 1 according to the direction of magnetization. The armature block 8 swings to form a closed magnetic path of the iron core 1 → the armature 9 → the permanent magnet 2 → the iron core 1, and the two contact springs 7
The movable contact 10 fixed to the distal end portion 7b of the contact spring 7 on the side attracted to the end of the iron core 1 from the swing center comes into contact with the fixed contact 6 of the body block 5, and The movable contact 10 fixed to the tip 7 b of the contact spring 7 on the opposite side is separated from the fixed contact 6. When energization of the coil is stopped in this state, the closed magnetic path is maintained as it is by the magnetic force of the permanent magnet 2, and the state in which the armature 9 is in contact with one magnetic pole surface of the iron core 1 is maintained. When the direction of current supply to the coil is reversed, the armature 9 is attracted to the magnetic pole surface at the other end of the iron core 1, the movable contact 10 that has been in contact with the fixed contact 6 is separated, and the movable Contact 10 is fixed contact 6
Contact In this state as well, after the energization is stopped, the state is maintained, and a so-called bistable operation is performed.

【0020】次に、本発明の要旨である電磁継電器Ry
の接点構造について説明する。
Next, the electromagnetic relay Ry which is the gist of the present invention is described.
Will be described.

【0021】本実施形態においては、図1に示すように
可動接点10が純金(純度99.5%以上)の第1層1
0aと、銀・パラジウム合金の第2層10bと、銅・ニ
ッケル合金の第3層10cとで構成され、また固定接点
6が銀・パラジウム合金の第1層6aと、銅・ニッケル
合金の第2層6bとで構成される。ここで、可動接点1
0の純金の第1層10aの厚みは5±3μm程度とす
る。また、固定接点6の第1層6aには、耐スティック
性を向上させるために少なくともビッカース硬さが35
以上である高硬度の金属材料を用いるが、本実施形態の
銀・パラジウム合金(AgPa40)以外にも銀・ニッ
ケル合金(AgNi10)や銀・銅合金(AgCu1
0)等を用いることができる。
In this embodiment, as shown in FIG. 1, the movable contact 10 is made of a first layer 1 of pure gold (purity of 99.5% or more).
0a, a second layer 10b of a silver / palladium alloy, and a third layer 10c of a copper / nickel alloy, and the fixed contact 6 has a first layer 6a of a silver / palladium alloy and a second layer 10a of a copper / nickel alloy. It is composed of two layers 6b. Here, the movable contact 1
The thickness of the first layer 10a of 0 pure gold is about 5 ± 3 μm. The first layer 6a of the fixed contact 6 has a Vickers hardness of at least 35 in order to improve the stick resistance.
The above-described high-hardness metal material is used. In addition to the silver-palladium alloy (AgPa40) of the present embodiment, a silver-nickel alloy (AgNi10) or a silver-copper alloy (AgCu1) is used.
0) can be used.

【0022】ところで、本実施形態においては、固定接
点6の第1層6a表面における可動接点10と接触する
部位に可動接点10の第1層10aから転写された純金
から成る転写部6cが設けてある。図4(a)に示すよ
うに、上記電磁継電器Ryが組み立てられた直後の初期
状態では固定接点6の第1層6aの表面には転写部6c
が形成されておらず、組立後に電磁継電器Ryを動作さ
せて固定接点6と可動接点10の接点対の開閉を数百回
程度繰り返すことにより、図4(b)(c)並びに図2
に示すように固定接点6の第1層6aの表面に可動接点
10の第1層10aの純金が打痕としてまだら状に転写
されて上記転写部6cが形成される。但し、接点対の開
閉をさらに繰り返すことによって、図3に示すように転
写部6cを厚みが極めて薄い(例えば、0.1μm以
下)薄膜状に形成するようにしても良い。
In the present embodiment, a transfer portion 6c made of pure gold transferred from the first layer 10a of the movable contact 10 is provided on a portion of the surface of the first layer 6a of the fixed contact 6 which is in contact with the movable contact 10. is there. As shown in FIG. 4A, in the initial state immediately after the electromagnetic relay Ry is assembled, the transfer portion 6c is formed on the surface of the first layer 6a of the fixed contact 6.
Are not formed, and after the assembly, the electromagnetic relay Ry is operated to repeatedly open and close the contact pair of the fixed contact 6 and the movable contact 10 about several hundred times.
As shown in (1), the pure gold of the first layer 10a of the movable contact 10 is mottling-transferred to the surface of the first layer 6a of the fixed contact 6 as a dent to form the transfer portion 6c. However, the transfer portion 6c may be formed into a very thin (for example, 0.1 μm or less) thin film as shown in FIG. 3 by further repeating the opening and closing of the contact pair.

【0023】而して、固定接点6の第1層6aに含まれ
る銀と電磁継電器Ryの構成部材等から発生する有機ガ
スに含まれている硫黄や塩素とが結合して第1層6aの
表面に有機被膜が形成されていたとしても、固定接点6
の第1層6aの表面に転写部6cを設けたことによって
固定接点6と可動接点10の接触点が純金同士となるか
ら、両接点間の接触抵抗の増大を防いで安定化できる。
また、転写部6cを形成する純金は微量であるから、振
動によって可動接点10の第1層10aと転写部6cと
が融着(スティック)する虞が無く、従来例に比較して
耐スティック性の向上が図れる。しかも、このような転
写部6cが電磁継電器Ryを繰り返し動作させるだけで
容易に形成することができ、製造コストの上昇を招くこ
と無しに上記効果が得られる。また、転写部6cを薄膜
状に形成した場合においても、転写部6cの厚み寸法が
極めて小さく、転写部6cに対して可動接点10の第1
層10aの表面部位の食い込み量が少ないことから、融
着の虞がない、あるいは仮に融着しても僅かな力で剥が
れるために接点の開閉不良などの不具合が発生しない。
Thus, the silver contained in the first layer 6a of the fixed contact 6 and the sulfur or chlorine contained in the organic gas generated from the constituent members of the electromagnetic relay Ry combine with each other to form the first layer 6a. Even if an organic film is formed on the surface, the fixed contact 6
By providing the transfer portion 6c on the surface of the first layer 6a, the contact point between the fixed contact 6 and the movable contact 10 becomes pure gold, so that the contact resistance between both contacts can be prevented from increasing and the contact can be stabilized.
Further, since the amount of pure gold forming the transfer portion 6c is very small, there is no possibility that the first layer 10a of the movable contact 10 and the transfer portion 6c are fused (stick) due to vibration. Can be improved. Moreover, such a transfer section 6c can be easily formed only by repeatedly operating the electromagnetic relay Ry, and the above-described effect can be obtained without increasing the manufacturing cost. Even when the transfer portion 6c is formed in a thin film shape, the thickness of the transfer portion 6c is extremely small, and the first contact of the movable contact 10 with respect to the transfer portion 6c.
Since there is little bite into the surface portion of the layer 10a, there is no danger of fusing, or even if fusing, the layer 10a is peeled off with a small force, so that troubles such as poor contact opening / closing do not occur.

【0024】なお、本実施形態では可動接点10に純金
の第1層10aを設けるとともに固定接点6に転写部6
cを設けているが、これに限定する趣旨ではなく、固定
接点6に純金の第1層を設け、可動接点10に純金を転
写させて転写部を形成するようにしても同様の効果を奏
することはいうまでもない。また、転写部6cを設ける
代わりに固定接点6の第1層6aの表面に1〔μm〕程
度の厚みの金メッキを予め形成しても良い。
In this embodiment, the movable contact 10 is provided with the first layer 10a of pure gold and the fixed contact 6 is provided with the transfer portion 6
c is provided, but the present invention is not limited to this. Similar effects can be obtained by providing a first layer of pure gold on the fixed contact 6 and transferring the pure gold to the movable contact 10 to form a transfer portion. Needless to say. Instead of providing the transfer portion 6c, gold plating having a thickness of about 1 [μm] may be formed on the surface of the first layer 6a of the fixed contact 6 in advance.

【0025】[0025]

【発明の効果】請求項1の発明は、接点対を開閉する電
磁継電器の接点構造において、前記接点対の互いに対向
する接点表面部の一方に略純金層が設けられるとともに
他方に金や銀よりも表面が硬い金属層が設けられ、前記
金属層の相手側接点との接触面に当該相手側接点の前記
略純金層の一部を転写した転写部が形成されたので、接
点対は略純金層と略純金層の一部を転写した転写部とで
接触導通することとなり、接触抵抗の増大を防いで安定
化できるとともに、転写部が表面の硬い金属層の当該表
面に部分的に形成されるものであるから、振動によって
略純金層と融着する虞が無く、従来例に比較して耐ステ
ィック性の向上が図れるという効果がある。
According to the first aspect of the present invention, there is provided a contact structure of an electromagnetic relay for opening and closing a contact pair, wherein a substantially pure gold layer is provided on one of contact surface portions of the contact pair opposed to each other and the other is made of gold or silver. Also, a metal layer having a hard surface is provided, and a transfer portion that transfers a part of the substantially pure gold layer of the mating contact on the contact surface of the metal layer with the mating contact is formed. The layer and the transfer portion where a portion of the substantially pure gold layer has been transferred are brought into contact with each other, thereby preventing the contact resistance from increasing and stabilizing the transfer portion. The transfer portion is partially formed on the surface of the hard metal layer having a hard surface. Therefore, there is no danger of being fused to the substantially pure gold layer due to vibration, and there is an effect that the stick resistance can be improved as compared with the conventional example.

【0026】請求項2の発明は、前記金属層の表面部位
にビッカース硬さが35以上である金属材料を用いたの
で、請求項1の発明と同様の効果を奏する。
According to the second aspect of the present invention, a metal material having a Vickers hardness of 35 or more is used for the surface portion of the metal layer.

【0027】請求項3の発明は、前記金属材料を銀・パ
ラジウム合金又は銀・ニッケル合金又は銀・銅合金とし
たことを特徴とし、実施形態2の発明の望ましい実施態
様である。
The invention according to claim 3 is characterized in that the metal material is a silver-palladium alloy, a silver-nickel alloy or a silver-copper alloy, and is a preferred embodiment of the invention of the second embodiment.

【0028】請求項4の発明は、前記略純金層の厚みを
5±3〔μm〕の範囲としたので、請求項1又は2又は
3の発明の効果に加えて、転写部の厚み寸法を1〔μ
m〕よりも大きくない程度にでき、耐スティック性をさ
らに向上できるという効果がある。
According to a fourth aspect of the present invention, since the thickness of the substantially pure gold layer is in the range of 5 ± 3 [μm], in addition to the effect of the first or second or third aspect, the thickness of the transfer portion can be reduced. 1 [μ
m], the stick resistance can be further improved.

【0029】請求項5の発明は、前記転写部が、前記接
点の金属層の表面に点在するまだら状に形成されたの
で、接点対の接触面積が小さいことから融着の虞が無
く、また仮に融着しても僅かな力で剥がすことができる
ために開閉不良などの不具合が生じることがないという
効果がある。
According to a fifth aspect of the present invention, since the transfer portion is formed in a mottled shape scattered on the surface of the metal layer of the contact, the contact area of the contact pair is small, so that there is no possibility of fusion. Further, even if they are fused, they can be peeled off with a small force, so that there is an effect that problems such as poor opening and closing do not occur.

【0030】請求項6の発明は、前記転写部が、前記接
点の金属層の表面に薄膜状に形成されたので、転写部に
対する相手側接点の食い込み量が少ないことから融着の
虞が無く、また仮に融着しても僅かな力で剥がすことが
できるために開閉不良などの不具合が生じることがない
という効果がある。
According to a sixth aspect of the present invention, since the transfer portion is formed in a thin film on the surface of the metal layer of the contact, the amount of biting of the mating contact into the transfer portion is small, so that there is no danger of fusion. Also, even if they are fused, they can be peeled off with a slight force, so that there is an effect that problems such as poor opening and closing do not occur.

【0031】請求項7の発明は、開離時にアークが生じ
ないような電圧及び電流が前記接点対に印加されること
を特徴とし、請求項1〜6の何れかの発明の望ましい実
施態様である。
According to a seventh aspect of the present invention, a voltage and a current which do not cause an arc when the electrodes are separated are applied to the contact pair. is there.

【0032】請求項8の発明は、接点対を開閉する電磁
継電器の接点構造の製造方法であって、前記接点対の互
いに対向する接点表面部の一方に略純金層が設けられる
とともに他方に金や銀よりも表面が硬い金属層が設けら
れ、前記接点対の開閉が繰り返されて前記金属層の相手
側接点との接触面に当該相手側接点の純金層の一部が転
写されるので、接点対は略純金層と略純金層の一部を転
写した転写部とで接触導通することとなり、接触抵抗の
増大を防いで安定化できるとともに、転写部が表面の硬
い金属層の当該表面に部分的に形成されるものであるか
ら、振動によって純金層と融着する虞が無く、従来例に
比較して耐スティック性の向上が図れ、しかもこのよう
な転写部が電磁継電器を繰り返し動作させるだけで容易
に形成することができるという効果がある。
An eighth aspect of the present invention is a method for manufacturing a contact structure of an electromagnetic relay for opening and closing a contact pair, wherein a substantially pure gold layer is provided on one of contact surface portions of the contact pair facing each other and the other is provided with a gold layer. Since a metal layer whose surface is harder than silver or silver is provided, and the opening and closing of the contact pair is repeated, a part of the pure gold layer of the mating contact is transferred to the contact surface of the metal layer with the mating contact, The contact pair is brought into contact conduction between the substantially pure gold layer and the transfer portion to which a portion of the substantially pure gold layer has been transferred, thereby preventing the contact resistance from increasing and stabilizing the transfer portion. Since it is formed partially, there is no danger of fusing with the pure gold layer due to vibration, so that the stick resistance can be improved as compared with the conventional example, and such a transfer portion repeatedly operates the electromagnetic relay. Just can be easily formed There is an effect that kill.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施形態を示す要部の側断面図である。FIG. 1 is a side sectional view of a main part showing an embodiment.

【図2】同上における固定接点の平面図である。FIG. 2 is a plan view of the fixed contact in the same.

【図3】同上における固定接点の平面図である。FIG. 3 is a plan view of the fixed contact in the above.

【図4】同上の製造方法を説明するための説明図であ
る。
FIG. 4 is an explanatory diagram for explaining the manufacturing method according to the first embodiment;

【図5】同上における電磁継電器の分解斜視図である。FIG. 5 is an exploded perspective view of the electromagnetic relay in the above.

【図6】同上の電磁継電器を用いた回路図である。FIG. 6 is a circuit diagram using the same electromagnetic relay.

【図7】従来の接点構造を示す側断面図である。FIG. 7 is a side sectional view showing a conventional contact structure.

【符号の説明】[Explanation of symbols]

6 固定接点 6a 第1層 6c 転写部 10 可動接点 10a 第1層 Reference Signs List 6 Fixed contact 6a First layer 6c Transfer unit 10 Movable contact 10a First layer

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 接点対を開閉する電磁継電器の接点構造
において、前記接点対の互いに対向する接点表面部の一
方に略純金層が設けられるとともに他方に金や銀よりも
表面が硬い金属層が設けられ、前記金属層の相手側接点
との接触面に当該相手側接点の前記略純金層の一部を転
写した転写部が形成されたことを特徴とする電磁継電器
の接点構造。
In a contact structure of an electromagnetic relay for opening and closing a contact pair, a substantially pure gold layer is provided on one of contact surfaces of the contact pair facing each other, and a metal layer whose surface is harder than gold or silver is provided on the other. A contact structure for an electromagnetic relay, wherein a transfer portion for transferring a part of the substantially pure gold layer of the mating contact is provided on a contact surface of the metal layer with the mating contact.
【請求項2】 前記金属層の表面部位にビッカース硬さ
が35以上である金属材料を用いたことを特徴とする請
求項1記載の電磁継電器の接点構造。
2. The contact structure for an electromagnetic relay according to claim 1, wherein a metal material having a Vickers hardness of 35 or more is used for a surface portion of said metal layer.
【請求項3】 前記金属材料を銀・パラジウム合金又は
銀・ニッケル合金又は銀・銅合金としたことを特徴とす
る請求項2記載の電磁継電器の接点構造。
3. The contact structure for an electromagnetic relay according to claim 2, wherein said metal material is silver / palladium alloy, silver / nickel alloy or silver / copper alloy.
【請求項4】 前記略純金層の厚みを5±3〔μm〕の
範囲としたことを特徴とする請求項1又は2又は3記載
の電磁継電器の接点構造。
4. The contact structure for an electromagnetic relay according to claim 1, wherein the thickness of the substantially pure gold layer is in a range of 5 ± 3 [μm].
【請求項5】 前記転写部は、前記接点の金属層の表面
に点在するまだら状に形成されたことを特徴とする請求
項1〜4の何れかに記載の電磁継電器の接点構造。
5. The contact structure for an electromagnetic relay according to claim 1, wherein the transfer portion is formed in a mottled shape scattered on a surface of the metal layer of the contact.
【請求項6】 前記転写部は、前記接点の金属層の表面
に薄膜状に形成されたことを特徴とする請求項1〜4の
何れかに記載の電磁継電器の接点構造。
6. The contact structure for an electromagnetic relay according to claim 1, wherein the transfer portion is formed in a thin film on a surface of a metal layer of the contact.
【請求項7】 開離時にアークが生じないような電圧及
び電流が前記接点対に印加されることを特徴とする請求
項1〜6の何れかに記載の電磁継電器の接点構造。
7. The contact structure for an electromagnetic relay according to claim 1, wherein a voltage and a current that do not cause an arc at the time of breaking are applied to the contact pair.
【請求項8】 接点対を開閉する電磁継電器の接点構造
の製造方法であって、前記接点対の互いに対向する接点
表面部の一方に略純金層が設けられるとともに他方に金
や銀よりも表面が硬い金属層が設けられ、前記接点対の
開閉が繰り返されて前記金属層の相手側接点との接触面
に当該相手側接点の純金層の一部が転写されることを特
徴とする電磁継電器の接点構造の製造方法。
8. A method for manufacturing a contact structure of an electromagnetic relay for opening and closing a contact pair, wherein a substantially pure gold layer is provided on one of contact surface portions of the contact pair facing each other, and the other surface has a surface higher than gold or silver. An electromagnetic relay, wherein a hard metal layer is provided, and a part of the pure gold layer of the mating contact is transferred to a contact surface of the metal layer with the mating contact by repeating opening and closing of the contact pair. Manufacturing method of contact structure.
JP16187899A 1999-06-09 1999-06-09 Contact structure of electromagnetic relay and manufacturing method thereof Expired - Lifetime JP4051821B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16187899A JP4051821B2 (en) 1999-06-09 1999-06-09 Contact structure of electromagnetic relay and manufacturing method thereof

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JP2000353442A true JP2000353442A (en) 2000-12-19
JP4051821B2 JP4051821B2 (en) 2008-02-27

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Country Link
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