JP2000352592A - Stage device and exposure device using it and device production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the dynamic characteristics of a stage and increase the speed and accuracy of positioning without leading to increase of the device size. SOLUTION: To a stage device provided with a stage movable in nearly vertical direction, a driving mechanism 40 moving the stage to nearly vertical direction, a counter mass 61 balancing the weight of the stage, and a pulley 63 winding and supporting the connection member 62 connecting the counter mass to the stage, a drive mechanism 63c and 80 giving one of or both of the drive force in the rotational direction of the pulley and the drive force along the direction nearly vertical to the counter mass are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus used in a lithography process for manufacturing semiconductor devices and the like, various precision processing machines, and a stage apparatus mounted on various precision measuring instruments and the like, and an exposure apparatus using the same. The present invention relates to an apparatus and a device manufacturing method.

[0002]

2. Description of the Related Art Conventionally, an apparatus generally called a stepper is known as an exposure apparatus used for manufacturing a semiconductor device or the like. In this method, a substrate is two-dimensionally moved in steps with respect to a projection optical system that projects a pattern of an original such as a reticle or a mask onto a substrate such as a wafer, and a plurality of original patterns are printed on one substrate. It is. As a stage device for positioning a substrate such as a wafer by step-moving it with respect to a projection optical system of a stepper, higher precision is required as semiconductor devices and the like are more highly integrated.

In recent years, the size of wafers has tended to increase in order to increase the number of device products obtained from one wafer, that is, the number of devices to be obtained, and accordingly stage devices such as steppers have become larger and larger. It is getting heavier. In order to obtain the required accuracy in such a state, it is necessary to further improve the dynamic characteristics of the stage, and it is desired to increase the rigidity of the guide and the like, but this results in a further increase in the weight of the entire stage. .

In addition, in order to reduce the cost of semiconductor devices and the like, it is required to shorten the exposure cycle time and improve the throughput, and it is desired that the stage for moving a wafer or the like be driven at a high speed. However, in order to increase the speed of a large and heavy stage, the rigidity of the structure supporting the stage must be further strengthened. As a result, the entire apparatus becomes significantly larger, heavier, and more expensive. Could be.

On the other hand, recently developed X-ray exposure apparatuses using soft X-rays (charged particle storage ring radiation) or the like as exposure light hold a substrate such as a wafer in a vertical direction and approach a vertical or similar substrate. A vertical stage that moves two-dimensionally in a reference plane is used. In such a vertical stage, in addition to the above-mentioned problems associated with the increase in size and speed, a countermass mechanism for compensating the stage's own weight is required because the stage is moved in the direction of gravity. However, if vibration occurs in the counter mass or the like, it becomes a disturbance that degrades the positioning accuracy of the wafer or the like, and the dynamic characteristics of the stage and the like also deteriorate significantly.

FIGS. 15 and 16 show an example of a conventional vertical stage. This includes a Y stage 1120 that can reciprocate in the Y-axis direction (vertical direction) along a surface plate 1110 erected on a plywood 1110a, and a Y stage 1120.
X stage 1130 that can reciprocate on the top in the X-axis direction
And an XY stage having a cylinder 1140 for moving the Y stage 1120 in the Y-axis direction and a linear motor (not shown) for moving the X stage 1130 in the X-axis direction.

The surface plate 1110 has a guide surface for supporting the back surface of the Y stage 1120 in a non-contact manner via an air pad or the like. One end of the surface plate 1110 has a Y stage 1
An unillustrated Y guide (yaw guide) for guiding the H.120 in the Y-axis direction is provided, and the space between the Y guide and the Y stage 1120 is kept in a non-contact state by an air pad or the like.

[0008] Y stage 1120 and X stage 1130
A self-weight compensating mechanism 1160 for canceling (cancelling) the weight of a wafer or the like (not shown) held on the belt 1162 at one end and a belt 1162 for suspending a counter mass 1161 at the other end, and winds and supports the belt 1162. Pulley 1
163, and the weight of the counter mass 1161 is set so as to balance the weight of the stage movable portion including the Y stage 1120 and the X stage 1130 and the wafers and the like held thereon.

[0009]

However, according to the above prior art, when the Y stage moves at a high speed, the response delay becomes a serious problem due to the influence of the inertia moment of the pulley and the counter mass. A steel belt, a wire, or the like is generally used as a belt connecting the stage and the counter mass. When the stage is moved, natural vibration of several tens Hz is generated due to insufficient rigidity of the steel belt or the like. In addition, the natural vibration of, for example, 50 Hz or more of the counter mass itself propagates through the belt to the front stage. These vibrations significantly deteriorate the positioning accuracy of the stage, and become a major obstacle in improving the frequency response characteristics of the positioning control system.

The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and has been made to improve the dynamic characteristics of a vertical stage provided with a self-weight compensation mechanism such as a counter mass, and to increase the size of the apparatus. It is an object of the present invention to provide a high-performance stage apparatus which can greatly promote high-speed and high-accuracy positioning without causing the problem, an exposure apparatus using the same, and a device manufacturing method.

[0011]

A first stage apparatus according to the present invention comprises a stage movable in a substantially vertical direction, a driving mechanism for moving the stage in the direction, and a counter for balancing the weight of the stage. A mass and a pulley that winds and supports a connecting member that connects the counter mass to the stage, and includes a driving force in a rotational direction with respect to the pulley or a driving force along a substantially vertical direction with respect to the counter mass. It is characterized by including a drive mechanism for providing one or both of them.

The second stage device is similar to the first stage device, wherein the position of the stage is controlled by a drive mechanism of the stage based on a position command value, and the pulley or counter mass drive mechanism is controlled by the position command. It is characterized by having control means for driving in synchronization with the value.

The third stage device comprises a work stage movable two-dimensionally along a substantially vertical reference plane, a first drive mechanism for moving the work stage in a substantially vertical first direction, A second drive mechanism for moving the work stage in a second direction, a counter mass that balances the weight of the work stage, and a pulley that winds and supports a connecting member that connects the counter mass to the work stage And a fourth drive mechanism for applying a drive force in the vertical direction to the counter mass, and a fourth drive mechanism for applying a drive force in the substantially vertical direction to the countermass.

The fourth stage device is a third stage device, wherein the position of the work stage is controlled by the first drive mechanism based on a position command value, and the third drive mechanism and the fourth drive mechanism are controlled by the first drive mechanism. It is characterized by having control means for driving in synchronization with the position command value.

A fifth stage device is the third or fourth stage device, wherein the first and fourth drive mechanisms are linear motors.

A sixth stage device is characterized in that in any one of the third to fifth stage devices, the third drive mechanism is a rotary motor attached to the pulley.

A seventh stage device is characterized in that in any one of the third to sixth stage devices, a hydrostatic bearing device for keeping the work stage in non-contact with the reference surface is provided. I do.

An eighth stage device is the stage device according to any one of the third to seventh stage devices, wherein the yaw guide for guiding the work stage in the first direction and the work stage are kept out of contact with the yaw guide. A yaw guide hydrostatic bearing device is provided.

A ninth stage device is the stage device according to any one of the third to eighth stage devices, wherein the counter mass is a guide for guiding the counter mass in the first direction, and the counter mass is a counter mass yaw guide. A countermass-yo guide hydrostatic bearing device is provided to keep the non-contact.

A first exposure apparatus according to the present invention includes any one of the first to ninth stage apparatuses and an exposure means for exposing a work held by the stage apparatus. The second exposure apparatus is characterized in that, in the first exposure apparatus, the exposure light used by the exposure means is an X-ray. A device manufacturing method according to the present invention includes a step of exposing a substrate by a first or second exposure apparatus.

In the configuration of the present invention, when the stage is driven, the pulley and the counter mass are driven in conformity with the stage drive so as to cancel the influence of the inertia moment of the pulley and the counter mass on the stage drive. Thus, disturbance caused by a self-weight compensating mechanism such as a counter mass including a connecting member having low rigidity is removed, and the positioning accuracy is further improved, and the speeding up is promoted.

[0022]

FIG. 1 is a perspective view showing an XY stage according to a first embodiment of the present invention. As shown in the figure, the XY stage includes a Y stage 20 which is reciprocally movable in a Y-axis direction (a vertical direction or a direction similar thereto) along a surface plate 10 erected on a plywood (not shown). An X stage 30 that is reciprocally movable on the Y stage 20 in the X axis direction, and a first stage that moves the Y stage 20 in the Y axis direction.
And a pair of Y linear motors 40 as second driving means for moving the X stage 30 in the X-axis direction. In FIG. 1, the display of the Y linear motor 40 on the left side of the figure is omitted to explain the Y guide 11 later.

The surface plate 10 has an XY guide surface 10a as a reference surface for supporting the back surfaces of the Y stage 20 and the X stage 30 in a non-contact manner via an air pad or the like which is a hydrostatic bearing device (not shown). One end of the platen 10 in the X-axis direction
Y which is a yaw guide for guiding the stage 20 in the Y-axis direction
A guide 11 (shown by a broken line) is provided upright, and the space between the Y guide surface 11a of the Y guide 11 and the Y stage 20 is kept in a non-contact state by an air pad 20a or the like which is a yaw guide static pressure bearing device. When both Y linear motors 40 are driven, the Y stage 20 moves on the XY guide surface 10 a of the base 10 along the Y guide 11.

The Y stage 20 includes a pair of Y sliders 21
And 22, and a frame body composed of an X linear motor stator 52 supported at both ends thereof. The back surfaces of the Y sliders 21 and 22 are
It faces the Y guide surface 10a and is supported in a non-contact manner via an air pad or the like as described above. Also, Y on the left side of FIG.
The slider 22 is longer than the other 21 and its side 22
a faces the Y guide surface 11a of the Y guide 11, and is guided in a non-contact manner through the air pad 20a and the like as described above (see FIG. 2B). The Y sliders 21 and 22 are respectively connected to the Y linear motor
1 are integrally connected. X stage 30 is top plate 3
The X linear motor stator 52 penetrates the hollow frame having a hollow portion 1. The surface of the top plate 31 forms a work stage for sucking and holding a wafer, which is a work (not shown).

Both Y linear motors 40 are Y linear motor movers 41 integrally connected to Y sliders 21 and 22 of Y stage 20 via connecting plate 23 as described above.
And a Y linear motor stator 42 penetrating the opening. The current supplied to each Y linear motor stator 42 generates a thrust in the Y axis direction on each Y linear motor movable element 41, and moves the Y stage 20 and the X stage 30 in the Y axis direction. An X linear motor mover that moves the X stage 30 on the Y stage 20 in the X-axis direction is fixed inside the top plate 31 of the X stage 30. The X-axis motor thrust is generated in the X-axis direction by the current supplied to the X linear motor stator 52, and the X stage 30
Is moved along the Y linear motor stator 52 in the X-axis direction.

The counter mass mechanism 60, which is a self-weight compensation mechanism for canceling (cancelling) the weights of the Y stage 20 and the X stage 30, etc., has the Y sliders 21 and 22, ie, the Y stage 20, at one end and the counter mass 61 at the other end. A belt 62 as a plurality of connecting members to be suspended, a pulley 63 for winding and supporting the belt 62, and a rotary motor 63 for driving the pulley 63
c. The weight of the counter mass 61 is set so as to balance the weight of the entire stage movable section including the Y stage 20 and the X stage 30 and the wafers and the like held thereon.

When the X stage 30 moves in the X axis direction,
Because the position of the center of gravity of the stage movable part including the Y stage 20 and the X stage 30 changes, around the Z axis (in the ωZ axis direction)
The balance of the rotational moments is lost. However, this moment cannot be received only by the countermass mechanism 60, and an excessive load is applied to the Y guide (yaw guide) 11 for guiding the Y stage 20. In order to support such a large load, it is necessary to significantly increase the rigidity of the Y guide 11. However, since increasing the rigidity of the Y guide 11 involves increasing the size of the Y guide 11 and the like, the entire stage is further increased. As the size and weight are increased, the dynamic characteristics of the stage are also deteriorated, resulting in a great hindrance to high precision and high speed positioning. Also, the Y stage 20 and the counter mass 6
Generally, a steel belt, a wire, or the like is used as the belt 62 connecting the first and second belts 1. However, when the Y stage 20 is moved, vibration occurs due to insufficient rigidity of the steel belt. Such vibration significantly deteriorates the positioning accuracy of the stage, and becomes a major obstacle in improving the frequency response characteristics of the positioning control system.

Therefore, an actuator 7 for adjusting the tension or the effective length of the belt 62 according to the displacement of the X stage 30 is provided at the connection between the Y stage 20 and each belt 62.
0 is provided. As the actuator 70, FIGS.
As shown in FIG. 6, a bellofram (air spring) 71 for controlling the tension of the belt 62 and an air cylinder 7 are provided.
2. Linear motor 73, belt 62 as shown in FIG.
A piezoelectric element 74 or the like for changing the effective length is used. Belt 62 for suspending Y sliders 21 and 22
The tension or the effective length of each belt 62 is adjusted by individually controlling the driving amount of each actuator 70 based on the position information of the X stage 30 as described later. In this way, by canceling (compensating) the rotational moment generated with the movement of the X stage 30, the load applied to the Y guide 11 by the Y stage 20 is reduced. In addition, the bellofram 71, the air cylinder 72, and the linear motor 73 have a vibration absorbing effect of absorbing and attenuating natural vibration generated by insufficient rigidity of the belt 62 and natural vibration of the counter mass 61 itself.
In other words, there is an advantage that the vibration transmitted from the belt 62 to the Y stage 20 can be reduced by the actuator 70, and the positioning accuracy and the frequency response characteristic of the positioning control system can be greatly improved.

The space between the guide surface 11a of the Y guide 11 and the Y stage 20 (Y slider 22) opposed thereto is kept in a non-contact state by the air pad 20a as described above. The Y stage 20 has a magnetic pad 20b in addition to the air pad 20a, which is used to apply a preload in a direction opposite to that of the air pad 20a to obtain a bearing rigidity k1 shown in FIG. As shown in FIG. 3, a counter mass yaw guide 64 is provided on the back side of the surface plate 10 in parallel with the Y guide 11. Counter Masyo Guide 6
Numeral 4 faces an air pad 61a and a magnetic pad 61b, which are countermass yaw guide static pressure bearing devices provided at one end of the countermass 61, and guides the countermass 61 in the Y-axis direction without contact. The magnetic pad 61b of the counter mass 61 is configured to apply a preload in a direction opposite to that of the air pad 61a to obtain a bearing stiffness k2 greater than the bearing stiffness k1 on the Y stage 20 side as shown in FIG. Thus, the counter mayo guide 6
The reason why the bearing stiffness k2 of No. 4 is made larger than the bearing stiffness k1 of the Y guide 11 is because the influence of the rotational moment generated when the center of gravity of the Y stage 20 changes as the X stage 30 moves in the X-axis direction. , Counter Masyo Guide 6
4 to reduce the rotational moment applied to the Y stage 20. X-axis direction of X stage 30 and X
The position in the axial direction is measured by position sensors 30c and 30d that receive the reflected light from the Y length measuring mirror 30a and the X length measuring mirror 30b integrated with the X stage 30, respectively.

Next, as each actuator 70, FIG.
The case where the bellofram 71 shown in FIG.
Belofram 71 is a bellows 71 having an air supply port 71a.
b, the upper end of the bellows 71 b is connected to a first housing 71 c integral with the Y stage 20, and the lower end of the bellows 71 b is connected to the lower end of the belt 62.
Is connected to the housing 71d. By changing the pressure of the air supplied to the air supply port 71a, the air pressure in the bellows 71b is changed.
To change the tension.

FIG. 8 is a block diagram showing a control system for controlling the air pressure of the bellows 71b based on the position information of the X stage 30 in the X axis direction. A servo system for controlling the X linear motor 50 drives the X linear motor 50 based on a position command value sent from a computer (not shown) and position information in the X axis direction of the X stage 30 fed back from the position sensor 30d. Control the amount. The position command value is kp-converted, and together with the pressure command value of the bellofram control system, the controller 70a as a control means.
To control the air pressure in the bellows 71b by adjusting the servo valve connected to the air supply port 71a of the bellofram 71. That is, by multiplying the position command value of the X stage 30 by the conversion coefficient kp and adding this to the pressure command value of the belofram control system, the air pressure in each belofram 71 when the center of gravity of the stage movable portion changes is changed. And the tension of each belt 62 is adjusted. By individually adjusting the tension of each belt 62 in this manner, a rotational moment opposite to the rotational moment generated by the movement of the X stage 30 is generated, and the load on the Y guide 11 is reduced. Since the load applied to the Y guide 11 is greatly reduced by performing the moment correction, the dynamic characteristics of the stage can be greatly improved without increasing the size and weight of the Y guide 11, and the speed of step movement and positioning can be increased. And high precision.

However, even if the rotational moment of the Y stage 20 is corrected by the actuator 70 and the vibration propagating to the Y stage 20 via the belt 62 is reduced as described above, the Y-stage 2
It is difficult to completely eliminate the vibration propagating to zero. Such vibrations are as low as several Hz, but cannot be neglected in order to further improve the positioning accuracy and promote the speeding up. Therefore, as shown in FIG. 3, a pair of linear motors 80 as third driving means for suppressing the natural vibration of the counter mass 61 by accelerating the counter mass 61 in the opposite direction to the Y stage 20 is provided. . Both linear motors 80 are disposed at both ends of the counter mass 61,
Each is located on the back side of a Y linear motor 40 that drives the Y stage 20 in the Y axis direction.

Each linear motor 80 has a counter mass 61
The linear motor mover 81 moves along a linear motor stator 82 provided on a side edge of the surface plate 10. By controlling the current supplied to the linear motor stator 82, the acceleration of the counter mass 61 in the Y-axis direction
From the acceleration applied to the Y stage 20 in the opposite direction so that the absolute value is the same, and synchronized with the Y stage 20 so that the moment of inertia of the pulley 63 is canceled by the rotating motor 63c attached to the pulley 63. By controlling the rotation motor 63c, disturbance due to the natural vibration of the counter mass 61 can be almost completely removed. Linear motor 80 for driving counter mass 61 and pulley 63
The control system of the motor 63c for driving the motor will be described later with reference to the block diagram of FIG.

As described above, the vibration propagating from the counter mass mechanism 60 including the belt 62 to the Y stage 20 is attenuated by the actuator 70 and the counter mass 6
By reducing the natural vibration itself, the Y stage 2
The disturbance to the zero control system can be removed very effectively, which contributes to further improvement of positioning accuracy and speeding up of positioning. In addition, the use of such a compact, high-performance, high-speed stage apparatus can greatly contribute to the miniaturization, high performance, and improvement of productivity of an exposure apparatus for manufacturing semiconductor devices and the like. it can.

When an air cylinder 72 shown in FIG. 5 is used instead of the belofram 71 as each actuator 70, the operation is as follows. That is, the cylinder 72b having the air supply port 72a is integrated with the Y stage 20, and the lower end of the belt 62 is connected to the piston 72c.
By changing the pressure of the air supplied to the air supply port 72a, the tension of the belt 62 is changed. Cylinder 72b
The control system for controlling the air pressure is the same as in FIG.

When the linear motor 73 shown in FIG. 6 is used as each actuator 70, the operation is as follows.
That is, the coil 73 a of the linear motor 73 is integrated with the Y stage 20, and a driving magnet 73 b is connected to the lower end of the belt 62. By changing the current supplied to the coil 73a, the tension of the belt 62 is changed. The control system for controlling the current supplied to the coil 73a is the same as in FIG.

The case where the piezoelectric element 74 shown in FIG. 7 is used as each actuator 70 is as follows. That is, the housing 74a supporting the upper end of the piezoelectric element 74
Is integrated with the Y stage 20, and a lower end of the belt 62 is connected to a housing 74 b that supports a lower end of the piezoelectric element 74. By changing the voltage of the piezoelectric element 74, its thickness is changed, and the effective length of the belt 62 is changed. The control system for controlling the voltage of the piezoelectric element 74 is the same as in FIG.

FIG. 9 shows a counter mass 61 and a pulley 63.
FIG. 3 is a block diagram showing a control system for controlling the control in synchronization with a Y stage 20. The servo system for controlling the Y linear motor 40 and the servo system for controlling the pulley 63 include a position command value sent from a computer (not shown) and position information in the Y-axis direction of the Y stage 20 fed back from the position sensor 30c. And the drive amount of the Y linear motor 40 and the pulley 63 are controlled based on The position command value is differentiated twice and sent to the linear motor 80 of the counter mass 61 and the rotary motor 63c of the pulley 63 as an acceleration command value converted into Kp and Kq. By simply adding such a simple control system, the drive amounts of the Y stage 20, the pulley 63, and the counter mass 61 can be controlled synchronously. In the figure, the pulley 63 and the counter mass 61
, A command value to the Y stage 20 is given as an acceleration command. However, similarly to the Y stage 20, it is also possible to arrange a position sensor to form a feedback loop and similarly perform synchronous control. In this case, the rotation motor 63c
Is provided with a rotary encoder.

FIG. 10 shows a second embodiment. This example
Instead of providing the actuator 70 at the connection between the belt 62 and the Y stage 20, an actuator 90 is provided at a bearing (support) of a pulley 63 disposed at the upper end of the surface plate 10. As shown in FIG. 11, the actuator 90 is constituted by a belofram 91 disposed between the bearing base 63b on which the rolling bearing 63a for supporting the pulley 63 is mounted and the surface plate 10. Velofram 91
Has the same internal configuration as that of the bellofram 71 of FIG. 4, and is controlled by the same control system as that of FIG. Belofram 91
Instead of an air cylinder similar to that of FIGS.
A linear motor, a piezoelectric element, or the like may be used. In addition, the surface plate 10, the Y guide 11, the Y stage 20, the X stage 3
Since the 0, Y linear motor 40, X linear motor 50, counter mass mechanism 60, and the like are the same as those in the above-described embodiment, the same components are denoted by the same reference numerals, and description thereof will be omitted. As described above, an actuator for adjusting the tension and the effective length of the belt 62 may be used for the support of the pulley 63. It is needless to say that the same torque compensation as described above can be effectively performed even if a similar actuator is provided at the connection between the belt 62 and the counter mass 61 on the back side of the surface plate 10.

Next, an exposure optical system of an X-ray exposure apparatus using the stage device according to the present invention will be described. As shown in FIG. 12, the SR light (charged particle storage ring radiation) as the X-rays emitted from the SR generator (charged particle storage ring) 1 as the X-ray source is in the form of a sheet beam. Is scanned in the Y-axis direction by a mirror 2 installed at a predetermined distance from the camera. The mirror 2 is not limited to one mirror, and a plurality of mirrors may be used. The SR light reflected by the mirror 2 passes through an original M such as a mask in which a pattern made of an X-ray absorber is formed on an X-ray transmission film, and irradiates a wafer W coated with a resist as a photosensitive material. You. The wafer W is held on the wafer chuck (work stage) 3 on the above-described stage device, and the stage device performs step movement and positioning. A shutter 4 for controlling the exposure time is disposed upstream of the original M, and a driving device 4a of the shutter 4 is controlled by a shutter controller 4b. A beryllium film (not shown) is provided between the mirror 2 and the shutter 4.
The side is controlled to an ultra-high vacuum, and the shutter 4 side is controlled to a reduced pressure atmosphere of helium gas.

Next, an embodiment of a method of manufacturing a semiconductor device using the above-described exposure apparatus will be described. FIG. 13 shows a flow of manufacturing a semiconductor device (a semiconductor chip such as an IC or an LSI, or a liquid crystal panel or a CCD). In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process,
An actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4,
It includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed.
Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 14 shows a detailed flow of the wafer process (step 4). Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. And step 19
In (resist removal), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device, which has been conventionally difficult to manufacture.

[0043]

According to the stage device of the embodiment described above, the driving force is applied to the pulley and the counter mass, so that the positioning accuracy and the positioning speed can be improved. That is, when the stage is driven, the pulley and the counter mass are driven in synchronization with the stage so that the influence of their moment of inertia is canceled, thereby eliminating disturbance due to the self-weight compensation mechanism including the connecting member having low rigidity. As a result, it is possible to prevent the vibration of the counter mass from propagating to the stage to deteriorate the dynamic characteristics and the like, and to further improve the positioning accuracy and promote the speeding up. And by using this stage device for the exposure device,
Higher definition and lower cost in semiconductor device manufacturing and the like can be greatly promoted.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an XY stage according to a first embodiment of the present invention.

FIG. 2 is a diagram for explaining bearing rigidity of a Y guide and the like in the apparatus of FIG. 1 and a diagram showing a cross section of the Y guide.

FIG. 3 is a perspective view of the apparatus of FIG. 1 as viewed from the back side.

FIG. 4 is a cross-sectional view showing a configuration of a bellofram that can be used as an actuator in the device of FIG.

FIG. 5 is a cross-sectional view showing a configuration of an air cylinder that can be used as an actuator in the device of FIG.

FIG. 6 is a cross-sectional view showing a configuration of a linear motor that can be used as an actuator in the device of FIG.

FIG. 7 is a cross-sectional view illustrating a configuration of a piezoelectric element that can be used as an actuator in the apparatus of FIG.

FIG. 8 is a block diagram showing a control system of an actuator in the apparatus of FIG.

9 is a block diagram showing a control system for driving a counter mass and a pulley in the apparatus shown in FIG. 1.

FIG. 10 is a perspective view showing a second embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a configuration of an actuator that can be used in the device of FIG.

FIG. 12 is a diagram showing a configuration of an X-ray exposure apparatus using a stage device according to the present invention.

FIG. 13 is a flowchart showing a manufacturing process of a semiconductor device that can use the exposure apparatus of the present invention.

FIG. 14 is a flowchart showing details of the wafer process of FIG. 13;

FIG. 15 is a side view showing a vertical stage according to a conventional example.

16 is an elevation view of the device of FIG.

[Explanation of symbols]

1: SR generator, 2: mirror, 3: wafer chuck,
10: surface plate, 11: Y guide, 20: Y stage, 2
3: Connecting plate, 30: X stage, 40: Y linear motor, 50: X linear motor, 60: counter mass mechanism,
61: counter mass, 62: belt, 63: pulley, 63
c: rotary motor, 70, 90: actuator, 70
a: controller, 71, 91: bellofram, 72: air cylinder, 73, 80: linear motor, 74: piezoelectric element, 81: linear motor movable element, 82: linear motor stator, M: original plate, W: wafer.

Claims (12)

[Claims] A stage movable in a substantially vertical direction, a driving mechanism for moving the stage in the direction,
A counter mass that balances the weight of the stage; and a pulley that winds and supports a connecting member that connects the counter mass to the stage. A stage device comprising a driving mechanism for applying one or both of driving forces along a direction. 2. The position of the stage is controlled by a driving mechanism of the stage based on a position command value.
The stage device according to claim 1, further comprising control means for driving a drive mechanism of the pulley or the counter mass in synchronization with the position command value. 3. A work stage movable two-dimensionally along a substantially vertical reference plane, a first drive mechanism for moving the work stage in a substantially vertical first direction, and A second drive mechanism for moving in a direction 2; a counter mass that balances the weight of the work stage; and a pulley that winds and supports a connecting member that connects the counter mass to the work stage. A third drive mechanism for applying a rotational drive force to the pulley,
A fourth driving mechanism for applying a substantially vertical driving force to the counter mass. 4. The position of the work stage is controlled by the first drive mechanism based on a position command value.
4. The stage device according to claim 3, further comprising control means for driving the third drive mechanism and the fourth drive mechanism in synchronization with the position command value. 5. The stage device according to claim 3, wherein the first and fourth driving mechanisms are linear motors. 6. The apparatus according to claim 3, wherein said third drive mechanism is a rotary motor attached to said pulley.
The stage device according to any one of the above. 7. The stage device according to claim 3, further comprising a hydrostatic bearing device for keeping the work stage out of contact with the reference surface. 8. A yaw guide for guiding said work stage in said first direction, and a yaw guide hydrostatic bearing device for keeping said work stage out of contact with said yaw guide. The stage device according to any one of claims 1 to 7. 9. A counter mass yaw guide for guiding the counter mass in the first direction, and a counter mass yaw guide hydrostatic bearing device for keeping the counter mass out of contact with the counter mass yaw guide. The stage device according to any one of claims 3 to 8, wherein the stage device is provided. 10. An exposure apparatus comprising: the stage apparatus according to claim 1; and an exposure unit configured to expose a work held by the stage apparatus. 11. An exposure apparatus according to claim 10, wherein exposure light used by said exposure means is an X-ray. 12. A device manufacturing method comprising a step of exposing a substrate by the exposure apparatus according to claim 10.