JP2000340710A - Wiring board, semiconductor mounting device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board, which is highly reliable to mechanical stresses and can be mounted at a high density. SOLUTION: A plurality of connection pads 4 are provided on the surface, which is mounted with a rectangular semiconductor unit 2, of a glass epoxy substrate in a dotted type in the state corresponding to external terminals 3 under the unit 2. Substrate wirings 6 for electrically connecting with other electronic component through the pads 4 are led out in the opposite directions to the directions of the one pair of the sides 2A and 2C opposing each other of a mounting region 2E and are formed. The number of the lead-out sides of the region 2E can be reduced, there is no need to ensure the laying space for the substrate wirings 6, components adjacent to the substrate wirings 6 can be arranged at the positions, where the wirings 6 are not led out, and a high-density mounting can be performed on a wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board formed by drawing substrate wiring from connection pads to which external terminals of a semiconductor device are connected, a semiconductor mounting device having the semiconductor device mounted on the wiring board, and these wiring boards. Alternatively, the present invention relates to an electronic device provided with a semiconductor mounting device.

[0002]

2. Description of the Related Art Conventionally, as a wiring board and a semiconductor device mounted on the wiring board, for example, a configuration disclosed in Japanese Patent Application Laid-Open No. 10-284846 as shown in FIG. 10 is known.

[0003] As shown in FIG.
No. 4,846, the board wiring 29 to another electronic component drawn out from a plurality of connection pads 33 and 34 formed in a dot shape on the wiring board 22 is formed in the mounting area 23 of the rectangular semiconductor device 21. It is pulled out in all four sides.

[0004]

However, in the device described in Japanese Patent Application Laid-Open No. H10-284846 as shown in FIG. 10, the space of the substrate wiring 29 further drawn out from the mounting area 23 of the semiconductor device 21 is reduced. Adjacent components cannot be arranged in the portion of the board wiring 29. For this reason, the mounting density cannot be increased.

Further, since the board wiring 29 is drawn out in four directions, for example, when employed in portable electronic equipment, bending stress is generated when mechanical stress such as bending is repeatedly applied to the portable electronic equipment body. If the direction and the drawing direction of the board wiring 29 match, it is easy to break at the base of the connection portion of the connection pads 33 and 34 connected to the board wiring 29 in the matched portion. For this reason, in the structure in which the semiconductor device 21 is mounted, there is a problem that it is difficult to further improve the device reliability against mechanical stress such as bending.

The present invention has been made in view of the above circumstances, and provides a wiring board, a semiconductor mounting apparatus, and an electronic apparatus which can obtain high reliability against mechanical stress and can be mounted at a high density. With the goal.

[0007]

According to a first aspect of the present invention, there is provided a wiring board including an insulating substrate on which a substantially rectangular semiconductor device having external terminals is mounted, and at least a surface of the insulating substrate on which the semiconductor device is mounted. A connection pad provided to electrically and mechanically connect external terminals of the semiconductor device, and a substrate wiring connected to the connection pad and drawn out from at most three sides of a mounting area where the semiconductor device is mounted Is provided. The wiring board according to claim 2,
A substantially rectangular semiconductor device having external terminals is mounted, and an insulating substrate having a through hole extending from a surface on which the semiconductor device is mounted to an opposite surface, and the semiconductor device of the insulating substrate is mounted. A connection pad which is provided from the surface of the insulating substrate through the inner peripheral surface of the through hole to the surface on the opposite side of the insulating substrate, and to which external terminals of the semiconductor device are electrically and mechanically connected; And a substrate wiring which is located on the opposite surface, is connected to the connection pad via an inner peripheral surface of the through hole, and is drawn out from a mounting area where the semiconductor device is mounted. 4. The wiring board according to claim 3, wherein the insulating substrate has a substantially rectangular semiconductor device having external terminals mounted thereon, the insulating substrate having a concave via hole opened on a surface on which the semiconductor device is mounted, and the semiconductor device having the insulating substrate. A connection pad that is provided from the surface on which the via hole is mounted to the inner peripheral surface of the via hole, and external terminals of the semiconductor device are electrically and mechanically connected;
A substrate which is connected to the connection pad via an inner peripheral surface of the via hole and is drawn out of a mounting area where the semiconductor device is mounted along a plane direction of the insulating substrate, which is located in an intermediate layer of the insulating substrate; And wiring. The wiring board according to claim 4, wherein a substantially rectangular semiconductor device having external terminals is mounted, a through hole penetrating from a surface on which the semiconductor device is mounted to a surface on the opposite side, and the semiconductor device is mounted. An insulating substrate having a concave via hole opening in a surface of the insulating substrate, and an insulating substrate provided from the surface of the insulating substrate on which the semiconductor device is mounted to the surface on the opposite side of the insulating substrate via the inner peripheral surface of the through hole. A connection pad that is provided from a surface of the insulating substrate on which the semiconductor device is mounted to an inner peripheral surface of the via hole, and that electrically and mechanically connects external terminals of the semiconductor device; Through at least one of the inner peripheral surface of the through hole and the via hole located on at least one of the opposite surface of the substrate and the intermediate layer of the insulating substrate Serial connected to the connection pad, is obtained by including a said semiconductor device substrate wiring is drawn out formed along a plane direction of the insulating substrate from the mounting area to be mounted. According to a fifth aspect of the present invention, there is provided the wiring board according to any one of the second to fourth aspects, wherein the board wiring is formed by drawing out from at most three sides of the mounting area. A wiring board according to a sixth aspect is the wiring board according to any one of the first to fifth aspects, wherein the board wiring is formed by being drawn out from a pair of opposite sides of the mounting area. According to a seventh aspect of the present invention, in the wiring board according to any one of the first to sixth aspects, a plurality of connection pads and a plurality of substrate wirings are provided, and at least 80% of the total number of the substrate wirings is provided. , Which are drawn out from predetermined sides of the mounting area. According to a eighth aspect of the present invention, in the wiring board according to any one of the first to seventh aspects, the insulating substrate is formed in a longitudinal shape, and the substrate wiring crosses the longitudinal direction of the insulating substrate. It is drawn out in the direction. According to a ninth aspect of the present invention, there is provided a semiconductor mounting device including the wiring substrate according to any one of the first to eighth aspects, and a semiconductor device mounted on the wiring substrate. The semiconductor mounting device according to claim 10 is the semiconductor mounting device according to claim 9, wherein a distance between the semiconductor device and the wiring board is
It is filled with a resin material. An electronic device according to claim 11 is a main body case, at least one of a wiring board according to any one of claims 1 to 8 and a semiconductor mounting device according to claim 9 or 10 provided in the main body case. Or one of them. The electronic device according to claim 12 is the electronic device according to claim 11,
The main body case is formed in a longitudinal shape, and the wiring board according to claim 8 is disposed on the main body case along a longitudinal direction of the main body case.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a configuration of a semiconductor mounting device according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing a wiring board according to an embodiment of the present invention. FIG. 2 is a sectional view showing the semiconductor mounting device according to the first embodiment.

In FIG. 1, a plurality of connection pads 4 arranged in the same arrangement corresponding to the arrangement of the external terminals 3 of the semiconductor device 2 are provided in a mounting area 2E where the semiconductor device 2 on the wiring board 1 is mounted. It is formed in a dot shape. This wiring board 1
For example, a glass epoxy substrate as an insulating substrate is used. On the glass epoxy substrate, a plurality of dot-like connection pads 4 are provided, for example, with copper at positions corresponding to the plurality of external terminals 3 of the semiconductor device 2 to be mounted. When the semiconductor device 2 is a 1.27 mm pitch BGA (Ball Grid Array),
The connection pad 4 has a diameter of about 630 μm.

Further, board wirings 6 for electrically connecting to other electronic components (not shown) are drawn out from these connection pads 4 respectively. These board wiring 6
Are opposite sides 2A, 2A formed of copper similarly to the connection pads 4 and corresponding to the sides of the rectangular semiconductor device 2 to be mounted.
It is pulled out in the direction opposite to the direction C and is electrically connected to another electronic component 5. The board wiring 6 is not drawn out in the thickness direction of the wiring board 1.

Then, the external terminals 3 formed on the mounting surface side of the semiconductor device 2 and the connection pads 4 formed on the wiring board 1 are connected by solder balls 7, and the wiring board 1 and the semiconductor device 2 are electrically connected. In addition, they are mechanically connected to form a semiconductor mounting device as shown in FIG.

Next, the operation of the above embodiment will be described.

On the connection pads 4 provided on the wiring board 1 corresponding to the external terminals 3 of the semiconductor device 2 to be mounted, board wirings 6 electrically connected to other electronic components 5 are provided on the sides of the semiconductor device 2. It is formed so as to be drawn in the opposite direction to the corresponding opposite sides 2A and 2C.

As described above, the mounting area 2 of the semiconductor device 2
By reducing the number of sides from which the board wiring 6 is drawn out from E to the outside, the side 2 from which the board wiring 6 is not drawn out is reduced.
There is no need to secure a space for leading the board wiring 6 at the positions corresponding to B and 2D, and it is possible to arrange adjacent components at positions corresponding to the sides 2B and 2D where the board wiring 6 is not drawn out. High-density mounting is possible.

When the wiring board 1 is used in, for example, a portable electronic device, the direction in which the bending stress is generated due to repeated mechanical stress such as bending applied to the portable electronic device. When the direction is perpendicular to the direction in which the board wiring 6 is drawn out, it is possible to suppress the occurrence of disconnection in the drawn-out part of the board wiring 6 which is the base part with the connection pad 4 due to mechanical stress. Therefore, by designing the number of sides from which the board wiring 6 is drawn out of the wiring board 1 to a small number, the direction in which the bending stress is generated and the direction in which the board wiring 6 is drawn out are unlikely to be substantially parallel, and the probability of occurrence of disconnection is increased. And the reliability of the quality of the adopted portable electronic device can be improved.

Since the direction in which bending stress is likely to be generated is substantially determined by the shape of the portable electronic device, the wiring board 1 is set so that the direction in which bending stress is generated and the direction in which the board wiring 6 is drawn out are orthogonal to each other. It is easy to arrange in a portable electronic device.

That is, for example, as shown in FIG. 3, the electronic device has a rectangular shape having a large vertical and horizontal length, such as a portable communication device such as a mobile phone, and the wiring board 1 incorporated therein is also similar. In the case of a shape having a large length-width ratio, for example, the length ratio between the longitudinal direction and the direction orthogonal to the longitudinal direction is 1.5: 1 to 4: 1 (in the case of a mobile phone, usually 3: 1 to 4: 1)
4: 1, typically 1.5: for foldable mobile phones
In the case of (1: 1 to 2: 1), mechanical stress such as bending stress in the longitudinal direction ear may be repeatedly applied to the electronic device as shown in FIG. Along with this, similar mechanical stress such as bending stress is applied to the wiring board 1.

When such an aspect ratio is relatively large and bending stress or the like is applied almost only in the direction of the arrow in FIG. 4, the substrate wiring 6 extends along the longitudinal direction of the wiring board 1 along the direction in which the bending stress is applied. By drawing out only in a direction intersecting the direction in which the bending stress is applied as shown in FIG. 3, for example, in a direction perpendicular to the direction in which the bending stress is applied as shown in FIG. 3, even if the bending stress is applied as shown in FIG. It is possible to suppress the occurrence of disconnection at the base portion, which is the connection portion with the connection pad 4 of FIG.

That is, it is preferable to draw out the substrate wiring 6 in a direction in which the application of mechanical stress is small.

In the embodiment shown in FIGS. 1 and 2, a pair of opposing sides 2A, 2A,
In the description, the substrate wiring 6 is drawn out from the position 2C in the opposite direction, but it is drawn out from adjacent sides such as sides 2A and 2B, drawn out from three sides other than one side, or drawn out from only one side. Even if drawers are formed,
A similar effect is obtained in that high-density mounting can be obtained.

Further, in the configuration in which the wiring is drawn out only from the position of one side, the direction of the bending stress generated by the mechanical stress from the outside is unlikely to be substantially parallel to the drawing out direction. It is possible to suppress the occurrence of disconnection in the lead-out portion that is the base portion with the pad 4, and it is possible to improve the reliability of the quality of the electronic device provided with the wiring board 1.

Next, another embodiment of the present invention will be described with reference to the drawings.

FIG. 5 is a plan view showing a wiring board according to another embodiment of the present invention. FIG. 6 is a sectional view showing the semiconductor mounting device according to the first embodiment.

In FIG. 5, the wiring board 1 is formed of, for example, a glass epoxy board and is a mounting surface on which the semiconductor device 2 is mounted, similarly to the wiring board 1 of the embodiment shown in FIGS. It is configured in a laminate with a front surface, a back surface, and an intermediate layer between the front and back surfaces. In the wiring board 1, a through hole 8 penetrating from the front surface to the back surface and a via hole 9 opening from the front surface to the intermediate layer with a bottom correspond to the plurality of external terminals 3 of the semiconductor device 2 to be mounted. Are provided at different positions.

The wiring substrate 1 is provided with connection pads 4 which are located on the surface and are continuous in dot form over the inner peripheral surfaces of the through hole 8 and the via hole 9, respectively, and a surface wiring layer is formed. .

Further, on the rear surface of the wiring board 1, there are provided substrate wirings respectively connected to the respective connection pads 4 provided on the inner peripheral surface of the through hole 8 and electrically connected to other electronic components 5 not shown. 6 are drawn out to form a backside wiring layer.

In the intermediate layer of the wiring board 1, a wiring board connected to each connection pad 4 provided on the inner peripheral surface of the via hole 9 and electrically connected to another electronic component 5 (not shown) A plurality of substrate wirings 6 are drawn out along the direction of the plane 1, an intermediate wiring layer substantially parallel to the front surface wiring layer and the back surface wiring layer is formed, and the wiring substrate 1 is formed in a laminated shape.

Note that the substrate wiring 6 is not provided on the front wiring layer, and the substrate wiring 6 provided on the back wiring layer and the intermediate wiring layer is provided in the mounting area 2 on which the semiconductor device 2 is mounted.
E is drawn out from all four sides 2A, 2B, 2C and 2D to the outside.

Then, the external terminals 3 formed on the mounting surface side of the semiconductor device 2 are connected to the surface wiring layer side of the connection pads 4 formed on the wiring substrate 1 by solder balls 7 so that the wiring substrate 1 and the semiconductor device 2 are electrically and mechanically connected to each other to form a semiconductor mounting device as shown in FIG.

In the embodiment shown in FIGS. 5 and 6, the surface wiring layer on which the semiconductor device 2 is mounted is not provided with the substrate wiring 6 which is drawn out from the mounting area 2E to the outside. There is no need to secure a space for routing the substrate wiring 6 in the wiring layer.
All four sides 2A, 2B, 2 of
Adjacent components can be arranged at positions corresponding to C and 2D, and higher-density mounting can be achieved.

Further, since the substrate wiring 6 is provided in a laminated state, the wiring of the substrate wiring 6 is different from the configuration in which the substrate wiring 6 is provided only in one layer in the embodiment shown in FIGS. While the spacing can be designed to be wide and short circuit between the substrate wirings 6 can be prevented, the present invention can be applied to the semiconductor device 2 having a narrower terminal pitch or the semiconductor device 2 having many external terminals 3.

In a case where the wiring board 1 must be provided in the electronic device so that the surface wiring layer side on which the board wiring 6 is not provided is a surface on which bending stress is easily applied, the board wiring 6 is provided. In the intermediate wiring layer and the rear wiring layer to be formed, the bending stress generated is relatively small, and the disconnection can be further suppressed.

In the embodiment shown in FIGS. 5 and 6, all four sides 2A, 2A of mounting area 2E are set.
In the description, the substrate wiring 6 is drawn out from the positions of B, 2C, and 2D. However, as shown in FIG. 7, for example, a pair of opposing sides 2A, 2A are similar to the embodiment shown in FIGS.
It can be drawn out from the position C, drawn out from only one side, drawn out from three sides,
A similar effect can be obtained in that a high-density mounting can be obtained even when drawing out from the position of the adjacent side.

Further, according to the configuration of drawing out from the position of a pair of opposing sides or the configuration of drawing out from the position of one side, the direction of bending stress generated by external mechanical stress and the direction of drawing out Are not substantially parallel to each other, and it is possible to suppress the occurrence of disconnection in the lead-out portion, which is the root portion of the board wiring 6 with the connection pad 4, and to improve the reliability of the quality of the electronic device provided with the wiring board 1. It also has an effect.

The through hole 8 and the via hole 9
In the description, the substrate wiring 6 is provided on both the intermediate wiring layer and the rear wiring layer. However, only the elementary rule 8 is provided and the substrate wiring 6 is provided only on the rear wiring layer, or only the via hole 9 is provided. The substrate wiring 6 may be provided only on the wiring layer.

As shown in the embodiments of FIGS. 5 and 6, there is a restriction on the substrate wiring design, and the direction in which the substrate wiring 6 is not drawn out at all as in the embodiment shown in FIGS. When it is not possible to provide the wiring, it is preferable to set the number to 20% or less of the number of all the board wirings 6 in the direction in which there is a restriction. For example, when the number of the external terminals 3 is 100 pins, the semiconductor device 2 has 50 pins in each of the drawing directions as in the embodiment shown in FIGS.
In addition, when there are restrictions on the board wiring design as in the embodiment of FIG.
0 or more, 2 on the side where drawers are reduced
When the number is zero or less, disconnection at the base of the board wiring 6 can be relatively suppressed.

In addition, when there is a great restriction on the design of the substrate wiring and it is not possible to make the ratio of drawing out different in this way, considering the substrate wiring 6 near the corner in this way, the base of the substrate wiring 6 is relatively large. Disconnection at a part can be suppressed.

Next, still another embodiment of the present invention will be described with reference to the drawings.

FIG. 8 is a plan view showing a wiring board according to still another embodiment of the present invention. FIG. 9 is a cross-sectional view showing the semiconductor mounting device of the above.

The embodiment shown in FIG. 8 and FIG.
The substrate wiring 6 connected to the connection pad 4 is also provided on the surface wiring layer in the embodiment shown in FIGS.

The substrate wirings 6 provided on the front wiring layer, the intermediate wiring layer and the rear wiring layer, respectively, are mounted similarly to the embodiment shown in FIGS. 1 and 2 and the embodiment shown in FIG. A pair of opposite sides 2A and 2C of the area 2E
Are drawn out in the opposite directions from the respective positions.

In the embodiment shown in FIGS. 8 and 9, similarly to the embodiment shown in FIGS. 1 and 2, the direction of the bending stress generated by external mechanical stress is substantially parallel to the drawing direction. It is possible to suppress the occurrence of disconnection in the lead-out portion, which is the base portion of the board wiring 6 with the connection pad 4, and to improve the reliability of the quality of the electronic device provided with the wiring board 1.

Also, as in the embodiment shown in FIGS. 5 and 6, the substrate wirings 6 are provided in a plurality of layers, so that the wiring intervals between the substrate wirings 6 can be designed to be wide, and a short circuit between the substrate wirings 6 can be prevented. On the other hand, the present invention can be applied to a semiconductor device 2 having a narrower terminal pitch or a semiconductor device 2 having many external terminals 3.

In the embodiment shown in FIGS. 8 and 9, a pair of opposing sides 2A, 2A,
In the description, the substrate wiring 6 is drawn out from the position 2C in the opposite direction, but it is drawn out from adjacent sides such as sides 2A and 2B, drawn out from three sides other than one side, or drawn out from only one side. Even if drawers are formed,
A similar effect is obtained in that high-density mounting can be obtained.

Further, the embodiment shown in FIGS. 1 and 2, the embodiment shown in FIGS. 3 and 4, FIGS.
In the embodiment shown in FIG. 7, the embodiment shown in FIG. 7, and the embodiment shown in FIG. 8 and FIG.
The same effect can be obtained even if a plurality of rows are provided in a staggered arrangement or in a full matrix.

Further, in the case where the semiconductor device 2 is a BGA (Ball Grid Array) having a pitch of 1.27 mm, the connection pad 4 is formed to have a size of about 630 μm, but the present invention is not limited to this.

If necessary, a surface treatment such as a Ni / Au alloy may be applied.

Also, the terminal pitch has been described as 1.27 mm pitch.
Pitch, 0.65 mm pitch, 0.5 mm pitch, and even finer pitch can be used.

Further, the wiring substrate 1 is not limited to a glass epoxy substrate, but may be an organic substrate in which an epoxy resin is combined with fibers other than glass, an inorganic substrate such as a polyimide substrate or an alumina insulating substrate, or an inorganic substrate such as an epoxy resin. Any material can be used for the material of the base material, its structure, and manufacturing method, such as a material having a reduced thermal expansion coefficient after curing by mixing a filler. In addition, if it is formed with a small thermal expansion coefficient, it is possible to further suppress disconnection due to the stress due to thermal expansion and contraction.

On the other hand, the gap between the semiconductor device 2 and the wiring board 1 may be filled with a resin material to reinforce the solder ball 7 and the base of the board wiring 6 connected to the connection pad 4. In this case, the portion of the ball or the like that has been reinforced is reinforced and the life of the portion is improved, but stress concentrates on the resin itself at the end of the portion filled with the resin material or the portion protruding from the mounting area 2E, and this resin material is used. In the case where a break occurs due to a crack in the substrate wiring 6 immediately below the end,
Care must be taken because cracks may occur in the resin material itself, and the cracks may develop and break the substrate wiring 6. Also in this case, the possibility of disconnection is reduced by reducing the number of pull-outs of the substrate wiring 6 on the side where cracks are likely to occur, by not pulling out the wiring, or by not performing wiring on the surface layer.

[0052]

According to the present invention, the number of sides from which the board wiring is drawn out from the mounting area of the semiconductor device to the outside is reduced to at most three or less, thereby coping with the side where the board wiring is not drawn out. There is no need to secure a space for routing the board wiring at the position, and it is possible to arrange adjacent components at a position corresponding to the side from which the board wiring is not drawn out, so that high-density mounting can be performed.

Further, by reducing the number of wires to be drawn out, the direction in which the stress generated by the mechanical stress is generated and the direction in which the board wiring is drawn out become difficult to match, the probability of occurrence of disconnection can be reduced, and stable characteristics can be obtained. .

Further, by forming the wiring direction of the substrate wiring in a direction intersecting the longitudinal direction of the longitudinal insulating substrate in which bending stress is likely to be generated, disconnection can be easily suppressed with a simple structure and stable. Characteristics are obtained.

Further, by forming the mounting area in the opposite direction from a pair of opposite sides of the mounting area, the direction in which the stress generated by the mechanical stress is generated and the direction in which the board wiring is drawn out hardly coincide with each other. The probability of occurrence of disconnection can be reduced, and stable characteristics can be obtained.

Further, in order to dispose a long wiring board in which the board wiring is drawn out in a direction intersecting with the longitudinal direction in the longitudinal main body case of the electronic device along the longitudinal direction of the main body case, Disconnection can be easily suppressed with a simple configuration, and stable characteristics of the electronic device can be easily obtained.

By providing through holes and via holes in the insulating substrate and providing the substrate wiring on the back surface or intermediate layer different from the mounting surface, higher-density mounting can be obtained.

Further, by providing the substrate wiring in a plurality of layers such as the intermediate layer and the back surface, the wiring interval between the substrate wirings can be designed to be wide, and a short circuit between the substrate wirings can be prevented.
The present invention can be applied to a semiconductor device having a narrower terminal pitch or a semiconductor device having many external terminals.

[Brief description of the drawings]

FIG. 1 is a plan view of a wiring board according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the same semiconductor mounting device.

FIG. 3 is a plan view of a wiring board showing another embodiment of the present invention.

FIG. 4 is an explanatory diagram illustrating a situation in which bending stress is applied to a wiring board provided in the electronic device.

FIG. 5 is a plan view of a wiring board showing still another embodiment of the present invention.

FIG. 6 is a cross-sectional view showing the semiconductor mounting device according to the first embodiment;

FIG. 7 is a plan view of a wiring board showing still another embodiment of the present invention.

FIG. 8 is a plan view of a wiring board showing still another embodiment of the present invention.

FIG. 9 is a sectional view showing the semiconductor mounting device according to the second embodiment;

FIG. 10 is a plan view showing a conventional wiring board.

[Explanation of symbols]

 1, 22 Wiring board 2, 21 Semiconductor device 2A, 2B, 2C, 2D side 2E, 23 Mounting area 3 External terminal 4, 33, 34 Connection pad 6, 29 Board wiring 7 Solder ball 8 Through hole 9 Via hole

Claims (12)

[Claims] 1. An insulating substrate on which a substantially rectangular semiconductor device having external terminals is mounted, and an external terminal provided on at least a surface of the insulating substrate on which the semiconductor device is mounted, wherein the external terminals of the semiconductor device are electrically and mechanically mounted. A wiring board, comprising: a connection pad connected to the connection pad; and a board wiring drawn from at most three sides of a mounting area connected to the connection pad and mounting the semiconductor device. 2. An insulating substrate having a substantially rectangular semiconductor device having external terminals mounted thereon and having a through hole extending from a surface on which the semiconductor device is mounted to an opposite surface, and A connection pad provided from the surface on which the semiconductor device is mounted to the surface on the opposite side of the insulating substrate via the inner peripheral surface of the through hole, and external terminals of the semiconductor device being electrically and mechanically connected; An insulating substrate that is connected to the connection pad via an inner peripheral surface of the through hole and is drawn out from a mounting area where the semiconductor device is mounted, the insulating substrate being positioned on a surface on the opposite side of the insulating substrate. A wiring board characterized by the above-mentioned. 3. An insulating substrate having a substantially rectangular semiconductor device having external terminals mounted thereon and having a concave via hole opened on a surface on which the semiconductor device is mounted, and wherein the semiconductor device of the insulating substrate is mounted. A connection pad provided from the surface to an inner peripheral surface of the via hole, to which external terminals of the semiconductor device are electrically and mechanically connected; and an inner peripheral surface of the via hole located in an intermediate layer of the insulating substrate. And a substrate wiring connected to the connection pad via a mounting area where the semiconductor device is mounted along a plane direction of the insulating substrate. 4. A substantially rectangular semiconductor device having external terminals is mounted, a through hole penetrating from a surface on which the semiconductor device is mounted to an opposite surface, and an opening in a surface on which the semiconductor device is mounted. An insulating substrate having a concave via hole to be formed, and an insulating substrate provided from a surface of the insulating substrate on which the semiconductor device is mounted to a surface on the opposite side of the insulating substrate via an inner peripheral surface of the through hole. A connection pad provided from a surface of the substrate on which the semiconductor device is mounted to an inner peripheral surface of the via hole, and externally connected to the external terminal of the semiconductor device electrically and mechanically; Surface and at least one of the intermediate layer of the insulating substrate and the connection pad through at least one of the inner peripheral surface of the through hole and the via hole. Is continued, the wiring board, characterized by comprising the above semiconductor device substrate wiring is drawn out formed along a plane direction of the insulating substrate from the mounting area to be mounted. 5. The circuit board according to claim 2, wherein the substrate wiring is drawn out from at most three sides of the mounting area.
5. The wiring board according to any one of items 4 to 4. 6. The wiring according to claim 1, wherein the substrate wiring is drawn out from a pair of opposite sides of the mounting area.
6. The wiring board according to any one of items 5 to 5. 7. A plurality of connection pads and substrate wirings are provided, respectively, and at least 80% of the total number of the substrate wirings is:
7. The wiring board according to claim 1, wherein the wiring board is drawn out from a predetermined side of the mounting area. 8. The insulating substrate according to claim 1, wherein the insulating substrate is formed in a longitudinal shape, and the substrate wiring is drawn out in a direction crossing the longitudinal direction of the insulating substrate. The wiring board according to claim 1. 9. A semiconductor mounting device, comprising: the wiring board according to claim 1; and a semiconductor device mounted on the wiring board. 10. The semiconductor mounting device according to claim 9, wherein a resin material is filled between the semiconductor device and the wiring board. 11. A main body case, and at least one of the wiring board according to any one of claims 1 to 8 and the semiconductor mounting device according to claim 9 or 10 provided in the main body case. An electronic device, comprising: 12. The main body case is formed in a longitudinal shape, and the wiring board according to claim 8 is disposed on the main body case along a longitudinal direction of the main body case. 12. The electronic device according to item 11.