JP2000226432A - Resin paste composition and semiconductor device using the same - Google Patents
Resin paste composition and semiconductor device using the sameInfo
- Publication number
- JP2000226432A JP2000226432A JP11029889A JP2988999A JP2000226432A JP 2000226432 A JP2000226432 A JP 2000226432A JP 11029889 A JP11029889 A JP 11029889A JP 2988999 A JP2988999 A JP 2988999A JP 2000226432 A JP2000226432 A JP 2000226432A
- Authority
- JP
- Japan
- Prior art keywords
- paste composition
- trade name
- resin
- resin paste
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 36
- 239000011347 resin Substances 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 239000004593 Epoxy Substances 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 9
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 7
- 239000001257 hydrogen Substances 0.000 claims abstract description 7
- 238000013329 compounding Methods 0.000 claims abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 230000009257 reactivity Effects 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 2
- 239000000126 substance Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- -1 amine compound Chemical class 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 101000618467 Hypocrea jecorina (strain ATCC 56765 / BCRC 32924 / NRRL 11460 / Rut C-30) Endo-1,4-beta-xylanase 2 Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910001410 inorganic ion Inorganic materials 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂ペースト組成
物、さらに詳しくはＩＣ、ＬＳＩ等の半導体素子を金属
フレーム、セラミック配線板、ガラスエポキシ配線板、
ポリイミド配線板等の支持部材に接着するのに好適な樹
脂ペースト組成物及びこれを用いた半導体装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin paste composition.
The present invention relates to a resin paste composition suitable for bonding to a support member such as a polyimide wiring board and a semiconductor device using the same.
【０００２】[0002]
【従来の技術】半導体装置の実装方式は、高密度実装の
観点から、従来のピン挿入方式から表面実装方式へと移
行しているが、基板への実装には基板全体を赤外線等で
加熱するリフローソルダリングが用いられ、パッケージ
が２００℃以上の高温に加熱されるため、パッケージ内
部、特に接着剤層中又は封止材中に含まれる水分の急激
な気化・膨張によりパッケージクラックが発生し、半導
体装置の信頼性が低下するという問題があった。この問
題は、４２アロイリードフレームよりも銅リードフレー
ムにおいて特に深刻な問題であった。2. Description of the Related Art From the viewpoint of high-density mounting, the mounting method of a semiconductor device has shifted from the conventional pin insertion method to a surface mounting method. Since reflow soldering is used and the package is heated to a high temperature of 200 ° C. or more, package cracks occur due to rapid vaporization / expansion of moisture contained in the package, particularly in the adhesive layer or the sealing material, There is a problem that the reliability of the semiconductor device is reduced. This problem was particularly acute with copper leadframes than with 42 alloy leadframes.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記の従来
技術の問題点を解消し、反応性が高く、硬化性が良好
で、接着性に優れた樹脂ペースト組成物及びこの組成物
を用いて製造が容易な半導体装置を提供するものであ
る。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and provides a resin paste composition having high reactivity, good curability, and excellent adhesiveness, and using this composition. And to provide a semiconductor device which is easy to manufacture.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）エポキ
シ樹脂、（Ｂ）硬化剤、（Ｃ）フィラー及び（Ｄ）下記
の式（Ｉ）The present invention comprises (A) an epoxy resin, (B) a curing agent, (C) a filler, and (D) a compound represented by the following formula (I):
【化４】 〔式中、Ｒ1、Ｒ2及びＲ3はそれぞれ独立に水素、式（I
I）Embedded image Wherein R 1 , R 2 and R 3 are each independently hydrogen,
I)
【化５】 又は式（III）Embedded image Or formula (III)
【化６】 （ただし、ｎは１〜５の整数を示す）で示される基を表
し、Ｒ1、Ｒ2及びＲ3のうち少なくとも１個は水素でな
いものとする〕で表されるイソシアヌレート環構造を有
するエポキシ化合物を含有してなる樹脂ペースト組成物
に関する。Embedded image (Where n represents an integer of 1 to 5, and at least one of R 1 , R 2 and R 3 is not hydrogen) having an isocyanurate ring structure represented by the following formula: The present invention relates to a resin paste composition containing an epoxy compound.
【０００５】また、本発明は、上記の樹脂ペースト組成
物を用いて半導体素子を支持部材に接着した後、封止し
てなる半導体装置に関する。[0005] The present invention also relates to a semiconductor device in which a semiconductor element is adhered to a supporting member using the above-mentioned resin paste composition and then sealed.
【０００６】[0006]
【発明の実施の形態】次に、本発明の樹脂ペースト組成
物について詳細に説明する。本発明に用いられる、
（Ａ）成分であるエポキシ樹脂としては、１分子中に２
個以上のエポキシ基を有する化合物であれば特に制限は
ないが、例えば、ビスフェノールＡ型エポキシ樹脂〔Ａ
ＥＲ−Ｘ８５０１（旭化成工業(株)、商品名）、Ｒ−３
０１（油化シェルエポキシ(株)、商品名）、ＹＬ−９８
０（油化シェルエポキシ(株)、商品名）〕、ビスフェノ
ールＦ型エポキシ樹脂〔ＹＤＦ−１７０（東都化成
(株)、商品名）〕、ビスフェノールＡＤ型エポキシ樹脂
〔Ｒ−１７１０（三井石油化学工業(株)、商品名）〕、
フェノールノボラック型エポキシ樹脂〔Ｎ−７３０Ｓ
（大日本インキ化学工業(株)、商品名）、Quatrex−２
０１０（ダウ・ケミカル社、商品名）〕、クレゾールノ
ボラック型エポキシ樹脂〔ＹＤＣＮ−７０２Ｓ（東都化
成(株)、商品名）、ＥＯＣＮ−１００（日本化薬(株)、
商品名）〕、多官能エポキシ樹脂〔ＥＰＰＮ−５０１
（日本化薬(株)、商品名）、ＴＡＣＴＩＸ−７４２（ダ
ウ・ケミカル社、商品名）、ＶＧ−３０１０（三井石油
化学工業(株)、商品名）、１０３２Ｓ（油化シェルエポ
キシ(株)、商品名）〕、ナフタレン骨格を有するエポキ
シ樹脂〔ＨＰ−４０３２（大日本インキ化学工業(株)、
商品名）〕、脂環式エポキシ樹脂〔ＥＨＰＥ−３１５０
（ダイセル化学工業(株)、商品名）〕、アミン型エポキ
シ樹脂〔ＥＬＭ−１００（住友化学工業(株)、商品
名）、ＹＨ−４３４Ｌ（東都化成(株)、商品名）、ＴＥ
ＴＲＡＤ−Ｘ、ＴＥＴＲＡＣ−Ｃ（三菱瓦斯化学(株)、
商品名）〕、レゾルシン型エポキシ樹脂〔デナコールＥ
Ｘ−２０１（ナガセ化成工業(株)、商品名）〕、ネオペ
ンチルグリコール型エポキシ樹脂〔デナコールＥＸ−２
１１（ナガセ化成工業(株)、商品名）〕、ヘキサンディ
ネルグリコール型エポキシ樹脂〔デナコールＥＸ−２１
２（ナガセ化成工業(株)、商品名）〕、エチレン・プロ
ピレングリコール型エポキシ樹脂〔デナコールＥＸ−８
１０、８１１、８５０、８５１、８２１、８３０、８３
２、８４１、８６１（ナガセ化成工業(株)、商品
名）〕、及び一般式（IV）Next, the resin paste composition of the present invention will be described in detail. Used in the present invention,
As the epoxy resin as the component (A), 2 per molecule is used.
There is no particular limitation as long as it is a compound having two or more epoxy groups. For example, bisphenol A type epoxy resin [A
ER-X8501 (Asahi Chemical Industry Co., Ltd., trade name), R-3
01 (Yukaka Epoxy Co., Ltd., trade name), YL-98
0 (Yukaka Shell Epoxy Co., Ltd., trade name)], bisphenol F type epoxy resin [YDF-170 (Toto Kasei
(Trade name)], bisphenol AD epoxy resin [R-1710 (Mitsui Petrochemical Co., Ltd., trade name)],
Phenol novolak type epoxy resin [N-730S
(Dainippon Ink Chemical Industry Co., Ltd., trade name), Quatrex-2
010 (Dow Chemical Co., trade name)], cresol novolak type epoxy resin [YDCN-702S (Toto Kasei Co., Ltd., trade name), EOCN-100 (Nippon Kayaku Co., Ltd.,
Trade name)], polyfunctional epoxy resin [EPPN-501
(Nippon Kayaku Co., Ltd., trade name), TACTIX-742 (Dow Chemical Co., trade name), VG-3010 (Mitsui Petrochemical Co., Ltd., trade name), 1032S (Yukaka Epoxy Co., Ltd.) , Trade name)], an epoxy resin having a naphthalene skeleton [HP-4032 (Dainippon Ink and Chemicals, Inc.,
Trade name)], alicyclic epoxy resin [EHPE-3150
(Daicel Chemical Industries, Ltd., trade name)], amine type epoxy resin [ELM-100 (Sumitomo Chemical Co., Ltd., trade name), YH-434L (Toto Kasei Co., Ltd., trade name), TE
TRAD-X, TETRAC-C (Mitsubishi Gas Chemical Co., Ltd.,
Product name)], resorcinol type epoxy resin [Denacol E
X-201 (Nagase Kasei Kogyo Co., Ltd., trade name)], neopentyl glycol type epoxy resin [Denacol EX-2
11 (Nagase Kasei Kogyo Co., Ltd., trade name)], hexanedine glycol type epoxy resin [Denacol EX-21
2 (Nagase Kasei Kogyo Co., Ltd., trade name)], ethylene / propylene glycol type epoxy resin [Denacol EX-8
10, 811, 850, 851, 821, 830, 83
2, 841, 861 (Nagase Kasei Kogyo Co., Ltd., trade name)] and general formula (IV)
【化７】 〔式中、ｎは０〜５の整数を表す〕で示されるエポキシ
樹脂〔Ｅ−ＸＬ−２４、Ｅ−ＸＬ−３Ｌ（三井東圧化学
(株）、商品名）〕などが挙げられる。これらのエポキ
シ樹脂を適宜組み合わせて用いることもできる。Embedded image [Wherein n represents an integer of 0 to 5] [E-XL-24, E-XL-3L (Mitsui Toatsu Chemicals, Inc.)
(Trade name)). These epoxy resins can be used in an appropriate combination.
【０００７】また、エポキシ樹脂として、１分子中にエ
ポキシ基を１個だけ有するエポキシ化合物（反応性希釈
剤）を含んでいてもよい。このようなエポキシ化合物
は、本発明の樹脂ペースト組成物の特性を阻害しない範
囲で使用されるが、エポキシ樹脂全量に対して０〜３０
重量％の範囲で使用することが好ましい。このようなエ
ポキシ化合物の市販品としては、ＰＧＥ（日本化薬
（株)、商品名）、ＰＰ−１０１（東都化成(株)、商品
名）、ＥＤ−５０２、５０９（旭電化工業(株)、商品
名）、ＹＥＤ−１２２（油化シェルエポキシ(株)、商品
名）、ＫＢＭ−４０３（信越化学工業(株)、商品名）、
ＴＳＬ−８３５０、ＴＳＬ−８３５５、ＴＳＬ−９９０
５（東芝シリコーン(株)、商品名）などが挙げられる。Further, the epoxy resin may contain an epoxy compound (reactive diluent) having only one epoxy group in one molecule. Such an epoxy compound is used in a range that does not impair the properties of the resin paste composition of the present invention.
It is preferable to use it in the range of weight%. Commercial products of such epoxy compounds include PGE (Nippon Kayaku Co., Ltd., trade name), PP-101 (Toto Kasei Co., Ltd., trade name), ED-502, 509 (Asahi Denka Kogyo Co., Ltd.) , YED-122 (Yukaka Epoxy Co., Ltd., trade name), KBM-403 (Shin-Etsu Chemical Co., Ltd., trade name),
TSL-8350, TSL-8355, TSL-990
5 (Toshiba Silicone Co., Ltd., trade name) and the like.
【０００８】本発明に（Ｂ）成分として用いられる硬化
剤としては、特に制限はないが、例えば、フェノールノ
ボラック樹脂〔Ｈ−１（明和化成工業(株)、商品名）、
ＶＲ−９３００（三井東圧化学(株)、商品名）〕、フェ
ノールアラルキル樹脂〔ＸＬ−２２５（三井東圧化学
(株)、商品名）〕、アリル化フェノールノボラック樹脂
〔ＡＬ−ＶＲ−９３００（三井東圧化学(株)、商品
名）〕、下記一般式（Ｖ）The curing agent used as the component (B) in the present invention is not particularly limited, and examples thereof include a phenol novolak resin [H-1 (Meiwa Kasei Kogyo Co., Ltd., trade name),
VR-9300 (Mitsui Toatsu Chemical Co., Ltd., trade name)], phenol aralkyl resin [XL-225 (Mitsui Toatsu Chemical)
Allylated phenol novolak resin [AL-VR-9300 (Mitsui Toatsu Chemical Co., Ltd., trade name)], the following general formula (V)
【化８】 〔式中、Ｒ4はメチル基、エチル基等のアルキル基を示
し、Ｒ5は水素又は炭化水素基を示し、ｍは２〜４の整
数を示す〕で表される特殊フェノール樹脂〔ＰＰ−７０
０−３００（日本石油化学(株)、商品名）〕、ジシアン
ジアミド、下記一般式（VI）Embedded image [Wherein R 4 represents an alkyl group such as a methyl group or an ethyl group, R 5 represents a hydrogen or hydrocarbon group, and m represents an integer of 2 to 4]. 70
0-300 (Nippon Petrochemical Co., Ltd., trade name)], dicyandiamide, the following general formula (VI)
【化９】 〔式中、Ｒ6はｍ−フェニレン基、ｐ−フェニレン基等
の２価の芳香族基、炭素数２〜１２の直鎖又は分岐鎖の
アルキレン基を示す〕で表される二塩酸ジヒドラジド
〔ＡＤＨ、ＰＤＨ、ＳＤＨ（日本ヒドラジン工業(株)、
商品名）〕、エポキシ樹脂とアミン化合物の反応物から
なるマイクロカプセル型硬化剤〔ノバキュア（旭化成工
業(株)、商品名）〕などが挙げられる。Embedded image [Wherein R 6 represents a divalent aromatic group such as an m-phenylene group or a p-phenylene group, or a linear or branched alkylene group having 2 to 12 carbon atoms] dihydrazide dihydrochloride [ ADH, PDH, SDH (Nippon Hydrazine Industry Co., Ltd.
Trade name)] and a microcapsule-type curing agent [Novacure (Asahi Kasei Kogyo Co., Ltd., trade name)] composed of a reaction product of an epoxy resin and an amine compound.
【０００９】硬化剤（Ｂ）の配合量は、エポキシ樹脂１
００重量部に対して０．０１〜９０重量部とするのが好
ましく、０．１〜５０重量部とすることがより好まし
い。硬化剤の配合量が０．０１重量部未満であると硬化
性が低下する傾向があり、９０重量部を超えると粘度が
上昇し、作業性が低下する傾向がある。The compounding amount of the curing agent (B) is as follows.
The amount is preferably 0.01 to 90 parts by weight, more preferably 0.1 to 50 parts by weight, based on 00 parts by weight. If the amount of the curing agent is less than 0.01 part by weight, the curability tends to decrease, and if it exceeds 90 parts by weight, the viscosity increases and the workability tends to decrease.
【００１０】本発明の樹脂ペースト組成物には、必要に
応じて硬化促進剤を添加することができる。硬化促進剤
としては、有機ボロン塩化合物〔ＥＭＺ・Ｋ、ＴＰＰＫ
（北興化学工業(株)、商品名）〕、三級アミン類又はそ
の塩〔ＤＢＵ、Ｕ−ＣＡＴ１０２、１０６、８３０、８
４０、５００２（サンアプロ社、商品名）〕、イミダゾ
ール類〔キュアゾール、２Ｐ４ＭＨＺ、Ｃ１７Ｚ、２Ｐ
Ｚ−ＯＫ（四国化成(株)、商品名）〕などが挙げられ
る。硬化剤及び必要に応じて添加される硬化促進剤は、
それぞれ単独で用いてもよく、また、複数種の硬化剤及
び硬化促進剤を適宜組み合わせて用いてもよい。硬化促
進剤の使用量は、エポキシ樹脂１００重量部に対して２
０重量部以下が好ましい。[0010] The resin paste composition of the present invention may optionally contain a curing accelerator. As a curing accelerator, organic boron salt compounds [EMZ · K, TPPK
(Hokuko Chemical Industry Co., Ltd., trade name)], tertiary amines or salts thereof [DBU, U-CAT 102, 106, 830, 8]
40, 5002 (San Apro Co., trade name)], imidazoles [Cureazole, 2P4MHZ, C17Z, 2P
Z-OK (Shikoku Chemicals Co., Ltd., trade name)] and the like. The curing agent and the curing accelerator added as necessary are
Each of them may be used alone, or a plurality of types of curing agents and curing accelerators may be used in appropriate combination. The amount of the curing accelerator used is 2 parts per 100 parts by weight of the epoxy resin.
0 parts by weight or less is preferred.
【００１１】本発明に（Ｃ）成分として用いられるフィ
ラーとしては、特に制限はなく、各種のものが用いられ
るが、例えば、金、銀、銅、ニッケル、鉄、アルミニウ
ム、ステンレス鋼等の導電性の粉体、酸化珪素、窒化硼
素、硼酸アルミニウム等の非導電性の粉体が挙げられ
る。フィラーの配合量は、特に限定されないが、樹脂ペ
ースト組成物の総量１００重量部に対して５〜９５重量
部とするのが好ましく、２０〜８０重量部とするのがよ
り好ましい。この配合量が５重量部未満であると、粘度
が低くなり作業性が低下する傾向があり、９５重量部を
超えると、逆に粘度が高くなり作業性が低下する傾向が
ある。The filler used as the component (C) in the present invention is not particularly limited, and various fillers may be used. For example, conductive fillers such as gold, silver, copper, nickel, iron, aluminum and stainless steel may be used. And non-conductive powders such as silicon oxide, boron nitride and aluminum borate. The amount of the filler is not particularly limited, but is preferably 5 to 95 parts by weight, more preferably 20 to 80 parts by weight, based on 100 parts by weight of the total amount of the resin paste composition. If the amount is less than 5 parts by weight, the viscosity tends to decrease and the workability tends to decrease. If the amount exceeds 95 parts by weight, the viscosity tends to increase and the workability tends to decrease.
【００１２】本発明に（Ｄ）成分として用いられる、一
般式（Ｉ）で表されるイソシアヌレート環構造を有する
エポキシ化合物としては、１分子中にエポキシ基を２個
以上有するものが好ましい。１分子中にエポキシ基が１
個である場合には、接着強度向上効果が充分でなく、樹
脂ペースト組成物の耐熱性が低下する傾向にある。この
エポキシ化合物（Ｄ）の配合量は、（Ａ）成分のエポキ
シ樹脂１００重量部に対して１０〜８０重量部であるこ
とが好ましく、２０〜７０重量部であることがより好ま
しい。この配合量が少なすぎると、接着性、耐リフロー
性が低下する傾向がある。多すぎると、弾性率が高くな
り、応力歪みが大きくなる傾向がある。The epoxy compound having an isocyanurate ring structure represented by the general formula (I) used as the component (D) in the present invention is preferably an epoxy compound having two or more epoxy groups in one molecule. One epoxy group in one molecule
In the case of individual pieces, the effect of improving the adhesive strength is not sufficient, and the heat resistance of the resin paste composition tends to decrease. The compounding amount of the epoxy compound (D) is preferably from 10 to 80 parts by weight, more preferably from 20 to 70 parts by weight, based on 100 parts by weight of the epoxy resin (A). If the amount is too small, the adhesiveness and reflow resistance tend to decrease. If it is too large, the elastic modulus tends to be high and the stress strain tends to be large.
【００１３】本発明の樹脂ペースト組成物には、ペース
ト組成物の作製時の作業性及び使用時の塗布作業性をよ
り良好ならしめるため、必要に応じて希釈剤を添加する
ことができる。これらの希釈剤としては、ブチルセロソ
ルブ、カルビトール、酢酸ブチルセロソルブ、酢酸カル
ビトール、エチレングリコールジエチルエーテル、α−
テルピネオール等の比較的沸点の高い有機溶剤が好まし
い。その使用量は、樹脂ペースト組成物１００重量部に
対して０〜３０重量部の範囲で使用することが好まし
い。A diluent can be added to the resin paste composition of the present invention, if necessary, in order to further improve the workability in preparing the paste composition and the workability in application during use. These diluents include butyl cellosolve, carbitol, butyl cellosolve acetate, carbitol acetate, ethylene glycol diethyl ether, α-
Organic solvents having a relatively high boiling point, such as terpineol, are preferred. It is preferable to use the amount in the range of 0 to 30 parts by weight based on 100 parts by weight of the resin paste composition.
【００１４】本発明の樹脂ペースト組成物には、さらに
必要に応じて酸化カルシウム、酸化マグネシウム等の吸
湿剤、その他のシランカップリング剤、チタンカップリ
ング剤等の接着力向上剤、ノニオン系界面活性剤、フッ
素系界面活性剤等の濡れ向上剤、シリコーン油等の消泡
剤、無機イオン交換体等のイオントラップ剤などを適宜
添加することができる。The resin paste composition of the present invention may further contain, if necessary, a hygroscopic agent such as calcium oxide and magnesium oxide, other adhesive improving agents such as a silane coupling agent and a titanium coupling agent, and a nonionic surfactant. Agents, wetting improvers such as fluorine-based surfactants, defoaming agents such as silicone oil, and ion trapping agents such as inorganic ion exchangers can be added as appropriate.
【００１５】本発明の樹脂ペースト組成物を製造するに
は、（Ａ）エポキシ樹、（Ｂ）硬化剤、（Ｃ）フィラー
及び（Ｄ）前記の式（Ｉ）で表されるイソシアヌレート
環構造を有するエポキシ化合物並びに必要に応じて添加
される希釈剤及び各種添加剤とともに、一括又は分割し
て攪拌器、らいかい器、３本ロール、プラネタリーミキ
サー等の分散・溶解装置を適宜組み合わせた装置に投入
し、必要に応じて加熱して混合、溶解、解粒混練又は分
散して均一なペースト状とすればよい。In order to produce the resin paste composition of the present invention, (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) an isocyanurate ring structure represented by the above formula (I) Appropriately combined with a dispersing / dissolving device such as a stirrer, a grinder, a three-roller, a planetary mixer or the like together with an epoxy compound having the above, and a diluent and various additives added as necessary. And, if necessary, heating to mix, dissolve, pulverize and knead or disperse to form a uniform paste.
【００１６】本発明においては、さらに、上記のように
して製造した樹脂ペースト組成物を用いて半導体素子と
基板とを接着した後、封止することにより半導体装置と
することがてきる。本発明の樹脂ペースト組成物を用い
て半導体素子をリードフレーム等の支持部材に接着させ
るには、まず、支持部材上に樹脂ペースト組成物をディ
スペンス法、スクリーン印刷法、スタンピング法などに
より塗布した後、半導体素子を圧着し、その後オーブ
ン、ヒートブロック等の加熱装置を用いて加熱硬化する
ことにより行うことができる。さらに、ワイヤボンド工
程を経た後、通常の方法により封止することにより完成
された半導体装置とすることができる。In the present invention, a semiconductor device can be obtained by bonding a semiconductor element and a substrate using the resin paste composition produced as described above and then sealing the semiconductor element and the substrate. In order to adhere a semiconductor element to a support member such as a lead frame using the resin paste composition of the present invention, first, after applying the resin paste composition on the support member by a dispensing method, a screen printing method, a stamping method, or the like. This can be performed by press-bonding a semiconductor element and then heating and hardening using a heating device such as an oven or a heat block. Further, after a wire bonding step, the semiconductor device is sealed by a usual method, whereby a completed semiconductor device can be obtained.
【００１７】[0017]
【実施例】次に、実施例により本発明を詳細に説明する
が、本発明はこれによって制限されるものではない。な
お、以下の実施例及び比較例で用いた材料は、下記の方
法で作製したもの、あるいは入手したものである。Next, the present invention will be described in detail with reference to examples, but the present invention is not limited thereto. The materials used in the following Examples and Comparative Examples were produced by the following method or obtained.
【００１８】（１）エポキシ樹脂の調製 ＹＤＦ−１７０（東都化成(株)製のビスフェノールＦ型
エポキシ樹脂の商品名、エポキシ当量＝１７０）７．５
重量部及びＹＬ−９８０（油化シェルエポキシ(株)製ビ
スフェノールＡ型エポキシ樹脂の商品名、エポキシ当量
＝１８５）７．５重量部を８０℃に加熱し、１時間攪拌
を続け、均一なエポキシ樹脂溶液を得た。 （２）硬化剤の調製 Ｈ−１（明和化成(株)製フェノールノボラック樹脂の商
品名、水酸基当量＝１０６）１．０重量部及び希釈剤と
してＰＰ−１０１（東都化成(株)製アルキルフェニルグ
リシジルエーテルの商品名、エポキシ当量＝２３０）
２．０重量部を１００℃に加熱し、１時間攪拌を続け、
均一なフェノール樹脂溶液を得た。(1) Preparation of Epoxy Resin YDF-170 (trade name of bisphenol F type epoxy resin manufactured by Toto Kasei Co., Ltd., epoxy equivalent = 170) 7.5
Parts by weight and 7.5 parts by weight of YL-980 (trade name of bisphenol A type epoxy resin manufactured by Yuka Shell Epoxy Co., Ltd., epoxy equivalent = 185) was heated to 80 ° C., and stirring was continued for 1 hour to obtain a homogeneous epoxy resin. A resin solution was obtained. (2) Preparation of curing agent 1.0 part by weight of H-1 (trade name of phenol novolak resin manufactured by Meiwa Kasei Co., Ltd., hydroxyl equivalent = 106) and PP-101 as a diluent (alkylphenyl manufactured by Toto Kasei Co., Ltd.) (Product name of glycidyl ether, epoxy equivalent = 230)
2.0 parts by weight was heated to 100 ° C. and stirring was continued for 1 hour,
A homogeneous phenolic resin solution was obtained.
【００１９】（３）硬化促進剤 ２Ｐ４ＭＨＺ（四国化成(株)製のイミダゾール化合物の
商品名）である。 （４）フィラー ＴＣＧ−１（徳力化学研究所(株)製、銀粉の商品名）で
ある。 （５）前記の式（Ｉ）で表されるイソシアヌレート環構
造を有するエポキシ化合物 ＥＸ−３０１（ナガセ化学工業(株)製、商品名）であ
る。(3) Curing accelerator 2P4MHZ (trade name of imidazole compound manufactured by Shikoku Chemicals Co., Ltd.). (4) Filler TCG-1 (trade name of silver powder, manufactured by Tokuriki Chemical Laboratory Co., Ltd.). (5) An epoxy compound EX-301 (trade name, manufactured by Nagase Chemical Industry Co., Ltd.) having an isocyanurate ring structure represented by the formula (I).
【００２０】実施例１〜２及び比較例１〜２ 表１に示す配合割合で上記のエポキシ樹脂、上記の硬化
剤、硬化促進剤、希釈剤としてＰＰ−１０１、フィラー
及びイソシアヌレート環構造を有するエポキシ化合物を
混合し、３本ロールを用いて混練した後、５トル（Tor
r）以下で１０分間脱泡処理を行い、樹脂ペースト組成
物を得た。この樹脂ペースト組成物の特性（粘度、剪断
接着強度、ピール強度及び耐リフロー性）を下記の方法
で測定し、結果を表１に示す。Examples 1-2 and Comparative Examples 1-2 The above epoxy resin, the above-mentioned curing agent, curing accelerator, PP-101 as a diluent, filler and isocyanurate ring structure in the proportions shown in Table 1. The epoxy compound was mixed and kneaded using three rolls, and then 5 torr (Tor
r) A defoaming treatment was performed for 10 minutes below to obtain a resin paste composition. The properties (viscosity, shear adhesion strength, peel strength and reflow resistance) of this resin paste composition were measured by the following methods, and the results are shown in Table 1.
【００２１】 粘度 ＥＨＤ型回転粘度計（東京計器社製）を用いて２５℃に
おける粘度（Pa・s）を測定した。 剪断接着強度 樹脂ペースト組成物を銅リードフレーム上に約２００μ
ｇ塗布し、この上に２mm×２mmのＳｉチップ（厚さ約
０．４mm）を圧着し、さらに１８０℃まで３０分で昇温
し、１８０℃で２時間加熱して硬化し、接着した。これ
を自動接着力試験装置（ＢＴ１００、Dage社製）を用
い、室温における剪断接着強度（kg／チップ）を測定し
た。Viscosity The viscosity (Pa · s) at 25 ° C. was measured using an EHD type rotational viscometer (manufactured by Tokyo Keiki Co., Ltd.). Shear bond strength Resin paste composition is coated on a copper lead frame to about 200μ.
g, and a 2 mm × 2 mm Si chip (thickness: about 0.4 mm) was crimped thereon, heated to 180 ° C. in 30 minutes, heated at 180 ° C. for 2 hours, cured, and bonded. The shear adhesive strength (kg / chip) at room temperature was measured using an automatic adhesive strength tester (BT100, manufactured by Dage).
【００２２】 ピール強度 樹脂ペースト組成物を銅リードフレーム上に約３．２mg
塗布し、この上に８mm×８mmのＳｉチップ（厚さ約０．
４mm）を圧着し、さらに１８０℃まで３０分で昇温し、
１８０℃で２時間加熱して硬化し、接着した。これを自
動接着力試験装置（日立化成工業(株)製）を用い、２４
０℃における引き剥がし強さ（kg／チップ）を測定し
た。Peel Strength About 3.2 mg of the resin paste composition is placed on a copper lead frame.
8 mm × 8 mm Si chip (approximately 0.
4mm), and heated to 180 ° C in 30 minutes.
It was cured by heating at 180 ° C. for 2 hours and bonded. Using an automatic adhesion tester (manufactured by Hitachi Chemical Co., Ltd.),
The peel strength at 0 ° C. (kg / chip) was measured.
【００２３】 耐リフロー性 上記実施例及び比較例により得た樹脂ペースト組成物を
用い、銅リードフレームと８mm×１０mmのＳｉチップ
（厚さ約０．４mm）を、１８０℃まで３０分で昇温し、
１８０℃で２時間加熱して硬化し、接着した。その後、
日立化成工業(株)製エポキシ封止材（商品名ＣＥＬ−４
６２０）により封止し、半田リフロー試験用パッケージ
（ＱＦＰ、大きさ１４mm×２０mm×２mm）を得た。同じ
試験用パッケージを５個作製した。各パッケージを温度
及び湿度がそれぞれ８５℃及び８５％の条件に設定され
た恒温恒湿槽中に７２時間放置し、吸湿させた。その
後、２４０℃／１０秒のリフロー条件で半田リフローを
行い、パッケージの外部クラックの発生数を顕微鏡（倍
率１５倍）で観察した。クラックの発生したパッケージ
数を示す。Using the resin paste compositions obtained in the above Examples and Comparative Examples, a copper lead frame and a 8 mm × 10 mm Si chip (about 0.4 mm thick) were heated to 180 ° C. in 30 minutes. And
It was cured by heating at 180 ° C. for 2 hours and bonded. afterwards,
Epoxy encapsulant (CEL-4, manufactured by Hitachi Chemical Co., Ltd.)
620) to obtain a solder reflow test package (QFP, size: 14 mm × 20 mm × 2 mm). Five identical test packages were produced. Each package was left in a thermo-hygrostat set at a temperature and a humidity of 85 ° C. and 85%, respectively, for 72 hours to absorb moisture. Thereafter, solder reflow was performed under reflow conditions of 240 ° C./10 seconds, and the number of external cracks generated in the package was observed with a microscope (magnification: 15). Shows the number of cracked packages.
【００２４】[0024]
【表１】 [Table 1]
【００２５】表１に示した結果から、比較例１及び２で
は、剪断接着強度及びピール強度が低く、耐リフロー性
に関しても全てのパッケージに外部クラックが発生し、
半導体装置の信頼性は低いが、それに対して実施例１及
び２に示した本発明の樹脂ペースト組成物を用いた場合
は、剪断接着強度及びピール強度が高く、パッケージの
外部クラックの発生も抑制され、信頼性の高いパッケー
ジが得られることが確認された。From the results shown in Table 1, in Comparative Examples 1 and 2, the shear bond strength and peel strength were low, and external cracks were generated in all the packages with respect to reflow resistance.
Although the reliability of the semiconductor device is low, when the resin paste composition of the present invention shown in Examples 1 and 2 is used, the shear adhesive strength and the peel strength are high, and the occurrence of external cracks in the package is suppressed. It was confirmed that a highly reliable package was obtained.
【００２６】[0026]
【発明の効果】本発明の樹脂ペースト組成物は、半導体
装置のダイボンディング材として使用した場合に、接着
性に優れ、半田リフロー時のペースト層の剥離を抑える
ことができ、リフロークラックの発生を低減できる。ま
た、本発明の半導体装置は、本発明になる樹脂ペースト
組成物を使用しているため、信頼性に優れる。The resin paste composition of the present invention, when used as a die bonding material for a semiconductor device, has excellent adhesiveness, can suppress peeling of the paste layer during solder reflow, and can prevent the occurrence of reflow cracks. Can be reduced. Further, the semiconductor device of the present invention is excellent in reliability because the resin paste composition according to the present invention is used.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4J002 CC043 CD011 CD021 CD031 CD041 CD051 CD061 CD071 CD131 CD142 CE003 DA076 DA086 DA096 DC006 DJ016 DK006 EQ027 ET007 FD016 FD143 FD147 GQ00 4J036 AA01 AA02 AA06 AB16 AD01 AF01 DA05 DC05 DC31 DC35 DC41 FA02 FA05 FA06 FB06 FB08 GA06 JA07 5F047 AA11 AA17 BA23 BA34 BB11 BB16 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4J002 CC043 CD011 CD021 CD031 CD041 CD051 CD061 CD071 CD131 CD142 CE003 DA076 DA086 DA096 DC006 DJ016 DK006 EQ027 ET007 FD016 FD143 FD147 GQ00 4J036 AA01 AA02 AA05 DC05 AF01 DC05 FA06 FB06 FB08 GA06 JA07 5F047 AA11 AA17 BA23 BA34 BB11 BB16
Claims (3)
（Ｃ）フィラー及び（Ｄ）下記の式（Ｉ） 【化１】 〔式中、Ｒ1、Ｒ2及びＲ3はそれぞれ独立に水素、式（I
I） 【化２】 又は式（III） 【化３】 （ただし、ｎは１〜５の整数を示す）で示される基を表
し、Ｒ1、Ｒ2及びＲ3のうち少なくとも１個は水素でな
いものとする〕で表されるイソシアヌレート環構造を有
するエポキシ化合物を含有してなる樹脂ペースト組成
物。(1) an epoxy resin, (B) a curing agent,
(C) filler and (D) the following formula (I): Wherein R 1 , R 2 and R 3 are each independently hydrogen,
I) Or formula (III): (Where n represents an integer of 1 to 5, and at least one of R 1 , R 2 and R 3 is not hydrogen) having an isocyanurate ring structure represented by the following formula: A resin paste composition containing an epoxy compound.
重量部に対して１０〜８０重量部である請求項１記載の
樹脂ペースト組成物。2. The compounding amount of the component (D) is 100% of the component (A).
The resin paste composition according to claim 1, wherein the amount is 10 to 80 parts by weight based on parts by weight.
いて半導体素子を支持部材に接着した後、封止してなる
半導体装置。3. A semiconductor device comprising a semiconductor element bonded to a support member using the resin paste composition according to claim 1, and then sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11029889A JP2000226432A (en) | 1999-02-08 | 1999-02-08 | Resin paste composition and semiconductor device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11029889A JP2000226432A (en) | 1999-02-08 | 1999-02-08 | Resin paste composition and semiconductor device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000226432A true JP2000226432A (en) | 2000-08-15 |
Family
ID=12288547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11029889A Pending JP2000226432A (en) | 1999-02-08 | 1999-02-08 | Resin paste composition and semiconductor device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000226432A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002241473A (en) * | 2001-02-16 | 2002-08-28 | Taiyo Ink Mfg Ltd | Thermosetting epoxy resin composition and its molding and multilayer printed wiring board |
| JP2005008669A (en) * | 2003-06-16 | 2005-01-13 | Sumitomo Bakelite Co Ltd | Adhesive for semiconductor device, semiconductor device and display using the same |
| JP2015227390A (en) * | 2014-05-30 | 2015-12-17 | 京セラケミカル株式会社 | Resin composition for encapsulating optical semiconductor and optical semiconductor device |
| CN108350146A (en) * | 2015-11-10 | 2018-07-31 | 日产化学工业株式会社 | The composition epoxy resin of alkyl is stretched containing long-chain |
-
1999
- 1999-02-08 JP JP11029889A patent/JP2000226432A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002241473A (en) * | 2001-02-16 | 2002-08-28 | Taiyo Ink Mfg Ltd | Thermosetting epoxy resin composition and its molding and multilayer printed wiring board |
| JP2005008669A (en) * | 2003-06-16 | 2005-01-13 | Sumitomo Bakelite Co Ltd | Adhesive for semiconductor device, semiconductor device and display using the same |
| JP2015227390A (en) * | 2014-05-30 | 2015-12-17 | 京セラケミカル株式会社 | Resin composition for encapsulating optical semiconductor and optical semiconductor device |
| CN108350146A (en) * | 2015-11-10 | 2018-07-31 | 日产化学工业株式会社 | The composition epoxy resin of alkyl is stretched containing long-chain |
| CN108350146B (en) * | 2015-11-10 | 2021-03-16 | 日产化学工业株式会社 | Epoxy resin composition containing long-chain alkylene group |
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