JP2000269610A - Printed board and measuring device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely know the inductance value of a slave printed board. SOLUTION: A slave printed board 12 having a high frequency circuit where inductance is formed by a print pattern and a master printed board 11 where the plural slave printed boards 12 are connected and are integrally formed, are installed. A reference pattern 14, having a correlation with the value of inductance formed in the slave printed board 12 is arranged in the non-forming part of the slave printed board 12. Thus, the value of the inductance of the slave printed board 12 can be know precisely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mainly used for high frequency equipment and a measuring apparatus for the printed circuit board.

[0002]

2. Description of the Related Art A conventional printed circuit board will be described below. A conventional printed circuit board is as shown in FIG. That is, a plurality of child printed circuit boards 2 are provided in the parent printed circuit board 1 in a connected manner. The sub printed board 2 has a resonance circuit 5 including an inductance 3 and a capacitor 4 formed in a printed pattern as shown in FIG. 8, for example, and an oscillation circuit 6 connected to the resonance circuit 5.
Was provided. The oscillation frequency of the oscillation circuit 6 is substantially determined by the inductance 3 and the capacitor 4.

FIG. 9 shows details of the inductance 3. In FIG. 9, the inductance 3 includes a first inductance 7 formed by a thin line portion and a second inductance 7 formed by a thick line portion.
And the inductance 8. Then, the second inductance 8 formed by the thick line portion is cut 9 by a laser to adjust the inductance 8. By adjusting the inductance 8, the oscillation frequency of the oscillation circuit 6 is adjusted.

[0004]

In the conventional configuration, the width 7A of the pattern of the inductance 7 in the thin wire portion is 0.2 mm.
On the other hand, the etching accuracy of the pattern is ±
It was 20 μm. It is about 10 between the width 7A of the pattern of the inductance 7 of the thin line portion and the etching accuracy of the pattern.
The effect of etching accuracy was small. However, with the recent miniaturization, the width 7A of the pattern of the inductance 7 in the thin wire portion has to be set to about 0.1 mm.

For this reason, the relationship with the etching accuracy is about five times, and the influence on the oscillation frequency is large, and it cannot be ignored. For this reason, there has been a case where correction cannot be performed if the value of the capacitor 4 is the same.

Actually, the width 7A of the inductance pattern of the thin wire portion is measured, and the value of the capacitor 4 is determined according to the pattern width. However, the pattern of the inductance 7 in the thin wire portion is generally coated with resist ink in order to prevent a short circuit with other components or the like, and it is difficult to measure accurately.

The present invention has been made to solve this problem, and has as its object to accurately know the inductance value of a child printed circuit board.

[0008]

In order to achieve this object, a printed circuit board according to the present invention comprises a printed circuit board having a high-frequency circuit in which an inductance is formed by a printed pattern, and a plurality of such printed circuit boards connected to each other. And a reference pattern having a correlation with the value of the inductance formed on the child printed circuit board in a portion of the parent printed circuit board where the child printed circuit board is not formed. Things. Thereby, the inductance of the child printed circuit board can be accurately known.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a child printed board having a high-frequency circuit in which an inductance is formed by a printed pattern, and a plurality of the child printed boards are connected and integrally formed. A printed circuit board comprising a master printed circuit board and a reference pattern having a correlation with a value of the inductance formed on the slave printed circuit board in a portion of the master printed board where the slave printed circuit board is not formed. As described above, by measuring the inductance of the reference pattern having a correlation with the inductance formed on the daughter printed board, the inductance in the daughter printed board can be accurately and easily known.

According to a second aspect of the present invention, the value of the inductance of the reference pattern is larger than the value of the inductance formed on the daughter printed board. Since the inductance is larger than the inductance of the daughter printed board, the measurement error is reduced, and measurement with less error can be easily performed.

According to a third aspect of the present invention, there is provided the printed circuit board according to the second aspect, wherein the reference pattern is formed in a zigzag shape. it can.

According to a fourth aspect of the present invention, there is provided the printed circuit board according to the first aspect, wherein a plurality of reference patterns are provided at different positions of the parent printed circuit board. The inductance of the child printed circuit board near the reference pattern can be measured more accurately. As a result, it is possible to measure the variation in etching due to the difference in the position of the child printed circuit board connected to the parent printed circuit board, and reflect it in the determination of the capacitor value.

According to a fifth aspect of the present invention, there is provided the printed circuit board according to the second aspect, wherein contact lands are provided at both ends of the reference pattern. Can be easily connected.

According to a sixth aspect of the present invention, there is provided the printed circuit board according to the first aspect, wherein a multilayer board is used as a printed board, and a reference pattern is provided on an inner layer of the multilayer board. The first layer has a pattern for recognition that is used in a device for mounting components or for dividing a child printed circuit board from a parent printed circuit board. Can be easily provided.

According to a seventh aspect of the present invention, there is provided a printed circuit board measuring apparatus for measuring a resistance value of the reference pattern by connecting a digital resistance measuring device to a contact land of the reference pattern of the printed circuit board according to the fifth aspect. Since the reference pattern is larger than the pattern inductance of the child printed circuit board, a digital resistance measurement device is connected to the outside through the contact lands of the reference pattern, and the conductor resistance value of the reference pattern is measured indirectly. Can be measured.

According to an eighth aspect of the present invention, an oscillation circuit connected to the inductance of the reference pattern of the printed circuit board is provided outside the printed circuit board, and the oscillation frequency of the oscillation circuit is measured by a digital frequency counter. This is an apparatus for measuring a printed circuit board, in which the oscillation frequency of the oscillation circuit can be easily read by a digital frequency counter, and the inductance of the child printed circuit board can be measured indirectly.

An embodiment of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 is a plan view of a printed circuit board according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 11 denotes a parent printed circuit board, on which a plurality of child printed circuit boards 12 are connected and provided. In the present embodiment, nine child printed boards 12 are provided horizontally and twelve vertically, so that 108 child printed boards 12 can be obtained from one parent printed board 11.

Reference numeral 13 denotes a hole used when mounting electric components on the parent printed circuit board 11. In addition, the resonance circuit 5 and the inductance 7 formed in a pattern as described in the section of the related art are formed in the daughter printed board 12. Reference numeral 14 denotes a reference pattern, which is provided in the vicinity of the side surface on the parent substrate 11 and in the portion where the child printed circuit board 12 is not formed.

Although the inductance of the reference pattern 14 depends on the resonance frequency of the oscillator of the daughter printed circuit board 12, it is several to several tens times as large as the inductance of the inductance 7, so that the measurement error can be reduced and the inductance 7 can be easily reduced by the present invention. The value of the inductance can be measured indirectly.

(Embodiment 2) The reference pattern 14 is provided in one place in the parent printed circuit board 11 in FIG. 1, but may be provided on each of four sides as shown in FIG. By doing so, the reference pattern 1 provided on the surface facing the reference pattern 14 provided on the parent printed circuit board 11
By providing the reference pattern 4a or the reference pattern 14b and the reference pattern 14c provided on the surface adjacent to the reference pattern 14, the inductance in the sub-printed circuit board 12 can be grasped more accurately.

The reference pattern 14 has a zigzag shape as shown in FIG. 2, and contact lands 15 are provided at both ends. As a result, the contact land 15 can be easily connected to another external device,
The value of the inductance can be measured. Further, since the shape is a zigzag shape, a large inductance value can be obtained with a small area. In the present embodiment, the length is 5 cm, and the width of the pattern is
Pattern width.

(Embodiment 3) FIG.
In this case, a reference pattern 21 is provided in an inner layer, and a contact land 23 is provided on the upper surface of the multilayer substrate 20 through a through hole 22. Thus, the size of the substrate can be reduced. Also, a land for component mounting and a recognition pattern for dividing the substrate can be formed on the first layer.

(Embodiment 4) FIG. 5 shows an indirect connection by connecting a digital resistance meter 16 to the contact lands 15 of the parent printed circuit board 11 and reading the resistance value of the reference pattern 14 with the digital resistance meter 16. Then, the value of the inductance 7 formed on the child printed circuit board 12 can be known.

(Embodiment 5) FIG.
An oscillation circuit 17 is connected to one contact land 15, and a frequency counter 18 is connected to the output of the oscillation circuit 17. As described above, since the value of the inductance of the reference pattern 14 is once converted into the frequency by the oscillation circuit 17, the oscillation frequency obtained from the inductance of the child printed circuit board 12 can be indirectly known.

[0026]

As described above, according to the present invention, the reference pattern having a correlation with the value of the inductance formed on the child printed circuit board is provided in the portion of the parent printed circuit board where the child printed circuit board is not formed. By measuring the inductance of the reference pattern having a correlation with the inductance formed on the child printed circuit board, the inductance in the child printed circuit board can be accurately and easily known.

[Brief description of the drawings]

FIG. 1 is a plan view of a printed circuit board according to a first embodiment of the present invention.

FIG. 2 is a plan view of a reference pattern provided in a printed circuit board.

FIG. 3 is a plan view of a printed circuit board according to the second embodiment.

FIG. 4 is a sectional view of a principal part of a printed circuit board according to Embodiment 3;

FIG. 5 is a connection diagram of a measuring device on a printed circuit board according to a fourth embodiment of the present invention.

FIG. 6 is a connection diagram of a measuring device on a printed circuit board according to the fifth embodiment.

FIG. 7 is a plan view of a conventional printed circuit board.

FIG. 8 is a circuit diagram of an oscillation circuit formed on a conventional printed circuit board.

FIG. 9 is a plan view of an inductance forming an oscillation circuit.

[Explanation of symbols]

 11 Parent printed circuit board 12 Child printed circuit board 14 Reference pattern

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E338 AA03 BB31 BB42 CC01 CC09 CD11 CD32 EE32 EE33 5E344 AA05 BB01 BB06 CC05 DD19 EE06 5E346 AA15 AA60 BB01 BB02 BB16 GG32 GG34 HH31

Claims (8)

[Claims] 1. A child printed circuit board having a high-frequency circuit in which an inductance is formed by a printed pattern, and a parent printed circuit board formed by integrally connecting a plurality of the child printed circuit boards. A printed circuit board provided with a reference pattern having a correlation with a value of the inductance formed on the daughter printed circuit board in a non-formed portion of the printed circuit board. 2. The value of the inductance of the reference pattern is:
The printed circuit board according to claim 1, wherein the value is larger than the value of the inductance formed on the daughter printed circuit board. 3. The printed circuit board according to claim 2, wherein the reference pattern has a zigzag shape. 4. The printed circuit board according to claim 1, wherein a plurality of reference patterns are provided at different positions on the parent printed circuit board. 5. The printed circuit board according to claim 2, wherein contact lands are provided at both ends of the reference pattern. 6. The printed board according to claim 1, wherein a multilayer board is used as the printed board, and a reference pattern is provided on an inner layer of the multilayer board. 7. A printed circuit board measuring apparatus for measuring a resistance value of the reference pattern by connecting a digital resistance measuring device to a contact land of the reference pattern of the printed circuit board according to claim 5. 8. An apparatus for measuring a printed circuit board, wherein an oscillation circuit connected to the inductance of the reference pattern of the printed circuit board according to claim 5 is provided outside the parent printed circuit board, and the oscillation frequency of the oscillation circuit is measured by a digital frequency counter. .