JP2000263603A - Resin molding machine and method for releasing molding from mold - Google Patents
Resin molding machine and method for releasing molding from moldInfo
- Publication number
- JP2000263603A JP2000263603A JP11072861A JP7286199A JP2000263603A JP 2000263603 A JP2000263603 A JP 2000263603A JP 11072861 A JP11072861 A JP 11072861A JP 7286199 A JP7286199 A JP 7286199A JP 2000263603 A JP2000263603 A JP 2000263603A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- air flow
- flow path
- cavity
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂成形装置及び
成形品の離型方法に関し、特に、樹脂封止型半導体装置
の製造に用いられる樹脂成形装置及び成形品の離型方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus and a method for releasing a molded article, and more particularly to a resin molding apparatus and a method for releasing a molded article used for manufacturing a resin-sealed semiconductor device.
【０００２】[0002]
【従来の技術】一般に、樹脂封止型半導体装置は、リー
ドフレームのダイパッド上に半導体素子を搭載し、その
半導体素子の外周に、略放射状に配置されたリードと半
導体素子の電極とをワイヤで接続し、樹脂成形装置を用
いて半導体素子等を樹脂で封止した構造をしている。2. Description of the Related Art In general, in a resin-encapsulated semiconductor device, a semiconductor element is mounted on a die pad of a lead frame, and the leads and the electrodes of the semiconductor element are arranged on the outer periphery of the semiconductor element by wires. The structure is such that the semiconductor elements and the like are sealed with a resin using a resin molding device.
【０００３】図３はこのような樹脂封止型半導体装置の
製造に用いられる従来の樹脂成形装置を示す断面図であ
る。この従来の樹脂成形装置（以下、従来例１という）
は、上側金型２０と下側金型２１とを有し、半導体素子
２２を搭載しワイヤで接続されたリードフレーム２３を
上側金型２０と下側金型２１との間に設置し、キャビテ
ィ２４内に樹脂２５を注入することにより成形する。成
形中、下側金型２１に設けられたエジェクトピン２６は
下方の位置に下がって待機している（図３（Ａ）参
照）。FIG. 3 is a sectional view showing a conventional resin molding apparatus used for manufacturing such a resin-encapsulated semiconductor device. This conventional resin molding apparatus (hereinafter referred to as Conventional Example 1)
Has an upper mold 20 and a lower mold 21, a semiconductor element 22 is mounted thereon, and a lead frame 23 connected by wires is installed between the upper mold 20 and the lower mold 21 to form a cavity. Molding is performed by injecting a resin 25 into the inside 24. During molding, the eject pin 26 provided on the lower mold 21 is lowered to a lower position and is on standby (see FIG. 3A).
【０００４】次いで、温度が下がり樹脂２５が硬化した
後、上側金型２０を上昇させ、成形品２７から離脱させ
る（図３（Ｂ）参照）。Then, after the temperature is lowered and the resin 25 is cured, the upper mold 20 is raised and separated from the molded article 27 (see FIG. 3B).
【０００５】次いで、エジェクトピン２０を押し上げ
て、成形品２７を突き上げて成形品２７を下側金型２１
から離脱させる（図３（Ｃ）参照）。Then, the eject pin 20 is pushed up, the molded product 27 is pushed up, and the molded product 27 is moved to the lower mold 21.
(See FIG. 3C).
【０００６】また、例えば特開平３−１９３４２７号公
報には、上側金型及び下側金型に圧縮空気が流れる空気
流路を形成し、キャビティ内に空気流路を介して圧縮空
気を送り込むことにより成形品を離型する樹脂成形装置
（以下、従来例２という）が開示されている。[0006] For example, Japanese Patent Application Laid-Open No. 3-193427 discloses a method in which an air flow path through which compressed air flows is formed in an upper mold and a lower mold, and compressed air is fed into the cavity through the air flow path. Discloses a resin molding apparatus (hereinafter, referred to as Conventional Example 2) for releasing a molded article from the mold.
【０００７】[0007]
【発明が解決しようとする課題】従来例１の樹脂成形装
置では、エジェクトピンの押し上げ時の圧力で、半導体
素子やパッケージにストレスが加えられるため、特に薄
型パッケージの成形品の場合、成形品にクラックが発生
するという課題がある。In the resin molding apparatus of Conventional Example 1, stress is applied to the semiconductor element and the package by the pressure at the time of pushing up the eject pin. There is a problem that cracks occur.
【０００８】また、従来例２の樹脂成形装置では、エジ
ェクトピンを用いることなく離型できるので上記の課題
はないが、圧縮空気により金型から成形品が不意に飛び
出し、成形品が破損するおそれがあるという課題があ
る。In the resin molding apparatus of the prior art 2, since the mold can be released without using an eject pin, the above problem does not occur. However, the molded article may suddenly jump out of the mold due to the compressed air, and the molded article may be damaged. There is a problem that there is.
【０００９】本発明は、上記課題を解決するためになさ
れたものであり、離型時における成形品のクラックの発
生を防止でき、金型から成形品を確実に離型することが
できる樹脂成形装置及び成形品の離型方法を提供するこ
とを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to prevent the occurrence of cracks in a molded product at the time of mold release, and to reliably release the molded product from a mold. It is an object of the present invention to provide an apparatus and a method for releasing a molded product.
【００１０】[0010]
【課題を解決するための手段】本発明の第１の樹脂成形
装置は、一対の金型を有し、その金型のキャビティ内に
樹脂を注入することにより成形品を成形する樹脂成形装
置において、少なくとも一方の金型にキャビティと連通
する空気流路が形成され、その空気流路を介して成形品
を真空吸着するとともに、空気流路を介して圧縮空気を
導入して成形品を離脱させる、ことを特徴とするもので
ある。According to a first aspect of the present invention, there is provided a resin molding apparatus having a pair of molds, and molding a molded product by injecting a resin into a cavity of the mold. An air flow path communicating with the cavity is formed in at least one of the molds, vacuum-adsorbs the molded article through the air flow path, and introduces compressed air through the air flow path to release the molded article. It is characterized by the following.
【００１１】本発明の第２の樹脂成形装置は、上側金型
及び下側金型を有し、上側金型及び下側金型のキャビテ
ィ内に樹脂を注入することにより成形品を成形する樹脂
成形装置において、上側金型にキャビティの上部と連通
する空気流路が形成され、その空気流路を介して成形品
を真空吸着するとともに、空気流路を介して圧縮空気を
導入して成形品を離脱させる、ことを特徴とするもので
ある。A second resin molding apparatus according to the present invention has an upper mold and a lower mold, and forms a molded article by injecting the resin into the cavities of the upper mold and the lower mold. In the molding apparatus, an air flow passage communicating with the upper part of the cavity is formed in the upper mold, and the molded product is vacuum-adsorbed through the air flow passage and compressed air is introduced through the air flow passage to form the molded product. Is released.
【００１２】空気流路はキャビティの複数の箇所と連通
していてもよい。The air passage may communicate with a plurality of locations in the cavity.
【００１３】空気流路とキャビティとの連通部分に、空
気流路内の開閉切換を行うバルブが設けられているのが
好ましい。It is preferable that a valve for switching between opening and closing of the air flow path is provided at a communication portion between the air flow path and the cavity.
【００１４】本発明の第１の成形品の離型方法は、一対
の金型のキャビティ内に樹脂を注入することにより成形
した成形品を離型する成形品の離型方法において、少な
くとも一方の金型に形成されキャビティと連通する空気
流路を介して成形品を真空吸着して、他方の金型から離
脱させる工程と、空気流路を介して圧縮空気を導入して
成形品を一方の金型から離脱させる工程と、を有するこ
とを特徴とするものである。The first method of releasing a molded product according to the present invention is directed to a method of releasing a molded product by releasing a molded product by injecting a resin into a cavity of a pair of molds. A step of vacuum-sucking the molded article through an air flow path formed in the mold and communicating with the cavity, and separating the molded article from the other mold; and introducing compressed air through the air flow path to form the molded article on one side. Separating from the mold.
【００１５】本発明の第２の成形品の離型方法は、上側
金型及び下側金型のキャビティ内に樹脂を注入すること
により成形した成形品を離型する成形品の離型方法にお
いて、上側金型に形成されキャビティの上部と連通する
空気流路を介して成形品を真空吸着して、下側金型から
離脱させる工程と、空気流路を介して圧縮空気を導入し
て成形品を上側金型から離脱させる工程と、を有するこ
とを特徴とするものである。The second method for releasing a molded product according to the present invention relates to a method for releasing a molded product from a molded product by injecting a resin into a cavity of an upper mold and a lower mold. A step of vacuum-sucking the molded product through an air flow path formed in the upper mold and communicating with the upper part of the cavity, and separating the molded product from the lower mold; and introducing compressed air through the air flow path to form the molded product. Removing the article from the upper mold.
【００１６】本発明によれば、空気流路を介して一方の
金型に成形品を真空吸着した状態で他方の金型から離脱
させ、空気流路を介して圧縮空気を導入して一方の金型
から成形品を離脱させる。According to the present invention, the molded article is released from the other mold while being vacuum-adsorbed to one of the molds via the air flow path, and compressed air is introduced through the air flow path to introduce the compressed air into the other mold. The molded product is removed from the mold.
【００１７】[0017]
【発明の実施の形態】以下、本発明の実施の形態を図１
及び図２を参照しながら説明する。図１は、本発明の第
１の実施の形態に係る樹脂成形装置を示す断面図であ
る。なお、本発明の樹脂成形装置は、例えば樹脂封止型
半導体装置の製造に用いられるが、他の成形品の製造の
ために用いてもよい。FIG. 1 is a block diagram showing an embodiment of the present invention.
This will be described with reference to FIG. FIG. 1 is a sectional view showing a resin molding apparatus according to the first embodiment of the present invention. The resin molding apparatus of the present invention is used, for example, for manufacturing a resin-sealed semiconductor device, but may be used for manufacturing other molded products.
【００１８】図１に示すように、第１の実施の形態に係
る樹脂成形装置は、上側金型１及び下側金型２を有し、
キャビティ３内に樹脂４を注入することにより成形品５
を成形する。As shown in FIG. 1, the resin molding apparatus according to the first embodiment has an upper mold 1 and a lower mold 2,
Molded product 5 is obtained by injecting resin 4 into cavity 3.
Is molded.
【００１９】第１の実施の形態に係る樹脂成形装置は、
上側金型１にキャビティ３の上部と連通する空気流路６
が形成されている。空気流路６の他端には、空気流路６
を介して成形品５を真空吸着するための真空ポンプ等の
真空装置（図示せず）が接続されているとともに、空気
流路６に圧縮空気を導入する圧縮空気生成装置（図示せ
ず）が接続され、これらの装置への接続を所望に切り換
えることができる。なお、空気流路６の他端に真空機能
と圧縮空気生成機能の両方の機能を備えた装置が接続さ
れていてもよい。The resin molding apparatus according to the first embodiment comprises:
Air flow path 6 communicating with the upper part of cavity 3 in upper mold 1
Are formed. The other end of the air flow path 6 has an air flow path 6
A vacuum device (not shown) such as a vacuum pump for vacuum-sucking the molded article 5 is connected through the air passage, and a compressed air generating device (not shown) for introducing compressed air into the air flow path 6 is provided. Connected, and the connection to these devices can be switched as desired. Note that a device having both a vacuum function and a compressed air generating function may be connected to the other end of the air flow path 6.
【００２０】また、空気流路６とキャビティ３との連通
部分には、空気流路６内の開閉切換を行う電磁弁等のバ
ルブ７が設けられている。A valve 7 such as an electromagnetic valve for switching between opening and closing of the air flow path 6 is provided at a portion where the air flow path 6 communicates with the cavity 3.
【００２１】次に、第１の実施の形態に係る樹脂成形装
置の動作について説明する。まず、半導体素子８を搭載
しワイヤで接続されたリードフレーム９を上側金型１と
下側金型２との間に設置し、キャビティ３内に樹脂４を
注入することにより成形品５を成形する。その際、バル
ブ７は下方の位置で空気流路６内を閉状態にしている
（図１（Ａ）参照）。Next, the operation of the resin molding apparatus according to the first embodiment will be described. First, a lead frame 9 on which a semiconductor element 8 is mounted and connected by wires is installed between the upper mold 1 and the lower mold 2, and the resin 4 is injected into the cavity 3 to form the molded product 5. I do. At this time, the valve 7 closes the inside of the air flow path 6 at the lower position (see FIG. 1A).
【００２２】次いで、温度が下がり樹脂４が硬化した
後、バルブ７を上昇させ空気流路６内を開状態にする。
そして、空気流路６を介して上側金型１を真空吸着した
状態で２〜５ｍｍ程度持ち上げる。成形品５は上側金型
１に吸着された状態で持ち上げられるため下側金型２か
ら離脱される（図１（Ｂ）参照）。Next, after the temperature is lowered and the resin 4 is cured, the valve 7 is raised to open the air passage 6.
Then, the upper mold 1 is lifted by about 2 to 5 mm in a state where the upper mold 1 is vacuum-sucked through the air flow path 6. Since the molded article 5 is lifted while being adsorbed by the upper mold 1, it is separated from the lower mold 2 (see FIG. 1B).
【００２３】次いで、空気流路６を介して圧縮空気を導
入して成形品５を上側金型１から離脱させる（図１
（Ｃ）参照）。Next, compressed air is introduced through the air passage 6 to release the molded product 5 from the upper mold 1 (FIG. 1).
(C)).
【００２４】本発明によれば、空気流路６を介して一方
の金型に成形品５を真空吸着した状態で他方の金型から
離脱させ、空気流路６を介して圧縮空気を導入して一方
の金型から成形品５を離脱させるので、成形品５に加え
られるストレスを小さくできクラックの発生を防止する
ことができる。According to the present invention, the molded article 5 is released from the other mold while being vacuum-adsorbed to one of the molds via the air flow path 6, and compressed air is introduced through the air flow path 6. Since the molded product 5 is separated from one of the molds, the stress applied to the molded product 5 can be reduced, and the occurrence of cracks can be prevented.
【００２５】また、成形品５の不意な飛び出し等のおそ
れもなく確実に金型１，２から成形品５を離型すること
ができる。Further, it is possible to reliably release the molded product 5 from the dies 1 and 2 without fear of the molded product 5 suddenly popping out.
【００２６】図２は、本発明の第２の実施の形態に係る
樹脂成形装置を示す断面図である。第２の実施の形態で
は、空気流路６は途中で複数（図２では２つ）に分岐し
て、キャビティ３の所定間隔を隔てた複数の（２つの）
箇所と連通している。また、複数の（２つの）バルブ７
が各空気流路６とキャビティ３の上部との連通部分に設
けられている。FIG. 2 is a sectional view showing a resin molding apparatus according to a second embodiment of the present invention. In the second embodiment, the air flow path 6 branches into a plurality (two in FIG. 2) on the way, and a plurality (two) of
It communicates with the place. In addition, a plurality of (two) valves 7
Are provided in the communicating portion between each air flow path 6 and the upper part of the cavity 3.
【００２７】第２の実施の形態によれば、空気流路６が
キャビティ３の複数の箇所と連通しているので、離型時
における成形品５に加えられるストレスを分散でき、ク
ラックの発生をさらに低減させることができる。According to the second embodiment, since the air flow path 6 communicates with a plurality of locations of the cavity 3, the stress applied to the molded product 5 at the time of releasing the mold can be dispersed, and the occurrence of cracks can be reduced. It can be further reduced.
【００２８】本発明は、上記実施の形態に限定されるこ
とはなく、特許請求の範囲に記載された技術的事項の範
囲内において、種々の変更が可能である。例えば、真空
吸着用の空気流路６と、圧縮空気導入用の空気流路６を
別個に形成してもよい。また、空気流路６は、上側金型
１だけでなく、下側金型２だけ、あるいは上側金型１及
び下側金型２の両方に形成してもよい。さらに、第２の
実施の形態では、空気流路６がキャビティ３の３以上の
箇所と連通していてもよい。The present invention is not limited to the above embodiment, and various changes can be made within the technical scope described in the claims. For example, the air passage 6 for vacuum suction and the air passage 6 for compressed air introduction may be formed separately. The air flow path 6 may be formed not only in the upper mold 1 but also in the lower mold 2 or in both the upper mold 1 and the lower mold 2. Furthermore, in the second embodiment, the air flow path 6 may communicate with three or more locations of the cavity 3.
【００２９】[0029]
【発明の効果】本発明によれば、空気流路を介して一方
の金型に成形品を真空吸着した状態で他方の金型から離
脱させ、空気流路を介して圧縮空気を導入して一方の金
型から成形品を離脱させるので、成形品に加えられるス
トレスを小さくできクラックの発生を防止することがで
きる。According to the present invention, the molded article is released from the other mold while being vacuum-adsorbed to one mold via the air flow path, and compressed air is introduced through the air flow path. Since the molded product is detached from one mold, the stress applied to the molded product can be reduced, and the occurrence of cracks can be prevented.
【００３０】また、成形品の不意な飛び出し等のおそれ
もなく確実に金型から成形品を離型することができる。Further, it is possible to reliably release the molded product from the mold without fear of unexpected protrusion of the molded product.
【図１】本発明の第１の実施の形態に係る樹脂成形装置
を示す断面図である。FIG. 1 is a sectional view showing a resin molding apparatus according to a first embodiment of the present invention.
【図２】本発明の第２の実施の形態に係る樹脂成形装置
を示す断面図である。FIG. 2 is a sectional view showing a resin molding apparatus according to a second embodiment of the present invention.
【図３】従来の樹脂成形装置を示す断面図である。FIG. 3 is a sectional view showing a conventional resin molding apparatus.
１：上側金型 ２：下側金型 ３：キャビティ ４：樹脂 ５：成形品 ６：空気流路 ７：バルブ 1: Upper mold 2: Lower mold 3: Cavity 4: Resin 5: Molded product 6: Air flow path 7: Valve
Claims (6)
内に樹脂を注入することにより成形品を成形する樹脂成
形装置において、 少なくとも一方の金型に前記キャビティと連通する空気
流路が形成され、その空気流路を介して前記成形品を真
空吸着するとともに、前記空気流路を介して圧縮空気を
導入して前記成形品を離脱させる、ことを特徴とする樹
脂成形装置。1. A resin molding apparatus having a pair of molds and molding a molded product by injecting a resin into a cavity of the mold, wherein an air flow path communicating with the cavity is provided in at least one of the molds. Is formed, and the molded article is vacuum-sucked through the air flow path, and the molded article is separated by introducing compressed air through the air flow path.
型及び下側金型のキャビティ内に樹脂を注入することに
より成形品を成形する樹脂成形装置において、 前記上側金型に前記キャビティの上部と連通する空気流
路が形成され、その空気流路を介して前記成形品を真空
吸着するとともに、前記空気流路を介して圧縮空気を導
入して前記成形品を離脱させる、ことを特徴とする樹脂
成形装置。2. A resin molding apparatus having an upper mold and a lower mold, and molding a molded article by injecting a resin into a cavity of the upper mold and the lower mold. An air flow passage communicating with the upper portion of the cavity is formed, and the molded article is vacuum-sucked through the air flow path, and compressed air is introduced through the air flow path to release the molded article. , A resin molding apparatus.
所と連通していることを特徴とする請求項１又は２に記
載の樹脂成形装置。3. The resin molding apparatus according to claim 1, wherein the air flow path communicates with a plurality of locations of the cavity.
に、空気流路内の開閉切換を行うバルブが設けられてい
ることを特徴とする請求項１乃至３のいずれか１つの項
に記載の樹脂成形装置。4. The valve according to claim 1, wherein a valve for switching between opening and closing of the air flow path is provided at a communication portion between the air flow path and the cavity. Resin molding equipment.
ることにより成形した成形品を離型する成形品の離型方
法において、 少なくとも一方の金型に形成され前記キャビティと連通
する空気流路を介して前記成形品を真空吸着して、他方
の金型から離脱させる工程と、 前記空気流路を介して圧縮空気を導入して前記成形品を
一方の金型から離脱させる工程と、 を有することを特徴とする成形品の離型方法。5. A mold release method for releasing a molded product by injecting a resin into a cavity of a pair of molds, wherein an air flow formed in at least one of the molds and communicating with the cavity. A step of vacuum-absorbing the molded article through a path to release the molded article from the other mold, and a step of introducing compressed air through the air flow path to release the molded article from the one mold, A method for releasing a molded article, comprising:
脂を注入することにより成形した成形品を離型する成形
品の離型方法において、 上側金型に形成され前記キャビティの上部と連通する空
気流路を介して前記成形品を真空吸着して、下側金型か
ら離脱させる工程と、 前記空気流路を介して圧縮空気を導入して成形品を上側
金型から離脱させる工程と、 を有することを特徴とする成形品の離型方法。6. A mold release method for releasing a molded product formed by injecting a resin into cavities of an upper mold and a lower mold, wherein the molded product is formed in an upper mold and an upper portion of the cavity. A step of vacuum-sucking the molded product through a communicating air flow path to release the molded product from the lower mold; and a step of introducing compressed air through the air flow path to release the molded product from the upper mold. A mold release method for a molded article, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11072861A JP2000263603A (en) | 1999-03-18 | 1999-03-18 | Resin molding machine and method for releasing molding from mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11072861A JP2000263603A (en) | 1999-03-18 | 1999-03-18 | Resin molding machine and method for releasing molding from mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000263603A true JP2000263603A (en) | 2000-09-26 |
Family
ID=13501563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11072861A Pending JP2000263603A (en) | 1999-03-18 | 1999-03-18 | Resin molding machine and method for releasing molding from mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000263603A (en) |
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| NL1026670C2 (en) * | 2004-07-16 | 2006-01-17 | Fico Bv | Encapsulation of electronic components, e.g. semiconductors, in mold by introducing part of conditioning gas into mold cavity during release of encapsulating material such that releasing gas pressure is exerted on encapsulating material |
| US7021915B2 (en) | 2000-08-29 | 2006-04-04 | Micron Technology, Inc. | Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length |
| US7216009B2 (en) | 2004-06-14 | 2007-05-08 | Micron Technology, Inc. | Machine vision systems for use with programmable material consolidation system and associated methods and structures |
| US7225044B2 (en) | 2002-11-11 | 2007-05-29 | Micron Technology, Inc. | Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques |
| JP2008508116A (en) * | 2004-07-29 | 2008-03-21 | フィーコ ビー．ブイ． | Mold part and method for encapsulating electronic components |
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- 1999-03-18 JP JP11072861A patent/JP2000263603A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7021915B2 (en) | 2000-08-29 | 2006-04-04 | Micron Technology, Inc. | Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length |
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| US7239932B2 (en) | 2002-11-11 | 2007-07-03 | Micron Technology, Inc. | Methods and apparatus for calibrating programmable material consolidation apparatus |
| US7216009B2 (en) | 2004-06-14 | 2007-05-08 | Micron Technology, Inc. | Machine vision systems for use with programmable material consolidation system and associated methods and structures |
| NL1026670C2 (en) * | 2004-07-16 | 2006-01-17 | Fico Bv | Encapsulation of electronic components, e.g. semiconductors, in mold by introducing part of conditioning gas into mold cavity during release of encapsulating material such that releasing gas pressure is exerted on encapsulating material |
| WO2006009429A1 (en) * | 2004-07-16 | 2006-01-26 | Fico B.V. | Method and device for encapsulating electronic components with a conditioning gas |
| JP2008506553A (en) * | 2004-07-16 | 2008-03-06 | フィーコ ビー．ブイ． | Method and apparatus for encapsulating electronic components with conditioning gas |
| US8268217B2 (en) | 2004-07-16 | 2012-09-18 | Fico B.V. | Method and device for encapsulating electronic components with a conditioning gas |
| JP4874967B2 (en) * | 2004-07-16 | 2012-02-15 | フィーコ ビー．ブイ． | Method and apparatus for encapsulating electronic components with conditioning gas |
| JP4741592B2 (en) * | 2004-07-29 | 2011-08-03 | フィーコ ビー．ブイ． | Mold part and method for encapsulating electronic components |
| KR101177588B1 (en) * | 2004-07-29 | 2012-08-27 | 피코 비. 브이. | Mould part and method for encapsulating electronic components |
| JP2008508116A (en) * | 2004-07-29 | 2008-03-21 | フィーコ ビー．ブイ． | Mold part and method for encapsulating electronic components |
| WO2010135081A3 (en) * | 2009-05-22 | 2011-03-03 | Dow Global Technologies Inc. | Improved method for extracting shaped foam articles from a forming mold cavity |
| WO2010135081A2 (en) * | 2009-05-22 | 2010-11-25 | Dow Global Technologies Inc. | Improved method for extracting shaped foam articles from a forming mold cavity |
| CN102438800A (en) * | 2009-05-22 | 2012-05-02 | 陶氏环球技术有限责任公司 | Improved method for extracting shaped foam articles from a forming mold cavity |
| KR20160146070A (en) * | 2015-06-11 | 2016-12-21 | 김형섭 | Manufacturing method of unified thermoplastic product |
| KR101698861B1 (en) | 2015-06-11 | 2017-01-23 | 김형섭 | Manufacturing method of unified thermoplastic product |
| CN112208045A (en) * | 2019-07-10 | 2021-01-12 | 众鼎瑞展电子科技(深圳)有限公司 | Key cooling and demoulding mode |
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| CN114228067A (en) * | 2021-12-18 | 2022-03-25 | 苏州恒源盛模塑有限公司 | Injection molding process of automobile door core plate |
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