JP2000251769A - Image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an enclosure for an image display device less in brightness reduction or life shortening, and sufficient in getter effect, by realizing an adhesion process at a temperature about 400 deg.C or below required at the minimum for a frit adhesion (sealing) process. SOLUTION: A rear plate 2 and a face plate 4 are joined respectively at joining parts to an outer frame 3 through polymer thermoplastic adhesives 9, 14 containing a polyphenyl compound. As the adhesives, a polymer thermoplastic adhesive containing polyether, polysulfone or polyether ketone, of the like is named. Especially a polymer thermoplastic sheet-shaped adhesive mainly composed of polyether ketone is used and heated to 330 deg.C or higher, to soften and crimp the adhesive, and the adhesive is hardened and bonded in a temperature-lowering process. Polyether ketone is preferable compared with other adhesives, especially from the viewpoint of a small quantity of emission gas in a vacuum baking process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an envelope in which glass members are joined by using a joining agent, and an image display device using the envelope.

[0002]

2. Description of the Related Art Conventionally, in an envelope capable of maintaining the inside thereof in a vacuum, a frit is used as a bonding agent at a joint between a face plate (phosphor substrate), a rear plate (electron emission substrate) and an outer frame. (Low-melting glass).

[0003] That is, a frit layer is formed on a joint portion as a joining agent and then fired, whereby the joint portion is air-tightly bonded to form an envelope capable of maintaining the inside in a vacuum. Bonding of glass using this frit requires firing at about 400 to 500 ° C. in the atmosphere (normal pressure).

In general, in an image display device using electrons, an envelope for maintaining a vacuum (reduced pressure) atmosphere comprising a face plate, a rear plate and an outer frame, which are glass members, and an electron source for emitting electrons. And a driving circuit therefor, an image forming member having a phosphor or the like which emits light by collision of electrons, an accelerating electrode for accelerating electrons toward the image forming member, a high-voltage power supply, and the like.

FIG. 16 is a perspective view of an image display device using an electron-emitting device disclosed in Japanese Patent Application Laid-Open No. 8-83578.

FIG. 17 is a sectional view taken along the line BB 'of the image display device shown in FIG. As shown in FIG. 17, a rear plate (electron-emitting device substrate) 1701 and a face plate 170 are interposed via frits 1704 and 1705.
Numerals 2 are joined (or sealed) at joints with the outer frame 1703. In the drawing, 1701 is a rear plate made of soda lime glass, 1702 is a face plate made of soda lime glass, 1703 is an outer frame made of soda lime glass, 1706 is an upper wiring, 1707 is an element electrode (upper wiring side), and 1708 is an electron emitting portion. A conductive thin film comprising: 170
9 is a phosphor, and 1710 is a metal back. The lower wiring and the element electrode (lower wiring side) are not shown.

For example, in an image display apparatus using a flat envelope such as a thin image display apparatus as disclosed in Japanese Patent Application Laid-Open No. 9-082245, a getter is provided for maintaining a vacuum. May be.

[0008]

However, when frit bonding (sealing) is used as a bonding agent at a bonding portion of an envelope including the above-described conventional image display device,
Since firing at a temperature of at least about 400 ° C. is required, there are the following problems.

(1) In the frit bonding step, usually, a calcination step is performed, and then a bonding step is performed twice. Therefore, compared to a bonding step which can be performed at a lower temperature in a single step. Therefore, the temperature is high and it takes more time.

(2) In an image display device using an electron-emitting device, if frit bonding (sealing) is performed after forming and activating beforehand, the higher the bonding temperature is, the more the characteristic deterioration due to heat, that is, electron Luminance and life may be shortened due to a decrease in emission current.

(3) When a getter is used, if the temperature is raised to about 400 ° C., the getter material may be oxidized and the gettering effect may be reduced.

Therefore, the present invention provides frit bonding (sealing).
To provide an envelope suitable for an image display device which realizes an adhesion process lower than at least about 400 ° C. necessary for the process, has less luminance reduction and shorter life, and has a high display quality and a sufficient getter effect. Is an issue.

[0013]

According to the present invention, there is provided a face plate, a rear plate disposed opposite to the face plate, and a rear plate disposed between the face plate and the rear plate. An outer frame surrounding the periphery, and an outer package including a bonding agent for bonding the outer frame, the face plate, the outer frame, and the rear plate, wherein at least one of the bonding agents is polyphenyl It is a polymer thermoplastic adhesive containing a compound.

That is, in the present invention, by using a polymer-based thermoplastic adhesive having a polyphenyl compound as a bonding agent, an envelope can be formed in one bonding step at a maximum heat treatment temperature of 370 ° C. I have.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The conditions of the adhesive applicable to the image display device of the present invention are as follows.

1. Heat resistance in the baking step in vacuum is required.

2. In order to maintain a high vacuum, it is required that vacuum leak and gas permeation are extremely small. However, it is required only for the places where vacuum maintenance is required.

3. Adhesion with glass members is required.

4. Low outgassing is required to maintain high vacuum.

[5] Heat treatment temperature: The maximum heat treatment temperature is required to be lower than about 400 ° C. in the frit bonding (sealing) step.

6. It is necessary to be able to easily adapt to an arbitrary outer frame shape and not to be fluidized near the bonding temperature.

Examples of the adhesive satisfying the above conditions include a high molecular thermoplastic adhesive containing polyether, polysulfone, and polyether ketone.

In particular, a high molecular thermoplastic adhesive containing polyether ketone is preferable as compared with other adhesives, because the amount of released gas in a vacuum baking step is small.

When a high molecular thermoplastic sheet adhesive mainly composed of polyetherketone is used, the adhesive is molded into an arbitrary shape, heated to 330 ° C. or more to soften the adhesive, and then press-bonded. The adhesive can be adhered by curing the adhesive during the temperature decreasing process, and the above conditions 1 to 6 can be satisfied.

Further, a polymeric thermoplastic adhesive having polyether and polysulfone is also suitable. When molded into an arbitrary shape and using a polymer thermoplastic sheet adhesive having polyether and polysulfone, 230
The adhesive is softened by heating to a temperature of 300 ° C. or more, and then pressed, and bonded by hardening the adhesive in a temperature decreasing process.

Further, the above-mentioned paste-like polymer-based thermoplastic adhesive containing polyether and polysulfone is coated on a glass member in a desired shape by a known coating method such as dipping, spraying, dispensing, and screen printing. After removing the method and evaporating the solvent, the adhesive is softened by heat treatment, pressed, and adhered by curing the adhesive in the course of cooling.

The polymer thermoplastic adhesive having the above-mentioned polyphenyl compound has a maximum heat treatment temperature of 400 ° C. or lower in a single bonding step. It is possible to provide an envelope including an image display device having high display quality and a sufficient getter effect.

The envelope of the present invention can be used for an image display device. Preferably, a phosphor and an electron accelerating electrode are formed on a face plate of the envelope, and an electron source is formed on a rear plate. Used for the formed image display device. This electron source is preferably a surface conduction electron-emitting device.

Hereinafter, an envelope of the present invention and an image display device using the same will be described with reference to the drawings.

FIG. 1 is a perspective view of the image display device of the present invention. Reference numeral 1 denotes an electron source in which a plurality of electron-emitting devices are arranged on a substrate, and are appropriately wired. 2 is a rear plate, 3 is an outer frame, 4 is a face plate, and 9, 14 are adhesives.

FIG. 2 is a sectional view taken along the line CC 'of FIG. As shown in FIG. 2, the rear plate 2 and the face plate 4 are connected to the outer frame 3 via polymer thermoplastic adhesives 9 and 14 having a polyphenyl compound.
Each is joined.

It is needless to say that the present invention is effective even when the outer frame and the face plate or the outer frame and the rear plate are integrated into one.

The face plate 4 has a fluorescent film 7 and a metal back 8 formed on a glass substrate 6, and this portion becomes an image display area. The phosphor film 7 is made of only a phosphor in the case of a black-and-white image, but in the case of displaying a color image, pixels are formed by phosphors of three primary colors of red, green and blue, and a black conductive material is used between the pixels. Separate structure. The black conductive material is called a black stripe, a black matrix, or the like, depending on its shape.

The metal back 8 is formed of a conductive thin film such as Al. The metal back 8 reflects light traveling toward the electron source 1 out of the light emitted from the phosphor toward the glass substrate 6 to improve the brightness, and the gas remaining in the envelope 5 reduces the electron emission. It also serves to prevent the phosphor from being damaged by the impact of ions generated by ionization by the wire. Further, it provides conductivity to the image display area of the face plate 4 to prevent charge from being accumulated, and serves as an anode electrode for the electron source 1.

Next, the fluorescent film 7 will be described.

FIG. 3A shows a case where the phosphors 13 are arranged in a stripe pattern, and the phosphors 13 of three primary colors of red (R), green (G), and blue (B) are formed in this order. Are separated by the black conductive material 12. In this case, the portion of the black conductive material 12 is called a black stripe.

FIG. 3B shows a state in which the dots of the phosphor 13 are arranged in a lattice, and the dots are separated by the black conductive material 12. In this case, the black conductive material 12 is called a black matrix. There are several methods of arranging each color of the phosphor 13, and accordingly, the arrangement of the dots may employ a square lattice or the like in addition to the illustrated triangular lattice.

As a method for patterning the black conductive material 12 and the phosphor 13 on the glass substrate 6, a slurry method, a printing method, or the like can be used. After the fluorescent film 7 is formed,
The metal back 8 is formed.

FIG. 4 is a schematic view of a two-dimensionally arranged electron source connected by matrix wiring.

FIG. 5 is a sectional view taken along the line AA 'of FIG. Reference numeral 72 denotes an X-direction wiring (upper wiring), and 73 denotes a Y-direction wiring (lower wiring), which are connected to the electron-emitting devices 78, respectively. The Y-direction wiring 73 is provided on the insulating base 71,
Further, an insulating layer 74 is formed thereon, and an X-directional wiring 72 and an electron-emitting device 78 are formed thereon. The Y-directional wiring 73 and the electron-emitting device 78 are connected via a contact hole 77.

The above various wirings are formed by a combination of various thin film deposition methods such as a sputtering method, a vacuum evaporation method, a plating method and the like, and a photolithography technique, or a printing method.

The face plate 4, the outer frame 3, the rear plate 2, and the electron source 1 and other structures are combined, and the outer frame 3, the face plate 4, and the rear plate 2 are joined. For bonding, a polymer-based thermoplastic adhesive having a polyphenyl compound is molded into an arbitrary shape, and the adhesive is softened by heat treatment at 400 ° C. or less in an inert gas such as Ar or in a vacuum, followed by pressure bonding. Then, the adhesive is cured by curing the adhesive during the cooling process (sealing step). The internal structure such as the electron source 1 is fixed in the same manner. At this time, it is desirable to lower the oxygen concentration and the temperature at the time of bonding as much as possible.

Thereafter, the inside of the envelope 5 is evacuated once (vacuum forming step), and necessary processing such as activation of the electron source 1 is performed. Subsequently, a sufficient vacuum is secured inside the envelope 5 by evacuation and heating degassing, that is, a baking process,
Further, a vacuum exhaust pipe (not shown) is heated and closed with a burner.

The image display device thus produced has little luminance reduction and shortened life, has high display quality, and has a sufficient getter effect, so that the degree of vacuum in the envelope can be maintained well. Stabilizes the electron emission amount.

FIG. 6 shows the image display device using NT.
FIG. 3 is a block diagram of a drive circuit for performing television display based on SC television signals. 81 is an image display device, 82 is a scanning circuit, 83 is a control circuit, and 84 is a shift register. 85 is a line memory, 86 is a synchronizing signal separation circuit, 87 is a modulation signal generator, and Vx and Va are DC voltage sources.

The image display device 81 has terminals Doxl to D
oxm, terminals Doyl to Doyn, and high voltage terminal Hv
Connected to an external electric circuit via Terminal Doxl
Scanning for sequentially driving electron sources provided in the image display apparatus, that is, a group of surface conduction electron-emitting devices arranged in a matrix of m rows and n columns, n elements per row. A signal is applied.

To the terminals Doyl to Doyn, a modulation signal for controlling an output electron beam of each element of the surface conduction electron-emitting device in one row selected by the scanning signal is applied. The high-voltage terminal Hv is supplied with a DC voltage of, for example, 10 kV from the DC voltage source Va, which applies sufficient energy to the electron beam emitted from the surface conduction electron-emitting device to excite the phosphor. This is the accelerating voltage to perform.

The scanning circuit 82 will be described. This circuit has m switching elements inside, and is schematically indicated by S1 to Sm in the figure. Each switching element selects either the output voltage of the DC voltage source Vx or 0 V (ground level), and is electrically connected to the terminals Doxl to Doxm of the image display device 81. Each of the switching elements S1 to Sm is:
It operates based on a control signal Tscan output from the control circuit 83, and can be configured by combining switching elements such as FETs, for example.

In the case of the present embodiment, the DC voltage source Vx uses a driving voltage applied to an unscanned element based on the characteristics of the surface conduction electron-emitting device (electron emission threshold voltage). It is set to output a constant voltage that is equal to or lower than the voltage.

The control circuit 83 has a function of matching the operation of each unit so that appropriate display is performed based on an image signal input from the outside. The control circuit 83 sends Tscan, Tsft, and Tmry to each unit based on the synchronization signal Tsync sent from the synchronization signal separation circuit 86.
Are generated.

The synchronizing signal separating circuit 86 is a circuit for separating a synchronizing signal component and a luminance signal component from an NTSC television signal input from the outside, and uses a general frequency separating (filter) circuit or the like. Can be configured. The synchronizing signal separated by the synchronizing signal separating circuit 86 is composed of a vertical synchronizing signal and a horizontal synchronizing signal.
This is shown as a SYNC signal. The luminance signal component of the image separated from the television signal is referred to as a DATA signal for convenience. The DATA signal is input to the shift register 84.

The shift register 84 is for serially / parallel converting the DATA signal input serially in time series for each line of an image, and is based on a control signal Tsft sent from the control circuit 83. (Ie, the control signal Tsft is supplied to the shift register 84
It can be said that it is a shift clock. ). The data of one line of the serial / parallel-converted image (corresponding to the drive data of N electron-emitting devices) is converted into N parallel signals Id1 to Idn as the shift register 8.
4 is output.

The line memory 85 is a storage device for storing data for one line of an image for a required time only.
The contents of Id1 to Idn are stored as appropriate according to the control signal Tmry sent from the control circuit 83. The stored contents are output as I'd1 to I'dn and input to the modulation signal generator 87.

The modulation signal generator 87 outputs the image data I'd
1 to I′dn are signal sources for appropriately driving and modulating each of the surface conduction electron-emitting devices in accordance with each of the surface conduction electron-emitting devices in the display panel 81 through terminals Doy1 to Doyn. Applied to the emitting element.

The electron-emitting device to which the present invention can be applied has the following basic characteristics with respect to the emission current Ie. That is, electron emission has a clear threshold voltage Vth, and electron emission occurs only when a voltage equal to or higher than Vth is applied. For a voltage equal to or higher than the electron emission threshold, the emission current also changes according to the change in the voltage applied to the device. From this, when a pulse-like voltage is applied to this element, for example, when a voltage lower than the electron emission threshold is applied, electron emission does not occur, but when a voltage higher than the electron emission threshold is applied, the electron beam is emitted. Is output. At that time, the intensity of the output electron beam can be controlled by changing the pulse peak value Vm. In addition, it is possible to control the total amount of charges of the output electron beam by changing the pulse width Pw.

Therefore, as a method of modulating the electron-emitting device according to the input signal, a voltage modulation method, a pulse width modulation method, or the like can be employed. In implementing the voltage modulation method, a circuit of a voltage modulation method that generates a voltage pulse of a fixed length and modulates the peak value of the pulse appropriately according to input data is used as the modulation signal generator 87. be able to.

When implementing the pulse width modulation method,
As the modulation signal generator 87, a pulse width modulation circuit that generates a voltage pulse having a constant peak value and appropriately modulates the width of the voltage pulse according to input data can be used. Shift register 84 and line memory 85
The digital signal type and the analog signal type can be adopted. This is because the serial / parallel conversion and storage of the image signal may be performed at a predetermined speed.

When the digital signal system is used, it is necessary to convert the output signal DATA of the synchronizing signal separation circuit 86 into a digital signal. For this purpose, an A / D converter may be provided at the output section of the circuit 86. In connection with this, the circuit used for the modulation signal generator 87 differs slightly depending on whether the output signal of the line memory 85 is a digital signal or an analog signal. That is, in the case of the voltage modulation method using a digital signal,
For example, a D / A conversion circuit is used as the modulation signal generator 87, and an amplification circuit and the like are added as necessary. In the case of the pulse width modulation method, the modulation signal generator 87 includes, for example, a high-speed oscillator, a counter for counting the number of waves output from the oscillator, and a comparator for comparing the output value of the counter with the output value of the memory. (Comparator) is used. If necessary, an amplifier for voltage-amplifying the pulse width modulated signal output from the comparator to the drive voltage of the surface conduction electron-emitting device can be added.

In the case of the voltage modulation system using an analog signal, the modulation signal generator 87 can employ, for example, an amplifier circuit using an operational amplifier or the like, and can add a level shift circuit or the like as necessary. In the case of the pulse width modulation method, for example, a voltage-controlled oscillation circuit (VOC) can be employed, and an amplifier for amplifying the voltage up to the drive voltage of the surface conduction electron-emitting device can be added as necessary.

In the image display device of the present invention which can take such a configuration, each of the electron-emitting devices is provided with an external terminal Do.
By applying a voltage via x1 to Doxm and Doy1 to Doyn, electron emission occurs. High voltage terminal H
A high voltage is applied to the metal back 8 or a transparent electrode (not shown) through the v to accelerate the electron beam. The accelerated electrons collide with the fluorescent film 7 and emit light to form an image.

The configuration of the image display device described here is an example of an image display device to which the present invention can be applied, and various modifications can be made based on the technical idea of the present invention. For the input signal, the NTSC system has been described, but the input signal is not limited to this. In addition to the PAL and SECAM systems, a TV signal including a larger number of scanning lines, such as an MU, may be used.
A high-definition TV system such as the SE system can also be adopted.

The image display device according to the present invention includes a display device for a television broadcast, a display device such as a video conference system and a computer, and an image display device as an optical printer using a photosensitive drum or the like. Can also be used.

[0063]

Hereinafter, the present invention will be described in more detail with reference to preferred embodiments. However, the present invention is not limited to these embodiments, and each element within a range in which the object of the present invention is achieved. And those in which the design has been replaced or changed.

[Embodiment 1] The image display apparatus of this embodiment is
It has a configuration similar to that of the device schematically shown in FIG. 1, and reference numeral 1 denotes an electron source, in which a plurality of electron-emitting devices are arranged on a substrate and appropriately wired. 2 is a rear plate, 3 is an outer frame, 4 is a face plate, and 9, 14 are adhesives.

As shown in the cross-sectional view taken along the line CC ′ of FIG. 2, the high-molecular thermoplastic adhesive 9 having a polyphenyl compound,
14, the rear plate 2 and the face plate 4
Are joined at the joint with the outer frame 3.

The image display device of this embodiment has an electron source 1 in which a plurality of (240 rows × 720 columns) surface conduction electron-emitting devices are arranged in a simple matrix on a substrate.

FIG. 7 is a plan view of the electron source 1.

FIG. 8 is a sectional view taken along the line BB 'of FIG. 7 and 8, the same reference numerals denote the same components. Reference numeral 101 denotes an electron source substrate, 102 denotes an X-direction wiring (also referred to as an upper wiring) corresponding to Doxm in FIG. 1, 103 denotes a Y-direction wiring (also referred to as a lower wiring) corresponding to Doyn in FIG.
08 is a conductive film including an electron emitting portion, 105 and 106 are device electrodes, 104 is an interlayer insulating layer, and 107 is a device electrode 105.
And a contact hole for electrical connection with the lower wiring 103.

FIG. 9 is a manufacturing process diagram of the image display device of this embodiment.

Step-a The substrate 1 was sufficiently washed with a detergent, pure water and an organic solvent. A 0.5 μm thick silicon oxide film was formed thereon by a sputtering method to obtain an electron source substrate 1. After a photoresist (manufactured by AZ1370 Hoechst) was spin-coated and baked thereon, a photomask image was exposed and developed to form a resist pattern of the lower wiring 103. Further, Cr having a thickness of 5 nm and a thickness of 600 n were formed by vacuum evaporation.
After sequentially stacking m Au, unnecessary portions of the Au / Cr deposited film were removed by lift-off to form a lower wiring 103 having a desired shape (FIG. 9A).

Step-b Next, an interlayer insulating film 104 made of a silicon oxide film having a thickness of 1.0 μm is deposited by RF sputtering (FIG. 9).
(B)).

Step-c A photoresist pattern for forming the contact hole 107 is formed in the silicon oxide film deposited in the step b, and the interlayer insulating layer 104 is etched using the photoresist pattern as a mask to form the contact hole 107. Etching is performed by RIE (Reactive I) using CF ₄ and H ₂ gas.
on Etching: reactive ion etching) (FIG. 9C).

Step-d A pattern was formed such that a resist was applied to portions other than the contact hole 107, and 5 nm thick Ti and 500 nm thick Au were sequentially deposited by vacuum evaporation. Unnecessary portions were removed by lift-off to bury the contact holes 107 (FIG. 9D).

Step-e Thereafter, a pattern to be a gap G between the device electrode 105 and the device electrode is formed by photoresist (RD-2000N-41).
Hitachi Chemical Co., Ltd.) and a thickness of 5 n
m of Ti and 100 nm of Ni were sequentially deposited. The photoresist pattern was dissolved with an organic solvent, the Ni / Ti deposited film was lifted off, and the device electrodes 105 and 106 were formed with the device electrode gap G of 3 μm and the device electrode width of 300 μm (FIG. 9E).

Step-f After a photoresist pattern of the upper wiring 102 is formed on the device electrodes 105 and 106, Ti having a thickness of 5 nm and a thickness of 5
00 nm of Au is sequentially deposited by vacuum evaporation, unnecessary portions are removed by lift-off, and a width 40 of a desired shape is obtained.
The upper wiring 102 of 0 μm was formed (FIG. 9F).

Step-g A 100 nm-thick Cr film 1019 is deposited and patterned by vacuum evaporation, and a Pd amine complex solution (c
cp4230 manufactured by Okumura Pharmaceutical Co., Ltd.) was spin-coated with a spinner and heated and baked at 300 ° C. for 10 minutes.
Further, the thus formed conductive film 108 for forming an electron emission portion composed of fine particles made of Pd as a main element has a thickness of 8.5 nm and a sheet resistance of 3.9 × 104 Ω /.
It was □. Note that the fine particle film described here is a film in which a plurality of fine particles are aggregated, and has a fine structure not only in a state where the fine particles are individually dispersed and arranged, but also in a state where the fine particles are adjacent to each other or overlapped (including an island shape). ), And the particle size refers to the diameter of the fine particles whose particle shape can be recognized in the above state (FIG. 9 (g)).

Step-h A desired pattern was formed by etching the Cr film 1019 and the conductive film 108 for forming the electron emission portion after firing with an acid etchant. (FIG. 9 (h)).

Through the above steps, a plurality of (240 rows × 720 columns) conductive films 108 for forming electron-emitting portions are connected to the electron source substrate 101 in a simple matrix including the upper wiring 102 and the lower wiring 103. It was taken.

Step-i Next, the face plate 4 shown in FIG. 1 was prepared as follows. The glass substrate 6 was sufficiently washed using a detergent, pure water and an organic solvent. On top of this, the IT
O was deposited to a thickness of 0.1 μm to form a transparent electrode 1011.
Subsequently, a phosphor film 7 was applied by a printing method, and the surface was smoothed (generally called “filming”) to form a phosphor portion. The fluorescent film 7 is a fluorescent film shown in FIG. 3A in which stripe-shaped phosphors (R, G, B) 13 and black conductive materials (black stripes) 12 are alternately arranged. Further, a metal back 8 made of an Al thin film is formed on the fluorescent film 7 by a sputtering method to a thickness of 0.1 μm.
m.

Step-j Next, the envelope 5 shown in FIG. 1 was prepared as follows.

After fixing the electron source 1 formed by the above-described process to the rear plate 2, the outer frame 3, the face plate 4, and the electron source 1 are combined to form the lower wiring 103 and the upper wiring 102 of the electron source 1. The envelope 5 was formed by connecting to the row selection terminal 10 and the signal input terminal 11, strictly adjusting the positions of the electron source 1 and the face plate 4, and bonding them.

Adhesion was performed by bonding a polymer thermoplastic sheet adhesive mainly composed of polyether ketone 9, 14: Stay Stick 451 (product name, Techno Alpha Co., Ltd.) in the shape of an outer frame, and placed. Thereafter, the adhesive was softened by a heat treatment at 350 ° C. in an inert gas such as Ar, pressure-bonded (0.3 kg / cm ² ), and the adhesive was cured in the course of cooling to effect bonding. The internal structure such as the electron source 1 is fixed in the same manner. When the rear plate 2 and the face plate 4 were arranged, a ring-shaped getter 16 of an evaporative getter containing Ba as a main component was simultaneously arranged outside the image display area.

FIG. 10 is a conceptual diagram of a vacuum device used in the subsequent steps.

The image display device 121 is connected to a vacuum vessel 123 via an exhaust pipe 122. The vacuum vessel 123 is connected to an exhaust device 125, and a gate valve 124 is provided therebetween. In the vacuum container 123,
Pressure gauge 126, quadrupole mass analyzer (Q-mass) 12
7 is attached so that the internal pressure and each partial pressure of the residual gas can be monitored. Since it is difficult to directly measure the pressure and the partial pressure in the envelope 5, the pressure and the partial pressure of the vacuum vessel 123 are measured, and these values are regarded as those in the envelope 5. The exhaust device 125 is an ultra-high vacuum exhaust device including a sorption pump and an ion pump. A plurality of gas introduction devices are connected to the vacuum container 123,
The substance stored in the substance source 129 can be introduced. The introduced substance is filled in a cylinder or an ampoule according to the type, and the introduced amount can be controlled by the gas introduced amount control means 128. The gas introduction amount control means 128
Depending on the type of introduced substance, flow rate, required control accuracy, etc.,
Needle valves, mass flow controllers and the like are used. In this embodiment, benzonitrile contained in a glass ampule was used as the substance source 129, and a slow leak valve was used as the gas introduction amount control means 128. The subsequent steps were performed using the above vacuum processing apparatus.

Step-k The inside of the envelope 5 is evacuated, the pressure is reduced to 1 × 10 −3 Pa or less, and the above-mentioned conductive films 108 (for forming a plurality of electron emitting portions) arranged on the electron source substrate 101 are formed. In FIG. 9 (k), the following process (called forming) for forming an electron-emitting portion was performed. As shown in FIG.
3 are connected in common and connected to the ground. A control device 131 controls the pulse generator 132 and the line selection device 134. 133 is an ammeter. Line selection device 134
As a result, one line is selected from the X-direction wiring 103, and a pulse voltage is applied thereto. The forming process was performed on the element rows in the X direction for each row of 300 elements.

FIG. 12 is a waveform diagram of the applied pulse. With a triangular wave pulse as shown in FIG. 12, the peak value was gradually increased. The pulse width T1 was 1 msec, and the pulse interval T2 was 10 msec. Further, a rectangular wave pulse having a peak value of 0.1 V was inserted between the triangular wave pulses, and the current was measured to measure the resistance value of each row. Resistance value is 3.3
When kΩ (1 MΩ per element) was exceeded, the forming of the row was terminated, and the processing of the next row was started. This process is performed for all the rows to complete the forming of all the conductive films (the conductive films 108 for forming the electron emission portions), and to form the electron emission portions in each of the conductive films. An electron source was formed in which the electron-emitting devices were wired in a simple matrix.

Step-1 Benzonitrile was introduced into the vacuum vessel 123, and the pressure was adjusted to 1.3 × 10 −3 Pa.
A pulse was applied to the electron source 1 while measuring f to activate each electron-emitting device.

FIG. 13 is a waveform diagram of a pulse generated by the pulse generator 132. With the rectangular wave shown in FIG.
The peak value is 14 V, the pulse width T1 = 100 μsec, and the pulse interval is 167 μsec. Line selection device 134
As a result, the selection line is changed from Dx1 to D every 167 μsec.
x100, so that each element row has T
A rectangular wave of 1 = 100 μsec and T2 = 16.7 msec is applied with the phase slightly shifted for each row.

The ammeter 133 is used in a mode for detecting the average of the current value in the ON state of the rectangular wave pulse (when the voltage is 14 V), and this value becomes 600 mA (2 mA per element). At this point, the activation process ends,
The inside of the envelope 5 was evacuated.

Step-m While the evacuation is continued, the whole of the image display device 121 and the vacuum vessel 123 is brought to 300 ° C. by a heating device (not shown).
Hold for 0 hours. By this treatment, benzonitrile and its decomposed products, which are considered to have been adsorbed on the envelope 5 and the inner wall of the vacuum vessel 123, were removed. This is Q-ma
It was confirmed by observation with ss127.

Step-n After confirming that the pressure is 1.3 × 10 −5 Pa or less, the exhaust pipe is heated and closed with a burner. Subsequently, the ring-shaped evaporable getter 16 placed outside the image display area was flashed by high frequency heating.

Thus, the image display device of this embodiment was prepared.

[Example 2] In this example, a polymer-based thermoplastic sheet-like adhesive containing polysulfone as a main component 9, 14: Techno Alpha The product name is different from that of the first embodiment in that a stay stick 415 is used and the heat treatment temperature is 300 ° C. An image display device was prepared in the same manner as in Example 1 except for the step-j.

Embodiment 3 In this embodiment, as the adhesive in Step-j of the process of Embodiment 1, a polymer-based thermoplastic sheet adhesive mainly composed of polysulfone 9, 14: Techno Alpha Product name is different from that of the first embodiment in that a stay stick 401 is used and a heat treatment temperature is 250 ° C. An image display device was prepared in the same manner as in Example 1 except for the step-j.

[Embodiment 4] In this embodiment, as the adhesive in the step-j of the process of the embodiment 1, a high-molecular thermoplastic paste adhesive containing polysulfone as a main component 9, 14: Techno Alpha The product name is that the glass material is coated in an arbitrary shape by a dispenser application method using a stay stick 301, degassing is performed, the solvent is evaporated at 150 ° C., and the heat treatment temperature is 300 ° C. in the embodiment. Different from 1.

An image display device was prepared in the same manner as in Example 1 except for the step-j.

[Embodiment 5] This embodiment is different from Embodiment 1 in that forming and activation are performed before the bonding step. In this embodiment, after performing the step-h of the process of the first embodiment,
Steps -k and 1 were performed, then steps -i and j were performed, and then steps m and n were performed.

As described above, the image display device of the present embodiment was prepared.

Comparative Example 1 An image display device similar to that of Example 1 was produced. However, in this comparative example, a step of forming at a bonding temperature of 410 ° C. was performed using a frit as an adhesive.

The image display devices of Examples 1 to 5 and Comparative Example 1 described above were compared and evaluated. For evaluation, simple matrix drive was performed, and the image display device was made to emit light over the entire surface.
The change in luminance over time was measured. As a result, the initial luminance was different from each other, but the temporal change of the luminance was equivalent.

As described above, since the bonding step using an adhesive having a polyphenyl compound as the adhesive is a single bonding step at a heat treatment temperature of 350 ° C. or lower, the power cost can be reduced and the image display device can be reduced. And other envelopes.

Further, in the fifth embodiment, since the energization forming and the activation process are performed before the enclosing of the envelope, conventionally, if the frit bonding at 410 ° C. is performed after the forming and the activation are performed, heat is applied. Degradation of characteristics, that is, a decrease in luminance and a shortened life due to a decrease in electron emission current sometimes occurred, whereas a decrease in luminance and a shortened life were hardly observed. In addition, since the energization forming and activation processing is performed in the vacuum chamber before bonding the envelope, gas introduction is easier than after adhesion of the enclosure, and there is a defect in the energization forming and activation processing. In this case, there is an advantage that only the rear plate alone is wasted instead of as an envelope.

Embodiment 6 FIG. 14 shows an image display device of this embodiment.

FIG. 15 is a sectional view taken along the line CC 'of FIG.

The present embodiment is different from the first embodiment in that a non-evaporable getter is provided in the image display device.

In this embodiment, an image display device was prepared in the same manner as in Embodiment 1, except that after the getter step-h, the step-x was performed, and then the steps-i to n were performed.

However, in the step-m of this embodiment, not only the removal of gas from the inside but also the activation of the getter is performed by heating / exhausting the image display apparatus.

Step-x A getter layer 17 made of a Zr-V-Fe alloy is formed on the upper wiring 102 in the image display area by using a metal mask by a sputtering method. The composition of the sputtering target used was as follows: Zr; 70%, V; 25%, Fe;
It is 5% (weight ratio) (FIG. 9 (x)).

As described above, the electron source 1 provided with the getter 17 was formed.

Comparative Example 2 An image display device similar to that of Example 6 was produced. In this comparative example, a step of forming at a bonding temperature of 420 ° C. using a frit as an adhesive was performed.

The image display devices of Example 6 and Comparative Example 2 were compared and evaluated. For evaluation, simple matrix driving was performed, the image display device was made to emit light over the entire surface, and a change in luminance over time was measured.
As a result, although the initial luminance was different, the getter functioned sufficiently in the image display device of Example 6 and almost no decrease in luminance was observed even when the getter was operated for a long time. On the other hand, in Comparative Example 2, the luminance gradually decreased relatively. The degree of the decrease was almost equal to Comparative Example 1 in which no getter was provided.

[0112]

According to the present invention described above, by using an adhesive having a polyphenyl compound as a bonding agent, power cost is reduced, luminance is reduced, life is shortened, and getter function is hardly deteriorated. No envelope can be provided. Further, when this envelope is applied to an image display device, there are obtained effects such that a decrease in luminance and a reduction in life are small, the display quality is high, and the function of the getter is sufficient.

The present invention is particularly effective in an image display device having no electrode structure such as a control electrode between an electron source and an image forming member. The same effect is naturally expected when the present invention is applied.

[Brief description of the drawings]

FIG. 1 is a perspective view of an image display device of the present invention.

FIG. 2 is a sectional view taken along the line C-C 'of FIG.

FIG. 3 is an array diagram of phosphors.

FIG. 4 is a schematic view of a matrix wiring electron source.

FIG. 5 is a sectional view taken along line A-A ′ of FIG. 4;

FIG. 6 is a block diagram of a driving circuit for displaying an NTSC signal;

FIG. 7 is a partial plan view of an electron source using a surface conduction electron-emitting device of 240 rows × 720 columns.

8 is a sectional view taken along the line B-B 'of FIG.

FIG. 9 is a manufacturing process diagram of the electron source.

FIG. 10 is a conceptual diagram of a vacuum device used in a forming step and an activation step.

FIG. 11 is a block diagram of a forming and activating system.

FIG. 12 is a waveform diagram of a forming voltage.

FIG. 13 is a waveform diagram of an activation voltage.

FIG. 14 is a perspective view of an image display device according to a sixth embodiment including a non-evaporable getter.

15 is a sectional view taken along the line C-C 'of FIG.

FIG. 16 is a perspective view of a conventional image display device.

17 is a sectional view taken along the line B-B 'in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electron source board 2 Rear plate 3 Outer frame 4 Face plate 5 Enclosure 6 Glass base 7 Phosphor 8 Metal back 9, 14 Adhesive 10 Row selection terminal 11 Signal input terminal 12 Black conductive material 13 Phosphor pattern 16, 17 Getter 71 Glass substrate 72 Upper wiring (X-direction wiring) 73 Lower wiring (Y-direction wiring) 74 Interlayer insulating film 75, 76 Device electrode 77 Contact hole 78 Electron emission section 81 Image display device 82 Scanning circuit 83 Control circuit 84 Shift register 85 Line memory 86 Synchronous signal separation circuit 87 Modulation signal generator 101 Glass substrate 102 Upper wiring 103 Lower wiring 104 Interlayer insulating layer 105, 106 Device electrode 107 Contact hole 108 Electron emission part 121 Image display device 122 Exhaust pipe 123 Vacuum container 124 Gate Valve 125 exhaust Apparatus 126 Pressure gauge 127 Q-mass 128 Gas introduction amount control means 129 Substance source 131 Controller 132 Pulse generator 133 Ammeter 134 Line selector

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuya Shigeoka 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Yoshitaka Arai 3-30-2 Shimomaruko, Ota-ku, Tokyo Within Canon Inc. (72) Inventor Kazuo Koyanagi ▼ 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term within Canon Inc. (reference) 4J040 EA011 EE061 EJ031 EL031 LA08 NA01 NA13 PB11 5C032 BB18 BB20 5C036 EE01 EE17 EF01 EF06 EF09 EG06 EH11

Claims (4)

[Claims] 1. A face plate, a rear plate disposed to face the face plate, an outer frame between the face plate and the rear plate, surrounding the periphery, the outer frame and the face plate, In an envelope comprising a bonding agent for bonding the outer frame and the rear plate, at least one of the bonding agents is a polymer thermoplastic adhesive containing a polyphenyl compound. Envelope. 2. The envelope according to claim 1, wherein a getter is disposed inside. 3. An image display device using the envelope according to claim 1, wherein a phosphor and an electron accelerating electrode are formed on the face plate, and the rear plate is provided on the rear plate. An image display device comprising an electron source. 4. The image display device according to claim 3, wherein said electron source is a surface conduction electron-emitting device.