JP2000246132A - Discharge treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform moderate discharge treatment to material to be treated before rapidly discharging it to outside a treating area in a discharge treating device for performing the discharge treatment to the material to be treated by providing a discharge hole for discharging the material to be treated that has undergone the discharge treatment in the treating area to outside the treating area in a member in the treating area. SOLUTION: When this invention is performed in a discharge treating device A1, it is provided with an electrode pair 2 and a high voltage pulse applying means 3 and between the electrode pair 2, a printed circuit board 1 is arranged. And between the electrode pair 2, pulse discharge of high voltage is generated, while crushing the printed circuit board 1 by shock waves and heat generated with it, electrically conductive parts, electronic circuit elements or the like are separated from the printed circuit board 1. At this time, as a cathodic electrode 2b being below the printed circuit board 1 of the electrode pair 2, a mesh electrode is used, and when the size of small fragments that the printed circuit board is crushed or separated becomes smaller than the mesh diameter of the mesh electrode, they are discharged from between the electrode pair 2 to prevent them from being crushed/separated too much.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a discharge treatment apparatus for performing a discharge treatment for modifying an object to be treated.
A printed circuit board in which various electronic circuit elements such as a conductive member for circuit patterns such as copper and a resistor are joined to a substrate made of epoxy resin, phenolic resin or the like, or a conductive member is enclosed. Discharge treatment equipment for crushing / separation of separated semiconductor packages, etc., and instantaneous application of high voltage to sludge contained in organic waste liquid to modify its material and provide it to aerobic treatment later And a discharge treatment apparatus for reforming the organic waste liquid.

[0002]

2. Description of the Related Art In the past, products that have been treated as mere waste materials by collective incineration or dumping include:
May contain harmful materials that have a negative impact on the environment at the time of disposal, and reusable resources. For this reason, in recent years, from the viewpoints of environmental protection and effective use of resources, the technology of separating and collecting the above harmful materials and reusable resources from the above products has become more important. .
In particular, with regard to electronic circuits, and eventually printed circuit boards, the practical life thereof is remarkably reduced, and conductive members for patterns formed on the printed circuit board such as copper and the like are mounted on the printed circuit board. There is also a strong social demand for separating and collecting various electronic circuit elements such as resistors and the solder connecting them. Therefore, Japanese Patent Application Hei 8-
No. 344962 discloses a technique of applying a high-voltage pulse between an electrode pair to generate a pulse discharge between the electrode pairs, and using a shock wave or heat generated during the pulse discharge to separate a material from a printed circuit board or the like. was suggested.

[0003]

In the technique according to the above-mentioned patent application, a material separated from the printed board or the like stays on the electrode pair in order to dispose a printed board or the like between the electrode pairs. There was a case. In this case, despite the completion of the separation process, the shock waves and heat generated by the pulse discharge will continue to be applied to the separated material, and crushing and separation will be performed more than necessary. There was a risk that subsequent collection would be hindered.
In addition to the case where the material is separated from the printed circuit board or the like, there is the same fear as described above when the material such as rock or concrete is crushed by the shock wave and heat generated by the pulse discharge. In order to solve such problems in the prior art, the present invention is to improve an electric discharge treatment device for crushing / separation, and to discharge crushed or separated small pieces from a treatment area where crushing or separation is performed. The object of the present invention is to provide a crushing / separating discharge treatment apparatus which can prevent the above-mentioned small pieces from staying in an electrode pair or the like and continuing to be crushed or separated by providing discharge holes for the crushing and separation. It is. For example, Japanese Patent Application No. Hei 10-13837
In Unit 2, as an equipment for purifying organic waste liquid such as domestic wastewater, an instantaneous high voltage is applied to the organic waste liquid, and eventually to the sludge contained in the waste liquid, to reform the material of the organic waste liquid. There has been proposed a discharge treatment apparatus for reforming an organic waste liquid to be subjected to a biological treatment by an aerobic microorganism later, that is, a so-called aerobic treatment. Even in this discharge treatment apparatus for organic waste liquid reforming, if the organic waste liquid that has undergone the reforming treatment by instantaneous high voltage application stagnates in the treatment area, the organic waste liquid can be smoothly processed for aerobic treatment. Adverse effects such as the inability to send Therefore, the present invention not only provides the above-described discharge treatment apparatus for crushing and separation, but also does not perform excessive discharge treatment on the organic waste liquid that has undergone the reforming treatment by instantaneous high voltage application. Another object of the present invention is to provide a discharge treatment apparatus for reforming an organic waste liquid, which can be smoothly sent to the subsequent aerobic treatment.

[0004]

In order to achieve the above object, according to the first aspect of the present invention, a discharge treatment apparatus for performing a discharge treatment for reforming an object to be treated has been subjected to a discharge treatment in a treatment area. The discharge processing apparatus is characterized in that a discharge hole for discharging the object to be processed out of the processing area is provided in a member in the processing area. According to a second aspect of the present invention, there is provided an electrode pair, and high voltage pulse applying means for applying a high voltage pulse between the electrode pairs, wherein the high voltage pulse applying means applies the high voltage pulse between the electrode pairs. A pulse processing is performed by applying a pulse to generate a pulse discharge between the pair of electrodes and performing a discharge process for modifying a workpiece disposed between the pair of electrodes. The discharge processing apparatus is characterized in that a discharge hole for discharging an object to be processed from a processing region where the discharge processing is performed is provided in one or both of the electrode pairs. . According to a third aspect of the present invention, in the discharge processing apparatus of the second aspect, the discharge hole is provided in at least an electrode of the electrode pair located below the workpiece. Is the gist. According to a fourth aspect of the present invention, in the discharge processing apparatus according to the second or third aspect, the discharge holes are formed in a mesh shape in the electrode pair, and discharge processing is performed from the discharge holes formed in the mesh shape. The gist of the present invention is to discharge the object to be processed reformed in the above.

According to a fifth aspect of the present invention, there is provided a discharge processing apparatus according to any one of the first to fourth aspects,
The gist is that the object to be treated is a solid substance, and the modification of the object to be treated is crushing or separation of the object to be treated. According to a sixth aspect of the present invention, in the discharge processing apparatus according to the second or third aspect, the object to be processed is a solid substance, and the modification of the object to be processed is performed by modifying the object to be processed. In a crushing or separation process, the object to be processed is placed on a mesh member inserted between the electrode pairs, and small pieces selected by the mesh member are discharged to the discharge member provided on the electrode. The gist of the present invention is that the material is discharged from the processing area through the hole. The invention according to claim 7 is
The gist of the present invention is that the electrode pair is immersed in a liquid medium. According to an eighth aspect of the present invention, in the discharge processing apparatus according to the seventh aspect, the object to be processed is configured by joining a plurality of materials having different specific gravities. The gist is that the specific gravity is set to be smaller than the average specific gravity of the plurality of materials and larger than the minimum specific gravity of the plurality of materials. The invention according to claim 9 is the invention according to claim 5.
8. The discharge processing apparatus according to any one of the items 8, wherein the object to be processed is one in which one or both of the conductive member for circuit pattern and the electronic circuit element and the substrate are joined. I do. According to a tenth aspect of the present invention, in the discharge processing apparatus according to any one of the fifth to eighth aspects, the object to be processed is a semiconductor package in which a conductive member is sealed. And According to an eleventh aspect of the present invention, in the discharge treatment apparatus according to any one of the first to fourth aspects, the gist is that the object to be treated is an organic waste liquid.

According to the discharge processing apparatus of any one of claims 1 to 4, after the object to be processed is subjected to an appropriate discharge processing without being stagnated in the processing area of the discharge processing,
The discharge can be quickly performed out of the processing area, and excessive discharge processing can be avoided. Claim 5 to Claim 10
According to the discharge treatment apparatus described in any one of the above, in the case where the crushing or separation processing of the solid substance to be processed is the discharge treatment here, the discharge processing apparatus in the processing area where the crushing or separation processing is performed is performed. For example, the electrode pair is provided with a discharge hole for discharging the crushed or separated object to be processed, and the sufficiently crushed or separated small pieces are subjected to vibration of the electrode pair caused by pulse discharge, gravity, and the like. As a result, small pieces that have been discharged from the processing area through the discharge holes and have not been crushed or separated remain in the processing area, so that the object to be processed such as a printed circuit board can be easily reduced to an appropriate size. Can be crushed or separated. Further, for example, if the discharge holes are provided in a mesh form as in the discharge treatment apparatus according to the fifth aspect, or if a mesh member is separately provided as in the discharge treatment apparatus according to the sixth aspect, Small pieces crushed or separated according to the size of the holes can be easily selected, and subsequent processing such as recovery can be speeded up. Further, when the electrode pair is immersed in a liquid medium as in the discharge processing apparatus according to the seventh aspect, the electrode pair is immersed in the liquid medium in addition to the action of directly applying a high voltage to the object by discharge. An indirect action such as a shock wave generated can also contribute to the discharge treatment here, that is, the crushing / separation treatment of the object to be treated. Further, as in the electric discharge treatment apparatus according to the eighth aspect, the object to be treated is formed by joining a plurality of materials having different specific gravities, and the specific gravity of the liquid medium is:
If the specific gravity of the plurality of materials is set to a value smaller than the average specific gravity of the plurality of materials and larger than the minimum specific gravity of the plurality of materials, the difference in the specific gravity of the crushed and separated small pieces of the object to be processed is determined. Sorting can be easily performed. According to the discharge treatment apparatus of the eleventh aspect, by treating an object to be treated as an organic waste liquid, the organic waste liquid, and thus the waste liquid, can be used as a facility for purifying organic waste liquid such as domestic wastewater. Instantaneous high voltage is applied to the sludge contained in the wastewater, the material of the organic wastewater is reformed, and the organic wastewater is subjected to biological treatment by aerobic microorganisms, that is, so-called aerobic treatment. A discharge treatment device for the reforming treatment can be configured, and the treated organic waste liquid is smoothly sent to the subsequent aerobic treatment without stagnation in the treatment area of the organic waste liquid to be treated. Can be.

[0007]

Embodiments of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The following embodiment is a specific example of the present invention and does not limit the technical scope of the present invention. Here, FIG. 1 is a diagram showing a schematic configuration of a discharge treatment apparatus according to an embodiment of the present invention, more specifically, a discharge treatment apparatus for crushing and separation. First, an electric discharge treatment apparatus according to an embodiment of the present invention uses a material such as the conductive member or the electronic circuit element from a printed circuit board to which an electronic circuit element such as a conductive member for a circuit pattern or a resistor is bonded. It is used as a separating device. As shown in FIG.
The discharge processing apparatus A1 according to the present embodiment includes an electrode pair 2,
A high voltage pulse applying means 3 for applying a high voltage pulse between the electrode pairs 2 is provided, and the printed circuit board 1 to be separated is disposed between the electrode pairs 2. In the discharge processing device A1, a high-voltage pulse discharge is generated between the electrode pair 2, and the printed circuit board 1 is crushed by a shock wave and heat generated by the pulse discharge. The material such as the element is the printed circuit board 1
Particularly, in this apparatus, since the mesh electrode is used for the cathode electrode a2 below the printed board 1 in the electrode pair 2, the printed board 1 is crushed or separated. If the size is smaller than the mesh diameter of the mesh electrode 2, it is discharged from between the electrode pairs 2, so that unnecessary crushing and separation can be prevented.

Next, the details of the discharge processing apparatus A1 will be described. In the discharge processing apparatus A1, the printed circuit board 1, which is an object to be separated and is an example of an object to be processed,
First, it is arranged between the electrode pairs 2. The electrode pair 2 is
A rod-shaped anode electrode 2a made of copper, tungsten, etc.
And an anode electrode 2a which is a dish-shaped mesh electrode.
Electrode 2b set to be relatively negative with respect to
And The electrode pair 2 is connected to a high voltage pulse generator 3 having a booster circuit such as a Marx circuit, for example, and a high voltage pulse of about several hundred kV is applied between the electrode pair 2. And the high voltage pulse generator 3
When a high-voltage pulse of about several hundred kV is applied between the electrode pairs 2, a pulse discharge occurs between the electrode pairs 2, and a shock wave or heat generated by the pulse discharge causes the arrangement between the electrode pairs 2. The material is separated from the printed circuit board 1 thus separated. The curved surface shape of the cathode electrode 2b is configured so as to form a substantially equal electric field with respect to the anode electrode 2a over the entire surface facing the anode electrode 2a. The pulse discharge generated between the two is spread and formed in a plane, and the crushing or separation process is uniformly performed over the entire surface of the cathode electrode 2b. The material placed in the processing area where the shock waves and heat generated by the pulse discharge propagate and crushed or separated from the printed circuit board 1 falls onto the cathode electrode 2b located below the printed circuit board 1. by the way,
When a plate-like member having no hole is used for the cathode electrode 2b, the material crushed or separated from the printed circuit board 1 falls on the cathode electrode 2b and stays there. In this case, the material dropped onto the cathode electrode 2b is crushed or separated more than necessary by the next pulse discharge, although the crushing or separation has been completed.

Therefore, in the discharge processing apparatus A1 according to the present embodiment, a mesh electrode is used for the cathode electrode 2b. The opening (discharge hole) of this mesh electrode is
For example, it is set to about 1 mm to 5 mm. Since the size of a metal piece such as an IC of the printed board 1 is usually 3 to 5 mm or more, the opening of the mesh electrode is 1 to 5 m.
By setting to about m, only the material that has been sufficiently crushed or separated is discharged from the processing area through the opening of the mesh electrode. At this time, the vibration of the mesh electrode caused by the shock wave acts, so that the material placed on the mesh electrode is suitably sieved from the mesh electrode. On the other hand, the material which is smaller than the opening of the mesh electrode and is not crushed or separated by one pulse discharge is left as it is on the cathode electrode 2b and further crushed or separated at the next pulse discharge. And is discharged from the processing area. As described above, in the discharge treatment apparatus according to the present embodiment, the cathode electrode is provided with a discharge hole in a mesh shape, and the sufficiently crushed or separated small pieces are subjected to the action of the cathode electrode vibration and gravity caused by the shock wave. As a result, the small pieces that have not been crushed or separated are discharged from the processing area where the shock wave and heat propagate through the discharge holes, and are left in the processing area. Can be crushed or separated.

[0010]

In the above embodiment, the present invention is applied to a discharge processing apparatus for separating materials such as electronic circuit elements and substrates from a printed circuit board 1. However, the present invention is not limited to this. For example, a metal member is sealed. The present invention may be applied to an apparatus for separating a semiconductor package by the above-described pulse discharge, or the present invention may be applied to an apparatus for crushing a member such as concrete or rock by the above-described pulse discharge. Such a discharge processing apparatus is also an example of the discharge processing apparatus in the present invention. Further, in the above-described embodiment, the discharge holes are provided in the cathode electrode 2b in a mesh shape. However, the present invention is not limited to this. For example, as shown in the discharge treatment device A2 shown in FIG. The two discharge holes 2h are provided in such a size that the electric field is not disturbed excessively, and the printed board 1 or the like is placed on the mesh-like supporting member 5 so that the small pieces crushed or separated into a predetermined size are formed. Are separated by the support member 5 and small pieces thereof are separated from the cathode electrode 2.
You may make it discharge | emit from the discharge hole 2h of b. Further, a punching metal provided with a plurality of discharge holes may be used for the electrode pair 2. Furthermore, when the discharge hole is not provided only in the electrode pair 2 and another member such as a reflector for reflecting a shock wave generated by the pulse discharge hinders discharge of the small pieces from the processing region, Other members may be provided with discharge holes. Further, the shape of the hole may be circular or another shape. Such a discharge processing apparatus is also an example of the discharge processing apparatus in the present invention.

In the above embodiments and examples, the electrode pair 2 may be immersed in a liquid such as water. In this case, the liquid serves as a transmission medium of the shock wave, and can contribute not only to the direct action of the discharge but also to the indirect action of the propagating shock wave to the crushing or separation, and thus more effective. Can be crushed or separated. However, when the specific gravity of the small pieces crushed or separated from the printed circuit board 1 or the like is smaller than the specific gravity of the liquid, the small pieces do not drop to the cathode electrode 2b side but float to the anode electrode 2a side. Therefore, when the anode electrode 2a is formed in a plate shape, for example, and the crushing or separation of the small pieces is prevented from floating, the anode electrode 2a alone or the cathode electrode 2b and the anode electrode 2b are not connected. The discharge holes may be provided in both of 2a. Further, if the specific gravity of the liquid is set to a value smaller than the average specific gravity of one or both of the conductive member for circuit pattern and the electronic circuit element, and larger than the specific gravity of the material having the smallest specific gravity, for example, the substrate. According to the difference in the specific gravity of the material, the material can be easily divided into a settling member and a floating member, so that the sorting process can be performed more quickly and easily. Such a discharge processing apparatus is also an example of the discharge processing apparatus in the present invention. Further, in the above embodiment, a rod-shaped electrode is used for the anode electrode 2a and a dish-shaped electrode is used for the cathode electrode 2b. However, the present invention is not limited to this.
Another form of electrode such as a ring may be used. Such a discharge processing apparatus is also an example of the discharge processing apparatus in the present invention.

Next, FIG. 3 is a diagram showing an example in which the discharge treatment device according to the present invention is applied as a discharge treatment device for reforming organic waste liquid. However, the configuration itself of the electric discharge processing apparatus A3 in FIG. 9 conforms to the electric discharge processing apparatus A1 in FIG. 1 described above. The configuration of FIG. 3 will be described below. First, here, the organic waste liquid is supplied from the passage 10 to the activated sludge tank 1.
The activated sludge is aerated while mixing the activated sludge in the activated sludge tank 11 and the organic waste liquid, and the organic waste liquid is decomposed by microorganisms in the activated sludge. Next, the mixed solution after the decomposition treatment is introduced into the sedimentation device 13 through the path 12, and the supernatant 20 and the sedimented sludge 2 are set in the sedimentation device 13.
The supernatant liquid 20 is discharged from the passage 14 as treated water. On the other hand, the settled sludge 21 is introduced into the discharge treatment apparatus A3 according to the present invention from the path 15 by the pump 16. Next, in the discharge treatment device A3, the settled sludge reformed by the high voltage pulse discharge is returned from the path 17 to the activated sludge tank 11. Further, in the activated sludge tank 11, an aerobic treatment is performed, in which aerobic microorganisms decompose the modified settled sludge. By repeating this circulation, the sludge is reduced in volume, and the amount of sludge discharged outside the system via the passage 18 is reduced. The discharge treatment target in the discharge treatment device A3 is an organic waste liquid, and more specifically, as described above, the sedimentation sludge of the organic waste liquid that has been solid-liquid separated in the precipitation device 13. The electrode pair 2 is configured to be immersed in the settling sludge in the discharge treatment device A3. As in FIG. 1, a high voltage pulse generator 3 having a booster circuit such as a Marx circuit is connected to the electrode pair 2 so that a high voltage pulse of about several hundred kV can be applied between the electrode pair 2. It has become. When a high voltage pulse of about several hundred kV is applied between the electrode pair 2 by the high voltage pulse generator 3, a pulse discharge is generated between the electrode pair 2 and a shock wave or heat generated by the pulse discharge is generated. Thereby, the reforming of the settled sludge such as the solubilization and the reduction of the molecular weight is performed in the discharge treatment device A3. That is, the microorganisms in the settled sludge are killed by application of a high-voltage pulse discharge in the discharge treatment device A3, and are further decomposed by destruction of cells, etc. to be degraded into low-molecular substances, and are subjected to the subsequent aerobic treatment. It is modified into a suitable easily decomposable substance. Note that the cathode electrode 2b is
Similarly, a mesh electrode is used, and by appropriately setting the opening (discharge hole) of the mesh electrode, it is possible to perform unnecessary discharge treatment on the settled sludge after organic waste liquid and solid-liquid separation more than necessary. The organic waste liquid after the discharge treatment can be sent to the activated sludge tank 11 smoothly. In such an embodiment where it is necessary to constantly circulate the object in the system, it is important to be able to smoothly send the object after the discharge treatment to the next step. is there.

[0013]

As described above, according to the discharge processing apparatus according to any one of the first to fourth aspects, an appropriate discharge process can be performed without stagnation of an object to be processed in a discharge processing area. After the application, it can be quickly discharged out of the processing region, and excessive discharge processing can be avoided. According to the discharge treatment apparatus of any one of claims 5 to 10, when the crushing or separation of the solid material to be treated is the discharge treatment here, the crushing or separation treatment is performed. A discharge hole for discharging the crushed or separated object to be processed is provided in, for example, an electrode pair in a processing area where the crushing or separation processing is performed. Due to the effects of pair vibration and gravity,
Small pieces that have been discharged from the processing area through the discharge holes and have not been crushed or separated remain in the processing area, so that the object to be processed such as a printed circuit board can be easily crushed or separated into an appropriate size. can do. Further, for example, if the discharge holes are provided in a mesh form as in the discharge treatment apparatus according to the fifth aspect, or if a mesh member is separately provided as in the discharge treatment apparatus according to the sixth aspect, The crushed or separated small pieces are easily selected according to the size of the hole,
Subsequent processing such as recovery can be speeded up. Further, when the electrode pair is immersed in a liquid medium as in the discharge processing apparatus according to the seventh aspect, the electrode pair is immersed in the liquid medium in addition to the action of directly applying a high voltage to the object by discharge. An indirect action such as a shock wave generated can also contribute to the discharge treatment here, that is, the crushing / separation treatment of the object to be treated. Further, as in the electric discharge treatment device according to the eighth aspect, the object to be treated is formed by joining a plurality of materials having different specific gravities, and the specific gravity of the liquid medium is equal to the plurality of materials. If the specific gravity of the material is set to a value smaller than the average specific gravity of the materials and larger than the minimum specific gravity of the plurality of materials, sorting is performed based on a difference in specific gravity of the crushed and separated small pieces of the workpiece. It can be done easily. According to the discharge treatment apparatus of the eleventh aspect, by treating an object to be treated as an organic waste liquid, the organic waste liquid, and thus the waste liquid, can be used as a facility for purifying organic waste liquid such as domestic wastewater. Instantaneous high voltage is applied to the sludge contained in the wastewater, the material of the organic wastewater is reformed, and the organic wastewater is subjected to biological treatment by aerobic microorganisms, that is, so-called aerobic treatment. A discharge treatment device for the reforming treatment can be configured, and the treated organic waste liquid is smoothly sent to the subsequent aerobic treatment without stagnation in the treatment area of the organic waste liquid to be treated. Can be.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of a discharge processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a schematic configuration of a discharge processing apparatus according to one embodiment of the present invention.

FIG. 3 is a diagram showing a schematic configuration of a discharge processing apparatus according to another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Printed circuit board (an example of a to-be-processed object) 2 ... Electrode pair 2a ... Anode 2b ... Cathode 3 ... High voltage pulse generator (an example of a high voltage pulse applying means)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4D004 AA02 AA24 AA32 AA33 CA04 CA12 CA13 CA19 CA44 CB13 CB44 4D067 CG01 DD02 DD08 4F301 AA22 AA24 AC15 BA10 BA12 BA21 BA25 BF05 BF10 BF11

Claims (11)

[Claims] In a discharge processing apparatus for performing a discharge process for modifying a workpiece, the discharge hole for discharging the workpiece after the discharge process in the processing region to the outside of the processing region is provided. An electric discharge treatment apparatus provided on a member in a treatment area. 2. An electrode pair, and high voltage pulse applying means for applying a high voltage pulse between the electrode pairs, wherein the high voltage pulse is applied between the electrode pairs by the high voltage pulse applying means. In a discharge processing apparatus that generates a pulse discharge between the pair of electrodes and performs a discharge process for modifying a workpiece disposed between the pair of electrodes, the workpiece that has been modified by the discharge process is A discharge processing apparatus, wherein a discharge hole for discharging from a processing area where the discharge processing is performed is provided in one or both electrodes of the electrode pair. 3. The discharge processing apparatus according to claim 2, wherein the discharge hole is provided in at least an electrode of the electrode pair located below the workpiece. 4. The method according to claim 2, wherein the discharge holes are formed in a mesh shape in the electrode pair, and the object to be processed, which has been modified by a discharge treatment, is discharged from the discharge holes formed in the mesh shape. 4. The discharge treatment device according to 3. 5. The object to be processed is a solid substance,
The discharge treatment apparatus according to any one of claims 1 to 4, wherein the modification of the object is crushing or separation of the object. 6. The object to be processed is a solid substance,
The modification of the object is crushing or separation of the object, and the object is placed on a mesh member inserted between the electrode pairs, and sorted by the mesh member. 4. The discharge processing apparatus according to claim 2, wherein the small pieces are discharged from the processing region through the discharge holes provided in the electrode. 7. The electric discharge treatment apparatus according to claim 5, wherein the electrode pair is immersed in a liquid medium. 8. The object to be processed is formed by joining a plurality of materials having different specific gravities, wherein the specific gravity of the liquid medium is smaller than an average specific gravity of the specific gravities of the plurality of materials. The discharge processing apparatus according to claim 7, wherein the specific gravity of the plurality of materials is set to a value larger than the minimum one. 9. The method according to claim 5, wherein the object to be processed is one in which one or both of a conductive member for a circuit pattern and an electronic circuit element and a substrate are joined. An electric discharge treatment device according to the item. 10. The semiconductor device according to claim 5, wherein the object to be processed is a semiconductor package in which a conductive member is sealed.
An electric discharge treatment device according to the item. 11. The discharge processing apparatus according to claim 1, wherein the object to be processed is an organic waste liquid.