JP2000133053A - Enameled wire and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an enameled wire and an IC card obtained by winding the enameled wire capable of rapidly and easily carrying out a soldering connection work in spite of omitting an attack soldering of the enameled wire terminal, having a high connection reliability and capable of extremely enhancing a quality and a productivity of an antenna coil. SOLUTION: (1) The enameled wire is constituted by providing a solder plating layer 6 on a copper wire 3 as a conductive line and providing an enamel film layer 7 on the solder plating layer 6. (2) In an IC card provided with an IC module constituted by connecting the enameled wire terminal of an antenna coil obtained by winding the enameled wire with a terminal part of an IC chip, as the enameled wire, a solder plating copper wire soldering enameled wire is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
It concerns the C card.

[0002]

2. Description of the Related Art In general, in the production of electric equipment coils, first, an enameled wire is coil-wound by a coil winding machine, and then the enameled wire terminal of the obtained electric equipment coil is replaced with an electric equipment terminal or a lead wire. It is electrically connected by soldering. Since the production volume of such an electric device coil is enormous, the soldering work of the enameled wire terminal of the electric device coil requires quickness.

[0003] In the soldering work of an enamel wire end of an electric device coil obtained by coil winding using a general-purpose enamel wire, first, the enamel film of the enamel wire end of the electric device coil is mechanically peeled off. The conductor is exposed and then soldered onto the exposed conductor.

[0004] As described above, in the work of soldering the enamel wire end of an electric device coil obtained by winding a coil using a general-purpose enamel wire, for example, a polyamideimide enamel wire, the enamel film of the enamel wire end of the electric device coil is used. Since it is necessary to solder after mechanically peeling off, the productivity is low, and there is a concern that the conductor may be damaged at the time of mechanically peeling off the enamel film. For this reason, the enamel wire for general use is hardly used as a magnet wire for electric equipment coils for mass production, especially for small electric equipment coils.

On the other hand, in the soldering work of the enameled wire end of an electrical equipment coil obtained by winding a coil using a brazeable enameled wire, for example, a polyurethane enameled wire, the enameled wire of the electrical equipment coil is enameled. The coating can be soldered directly onto the brazeable polyurethane enamel coating without mechanical peeling.

On the other hand, in order to further improve the workability of soldering an enameled wire terminal of an electric device coil to a terminal of an electric device, a lead wire, or the like, the enameled wire terminal of the electric device coil must be previously received and soldered. Has been done.

[0007] The soldering operation of the coil of an electric device obtained by winding an enameled wire having a conductor diameter of 0.1 mm or more to the end of the enameled wire can be performed only at the terminal.
Since the productivity is low and the cost is high, there are few opportunities for practical use.

On the other hand, in recent years, soldering work speed has been increased for electrical equipment requiring high reliability, such as electrical equipment for space, nuclear power, medical electrical equipment, micromachine electrical equipment, and IC cards. In addition to the improvement of the soldering, the demand for the improvement of the soldering reliability has been further increased. For this reason, the soldering operation has been reviewed in order to improve the soldering speed and the soldering reliability.

[0009] The enameled wire size for practically performing the welcome soldering operation requires soldering reliability in terms of price, function, reliability, etc. and requires the welcome soldering operation. Conductor diameter is φ0.1mm
It is an enameled wire of the following size. Further, as the type of the enameled wire, a brazeable enameled wire that can be soldered without peeling the enamel coating, such as a polyurethane enameled wire, a brazeable polyester enameled wire, a brazeable polyesterimide enameled wire, a brazed Adhesive polyamideimide enameled wire and the like.

FIG. 4 is a perspective view showing the internal structure of a conventional IC card.

In FIG. 4, reference numeral 1 denotes an IC module, and 2 denotes a gold-plated conductive wire enameled wire antenna coil.

That is, the internal structure of a conventional IC card is
It is formed by connecting the enameled wire terminal of the antenna coil 2 to the connection terminal of an IC chip (not shown) of the C module 1. Here, the IC module 1 performs storage, processing, output, and the like of information data, and the gold-plated conductor enameled wire winding antenna coil 2 exchanges power and exchanges information.

Here, the terminal portion of the IC chip of the IC module 1 has a gold-plated surface formed by gold plating or a gold-deposited surface formed by depositing gold. The enameled wire of the gold-plated conductive wire enameled wire antenna coil 2 is a gold-plated conductive wire enameled wire, but may be a gold-deposited conductive wire enameled wire.

FIG. 5 is a sectional view of such a gold-plated conductive wire enameled wire.

In FIG. 5, 3 is a copper wire, 4 is a gold plating layer, and 5 is an enamel coating layer.

The connection between the terminal portion of the IC chip and the enameled wire terminal of the gold-plated conductive wire enameled wire antenna coil 2 is performed by spot welding or crimping.

[0017]

As described above, the conventional I
In the C card, an expensive gold-plated conductor enamel wire or a gold-deposited conductor enamel wire is used as the enamel wire of the antenna coil 2 of the gold-plated conductor conductor, and the terminal portion of the IC chip 1 is also gold-plated. Therefore, it is necessary to use a gold-plated surface, and the production cost is disadvantageously increased. In addition, the connection between the terminal portion of the IC chip and the enamel wire terminal of the antenna coil 2 has to be performed by spot welding or crimping or the like, which makes connection of an extremely small size difficult.

The present invention has been made in view of such a point, and it is an object of the present invention to solve the above-mentioned disadvantages of the prior art and to omit the soldering of an enameled wire terminal. An enameled wire that can be quickly and easily soldered and has high connection reliability, thereby significantly improving the quality and productivity of the antenna coil, and can be obtained by winding the enameled wire. To provide an IC card.

[0019]

The gist of the present invention lies in the following two points.

(1) An enameled wire characterized in that a solder plating layer is provided on a conductive wire, and an enamel coating layer is provided on the solder plating layer.

(2) In an IC card having an IC module formed by connecting an enamel wire terminal of an antenna coil obtained by winding an enamel wire and a terminal portion of an IC chip, the enamel wire is solder-plated. An IC card comprising a copper wire brazing enamel wire.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the enameled wire of the present invention and I
An embodiment of the C card will be described.

In the present invention, the conductor is preferably a copper wire. Further, as the copper wire, any of a tough pitch copper wire and an oxygen-free copper wire may be used. The cross-sectional shape of the conductor may be a circle, an ellipse, a square, a polygon, or the like.

In the present invention, as the solder plating layer,
When the enamel paint is applied on the solder plating layer and then baked at a high temperature, it is desirable that the solder plating layer is not easily melted by heat. For example, an electroplating high melting point solder layer containing 90% or more of tin is preferable.

In the present invention, examples of the enamel film layer include a brazeable enamel film such as a polyurethane enamel film, a polyesterimide enamel film, and a polyamideimide enamel film.

[0026] The solder-plated conductor enameled wire of the present invention may be provided with an enamel coating layer on the solder-plated conductive wire, and further provided with a fusion layer on the enamel coating layer.

The enameled wire of the present invention can be used not only for coils of IC cards, but also for micromachines, small precision medical devices,
It can also be used for electrical equipment for nuclear power, measurement equipment, and the like.

[0028]

Next, embodiments of an enameled wire and an IC card will be described.

(Enameled wire of Example 1) First, the conductor diameter φ
A high melting point solder plating composed of tin 95: lead 5 was applied on a 0.080 mm copper wire by electrolytic plating so that the thickness of the solder plating layer was 0.002 mm.

Next, on the high melting point solder plating layer of the high melting point solder plated copper wire thus obtained, a brazing polyurethane enamel paint is applied so that the thickness of the brazing polyurethane enamel film is 0.020 mm. Was repeatedly applied and baked to obtain an enameled wire of Example 1.

FIG. 1 is an enlarged sectional view of the enameled wire of Example 1 thus obtained.

In FIG. 1, 3 is a copper wire, 6 is a high melting point solder plating layer, and 7 is a brazeable polyurethane enamel coating layer.

(Enameled wire of Example 2) First, the conductor diameter φ
A high melting point solder plating composed of tin 95: lead 5 was applied on a 0.080 mm copper wire by electrolytic plating so that the thickness of the solder plating layer was 0.002 mm.

Next, on the high melting point solder plating layer of the high melting point solder plated copper wire thus obtained, a brazing polyurethane enamel paint is applied so that the thickness of the brazing polyurethane enamel film becomes 0.016 mm. Was repeatedly applied and baked to obtain an enameled wire.

Next, a heat-fusible copolymerized polyamide resin paint was applied to the enameled wire obtained above so that the thickness of the fused layer became 0.004 mm, and baked, whereby the enameled wire of Example 2 was obtained. (Self-fusing enameled wire) was obtained.

FIG. 2 is an enlarged sectional view of the enameled wire of Example 2 thus obtained.

In FIG. 2, 3 is a copper wire, 6 is a high melting point solder plating layer, 7 is a brazing polyurethane enamel coating layer,
8 is a fusion layer.

(Enameled wire of Comparative Example 1) First, the conductor diameter φ
A brazeable polyurethane enamel paint was repeatedly applied and baked on a 0.080 mm copper wire so that the thickness of the brazeable polyurethane enamel film became 0.020 mm, whereby an enameled wire of Comparative Example 1 was obtained.

(Enameled wire of Comparative Example 2) First, the conductor diameter φ
Gold plating was performed on a 0.080 mm copper wire by electrolytic plating so that the thickness of the gold plating layer was 0.002 mm.

Next, a brazeable polyurethane enamel paint is repeatedly applied and baked on the gold plating layer of the gold plated copper wire thus obtained so that the brazeable polyurethane enamel film thickness becomes 0.020 mm. By doing so, an enameled wire of Comparative Example 2 was obtained.

(IC Card Manufactured Using Enamel Wire of Example 1) An antenna coil for an IC chip was wound using the enamel wire of Example 1.

Next, the enameled wire terminal of the obtained antenna coil was soldered to the terminal portion of the IC chip, and then assembled by a conventional method to obtain the enameled wire wound IC card of Example 1.

FIG. 3 is an explanatory perspective view of the enameled wire wound IC card according to the first embodiment thus obtained.

In FIG. 3, reference numeral 1 denotes an IC module, 9 denotes an IC chip, and 10 denotes a solder-plated conductor enameled wire wound antenna coil.

(IC Card Manufactured Using Enamelled Wire of Example 2) An antenna coil for an IC chip was wound using the enameled wire of Example 2.

Next, the enameled wire terminal of the obtained antenna coil was soldered to the terminal portion of the IC chip, and then assembled by a conventional method to obtain an enameled wire wound IC card of Example 2.

(IC Card Manufactured Using the Enamel Wire of Comparative Example 1) An antenna coil for an IC chip was wound using the enamel wire of Comparative Example 1.

Next, the enameled wire terminal of the obtained antenna coil was soldered to the terminal portion of the IC chip, and then assembled by a conventional method to obtain an enameled wire wound IC card of Comparative Example 1.

(IC Card Manufactured Using Enamel Wire of Comparative Example 2) An antenna coil for IC chip was wound using the enamel wire of Comparative Example 2.

Next, the enameled wire terminal of the obtained antenna coil was soldered to the terminal portion of the IC chip, and then assembled by a conventional method to obtain an enameled wire wound IC card of Comparative Example 2.

(Characteristics comparison) The characteristics were tested as follows.

A. Solderability of enameled wire The test enameled wire was immersed in a tin 50: lead 50 solder bath melted at 320 ° C., and the solderable time was measured. However, those that could not be soldered were indicated by x.

B. Price ratio of enamel wire The price ratio when the enamel wire of Comparative Example 1 was set to 1 is shown.

[0054] c. Terminal connection of enameled wire of IC card coil
Special equipment such as spot welding for connection
Necessary items are indicated by x.

[0055] d. When the enameled wire terminals of the pick-up solder IC card coil are connected on the production line, those that do not require pick-up solder are indicated by 、, and those that do need are indicated by x.

[0056] e. Terminal connection of enameled wire of IC card coil
An enameled wire terminal of a continuous reliability IC card coil was connected on a production line, and a tensile test was performed on the connected portion. A test piece having a large tensile strength was indicated by ○, and a test piece having a low tensile strength was indicated by ×.

F. Productivity of IC Card Coil The productivity when the enameled wire terminals of the IC card coil were connected on a production line was compared with the enameled wire of Comparative Example 1 as 1.

G. Q value of IC card coil The Q value of the IC card coil was measured by an ordinary method, and those having a large Q value were indicated by ○ and those having a small Q value were indicated by x.

Table 1 shows the results of these characteristic tests.

[0060]

[Table 1]

As can be seen from Table 1, the price of the enameled wire of Comparative Example 1 is the lowest, but the enameled wire solderability, special terminal connection equipment, soldering, terminal connection reliability, coil productivity, and coil Q Values are bad. The enameled wire of Comparative Example 2 has the highest price, and is also poor in enameled wire solderability, terminal connection special equipment, terminal connection reliability, coil productivity, coil Q value, and the like.

On the other hand, the enameled wires of Examples 1 and 2 are much lower in price than the conventional enameled wire of Comparative Example 2, and have good solderability, special terminal connection equipment,
Terminal connection reliability, coil productivity, coil Q value, etc. all showed excellent results. Although not shown in Table 1, the enameled wire of Example 2 had self-fusing properties, so that there was no variation in the coil, and as a result, a compact coil having stable electrical characteristics was obtained.

[0063]

The enameled wire of the present invention is inexpensive and has excellent solderability. As a result, electric equipment coils wound using the enameled wire do not require special equipment for terminal connection, And has many excellent features such as high coil terminal connection reliability, high coil productivity, and a large coil Q value, and is industrially useful.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of an enameled wire according to a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view of an enameled wire according to a second embodiment of the present invention.

FIG. 3 is an explanatory perspective view of an enameled wire wound IC card according to the first embodiment of the present invention.

FIG. 4 is an explanatory perspective view showing the internal structure of a conventional IC card.

FIG. 5 is an enlarged cross-sectional view of a conventional enameled gold-plated conductive wire.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 IC module 2 gold-plated conductor conductor enameled wire wound antenna coil 3 copper wire 4 gold-plated layer 5 enamel coating layer 6 high melting point solder plating layer 7 brazeable polyurethane enamel coating layer 8 fusion layer 9 IC chip 10 solder plating lead Conductor enameled wire wound antenna coil

Claims (7)

[Claims] 1. An enameled wire comprising: a conductive wire having a solder plating layer provided thereon; and an enamel coating layer provided on the solder plating layer. 2. The enameled wire according to claim 1, wherein the solder plating layer is an electroplating high melting point solder layer containing 90% or more of tin. 3. The enameled wire according to claim 1, wherein the enamel coating layer is a brazeable polyurethane enamel coating. 4. The enameled wire according to claim 1, wherein a fusion layer is provided on the enamel coating layer. 5. An IC card comprising an IC module formed by connecting an enameled wire terminal of an antenna coil obtained by winding an enameled wire and a terminal portion of an IC chip.
The enameled wire is a solder-plated copper wire conductor brazeable enameled wire. 6. The IC card according to claim 5, wherein the solder-plated copper wire conductor of the soldering enameled wire comprises an electroplated high melting point solder layer containing 90% or more of tin. . 7. A solder-plated copper wire conductor brazeable enameled wire is a solder-plated copper wire conductor brazeable polyurethane enamel wire, a solder-plated copper wire conductor brazeable polyesterimide enamel wire, a solder-plated copper wire conductor brazeability. 6. The IC card according to claim 5, wherein the IC card is one selected from polyamide imide enameled wires.