JP2000100855A - Bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding device, which can determine the position of a frame at high speed with high accuracy. SOLUTION: This device comprises a detection part 1, comprising a unidimensional line sensor 1a, a control part 2 having a drive circuit 2a for driving the unidirectional line sensor 1a and a light source part 3 for generating parallel light. Parallel light from the light source part 3 is emitted from the lower part of a frame. The parallel light is received by the unidirectional line sensor 1a. The level of the output signal from the unidirectional line sensor 1a is determined, and the position of the frame is detected. From the data of the detected position, the conveying amount of a frame conveying mechanism, which conveys frame to the specified bonding position, is controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus having a position detecting means capable of detecting a position of a frame at high speed and with high accuracy.

[0002]

2. Description of the Related Art Conventionally, a wire bonding apparatus as a bonding apparatus has a plurality of lead frames as a frame arranged and housed in a magazine, and the lead frames are provided with a plurality of semiconductor components at predetermined intervals in a longitudinal direction. I
C chip). A frame transfer device as a frame transfer means for transferring the lead frame sequentially extrudes the lead frames in the magazine out of the magazine and transfers them to a predetermined bonding position.

The frame transfer device as the frame transfer means includes a frame pushing means for sequentially pushing out a part of the lead frames arranged and stored in the magazine out of the magazine, and a lead frame pushed by the frame pushing means to the lead. A frame transport mechanism that intermittently feeds the IC chips on the frame at an array pitch and transports the IC chip to a bonding position is provided, and a detection unit that detects that the lead frame has reached the starting position for the transport is provided.

[0004] The lead frame conveyed to the bonding position is heated by a heater block as heating means. Next, the bonding means uses a bonding tool (capillary) to wrap a conductive wire between the electrode (pad) on the IC chip attached to the lead frame and the lead of the lead frame. Perform bonding connection.

[0005] As a conventional bonding apparatus provided with a detecting means, there is a frame transfer apparatus as a frame transfer means shown in FIG.

FIG. 7 is a plan view showing a frame transfer device of a wire bonding apparatus provided with a conventional detecting means, including a partial cross section. FIG. 8 is a side view showing a main part of the conventional detecting means. is there. FIG. 9A shows the state shown in FIG. 7 and FIG.
It is a figure which shows the change of the light intensity obtained by the light receiving element with which the conventional detection means is provided, a horizontal axis represents a position and the vertical axis | shaft represents the light intensity. Note that, in FIG.
a is shown by a dotted line for convenience of explanation.

First, with reference to FIGS. 7 to 9, a description will be given of a conventional frame transport device provided with a detecting means.

As shown in FIG. 7, a conventional frame transport device 101 is a magazine 32 in which a plurality of rectangular lead frames 31 as a transported object are arranged and stored in the vertical direction, that is, in the direction perpendicular to the paper surface. A magazine receiver 33 for holding the
An elevating mechanism (not shown) for intermittently lowering or raising the pitch of each of the lead frames 31 arranged and stored in the
The magazine 3 is linked with the operation of the lifting mechanism (not shown).
A push mechanism 37 for pushing out the lead frames 31 in the sheet 2 one by one; a frame transport mechanism 40 for transporting the lead frame 31 pushed out of the magazine to the side of a lifting / lowering mechanism (not shown) to a bonding position 50; Detecting means 70 for detecting that the lead frame 31 as the conveyed object has reached the starting position of conveyance by the frame conveying mechanism 40. Further, the lifting mechanism (not shown) and the push mechanism 37 constitute a frame pushing means.

The push mechanism 37 includes a base 51, a guide shaft 52 fixed on the base 51, a slider 53 guided by the guide shaft 52,
A pusher 54 attached to the slider 53, the tip of which abuts against each of the lead frames 31 in the magazine 32 and pushes the lead frames one by one out of the magazine 32, and a pusher 54 via the slider 53.
And an air cylinder 55 for driving the air cylinder.

The frame transport mechanism 40 is provided with the magazine 3
A pair of guide rails 42a and 42b, which are arranged in parallel so as to sandwich the lead frame 31 extruded from the two sides from both sides in the width direction, and are relatively close to and separated from each other; Feed screw 44a screwed to guide rail 42b
And a feed screw 44b, and a motor 45a and a motor 45b as drive means for applying torque to the feed screw 44a and the feed screw 44b, respectively. The lead frame 31 is moved along the guide rails 42a and 42b. Transporting means (not shown) for transporting in the direction of the bonding position 50.

When the motor 45a and the motor 45b rotate forward or backward, the distance between the guide rails 42a and 42b can be varied, and the width of the frame changes due to the change of the lead frame type. It can be adapted to.

The conventional lead frame detecting means 70 comprises:
The detection unit includes a reflection type fiber sensor 60 and a control unit (not shown) provided at the rear end of the reflection type fiber sensor 60.

As schematically shown in FIGS. 9 (a) and 9 (b), the reflection type fiber sensor 60 as a detecting portion is, in this case, a metal outer cylinder 60e such as stainless steel having a section diameter of about 2 mm. Among them, a plurality of light projecting fibers 60a and a plurality of light receiving fibers 60b are randomly mixed. At the rear end, a light-emitting connector (not shown) for bundling the light-emitting fiber 60a and a light-receiving connector (not shown) for bundling the light-receiving fiber 60b are drawn out.

As shown in FIG. 8, the reflection-type fiber sensor 60 as a detection unit has an angle of about 90 degrees so that a portion of about 1 cm from the tip faces the lead frame 31 as a conveyed object from above. It is bent. Further, the lead frame 31 whose leading end is conveyed along the guide rails 42a and 42b.
And a position where the lead frame 31 extruded by the pusher mechanism 37 can be conveyed by conveying means (not shown) of the frame conveying mechanism 40, that is, Corresponding to the transport starting position, the frame is fixed on a base (not shown) of the frame transport device 101 on the guide rail 42a side via a bracket 65.

A control unit (not shown) of the detecting means 70
A light emitting element for projecting light through the light projecting fiber 60a, and a reflected light of the projected light to the light receiving fiber 6a.
A light-receiving element that receives light through an optical signal Ob and converts it into an electric signal;
While controlling the operation of the light emitting element and the light receiving element, it is configured by a control circuit or the like that detects an electric signal from the light receiving element and outputs a signal, and the like of the reflection type fiber sensor 60 as a detection unit. A light emitting side connector (not shown) and the light receiving side connector (not shown) respectively include a light emitting side connector (not shown) leading to the light emitting element and a light receiving side connector (not shown) leading to the light receiving element. ) And connected to.

Next, the conventional lead frame detecting means 7
0 and the operation of the conventional frame transport apparatus 101 will be described with reference to FIGS. FIG. 10 is a flowchart showing the operation of the conventional frame transport device 101.

First, by rotating the motor 45a and the motor 45b of the frame transfer device 101 forward or backward, the guide rails 42a and 42b are adjusted to have a width suitable for the lead frame 31 to be transferred.
Adjust the spacing of Thereafter, the output shaft of the air cylinder 55 provided in the push mechanism 37 is pulled in, and the pusher 54 moves in the direction of the arrow X. Thereby, of the plurality of lead frames 31 arranged and stored in the magazine 32, for example, the tip of the pusher 54 contacts the rear end of the lowermost one, and the lead frame 31 is pushed by a certain amount. It is sent out of the magazine 32 (step S1 in FIG. 10).

The sent lead frame 31 is transported by the frame transport mechanism 40 to a location near the detection means 70 by a predetermined amount (step S2 in FIG. 10).

Next, the lead frame 31 is continuously moved toward the detecting means 70 at a low speed by the frame transport mechanism 40 (step S3 in FIG. 10).

As shown in FIG. 9A, the detecting means 7
Numeral 0 denotes light projected from a light emitting element of the control unit (not shown) from the light projecting fiber 60a, and a detection range Y of the detecting means 70 (shown by oblique lines in FIG. 9A). When the leading end of the lead frame 31 as a conveyed object enters in (), the projection light is reflected on the lead frame 31. The light reflected on the lead frame 31 is received by the light receiving element of the control unit (not shown) via the light receiving fiber 60b. At this time, FIG.
As shown in (b), the intensity of light received by the light receiving element exceeds the operating point of the light receiving element, and the light receiving element converts the received light into an electric signal and outputs the electric signal. A control circuit of the control unit (not shown) detects an electric signal output from the light receiving element, and outputs a signal indicating that the lead frame 31 has reached a transport start position at which the lead frame 31 can be transported by the frame transport mechanism 40. Output (Step S4 in FIG. 10).

When a signal indicating that the lead frame 31 has reached the transport starting position at which the lead frame 31 can be transported by the frame transport mechanism 40 is output from a control circuit of the control unit (not shown), the lead by the frame transport mechanism 40 is output. Frame 3
1 is stopped (Step S5 in FIG. 10).

Then, based on a signal output from the control circuit of the control section (not shown), the frame transport mechanism 40 operates, and the lead frame 31 is transported to the bonding position 50 (FIG. 10). Step S
6).

Thereafter, a bonding operation is sequentially performed between the IC chip held on the lead frame 31 by bonding means (not shown) and the leads of the lead frame 31 disposed around the IC chip. . The lead frame 31 on which the bonding operation has been completed.
Is further transported in the direction of arrow X by the frame transport mechanism 40 and collected in the magazine on the unloader side.

Subsequently or in conjunction with the above-described series of operations, the magazine receiver 33 of the elevating mechanism (not shown) is lowered by one pitch of the arrangement pitch of the lead frame 31, and The lead frame 31 is pushed out of the magazine 32 by the pusher 54. Hereinafter, the above-described series of operations are similarly repeated for the second and subsequent lead frames.

[0025]

In the conventional frame transfer apparatus 101, the lead frame 31 is pushed out of the magazine 32 by the push mechanism 37 and the guide rails 42a and the guide rails 4 of the frame transfer apparatus 101 are pushed out.
2b, and moves at a low speed until the detecting means detects the lead frame 31 to detect that the lead frame 31 has reached the transport starting position.

However, the conventional frame transport device 1
01 indicates that the detecting means 70 is "ON" when detecting that the lead frame 31 has reached the transport starting position,
That is, the lead frame 31 pushed out until it is detected.
Need to be moved at a low speed, the positioning operation of the lead frame 31 takes time. In particular, since a semiconductor component having a small number of leads has a short bonding time, it takes time for the leading semiconductor component of the next lead frame 31 to move to the bonding position 50 on the bonding stage. Even if the bonding of the last semiconductor component is completed, the next semiconductor component may not be transported onto the bonding stage in some cases, so that a waiting time occurs in the bonding apparatus and the number of semiconductor components produced decreases. Sometimes.

If the lead frame 31 exists in the detection range Y (shown in FIG. 9), the light receiving element of the detection means 70 outputs an electric signal at any position, and The output timing of the signal output from the control circuit of the section (not shown) indicating that the lead frame 31 has reached the transport start position may vary within the detection range Y. In other words, when the lead frame 31 as a conveyed object is continuously and repeatedly conveyed, the starting position of the lead frame 31 is set in the detection range Y.
In other words, there is a possibility that the so-called repetition accuracy is reduced. In particular, a lead frame 31 having a large number of pins (having a large number of leads) or an island down (a shape in which the portion (island) holding the IC chip of the lead frame is recessed one step lower than the surrounding lead portion)
When the lead frame is used, it is necessary to transport the lead frame to a fixed position on the bonding stage with high accuracy, and to improve the repetition accuracy in the transport to prevent the failure of the semiconductor component by the bonding means. Is required.

The reflection type fiber sensor 60 serving as the detecting means 70 detects the reflection type fiber sensor 60 when scattering of reflected light occurs due to the surface condition of the lead frame 31 or deformation (warpage) of the lead frame 31. In some cases, the intensity of light received by the light receiving element decreases, and the lead frame 31 cannot be detected accurately.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has as its object to provide a bonding apparatus having a detecting means capable of detecting the position of a frame at high speed and with high accuracy.

[0030]

According to the present invention, there is provided a bonding apparatus comprising: a frame pushing means for pushing out frames one by one from a magazine in which a plurality of frames are arranged and stored; and a position of the frame pushed by the frame pushing means. A position detecting means for detecting, and a bonding apparatus having a frame carrying means having a frame carrying mechanism for carrying the frame to a bonding position, wherein the position detecting means comprises a detecting unit comprising a one-dimensional line sensor; The control unit includes a control unit having a drive circuit for driving the one-dimensional line sensor, and a light source unit for generating parallel light.

The frame transporting means of the bonding apparatus according to the present invention is such that the one-dimensional line sensor of the position detecting means is arranged in parallel with the scanning direction of the one-dimensional line sensor and the transporting direction of the frame. It is.

Further, the frame transport means of the bonding apparatus according to the present invention controls the transport amount of the frame transport mechanism based on data of the position of the frame detected by the position detecting means.

[0033]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a bonding apparatus according to an embodiment of the present invention;

FIG. 1A is a diagram showing the structure of a lead frame position detecting means provided in the frame transport device according to the present invention. FIG. 1B is a diagram showing a change in a signal obtained by a one-dimensional line sensor provided in the lead frame position detecting means according to the present invention, in which the horizontal axis represents time and the vertical axis represents signal strength. I have. FIG. 2 is a side view showing a main part of a lead frame position detecting means according to the present invention.
FIG. 3 is a plan view including a partial cross section showing a frame transport device provided with a lead frame position detecting means according to the present invention. Note that the same reference numerals are used for portions having the same functions and configurations as those of the conventional frame transport device 101.

First, the lead frame position detecting means according to the present invention will be described with reference to FIGS.

As shown in FIGS. 1 and 2, the position detecting means 5 of the lead frame 31 according to the present invention comprises a detecting section 1 comprising a one-dimensional line sensor 1a and a signal for driving and controlling the one-dimensional line sensor 1a. Drive circuit 2a that generates
And a light source unit 3 for irradiating the one-dimensional line sensor 1a with parallel light generated from a light source 3a and a reflection mirror 3b (shown in FIG. 2). Consists of

One-dimensional line sensor 1a as detection unit 1
Is composed of a one-dimensional solid-state image sensor and the like. In the present embodiment, a one-dimensionally arranged pixel group having functions of photoelectric conversion and charge accumulation, and a function of transferring the charge accumulated in each pixel are provided. A one-dimensional CCD image sensor 1a comprising a CCD (charge coupled device) is used.

The one-dimensional CCD image sensor 1a according to the present embodiment has 2048 pixels, a pitch between pixels of 14 μm,
The length of the light receiving section is 28.7 mm.

The drive circuit 2a is a circuit for supplying a pulse signal for reading signal charges from each pixel of the one-dimensional CCD image sensor 1a and amplifying the read signal. The control unit 2 receives a command from a control device (not shown) of the frame transport device 10 shown in FIG. 3, and outputs a clock pulse and a start pulse as a conversion start signal to the drive circuit 2a. The output signal of the sensor from the drive circuit 2a is processed.

As shown in FIG. 2, the light source unit 3 includes a light source 3a.
And the reflection mirror 3b, wherein the reflection mirror 3b is
The light receiving surface of the one-dimensional CCD image sensor 1a and the light source 3a are fixed at an angle of 45 degrees, and reflect light from the light source 3a to supply parallel light to the light receiving surface of the one-dimensional CCD image sensor 1a. Is what you do.

As shown in FIG. 3, the frame transfer apparatus 10 of the wire bonding apparatus according to the present invention moves a plurality of rectangular lead frames 31 as a transfer object in the vertical direction, that is, in the direction perpendicular to the paper surface. A magazine receiver 33 for holding the magazines 32 arranged and stored therein, an elevating mechanism (not shown) for intermittently lowering or raising the magazine receivers 33 by an array pitch of each lead frame arranged and stored in the magazine, and the elevating mechanism A push mechanism 37 for pushing out the lead frames 31 in the magazine 32 one by one in conjunction with an operation of the magazine (not shown), and a lead pushed out of the magazine 32 beside a lifting mechanism (not shown). A frame transport mechanism 40 that transports the frame 31 toward the bonding position 50, and a transport of the lead frame 31 as a transported object. It consists position detection means 5 for detecting the position in the origin area.

The lifting mechanism (not shown) and the push mechanism 37 constitute a frame pushing means.

The frame transfer apparatus 10 according to the present invention is the same as the conventional frame transfer apparatus shown in FIG. 7 except for the structure of the position detecting means 5 of the lead frame 31 and the operation of the frame transfer apparatus 10 according to the present invention. The configuration is the same as that of the device 101, and in the following description, the overlapping part is omitted, and the main part will be described.

As shown in FIGS. 1 to 3, a one-dimensional CCD image sensor 1
a is attached at substantially the same position as the conventional detection means 70 (shown in FIG. 7). The detection unit 1 is fixed to the guide rail 42a via the bracket 20 having a substantially L-shaped cross section so that the scanning direction of the one-dimensional CCD image sensor 1a and the conveyance direction of the lead frame 31 are parallel. The light source unit 3 is located below the frame transport device 10, irradiates the lead frame 31 with parallel light from below, and guides the guide rail 42a so that the parallel light is directly incident on the light receiving surface of the one-dimensional CCD image sensor 1a. It is arranged along the transport direction, and is fixed to the guide rail 42a via a bracket 21 having a substantially L-shaped cross section.

Next, the lead frame 3 according to the present invention will be described.
The operation of the position detecting means 5 and the frame transport device 10 will be described with reference to FIGS.

First, as shown in FIG. 3, the guide rails 42a and the guide rails 42a and the guides have a width suitable for the lead frame 31 to be transported by rotating the motor 45a and the motor 45b of the frame transport device 10 forward or reverse. Adjust the distance between the rails 42b. Then, a pusher 54 included in the push mechanism 37 of the frame transport device 10 is provided.
Is moved in the direction of the arrow X, and among the plurality of lead frames 31 arranged and stored in the magazine 32,
For example, the leading end of the pusher 54 is brought into contact with the rear end of the lowermost one, and the lead frame 31 is pushed out by a certain amount to send the lead frame 31 out of the magazine 32.

As shown in FIG. 4, the leading end of the lead frame 31 sent out of the magazine 32 by the frame transport mechanism 40 is set to the length of the light receiving portion of the one-dimensional CCD image sensor 1a. A predetermined amount is conveyed so as to be located within a certain conveyance start range. FIG.
The control unit 2 of the position detecting means 5 outputs a scan start signal to the drive circuit 2a.

The driving circuit 2a supplies a clock pulse for reading signal charges from each pixel of the one-dimensional CCD image sensor 1a to convert the intensity of light received from the one-dimensional CCD image sensor 1a into an electric signal. Then, the signal is output (FIG. 1B).

As shown in FIG. 1B, the output voltage of the illuminated pixel of the one-dimensional CCD image sensor 1a is parallel light from the light source unit 3 where the parallel light is not blocked by the lead frame 31. It becomes high (indicated by A in FIG. 1B), and becomes low when parallel light is blocked by the lead frame 31 (indicated by B in FIG. 1B).

FIG. 5A is a diagram showing a time chart of a clock pulse, a scanning start signal, and an output signal.
As shown in FIG. 5A, a one-dimensional C
A signal from each pixel of the CD image sensor 1a is read and an output signal is output. The scanning time for reading the signals of all the pixels of the one-dimensional CCD image sensor 1a is (number of pixels × clock pulse period). In this embodiment, the number of pixels is 2048 and the clock pulse period is 100 ns.
Therefore, the scanning time in this embodiment is 205 μsec.

Next, a comparator (not shown) built in the control unit 2 compares a signal output from the drive circuit 2a with a reference voltage, and the comparator (not shown) detects the input voltage. If it is higher than the reference voltage, it outputs a high-level voltage, and if it is lower, it outputs a low-level voltage (shown by (b) in FIG. 5).

Next, the logical product (AND) of the period and the clock pulse from the start of scanning until the output of the comparator (not shown) first changes from the high level to the low level is determined by an AND circuit ( The number of pulses (shown by (c) in FIG. 5) output from an AND circuit (not shown) is counted by a counter (not shown) built in the control unit 2.
Count with. When one pulse of this counter (not shown) is converted into a length, it corresponds to the length of the pixel pitch (interval) of the one-dimensional CCD image sensor 1a. For example, when the count value of the counter is 100 pulses, FIG.
As shown in the figure, it can be seen that the leading end of the lead frame 31 is at a position 1.4 mm from the end face of the one-dimensional CCD image sensor 1a on the bonding position 50 side. At this time, the position of the lead frame 31 can be detected with a unit of the pixel pitch of the one-dimensional CCD image sensor 1a, so that a highly accurate detection can be performed.

As shown in FIG. 4B, the distance from the end face of the light receiving section of the one-dimensional CCD image sensor 1a of the detecting section 1 to the bonding position 50 is Smm, and the center of the first IC chip from the tip of the lead frame 31 is set. The distance Tmm to the position is stored in advance in the memory in the control unit 2 as reference data. Therefore, as shown in FIG. 4 (b), up to the bonding position 50 of the first IC chip of the lead frame 31 when the leading end of the lead frame 31 is detected at a position α from the bonding position 50 of the one-dimensional CCD image sensor 1a. Is (S + T + α) m
m.

For example, a one-dimensional CCD image sensor 1a
When the tip of the lead frame 31 is detected at the 1000th pixel from the bonding position 50, since the pixel pitch is 14 μm, the α is a distance of 14 mm.
Therefore, the first IC chip reaches the bonding position after being transported by (S + T + 14) mm (shown in FIG. 4C).

The operation sequence of the above-described bonding apparatus according to the present invention will be described with reference to a flowchart shown in FIG.

First, the lead frames 31 arranged and stored in the magazine 32 are pushed out by a predetermined amount by the pusher 54, and the lead frames 31 are sent out of the magazine 32.

The sent lead frame 31 is transported by the frame transport mechanism 40 by a predetermined amount to a position near the center of the one-dimensional CCD image sensor 1a of the position detecting means 5 (step S2).

A control device (not shown) of the frame transport device 10 issues a position detection command to the control unit 2 of the position detecting means 5, and the control unit 2 of the position detecting means 5 outputs the counted value. (Step S3).

The control device (not shown) of the frame transport device 10 calculates the position of the lead frame 31 on the one-dimensional CCD image sensor 1a from the count value output from the control unit 2 of the position detecting means 5, The transport distance up to the bonding position 50 is calculated from the transport distance (reference value) set in advance and the calculated position on the one-dimensional CCD image sensor 1a (step S4).

The frame transport mechanism 40 operates based on the calculated transport distance to the bonding position 50 to transport the lead frame 31 to the bonding position 50 (step S5).

Hereinafter, the bonding means (not shown)
Thereby, the bonding operation is sequentially performed. The lead frame 31 on which the bonding operation has been completed is further transported in the arrow X direction by the frame transport mechanism 40 and is collected in a magazine on the unloader side.

Since the operation of the frame transport device 10 in this embodiment is based on the data detected by the position detecting means 5, the detection of the sensor at a low speed movement like the conventional frame transport device 101, ie, " Since there is no judgment of “ON”, the lead frame 31 is quickly moved to the bonding position 5.
0 can be transported.

In this embodiment, an example is described in which the position detecting means according to the present invention is provided in the frame transfer device of the wire bonding apparatus. However, the present invention is not limited to this, and can be applied to various bonding apparatuses. Further, it can be used for position detection of a PCB substrate, a ceramic substrate, or the like as a frame.

[0064]

As described above, according to the position detecting means of the present invention, the position of a frame can be detected at high speed and with high accuracy.

Further, according to the present invention, a conveyed object such as a lead frame can be conveyed to the bonding station at high speed and with high accuracy, so that there is no loss time due to the conveying operation, and the number of products can be improved. Since a multi-pin lead frame, an island-down lead frame, and the like can be accurately conveyed to the bonding position, the yield of semiconductor products can be improved.

[Brief description of the drawings]

FIG. 1A is a diagram illustrating a configuration of a position detecting unit of a frame transport device according to the present invention, and FIG. 1B is a diagram illustrating a change in an output signal of a one-dimensional line sensor of the position detecting unit. .

FIG. 2 is a side view showing a main part of the position detecting means according to the present invention.

FIG. 3 is a plan view including a partial cross section showing a position detecting means and a frame transport device according to the present invention.

FIG. 4A shows a length from a bonding position side of a one-dimensional line sensor in lead frame position detection,
(B) is a diagram showing a transport amount to a bonding position set in advance, and (C) is a diagram showing a state where the first IC chip has reached the bonding position.

5A shows a time chart of a clock pulse of a one-dimensional line sensor, a scanning start signal, and an output signal, FIG. 5B shows an output signal of a comparator, and FIG. 5C shows an output of an AND circuit; FIG. 4 is a diagram showing a pulse to be performed.

FIG. 6 is a flowchart showing the operation of the position detecting means and the frame transport device according to the present invention.

FIG. 7 is a plan view including a partial cross section showing a conventional lead frame detecting means and a frame transport device.

FIG. 8 is a side view showing a main part of a conventional lead frame detecting means.

9 (a) is a diagram showing the operation of the conventional lead frame detecting means and the frame transport device shown in FIGS. 7 and 8, and FIG. 9 (b) is a light receiving section provided in the conventional lead frame detecting means. FIG. 4 is a diagram showing a change in light intensity obtained by an element.

FIG. 10 is a flowchart showing an operation of a conventional lead frame detecting means and a frame transport device.

[Explanation of symbols]

1 Detector 1a One-dimensional line sensor (one-dimensional CCD
2 control unit 2a drive circuit 3 light source unit 3a light source 3b reflecting mirror 5 position detecting device 10 frame transport device 31 lead frame 37 push mechanism 40 frame transport mechanism 42a guide rail 42b guide rail 50 bonding position 60 reflective fiber sensor 60a Light emitting fiber 60b Light receiving fiber 60c Light emitting connector 60d Light receiving connector 60e Outer cylinder

Claims (3)

[Claims] 1. A frame pushing means for pushing the frames one by one from a magazine in which a plurality of frames are arranged and stored, a position detecting means for detecting a position of the frame pushed by the frame pushing means, and a bonding of the frames. A bonding apparatus having a frame transport unit having a frame transport mechanism for transporting the frame to a position, wherein the position detecting unit includes a detection unit including a one-dimensional line sensor and a drive circuit that drives the one-dimensional line sensor. A bonding apparatus, comprising: a control unit; and a light source unit that generates parallel light. 2. The frame transport means, wherein the one-dimensional line sensor of the position detecting means is arranged in parallel with a scanning direction of the one-dimensional line sensor and a transport direction of the frame. 2. The bonding apparatus according to 1. 3. The bonding apparatus according to claim 1, wherein the frame transport unit controls a transport amount of the frame transport mechanism based on data of the position of the frame detected by the position detecting unit.