JP2000191991A - Top cover tape for chip type electronic part carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a top cover tape for chip type electronic part carrier excellent in adhesiveness, readily releasable property and antistatic property and capable of stably continuing high antistatic property for a long period and simply forming a homogeneous adhesive layer. SOLUTION: This top cover tape for chip type electronic part carrier is obtained by laminating an adhesive layer 2 comprising 100 pts.wt. olefinic resin containing at least metallocene catalyst method polyethylene, 10-45 pts.wt. potassium ionomer, 1-30 pts.wt. tackiness-providing resin and 0.5-3.0 pts.wt. (as active ingredient) surfactant through or without an intermediate 3 onto a supporting substrate layer. Softening point of the adhesive layer 2 is about 60-150 deg.C and surface resistivity of the adhesive layer 2 is about 107 to 1013 Ω. The thickness of the adhesive layer 2 is about 5-50 μm and the thickness of the intermediate layer 3 is about 0-40 μm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a top cover tape of a carrier material used for transporting chip-type electronic components.

[0002]

2. Description of the Related Art As a method of transporting chip-type electronic components such as chip fixed resistors and multilayer ceramic capacitors, a taping reel system using an electronic component transport tape is known. In this taping reel system, the lower surface of a paper carrier in which punched square holes for storing chip-type electronic components are formed at regular intervals in the length direction of the tape-shaped cardboard is heat-sealed with a bottom tape to produce a storage pocket. Immediately thereafter, the chip-type electronic component is inserted into the storage pocket, and the top surface of the paper carrier is heat-sealed with a top cover tape to encapsulate the chip-type electronic component. In the production process of the circuit board etc. at the destination, the mainstream is an automatic assembly system that peels off the top cover tape, then automatically sucks the stored chip-type electronic components with an air nozzle and supplies them onto the board. ing.

[0003] From this series of taping reel systems to automatic assembling systems, the top cover tape, which is heat-sealed on the upper surface of the paper carrier and used for encapsulating chip-type electronic components, has adhesiveness to the paper carrier, transport and transport. There is a need for a so-called antistatic property that suppresses the generation of static electricity due to vibrations during the process, a property that the dispersion of the adhesive force when peeling the top cover tape is small and the fluff from the paper carrier is small, that is, easy peelability. By satisfying these requirements, a reliable and stable supply of chip-type electronic components in an automatic integration system is achieved.

Heretofore, there has been known a top cover tape provided with an adhesive layer made of an olefin resin into which a surfactant has been kneaded via an intermediate layer on a supporting base material. This top cover tape has excellent adhesiveness and easy peelability, has no practical problem in antistatic property, and is widely used.

However, in recent years, chip-type electronic components have become lighter, thinner and smaller, and their main size has been shifted to very small and lighter chip components. That is the current situation. When transporting such chip-type electronic components,
The above conventional top cover tape does not have sufficient antistatic properties, and after inserting the chip into the punched square hole for storing the chip components of the paper carrier, through the heat sealing of the top cover tape,
When stored at a high temperature for a long period of time until the chip components are supplied to the substrate, there is a concern that a problem of static electricity caused by disappearance of the surfactant may occur.

Further, as a top cover tape, low-density polyethylene or ethylene-unsaturated ester copolymer 7
One having an adhesive layer consisting of 0 to 90 parts by weight and 30 to 10 parts by weight of a potassium ionomer is known. Although this top cover tape has excellent antistatic properties, it has a lot of fluff from the surface of the paper carrier at the time of peeling, causing paper dust and uneven adhesion (change over time).
Is large.

Further, the ethylene-vinyl acetate copolymer generally used as an adhesive in the past contains an unmelted gel partially due to unevenness in properties. For this reason, if the adhesive layer of the top cover tape is composed of this ethylene-vinyl acetate copolymer, a film crack caused by the unmelted gel occurs when the adhesive layer is laminated on the supporting base material, and the paper carrier at the time of heat sealing. Adhesion failure may occur.

[0008]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide excellent adhesiveness, easy peelability and antistatic properties,
An object of the present invention is to provide a top cover tape for a chip-type electronic component carrier, which has a high antistatic property stably maintained for a long period of time and can easily form a uniform adhesive layer.

[0009]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object. As a result, when the adhesive layer is composed of a specific resin or the like, a uniform adhesive layer can be easily formed.
The inventors have found that they are excellent in all of the adhesiveness, easy peeling properties and antistatic properties, have excellent storage stability, and exhibit an antistatic effect stably over a long period of time, and have completed the present invention.

That is, according to the present invention, 100 parts by weight of an olefin resin containing at least metallocene-catalyzed polyethylene, potassium ionomer 10 to 4
An adhesive layer comprising 5 parts by weight, 1 to 30 parts by weight of a tackifier resin and 0.5 to 3.0 parts by weight of a surfactant (in terms of an active ingredient) is laminated with or without an intermediate layer. Provided is a top cover tape for a chip-type electronic component carrier.

[0011]

Embodiments of the present invention will be described below with reference to the drawings as necessary. FIG. 1 and FIG. 2 are diagrams schematically showing cross sections of an example of the top cover tape for a chip-type electronic component carrier of the present invention. In the example of FIG. 1, the top cover tape is composed of the support base material layer 1 and the adhesive layer 2, and in the example of FIG. 2, the top cover tape is composed of the support base material layer 1 and the adhesive layer 2.
And an intermediate layer 3 formed between the two layers.

The supporting base material constituting the supporting base material layer 1 may be any material having a self-supporting property.
Paper; olefinic resins such as polyethylene and polypropylene; polyesters such as polyethylene terephthalate; polyvinyl chloride; plastic films made of cellophane; and the like. The surface of the supporting substrate is
If necessary, a conventional surface treatment, for example, an antistatic treatment or the like may be applied. In addition, the surface of the supporting base material that comes into contact with the adhesive layer 2 or the intermediate layer 3 is subjected to a treatment such as an anchor coating treatment with a urethane-based anchor coating agent or a corona discharge treatment in order to increase the adhesive strength. Is also good.

The thickness of the supporting base material layer 1 can be appropriately selected within a range where the mechanical strength, handleability and the like are not impaired, and is, for example, about 5 to 200 μm, preferably about 10 to 50 μm.

An important feature of the present invention is that the adhesive layer 2 comprises at least 100 parts by weight of an olefin resin containing at least metallocene-catalyzed polyethylene (hereinafter sometimes abbreviated as “metallocene polyethylene”), potassium ionomer 1
0 to 45 parts by weight, 1 to 30 parts by weight of a tackifier resin, and 0.5 to 3.0 parts by weight of a surfactant (in terms of an active ingredient).

The metallocene polyethylene can be obtained by a known or commonly used polymerization method in the presence of a metallocene catalyst, and a commercially available product can also be used. The density of the metallocene polyethylene is, for example, 0.904 to 0.921 g / c.
a m ³ approximately, a melt flow rate (MFR), for example 4～20G / 10 min.

The olefin resin may contain at least a metallocene polyethylene, and other olefin resins, for example, low-density polyethylene, linear low-density polyethylene, ethylene-α-olefin copolymer obtained by various methods , Ethylene-vinyl acetate copolymer or the like. The ratio of the metallocene polyethylene in the olefin-based resin is, for example, 50% by weight or more, preferably 80% by weight or more, and more preferably 90% by weight or more. It is preferable to consist essentially of metallocene polyethylene only.

The potassium ionomer is a resin in which a hydrogen atom of a carboxyl group is replaced with potassium in a copolymer of an α-olefin and a carboxyl group-containing monomer such as an ethylene-methacrylic acid copolymer. The potassium ionomer can be produced by a known or conventional method, and a commercially available product can also be used. The potassium ionomer has a density of, for example, about 0.985 g / cm ³ and a melt flow rate (MFR) of, for example, 6.0 g.
It is about / 10 minutes. The amount of the potassium ionomer is 10 parts by weight based on 100 parts by weight of the olefin resin.
To 45 parts by weight, preferably 15 to 35 parts by weight.

As the tackifying resin, aliphatic petroleum resin,
Petroleum resins such as aromatic petroleum resins, alicyclic petroleum resins hydrogenated with aromatic petroleum resins (alicyclic saturated hydrocarbon resins), rosin resins (rosin, hydrogenated rosin esters, etc.), terpene resins ( Terpene resin, aromatic modified terpene resin,
Hydrogenated terpene resins, terpene phenol resins, etc.), styrene resins, coumarone indene resins and the like. The tackifier resins can be used alone or in combination of two or more.

By adding a tackifying resin to the adhesive layer 2, the heat sealing workability is improved, and good and stable adhesion can be obtained by the existing heat sealing machine. Among the tackifying resins, the alicyclic petroleum resin and the like are preferable because the adhesive has little change over time and high stability against oxidation. The compounding amount of the tackifier resin is 1 to 30 parts by weight, preferably 3 to 15 parts by weight, based on 100 parts by weight of the olefin resin.

As the surfactant, an alkylamine salt,
Cationic surfactants such as quaternary ammonium salts; aliphatic monocarboxylates, alkylbenzene sulfonates,
Alkyl sulfates, alkyl sulfate polyoxyethylene salts,
Anionic surfactants such as alkyl phosphate salts; glycerin fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester, polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene block copolymer, polyethylene glycol fatty acid Nonionic surfactants such as esters, polyoxyethylene sorbitan fatty acid esters and fatty acid alkanolamides; N, N-dimethyl-N-alkylaminoacetic acid betaine, 2-alkyl-
Examples include amphoteric surfactants such as 1-hydroxyethyl-1-carboxymethylimidazolinium betaine.

By adding a surfactant to the adhesive layer 2, an antistatic function can be exhibited immediately after the formation of the adhesive layer, and the fluffing of the paper carrier surface when the top cover tape is peeled off can be ensured. Can be prevented.

The amount of the surfactant is calculated in terms of the active ingredient.
0.5 to 100 parts by weight of the olefin resin
3.0 parts by weight, preferably 1.0 to 2.0 parts by weight. As the surfactant, for example, a surfactant masterbatch having an active ingredient content of about 10% by weight can be used.

The adhesive layer 2 may contain, in addition to the above components, additives such as inorganic substances such as silica, silica fine powder, alumina and spherical silicone, and conductive agents, if necessary. The compounding amount of these additives is about 0 to 20 parts by weight (for example, 1 to 20 parts by weight) based on 100 parts by weight of the olefin resin.

The adhesive layer 2 can be formed by a conventional laminating method. For example, it can be formed by dry blending each constituent component of the adhesive layer 2 using a tumbler or the like, melt-kneading with a twin-screw extruder or the like, and extruding onto the support substrate 1. Alternatively, the molten resin composition may be co-extruded with a resin composition containing the resin constituting the support substrate 1 and the resin constituting the intermediate layer 3 to produce a top cover tape in one step.

The softening point of the adhesive layer 2 is, for example, 60 to 15
0 ° C., and the surface resistivity of the adhesive layer 2 is, for example, 1
0 ⁷ ~10 ¹³ Ω, preferably 10 ⁷ ~2 × 10 ¹¹ Ω, more preferably about 10 ⁷ ~10 ¹¹ Ω. Adhesive layer 2
The softening point and surface resistivity of the resin constituting the adhesive layer 2
It can be adjusted by appropriately selecting the type and blending ratio of additives such as a conductive agent.

The thickness of the adhesive layer 2 can be appropriately selected as long as the adhesiveness and handleability of the top cover tape are not impaired, but is generally about 5 to 50 μm.

The intermediate layer 3 can be made of, for example, an olefin resin. As the olefin resin, for example, low-density polyethylene, linear low-density polyethylene, ethylene-
α-olefin copolymer, ethylene-vinyl acetate copolymer and the like can be exemplified. The thickness of the intermediate layer 3 can be appropriately selected as long as the handleability of the top cover tape is not impaired, and is, for example, about 0 to 40 μm. In addition, the intermediate | middle layer 3 does not necessarily need to be provided.

[0028]

According to the top cover tape for a chip-type electronic component carrier of the present invention, since the adhesive layer is composed of a specific resin composition, a uniform adhesive layer can be formed and the adhesiveness is excellent. Moreover, high antistatic properties are stably exhibited for a long period of time. Also, when peeling, the dispersion of the adhesive strength and the change with time are small, so that the peeling can be performed smoothly and there is no fuzz from the surface layer of the paper carrier. As a result, frictional electrification during transport of the chip-type electronic component can be significantly suppressed, and the chip-type electronic component adheres to the tape adhesive layer side due to static electricity when the top cover tape is peeled off and jumps out from the square hole for storage. Can be prevented. Further, in the automatic assembling system, the chip-type electronic components can be reliably supplied onto the substrate.

[0029]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

Example 1 A biaxially stretched polyester film having an antistatic treatment on one side as a supporting substrate (FE2, manufactured by Nimura Chemical Industry Co., Ltd.)
021, thickness 25 μm), a urethane anchor coating agent is applied by a kiss roll coater on the surface opposite to the antistatic treated surface and dried, and then a low-density polyethylene (LC607, manufactured by Mitsubishi Chemical Corporation) is used as an intermediate layer. , Density 0.919
g / cm ³ , MFR 8.5 g / 10 min) (thickness 15 μm)
m) and an adhesive layer (thickness: 20 μm) having the following composition
m) were sequentially laminated by an extrusion laminator to obtain a top cover tape. The softening point of the adhesive layer is 10
5 ° C. Adhesive layer: Metallocene polyethylene (Ube Industries, Ltd.)
Product name: Yumerit 15200L, density 0.915
g / cm ³ , MFR 20 g / 10 min) 100 parts by weight Potassium ionomer (manufactured by Mitsui DuPont Polychemicals Co., Ltd., trade name: SD100, density 0.985 g / c)
m ³ , MFR 6.0 g / 10 min) 25 parts by weight Alicyclic saturated hydrocarbon resin (Tonex Co., Ltd.
Trade name: ESCOREZ 5300) 5 parts by weight Surfactant (manufactured by Kao Corporation, trade name: Erestmaster LL-10) 10 parts by weight Comparative Example 1 Non-chargeable resin as adhesive layer (Mitsui DuPont Polychemical Co., Ltd.) MK501, density 0.94 g / cm ³ , M
FR 7.7 g / 10 min) was extruded so as to have a thickness of 20 μm using an extruding laminator, and the same operation as in Example 1 was performed to obtain a top cover tape.

Comparative Example 2 A top cover tape was obtained in the same manner as in Example 1, except that a layer (thickness: 20 μm) having the following composition was laminated by an extruder laminator as an adhesive layer. Adhesive layer: ethylene-vinyl acetate copolymer (manufactured by Mitsubishi Chemical Corporation, trade name: LV360, MFR 9.0 g / 10)
Minutes) 100 parts by weight alicyclic saturated hydrocarbon resin (Tonex Co., Ltd.
Trade name: ESCOREZ5300) 10 parts by weight Surfactant (manufactured by Kao Corporation, trade name: Erestmaster LL-10) 10 parts by weight.

Evaluation Test The top cover tapes obtained in Examples and Comparative Examples were evaluated for surface resistivity, adhesive strength and peelability as follows. (Surface resistivity) For each top cover tape, at the time of manufacture (initial), after being left at 50 ° C for 28 days, and at 40 ° C,
The surface resistivity after standing for 28 days under the condition of 92% RH was measured using a high resistivity meter Hiresta UP (manufactured by Mitsubishi Chemical Corporation).
Was measured. Table 1 shows the results.

[0033]

[Table 1] (Adhesive strength and peelability) Paper carrier (manufactured by Oji Paper Co., Ltd.)
OJH-75), each top cover tape was heated at 160 ° C. with an iron pressing force of 2.5 kgf at a speed of 1200 PCS / min using a heat sealing machine (TWA-6000, manufactured by Tokyo Wells Co., Ltd.). Sealed, immediately after heat sealing (initial stage), after standing at 50 ° C. for 28 days, and 40
The adhesive strength and releasability after standing for 28 days at a temperature of 92 ° C. and 92% RH were measured and evaluated. The adhesion was measured using a peeling tester (GPD856VS) at a peeling speed of 300 m.
m / min at a peel angle of about 180 °. In addition, the peelability was visually determined by judging the peeling state of the top cover tape when measuring the adhesive force, and evaluated according to the following criteria. Table 2 shows the results. ：: There was no fluff from the paper carrier surface layer, and it was peeled off smoothly. Δ: Fuzz from the paper carrier surface layer was recognized. ×: Fuzz from the paper carrier surface layer was remarkable.

[0034]

[Table 2]

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a cross section of an example of a top cover tape for a chip-type electronic component carrier of the present invention.

FIG. 2 is a diagram schematically showing a cross section of another example of the top cover tape for a chip-type electronic component carrier of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Support base material 2 Adhesive layer 3 Intermediate layer

Continued on the front page F-term (reference) 4F100 AK03A AK04A AK06 AK70A AL05A AT00B AT00C BA02 BA03 BA10A BA10C CA16A CA18A EJ38 EJ91 GB41 GB90 JA04A JG04A JK06 JL00 JL14 YY00A YY00B YY00C04A04 A07 A04A04 BA202 DA021 DA182 DB032 DK012 DN032 DN072 EL012 GA07 JA09 JB09 KA26 KA38 LA06 LA08 LA09 NA19

Claims (3)

[Claims] 1. 100 parts by weight of an olefin resin containing at least metallocene catalyzed polyethylene, 10 to 45 parts by weight of a potassium ionomer, 1 to 30 parts by weight of a tackifier resin, and 0.5 to 10 parts by weight of a surfactant on a supporting base material layer. A top cover tape for a chip-type electronic component carrier, wherein an adhesive layer composed of 3.0 parts by weight (in terms of an active ingredient) is laminated with or without an intermediate layer. 2. The top cover tape for a chip-type electronic component carrier according to claim 1, wherein the softening point of the adhesive layer is 60 to 150 ° C., and the surface resistivity of the adhesive layer is 10 ⁷ to 10 ¹³ Ω. 3. The top cover tape for a chip-type electronic component carrier according to claim 1, wherein the thickness of the adhesive layer is 5 to 50 μm, and the thickness of the intermediate layer is 0 to 40 μm.