[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP2000182949A - Processing device and clean air supply method therefor - Google Patents

Processing device and clean air supply method therefor

Info

Publication number
JP2000182949A
JP2000182949A JP10375585A JP37558598A JP2000182949A JP 2000182949 A JP2000182949 A JP 2000182949A JP 10375585 A JP10375585 A JP 10375585A JP 37558598 A JP37558598 A JP 37558598A JP 2000182949 A JP2000182949 A JP 2000182949A
Authority
JP
Japan
Prior art keywords
air
processing
unit
blowing
processing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10375585A
Other languages
Japanese (ja)
Other versions
JP3375294B2 (en
Inventor
Kiyohisa Tateyama
清久 立山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP37558598A priority Critical patent/JP3375294B2/en
Publication of JP2000182949A publication Critical patent/JP2000182949A/en
Application granted granted Critical
Publication of JP3375294B2 publication Critical patent/JP3375294B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)

Abstract

PROBLEM TO BE SOLVED: To supply clean air only to a required place and to remove an excessive load applied on a blower and a fan, etc., when a needless process device is omitted, for reduced running cost. SOLUTION: An air blow-out part 40 is provided above a processing part while an object to be processed corresponding to each process part for a specified process, and an air recovering part 43 is provided below the process part while corresponding to each process part. Clean air blown out downward perpendicularly of the air blow-out part 40 passes a process part installed in the device, and then recovered through the air recovering part 43 facing the air blow-out part 40 by an air suction mechanism 45 before being supplied again to the air blow-out part 40 through a return duct 44.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば液晶ディス
プレイ(Liquid Crystal Display:LCD)に使われる
ガラス基板上にレジスト液を塗布し現像する塗布・現像
処理システム等の処理装置および該装置における清浄エ
アの供給方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus such as a coating / developing processing system for applying and developing a resist solution on a glass substrate used for, for example, a liquid crystal display (LCD), and clean air in the apparatus. Related to the supply method.

【0002】[0002]

【従来の技術】LCDの製造工程においては、LCD用
のガラス基板上にITO(Indium TinOxide)の薄膜や
電極パターンを形成するために、半導体デバイスの製造
に用いられるものと同様のフォトリソグラフィ技術が利
用される。フォトリソグラフィ技術では、フォトレジス
トを基板に塗布し、これを露光し、さらに現像する。
2. Description of the Related Art In an LCD manufacturing process, a photolithography technique similar to that used in the manufacture of semiconductor devices is used to form an ITO (Indium Tin Oxide) thin film and an electrode pattern on an LCD glass substrate. Used. In the photolithography technique, a photoresist is applied to a substrate, exposed, and further developed.

【0003】このような塗布・現像処理システムにおい
ては、パーティクルが被処理体である基板に付着しない
よう、上方に清浄エアの吹き出し部を設け、常時、清浄
エアを供給し、ダウンフローの気流を形成している。そ
して、塗布・現像処理システムの下方の床面の開口部グ
リーチングより床下へ吸引されたエアーはリターンゾー
ンを通って再利用される。
In such a coating / developing processing system, a clean air blowing section is provided at an upper portion so as to prevent particles from adhering to a substrate which is a processing target, and clean air is always supplied to reduce a downflow airflow. Has formed. Then, the air sucked below the floor from the opening leaching on the floor below the coating / developing system is reused through the return zone.

【0004】[0004]

【発明が解決しようとする課題】ところで、塗布・現像
処理システムは、被処理体であるガラス基板の搬送路を
挟んで、複数のレジスト塗布装置や複数の現像装置等が
設置されて構成されているが、ガラス基板等の処理枚数
等によっては、このうちいくつかの装置しか使用しない
場合もある。このような場合、不要な装置を取り外した
上で処理が行われる。しかしながら、塗布・現像処理シ
ステムの上方に設置される清浄エアの吹き出し部や下方
に設置されるエア回収部は、各処理装置ごとに対応して
設けられているわけではないため、装置が設置されてい
ない箇所においても清浄エアの供給と吸引(回収)が行
われる。この装置が設置されていない個所において供給
される清浄エアは、被処理体であるガラス基板へのパー
ティクルの付着防止という観点からは、何ら役立ってい
ない余分なエアであるところ、このエアも一緒に吸引
(回収)され、再度吹き出されるために、吸引機構を構
成するブロワや吹き出し部を構成するファン等には全く
余分な負荷がかかっていることになる。
The coating / developing processing system includes a plurality of resist coating devices, a plurality of developing devices, and the like, which are disposed with a conveyance path for a glass substrate to be processed interposed therebetween. However, depending on the number of processed glass substrates or the like, only some of these devices may be used. In such a case, the processing is performed after removing unnecessary devices. However, since the clean air blowing section installed above the coating / developing processing system and the air recovery section installed below are not provided for each processing apparatus, the apparatus is installed. The supply and suction (recovery) of the clean air are performed even in a place where no cleaning air is supplied. The clean air supplied at a place where this apparatus is not installed is unnecessary air from the viewpoint of preventing particles from adhering to the glass substrate to be processed. Since the air is sucked (recovered) and blown out again, an extra load is applied to the blower constituting the suction mechanism and the fan constituting the blowout section.

【0005】本発明は上記に鑑みなされたものであり、
必要な箇所のみに清浄エアを供給でき、上記のように不
要な処理装置を省いた場合に、ブロワやファン等にかか
る余分な負荷を除去し、ランニングコストを低減するこ
とができる処理装置および該装置における清浄エアの供
給方法を提供することを課題とする。別言すると、装置
を設置する部屋全体のエアを循環させるのに比べ、圧倒
的に「動かすエアの量」を減らすことができ、それによ
るブロア能力、冷凍能力、フィルタ数等を低減させるこ
とができる処理装置および該装置における清浄エアの供
給方法を提供することを課題とする。
[0005] The present invention has been made in view of the above,
A processing apparatus and a processing apparatus capable of supplying clean air only to a necessary portion and eliminating an unnecessary load on a blower, a fan, and the like when the unnecessary processing apparatus is omitted as described above and reducing running costs. It is an object to provide a method for supplying clean air in an apparatus. In other words, compared to circulating the air in the entire room where the device is installed, it is possible to overwhelmingly reduce the "amount of air to move", thereby reducing the blower capacity, refrigeration capacity, number of filters, etc. It is an object of the present invention to provide a processing apparatus capable of performing the method and a method for supplying clean air in the processing apparatus.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するた
め、請求項1記載の本発明の処理装置は、被処理体に所
定の処理を行う複数の処理部と、前記各処理部に対応し
て、該処理部の上方に設けられ、清浄エアを直下に向け
て吹き出すエア吹き出し部と、前記各処理部に対応し
て、該処理部の下方に、前記エア吹き出し部に対向して
設けられ、エア吸引機構の吸引力により、リターンダク
トを通じて前記エア吹き出し部にエアを再供給するた
め、処理部を通過したエアを回収するエア回収部と、を
具備することを特徴とする。
According to a first aspect of the present invention, there is provided a processing apparatus comprising: a plurality of processing units for performing a predetermined process on an object to be processed; And an air blowing section provided above the processing section and blowing clean air directly downward, and corresponding to each processing section, provided below the processing section and opposed to the air blowing section. An air collection unit that collects air that has passed through the processing unit in order to resupply air to the air blowing unit through a return duct by a suction force of an air suction mechanism.

【0007】請求項2記載の本発明の処理装置は、被処
理体に所定の処理を行う処理部と、前記処理部を囲繞す
ると共に、側面部にエアを外部に吹き出すためのエア通
過部が形成された処理部保護用のカバー部材と、前記処
理部に対応して、該処理部の上方に設けられ、清浄エア
を直下に向けて吹き出すエア吹き出し部と、前記処理部
に対応して、該処理部の下方に、前記エア吹き出し部に
対向して設けられ、エア吸引機構の吸引力により、リタ
ーンダクトを通じて前記エア吹き出し部にエアを再供給
するため、処理部を通過したエアを回収するエア回収部
と、を具備することを特徴とする。
According to a second aspect of the present invention, there is provided a processing apparatus, comprising: a processing section for performing a predetermined processing on an object to be processed; and an air passage section for surrounding the processing section and blowing air to the outside on a side portion. The formed processing unit protection cover member, corresponding to the processing unit, provided above the processing unit, and an air blowing unit that blows clean air directly downward, corresponding to the processing unit, The air passing through the processing unit is collected below the processing unit, facing the air blowing unit, and resupplying the air to the air blowing unit through a return duct by a suction force of an air suction mechanism. And an air recovery unit.

【0008】請求項3記載の本発明の処理装置は、被処
理体に所定の処理を行う処理部と、前記処理部に対応し
て、該処理部の上方に設けられ、清浄エアを直下に向け
て吹き出し可能であると共に、前記処理部の外方におい
ても清浄エアを直下に向けて吹き出すことができる突出
した吹き出し部を有するエア吹き出し部と、前記突出し
た吹き出し部の外側縁に沿って設けられるカーテン部材
と、前記処理部に対応して、該処理部の下方に、前記エ
ア吹き出し部のうち、突出した吹き出し部を除いたエア
吹き出し部に対向して設けられ、エア吸引機構の吸引力
により、リターンダクトを通じて前記エア吹き出し部に
エアを再供給するため、処理部を通過したエアを回収す
るエア回収部と、を具備することを特徴とする。
According to a third aspect of the present invention, there is provided a processing apparatus for performing a predetermined process on an object to be processed, and corresponding to the processing section, provided above the processing section and directing clean air directly below the processing section. An air blowout portion having a protruding blowout portion that can be blown out and that can blow out clean air directly below even outside the processing portion, and provided along an outer edge of the protruding blowout portion. A curtain member corresponding to the processing unit, and provided below the processing unit and opposed to the air blowing unit excluding the protruding blowing unit of the air blowing unit, and the suction force of the air suction mechanism. In order to resupply the air to the air blow-out unit through the return duct, an air collection unit that collects the air that has passed through the processing unit is provided.

【0009】請求項4記載の本発明の処理装置は、請求
項1〜3のいずれか1に記載の処理装置であって、前記
エア吹き出し部が、送風ファンと、該送風ファンの吹き
出し側に設けられるフィルタとを有して構成されること
を特徴とする。
According to a fourth aspect of the present invention, there is provided the processing apparatus according to any one of the first to third aspects, wherein the air blowing unit includes a blower fan and a blower side of the blower fan. And a filter provided.

【0010】請求項5記載の本発明の処理装置は、請求
項1〜4のいずれか1に記載の処理装置であって、前記
エア吸引機構が、吸引されたエアを冷却する熱交換機
と、前記エア回収部を経由させてエアを吸引すると共
に、前記リターンダクトを経由させてエア吹き出し部に
回収されたエアを供給するブロワとを有して構成される
ことを特徴とする。
A processing apparatus according to a fifth aspect of the present invention is the processing apparatus according to any one of the first to fourth aspects, wherein the air suction mechanism comprises: a heat exchanger for cooling the sucked air; It is characterized in that it comprises a blower that sucks air through the air collection unit and supplies the collected air to the air blowing unit through the return duct.

【0011】請求項6記載の本発明の処理装置は、請求
項1〜5のいずれか1に記載の処理装置であって、前記
エア吸引機構に外部空気取り入れ口が付設されているこ
とを特徴とする。
A processing apparatus according to a sixth aspect of the present invention is the processing apparatus according to any one of the first to fifth aspects, wherein an external air intake is provided to the air suction mechanism. And

【0012】請求項7記載の本発明の処理装置は、請求
項1〜6のいずれか1に記載の処理装置であって、前記
エア吹き出し部とエア回収部との間に、ケミカルトラッ
プが配置されていることを特徴とする。
According to a seventh aspect of the present invention, there is provided the processing apparatus according to any one of the first to sixth aspects, wherein a chemical trap is disposed between the air blowing section and the air collecting section. It is characterized by having been done.

【0013】請求項8記載の本発明の処理装置は、被処
理体に所定の処理を行う複数の処理部と、前記各処理部
に対応して、該処理部の上方に設けられ、清浄エアを直
下に向けて吹き出すエア吹き出し部と、前記各処理部に
対応して、該処理部の下方に、前記エア吹き出し部に対
向してそれぞれ設けられ、前記各エア吹き出し部から吹
き出されて前記各処理部を通過した清浄エアを一旦蓄積
する箱形のエア回収部と、前記各エア回収部に蓄積され
た清浄エアを引力し、前記エア吹き出し部に再供給する
ためのエア吸引機構及びリターンダクトとを具備するこ
とを特徴とする。
According to a further aspect of the present invention, there is provided a processing apparatus for performing a predetermined process on an object to be processed, and corresponding to each of the processing units, provided above the processing unit and provided with a clean air. An air blowout section that blows out directly below, and corresponding to each of the processing sections, provided below the processing section, opposite to the air blowout section, and blown out from each of the air blowout sections. A box-shaped air recovery unit for temporarily storing the clean air that has passed through the processing unit; an air suction mechanism and a return duct for attracting the clean air stored in each of the air recovery units and re-supplying the air to the air blowing unit And characterized in that:

【0014】請求項9記載の本発明の処理装置は、請求
項8記載の処理装置であって、前記各エアー回収部は、
相互にエアの流出入が可能に連結自在であることを特徴
とする。
A processing apparatus according to a ninth aspect of the present invention is the processing apparatus according to the eighth aspect, wherein each of the air collecting units is
It is characterized by being freely connectable so that air can flow in and out of each other.

【0015】請求項10記載の本発明の処理装置は、複
数の処理部と、各処理部に清浄エアーを供給する供給手
段とを有する処理装置であって、前記処理部毎に、供給
される清浄エアーのクリーン度、温度、湿度のうち少な
くとも1つのコントロールの有無を設定可能としたこと
を特徴する。
According to a tenth aspect of the present invention, there is provided a processing apparatus having a plurality of processing units and a supply unit for supplying clean air to each processing unit. It is characterized in that the presence / absence of at least one of the cleanness, temperature and humidity of the clean air can be set.

【0016】請求項11記載の本発明の処理装置は、複
数の処理部と、各処理部に清浄エアーを供給する供給手
段とを有する処理装置であって、当該処理装置に対する
メンテナンス時を検出する手段と、前記メンテナンス時
が検出されたとき、各処理部のうち所定の処理部に供給
される清浄エアーの風速をコントロールすることを特徴
とする。
A processing apparatus according to an eleventh aspect of the present invention is a processing apparatus having a plurality of processing units and a supply unit for supplying clean air to each processing unit, and detects a maintenance time for the processing unit. Means for controlling the wind speed of clean air supplied to a predetermined processing unit among the processing units when the maintenance time is detected.

【0017】請求項12記載の本発明の処理装置におけ
る清浄エアの供給方法は、被処理体に所定の処理を行う
処理部ごとに対応させて、該処理部の上方にエア吹き出
し部を設け、該エア吹き出し部から清浄エアを直下に向
けて吹き出した後、処理部を通過したエアを、エア吸引
機構の吸引力により、前記処理部ごとに対応させて、前
記処理部の下方に設けたエア回収部を通じて回収し、リ
ターンダクトを介してエア吹き出し部に再度供給するこ
とを特徴とする。
According to a twelfth aspect of the present invention, there is provided a method for supplying clean air in a processing apparatus according to the present invention, wherein an air blowing section is provided above the processing section so as to correspond to each processing section which performs a predetermined processing on the object to be processed. After the clean air is blown downward from the air blow-out section, the air passing through the processing section is caused to correspond to each processing section by the suction force of an air suction mechanism, and the air provided below the processing section. It is characterized in that it is collected through the collection unit and is supplied again to the air blowing unit through the return duct.

【0018】請求項13記載の本発明の処理装置におけ
る清浄エアの供給方法は、被処理体に所定の処理を行う
処理部の上方にエア吹き出し部を設け、該エア吹き出し
部から清浄エアを直下に向けて吹き出した後、処理部を
通過したエアを、エア吸引機構の吸引力により、前記処
理部ごとに対応させて、前記処理部の下方に設けたエア
回収部を通じて回収し、リターンダクトを介してエア吹
き出し部に再度供給する一方、前記処理部を囲繞する処
理部保護用のカバー部材の側面部にエア通過部を形成
し、該エア通過部を通じてエアを外部に吹き出すことに
より、外部パーティクルの侵入を防ぐ気流を形成するこ
とを特徴とする。
According to a thirteenth aspect of the present invention, there is provided a method for supplying clean air in a processing apparatus according to the present invention, wherein an air blowing section is provided above a processing section for performing a predetermined processing on an object to be processed, and clean air is directly discharged from the air blowing section. After being blown out toward the processing unit, the air that has passed through the processing unit is collected by an air collecting unit provided below the processing unit, corresponding to each processing unit by the suction force of an air suction mechanism, and a return duct is provided. The air particles are supplied again to the air blow-out unit, and an air passage portion is formed on a side surface of a cover member for protecting the processing unit that surrounds the processing unit, and the air is blown out to the outside through the air passage portion, whereby external particles are discharged. It is characterized by forming an airflow that prevents intrusion of air.

【0019】請求項14記載の本発明の処理装置におけ
る清浄エアの供給方法は、被処理体に所定の処理を行う
処理部の上方に処理部の外方に突出した吹き出し部を有
するエア吹き出し部を設け、該エア吹き出し部から清浄
エアを直下に向けて吹き出した後、処理部を通過したエ
アを、エア吸引機構の吸引力により、前記処理部ごとに
対応させて、前記処理部の下方に設けたエア回収部を通
じて回収し、リターンダクトを介してエア吹き出し部に
再度供給する一方、前記突出した吹き出し部から処理部
の外方においても清浄エアを直下に向けて吹き出すこと
により、外部パーティクルの侵入を防ぐ気流を形成する
ことを特徴とする。
According to a fourteenth aspect of the present invention, there is provided a method for supplying clean air in a processing apparatus, comprising: an air blowing part having a blowing part projecting outward from a processing part above a processing part for performing a predetermined processing on an object to be processed. Is provided, and after the clean air is blown out from the air blow-out section toward directly below, the air passing through the processing section is caused to correspond to each of the processing sections by a suction force of an air suction mechanism, and is provided below the processing section. While collecting through the provided air collecting unit and supplying it again to the air blowing unit via the return duct, the clean air is blown out directly from the protruding blowing unit to the outside of the processing unit, so that external particles are removed. It is characterized by forming an airflow that prevents intrusion.

【0020】請求項1記載の本発明の処理装置は、被処
理体に所定の処理を行う処理部ごとに対応させて、該処
理部の上方にエア吹き出し部を設け、また、処理部ごと
に対応させて、該処理部の下方に設けたエア回収部を設
けている。したがって、エア吹き出し部から直下に向け
て吹き出された清浄エアは、当該装置内に設置された処
理部を通過した後、エア吸引機構による吸引力により、
該エア吹き出し部に対向するエア回収部を通じて回収さ
れ、リターンダクトを介してエア吹き出し部に再度供給
される。すなわち、処理装置ごとに対応してエア吹き出
し部およびエア回収部が設けられているため、例えば、
塗布・現像処理システム中、当該処理装置が不要で、当
該処理装置を省いた際には、当該処理装置に設けられた
エア吹き出し部、エア回収部等も一緒に除去される。こ
のため、塗布・現像処理システムにおいて、必要な箇所
(処理装置)においてのみ清浄エアを供給でき、不要な
処理装置を省いた場合には、ブロワやファン等に余分な
負荷がかからず、従来と比較してランニングコストを低
減することができる。
In the processing apparatus according to the first aspect of the present invention, an air blowing section is provided above the processing section so as to correspond to each processing section for performing a predetermined process on the object to be processed. Correspondingly, an air recovery section provided below the processing section is provided. Therefore, the clean air blown directly downward from the air blowout unit passes through the processing unit installed in the apparatus, and then is suctioned by the air suction mechanism.
The air is recovered through the air recovery unit facing the air blowing unit, and is supplied again to the air blowing unit via the return duct. That is, since an air blowing unit and an air collecting unit are provided for each processing device, for example,
In the coating / developing processing system, the processing apparatus is unnecessary, and when the processing apparatus is omitted, the air blowing section, the air recovery section, and the like provided in the processing apparatus are also removed. For this reason, in the coating / developing processing system, it is possible to supply clean air only to necessary parts (processing equipment), and if unnecessary processing equipment is omitted, no extra load is applied to the blower, fan, etc. The running cost can be reduced as compared with the case of FIG.

【0021】請求項2記載の本発明の処理装置は、被処
理体に所定の処理を行う処理部ごとに対応させて、該処
理部の上方にエア吹き出し部を設け、また、処理部ごと
に対応させて、該処理部の下方に設けたエア回収部を設
けていると共に、処理部を囲繞する処理部保護用のカバ
ー部材の側面部にエア通過部を形成している。したがっ
て、エア吹き出し部から直下に向けて吹き出された清浄
エアは、当該装置内に設置された処理部を通過した後、
エア吸引機構による吸引力により、該エア吹き出し部に
対向するエア回収部を通じて回収され、リターンダクト
を介してエア吹き出し部に再度供給される一方、エア通
過部を通じてエアを外部に吹き出すことにより、外部パ
ーティクルの侵入を防ぐ気流を形成することができる。
このため、例えば、塗布・現像処理システムにおいて、
必要な箇所(処理装置)においてのみ清浄エアを供給で
き、不要な処理装置を省いた場合には、ブロワやファン
等に余分な負荷がかからず、従来と比較してランニング
コストを低減することができると共に、被処理体に対す
るパーティクルの付着をより効果的に防止できる。
According to a second aspect of the present invention, an air blowing section is provided above the processing section so as to correspond to each processing section for performing a predetermined process on the object to be processed. Correspondingly, an air recovery section provided below the processing section is provided, and an air passage section is formed on a side surface of a cover member for protecting the processing section surrounding the processing section. Therefore, the clean air blown directly downward from the air blowout unit passes through the processing unit installed in the device,
By the suction force of the air suction mechanism, the air is recovered through the air recovery unit facing the air blowing unit, and is again supplied to the air blowing unit via the return duct. An airflow that prevents particles from entering can be formed.
For this reason, for example, in a coating and developing processing system,
Clean air can be supplied only to the necessary places (processing equipment), and if unnecessary processing equipment is omitted, no extra load is applied to the blower, fan, etc., and the running cost can be reduced compared to the past. And adhesion of particles to the object to be processed can be more effectively prevented.

【0022】請求項3記載の本発明の処理装置は、被処
理体に所定の処理を行う処理部ごとに対応させて、該処
理部の上方にエア吹き出し部を設け、また、処理部ごと
に対応させて、該処理部の下方に設けたエア回収部を設
けている。また、前記処理部の外方においても清浄エア
を直下に向けて吹き出すことができる突出した吹き出し
部を設け、さらに、前記突出した吹き出し部の外側縁に
沿ってカーテン部材を設けている。したがって、エア吹
き出し部から直下に向けて吹き出された清浄エアは、当
該装置内に設置された処理部を通過した後、エア吸引機
構による吸引力により、該エア吹き出し部に対向するエ
ア回収部を通じて回収され、リターンダクトを介してエ
ア吹き出し部に再度供給される。その一方、突出した吹
き出し部を通じてカーテン部材と処理部との間にダウン
ブローの気流を形成することができる。このため、処理
部に対してメンテナンス処理を行う際に、作業者がカー
テン部材内に入ったときの、外部パーティクルの処理部
内への侵入を防止できる。
According to a third aspect of the present invention, an air blowing section is provided above the processing section so as to correspond to each processing section for performing a predetermined process on the object to be processed. Correspondingly, an air recovery section provided below the processing section is provided. In addition, a protruding blow-out portion capable of blowing clean air directly below the processing portion is provided, and a curtain member is provided along an outer edge of the protruding blow-out portion. Therefore, the clean air blown directly downward from the air blowout section passes through the processing section installed in the apparatus, and then, by the suction force of the air suction mechanism, passes through the air recovery section facing the air blowout section. It is collected and supplied again to the air blowing section via the return duct. On the other hand, a down-blow airflow can be formed between the curtain member and the processing section through the protruding blowing section. For this reason, when performing maintenance processing on the processing unit, it is possible to prevent external particles from entering the processing unit when an operator enters the curtain member.

【0023】請求項4記載の本発明の処理装置は、前記
エア吹き出し部を、送風ファンと、該送風ファンの吹き
出し側に設けられるフィルタとを有する構成としてい
る。したがって、吹き出し直前にフィルタにより清浄さ
れた清浄エアが各処理装置ごと供給される。
According to a fourth aspect of the present invention, in the processing apparatus of the present invention, the air blowing section includes a blowing fan and a filter provided on a blowing side of the blowing fan. Therefore, clean air that has been cleaned by the filter immediately before blowing is supplied to each processing apparatus.

【0024】請求項5記載の本発明の処理装置は、前記
エア吸引機構が熱交換機とブロワを有しているため、前
記エア回収部を経由させてエアを吸引して回収する際、
エアを冷却し、その上でリターンダクトを経由させてエ
ア吹き出し部に供給することができる。
According to a fifth aspect of the present invention, since the air suction mechanism has a heat exchanger and a blower, when the air is sucked and recovered through the air recovery section,
The air can be cooled and then supplied to the air blowing section via a return duct.

【0025】請求項6記載の本発明の処理装置は、前記
エア吸引吸引機構に外部空気取り入れ口が付設されてい
る。このため、装置外へ漏れたエア分を新鮮な外部空気
で補うことができる。
According to a sixth aspect of the present invention, the air suction / suction mechanism is provided with an external air intake. For this reason, the air leaked out of the apparatus can be supplemented with fresh external air.

【0026】請求項7記載の本発明の処理装置では、前
記エア吹き出し部とエア回収部との間に、ケミカルトラ
ップが配置されているので、より清浄なエアの供給が可
能である。
In the processing apparatus according to the present invention, since a chemical trap is disposed between the air blowing section and the air collecting section, it is possible to supply cleaner air.

【0027】請求項8記載の本発明の処理装置では、各
エア吹き出し部から吹き出されて各処理部を通過した清
浄エアを一旦蓄積する箱形のエア回収部がリターンダク
ト等とは別個に設けられているので、均一な吸引或いは
必要に応じて分布を変えた吸引を行うことができる。
In the processing apparatus according to the present invention, a box-shaped air recovery section for temporarily storing clean air blown out from each air blowing section and passing through each processing section is provided separately from the return duct and the like. Therefore, it is possible to perform a uniform suction or a suction whose distribution is changed as required.

【0028】請求項9記載の本発明の処理装置では、各
エアー回収部が相互にエアの流出入が可能に連結自在で
あるので、増設が容易である。
In the processing apparatus according to the ninth aspect of the present invention, the respective air recovery sections can be connected to each other so that air can flow in and out of each other.

【0029】請求項10記載の本発明の処理装置では、
処理部毎に、供給される清浄エアーのクリーン度、温
度、湿度のうち少なくとも1つのコントロールの有無を
設定可能としたので、最適でかつ安価な装置構成をとる
ことが可能である。
[0029] In the processing apparatus of the present invention described in claim 10,
Since it is possible to set at least one of the control of the degree of cleanness, temperature, and humidity of the supplied clean air for each processing unit, an optimal and inexpensive device configuration can be obtained.

【0030】請求項11記載の本発明の処理装置では、
当該処理装置に対するメンテナンス時を検出する手段を
有し、メンテナンス時が検出されたとき、各処理部のう
ち所定の処理部に供給される清浄エアーの風速をコント
ロールしているので、メンテナンス時に所定の処理部に
パーティクル等が進入するのを防止することができる。
[0030] In the processing apparatus according to the eleventh aspect of the present invention,
It has means for detecting the maintenance time of the processing apparatus, and when the maintenance time is detected, the wind speed of the clean air supplied to a predetermined processing unit among the processing units is controlled. It is possible to prevent particles and the like from entering the processing section.

【0031】請求項12記載の本発明の処理装置におけ
る清浄エアの供給方法によれば、処理装置ごとに対応し
てエア吹き出し部およびエア回収部を設けて供給するた
め、必要な箇所(処理装置)においてのみ清浄エアを供
給でき、不要な処理装置を省いた場合には、ブロワやフ
ァン等に余分な負荷がかからず、従来と比較してランニ
ングコストを低減することができる。
According to the method for supplying clean air in the processing apparatus of the present invention, since the air blowing section and the air recovery section are provided and supplied corresponding to each processing apparatus, a necessary portion (processing apparatus) is provided. 2), clean air can be supplied only when unnecessary processing equipment is omitted, and no extra load is applied to the blower, the fan, etc., and the running cost can be reduced as compared with the conventional case.

【0032】請求項13記載の本発明の処理装置におけ
る清浄エアの供給方法によれば、エア通過部を通じてエ
アを外部に吹き出すことにより、外部パーティクルの侵
入を防ぐ気流を形成することができる。このため、被処
理体に対するパーティクルの付着をより効果的に防止で
きる。
According to the method for supplying clean air in the processing apparatus according to the thirteenth aspect of the present invention, by blowing air to the outside through the air passage portion, it is possible to form an airflow for preventing intrusion of external particles. Therefore, it is possible to more effectively prevent particles from adhering to the object.

【0033】請求項14記載の本発明の処理装置におけ
る清浄エアの供給方法によれば、突出した吹き出し部を
通じて処理部の外部にダウンブローの気流を形成するこ
とができる。このため、処理部に対してメンテナンス処
理を行う際に、作業者が接近したときの、外部パーティ
クルの処理部内への侵入を防止できる。
According to the method for supplying clean air in the processing apparatus of the present invention, a down-blow airflow can be formed outside the processing section through the protruding blowing section. For this reason, when performing a maintenance process on the processing unit, it is possible to prevent external particles from entering the processing unit when an operator approaches.

【0034】[0034]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づき説明するが、まず、本発明の処理装置の組み合
わせからなる、LCD用のガラス基板上にITOの薄膜
や電極パターンを形成するフォトレジストの塗布・現像
処理システムの全体構成について説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, an ITO thin film and an electrode pattern are formed on a glass substrate for LCD, which is a combination of the processing apparatus of the present invention. The overall configuration of the photoresist coating / developing processing system will be described.

【0035】図1に示すように、この塗布・現像処理シ
ステム1の前方には、ガラス基板Gを、塗布・現像処理
システム1に対して搬出入するローダ・アンローダ部2
が設けられている。このローダ・アンローダ部2には、
ガラス基板Gを例えば25枚ずつ収納したカセットCを
所定位置に整列させて載置させるカセット載置台3と、
各カセットCから処理すべきガラス基板Gを取り出し、
また塗布・現像処理システム1において処理の終了した
ガラス基板Gを各カセットCへ戻すローダ・アンローダ
4が設けられている。図示のローダアンローダ4は、本
体5の走行によってカセットCの配列方向に移動し、本
体5に搭載された板片状のピンセット6によって各カセ
ットCからガラス基板Gを取り出し、また各カセットC
へガラス基板Gを戻すようになっている。また、ピンセ
ット6の両側には、ガラス基板Gの四隅を保持して位置
合わせを行う基板位置合わせ部材7が設けられている。
As shown in FIG. 1, in front of the coating / developing processing system 1, a loader / unloader unit 2 for loading / unloading the glass substrate G with respect to the coating / developing processing system 1.
Is provided. This loader / unloader unit 2 includes:
A cassette mounting table 3 on which a cassette C containing, for example, 25 glass substrates G is aligned and mounted at a predetermined position;
Take out the glass substrate G to be processed from each cassette C,
Further, a loader / unloader 4 for returning the glass substrate G, which has been processed in the coating / developing processing system 1, to each cassette C is provided. The illustrated loader / unloader 4 moves in the direction in which the cassettes C are arranged by traveling of the main body 5, takes out the glass substrate G from each cassette C by the plate-like tweezers 6 mounted on the main body 5, and
The glass substrate G is returned. Further, on both sides of the tweezers 6, there are provided substrate positioning members 7 for holding and positioning the four corners of the glass substrate G.

【0036】塗布・現像処理システム1の中央部には、
長手方向に配置された廊下状の搬送路10、11が第1
の受け渡し部12を介して一直線上に設けられており、
この搬送路10、11の両側には、ガラス基板Gに対す
る各処理を行うための各種処理装置が配置されている。
At the center of the coating and developing system 1,
Corridor-like transport paths 10, 11 arranged in the longitudinal direction are the first.
Are provided in a straight line via the transfer unit 12 of
Various processing apparatuses for performing each processing on the glass substrate G are arranged on both sides of the transport paths 10 and 11.

【0037】図示の塗布・現像処理システム1にあって
は、搬送路10の一側方に、ガラス基板Gをブラシ洗浄
すると共に高圧ジェット水により洗浄を施すための洗浄
装置16が例えば2台並設されている。また、搬送路1
0を挟んで反対側に、二基の現像装置17が並設され、
その隣りに二基の加熱装置18が積み重ねて設けられて
いる。
In the illustrated coating / developing processing system 1, for example, two cleaning devices 16 for cleaning the glass substrate G by brush and high-pressure jet water are provided on one side of the transport path 10. Has been established. In addition, transport path 1
Two developing devices 17 are arranged side by side on the opposite side with respect to 0,
Two heating devices 18 are stacked next to each other.

【0038】また、搬送路11の一側方に、ガラス基板
Gにレジスト液を塗布する前にガラス基板Gを疎水処理
するアドヒージョン装置20が設けられ、このアドヒー
ジョン装置20の下方には冷却用の清浄グ装置21が配
置されている。また、これらアドヒージョン装置20と
清浄グ装置21の隣には加熱装置22が二列に二個ずつ
積み重ねて配置されている。また、搬送路11を挟んで
反対側に、ガラス基板Gの表面にレジスト液を塗布する
ことによってガラス基板Gの表面にレジスト膜を形成す
るレジスト塗布装置23が配置されている。図示はしな
いが、これら塗布装置23の側部には、第2の受け渡し
部28を介し、ガラス基板G上に形成されたレジスト膜
に所定の微細パターンを露光するための露光装置等が設
けられる。第2の受け渡し部28は、ガラス基板Gを搬
入および搬出するための搬出入ピンセット29および受
け渡し台30を備えている。
Further, on one side of the transport path 11, an adhesion device 20 for hydrophobically treating the glass substrate G before applying the resist liquid to the glass substrate G is provided. Below the adhesion device 20, a cooling device is provided. A cleaning device 21 is provided. Further, adjacent to the adhesion device 20 and the cleaning device 21, two heating devices 22 are stacked and arranged in two rows. On the opposite side of the transport path 11, a resist coating device 23 that forms a resist film on the surface of the glass substrate G by applying a resist liquid on the surface of the glass substrate G is disposed. Although not shown, an exposure device or the like for exposing a predetermined fine pattern to a resist film formed on the glass substrate G via a second transfer unit 28 is provided on a side portion of the coating device 23. . The second transfer unit 28 includes a loading / unloading tweezers 29 for loading and unloading the glass substrate G, and a delivery table 30.

【0039】以上の各処理装置16〜18および20〜
23は、何れも搬送路10、11の両側において、ガラ
ス基板Gの出入口を内側に向けて配設されている。第1
の搬送装置25がローダ・アンローダ部2、各処理装置
16〜18および第1の受け渡し部12との間でガラス
基板Gを搬送するために搬送路10上を移動し、第2の
搬送装置26が第1の受け渡し部12、第2の受け渡し
部28および各処理装置20〜23との間でガラス基板
Gを搬送するために搬送路11上を移動するようになっ
ている。
The above processing units 16 to 18 and 20 to
23 is disposed on both sides of the transport paths 10 and 11 with the entrance of the glass substrate G facing inward. First
Transfer device 25 moves on the transfer path 10 to transfer the glass substrate G between the loader / unloader unit 2, each of the processing devices 16 to 18, and the first transfer unit 12, and the second transfer device 26 Move on the transfer path 11 to transfer the glass substrate G between the first transfer unit 12, the second transfer unit 28, and each of the processing devices 20 to 23.

【0040】各搬送装置25、26は、それぞれ上下一
対のアーム27、27を有しており、各処理装置16〜
18および20〜23にアクセスするときは、一方のア
ーム27で各処理装置のチャンバから処理済みのガラス
基板Gを搬出し、他方のアーム27で処理前のガラス基
板Gをチャンバ内に搬入するように構成されている。
Each of the transfer devices 25 and 26 has a pair of upper and lower arms 27 and 27, respectively.
When accessing 18 and 20 to 23, the processed glass substrate G is unloaded from the chamber of each processing apparatus by one arm 27, and the unprocessed glass substrate G is loaded into the chamber by the other arm 27. Is configured.

【0041】図2は図1に示した塗布・現像処理システ
ムを構成する処理装置のうち、レジスト塗布装置23と
加熱装置22の概略構成を示す斜視図であり、図3はそ
の断面図である。
FIG. 2 is a perspective view showing a schematic configuration of a resist coating unit 23 and a heating unit 22 of the processing units constituting the coating / developing processing system shown in FIG. 1, and FIG. 3 is a sectional view thereof. .

【0042】図に示したように、レジスト塗布装置23
と加熱装置22とは、通常、搬送路11を挟んで一つの
処理ユニットを構成するように設けられている。このよ
うに一対の処理装置からなる処理ユニットが複数連接さ
れることで、レジスト塗布装置23と加熱装置22とが
被処理体であるガラス基板Gの処理枚数に応じて、必要
数配設される。すなわち、各処理装置には、下部にキャ
スター35がそれぞれ設けられており、処理装置ごとに
移動してライン上に配置したり、ラインから外したりす
ることにより、レジスト塗布装置23と加熱装置22と
の配設数を調整することができる。
As shown in FIG.
The heating device 22 and the heating device 22 are usually provided so as to constitute one processing unit with the transport path 11 interposed therebetween. By connecting a plurality of processing units each including a pair of processing apparatuses in this manner, a required number of resist coating apparatuses 23 and heating apparatuses 22 are provided according to the number of processed glass substrates G to be processed. . That is, each processing apparatus is provided with a caster 35 at a lower portion, and is moved for each processing apparatus to be disposed on a line or removed from the line, so that the resist coating apparatus 23 and the heating apparatus 22 Can be adjusted.

【0043】なお、本実施の形態では、このように、レ
ジスト塗布装置23と加熱装置22とにより一つの処理
ユニットを構成し、後述のエア吸引機構45とリターン
ダクト44とは、処理装置ごとではなく処理ユニットご
とに設けている。エア吸引機構45およびリターンダク
ト44とも、エア吹き出し部40およびエア回収部43
のように各処理装置ごとに対応させて設けることもでき
るが、本実施の形態のように処理ユニットごとに設ける
と構成を簡易にすることができる。そして、各エア回収
部43は、各ユニット毎に分離、独立しており、システ
ムに組み合わせるときにジョイントパイプ43bで連結
されるようになっている。
In this embodiment, as described above, one processing unit is constituted by the resist coating device 23 and the heating device 22, and the air suction mechanism 45 and the return duct 44 described later are provided separately for each processing device. And is provided for each processing unit. Both the air suction mechanism 45 and the return duct 44 include the air blowing section 40 and the air collecting section 43.
Although it can be provided corresponding to each processing device as described above, the configuration can be simplified if provided for each processing unit as in the present embodiment. The air collecting sections 43 are separated and independent for each unit, and are connected by a joint pipe 43b when combined with the system.

【0044】本実施の形態にかかる処理装置であるレジ
スト塗布装置23と加熱装置22とは、搬送路11を挟
んで一組の処理ユニットを構成しており、レジスト塗布
装置23においては、ガラス基板Gが載置され、回転し
ながらガラス基板G上に吐出されるレジストを均一に広
げるスピンチャック31が処理部に相当し、加熱装置2
2においては、載置されるガラス基板Gを加熱して熱処
理を行うホットプレート32が処理部に相当する。ま
た、搬送路11においては、レジスト塗布装置23や加
熱装置22にガラス基板Gを出し入れするために走行す
る搬送装置26が処理部に相当する。
The resist coating device 23 and the heating device 22, which are the processing devices according to the present embodiment, constitute a set of processing units with the conveyance path 11 interposed therebetween. A spin chuck 31 on which a resist is discharged and uniformly spread on the glass substrate G while being rotated corresponds to a processing unit.
In 2, the hot plate 32 that heats the mounted glass substrate G by heating is equivalent to the processing unit. In the transport path 11, a transport device 26 that travels to take the glass substrate G in and out of the resist coating device 23 and the heating device 22 corresponds to a processing unit.

【0045】エア吹き出し部40は、レジスト塗布装置
23においてはスピンチャック31の上方、加熱装置2
2においてはホットプレート32の上方、搬送路11に
おいては搬送装置26の上方に設けられている。このエ
ア吹き出し部40は、送風ファン41と該送風ファン4
1よりも吹き出し側に配設されるフィルタ42とを有し
て構成される。フィルタ42は、後述のエア回収部43
やリターンダクト44中に配設することも可能である
が、回収されたエアがエア回収部43やリターンダクト
44を通過する間に、微小の浮遊パーティクルと再接触
する可能性があるため、本実施の形態のように、送風フ
ァン41の後段、すなわち、エアの吹き出し直前に配設
することが好ましい。もちろん、このフィルタ42のほ
かに、さらにリターンダクト44中等にケミカルトラッ
プ61,62を配設することも可能である。これによ
り、より清浄なエアを供給可能になる。
In the resist coating device 23, the air blowing unit 40 is located above the spin chuck 31 and the heating device 2.
2 is provided above the hot plate 32, and in the transfer path 11 is provided above the transfer device 26. The air blowing section 40 includes a blower fan 41 and the blower fan 4.
And a filter 42 disposed closer to the outlet side than the filter 42. The filter 42 includes an air recovery unit 43 described later.
Although it is possible to dispose the collected air in the return duct 44, the collected air may come into contact with minute floating particles while passing through the air collection unit 43 or the return duct 44. As in the embodiment, it is preferable to dispose it at a stage subsequent to the blower fan 41, that is, immediately before blowing out the air. Of course, in addition to the filter 42, chemical traps 61 and 62 can be further disposed in the return duct 44 or the like. This makes it possible to supply cleaner air.

【0046】エア回収部43は、上記したエア吹き出し
部40と対向する位置、すなわち、スピンチャック31
の下方、ホットプレート32の下方、搬送装置26の下
方にそれぞれ設けられる。エア回収部43は、上面に複
数のエア通過孔が形成された多孔板43aを有してお
り、後述のエア吸引機構45の作動により該エア通過孔
を介してエアが回収される構造である。また、本実施の
形態では、エア回収部43が、必ずエア吹き出し部40
に対向して、処理装置と一体に設けられている構成であ
るため、移動用のキャスタ35は、該エア回収部43を
形成しているフレームの下部に設けられる。また、本実
施の形態では、エア吸引機構45およびリターンダクト
44を一組の処理ユニットごとに設けているため、各処
理装置に設けられるエア回収部43は相互にジョイント
パイプ43bを介して接続している。
The air collecting section 43 is located at a position facing the air blowing section 40, that is, the spin chuck 31.
, Below the hot plate 32, and below the transfer device 26, respectively. The air collecting section 43 has a perforated plate 43a having a plurality of air passage holes formed on an upper surface, and has a structure in which air is collected through the air passage holes by the operation of an air suction mechanism 45 described later. . Further, in the present embodiment, the air collection unit 43 is always
The moving casters 35 are provided at the lower part of the frame forming the air collecting section 43 because the moving casters 35 are provided integrally with the processing device. Further, in the present embodiment, since the air suction mechanism 45 and the return duct 44 are provided for each set of processing units, the air collection units 43 provided in each processing device are connected to each other via the joint pipe 43b. ing.

【0047】処理装置の一つであるレジスト塗布装置2
3のスピンチャック31の周囲には、該スピンチャック
31を保護するための、処理部保護用のカバー部材31
aが設けられている。この処理部保護用のカバー部材3
1には、その側面部に、メンテナンス用の窓部31bが
設けられている。本実施の形態においては、このメンテ
ナンス用の窓部31bをエア通過部として用い、該窓部
31bを通じて積極的に清浄エアを外部に放出し得るよ
うに設けている。これにより、処理装置内が陽圧とな
り、外部が陰圧雰囲気になるため、窓部31bからの外
部パーティクルの侵入を積極的に防止している。同様
に、加熱装置22のホットプレート32の周囲にも処理
部保護用のカバー部材32aが設けられており、この処
理部保護用のカバー部材32aの側面部にもエア通過部
32bを形成している。
A resist coating device 2 which is one of the processing devices
A cover member 31 for protecting the processing unit is provided around the spin chuck 31 of No. 3 to protect the spin chuck 31.
a is provided. Cover member 3 for protecting this processing section
1 is provided with a maintenance window 31b on the side surface thereof. In the present embodiment, the maintenance window 31b is used as an air passage portion, and is provided so that clean air can be positively discharged to the outside through the window 31b. As a result, the inside of the processing apparatus becomes a positive pressure, and the outside becomes a negative pressure atmosphere. Therefore, intrusion of external particles from the window 31b is positively prevented. Similarly, a cover member 32a for protecting the processing section is provided around the hot plate 32 of the heating device 22, and an air passage section 32b is formed on the side surface of the cover member 32a for protecting the processing section. I have.

【0048】エア吸引機構45は、ブロワ45aと、該
ブロワ45aの保持用ケース45bとを有し、保持用ケ
ース45bは、処理ユニットを構成するいずれかの処理
装置のエア回収部43に排気ダクト45cを介して接続
されている。また、保持用ケース45bには新鮮な外部
空気を取り込む外部空気取り入れ口45dが設けられて
いると共に、排気ダクト45cには、回収されたエアを
冷却するための熱交換機45eが配設されている。な
お、エア吸引機構45は、処理装置が設置される床面上
に配置してもよいが、予め、接続されるリターンダクト
44を引き出した上で、床面下に所定数埋設しておくこ
とも可能である。
The air suction mechanism 45 has a blower 45a and a case 45b for holding the blower 45a, and the holding case 45b is connected to the air collection unit 43 of any of the processing units constituting the processing unit by an exhaust duct. 45c. The holding case 45b is provided with an external air intake 45d for taking in fresh external air, and the exhaust duct 45c is provided with a heat exchanger 45e for cooling the collected air. . The air suction mechanism 45 may be disposed on the floor on which the processing apparatus is installed. However, it is necessary to draw out the return duct 44 to be connected in advance and bury the predetermined number under the floor. Is also possible.

【0049】保持用ケース45bは、さらに、リターン
ダクト44を介してエア吹き出し部40に連結されてい
る。より具体的には、エア吹き出し部40を構成する送
風ファン41の手前側には、3つのエア吹き出し部40
を相互に連通する連通ダクト46が設けられており、リ
ターンダクト44はこの連通ダクト46に連結されてい
る。なお、リターンダクト44の適宜箇所には、エア吹
き出し部40に再供給されるエアを冷却するための冷凍
機(図示せず)を配設することもできる。
The holding case 45b is further connected to the air blowing section 40 via a return duct 44. More specifically, three air blowing portions 40 are provided in front of the blower fan 41 constituting the air blowing portion 40.
Are provided with a communication duct 46 that communicates with each other. The return duct 44 is connected to the communication duct 46. In addition, a refrigerator (not shown) for cooling the air resupplied to the air blowing unit 40 may be provided at an appropriate position of the return duct 44.

【0050】上記したように、エア吹き出し部40とエ
ア回収部43とは処理部の上方又は下方に対向するよう
に設けられているが、本実施の形態では、該エア吹き出
し部40に、装置外に突出する吹き出し部40aを設け
ている。この突出した吹き出し部40aは、メンテナン
ス用の窓部31bが設けられたレジスト塗布装置23の
上方に配設されたエア吹き出し部40に、該窓部31b
の形成面と同じ側の外方に突出するように設けられてい
る。また、この突出した吹き出し部40aの外側面に沿
って下方に垂下するようにプラスチックフィルム等から
なるカーテン部材48が設けられている。メンテナンス
作業をする場合には、作業者がこのカーテン部材48の
内側に入り、窓部31bを通じて所定の作業を行うこと
になるが、このように、突出した吹き出し部40aを設
け、ダウンブローで清浄エアを供給することで、作業者
がカーテン部材48の内側に入ったときの気流の乱れに
よる外部パーティクルの窓部31bを通じての侵入を防
ぐことができる。
As described above, the air blowing section 40 and the air collecting section 43 are provided so as to face above or below the processing section, but in the present embodiment, the air blowing section 40 is provided with the device. A blowing portion 40a protruding outside is provided. The protruding blowout portion 40a is attached to the air blowout portion 40 disposed above the resist coating device 23 provided with the maintenance window portion 31b.
Is formed so as to protrude outward on the same side as the surface on which the. Further, a curtain member 48 made of a plastic film or the like is provided so as to hang down along the outer surface of the protruding blowout portion 40a. When the maintenance work is performed, the worker enters the inside of the curtain member 48 and performs a predetermined work through the window 31b. In this manner, the protruding blowout part 40a is provided, and the cleaning is performed by down blow. By supplying air, it is possible to prevent external particles from entering through the window 31b due to turbulence in the airflow when the operator enters the inside of the curtain member 48.

【0051】本実施の形態によれば、レジスト塗布装置
23、加熱装置22、および搬送路11の各処理装置に
おいて、スピンチャック31、ホットプレート32又は
搬送装置26の各上方に配置されたエア吹き出し部40
から清浄エアが直下に向けて供給される。そして、これ
らの処理部において被処理体であるガラス基板Gに向か
ってパーティクルが付着しないように供給された清浄エ
アは、その後、エア吸引機構45を構成するブロワ45
aの作動により吸引され、対応して配設されたエア回収
部43を経由して回収される。また、レジスト塗布装置
23の窓部31bや加熱装置22のエア通過部32bを
通じて、エアが装置外部に排出される。このため、この
窓部31b等を通じての外部パーティクルの侵入が防止
できる。清浄エアは、このようにその一部が外部に漏れ
ることから、回収されたエア量だけでは、次に供給する
清浄エアのエア量が不足することになるが、その不足分
は、ブロワ保持用ケース45bに形成された外部空気取
り入れ口45dから吸引され、リターンダクト44を通
じて、回収されたエアと共にエア吹き出し部40に供給
され、フィルタ42を通過することにより、清浄エアと
して処理部に向けて再度供給される。
According to the present embodiment, in each of the resist coating device 23, the heating device 22, and the processing device of the transfer path 11, the air blowout disposed above each of the spin chuck 31, the hot plate 32, and the transfer device 26. Part 40
, Clean air is supplied downward. Then, in these processing units, the clean air supplied so as to prevent particles from adhering to the glass substrate G as the object to be processed is then supplied to the blower 45 constituting the air suction mechanism 45.
The air is sucked by the operation of a, and is collected via the air collection unit 43 provided correspondingly. In addition, air is discharged to the outside of the apparatus through the window 31b of the resist coating device 23 and the air passage 32b of the heating device 22. Therefore, intrusion of external particles through the window 31b and the like can be prevented. Since a part of the clean air leaks to the outside in this way, the amount of the collected clean air alone will result in a shortage of the clean air to be supplied next. The air is sucked from the external air inlet 45d formed in the case 45b, supplied to the air blowing unit 40 together with the collected air through the return duct 44, and passed through the filter 42, so that the air is cleaned again toward the processing unit as clean air. Supplied.

【0052】以上のように、本実施の形態によれば、各
処理装置ごとにエア吹き出し部40やエア回収部43が
設けられている構成であるため、不要な処理装置を除去
した場合には、エア吹き出し部40およびエア回収部4
3が一緒に除去されることから、従来のように、エア吸
引機構45に余計な負荷がかかることを防止できる。
As described above, according to the present embodiment, since the air blowing section 40 and the air collecting section 43 are provided for each processing apparatus, when an unnecessary processing apparatus is removed, Air blowing section 40 and air collecting section 4
Since 3 is removed together, it is possible to prevent an unnecessary load from being applied to the air suction mechanism 45 as in the related art.

【0053】なお、図4に示すように、カーテン部材4
8が形成された側に、メンテナンス時に使うステップ台
51を設け、このステップ台51内にエア吸引機構とし
ての機能を持たせ、エア回収部43のエアを吸引するよ
うにしてもよい。
Note that, as shown in FIG.
A step table 51 used for maintenance may be provided on the side where 8 is formed, and a function as an air suction mechanism may be provided in the step table 51 so that the air in the air recovery section 43 may be sucked.

【0054】また、リターンダクトを介して供給される
エアの性質を各処理ユニット毎に変えても良い。例え
ば、図4の符号52、53、54で示す各処理ユニット
に対応する各リターンダクトから異なる性質のエア、例
えばリターンダクト52から温度及び湿度がコントロー
ルされたエア、リターンダクト53から清浄のみがなさ
れたエア、リターンダクト54から清浄がなされ流速の
遅いエアを供給するようにしてもよい。即ち、処理部毎
に、供給される清浄エアーのクリーン度、温度、湿度等
のコントロールの有無を設定可能することで、最適でか
つ安価な装置構成をとることが可能である。
Further, the nature of the air supplied through the return duct may be changed for each processing unit. For example, air having different properties from the respective return ducts corresponding to the respective processing units indicated by reference numerals 52, 53 and 54 in FIG. 4, for example, air whose temperature and humidity are controlled from the return duct 52, and only cleaning from the return duct 53 are performed. Alternatively, it is also possible to supply clean air from the return duct 54 and air with a low flow velocity. That is, it is possible to set an optimal and inexpensive apparatus configuration by setting whether or not to control the cleanness, temperature, humidity, and the like of the supplied clean air for each processing unit.

【0055】更に、図5の符号71、72に示すリター
ンダクトの構成のように、スピン系、搬送系等に大きく
分けて、それぞれ例えば上記の如く制御されたエアを供
給しても構わない。
Further, as in the configuration of the return ducts indicated by reference numerals 71 and 72 in FIG. 5, the air may be broadly divided into a spin system, a transport system, and the like, and the air controlled as described above, for example, may be supplied.

【0056】また、装置の前面や側面等のオペレーショ
ン面に人が出入りしたり、処理ユニットの前面カバー等
を開けたときに、その状態を、例えば圧力センサ、風速
センサ、ドアスイッチ等により検出し、必要な部部の風
速をコントロールするように構成しても構わない。
Further, when a person enters or exits an operation surface such as a front surface or a side surface of the apparatus, or when a front cover of the processing unit is opened, the state is detected by a pressure sensor, a wind speed sensor, a door switch, or the like. Alternatively, the wind speed of a necessary part may be controlled.

【0057】上記した説明では、処理装置として、塗布
・現像処理システムを構成するレジスト塗布装置23や
加熱装置22にエア吹き出し部40等を設けた場合を例
にとり説明しているが、洗浄装置16等の他の処理装置
をこのようなエア吹き出し部40等を設けた構成とする
ことももちろん可能である。
In the above description, the case where the resist coating device 23 and the heating device 22 constituting the coating / developing processing system are provided with the air blowing section 40 and the like as the processing device is described as an example. Of course, it is also possible to adopt a configuration in which such an air blowing unit 40 or the like is provided in another processing apparatus.

【0058】[0058]

【発明の効果】請求項1記載の本発明の処理装置によれ
ば、処理装置ごとに対応してエア吹き出し部およびエア
回収部が設けられているため、例えば、塗布・現像処理
システム中、当該処理装置が不要で、当該処理装置を省
いた際には、当該処理装置に設けられたエア吹き出し
部、エア回収部等も一緒に除去される。このため、塗布
・現像処理システムにおいて、必要な箇所(処理装置)
においてのみ清浄エアを供給でき、不要な処理装置を省
いた場合には、ブロワやファン等に余分な負荷がかから
ず、従来と比較してランニングコストを低減することが
できる。
According to the processing apparatus of the present invention, the air blowing section and the air collecting section are provided for each processing apparatus. When the processing device is unnecessary and the processing device is omitted, the air blowing unit, the air recovery unit, and the like provided in the processing device are also removed. Therefore, in the coating / developing processing system, necessary parts (processing equipment)
In the case where unnecessary processing equipment is omitted, unnecessary load is not applied to the blower, the fan and the like, and the running cost can be reduced as compared with the related art.

【0059】請求項2記載の本発明の処理装置によれ
ば、例えば、塗布・現像処理システムにおいて、必要な
箇所(処理装置)においてのみ清浄エアを供給でき、不
要な処理装置を省いた場合には、ブロワやファン等に余
分な負荷がかからず、従来と比較してランニングコスト
を低減することができると共に、被処理体に対するパー
ティクルの付着をより効果的に防止できる。
According to the processing apparatus of the present invention, for example, in a coating / developing processing system, clean air can be supplied only to a necessary portion (processing apparatus), and unnecessary processing apparatuses can be omitted. In this method, no extra load is applied to the blower, the fan, etc., so that the running cost can be reduced as compared with the related art, and the adhesion of particles to the object can be more effectively prevented.

【0060】請求項3記載の本発明の処理装置によれ
ば、エア吹き出し部から直下に向けて吹き出された清浄
エアは、当該装置内に設置された処理部を通過した後、
エア吸引機構による吸引力により、該エア吹き出し部に
対向するエア回収部を通じて回収され、リターンダクト
を介してエア吹き出し部に再度供給される。その一方、
突出した吹き出し部を通じてカーテン部材と処理部との
間にダウンブローの気流を形成することができる。この
ため、処理部に対してメンテナンス処理を行う際に、作
業者がカーテン部材内に入ったときの、外部パーティク
ルの処理部内への侵入を防止できる。
According to the processing apparatus of the third aspect of the present invention, the clean air blown directly downward from the air blowing section passes through the processing section installed in the apparatus, and
Due to the suction force of the air suction mechanism, the air is recovered through the air recovery section facing the air blowing section, and is again supplied to the air blowing section via the return duct. On the other hand,
A down-blow airflow can be formed between the curtain member and the processing section through the protruding blowing section. For this reason, when performing maintenance processing on the processing unit, it is possible to prevent external particles from entering the processing unit when an operator enters the curtain member.

【0061】請求項4記載の本発明の処理装置によれ
ば、前記エア吹き出し部を、送風ファンと、該送風ファ
ンの吹き出し側に設けられるフィルタとを有する構成と
している。したがって、吹き出し直前にフィルタにより
清浄された清浄エアが各処理装置ごと供給される。
According to a fourth aspect of the present invention, the air blowing section includes a blower fan and a filter provided on the blower side of the blower fan. Therefore, clean air that has been cleaned by the filter immediately before blowing is supplied to each processing apparatus.

【0062】請求項5記載の本発明の処理装置によれ
ば、前記エア吸引機構が熱交換機とブロワを有している
ため、前記エア回収部を経由させてエアを吸引して回収
する際、エアを冷却し、その上でリターンダクトを経由
させてエア吹き出し部に供給することができる。
According to the processing apparatus of the present invention, since the air suction mechanism has a heat exchanger and a blower, when the air is sucked and collected through the air collecting section, The air can be cooled and then supplied to the air blowing section via a return duct.

【0063】請求項6記載の本発明の処理装置によれ
ば、前記エア吸引吸引機構に外部空気取り入れ口が付設
されている。このため、装置外へ漏れたエア分を新鮮な
外部空気で補うことができる。
According to the processing apparatus of the present invention, the air suction / suction mechanism is provided with an external air intake. For this reason, the air leaked out of the apparatus can be supplemented with fresh external air.

【0064】請求項7記載の本発明の処理装置によれ
ば、前記エア吹き出し部とエア回収部との間に、ケミカ
ルトラップが配置されているので、より清浄なエアの供
給が可能である。
According to the processing apparatus of the present invention, since the chemical trap is arranged between the air blowing section and the air collecting section, it is possible to supply more clean air.

【0065】請求項8記載の本発明の処理装置によれ
ば、各エア吹き出し部から吹き出されて各処理部を通過
した清浄エアを一旦蓄積する箱形のエア回収部がリター
ンダクト等とは別個に設けられているので、均一な吸引
或いは必要に応じて分布を変えた吸引を行うことができ
る。
According to the processing apparatus of the present invention, the box-shaped air recovery section for temporarily storing the clean air blown out from each air blowing section and passing through each processing section is separate from the return duct and the like. , It is possible to perform a uniform suction or a suction whose distribution is changed as required.

【0066】請求項9記載の本発明の処理装置によれ
ば、各エアー回収部が相互にエアの流出入が可能に連結
自在であるので、増設が容易である。
According to the processing apparatus of the ninth aspect of the present invention, the respective air recovery units can be connected to each other so that air can flow in and out of each other.

【0067】請求項10記載の本発明の処理装置によれ
ば、処理部毎に、供給される清浄エアーのクリーン度、
温度、湿度のうち少なくとも1つのコントロールの有無
を設定可能としたので、最適でかつ安価な装置構成をと
ることが可能である。
According to the processing apparatus of the present invention, the cleanliness of the supplied clean air is determined for each processing section.
Since at least one control of temperature and humidity can be set, an optimal and inexpensive device configuration can be obtained.

【0068】請求項11記載の本発明の処理装置によれ
ば、当該処理装置に対するメンテナンス時を検出する手
段を有し、メンテナンス時が検出されたとき、各処理部
のうち所定の処理部に供給される清浄エアーの風速をコ
ントロールしているので、メンテナンス時に所定の処理
部にパーティクル等が進入するのを防止することができ
る。
According to the eleventh aspect of the present invention, there is provided the processing apparatus of the present invention, which has a means for detecting a maintenance time of the processing apparatus, and when the maintenance time is detected, supplies to a predetermined processing unit among the processing units. Since the wind speed of the clean air is controlled, it is possible to prevent particles and the like from entering a predetermined processing unit during maintenance.

【0069】請求項12記載の本発明の処理装置におけ
る清浄エアの供給方法によれば、処理装置ごとに対応し
てエア吹き出し部およびエア回収部を設けて供給するた
め、必要な箇所(処理装置)においてのみ清浄エアを供
給でき、不要な処理装置を省いた場合には、ブロワやフ
ァン等に余分な負荷がかからず、従来と比較してランニ
ングコストを低減することができる。
According to the method for supplying clean air in the processing apparatus of the present invention, since an air blowing section and an air recovery section are provided and supplied for each processing apparatus, a necessary portion (processing apparatus) is provided. 2), clean air can be supplied only when unnecessary processing equipment is omitted, and no extra load is applied to the blower, the fan, etc., and the running cost can be reduced as compared with the conventional case.

【0070】請求項13記載の本発明の処理装置におけ
る清浄エアの供給方法によれば、エア通過部を通じてエ
アを外部に吹き出すことにより、外部パーティクルの侵
入を防ぐ気流を形成することができる。このため、被処
理体に対するパーティクルの付着をより効果的に防止で
きる。
According to the method for supplying clean air in the processing apparatus according to the thirteenth aspect of the present invention, by blowing air to the outside through the air passage section, it is possible to form an air flow for preventing intrusion of external particles. Therefore, it is possible to more effectively prevent particles from adhering to the object.

【0071】請求項14記載の本発明の処理装置におけ
る清浄エアの供給方法によれば、突出した吹き出し部を
通じて処理部の外部にダウンブローの気流を形成するこ
とができる。このため、処理部に対してメンテナンス処
理を行う際に、作業者が接近したときの、外部パーティ
クルの処理部内への侵入を防止できる。
According to the method for supplying clean air in the processing apparatus of the present invention, it is possible to form a down-blow airflow outside the processing section through the protruding blowing section. For this reason, when performing a maintenance process on the processing unit, it is possible to prevent external particles from entering the processing unit when an operator approaches.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の一の実施の形態に係る塗布・現像処
理システムの斜視図である。
FIG. 1 is a perspective view of a coating / developing processing system according to an embodiment of the present invention.

【図2】 図2は図1に示した塗布・現像処理システム
を構成する処理装置のうち、レジスト塗布装置と加熱装
置の概略構成を示す斜視図である。
FIG. 2 is a perspective view showing a schematic configuration of a resist coating device and a heating device among processing devices constituting the coating / developing processing system shown in FIG.

【図3】 図3は図2の断面図である。FIG. 3 is a sectional view of FIG. 2;

【図4】 本発明の他の実施形態に係るレジスト塗布装
置と加熱装置の断面図である。
FIG. 4 is a cross-sectional view of a resist coating device and a heating device according to another embodiment of the present invention.

【図5】 本発明の他の実施形態に係る塗布・現像処理
システムの断面図である。
FIG. 5 is a sectional view of a coating / developing processing system according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

26 搬送装置 31 スピンチャック 31a カバー部材 32 ホットプレート 32a カバー部材 40 エア吹き出し部 40a 突出したエア引き出し部 41 送風ファン 42 フィルタ 43 エア回収部 44 リターンダクト 45 エア吸引機構 45a ブロワ 45d 外部空気取り入れ口 45e 熱交換機 48 カーテン部材 G ガラス基板 26 Conveying device 31 Spin chuck 31a Cover member 32 Hot plate 32a Cover member 40 Air blow-out part 40a Protruding air draw-out part 41 Blower fan 42 Filter 43 Air recovery part 44 Return duct 45 Air suction mechanism 45a Blower 45d External air intake 45e Heat Exchanger 48 Curtain member G Glass substrate

Claims (14)

【特許請求の範囲】[Claims] 【請求項1】 被処理体に所定の処理を行う複数の処理
部と、 前記各処理部に対応して、該処理部の上方に設けられ、
清浄エアを直下に向けて吹き出すエア吹き出し部と、 前記各処理部に対応して、該処理部の下方に、前記エア
吹き出し部に対向して設けられ、エア吸引機構の吸引力
により、リターンダクトを通じて前記エア吹き出し部に
エアを再供給するため、処理部を通過したエアを回収す
るエア回収部と、 を具備することを特徴とする処理装置。
1. A plurality of processing units for performing predetermined processing on an object to be processed, and provided above the processing units corresponding to the processing units,
An air blowing section for blowing clean air directly downward, corresponding to each processing section, provided below the processing section and opposed to the air blowing section, and provided with a return duct by a suction force of an air suction mechanism. And an air recovery unit that recovers air that has passed through the processing unit in order to resupply the air to the air blowing unit through the air processing unit.
【請求項2】 被処理体に所定の処理を行う処理部と、 前記処理部を囲繞すると共に、側面部にエアを外部に吹
き出すためのエア通過部が形成された処理部保護用のカ
バー部材と、 前記処理部に対応して、該処理部の上方に設けられ、清
浄エアを直下に向けて吹き出すエア吹き出し部と、 前記処理部に対応して、該処理部の下方に、前記エア吹
き出し部に対向して設けられ、エア吸引機構の吸引力に
より、リターンダクトを通じて前記エア吹き出し部にエ
アを再供給するため、処理部を通過したエアを回収する
エア回収部と、を具備することを特徴とする処理装置。
2. A processing unit for performing a predetermined processing on an object to be processed, and a cover member for protecting the processing unit, the processing unit surrounding the processing unit and having an air passage formed on a side surface for blowing air to the outside. Corresponding to the processing unit, an air blowing unit provided above the processing unit and blowing clean air directly downward, and corresponding to the processing unit, the air blowing below the processing unit. An air collection unit that is provided to face the unit and collects air that has passed through the processing unit in order to resupply air to the air blowing unit through a return duct by a suction force of an air suction mechanism. Characteristic processing device.
【請求項3】 被処理体に所定の処理を行う処理部と、 前記処理部に対応して、該処理部の上方に設けられ、清
浄エアを直下に向けて吹き出し可能であると共に、前記
処理部の外方においても清浄エアを直下に向けて吹き出
すことができる突出した吹き出し部を有するエア吹き出
し部と、 前記突出した吹き出し部の外側縁に沿って設けられるカ
ーテン部材と、 前記処理部に対応して、該処理部の下方に、前記エア吹
き出し部のうち、処理部外へ突出した吹き出し部を除い
たエア吹き出し部に対向して設けられ、エア吸引機構の
吸引力により、リターンダクトを通じて前記エア吹き出
し部にエアを再供給するため、処理部を通過したエアを
回収するエア回収部と、 を具備することを特徴とする処理装置。
A processing unit for performing predetermined processing on the object to be processed; a processing unit provided above the processing unit corresponding to the processing unit, and capable of blowing clean air directly below the processing unit; An air blowing portion having a protruding blowing portion that can blow clean air directly downward even outside the portion, a curtain member provided along an outer edge of the protruding blowing portion, Then, below the processing unit, the air blowing unit is provided to face the air blowing unit excluding the blowing unit protruding outside the processing unit, and the suction force of the air suction mechanism causes the return unit to pass through the return duct. A processing apparatus comprising: an air recovery unit that recovers air that has passed through the processing unit in order to resupply air to the air blowing unit.
【請求項4】 請求項1〜3のいずれか1に記載の処理
装置であって、前記エア吹き出し部が、送風ファンと、
該送風ファンの吹き出し側に設けられるフィルタとを有
して構成されることを特徴とする処理装置。
4. The processing apparatus according to claim 1, wherein the air blowing unit includes a blower fan,
A processing device, comprising: a filter provided on a blowing side of the blower fan.
【請求項5】 請求項1〜4のいずれか1に記載の処理
装置であって、前記エア吸引機構が、吸引されたエアを
冷却する熱交換機と、前記エア回収部を経由させてエア
を吸引すると共に、前記リターンダクトを経由させてエ
ア吹き出し部に回収されたエアを供給するブロワとを有
して構成されることを特徴とする処理装置。
5. The processing apparatus according to claim 1, wherein the air suction mechanism removes the air through a heat exchanger that cools the sucked air and the air recovery unit. A processing apparatus, comprising: a blower that sucks air and supplies the collected air to the air blowing unit via the return duct.
【請求項6】 請求項1〜5のいずれか1に記載の処理
装置であって、前記エア吸引機構に外部空気取り入れ口
が付設されていることを特徴とする処理装置。
6. The processing apparatus according to claim 1, wherein an external air intake is provided to the air suction mechanism.
【請求項7】 請求項1〜6のいずれか1に記載の処理
装置であって、前記エア吹き出し部とエア回収部との間
に、ケミカルトラップが配置されていることを特徴とす
る処理装置。
7. The processing apparatus according to claim 1, wherein a chemical trap is disposed between the air blowing section and the air recovery section. .
【請求項8】 被処理体に所定の処理を行う複数の処理
部と、 前記各処理部に対応して、該処理部の上方に設けられ、
清浄エアを直下に向けて吹き出すエア吹き出し部と、 前記各処理部に対応して、該処理部の下方に、前記エア
吹き出し部に対向してそれぞれ設けられ、前記各エア吹
き出し部から吹き出されて前記各処理部を通過した清浄
エアを一旦蓄積する箱形のエア回収部と、 前記各エア回収部に蓄積された清浄エアを引力し、前記
エア吹き出し部に再供給するためのエア吸引機構及びリ
ターンダクトとを具備することを特徴とする処理装置。
8. A plurality of processing units for performing predetermined processing on the object to be processed, and provided above the processing units corresponding to the processing units,
An air blowing section for blowing clean air directly downward, corresponding to each of the processing sections, provided below the processing section, opposite to the air blowing section, and blown from each of the air blowing sections. A box-shaped air collection unit that temporarily accumulates the clean air that has passed through each of the processing units; and an air suction mechanism for attracting the clean air accumulated in each of the air collection units and re-supplying the air to the air blowing unit. A processing device, comprising: a return duct.
【請求項9】 請求項8記載の処理装置であって、 前記各エアー回収部は、相互にエアの流出入が可能に連
結自在であることを特徴とする処理装置。
9. The processing apparatus according to claim 8, wherein each of the air recovery units is freely connectable so that air can flow in and out of each other.
【請求項10】 複数の処理部と、各処理部に清浄エア
ーを供給する供給手段とを有する処理装置であって、 前記処理部毎に、供給される清浄エアーのクリーン度、
温度、湿度のうち少なくとも1つのコントロールの有無
を設定可能としたことを特徴する処理装置。
10. A processing apparatus comprising: a plurality of processing units; and a supply unit for supplying clean air to each processing unit, wherein the cleanliness of the supplied clean air is determined for each of the processing units.
A processing apparatus characterized in that the presence or absence of at least one of temperature and humidity can be set.
【請求項11】 複数の処理部と、各処理部に清浄エア
ーを供給する供給手段とを有する処理装置であって、 当該処理装置に対するメンテナンス時を検出する手段
と、 前記メンテナンス時が検出されたとき、各処理部のうち
所定の処理部に供給される清浄エアーの風速をコントロ
ールすることを特徴とする処理装置。
11. A processing apparatus comprising: a plurality of processing units; and a supply unit for supplying clean air to each processing unit, wherein: a unit for detecting a maintenance time for the processing unit; A processing device for controlling a wind speed of clean air supplied to a predetermined processing unit among the processing units.
【請求項12】 被処理体に所定の処理を行う処理部ご
とに対応させて、該処理部の上方にエア吹き出し部を設
け、該エア吹き出し部から清浄エアを直下に向けて吹き
出した後、処理部を通過したエアを、エア吸引機構の吸
引力により、前記処理部ごとに対応させて、前記処理部
の下方に設けたエア回収部を通じて回収し、リターンダ
クトを介してエア吹き出し部に再度供給することを特徴
とする処理装置における清浄エアの供給方法。
12. An air blowing unit is provided above the processing unit in correspondence with each processing unit that performs a predetermined process on the object to be processed, and after the clean air is blown from the air blowing unit directly downward, The air that has passed through the processing unit is collected by an air collection unit provided below the processing unit by the suction force of the air suction mechanism, and is returned to the air blowing unit via a return duct. A method for supplying clean air in a processing apparatus, characterized by supplying.
【請求項13】 被処理体に所定の処理を行う処理部の
上方にエア吹き出し部を設け、該エア吹き出し部から清
浄エアを直下に向けて吹き出した後、処理部を通過した
エアを、エア吸引機構の吸引力により、前記処理部ごと
に対応させて、前記処理部の下方に設けたエア回収部を
通じて回収し、リターンダクトを介してエア吹き出し部
に再度供給する一方、前記処理部を囲繞する処理部保護
用のカバー部材の側面部にエア通過部を形成し、該エア
通過部を通じてエアを外部に吹き出すことにより、外部
パーティクルの侵入を防ぐ気流を形成することを特徴と
する処理装置における清浄エアの供給方法。
13. An air blowing section is provided above a processing section for performing a predetermined processing on the object to be processed, and after the clean air is blown downward from the air blowing section, air passing through the processing section is removed by the air. By the suction force of the suction mechanism, corresponding to each of the processing units, the air is recovered through an air recovery unit provided below the processing unit and supplied again to the air blowing unit via a return duct, while surrounding the processing unit. Forming an air passage on the side surface of the cover member for protecting the processing unit, and blowing air to the outside through the air passage to form an airflow preventing entry of external particles. How to supply clean air.
【請求項14】 被処理体に所定の処理を行う処理部の
上方に処理部の外方に突出した吹き出し部を有するエア
吹き出し部を設け、該エア吹き出し部から清浄エアを直
下に向けて吹き出した後、処理部を通過したエアを、エ
ア吸引機構の吸引力により、前記処理部ごとに対応させ
て、前記処理部の下方に設けたエア回収部を通じて回収
し、リターンダクトを介してエア吹き出し部に再度供給
する一方、前記処理部外へ突出した吹き出し部から処理
部の外方においても清浄エアを直下に向けて吹き出すこ
とにより、外部パーティクルの侵入を防ぐ気流を形成す
ることを特徴とする処理装置における清浄エアの供給方
法。
14. An air blowing section having a blowing section protruding outward from the processing section is provided above a processing section for performing a predetermined processing on the object to be processed, and clean air is blown from the air blowing section directly downward. After that, the air that has passed through the processing unit is collected by an air collecting mechanism provided below the processing unit by the suction force of an air suction mechanism, and the air is blown out through a return duct. While supplying the air again to the processing unit, the cleaning air is blown out from the blowing unit protruding out of the processing unit to the outside of the processing unit just below, thereby forming an airflow that prevents intrusion of external particles. A method for supplying clean air in a processing apparatus.
JP37558598A 1998-12-17 1998-12-17 Processing apparatus, processing system, and method for supplying clean air in the apparatus Expired - Fee Related JP3375294B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP37558598A JP3375294B2 (en) 1998-12-17 1998-12-17 Processing apparatus, processing system, and method for supplying clean air in the apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37558598A JP3375294B2 (en) 1998-12-17 1998-12-17 Processing apparatus, processing system, and method for supplying clean air in the apparatus

Publications (2)

Publication Number Publication Date
JP2000182949A true JP2000182949A (en) 2000-06-30
JP3375294B2 JP3375294B2 (en) 2003-02-10

Family

ID=18505754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37558598A Expired - Fee Related JP3375294B2 (en) 1998-12-17 1998-12-17 Processing apparatus, processing system, and method for supplying clean air in the apparatus

Country Status (1)

Country Link
JP (1) JP3375294B2 (en)

Cited By (265)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6783427B2 (en) 2001-10-22 2004-08-31 Ebara Corporation Polishing system with air exhaust system
US7182813B2 (en) 2002-01-15 2007-02-27 Fuji Photo Film Co., Ltd. Production apparatus of multilayer coating film
JP2008066595A (en) * 2006-09-08 2008-03-21 Tokyo Electron Ltd Liquid treatment equipment, liquid treatment method, and storage medium
US9704727B2 (en) 2013-12-13 2017-07-11 Sinfonia Technology Co., Ltd. Efem
JP2018160681A (en) * 2018-06-05 2018-10-11 株式会社Screenセミコンダクターソリューションズ Substrate processing method
WO2019103610A1 (en) * 2017-11-27 2019-05-31 Asm Ip Holding B.V. Apparatus including a clean mini environment
US10720331B2 (en) 2016-11-01 2020-07-21 ASM IP Holdings, B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US10784102B2 (en) 2016-12-22 2020-09-22 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10787741B2 (en) 2014-08-21 2020-09-29 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
US10804098B2 (en) 2009-08-14 2020-10-13 Asm Ip Holding B.V. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US10832903B2 (en) 2011-10-28 2020-11-10 Asm Ip Holding B.V. Process feed management for semiconductor substrate processing
US10844486B2 (en) 2009-04-06 2020-11-24 Asm Ip Holding B.V. Semiconductor processing reactor and components thereof
US10847371B2 (en) 2018-03-27 2020-11-24 Asm Ip Holding B.V. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10851456B2 (en) 2016-04-21 2020-12-01 Asm Ip Holding B.V. Deposition of metal borides
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US10867786B2 (en) 2018-03-30 2020-12-15 Asm Ip Holding B.V. Substrate processing method
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
US10914004B2 (en) 2018-06-29 2021-02-09 Asm Ip Holding B.V. Thin-film deposition method and manufacturing method of semiconductor device
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
US10928731B2 (en) 2017-09-21 2021-02-23 Asm Ip Holding B.V. Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same
US10934619B2 (en) 2016-11-15 2021-03-02 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including the gas supply unit
US10943771B2 (en) 2016-10-26 2021-03-09 Asm Ip Holding B.V. Methods for thermally calibrating reaction chambers
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US10950432B2 (en) 2017-04-25 2021-03-16 Asm Ip Holding B.V. Method of depositing thin film and method of manufacturing semiconductor device
USD913980S1 (en) 2018-02-01 2021-03-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11001925B2 (en) 2016-12-19 2021-05-11 Asm Ip Holding B.V. Substrate processing apparatus
US11004977B2 (en) 2017-07-19 2021-05-11 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
US11056567B2 (en) 2018-05-11 2021-07-06 Asm Ip Holding B.V. Method of forming a doped metal carbide film on a substrate and related semiconductor device structures
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US11069510B2 (en) 2017-08-30 2021-07-20 Asm Ip Holding B.V. Substrate processing apparatus
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
US11094582B2 (en) 2016-07-08 2021-08-17 Asm Ip Holding B.V. Selective deposition method to form air gaps
US11094546B2 (en) 2017-10-05 2021-08-17 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US11101370B2 (en) 2016-05-02 2021-08-24 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
US11107676B2 (en) 2016-07-28 2021-08-31 Asm Ip Holding B.V. Method and apparatus for filling a gap
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
US11114294B2 (en) 2019-03-08 2021-09-07 Asm Ip Holding B.V. Structure including SiOC layer and method of forming same
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
US11127617B2 (en) 2017-11-27 2021-09-21 Asm Ip Holding B.V. Storage device for storing wafer cassettes for use with a batch furnace
US11127589B2 (en) 2019-02-01 2021-09-21 Asm Ip Holding B.V. Method of topology-selective film formation of silicon oxide
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
US11164955B2 (en) 2017-07-18 2021-11-02 Asm Ip Holding B.V. Methods for forming a semiconductor device structure and related semiconductor device structures
US11171025B2 (en) 2019-01-22 2021-11-09 Asm Ip Holding B.V. Substrate processing device
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
US11168395B2 (en) 2018-06-29 2021-11-09 Asm Ip Holding B.V. Temperature-controlled flange and reactor system including same
US11205585B2 (en) 2016-07-28 2021-12-21 Asm Ip Holding B.V. Substrate processing apparatus and method of operating the same
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
US11222772B2 (en) 2016-12-14 2022-01-11 Asm Ip Holding B.V. Substrate processing apparatus
US11227789B2 (en) 2019-02-20 2022-01-18 Asm Ip Holding B.V. Method and apparatus for filling a recess formed within a substrate surface
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US11233133B2 (en) 2015-10-21 2022-01-25 Asm Ip Holding B.V. NbMC layers
US11242598B2 (en) 2015-06-26 2022-02-08 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US11251068B2 (en) 2018-10-19 2022-02-15 Asm Ip Holding B.V. Substrate processing apparatus and substrate processing method
US11251040B2 (en) 2019-02-20 2022-02-15 Asm Ip Holding B.V. Cyclical deposition method including treatment step and apparatus for same
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
US11270899B2 (en) 2018-06-04 2022-03-08 Asm Ip Holding B.V. Wafer handling chamber with moisture reduction
US11274369B2 (en) 2018-09-11 2022-03-15 Asm Ip Holding B.V. Thin film deposition method
US11282698B2 (en) 2019-07-19 2022-03-22 Asm Ip Holding B.V. Method of forming topology-controlled amorphous carbon polymer film
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
US11289326B2 (en) 2019-05-07 2022-03-29 Asm Ip Holding B.V. Method for reforming amorphous carbon polymer film
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US11315794B2 (en) 2019-10-21 2022-04-26 Asm Ip Holding B.V. Apparatus and methods for selectively etching films
TWI763012B (en) * 2020-01-10 2022-05-01 日商中外爐工業股份有限公司 Clean heat treatment apparatus
US11339476B2 (en) 2019-10-08 2022-05-24 Asm Ip Holding B.V. Substrate processing device having connection plates, substrate processing method
US11342216B2 (en) 2019-02-20 2022-05-24 Asm Ip Holding B.V. Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
US11345999B2 (en) 2019-06-06 2022-05-31 Asm Ip Holding B.V. Method of using a gas-phase reactor system including analyzing exhausted gas
US11355338B2 (en) 2019-05-10 2022-06-07 Asm Ip Holding B.V. Method of depositing material onto a surface and structure formed according to the method
US11361990B2 (en) 2018-05-28 2022-06-14 Asm Ip Holding B.V. Substrate processing method and device manufactured by using the same
US11378337B2 (en) 2019-03-28 2022-07-05 Asm Ip Holding B.V. Door opener and substrate processing apparatus provided therewith
US11387120B2 (en) 2017-09-28 2022-07-12 Asm Ip Holding B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US11390945B2 (en) 2019-07-03 2022-07-19 Asm Ip Holding B.V. Temperature control assembly for substrate processing apparatus and method of using same
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US11393690B2 (en) 2018-01-19 2022-07-19 Asm Ip Holding B.V. Deposition method
US11390946B2 (en) 2019-01-17 2022-07-19 Asm Ip Holding B.V. Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
US11401605B2 (en) 2019-11-26 2022-08-02 Asm Ip Holding B.V. Substrate processing apparatus
US11410851B2 (en) 2017-02-15 2022-08-09 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US11417545B2 (en) 2017-08-08 2022-08-16 Asm Ip Holding B.V. Radiation shield
US11414760B2 (en) 2018-10-08 2022-08-16 Asm Ip Holding B.V. Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same
US11424119B2 (en) 2019-03-08 2022-08-23 Asm Ip Holding B.V. Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer
US11430640B2 (en) 2019-07-30 2022-08-30 Asm Ip Holding B.V. Substrate processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11437241B2 (en) 2020-04-08 2022-09-06 Asm Ip Holding B.V. Apparatus and methods for selectively etching silicon oxide films
US11443926B2 (en) 2019-07-30 2022-09-13 Asm Ip Holding B.V. Substrate processing apparatus
US11447864B2 (en) 2019-04-19 2022-09-20 Asm Ip Holding B.V. Layer forming method and apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
US11469098B2 (en) 2018-05-08 2022-10-11 Asm Ip Holding B.V. Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures
US11476109B2 (en) 2019-06-11 2022-10-18 Asm Ip Holding B.V. Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11482418B2 (en) 2018-02-20 2022-10-25 Asm Ip Holding B.V. Substrate processing method and apparatus
US11482533B2 (en) 2019-02-20 2022-10-25 Asm Ip Holding B.V. Apparatus and methods for plug fill deposition in 3-D NAND applications
US11482412B2 (en) 2018-01-19 2022-10-25 Asm Ip Holding B.V. Method for depositing a gap-fill layer by plasma-assisted deposition
US11488819B2 (en) 2018-12-04 2022-11-01 Asm Ip Holding B.V. Method of cleaning substrate processing apparatus
US11488854B2 (en) 2020-03-11 2022-11-01 Asm Ip Holding B.V. Substrate handling device with adjustable joints
US11495459B2 (en) 2019-09-04 2022-11-08 Asm Ip Holding B.V. Methods for selective deposition using a sacrificial capping layer
US11492703B2 (en) 2018-06-27 2022-11-08 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US11501956B2 (en) 2012-10-12 2022-11-15 Asm Ip Holding B.V. Semiconductor reaction chamber showerhead
US11499222B2 (en) 2018-06-27 2022-11-15 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US11499226B2 (en) 2018-11-02 2022-11-15 Asm Ip Holding B.V. Substrate supporting unit and a substrate processing device including the same
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
US11515187B2 (en) 2020-05-01 2022-11-29 Asm Ip Holding B.V. Fast FOUP swapping with a FOUP handler
US11515188B2 (en) 2019-05-16 2022-11-29 Asm Ip Holding B.V. Wafer boat handling device, vertical batch furnace and method
US11521851B2 (en) 2020-02-03 2022-12-06 Asm Ip Holding B.V. Method of forming structures including a vanadium or indium layer
US11527400B2 (en) 2019-08-23 2022-12-13 Asm Ip Holding B.V. Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane
US11527403B2 (en) 2019-12-19 2022-12-13 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US11530876B2 (en) 2020-04-24 2022-12-20 Asm Ip Holding B.V. Vertical batch furnace assembly comprising a cooling gas supply
US11530483B2 (en) 2018-06-21 2022-12-20 Asm Ip Holding B.V. Substrate processing system
US11551925B2 (en) 2019-04-01 2023-01-10 Asm Ip Holding B.V. Method for manufacturing a semiconductor device
US11551912B2 (en) 2020-01-20 2023-01-10 Asm Ip Holding B.V. Method of forming thin film and method of modifying surface of thin film
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
US11557474B2 (en) 2019-07-29 2023-01-17 Asm Ip Holding B.V. Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11587821B2 (en) 2017-08-08 2023-02-21 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11594600B2 (en) 2019-11-05 2023-02-28 Asm Ip Holding B.V. Structures with doped semiconductor layers and methods and systems for forming same
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
US11594450B2 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Method for forming a structure with a hole
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
US11605528B2 (en) 2019-07-09 2023-03-14 Asm Ip Holding B.V. Plasma device using coaxial waveguide, and substrate treatment method
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
US11610775B2 (en) 2016-07-28 2023-03-21 Asm Ip Holding B.V. Method and apparatus for filling a gap
US11610774B2 (en) 2019-10-02 2023-03-21 Asm Ip Holding B.V. Methods for forming a topographically selective silicon oxide film by a cyclical plasma-enhanced deposition process
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
US11615970B2 (en) 2019-07-17 2023-03-28 Asm Ip Holding B.V. Radical assist ignition plasma system and method
US11626316B2 (en) 2019-11-20 2023-04-11 Asm Ip Holding B.V. Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
US11626308B2 (en) 2020-05-13 2023-04-11 Asm Ip Holding B.V. Laser alignment fixture for a reactor system
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11629407B2 (en) 2019-02-22 2023-04-18 Asm Ip Holding B.V. Substrate processing apparatus and method for processing substrates
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
US11637011B2 (en) 2019-10-16 2023-04-25 Asm Ip Holding B.V. Method of topology-selective film formation of silicon oxide
US11639548B2 (en) 2019-08-21 2023-05-02 Asm Ip Holding B.V. Film-forming material mixed-gas forming device and film forming device
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
US11646204B2 (en) 2020-06-24 2023-05-09 Asm Ip Holding B.V. Method for forming a layer provided with silicon
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
US11646197B2 (en) 2018-07-03 2023-05-09 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US11646184B2 (en) 2019-11-29 2023-05-09 Asm Ip Holding B.V. Substrate processing apparatus
US11644758B2 (en) 2020-07-17 2023-05-09 Asm Ip Holding B.V. Structures and methods for use in photolithography
US11649546B2 (en) 2016-07-08 2023-05-16 Asm Ip Holding B.V. Organic reactants for atomic layer deposition
US11658029B2 (en) 2018-12-14 2023-05-23 Asm Ip Holding B.V. Method of forming a device structure using selective deposition of gallium nitride and system for same
US11658030B2 (en) 2017-03-29 2023-05-23 Asm Ip Holding B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
US11658035B2 (en) 2020-06-30 2023-05-23 Asm Ip Holding B.V. Substrate processing method
US11664245B2 (en) 2019-07-16 2023-05-30 Asm Ip Holding B.V. Substrate processing device
US11664199B2 (en) 2018-10-19 2023-05-30 Asm Ip Holding B.V. Substrate processing apparatus and substrate processing method
US11664267B2 (en) 2019-07-10 2023-05-30 Asm Ip Holding B.V. Substrate support assembly and substrate processing device including the same
US11676812B2 (en) 2016-02-19 2023-06-13 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on top/bottom portions
US11674220B2 (en) 2020-07-20 2023-06-13 Asm Ip Holding B.V. Method for depositing molybdenum layers using an underlayer
US11680839B2 (en) 2019-08-05 2023-06-20 Asm Ip Holding B.V. Liquid level sensor for a chemical source vessel
US11688603B2 (en) 2019-07-17 2023-06-27 Asm Ip Holding B.V. Methods of forming silicon germanium structures
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
US11685991B2 (en) 2018-02-14 2023-06-27 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
US11705333B2 (en) 2020-05-21 2023-07-18 Asm Ip Holding B.V. Structures including multiple carbon layers and methods of forming and using same
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
US11725280B2 (en) 2020-08-26 2023-08-15 Asm Ip Holding B.V. Method for forming metal silicon oxide and metal silicon oxynitride layers
US11725277B2 (en) 2011-07-20 2023-08-15 Asm Ip Holding B.V. Pressure transmitter for a semiconductor processing environment
US11735422B2 (en) 2019-10-10 2023-08-22 Asm Ip Holding B.V. Method of forming a photoresist underlayer and structure including same
US11742189B2 (en) 2015-03-12 2023-08-29 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
US11742198B2 (en) 2019-03-08 2023-08-29 Asm Ip Holding B.V. Structure including SiOCN layer and method of forming same
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11767589B2 (en) 2020-05-29 2023-09-26 Asm Ip Holding B.V. Substrate processing device
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
US11781221B2 (en) 2019-05-07 2023-10-10 Asm Ip Holding B.V. Chemical source vessel with dip tube
US11804364B2 (en) 2020-05-19 2023-10-31 Asm Ip Holding B.V. Substrate processing apparatus
US11802338B2 (en) 2017-07-26 2023-10-31 Asm Ip Holding B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US11810788B2 (en) 2016-11-01 2023-11-07 Asm Ip Holding B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US11814747B2 (en) 2019-04-24 2023-11-14 Asm Ip Holding B.V. Gas-phase reactor system-with a reaction chamber, a solid precursor source vessel, a gas distribution system, and a flange assembly
US11823876B2 (en) 2019-09-05 2023-11-21 Asm Ip Holding B.V. Substrate processing apparatus
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
US11823866B2 (en) 2020-04-02 2023-11-21 Asm Ip Holding B.V. Thin film forming method
US11827981B2 (en) 2020-10-14 2023-11-28 Asm Ip Holding B.V. Method of depositing material on stepped structure
US11828707B2 (en) 2020-02-04 2023-11-28 Asm Ip Holding B.V. Method and apparatus for transmittance measurements of large articles
US11830738B2 (en) 2020-04-03 2023-11-28 Asm Ip Holding B.V. Method for forming barrier layer and method for manufacturing semiconductor device
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
US11840761B2 (en) 2019-12-04 2023-12-12 Asm Ip Holding B.V. Substrate processing apparatus
US11848200B2 (en) 2017-05-08 2023-12-19 Asm Ip Holding B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US11873557B2 (en) 2020-10-22 2024-01-16 Asm Ip Holding B.V. Method of depositing vanadium metal
US11876356B2 (en) 2020-03-11 2024-01-16 Asm Ip Holding B.V. Lockout tagout assembly and system and method of using same
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
US11885013B2 (en) 2019-12-17 2024-01-30 Asm Ip Holding B.V. Method of forming vanadium nitride layer and structure including the vanadium nitride layer
US11887857B2 (en) 2020-04-24 2024-01-30 Asm Ip Holding B.V. Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
US11885023B2 (en) 2018-10-01 2024-01-30 Asm Ip Holding B.V. Substrate retaining apparatus, system including the apparatus, and method of using same
US11885020B2 (en) 2020-12-22 2024-01-30 Asm Ip Holding B.V. Transition metal deposition method
US11891696B2 (en) 2020-11-30 2024-02-06 Asm Ip Holding B.V. Injector configured for arrangement within a reaction chamber of a substrate processing apparatus
US11901179B2 (en) 2020-10-28 2024-02-13 Asm Ip Holding B.V. Method and device for depositing silicon onto substrates
US11898243B2 (en) 2020-04-24 2024-02-13 Asm Ip Holding B.V. Method of forming vanadium nitride-containing layer
US11915929B2 (en) 2019-11-26 2024-02-27 Asm Ip Holding B.V. Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
US11923181B2 (en) 2019-11-29 2024-03-05 Asm Ip Holding B.V. Substrate processing apparatus for minimizing the effect of a filling gas during substrate processing
US11923190B2 (en) 2018-07-03 2024-03-05 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US11929251B2 (en) 2019-12-02 2024-03-12 Asm Ip Holding B.V. Substrate processing apparatus having electrostatic chuck and substrate processing method
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
US11961741B2 (en) 2020-03-12 2024-04-16 Asm Ip Holding B.V. Method for fabricating layer structure having target topological profile
US11959168B2 (en) 2020-04-29 2024-04-16 Asm Ip Holding B.V. Solid source precursor vessel
US11967488B2 (en) 2013-02-01 2024-04-23 Asm Ip Holding B.V. Method for treatment of deposition reactor
US11976359B2 (en) 2020-01-06 2024-05-07 Asm Ip Holding B.V. Gas supply assembly, components thereof, and reactor system including same
US11986868B2 (en) 2020-02-28 2024-05-21 Asm Ip Holding B.V. System dedicated for parts cleaning
US11987881B2 (en) 2020-05-22 2024-05-21 Asm Ip Holding B.V. Apparatus for depositing thin films using hydrogen peroxide
US11996292B2 (en) 2019-10-25 2024-05-28 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
US11993843B2 (en) 2017-08-31 2024-05-28 Asm Ip Holding B.V. Substrate processing apparatus
US11996309B2 (en) 2019-05-16 2024-05-28 Asm Ip Holding B.V. Wafer boat handling device, vertical batch furnace and method
US11996289B2 (en) 2020-04-16 2024-05-28 Asm Ip Holding B.V. Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
US11993847B2 (en) 2020-01-08 2024-05-28 Asm Ip Holding B.V. Injector
US12006572B2 (en) 2019-10-08 2024-06-11 Asm Ip Holding B.V. Reactor system including a gas distribution assembly for use with activated species and method of using same
US12009241B2 (en) 2019-10-14 2024-06-11 Asm Ip Holding B.V. Vertical batch furnace assembly with detector to detect cassette
US12009224B2 (en) 2020-09-29 2024-06-11 Asm Ip Holding B.V. Apparatus and method for etching metal nitrides
US12020934B2 (en) 2020-07-08 2024-06-25 Asm Ip Holding B.V. Substrate processing method
US12027365B2 (en) 2020-11-24 2024-07-02 Asm Ip Holding B.V. Methods for filling a gap and related systems and devices
US12025484B2 (en) 2018-05-08 2024-07-02 Asm Ip Holding B.V. Thin film forming method
US12033885B2 (en) 2020-01-06 2024-07-09 Asm Ip Holding B.V. Channeled lift pin
US12040177B2 (en) 2020-08-18 2024-07-16 Asm Ip Holding B.V. Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
US12040200B2 (en) 2017-06-20 2024-07-16 Asm Ip Holding B.V. Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
US12040199B2 (en) 2018-11-28 2024-07-16 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US12051567B2 (en) 2020-10-07 2024-07-30 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including gas supply unit
US12057314B2 (en) 2020-05-15 2024-08-06 Asm Ip Holding B.V. Methods for silicon germanium uniformity control using multiple precursors
US12074022B2 (en) 2020-08-27 2024-08-27 Asm Ip Holding B.V. Method and system for forming patterned structures using multiple patterning process
US12087586B2 (en) 2020-04-15 2024-09-10 Asm Ip Holding B.V. Method of forming chromium nitride layer and structure including the chromium nitride layer
US12106944B2 (en) 2020-06-02 2024-10-01 Asm Ip Holding B.V. Rotating substrate support
US12107005B2 (en) 2020-10-06 2024-10-01 Asm Ip Holding B.V. Deposition method and an apparatus for depositing a silicon-containing material
US12112940B2 (en) 2019-07-19 2024-10-08 Asm Ip Holding B.V. Method of forming topology-controlled amorphous carbon polymer film
US12125700B2 (en) 2020-01-16 2024-10-22 Asm Ip Holding B.V. Method of forming high aspect ratio features
US12129545B2 (en) 2020-12-22 2024-10-29 Asm Ip Holding B.V. Precursor capsule, a vessel and a method
US12131885B2 (en) 2020-12-22 2024-10-29 Asm Ip Holding B.V. Plasma treatment device having matching box
US12148609B2 (en) 2021-09-13 2024-11-19 Asm Ip Holding B.V. Silicon oxide deposition method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293554A (en) * 1989-05-09 1990-12-04 Fuji Electric Co Ltd Clean room system
JPH03199839A (en) * 1989-12-27 1991-08-30 Tadahiro Omi Clean room
JPH03271645A (en) * 1990-03-22 1991-12-03 Hitachi Ltd Air purifying system
JPH03291436A (en) * 1990-04-05 1991-12-20 N M B Semiconductor:Kk Clean room of semiconductor manufacturing factory
JPH05106888A (en) * 1991-04-17 1993-04-27 Matsushita Electric Ind Co Ltd Connected type clean spacing device
JPH06318538A (en) * 1993-04-06 1994-11-15 Hitachi Plant Eng & Constr Co Ltd Semiconductor device, method and apparatus for manufacturing teh same
JPH07180867A (en) * 1993-12-24 1995-07-18 Hitachi Ltd Manufacturing system of product
JPH1096332A (en) * 1996-09-20 1998-04-14 Mitsubishi Electric Corp Clean room
JPH10144600A (en) * 1996-11-08 1998-05-29 Canon Sales Co Inc Substrate treatment equipment

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293554A (en) * 1989-05-09 1990-12-04 Fuji Electric Co Ltd Clean room system
JPH03199839A (en) * 1989-12-27 1991-08-30 Tadahiro Omi Clean room
JPH03271645A (en) * 1990-03-22 1991-12-03 Hitachi Ltd Air purifying system
JPH03291436A (en) * 1990-04-05 1991-12-20 N M B Semiconductor:Kk Clean room of semiconductor manufacturing factory
JPH05106888A (en) * 1991-04-17 1993-04-27 Matsushita Electric Ind Co Ltd Connected type clean spacing device
JPH06318538A (en) * 1993-04-06 1994-11-15 Hitachi Plant Eng & Constr Co Ltd Semiconductor device, method and apparatus for manufacturing teh same
JPH07180867A (en) * 1993-12-24 1995-07-18 Hitachi Ltd Manufacturing system of product
JPH1096332A (en) * 1996-09-20 1998-04-14 Mitsubishi Electric Corp Clean room
JPH10144600A (en) * 1996-11-08 1998-05-29 Canon Sales Co Inc Substrate treatment equipment

Cited By (324)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6783427B2 (en) 2001-10-22 2004-08-31 Ebara Corporation Polishing system with air exhaust system
US7182813B2 (en) 2002-01-15 2007-02-27 Fuji Photo Film Co., Ltd. Production apparatus of multilayer coating film
JP2008066595A (en) * 2006-09-08 2008-03-21 Tokyo Electron Ltd Liquid treatment equipment, liquid treatment method, and storage medium
US7914613B2 (en) 2006-09-08 2011-03-29 Tokyo Electron Limited Liquid processing apparatus, liquid processing method and storage medium
US8038769B2 (en) 2006-09-08 2011-10-18 Tokyo Electron Limited Liquid processing apparatus, liquid processing method and storage medium
US10844486B2 (en) 2009-04-06 2020-11-24 Asm Ip Holding B.V. Semiconductor processing reactor and components thereof
US10804098B2 (en) 2009-08-14 2020-10-13 Asm Ip Holding B.V. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US11725277B2 (en) 2011-07-20 2023-08-15 Asm Ip Holding B.V. Pressure transmitter for a semiconductor processing environment
US10832903B2 (en) 2011-10-28 2020-11-10 Asm Ip Holding B.V. Process feed management for semiconductor substrate processing
US11501956B2 (en) 2012-10-12 2022-11-15 Asm Ip Holding B.V. Semiconductor reaction chamber showerhead
US11967488B2 (en) 2013-02-01 2024-04-23 Asm Ip Holding B.V. Method for treatment of deposition reactor
US9704727B2 (en) 2013-12-13 2017-07-11 Sinfonia Technology Co., Ltd. Efem
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US10787741B2 (en) 2014-08-21 2020-09-29 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US11795545B2 (en) 2014-10-07 2023-10-24 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US11742189B2 (en) 2015-03-12 2023-08-29 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
US11242598B2 (en) 2015-06-26 2022-02-08 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US11233133B2 (en) 2015-10-21 2022-01-25 Asm Ip Holding B.V. NbMC layers
US11956977B2 (en) 2015-12-29 2024-04-09 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US11676812B2 (en) 2016-02-19 2023-06-13 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on top/bottom portions
US10851456B2 (en) 2016-04-21 2020-12-01 Asm Ip Holding B.V. Deposition of metal borides
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US11101370B2 (en) 2016-05-02 2021-08-24 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US11649546B2 (en) 2016-07-08 2023-05-16 Asm Ip Holding B.V. Organic reactants for atomic layer deposition
US11094582B2 (en) 2016-07-08 2021-08-17 Asm Ip Holding B.V. Selective deposition method to form air gaps
US11749562B2 (en) 2016-07-08 2023-09-05 Asm Ip Holding B.V. Selective deposition method to form air gaps
US11610775B2 (en) 2016-07-28 2023-03-21 Asm Ip Holding B.V. Method and apparatus for filling a gap
US11107676B2 (en) 2016-07-28 2021-08-31 Asm Ip Holding B.V. Method and apparatus for filling a gap
US11205585B2 (en) 2016-07-28 2021-12-21 Asm Ip Holding B.V. Substrate processing apparatus and method of operating the same
US11694892B2 (en) 2016-07-28 2023-07-04 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10943771B2 (en) 2016-10-26 2021-03-09 Asm Ip Holding B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US11810788B2 (en) 2016-11-01 2023-11-07 Asm Ip Holding B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10720331B2 (en) 2016-11-01 2020-07-21 ASM IP Holdings, B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10934619B2 (en) 2016-11-15 2021-03-02 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including the gas supply unit
US11396702B2 (en) 2016-11-15 2022-07-26 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including the gas supply unit
US11222772B2 (en) 2016-12-14 2022-01-11 Asm Ip Holding B.V. Substrate processing apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
US12000042B2 (en) 2016-12-15 2024-06-04 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11970766B2 (en) 2016-12-15 2024-04-30 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11851755B2 (en) 2016-12-15 2023-12-26 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
US11001925B2 (en) 2016-12-19 2021-05-11 Asm Ip Holding B.V. Substrate processing apparatus
US11251035B2 (en) 2016-12-22 2022-02-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10784102B2 (en) 2016-12-22 2020-09-22 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US12043899B2 (en) 2017-01-10 2024-07-23 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US12106965B2 (en) 2017-02-15 2024-10-01 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US11410851B2 (en) 2017-02-15 2022-08-09 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US11658030B2 (en) 2017-03-29 2023-05-23 Asm Ip Holding B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
US10950432B2 (en) 2017-04-25 2021-03-16 Asm Ip Holding B.V. Method of depositing thin film and method of manufacturing semiconductor device
US11848200B2 (en) 2017-05-08 2023-12-19 Asm Ip Holding B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US12040200B2 (en) 2017-06-20 2024-07-16 Asm Ip Holding B.V. Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
US11976361B2 (en) 2017-06-28 2024-05-07 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US11164955B2 (en) 2017-07-18 2021-11-02 Asm Ip Holding B.V. Methods for forming a semiconductor device structure and related semiconductor device structures
US11695054B2 (en) 2017-07-18 2023-07-04 Asm Ip Holding B.V. Methods for forming a semiconductor device structure and related semiconductor device structures
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US11004977B2 (en) 2017-07-19 2021-05-11 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11802338B2 (en) 2017-07-26 2023-10-31 Asm Ip Holding B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US11417545B2 (en) 2017-08-08 2022-08-16 Asm Ip Holding B.V. Radiation shield
US11587821B2 (en) 2017-08-08 2023-02-21 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
US11069510B2 (en) 2017-08-30 2021-07-20 Asm Ip Holding B.V. Substrate processing apparatus
US11581220B2 (en) 2017-08-30 2023-02-14 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
US11993843B2 (en) 2017-08-31 2024-05-28 Asm Ip Holding B.V. Substrate processing apparatus
US10928731B2 (en) 2017-09-21 2021-02-23 Asm Ip Holding B.V. Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11387120B2 (en) 2017-09-28 2022-07-12 Asm Ip Holding B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US11094546B2 (en) 2017-10-05 2021-08-17 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US12033861B2 (en) 2017-10-05 2024-07-09 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
US12040184B2 (en) 2017-10-30 2024-07-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
US11682572B2 (en) 2017-11-27 2023-06-20 Asm Ip Holdings B.V. Storage device for storing wafer cassettes for use with a batch furnace
US11127617B2 (en) 2017-11-27 2021-09-21 Asm Ip Holding B.V. Storage device for storing wafer cassettes for use with a batch furnace
WO2019103610A1 (en) * 2017-11-27 2019-05-31 Asm Ip Holding B.V. Apparatus including a clean mini environment
US11639811B2 (en) 2017-11-27 2023-05-02 Asm Ip Holding B.V. Apparatus including a clean mini environment
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US11501973B2 (en) 2018-01-16 2022-11-15 Asm Ip Holding B.V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US11972944B2 (en) 2018-01-19 2024-04-30 Asm Ip Holding B.V. Method for depositing a gap-fill layer by plasma-assisted deposition
US11393690B2 (en) 2018-01-19 2022-07-19 Asm Ip Holding B.V. Deposition method
US11482412B2 (en) 2018-01-19 2022-10-25 Asm Ip Holding B.V. Method for depositing a gap-fill layer by plasma-assisted deposition
US12119228B2 (en) 2018-01-19 2024-10-15 Asm Ip Holding B.V. Deposition method
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
USD913980S1 (en) 2018-02-01 2021-03-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US11735414B2 (en) 2018-02-06 2023-08-22 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US11387106B2 (en) 2018-02-14 2022-07-12 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US11685991B2 (en) 2018-02-14 2023-06-27 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US11482418B2 (en) 2018-02-20 2022-10-25 Asm Ip Holding B.V. Substrate processing method and apparatus
US11939673B2 (en) 2018-02-23 2024-03-26 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
US11398382B2 (en) 2018-03-27 2022-07-26 Asm Ip Holding B.V. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US10847371B2 (en) 2018-03-27 2020-11-24 Asm Ip Holding B.V. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US12020938B2 (en) 2018-03-27 2024-06-25 Asm Ip Holding B.V. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
US10867786B2 (en) 2018-03-30 2020-12-15 Asm Ip Holding B.V. Substrate processing method
US12025484B2 (en) 2018-05-08 2024-07-02 Asm Ip Holding B.V. Thin film forming method
US11469098B2 (en) 2018-05-08 2022-10-11 Asm Ip Holding B.V. Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures
US11056567B2 (en) 2018-05-11 2021-07-06 Asm Ip Holding B.V. Method of forming a doped metal carbide film on a substrate and related semiconductor device structures
US11908733B2 (en) 2018-05-28 2024-02-20 Asm Ip Holding B.V. Substrate processing method and device manufactured by using the same
US11361990B2 (en) 2018-05-28 2022-06-14 Asm Ip Holding B.V. Substrate processing method and device manufactured by using the same
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
US11270899B2 (en) 2018-06-04 2022-03-08 Asm Ip Holding B.V. Wafer handling chamber with moisture reduction
US11837483B2 (en) 2018-06-04 2023-12-05 Asm Ip Holding B.V. Wafer handling chamber with moisture reduction
JP2018160681A (en) * 2018-06-05 2018-10-11 株式会社Screenセミコンダクターソリューションズ Substrate processing method
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
US11296189B2 (en) 2018-06-21 2022-04-05 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
US11530483B2 (en) 2018-06-21 2022-12-20 Asm Ip Holding B.V. Substrate processing system
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
US11952658B2 (en) 2018-06-27 2024-04-09 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US11814715B2 (en) 2018-06-27 2023-11-14 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US11499222B2 (en) 2018-06-27 2022-11-15 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US11492703B2 (en) 2018-06-27 2022-11-08 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US10914004B2 (en) 2018-06-29 2021-02-09 Asm Ip Holding B.V. Thin-film deposition method and manufacturing method of semiconductor device
US11168395B2 (en) 2018-06-29 2021-11-09 Asm Ip Holding B.V. Temperature-controlled flange and reactor system including same
US11923190B2 (en) 2018-07-03 2024-03-05 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US11646197B2 (en) 2018-07-03 2023-05-09 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11804388B2 (en) 2018-09-11 2023-10-31 Asm Ip Holding B.V. Substrate processing apparatus and method
US11274369B2 (en) 2018-09-11 2022-03-15 Asm Ip Holding B.V. Thin film deposition method
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
US11885023B2 (en) 2018-10-01 2024-01-30 Asm Ip Holding B.V. Substrate retaining apparatus, system including the apparatus, and method of using same
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US11414760B2 (en) 2018-10-08 2022-08-16 Asm Ip Holding B.V. Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same
US11251068B2 (en) 2018-10-19 2022-02-15 Asm Ip Holding B.V. Substrate processing apparatus and substrate processing method
US11664199B2 (en) 2018-10-19 2023-05-30 Asm Ip Holding B.V. Substrate processing apparatus and substrate processing method
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11735445B2 (en) 2018-10-31 2023-08-22 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11499226B2 (en) 2018-11-02 2022-11-15 Asm Ip Holding B.V. Substrate supporting unit and a substrate processing device including the same
US11866823B2 (en) 2018-11-02 2024-01-09 Asm Ip Holding B.V. Substrate supporting unit and a substrate processing device including the same
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US11798999B2 (en) 2018-11-16 2023-10-24 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US11411088B2 (en) 2018-11-16 2022-08-09 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US11244825B2 (en) 2018-11-16 2022-02-08 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US12040199B2 (en) 2018-11-28 2024-07-16 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
US11488819B2 (en) 2018-12-04 2022-11-01 Asm Ip Holding B.V. Method of cleaning substrate processing apparatus
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
US11769670B2 (en) 2018-12-13 2023-09-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
US11658029B2 (en) 2018-12-14 2023-05-23 Asm Ip Holding B.V. Method of forming a device structure using selective deposition of gallium nitride and system for same
US11959171B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
US11390946B2 (en) 2019-01-17 2022-07-19 Asm Ip Holding B.V. Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
US11171025B2 (en) 2019-01-22 2021-11-09 Asm Ip Holding B.V. Substrate processing device
US11127589B2 (en) 2019-02-01 2021-09-21 Asm Ip Holding B.V. Method of topology-selective film formation of silicon oxide
US11227789B2 (en) 2019-02-20 2022-01-18 Asm Ip Holding B.V. Method and apparatus for filling a recess formed within a substrate surface
US11798834B2 (en) 2019-02-20 2023-10-24 Asm Ip Holding B.V. Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
US11342216B2 (en) 2019-02-20 2022-05-24 Asm Ip Holding B.V. Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
US11482533B2 (en) 2019-02-20 2022-10-25 Asm Ip Holding B.V. Apparatus and methods for plug fill deposition in 3-D NAND applications
US11251040B2 (en) 2019-02-20 2022-02-15 Asm Ip Holding B.V. Cyclical deposition method including treatment step and apparatus for same
US11615980B2 (en) 2019-02-20 2023-03-28 Asm Ip Holding B.V. Method and apparatus for filling a recess formed within a substrate surface
US11629407B2 (en) 2019-02-22 2023-04-18 Asm Ip Holding B.V. Substrate processing apparatus and method for processing substrates
US11901175B2 (en) 2019-03-08 2024-02-13 Asm Ip Holding B.V. Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer
US11424119B2 (en) 2019-03-08 2022-08-23 Asm Ip Holding B.V. Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer
US11742198B2 (en) 2019-03-08 2023-08-29 Asm Ip Holding B.V. Structure including SiOCN layer and method of forming same
US11114294B2 (en) 2019-03-08 2021-09-07 Asm Ip Holding B.V. Structure including SiOC layer and method of forming same
US11378337B2 (en) 2019-03-28 2022-07-05 Asm Ip Holding B.V. Door opener and substrate processing apparatus provided therewith
US11551925B2 (en) 2019-04-01 2023-01-10 Asm Ip Holding B.V. Method for manufacturing a semiconductor device
US11447864B2 (en) 2019-04-19 2022-09-20 Asm Ip Holding B.V. Layer forming method and apparatus
US11814747B2 (en) 2019-04-24 2023-11-14 Asm Ip Holding B.V. Gas-phase reactor system-with a reaction chamber, a solid precursor source vessel, a gas distribution system, and a flange assembly
US11781221B2 (en) 2019-05-07 2023-10-10 Asm Ip Holding B.V. Chemical source vessel with dip tube
US11289326B2 (en) 2019-05-07 2022-03-29 Asm Ip Holding B.V. Method for reforming amorphous carbon polymer film
US11355338B2 (en) 2019-05-10 2022-06-07 Asm Ip Holding B.V. Method of depositing material onto a surface and structure formed according to the method
US11996309B2 (en) 2019-05-16 2024-05-28 Asm Ip Holding B.V. Wafer boat handling device, vertical batch furnace and method
US11515188B2 (en) 2019-05-16 2022-11-29 Asm Ip Holding B.V. Wafer boat handling device, vertical batch furnace and method
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
US11345999B2 (en) 2019-06-06 2022-05-31 Asm Ip Holding B.V. Method of using a gas-phase reactor system including analyzing exhausted gas
US11908684B2 (en) 2019-06-11 2024-02-20 Asm Ip Holding B.V. Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method
US11476109B2 (en) 2019-06-11 2022-10-18 Asm Ip Holding B.V. Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
US11746414B2 (en) 2019-07-03 2023-09-05 Asm Ip Holding B.V. Temperature control assembly for substrate processing apparatus and method of using same
US11390945B2 (en) 2019-07-03 2022-07-19 Asm Ip Holding B.V. Temperature control assembly for substrate processing apparatus and method of using same
US11605528B2 (en) 2019-07-09 2023-03-14 Asm Ip Holding B.V. Plasma device using coaxial waveguide, and substrate treatment method
US12107000B2 (en) 2019-07-10 2024-10-01 Asm Ip Holding B.V. Substrate support assembly and substrate processing device including the same
US11664267B2 (en) 2019-07-10 2023-05-30 Asm Ip Holding B.V. Substrate support assembly and substrate processing device including the same
US11996304B2 (en) 2019-07-16 2024-05-28 Asm Ip Holding B.V. Substrate processing device
US11664245B2 (en) 2019-07-16 2023-05-30 Asm Ip Holding B.V. Substrate processing device
US11615970B2 (en) 2019-07-17 2023-03-28 Asm Ip Holding B.V. Radical assist ignition plasma system and method
US11688603B2 (en) 2019-07-17 2023-06-27 Asm Ip Holding B.V. Methods of forming silicon germanium structures
US12129548B2 (en) 2019-07-18 2024-10-29 Asm Ip Holding B.V. Method of forming structures using a neutral beam
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
US11282698B2 (en) 2019-07-19 2022-03-22 Asm Ip Holding B.V. Method of forming topology-controlled amorphous carbon polymer film
US12112940B2 (en) 2019-07-19 2024-10-08 Asm Ip Holding B.V. Method of forming topology-controlled amorphous carbon polymer film
US11557474B2 (en) 2019-07-29 2023-01-17 Asm Ip Holding B.V. Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation
US11443926B2 (en) 2019-07-30 2022-09-13 Asm Ip Holding B.V. Substrate processing apparatus
US11430640B2 (en) 2019-07-30 2022-08-30 Asm Ip Holding B.V. Substrate processing apparatus
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11876008B2 (en) 2019-07-31 2024-01-16 Asm Ip Holding B.V. Vertical batch furnace assembly
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11680839B2 (en) 2019-08-05 2023-06-20 Asm Ip Holding B.V. Liquid level sensor for a chemical source vessel
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
US11639548B2 (en) 2019-08-21 2023-05-02 Asm Ip Holding B.V. Film-forming material mixed-gas forming device and film forming device
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
US12040229B2 (en) 2019-08-22 2024-07-16 Asm Ip Holding B.V. Method for forming a structure with a hole
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
US11594450B2 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Method for forming a structure with a hole
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
US11898242B2 (en) 2019-08-23 2024-02-13 Asm Ip Holding B.V. Methods for forming a polycrystalline molybdenum film over a surface of a substrate and related structures including a polycrystalline molybdenum film
US11527400B2 (en) 2019-08-23 2022-12-13 Asm Ip Holding B.V. Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane
US12033849B2 (en) 2019-08-23 2024-07-09 Asm Ip Holding B.V. Method for depositing silicon oxide film having improved quality by PEALD using bis(diethylamino)silane
US11827978B2 (en) 2019-08-23 2023-11-28 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
US11495459B2 (en) 2019-09-04 2022-11-08 Asm Ip Holding B.V. Methods for selective deposition using a sacrificial capping layer
US11823876B2 (en) 2019-09-05 2023-11-21 Asm Ip Holding B.V. Substrate processing apparatus
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
US11610774B2 (en) 2019-10-02 2023-03-21 Asm Ip Holding B.V. Methods for forming a topographically selective silicon oxide film by a cyclical plasma-enhanced deposition process
US12006572B2 (en) 2019-10-08 2024-06-11 Asm Ip Holding B.V. Reactor system including a gas distribution assembly for use with activated species and method of using same
US11339476B2 (en) 2019-10-08 2022-05-24 Asm Ip Holding B.V. Substrate processing device having connection plates, substrate processing method
US11735422B2 (en) 2019-10-10 2023-08-22 Asm Ip Holding B.V. Method of forming a photoresist underlayer and structure including same
US12009241B2 (en) 2019-10-14 2024-06-11 Asm Ip Holding B.V. Vertical batch furnace assembly with detector to detect cassette
US11637011B2 (en) 2019-10-16 2023-04-25 Asm Ip Holding B.V. Method of topology-selective film formation of silicon oxide
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
US11315794B2 (en) 2019-10-21 2022-04-26 Asm Ip Holding B.V. Apparatus and methods for selectively etching films
US11996292B2 (en) 2019-10-25 2024-05-28 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
US11594600B2 (en) 2019-11-05 2023-02-28 Asm Ip Holding B.V. Structures with doped semiconductor layers and methods and systems for forming same
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
US11626316B2 (en) 2019-11-20 2023-04-11 Asm Ip Holding B.V. Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
US11401605B2 (en) 2019-11-26 2022-08-02 Asm Ip Holding B.V. Substrate processing apparatus
US11915929B2 (en) 2019-11-26 2024-02-27 Asm Ip Holding B.V. Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
US11923181B2 (en) 2019-11-29 2024-03-05 Asm Ip Holding B.V. Substrate processing apparatus for minimizing the effect of a filling gas during substrate processing
US11646184B2 (en) 2019-11-29 2023-05-09 Asm Ip Holding B.V. Substrate processing apparatus
US11929251B2 (en) 2019-12-02 2024-03-12 Asm Ip Holding B.V. Substrate processing apparatus having electrostatic chuck and substrate processing method
US11840761B2 (en) 2019-12-04 2023-12-12 Asm Ip Holding B.V. Substrate processing apparatus
US11885013B2 (en) 2019-12-17 2024-01-30 Asm Ip Holding B.V. Method of forming vanadium nitride layer and structure including the vanadium nitride layer
US11527403B2 (en) 2019-12-19 2022-12-13 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
US12119220B2 (en) 2019-12-19 2024-10-15 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
US12033885B2 (en) 2020-01-06 2024-07-09 Asm Ip Holding B.V. Channeled lift pin
US11976359B2 (en) 2020-01-06 2024-05-07 Asm Ip Holding B.V. Gas supply assembly, components thereof, and reactor system including same
US11993847B2 (en) 2020-01-08 2024-05-28 Asm Ip Holding B.V. Injector
TWI763012B (en) * 2020-01-10 2022-05-01 日商中外爐工業股份有限公司 Clean heat treatment apparatus
US12125700B2 (en) 2020-01-16 2024-10-22 Asm Ip Holding B.V. Method of forming high aspect ratio features
US11551912B2 (en) 2020-01-20 2023-01-10 Asm Ip Holding B.V. Method of forming thin film and method of modifying surface of thin film
US11521851B2 (en) 2020-02-03 2022-12-06 Asm Ip Holding B.V. Method of forming structures including a vanadium or indium layer
US11828707B2 (en) 2020-02-04 2023-11-28 Asm Ip Holding B.V. Method and apparatus for transmittance measurements of large articles
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
US11986868B2 (en) 2020-02-28 2024-05-21 Asm Ip Holding B.V. System dedicated for parts cleaning
US11837494B2 (en) 2020-03-11 2023-12-05 Asm Ip Holding B.V. Substrate handling device with adjustable joints
US11876356B2 (en) 2020-03-11 2024-01-16 Asm Ip Holding B.V. Lockout tagout assembly and system and method of using same
US11488854B2 (en) 2020-03-11 2022-11-01 Asm Ip Holding B.V. Substrate handling device with adjustable joints
US11961741B2 (en) 2020-03-12 2024-04-16 Asm Ip Holding B.V. Method for fabricating layer structure having target topological profile
US11823866B2 (en) 2020-04-02 2023-11-21 Asm Ip Holding B.V. Thin film forming method
US11830738B2 (en) 2020-04-03 2023-11-28 Asm Ip Holding B.V. Method for forming barrier layer and method for manufacturing semiconductor device
US11437241B2 (en) 2020-04-08 2022-09-06 Asm Ip Holding B.V. Apparatus and methods for selectively etching silicon oxide films
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
US12087586B2 (en) 2020-04-15 2024-09-10 Asm Ip Holding B.V. Method of forming chromium nitride layer and structure including the chromium nitride layer
US11996289B2 (en) 2020-04-16 2024-05-28 Asm Ip Holding B.V. Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
US11898243B2 (en) 2020-04-24 2024-02-13 Asm Ip Holding B.V. Method of forming vanadium nitride-containing layer
US11887857B2 (en) 2020-04-24 2024-01-30 Asm Ip Holding B.V. Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
US12130084B2 (en) 2020-04-24 2024-10-29 Asm Ip Holding B.V. Vertical batch furnace assembly comprising a cooling gas supply
US11530876B2 (en) 2020-04-24 2022-12-20 Asm Ip Holding B.V. Vertical batch furnace assembly comprising a cooling gas supply
US11959168B2 (en) 2020-04-29 2024-04-16 Asm Ip Holding B.V. Solid source precursor vessel
US11798830B2 (en) 2020-05-01 2023-10-24 Asm Ip Holding B.V. Fast FOUP swapping with a FOUP handler
US11515187B2 (en) 2020-05-01 2022-11-29 Asm Ip Holding B.V. Fast FOUP swapping with a FOUP handler
US11626308B2 (en) 2020-05-13 2023-04-11 Asm Ip Holding B.V. Laser alignment fixture for a reactor system
US12057314B2 (en) 2020-05-15 2024-08-06 Asm Ip Holding B.V. Methods for silicon germanium uniformity control using multiple precursors
US11804364B2 (en) 2020-05-19 2023-10-31 Asm Ip Holding B.V. Substrate processing apparatus
US11705333B2 (en) 2020-05-21 2023-07-18 Asm Ip Holding B.V. Structures including multiple carbon layers and methods of forming and using same
US11987881B2 (en) 2020-05-22 2024-05-21 Asm Ip Holding B.V. Apparatus for depositing thin films using hydrogen peroxide
US11767589B2 (en) 2020-05-29 2023-09-26 Asm Ip Holding B.V. Substrate processing device
US12106944B2 (en) 2020-06-02 2024-10-01 Asm Ip Holding B.V. Rotating substrate support
US11646204B2 (en) 2020-06-24 2023-05-09 Asm Ip Holding B.V. Method for forming a layer provided with silicon
US11658035B2 (en) 2020-06-30 2023-05-23 Asm Ip Holding B.V. Substrate processing method
US12020934B2 (en) 2020-07-08 2024-06-25 Asm Ip Holding B.V. Substrate processing method
US12055863B2 (en) 2020-07-17 2024-08-06 Asm Ip Holding B.V. Structures and methods for use in photolithography
US11644758B2 (en) 2020-07-17 2023-05-09 Asm Ip Holding B.V. Structures and methods for use in photolithography
US11674220B2 (en) 2020-07-20 2023-06-13 Asm Ip Holding B.V. Method for depositing molybdenum layers using an underlayer
US12040177B2 (en) 2020-08-18 2024-07-16 Asm Ip Holding B.V. Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
US11725280B2 (en) 2020-08-26 2023-08-15 Asm Ip Holding B.V. Method for forming metal silicon oxide and metal silicon oxynitride layers
US12074022B2 (en) 2020-08-27 2024-08-27 Asm Ip Holding B.V. Method and system for forming patterned structures using multiple patterning process
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
US12009224B2 (en) 2020-09-29 2024-06-11 Asm Ip Holding B.V. Apparatus and method for etching metal nitrides
US12107005B2 (en) 2020-10-06 2024-10-01 Asm Ip Holding B.V. Deposition method and an apparatus for depositing a silicon-containing material
US12051567B2 (en) 2020-10-07 2024-07-30 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including gas supply unit
US11827981B2 (en) 2020-10-14 2023-11-28 Asm Ip Holding B.V. Method of depositing material on stepped structure
US11873557B2 (en) 2020-10-22 2024-01-16 Asm Ip Holding B.V. Method of depositing vanadium metal
US11901179B2 (en) 2020-10-28 2024-02-13 Asm Ip Holding B.V. Method and device for depositing silicon onto substrates
US12027365B2 (en) 2020-11-24 2024-07-02 Asm Ip Holding B.V. Methods for filling a gap and related systems and devices
US11891696B2 (en) 2020-11-30 2024-02-06 Asm Ip Holding B.V. Injector configured for arrangement within a reaction chamber of a substrate processing apparatus
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
US11885020B2 (en) 2020-12-22 2024-01-30 Asm Ip Holding B.V. Transition metal deposition method
US12129545B2 (en) 2020-12-22 2024-10-29 Asm Ip Holding B.V. Precursor capsule, a vessel and a method
US12131885B2 (en) 2020-12-22 2024-10-29 Asm Ip Holding B.V. Plasma treatment device having matching box
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
US12148609B2 (en) 2021-09-13 2024-11-19 Asm Ip Holding B.V. Silicon oxide deposition method

Also Published As

Publication number Publication date
JP3375294B2 (en) 2003-02-10

Similar Documents

Publication Publication Date Title
JP3375294B2 (en) Processing apparatus, processing system, and method for supplying clean air in the apparatus
JP3110218B2 (en) Semiconductor cleaning apparatus and method, wafer cassette, dedicated glove, and wafer receiving jig
JP4056858B2 (en) Substrate processing equipment
JP3218425B2 (en) Processing method and processing apparatus
JP4354675B2 (en) Thin plate electronic component clean transfer device and thin plate electronic product manufacturing system
EP0841688B1 (en) Processing apparatus
WO1998000676A1 (en) Environmentally enhanced enclosure for managing cmp contamination
KR19980019186A (en) Substrate Treatment System
WO1998000676A9 (en) Environmentally enhanced enclosure for managing cmp contamination
JP2013045877A (en) Substrate processing apparatus
JP4579268B2 (en) Substrate processing equipment
JP2008075945A (en) Local cleaning device
US6347990B1 (en) Microelectronic fabrication system cleaning methods and systems that maintain higher air pressure in a process area than in a transfer area
JP3483376B2 (en) Substrate processing equipment
JP3754905B2 (en) Substrate dryer
JP3415404B2 (en) Processing system
JP3352865B2 (en) Substrate processing equipment
JP3774277B2 (en) Substrate transport method and processing system
JPH0811224B2 (en) Article cleaning equipment
JP3790691B2 (en) Substrate drying method and substrate drying apparatus
JPH09264575A (en) Manufacturing device and cleaning method
KR100650807B1 (en) Substrate transporting apparatus, processing apparatus, processing system for substrate, transporting method, receiving apparatus and accommodating box
JP2002110619A (en) Substrate-treating apparatus
KR100741153B1 (en) Substrate conveying device
JP2971771B2 (en) Heat treatment equipment with sublimate removal function

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081129

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111129

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees