JP2000174163A - Mounting substrate and manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable mounting substrate on which a semiconductor chip can be mounted surely and a semiconductor device manufacturing method. SOLUTION: Patterns 1 formed on a circuit board are formed in such a way that the front ends of the patterns 1 are extended into a chip mounting section 2 for mounting a semiconductor chip. The patterns 1 have extended patterns 4 the front ends of which are extended into the chip mounting section 2 and expanded patterns 5 having broad sections (protruded in the widthwise direction) at the front ends. The patterns 1 are formed in such a way that the patterns 4 and 5 are alternately arranged. In addition, the front ends of the patterns 4 are extended toward the center of the chip mounting section 2 in such a way that the patterns 4 are extended longer as going to the centers of the side sections of the section 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board for mounting a semiconductor chip and a method for manufacturing a semiconductor device formed by mounting a semiconductor chip on the mounting board.

[0002]

2. Description of the Related Art Conventionally, a bare chip as a semiconductor element is mounted as shown in FIG. That is, the bonding resin 14 is supplied to the chip mounting portion surrounded by the pattern 13 formed on the circuit board 12, and the chip 11 is mounted while being aligned with the pattern 13.

In this case, as shown in FIG. 4, the pattern 13 has a shape in which the bump forming portion 16 slightly extends in the chip mounting portion 15 of the circuit board 12. The tips of these patterns 13 are formed so as to be aligned at the chip mounting portion 15.

[0004]

When a chip is mounted on the circuit board 12 having the pattern 13 as described above,
Adhesive resin for adhering the chip is applied to the chip mounting portion 15.
Supply to the center of When the chip is mounted on the bonding resin, the resin spreads radially and uniformly from the center of the chip.

In this case, since the bonding resin 14 spreads in a circular shape as shown in FIG. 5, the bonding resin 14 does not spread to the four corners of the rectangular chip 11, and the resin filling becomes insufficient. For this reason, there is a problem in that the adhesive strength between the corner portion of the chip 11 and the circuit board is reduced, thereby lowering the reliability of chip mounting.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a highly reliable mounting board and a method of manufacturing a semiconductor device which can reliably mount a semiconductor chip on a board.

[0007]

In order to solve the above-mentioned problems, a mounting substrate according to the present invention is provided with a substrate for mounting a semiconductor chip, and formed on the substrate and electrically connected to the semiconductor chip. The wiring pattern has an extension portion extending toward the inside of the mounting area of the semiconductor chip.

In the above mounting board, since the wiring pattern has an extended portion, the adhesive resin supplied to the mounting area of the semiconductor chip is allowed to flow to the corner of the mounting area of the rectangular semiconductor chip. it can. Thereby, the adhesive resin can sufficiently spread to the corners of the mounting region of the semiconductor chip, and the adhesive strength of the semiconductor chip to the mounting substrate can be sufficiently maintained. As a result, the reliability of mounting the semiconductor chip can be improved.

In the mounting board according to the present invention, it is preferable that the wiring pattern has the extending portion in a region other than a corner in a mounting region of the semiconductor chip. Further, in the mounting board of the present invention, it is preferable that the extending portion has a shape in which a tip becomes narrower toward an inside of a mounting region of the semiconductor chip. Thus, the adhesive resin supplied to the mounting region of the semiconductor chip can be made to flow more efficiently to the corners of the mounting region of the rectangular semiconductor chip.

In the mounting board of the present invention, it is preferable that the wiring pattern other than the extending portion has a wide portion at the tip. This makes it possible to suppress the flowability of the adhesive resin to regions other than the corners of the mounting region of the semiconductor chip, that is, to the sides.

Thus, the adhesive resin can be uniformly supplied to the mounting area of the semiconductor chip. as a result,
The problem of a decrease in the fluidity of the adhesive resin that occurs when the pitch of the conductive members on the wiring pattern is reduced can be solved, and the reliability of mounting the semiconductor chip can be improved.

A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device formed by mounting a semiconductor chip on a circuit board having a wiring pattern, wherein the method is directed toward an inside of a mounting area of the semiconductor chip. Forming a wiring pattern having an extended portion on the circuit board, supplying an adhesive resin onto the mounting area, and mounting the semiconductor chip on the wiring pattern by the adhesive resin. And a step of performing

According to the above-described method of manufacturing a semiconductor device, it is possible to efficiently obtain a semiconductor device capable of sufficiently maintaining the bonding strength of the semiconductor chip to the circuit board and improving the reliability of mounting the semiconductor chip.

[0014]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a structure of a semiconductor device according to one embodiment of the present invention. This figure shows a pattern 1 formed on a circuit board (mounting board). The pattern 1 is formed inside the mounting portion 2 of the semiconductor chip so that its tip extends.

The pattern 1 has a tip mounted on the chip mounting portion 2.
And an extended pattern 4 having a wide portion (a portion projecting in the width direction) at the tip. On these patterns 1, 4 and 5 and inside the chip mounting section 2, there is a bump forming section 3. Also,
These extension patterns 4 and huge patterns 5 are formed so as to be alternately arranged. Further, the tip of the extension pattern 4 is narrowly extended toward the center of the chip mounting portion 2, and extends longer toward the center of the side portion of the chip mounting portion 2.

By forming the pattern 1 as described above, the pattern is densely formed on the side portion 6 of the chip mounting portion 2 and the pattern is sparsely formed on the corner portion 7 of the chip mounting portion 2. . In such a pattern configuration, the arrangement of the extension patterns 4 improves the flowability of the adhesive resin in the direction of the corners 7, and the arrangement of the enormous patterns 5 allows the flow of the adhesive resin in the direction of the sides 6. Suppress.

Thus, the adhesive resin can be uniformly supplied to the chip mounting section 2. As a result, it is possible to solve the problem of a decrease in the fluidity of the adhesive resin, which occurs when the pitch of the bumps on the pattern is reduced, and to improve the reliability of chip mounting.

Next, a method of manufacturing a semiconductor device according to the present invention will be described. First, a metal layer is formed by plating Cu or the like on a circuit board by plating, and patterns 1, 4, and 5 are formed by photolithography and etching. A bump forming section 3 is provided at a position corresponding to the chip electrode in the chip mounting section 2 of these patterns 1, 4, and 5.

Next, as shown in FIG. 2, an adhesive resin 10 is supplied to the chip mounting portion 2 of the circuit board 9. Then
The positions of the patterns 1, 4, 5 on the circuit board 9 and the bumps of the chip 8 are aligned, and the chip 8 is mounted on the circuit board 9 using a bonding tool.

At this time, the bonding resin 10 is as shown in FIG.
~ Spread as shown in FIG. In this case, the flow of the adhesive resin in the direction of the corners 7 is improved by the arrangement of the extension patterns 4, and the flow of the adhesive resin in the direction of the sides 6 is suppressed by the arrangement of the enormous patterns 5. Adhesive resin 1
0 is uniformly supplied to the entire surface of the chip mounting section 2. afterwards,
The bonding resin is cured, and the mounting of the chip 8 is completed.
Thus, the semiconductor device according to the present embodiment can be obtained.

The present invention is not limited to the above embodiment, but can be implemented with various modifications.

[0022]

As described above, according to the present invention, there are provided a substrate for mounting a semiconductor chip, and a wiring pattern formed on the substrate and electrically connected to the semiconductor chip. The wiring pattern has an extended portion extending toward the inside of the mounting area of the semiconductor chip. Therefore, it is possible to provide a highly reliable mounting board and a method for manufacturing a semiconductor device, which can reliably mount the semiconductor chip on the board.

[Brief description of the drawings]

FIG. 1 is a plan view showing a structure of a semiconductor device according to one embodiment of the present invention.

FIGS. 2A to 2C are diagrams for explaining the spread of an adhesive resin when mounting a semiconductor chip.

FIG. 3 is a perspective view showing a state in which a conventional semiconductor device is manufactured.

FIG. 4 is a plan view showing the structure of a conventional semiconductor device.

FIG. 5 is a diagram for explaining the spread of an adhesive resin when mounting a semiconductor chip in a conventional method.

[Explanation of symbols]

1 ... pattern, 2 ... chip mounting part, 3 ... bump formation part,
4 ... extension pattern, 5 ... huge pattern, 6 ... side, 7 ...
Corners, 8: Chip, 9: Circuit board, 10: Adhesive resin.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Dai Sasaki, Inventor 1300 Tsukakoshi, Sakado-shi, Saitama Sony Bonson Co., Ltd.

Claims (5)

[Claims] 1. A substrate for mounting a semiconductor chip, and a wiring pattern formed on the substrate and electrically connected to the semiconductor chip, wherein the wiring pattern is formed on the semiconductor chip. A mounting board having an extending portion extending toward the inside of a mounting area. 2. The mounting board according to claim 1, wherein the wiring pattern has the extension portion in a region other than a corner in a mounting region of the semiconductor chip. 3. The mounting substrate according to claim 1, wherein the extending portion has a shape whose tip becomes narrower toward the inside of the mounting region of the semiconductor chip. 4. The mounting board according to claim 1, wherein the wiring pattern other than the extending portion has a wide end. 5. A method of manufacturing a semiconductor device formed by mounting a semiconductor chip on a circuit board having a wiring pattern, the method comprising a step of extending toward an inside of a mounting area of the semiconductor chip. Forming a wiring pattern on a circuit board, supplying an adhesive resin onto the mounting area, and mounting the semiconductor chip on the wiring pattern using the adhesive resin. A method for manufacturing a semiconductor device.