JP2000173902A - Substrate treatment system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the state of discharge of sufficient quantity of stabilized treatment liquid even in the case wherein the difference between altitude of a treatment liquid storing part and a treatment part in large or when a piping length is long. SOLUTION: The treatment liquid 60 fed to the first buffer tank 121 and the second buffer tank 122 is pressurized by pressurized gas 61, and the treatment liquid 60 is fed to an on/off valve 152. By the opening and closing of the valve 152, a necessary amount of the treatment liquid for one substrate treatment is fed into the trap tank 151 provided in the vicinity of a treatment part 10. The pressurized gas 61, which is adjusted by a pressure adjusting device 161, is introduced into the trap tank 151, and the treatment liquid is fed to a treatment liquid discharge nozzle 13 by opening the on/off valve 154.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for performing a predetermined processing on a substrate using a processing liquid.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a glass substrate for an optical disk. Among these substrate processing apparatuses, in a developing apparatus, a rotary coating apparatus, and the like, a substrate is processed using a processing liquid such as a developing liquid or a resist liquid.

FIG. 3 is a schematic view showing an example of a conventional substrate processing apparatus. As shown in FIG. 3, the substrate processing apparatus 100
Includes a processing unit 10, a processing liquid storage unit 20, and a supply amount adjusting unit 50.

In the processing section 10, a substrate W is held in a horizontal posture on a substrate holding section 11 which is driven to rotate about a vertical axis. The periphery of the substrate W held by the substrate holding unit 11 is surrounded by a cup 12 for preventing the processing liquid from scattering.

[0005] Above the substrate W, a processing liquid discharge nozzle 13 for discharging a processing liquid onto the substrate W is provided. A processing liquid 60 supplied from a processing liquid supply system (not shown) such as a factory line or a canister is supplied to the processing liquid discharge nozzle 13.
Is supplied through the processing liquid storage unit 20 and the supply amount adjusting unit 50.

The processing liquid storage section 20 includes a first buffer tank 21, a second buffer tank 22, three-way valves 25, 26, 3
1 and 32 and a pressure adjusting device 33. The first buffer tank 21 and the second buffer tank 22 are pressure vessels capable of storing an amount of processing liquid necessary for a plurality of times of substrate processing.

The processing liquid 60 from the processing liquid supply system is supplied to the pipe 4
4 to the first fluid port 25a of the three-way valve 25, and further from the second fluid port 25b of the three-way valve 25 to the first buffer tank 21 via the pipe 27, or to the first fluid port 25a of the three-way valve 25. The fluid is supplied into the second buffer tank 22 through the pipe 28 from the third fluid port 25c. By switching the three-way valve 25, the processing liquid 60 is selectively supplied to one of the buffer tanks 21 and 22.

The first buffer tank 21 and the second buffer tank 22 have a liquid level sensor 2 for detecting the liquid level.
3 and 24 are provided respectively. Thereby, the first
When the liquid level sensor 23 detects that the liquid level of the processing liquid in the buffer tank 21 has dropped to a predetermined position, the three-way valve 25 is connected to the first buffer tank 21 so as to supply the processing liquid to the first buffer tank 21. Switch to When the liquid level sensor 23 detects that the liquid level of the processing liquid in the first buffer tank 21 has risen to a predetermined position, the three-way valve 25 stops supplying the processing liquid to the first buffer tank 21. Switches. Thus, the amount of the processing liquid in the first buffer tank 21 is kept within a predetermined range. Similarly, the level of the processing liquid in the second buffer tank 22 is detected by the liquid level sensor 24, and the amount of the processing liquid in the second buffer tank 22 is kept within a predetermined range.

The processing liquid stored in the first buffer tank 21 is supplied through a pipe 29 to a first fluid port 26a of a three-way valve 26. Also, the second buffer tank 22
The processing liquid stored in the three-way valve 26 passes through a pipe 30.
Is supplied to the second fluid port 26b. The processing liquid derived from the third fluid port 26 c of the three-way valve 26 is supplied to the pipe 42, the flow detection device 51, the flow control valve 52 and the pipe 4.
The liquid is supplied to the processing liquid discharge nozzle 13 through the nozzle 3. By switching the three-way valve 26, the first buffer tank 21
Alternatively, the processing liquid is selectively supplied to the processing liquid discharge nozzle 13 from one of the second buffer tanks 22.

The flow rate detecting device 51 measures the flow rate of the processing liquid in the pipe 42. The flow control valve 52 is provided with a flow detection device 51.
The flow rate of the processing solution is adjusted based on the measured value of the above.

A pressurized gas 61 such as nitrogen gas from a gas supply system (not shown) is supplied through a pipe 34 to a pressure adjusting device 33.
To the piping 35 from the pressure adjusting device 33, the three-way valve 3
The first fluid port 31a, the second fluid port 31b of the three-way valve 31 and the pipe 36 are supplied into the first buffer tank 21 via the pipe 36, and the pipe 38 and the first port of the three-way valve 32
Fluid inlet / outlet 32a of the three-way valve 32
The gas is supplied into the second buffer tank 22 via 2b and the pipe 39. In the first buffer tank 21, the three-way valve 3
It can be opened to the atmosphere via the first third fluid port 31c and the pipe 37. Inside the second buffer tank 22, the third fluid port 32c of the three-way valve 32 and the pipe 4
0 can be opened to the atmosphere.

The pressure in the first buffer tank 21 and the second buffer tank 22 is precisely adjusted by the pressure adjusting device 33 to a pressure required for the processing liquid to be discharged from the processing liquid discharge nozzle 13. The pressure in the first buffer tank 21 is
By switching the three-way valve 31, the pressure becomes the atmospheric pressure or the adjustment pressure. When the pressure in the first buffer tank 21 is atmospheric pressure, the first
The processing liquid is supplied into the buffer tank 21, and the first buffer tank 21
The processing liquid is discharged from the inside. Similarly, the processing liquid is supplied into the second buffer tank 22 when the inside of the second buffer tank 22 is at atmospheric pressure, and the processing liquid is supplied from the inside of the second buffer tank 22 when the inside of the second buffer tank 22 is at the regulated pressure. Is discharged.

At the end of a pipe 41 branched from a pipe 42 connecting the processing liquid storage section 20 and the supply amount adjustment section 50, a supply amount adjustment section (not shown) similar to the supply amount adjustment section 50 and the processing section 10 is provided. And a processing unit (not shown). As a result, a single processing liquid storage unit 20 transfers a plurality of processing units 1
Thus, it is possible to supply the processing liquid to the processing liquid discharge nozzle 13 of 0.

Next, the operation of the substrate processing apparatus of FIG. 3 will be described. Here, it is assumed that the processing liquid is supplied from the first buffer tank 21 to the processing liquid discharge nozzle 13 and the processing liquid in the first buffer tank 21 is lowered to the lower limit position.

The processing liquid is stored in advance in the second buffer tank 22 up to the upper limit position, and the pressure in the second buffer tank 22 is controlled by the pressure adjusting device 33 to supply the processing liquid to the processing liquid discharge nozzle 13. Adjusted to the required pressure.

The three-way valve 26 switches to the second buffer tank 22 side. The flow control valve 52 is opened, and the processing liquid in the second buffer tank 22 is supplied to the flow control valve 52 through the pipe 30, the three-way valve 26, the pipe 42, and the flow detection device 51. In the flow rate detection device 51, the flow rate of the processing liquid in the pipe 42 is measured, and based on the measurement result, a flow control valve 52 is provided so that an appropriate flow rate is supplied to the processing liquid discharge nozzle 13.
Is adjusted. The processing liquid supplied from the flow control valve 52 to the processing liquid discharge nozzle 13 via the pipe 43 is discharged from the processing liquid discharge nozzle 13 onto the substrate W, and a predetermined process is performed on the substrate W. The above operation is sequentially repeated for a plurality of substrates.

While the supply of the processing liquid from the second buffer tank 22 to the processing liquid discharge nozzle 13 is continued, the processing liquid is supplied into the first buffer tank 21. First, the three-way valve 31 is switched so that the inside of the first buffer tank 21 communicates with the pipe 37, and the first buffer tank 21
Inside becomes atmospheric pressure. In this state, the three-way valve 25 switches to the first buffer tank 21 side, and the first buffer tank 2
The processing liquid 60 is supplied into the inside 1. First buffer tank 2
The liquid level sensor 2 indicates that the processing liquid in
When 3 is detected, the three-way valve 25 is switched so as to stop the supply of the processing liquid. Next, the three-way valve 31 is switched so that the inside of the first buffer tank 21 communicates with the pressure adjusting device 33, and the inside of the first buffer tank 21 becomes a pressure at which the processing liquid can be supplied.

When the liquid level sensor 24 detects that the processing liquid in the second buffer tank 22 has dropped to the lower limit position,
The three-way valve 26 switches to the first buffer tank 21 side,
From the next processing of the substrate W, the processing liquid in the first buffer tank 21 is used. The supply of the processing liquid into the second buffer tank 22 is performed in the same manner as in the case of the first buffer tank 21.

As described above, the two buffer tanks 2
The supply of the processing liquid to the processing liquid discharge nozzle 13 and the replenishment of the processing liquid are alternately performed using the processing liquids 1 and 22, thereby stabilizing the processing liquid precisely regulated without stopping the substrate processing apparatus 100. To the processing unit 10.

[0020]

However, in the above-described substrate processing apparatus, since the processing liquid is pressurized by the pressurized gas 61 such as nitrogen gas, the gas is dissolved in the processing liquid. Therefore, when the pressure is rapidly reduced at the time of ejection in the processing unit 10, bubbling accompanied by microbubbles or the like occurs, which may adversely affect the substrate W.

Further, in recent substrate processing apparatuses, in order to reduce the cost of a clean room, ancillary facilities are being installed in places where the degree of cleanliness control is relatively low, such as under the floor. Therefore, the processing liquid storage unit 20 and the processing unit 1
There is a tendency that the height difference from 0 increases and the piping lengthens. Therefore, in order to supply the processing liquid to the processing unit 10, the processing liquid must be pressurized at a pressure higher than the conventional pressure, and the possibility of foaming is further increased by increasing the dissolved amount of the gas in the processing liquid. .

Further, since the first buffer tank 21 and the second buffer tank 22 are pressure vessels, it is desirable that the pressurized value is low from the viewpoint of safety. If the pressure is lower than the pressure defined in the pressure standard of the pressure vessel, a desired discharge amount may not be obtained.

As described above, the processing liquid storage section 20 and the processing section 1
While there is a demand for increasing the pressure from the viewpoint of increasing the height difference from zero and increasing the length of the pipe between the processing liquid storage unit 20 and the processing liquid discharge nozzle 13, from the viewpoint of reducing the amount of foaming and ensuring safety. Pressure drop is required.

As a method for solving the above problem, the pipe 4
There is a method in which a degassing device using a hollow fiber membrane element is provided in the middle of Step 2 to degas dissolved gases in the treatment liquid. However, the equipment is expensive and the hollow fiber membrane element needs to be periodically replaced. Furthermore, since the pressure loss of the deaerator itself is relatively large, it is necessary to apply a higher pressure to the first buffer tank 21 and the second buffer tank 22, but a pressure exceeding the pressure standard of the pressure vessel cannot be applied. . Therefore, the original effect of the deaerator cannot be sufficiently exhibited.

Further, since the pipe between the processing liquid storage section 20 and the processing section 10 becomes long, pressure pulsation generated when the processing liquid flows in the pipe is easily generated. As a result, even if the pressures in the first buffer tank 21 and the second buffer tank 22 are precisely adjusted, a stable processing liquid discharge state may not be obtained.

Further, since it is necessary to precisely adjust the pressure in the first buffer tank 21 and the second buffer tank 22, it takes time for the pressure adjusting unit.

An object of the present invention is to provide a substrate processing apparatus capable of obtaining a sufficient amount of a processing liquid and a stable discharge state of the processing liquid even when the height difference between the processing liquid storage section and the processing section is large or the pipe length is long. It is to provide.

[0028]

Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus for performing a predetermined process on a substrate, and a processing unit for performing a process on the substrate using a processing liquid. A first storage unit that stores the processing liquid, a second storage unit that has a smaller capacity than the first storage unit and stores the processing liquid, and a first storage unit that pressurizes the inside of the first storage unit. A first pressurizing unit that supplies the processing liquid in the first storage unit to the second storage unit, and a first pressure unit that supplies the processing liquid in the second storage unit to the processing unit by pressurizing the second storage unit. Pressure means.

In the substrate processing apparatus according to the first invention, the processing liquid stored in the first storage unit is supplied to the second storage unit by the first pressurizing means, and is temporarily stored.
The processing liquid stored in the second storage unit is supplied to the processing unit by the second pressurizing unit.

In this case, when the processing liquid is supplied from the first storage section to the second storage section by the first pressurizing means, the second storage section is opened so that the processing liquid in the processing liquid is supplied. Can be released from the processing liquid.

Further, since the second storage unit has a smaller capacity than the first storage unit, the second storage unit can be provided closer to the processing unit than the first storage unit. It is possible to shorten the length of the pipe for guiding the processing liquid from the storage section to the processing section. Thereby, the pressure by the first pressure unit can be set low when the processing liquid is supplied from the second storage unit to the processing unit. Therefore, the dissolved amount of the pressurized gas in the processing liquid by the second pressurizing unit is reduced, and the processing liquid is prevented from foaming in the processing unit.

Further, since the pipe for guiding the processing liquid from the second storage section to the processing section can be shortened, pressure pulsation hardly occurs when the processing liquid is supplied from the second storage section to the processing section. Become.

As a result, a sufficient amount of the processing liquid and a stable discharge state of the processing liquid can be obtained.

According to a second aspect of the present invention, in the configuration of the substrate processing apparatus according to the first aspect, the first storage unit stores an amount of processing liquid necessary for a plurality of processes in the processing unit. The second storage unit has a capacity capable of storing an amount of processing liquid necessary for one processing in the processing unit.

In this case, an amount of processing liquid necessary for a plurality of treatments is stored in the first storage unit, and an amount of the processing liquid required for one processing from the first storage unit to the second storage unit is stored. Is supplied.
Since the capacity of the second storage unit is a capacity capable of storing the processing liquid necessary for one process, the size of the second storage unit is reduced.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the second storage section is closer to the processing section than the first storage section. It is provided.

In this case, since the length of the pipe for guiding the processing liquid from the second storage section to the processing section is shortened, the pressure by the second pressurizing means can be set low. Thereby, the dissolved amount of the pressurized gas in the processing liquid by the second pressurizing unit is reduced. Further, pressure pulsation is less likely to occur when the processing liquid is supplied from the second storage unit to the processing unit.

The substrate processing apparatus according to the fourth invention comprises:
In the configuration of the substrate processing apparatus according to the second or third aspect, the processing section and the second storage section are provided inside the apparatus main body, and the first storage section is provided outside the apparatus main body. .

In this case, since the second storage section is provided in the main body of the apparatus, a pipe for guiding the processing liquid from the second storage section to the processing section is shortened. Thereby, the pressure by the second pressurizing means can be set lower than the pressure by the first pressurizing means. Therefore, the dissolved amount of the pressurized gas in the processing liquid by the second pressurizing unit is reduced. Further, pressure pulsation is less likely to occur when the processing liquid is supplied from the second storage unit to the processing unit.

According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the first storage section is provided below the apparatus main body.

In this case, since the first storage section is provided below the apparatus main body, the footprint of the apparatus main body can be reduced.

The substrate processing apparatus according to the sixth invention comprises
In the configuration of the substrate processing apparatus according to any one of the fifth aspects of the invention, the first pressurizing means includes: a first conduit for guiding a first gas having a predetermined pressure into the first storage; A first pressure switching means for switching the inside of the storage portion between a pressurized state by a first gas and an open state, and a second pressurizing means,
A second conduit for guiding a second gas having a predetermined pressure into the second storage portion, pressure adjusting means for adjusting a pressure in the second storage portion, and a second gas flowing through the second storage portion. And a second pressure switching means for switching between a pressurized state and an atmospheric pressure or a reduced pressure state.

In this case, a first gas having a predetermined pressure is supplied into the first storage section through the first conduit, and the first gas is supplied to the first storage section.
Is switched between the pressurized state by the first gas and the open state by the first pressure switching means. Also,
A second gas having a predetermined pressure is supplied through the second conduit into the second storage portion, and the inside of the second storage portion is pressurized by the second gas and opened by the second pressure switching means, or It can be switched to the reduced pressure state. The processing liquid is supplied to the first storage section when the inside of the first storage section is in the open state, and the first processing liquid is supplied when the inside of the first storage section is in the pressurized state and the second storage section is in the open state or the reduced pressure state. The processing liquid is supplied from the storage section to the second storage section. Thereby, the gas in the processing liquid supplied to the second storage unit is released. Further, the processing liquid is supplied from the second storage unit to the processing unit when the second storage unit is in a pressurized state.

The substrate processing apparatus according to the seventh invention comprises
In the configuration of the substrate processing apparatus according to any one of the sixth inventions, the first storage unit may include the first and second tanks and the first storage unit.
A first path for guiding the processing liquid to the second tank, a second path for guiding the processing liquid to the second tank, first path switching means for switching the first path and the second path, and a first path. A third path for guiding the processing liquid from the tank to the second storage section;
And a second path switching means for switching the third path and the fourth path for guiding the processing liquid from the tank to the second storage section.

In this case, the processing liquid is selectively supplied to the first tank or the second tank by the first path switching means. Further, the processing liquid is selectively supplied to the second storage section from the first tank or the second tank by the second path switching means. Thus, when the processing liquid is being supplied from one of the first and second tanks to the second storage section, the processing liquid can be supplied to the other of the first and second tanks. Therefore, it is possible to always store the processing liquid in the first storage unit.

The substrate processing apparatus according to the eighth invention comprises
In the configuration of the substrate processing apparatus according to any one of the sixth aspects of the invention, the first storage unit may include a tank, a fifth path that guides the processing liquid to the tank, and a processing liquid that guides the processing liquid from the tank to the second storage unit. And a sixth route.

In this case, the processing liquid is supplied and stored in the tank through the fifth path. The processing liquid stored in the tank is supplied to the second storage section through the sixth path. When the processing liquid is not supplied from the tank to the second storage section through the sixth path, the processing liquid is supplied to the tank through the fifth path so that the processing liquid is constantly stored in the first storage section. Becomes possible.

The substrate processing apparatus according to the ninth invention comprises
In the configuration of the substrate processing apparatus according to any one of the eighth inventions, the second storage unit may include a trap tank, a seventh path that guides a processing liquid from the first storage unit to the trap tank, And an eighth route for guiding the processing liquid to the processing unit.

In this case, the processing liquid is supplied to and stored in the trap tank through the seventh path. The processing liquid stored in the trap tank is supplied to the processing section through the eighth route.

A processing liquid supply system according to a tenth aspect of the present invention is a processing liquid supply system for supplying a processing liquid to a processing section of a substrate processing apparatus, comprising: a first storage section for storing a processing liquid; A second storage unit that has a smaller capacity than the storage unit and stores the processing liquid, and a second storage unit that supplies the processing liquid in the first storage unit to the second storage unit by pressurizing the inside of the first storage unit. The first pressure means and the second pressure means for supplying the processing liquid in the second storage section to the processing section by pressurizing the inside of the second storage section.

In the processing liquid supply system according to the present invention, the processing liquid stored in the first storage section is supplied to the second storage section by the first pressurizing means, and temporarily stored therein.
The processing liquid stored in the second storage unit is supplied to the processing unit by the second pressurizing unit.

In this case, when the processing liquid is supplied from the first storage section to the second storage section by the first pressurizing means, the second storage section is set to the open state, whereby the processing liquid Can be released from the processing liquid.

Since the second storage section has a smaller capacity than the first storage section, the second storage section can be provided closer to the processing section than the first storage section, It is possible to shorten the length of the pipe for guiding the processing liquid from the storage section to the processing section. Thereby, the pressure by the first pressure unit can be set low when the processing liquid is supplied from the second storage unit to the processing unit. Therefore, the dissolved amount of the pressurized gas in the processing liquid by the second pressurizing unit is reduced, and the processing liquid is prevented from foaming in the processing unit.

Further, since the pipe for guiding the processing liquid from the second storage section to the processing section can be shortened, disturbance such as pressure pulsation when the processing liquid is supplied from the second storage section to the processing section. Less likely to occur.

As a result, a sufficient amount of the processing liquid and a stable discharge state of the processing liquid can be obtained.

[0056]

FIG. 1 is a schematic view of a substrate processing apparatus according to a first embodiment of the present invention. The substrate processing apparatus 200 in FIG. 1 is a developing apparatus, and the processing liquid is a developing liquid.

As shown in FIG. 1, the substrate processing apparatus 200 includes a processing section 10, a processing liquid storage section 120, and a processing liquid supply section 1.
50 is provided.

In this embodiment, the processing section 10 and the processing liquid supply section 150 are provided in the apparatus main body 400, and the processing liquid storage section 120 is provided under the floor in the factory. In particular, the processing liquid supply unit 150 is provided near the processing unit 10.

The processing liquid storage section 120 constantly stores the processing liquid and supplies the processing liquid to the processing liquid supply section 150. The processing liquid supply section 150 stores and stores the processing liquid necessary for one substrate processing. The processing liquid is supplied to the processing unit 10.

In the processing section 10, a substrate W is held in a horizontal posture on a substrate holding section 11 which is driven to rotate around a vertical axis. The periphery of the substrate W held by the substrate holding unit 11 is surrounded by a cup 12 for preventing the processing liquid from scattering.

Above the substrate W, a processing liquid discharge nozzle 13 for discharging a processing liquid onto the substrate W is provided. A processing liquid 60 supplied from a processing liquid supply system (not shown) such as a factory line or a canister is supplied to the processing liquid discharge nozzle 13.
Is supplied through the processing liquid storage unit 120 and the processing liquid supply unit 150.

The processing liquid storage section 120 includes a first buffer tank 121, a second buffer tank 122, and a three-way valve 12.
5,126,131,132. The first buffer tank 121 and the second buffer tank 122 are pressure vessels capable of storing an amount of processing liquid necessary for a plurality of times of substrate processing.

The processing liquid 60 from the processing liquid supply system is supplied to the pipe 1
Through the first fluid port 125a of the three-way valve 125
To the first buffer tank 1 through a pipe 127 from a second fluid port 125 b of the three-way valve 125.
21 or supplied from the third fluid port 125 c of the three-way valve 125 to the second buffer tank 122 via the pipe 128. By switching the three-way valve 125, the processing liquid is selectively supplied to one of the buffer tanks 121 and 122.

The first buffer tank 121 and the second buffer tank 122 are respectively provided with liquid level sensors 123 and 124 capable of detecting the liquid level. Thus, when the liquid level sensor 123 detects that the liquid level of the processing liquid in the first buffer tank 121 has dropped to a predetermined position, the three-way valve 125 supplies the processing liquid into the first buffer tank 121. Switch to the first buffer tank 121 side. The liquid level sensor 123 detects that the liquid level of the processing liquid in the first buffer tank 121 has risen to a predetermined position.
Is detected, the three-way valve 125 is switched so that the supply of the processing liquid to the first buffer tank 121 is stopped. Thus, the amount of the processing liquid in the first buffer tank 121 is kept within a predetermined range. Similarly, the level of the processing liquid in the second buffer tank 122 is detected by the liquid level sensor 124, and the amount of the processing liquid in the second buffer tank 122 is kept within a predetermined range.

The processing liquid stored in the first buffer tank 121 is supplied to a first fluid port 126 a of the three-way valve 126 through a pipe 129. Further, the processing liquid stored in the second buffer tank 122 is supplied to the second fluid port 126 b of the three-way valve 126 through the pipe 130. The processing liquid derived from the third fluid inlet / outlet 126 c of the three-way valve 126 is supplied to the processing liquid supply unit 15 through a pipe 142.
0. By switching the three-way valve 126, the processing liquid is selectively supplied to the processing liquid supply unit 150 from either the first buffer tank 121 or the second buffer tank 122.

A pressurized gas 61 such as nitrogen gas from a gas supply system (not shown) is supplied to a pipe 135, a first fluid port 131 a of the three-way valve 131, a second fluid port 131 b of the three-way valve 131, and a pipe 136. Through the pipe 138, the first fluid port 132 a of the three-way valve 132, the second fluid port 132 b of the three-way valve 132, and the pipe 139. Supplied to First buffer tank 12
1 can be opened to the atmosphere through a third fluid port 131c of the three-way valve 131 and a pipe 137. The inside of the second buffer tank 122 can be opened to the atmosphere through the third fluid port 132 c of the three-way valve 132 and the pipe 140.

The pressure in the first buffer tank 121 becomes the atmospheric pressure or the pressure of the pressurized gas 61 by switching the three-way valve 131. The processing liquid is supplied into the first buffer tank 121 when the pressure in the first buffer tank 121 is atmospheric pressure, and the processing liquid is supplied from the inside of the first buffer tank 121 when the pressure in the first buffer tank 121 is the pressure of the pressurized gas 61. Is discharged. Similarly, when the inside of the second buffer tank 122 is at atmospheric pressure, the processing liquid is supplied into the second buffer tank 122, and when the second buffer tank 122 is at the pressure of the pressurized gas 61, the processing liquid is supplied from the inside of the second buffer tank 122. The processing liquid is discharged.

The processing liquid storage section 120 and the processing liquid supply section 150
At the end of the pipe 141 branched from the pipe 142 connecting
A processing liquid supply unit (not shown) and a processing unit (not shown) similar to the processing liquid supply unit 150 and the processing unit 10 are provided. This makes it possible to supply the processing liquid from one processing liquid storage unit 120 to the processing liquid discharge nozzles 13 of the plurality of processing units 10.

The processing liquid supply unit 150 is provided in the trap tank 1
51, a supply stop sensor 152, on-off valves 153, 154, and a three-way valve 160. The trap tank 151 is 1
This is a pressure vessel that can store an amount of processing liquid necessary for substrate processing for each time.

The processing liquid supplied from the processing liquid storage unit 120 through the pipe 142 is supplied to the opening valve 153 and the pipe 155.
Is supplied to the inside of the trap tank 151. The supply stop sensor 152 detects that an amount of processing liquid necessary for one substrate processing is stored in the trap tank 151.
When the supply stop sensor 152 detects that the processing liquid required for one substrate processing is stored, the on-off valve 153 is closed and the supply of the processing liquid is stopped.

A pressurized gas 61 such as a nitrogen gas from a gas supply system (not shown) is supplied to a pipe 162, a pressure adjusting device 161,
Piping 163, first fluid port 160 of three-way valve 160
a, It is supplied into the trap tank 151 through the second fluid port 160b of the three-way valve 160 and the pipe 164. The inside of the trap tank 151 can be opened to the atmosphere via the third fluid port 160c of the three-way valve 160 and the pipe 165.

The pressure in the trap tank 151 is precisely adjusted by the pressure adjusting device 161 to a pressure required for the processing liquid to be discharged from the processing liquid discharge nozzle 13. The pressure in the trap tank 151 becomes the atmospheric pressure or the regulated pressure by switching the three-way valve 160. Trap tank 151
The processing liquid is supplied into the trap tank 151 when the inside is at atmospheric pressure, and the processing liquid is discharged from the trap tank 151 when the inside of the trap tank 151 is at a regulated pressure.

The processing liquid stored in the trap tank 151 is supplied to the processing liquid discharge nozzle 13 through a pipe 156, an on-off valve 154, and a pipe 143. On-off valve 154
Is opened, the processing liquid discharge nozzle 1 is discharged from the trap tank 151.
When the supply of the processing liquid to 3 starts and the on-off valve 154 closes, the supply of the processing liquid ends.

In this embodiment, the processing section 10 corresponds to the processing section, the processing liquid storage section 120 corresponds to the first storage section, the processing liquid supply section 150 corresponds to the second storage section, and the pipe 135 ,
136, 138, 139 and the three-way valves 131, 132 correspond to the first pressurizing means, and the pipes 162, 163, 16
4. The three-way valve 160 and the pressure adjusting device 161 correspond to the second pressurizing means, and the pressurized gas 62 is the first gas and the second gas.
The apparatus main body 400 corresponds to the apparatus main body,
The pipes 135, 136, 138, and 139 correspond to a first pipe, the three-way valves 131 and 132 correspond to first pressure switching means, and the pipes 162, 163, and 164 correspond to a second pipe. The pressure adjusting device 161 corresponds to a pressure adjusting unit,
The three-way valve 160 corresponds to the second pressure switching means,
The buffer tank 121 corresponds to a first tank, the second buffer tank 122 corresponds to a second tank,
7 corresponds to the first path, the pipe 128 corresponds to the second path, the three-way valve 125 corresponds to the first path switching means, the pipe 129 corresponds to the third path, and the pipe 130 corresponds to the third path. The three-way valve 126 corresponds to the second path switching means, the trap tank 151 corresponds to the trap tank, the pipe 155 corresponds to the seventh path, and the pipe 15 corresponds to the third path.
6 corresponds to an eighth route.

Next, the operation of the substrate processing apparatus of FIG. 1 will be described. The processing liquid storage unit 120 operates so as to constantly supply the processing liquid to the on-off valve 153 of the processing liquid supply unit 150 through the pipe 142. Therefore, the operation of the processing liquid storage unit 120 will be described first, and then the operation of the processing liquid supply unit 150 will be described.

The first storage tank 121 of the processing liquid storage unit 120 to the trap tank 15 of the processing liquid supply unit 150
The processing liquid is supplied to the first buffer tank 12.
It is assumed that the processing liquid in 1 has dropped to the lower limit position.

The three-way valve 126 is connected to the second buffer tank 122
The processing liquid is supplied to the on-off valve 153 via the pipe 142. While the on-off valve 153 is open, the second
The processing liquid is supplied from the buffer tank 122 into the trap tank 151. While the on-off valve 153 is closed, the processing liquid is supplied from the inside of the second buffer tank 122 to the on-off valve 153.

The processing liquid is stored in the second buffer tank 122 up to the upper limit position in advance, and the pressure gas 6
1 is supplied, and the processing liquid can be supplied to the trap tank 151. .

While the supply of the processing liquid from the second buffer tank 122 is continued, the processing liquid is supplied into the first buffer tank 121. First, the first buffer tank 12
The three-way valve 131 is switched so that the inside of the first tank communicates with the pipe 137, and the inside of the first buffer tank 121 becomes the atmospheric pressure.
In this state, the three-way valve 125 is
The processing liquid 60 is supplied to the first buffer tank 121. When the liquid level sensor 123 detects that the processing liquid in the first buffer tank 121 has reached the upper limit position, the three-way valve 125 is switched to stop supplying the processing liquid. The pipe 135 is inside the first buffer tank 121.
The three-way valve 131 is switched so as to communicate with the pressure, and the pressure in the first buffer tank 121 becomes a pressure at which the processing liquid can be supplied.

When the liquid level sensor 124 detects that the processing liquid in the second buffer tank 122 has reached the lower limit position,
The three-way valve 126 is switched to the first buffer tank 121 side, and the supply of the next processing liquid starts with the first buffer tank 121.
Is used. Replenishment of the processing liquid in the second buffer tank 122 is performed in the same manner as in the case of the first buffer tank 121.

As described above, while using two buffer tanks and supplying the processing liquid from one buffer tank, the processing liquid is supplied to the other buffer tank so that the processing liquid is constantly supplied to the on-off valve 153. Can be supplied.

Since the pressure of the pressurized gas 61 may be a pressure at which the processing liquid can be supplied to the trap tank 151, the pressure of the pressurized gas 61 can be set lower than in the conventional case. for that reason,
First buffer tank 121 and second buffer tank 1
At 22, the amount of the pressurized gas 61 dissolved in the processing liquid is reduced as compared with the related art. In addition, the first buffer tank 121 and the second
Fine pressure adjustment in the buffer tank 122 is not required.

Further, since the pressure applied to the first buffer tank 121 and the second buffer tank 122 is reduced, the pressure of the pressurized gas 61 sufficiently conforms to the pressure standard of the pressure vessel. Therefore, safety is enhanced.

In the processing liquid supply section 150, it is assumed that the supply of the processing liquid from the trap tank 151 to the processing liquid discharge nozzle 13 has been completed.

The opening / closing valve 154 is closed, and the inside of the trap tank 151 is switched so as to communicate with the pipe 165, and the inside of the trap tank 151 becomes the atmospheric pressure. Next, the on-off valve 15
3 is opened and the processing liquid is supplied into the trap tank 151. When the supply stop sensor 152 detects the supply of the processing liquid in an amount necessary for one substrate processing, the on-off valve 153 is closed. Further, the three-way valve 160 is switched so that the inside of the trap tank 151 communicates with the pressure adjusting device 161, and the inside of the trap tank 151 has an adjustment pressure capable of supplying the processing liquid to the processing liquid discharge nozzle 13.

Next, the on-off valve 154 is opened, and the processing liquid is supplied from the trap tank 151 to the processing liquid discharge nozzle 13. The processing liquid supplied to the processing liquid discharge nozzle 13 is discharged from the processing liquid discharge nozzle 13 onto the substrate W, and a predetermined process is performed on the substrate W.

In the substrate processing apparatus of the present embodiment, the trap tank 151 needs to be large enough to store the amount of processing liquid necessary for one substrate processing. And the processing liquid supply unit 150 and the processing unit 1
The piping between 0 is short. Accordingly, the discharge state of the processing liquid from the processing liquid discharge nozzle 13 is less likely to be affected by the pressure pulsation generated when the processing liquid flows in the pipe. Therefore, a stable processing liquid discharge state can be obtained.

Further, since the processing liquid supply unit 150 can be disposed close to the processing unit 10, there is almost no difference in height between the processing liquid supply unit 150 and the processing unit 10. Therefore, the pressure adjusted by the pressure adjusting device 161 can be set low, and the amount of dissolved gas in the processing liquid is reduced. Further, since the time during which the processing liquid and the gas are in contact with each other in the trap tank 151 is short, the dissolved amount of the gas in the processing liquid is further reduced. Further, when the processing liquid is supplied into the trap tank 151, the inside of the trap tank 151 is open to the atmosphere. Therefore, at this point, the gas dissolved in the processing liquid is degassed. Further, by connecting a vacuum pump to the tip of the pipe 165 instead of opening the tip of the pipe 165 to the atmosphere, degassing can be performed more strongly.

As a result, foaming from the processing liquid discharged onto the substrate W is suppressed, and a stable processing liquid discharge state is obtained.

FIG. 2 is a schematic view of a substrate processing apparatus according to a second embodiment of the present invention. The substrate processing apparatus 300 in FIG. 2 is a developing apparatus, and the processing liquid is a developing liquid.

As shown in FIG. 2, the substrate processing apparatus 300 includes a processing section 10, a processing liquid storage section 220, and a processing liquid supply section 1.
50 is provided.

In this embodiment, the processing section 10 and the processing liquid supply section 150 are provided in the apparatus main body 400, and the processing liquid storage section 220 is provided under the floor in the factory. In particular, the processing liquid supply unit 150 is provided near the processing unit 10.

In the substrate processing apparatus of this embodiment, the processing unit 10
The configuration of the processing liquid supply unit 150 is the same as the configuration of the processing unit 10 and the processing liquid supply unit 150 of the substrate processing apparatus 200 of FIG. 1, and the configuration of the processing liquid storage unit 220 is the same as that of the processing liquid storage unit 120 of FIG. Different from configuration.

The processing liquid storage section 220 is provided in the buffer tank 2
21, an on-off valve 223 and a three-way valve 231. The processing liquid storage section 220 is a pressure vessel that can store an amount of processing liquid necessary for a plurality of times of substrate processing.

Processing liquid 6 from processing liquid supply system (not shown)
0 is supplied into the buffer tank 221 via the pipe 227 and the on-off valve 224.

The buffer tank 221 is provided with a liquid level sensor 222 capable of detecting the liquid level. Thereby, when the liquid level sensor 222 detects that the liquid level of the processing liquid in the buffer tank 221 has dropped to a predetermined position,
The on-off valve 223 is opened to supply the processing liquid into the buffer tank 221. The liquid level sensor 222 detects that the level of the processing liquid in the buffer tank 221 has risen to a predetermined position.
Is detected, the on-off valve 223 closes and the supply of the processing liquid is stopped. Thus, the amount of the processing liquid in the buffer tank 221 is kept within a predetermined range.

The processing liquid stored in the buffer tank 221 is supplied to the open / close valve 153 of the processing liquid supply unit 150 through the pipe 225.

A pressurized gas 61 such as nitrogen gas from a gas supply system (not shown) is supplied to a pipe 232, a first fluid port 231 a of the three-way valve 231, a second fluid port 231 b of the three-way valve 231, and a pipe 233. Through the buffer tank 22
1 is supplied. The inside of the buffer tank 221 can be opened to the atmosphere via the third fluid port 231c of the three-way valve 231 and the pipe 234.

The pressure in the buffer tank 221 is controlled by the three-way valve 2
Atmospheric pressure or pressurized gas 61 by switching 31
Pressure. The processing liquid is supplied into the buffer tank 221 when the pressure in the buffer tank 221 is the atmospheric pressure, and the processing liquid is discharged from the buffer tank 221 when the pressure in the buffer tank 221 is the pressure of the pressurized gas 60.

In this embodiment, the buffer tank 221 corresponds to the tank, the pipes 227 and 224 correspond to the first path, the pipe 225 corresponds to the second path, and the pipes 232 and 2
33 corresponds to a first pipeline, and the three-way valve 231 corresponds to first pressure switching means.

Next, the operation of the processing liquid storage section 220 will be described. Here, it is assumed that the processing liquid is being supplied from the buffer tank 221 to the trap tank 151.

The three-way valve 231 is switched so that the inside of the buffer tank 221 communicates with the pipe 232, and the pressurized gas 61 is guided into the buffer tank 221. At this time, the on-off valve 223 is closed.

When the liquid level sensor 222 detects that the processing liquid in the buffer tank 221 has decreased to the lower limit position,
The three-way valve 231 is switched so that the pipe 234 communicates with the inside of the buffer tank 221, and the inside of the buffer tank 221 becomes atmospheric pressure. At this time, the on-off valve 153 of the processing liquid supply unit 150 is closed.

Next, the opening / closing valve 223 is opened to supply the processing liquid into the buffer tank 221. When the liquid level sensor 222 detects that the processing liquid has reached the upper limit position, the on-off valve 223 closes and the supply of the processing liquid stops.

Next, the three-way valve 231 is
1 is switched to communicate with the pipe 232, and the pressurized gas 61 is guided into the buffer tank 221. Thus, preparation for supplying the processing liquid to the processing liquid supply unit 150 is completed, the on-off valve 153 is opened, and the processing liquid is supplied to the trap tank 151.

By setting the supply pressure of the processing liquid from the buffer tank 221 to the trap tank 151 lower than the supply pressure of the processing liquid from the processing liquid supply system such as a factory line or a canister to the buffer tank 22, The inside of the buffer tank 221 can be filled with the processing liquid.

In the substrate processing apparatus of this embodiment, the supply of the processing liquid from the buffer tank 221 to the trap tank 151 is completed, and
The processing liquid is supplied into the buffer tank 221 using the time interval until the supply of the next processing liquid to the first processing liquid. Thus, only one buffer tank 221 can be used.

Therefore, the pipes and valves for supplying and discharging the processing liquid to and from the buffer tank 221 and the pipes and valves for supplying and discharging the pressurized gas to and from the buffer tank 221 are halved as compared with the prior art. Significant cost reduction is possible.

In the above embodiment, the case where the present invention is applied to a developing apparatus has been described. However, the present invention is directed to a rotary coating apparatus using a coating liquid such as a resist liquid as a processing liquid, and pure water or the like as a processing liquid. The present invention can also be applied to other substrate processing apparatuses such as a cleaning apparatus using the cleaning liquid of (1).

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic view of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 3 is a schematic diagram illustrating an example of a conventional substrate processing apparatus.

DESCRIPTION OF SYMBOLS 10 processing unit 120 processing liquid storage unit 121 first buffer tank 122 second buffer tank 125, 126 three-way valve 127 to 130 pipe 131, 132 three-way valve 135 to 142 pipe 144 pipe 150 processing liquid supply part 151 trap Tanks 162 to 165 Piping 161 Pressure regulator 220 Processing liquid storage 221 Buffer tanks 224, 225, 227 Piping 231 Three-way valve 232 to 234 Piping 400 Main body of device

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ryuichi Chikamori 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto Dainippon Screen Mfg. Co., Ltd. (72) Inventor Masafumi Maeda Kamigyo, Kyoto-shi 4-chome Tenjin, Horikawa-dori Terunouchi, Ward 1-1-1 Kitamachi 1 Dainippon Screen Mfg. Co., Ltd. F-term (reference) 2H096 AA25 CA14 GA30 4F042 AA07 BA06 CA01 CB03 CB08 EB17 5F046 JA03 LA03

Claims (10)

[Claims] 1. A substrate processing apparatus for performing a predetermined process on a substrate, a processing unit for performing a process on the substrate using a processing liquid, a first storage unit for storing a processing liquid, and the first storage A second storage unit having a smaller capacity than the storage unit and storing the processing liquid; and supplying the processing liquid in the first storage unit to the second storage unit by pressurizing the inside of the first storage unit. A first pressurizing unit that pressurizes the inside of the second storage unit and supplies a processing liquid in the second storage unit to the processing unit by pressurizing the inside of the second storage unit. Substrate processing equipment. 2. The first storage unit has a capacity capable of storing an amount of processing liquid necessary for a plurality of processes in the processing unit, and the second storage unit has a capacity of 1 in the processing unit. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus has a capacity capable of storing an amount of processing liquid necessary for each processing. 3. The substrate processing apparatus according to claim 1, wherein the second storage unit is provided closer to the processing unit than the first storage unit. 4. The processing unit and the second storage unit,
4. The device according to claim 1, wherein the first storage unit is provided inside the apparatus main body, and the first storage unit is provided outside the apparatus main body.
The substrate processing apparatus according to any one of the preceding claims. 5. The substrate processing apparatus according to claim 4, wherein the first storage section is provided below the apparatus main body. 6. The first pressurizing means includes: a first conduit that guides a first gas having a predetermined pressure into the first storage unit; and a first conduit that guides a first gas having a predetermined pressure into the first storage unit. A first pressure switching unit that switches between a pressurized state by a gas and an open state, wherein the second pressurizing unit guides a second gas having a predetermined pressure into the second storage unit. A pressure adjusting means for adjusting the pressure in the second storage portion; and a second pressure switching for switching the inside of the second storage portion between a pressurized state by the second gas and an atmospheric pressure or a reduced pressure state. The substrate processing apparatus according to any one of claims 1 to 5, further comprising means. 7. The first storage section includes: a first and a second tank; a first path for guiding the processing liquid to the first tank; and a second path for guiding the processing liquid to the second tank. A first path switching unit that switches between the first path and the second path; a third path that guides the processing liquid from the first tank to the second storage unit; A fourth path for guiding the processing liquid from the tank to the second storage section, and a second path switching means for switching between the third path and the fourth path. ~
7. The substrate processing apparatus according to any one of 6. 8. The first storage section includes a tank, a fifth path for guiding the processing liquid to the tank, and a sixth path for guiding the processing liquid from the tank to the second storage section. The substrate processing apparatus according to claim 1. 9. The second storage section includes: a trap tank; a seventh path for guiding a processing liquid from the first storage section to the trap tank; and a processing liquid from the trap tank to the processing section. Guide 8
The substrate processing apparatus according to any one of claims 1 to 8, further comprising: 10. A processing liquid supply system for supplying a processing liquid to a processing section of a substrate processing apparatus, comprising: a first storage section for storing a processing liquid; and a smaller capacity than the first storage section. A second storage unit that stores the processing liquid, and a first pressurizing unit that supplies the processing liquid in the first storage unit to the second storage unit by pressurizing the inside of the first storage unit. And a second pressurizing means for supplying a processing liquid in the second storage section to the processing section by pressurizing the inside of the second storage section.