JP2000173859A - Manufacture of and device of laminated chip part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate defects attendant on screen printing, to shorten a manufacturing lead time, and to cope quickly with a prodcution of a small amount of parts of various types, by a method wherein inner electrodes are formed on green sheets made like cards of uniform shape through a heat transfer method. SOLUTION: A through-hole boring machine 30 which bores a through-hole in a card-like green sheet 1, an electrode printing mechanism 35 as an electrode thermal printing means which prints inner electrodes on the card-like green sheet through a heat transfer method, and a thermocompression mechanism 50 which heats, presses, and laminates the green sheets 1 where a through-hole has been bored and inner electrodes have been printed, are provided. By this setup, various through-holes and inner electrode patterns are successively provided to the card-like green sheets by boring and printing corresponding to the order of lamination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for manufacturing a multilayer chip component such as a multilayer chip capacitor, a multilayer chip inductor, and a multilayer composite component.

[0002]

2. Description of the Related Art Conventionally, a method for manufacturing a multilayer chip component such as a multilayer chip capacitor, a multilayer chip inductor, a multilayer composite component, etc. has the steps shown in FIGS. Had been manufactured.

First, in a sheet forming step shown in FIG. 6, a powder material (a material for firing such as a magnetic material, a dielectric material and a low dielectric constant insulating material) is mixed with a binder, a solvent, a surfactant and the like to form a paint. Using a sheet forming machine 70, a roll 71 is produced by applying a thickness of several μm to several tens μm on a base film such as a PET film and drying. In this case, it is usual that the PET film is manufactured in a roll-to-roll transport form using several hundred meters or more as a unitary material.

Next, in a through-hole processing step shown in FIG.
A green sheet 72 (an unsintered sheet containing the powder material or the like) sheet-formed (cast) on a base film such as a PET film is fed out from a roll 71,
If a through-hole for internal connection is required, use a through-hole forming machine (punching machine) 73 to make a hole with a die, laser, sand blast, etc. Roll 74
Is prepared.

Further, internal electrodes are formed by printing in an electrode printing step using a screen printing machine 75 and a drying furnace 76 shown in FIG. That is, the green sheet subjected to the through-hole processing is fed out from the roll 74, and the internal electrode material is printed by a screen printing method, dried and wound up in a roll shape to produce the roll 77 after the internal electrode printing.

Finally, the green sheet (with a step corresponding to the thickness of the internal electrode) on which the internal electrodes have been printed in the sheet peeling step of FIG. 7 is drawn out from a roll 77 and peeled off from the base film. After cutting to a predetermined length, the cut sheet 78 is aligned using an XYθ table and a camera, and then laminated and pressed by successive thermocompression bonding or the like in a sheet laminating step to produce a laminated body (multiple pieces). I do.

In the conventional manufacturing method shown in FIGS. 6 and 7, for example, when four kinds of patterns of ABCD are required, an A pattern punched product, a B pattern punched product, a C pattern punched product, and a D pattern punched by a through hole forming machine 73. It is necessary to make four rolls 74 of the product. In the electrode printing process, A electrode printing and drying are performed on the A pattern punched product, and B electrode printing is performed on the B pattern punched product.
Each process of electrode printing, drying, C electrode printing and drying for C pattern punched products, and D electrode printing and drying for D pattern punched products are required, and setup such as mask exchange for screen printing is required. Furthermore, after cutting the sheet of FIG. 7, it is necessary to sequentially select and laminate the A electrode printing sheet, the B electrode printing sheet, the C electrode printing sheet, and the D electrode printing sheet in the sheet laminating step.

[0008]

The problems of the above prior art are listed below.

(1) The lead time for manufacturing a green sheet laminate is long. Roll-to-roll lot production, from sheet molding, through-hole molding, internal electrode printing, and sheet lamination, requires a long production lead time from receiving an order to producing a laminate.

(2) It is difficult to freely deal with varieties and quantities. It takes a long time to manufacture masks for screen printing, which limits the variety of products.Because of roll-to-roll lot production, it is difficult to manufacture without a certain order quantity, which increases costs. Problems arise.

(3) Equipment costs increase. A roll feeding and winding mechanism is required for each process equipment such as a sheet forming machine, a through-hole forming machine, an internal electrode printing machine, a sheet laminating machine, and a press machine. In addition, the through-hole forming machine, the internal electrode printing machine, the sheet laminating machine, and the like also require an image positioning mechanism and the like, so that each facility includes a redundant mechanism.

Among the multilayer chip components, high-frequency multilayer chip components such as a band-pass filter (BPF) and a voltage-controlled oscillator (VCO) have different product specifications and have a very large variety of components.

[0013] Problems when manufacturing a variety of products using screen printing technology will be described.

(4) The lead time of screen production is long. Long time from specification to manufacturing
2 weeks), it is difficult to respond to specification changes.

(5) The setup time is long. Supply and recovery of the printing paste, replacement of the screen mask, cleaning of the screen mask, and the like are required.

(6) There are many management points. There is a strong tendency to rely on skilled workers for screen elongation, screen life, squeegee polishing, printing gap, squeegee speed, scraper shape, printing pressure control, paste viscosity, yield value, and the like. Usually, the screen printing technique prints with a certain gap, so there is a difference between the screen mask dimension and the print-transferred dimension (plate extension). Managing this is essential to improving product yield.

(7) Not suitable for multi-product production. It is suitable for mass production in which the same pattern and the same ink are continuously printed. However, if the number of types increases, it takes time to exchange screen masks and the like, and the operation rate of the printing machine itself is reduced, resulting in poor production efficiency.

(8) The installation space is increased. This causes screen mask management, screen mask original image management, and enlargement of mask stockers.

(9) Variations in the characteristics of the product increase.
From the viewpoint of product characteristics, the green sheet on which the internal electrode is printed originally has a step corresponding to the electrode thickness. This leads to large variations in product characteristics.

The present invention has been made in view of the above points, and has the drawbacks associated with the roll-to-roll processing of a green sheet by forming internal electrodes by thermal transfer on a green sheet having a card-like shape. It is an object of the present invention to provide a method and an apparatus for manufacturing a multilayer chip component which eliminates the drawbacks associated with screen printing, has a short manufacturing lead time, and can quickly respond to high-mix low-volume production.

Other objects and novel features of the present invention will be clarified in embodiments described later.

[0022]

In order to achieve the above object, a method of manufacturing a laminated chip component according to the present invention is to provide a method for manufacturing a laminated green chip by performing through-hole processing on a card-like green sheet and printing by thermal transfer of internal electrodes. It is characterized by doing.

In the method of manufacturing a multilayer chip component, when there are a plurality of types of through-holes and internal electrode patterns, through-hole processing of different through-holes and internal electrode patterns and internal electrode printing are sequentially performed in accordance with the lamination order. It is good to execute.

An apparatus for manufacturing a laminated chip component according to the present invention comprises:
Through-hole processing means for performing through-hole processing on the card-shaped green sheet, thermal transfer printing means for electrodes for printing internal electrodes on the card-shaped green sheet by thermal transfer, and card-shaped green sheet subjected to through-hole processing and internal electrode printing And a laminating means for laminating by heating and pressing.

In the apparatus for manufacturing a laminated chip component, the through-hole processing means and the thermal transfer printing means may perform through-hole processing and internal electrode printing of different through-holes and internal electrode patterns in accordance with the laminating order in the laminating means. Are sequentially executed.

In the above-mentioned apparatus for manufacturing a laminated chip component, a flattening material thermal transfer printing means for printing a flattening material on a card-like green sheet by thermal transfer may be further provided.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method and an apparatus for manufacturing a multilayer chip component according to the present invention will be described below with reference to the drawings.

A first embodiment of the present invention will be described with reference to FIGS. Figure 1 shows a card-like green sheet (magnetic material,
FIG. 2 shows a through-hole processing step, an electrode printing step, and a sheet laminating step for an unfired sheet including a powder material for firing such as a dielectric material and a low dielectric constant insulating material. FIG. 2 shows a sheet for producing a card-like green sheet. The molding step and the sheet cutting step are shown.

In the sheet forming step shown in FIG. 2, a powder material (a magnetic material, a dielectric material, a low dielectric material, etc.) is mixed with a binder, a solvent, a surfactant and the like to form a coating material. A roll 71 is manufactured by applying the film to a thickness of several μm to several tens μm on a base film such as a PET film and drying the same (up to here is the same as the prior art). Next, in a sheet cutting step, a green sheet 72 formed (cast) into a base film such as a PET film by a sheet cutting machine 80 is fed out from a roll 71 and cut into a card having a certain size. Prepare No. 1. At this time, a guide hole 1a serving as a reference for alignment and a stock hole 1b for storage in a cassette are formed at, for example, four corners. Note that the stock point is the state of the card-like green sheet 1, which is a card system unlike the conventional roll-to-roll system.

Also, the internal electrode material and the like to be patterned on the card-like green sheet 1 are similarly formed into a base film such as a PET film in a required thickness in a similar manner (casting) and wound up in a roll shape. The internal electrode transfer sheet produced in this manner is prepared by using a thermal transfer head (thermal head) in the electrode printing process.
When forming a sheet for pattern transfer, an organic compound with a hot melt effect (the property of melting when heated) is selected as a binder, mixed with an internal electrode material to form a paint, and formed into a sheet with a predetermined thickness. I will go.

On the other hand, the cassette 10 of FIG. 1 has alignment pins 11, and sets the card-like green sheets 1 produced in the sheet cutting step of FIG. At this time, the stock holes 1b at the four corners of the card-like green sheet 1 in FIG.
, Each card-like green sheet 1 is in a fixed posture. In addition, for convenience of the sheet laminating step described later, each card-like green sheet 1 is provided in the cassette 10 so that the base film is on the lower side.

Fixed table 15, fixed table 20, X
Table 25 is arranged, for example, on a straight line,
Pilot pins 1 fitted in guide holes 1a on the card-like green sheet 1 side are respectively provided on the fixed tables 15 and 20.
6 and 21 are provided respectively.

In order to perform through-hole processing on the card-like green sheet 1 set on the fixed table 15, a through-hole forming machine (punching machine) 30 equipped with a YAG laser, a punching die and the like is provided with a fixed table. 15 is disposed opposite to the upper surface (green sheet mounting surface). The fixed table 15 and the through-hole forming machine 30 constitute through-hole processing means for executing a through-hole processing step.

An electrode printing mechanism 35 is disposed above the fixed table 20 so as to face the upper surface of the fixed table 20 (the green sheet mounting surface). The electrode printing mechanism 35 is provided with the internal electrode transfer sheet 3 as a thermal transfer printing ribbon.
6 and a thermal transfer head (thermal head) 37, and the internal electrode transfer sheet 36 is wound by a roller 39 via a roller 38. The fixed table 20 and the electrode printing mechanism 35 constitute an electrode thermal transfer printing unit that performs an electrode printing process.

Above the XYθ table 25, an image positioning camera 40 is provided.
5, an alignment mark printed simultaneously with the internal electrode pattern P1 printed on the card-like green sheet 1 is imaged, and the XYθ table 25 uses the XYθ table 25 so that the alignment mark is at a predetermined reference position. The positions of the green sheet 1 in the X direction, the Y direction, and the θ direction (rotation direction) are corrected. After the position correction, the XYθ table 25 can be moved to a position below the mold 45 while maintaining the attitude of the card-like green sheet 1. The mold 45 is for making cuts (V-grooves, perforations, etc.) for snapping the card-like green sheet 1.

The thermocompression bonding mechanism 50 has a lower press die 51 having a built-in heater H for heating the placed card-like green sheet 1 and an upper press die 52 having a vacuum suction function and a cooling function. This constitutes laminating means for executing the sheet laminating step.

A storage box 55 is provided for storing a temporary stack after a required number of card-like green sheets 1 are stacked.

The overall operation of the first embodiment will be described below.

The card-like green sheets 1 obtained through the sheet forming step and the sheet cutting step shown in FIG. 2 are set in the cassette 10 in the stacking order. Then, the cassette 10 is set in the apparatus so that the card-like green sheet 1 on the cassette 10 is at a predetermined supply position. Next, the card-like green sheet 1 is moved on a fixed table 15 which is a through-hole processing position on the basis of the guide hole 1a (in a state where the guide hole 1a is fitted to the pilot pin 16) with respect to the guide hole 1a. The necessary hole processing is performed by the molding machine 30.

Next, based on the guide holes, the card-shaped green sheet 1 after the hole processing is moved onto the fixed table 20 where the internal electrodes are printed by thermal transfer (the guide holes 1a are fitted to the pilot pins 21). State),
The internal electrode transfer sheet 36 is replaced with the card-like green sheet 1
The thermal transfer head 37 is run (line printed) with the internal electrode pattern P1 input in advance so as to be pressed upward, and necessary patterning is performed.

Then, the card-like green sheet 1 on which the internal electrodes are printed is laminated.
XY by Yθ table 25 and image positioning camera 40
Card-like green sheet 1 placed on θ table 25
Is corrected so as to accurately adjust the position to a predetermined constant posture. That is, when the internal electrodes are patterned, the alignment marks patterned at the same time are imaged by the image positioning camera 40 to perform image positioning.
The position of the card-like green sheet 1 is corrected on the table 25 to a fixed posture.

After the image is positioned, the XYθ table 25 is moved below the mold 45 while maintaining the attitude of the card-like green sheet 1, and cut by cutting the mold 45 to remove unnecessary sheet portions. , Laminated thermocompression bonding mechanism 50
When laminate thermocompression bonding is performed, unnecessary portions are peeled off simultaneously with the peeling of the base film of the green sheet. That is, the positioned card-like green sheet 1 is placed at the laminating position on the press lower die 51 so that the base film faces down, and the press upper die 52 descends for each sheet, and Is vacuum-sucked by the upper mold 52, and the second and subsequent sheets are already
A new card-like green sheet 1 supplied to the lower mold 51 is laminated and thermocompression-bonded to the lower surface of the card-like green sheet vacuum-adsorbed in a state where the base film is peeled off. The unnecessary sheet portion is peeled off. In this way, the upper mold 5
When a required number of card-like green sheets held in 2 are formed into a laminated body (temporary stack product), the vacuum suction is released and the green sheets are placed in a storage box 55 for sending to the next step.

When the laminated body is formed by laminating card-like green sheets having different through holes and internal electrode patterns for each layer, processing of the through holes of different through holes and internal electrode patterns and internal processing are performed in accordance with the lamination order. The electrode printing may be sequentially performed on the card-like green sheet by the through-hole forming machine 30 and the electrode printing mechanism 35. According to the formation of the through-hole by laser processing and the internal electrode printing by thermal transfer, different holes and electrodes are formed for each layer. It is easy to make a pattern. Therefore, it is not necessary to rearrange the card-like green sheets before the lamination after printing the internal electrodes.

According to the first embodiment, the following effects can be obtained.

(1) The lead time until the production of the green sheet laminate (temporary stack product) is shortened. Since continuous production in the form of a card is possible, from through-hole molding, internal electrode printing, sheet lamination, and pressing, the production lead time from receiving an order to manufacturing a sheet laminate is reduced. Since screen printing is not used, setup is easy and a drying step can be omitted.

(2) It is possible to freely cope with various kinds of small-quantity production. Since the internal electrodes are freely printed using the thermal transfer head 37, it is possible to continuously produce a required number of different patterns.

(3) Equipment cost and equipment installation space can be reduced. Since the process from through-hole molding, internal electrode printing, sheet lamination, and pressing can be continuously performed in a card form, a roll winding and feeding mechanism is not required. Further, since the image positioning mechanism including the XYθ table 25 and the image positioning camera 40 is provided only immediately before lamination of the sheets, the total equipment cost is reduced, and the installation space for the equipment is reduced.

(4) Since screen printing of the internal electrodes is not required, screen production and printing paste supply are not required, so that the mask production lead time and setup time can be reduced.

FIG. 3 shows a second embodiment of the present invention.
In this case, the fixed table 22 is arranged, for example, on a straight line between the fixed table 20 and the XYθ table 25, and the fixed table 22 is provided with pilot pins 23 that fit into the guide holes on the card-like green sheet 1 side. Have been. Above the fixed table 22, the fixed table 22
A flattening reversal material printing mechanism 60 is arranged to face the upper surface (green sheet mounting surface). The flattening reversal material printing mechanism 60 includes a reversal material transfer sheet 61 as a thermal transfer printing ribbon and a thermal transfer head (thermal head) 6.
And the sheet 61 for reversal material transfer is a roller 63
Through the roller 64. The fixed table 22 and the flattening reversal material printing mechanism 60 constitute a flattening material thermal transfer printing unit that executes a reversal material printing process. The reversing material transfer sheet 61 is prepared in a sheet forming process in the same manner as the internal electrode transfer sheet 36. That is, a binder, a solvent, a surfactant and the like are mixed with a powder of a flattening reversal material (preferably the same material as the green sheet) to form a paint,
Apply to required thickness on base film such as ET film,
After drying, a roll of a reversal material transfer sheet is prepared. However, an organic compound having a hot-melt effect (a property of melting when heated) is selected as a binder when a sheet is formed in order to transfer a pattern using a thermal transfer head in the printing process of the material for flattening.

The other configuration is the same as that of the first embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof will be omitted.

In the case of the second embodiment, after the internal electrode patterning by the electrode printing mechanism 35, the card-like green sheet 1 transferred onto the fixed table 22 is positioned on the basis of its guide hole (with respect to the pilot pin 23). With the guide holes fitted), the thermal transfer head 62 is run with the reverse pattern of the internal electrodes previously input so that the reverse material transfer sheet 61 is pressed onto the card-like green sheet 1 (line printing). Then, an inversion pattern of the internal electrode is formed of an inversion material so that necessary patterning is performed to eliminate a step of the card-like green sheet 1. Other operations are the same as those in the first embodiment.

According to the second embodiment, in addition to the effects of the first embodiment, the step caused by the formation of the internal electrode on the green sheet can be eliminated by the thermal transfer of the reversal material. It is possible to reduce misalignment and press deformation after lamination, thereby reducing product characteristic variations.

FIG. 4 shows a third embodiment of the present invention.
In this case, after the sheet forming and sheet cutting steps shown in FIG.
The card is supplied onto the cassette 10 using a card-like green sheet 1 'containing a snap provided with grooves, perforations, etc.). For this reason, it is possible to omit disposing a die for forming a cut after the image positioning mechanism including the XYθ table 25 and the image positioning camera 40, and after correcting the position in the XYθ table 25, stack the sheets by the thermocompression bonding mechanism 50. The process can be performed.

The other structure, operation and effect are the same as those of the first embodiment, and the same or corresponding portions are denoted by the same reference characters and description thereof will be omitted.

FIG. 5 shows a fourth embodiment of the present invention.
In this case, in addition to the configuration of the third embodiment, the flattening material thermal transfer printing means for performing the inverting material printing step having the fixed table 22 and the flattening inverting material printing mechanism 60 is used for electrode thermal transfer printing. It is located after the means. Therefore, as described in the second embodiment (FIG. 3), the step due to the formation of the internal electrode on the green sheet can be eliminated by the thermal transfer of the inversion material, and the sheet stacking deviation and the press deformation after the stacking can be reduced. Thus, it is possible to reduce the number of products, thereby reducing the variation in product characteristics.

The other structure, operation and effect are the same as those of the third embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof will be omitted.

The green sheet (magnetic material, dielectric material, insulating material, etc.) used in each embodiment may be any material that can be fired simultaneously with the internal electrode material.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. There will be.

[0059]

As described above, according to the present invention,
This is a configuration in which card-shaped green sheets are laminated by performing through-hole processing and printing by thermal transfer of internal electrodes. Continuous production in card form is possible, from through-hole molding, internal electrode printing, sheet lamination, and pressing. The production lead time from production to production of sheet laminates is shortened, and the internal electrodes are printed by thermal transfer, eliminating the need for screen printing. , It is possible to reduce various equipment costs and equipment installation space.

When there are a plurality of types of through-holes and internal electrode patterns, it is possible to sequentially perform through-hole processing of different through-holes and internal electrode patterns and internal electrode printing in accordance with the lamination order. The step of rearranging the card-like green sheets in the stacking order can be omitted.

[Brief description of the drawings]

FIG. 1 is a first embodiment of a method and an apparatus for manufacturing a multilayer chip component according to the present invention, and is a configuration diagram illustrating a process for a card-like green sheet.

FIG. 2 is a perspective view illustrating a process of producing a card-like green sheet according to the first embodiment.

FIG. 3 is a configuration diagram showing a second embodiment of the present invention.

FIG. 4 is a configuration diagram showing a third embodiment of the present invention.

FIG. 5 is a configuration diagram showing a third embodiment of the present invention.

FIG. 6 is a perspective view for explaining steps from sheet molding (roll) to screen printing of electrodes by a conventional roll-to-roll method.

FIG. 7 is a perspective view illustrating steps from sheet separation to sheet lamination by a conventional roll-to-roll method.

[Explanation of symbols]

 1, 1 'Card-shaped green sheet 1a Guide hole 10 Cassette 11 Positioning pin 15, 20, 22 Fixed table 16, 21, 23 Pilot pin 25 XYθ table 30 Through hole forming machine 35 Electrode printing mechanism 36 Internal electrode transfer sheet 37 , 62 Thermal transfer head 40 Image positioning camera 45 Mold 50 Thermocompression bonding mechanism 51 Press lower mold 52 Press upper mold 55 Storage box 60 Inverting material printing mechanism for flattening 61 Inverting material transfer sheet P1 Internal electrode pattern

Claims (5)

[Claims] 1. A method for manufacturing a laminated chip component, comprising: performing through-hole processing on a card-shaped green sheet and printing by thermal transfer of an internal electrode; 2. The lamination according to claim 1, wherein when there are a plurality of types of through-holes and internal electrode patterns, through-hole processing of different through-holes and internal electrode patterns and internal electrode printing are sequentially executed in accordance with the lamination order. Manufacturing method of die chip parts. 3. A through-hole processing means for performing through-hole processing on the card-like green sheet, an electrode thermal transfer printing means for printing internal electrodes on the card-like green sheet by thermal transfer, and a through-hole processing and internal electrode printing. And a laminating means for laminating the card-like green sheet by heating and pressurizing the green sheet. 4. The through-hole processing means and the thermal transfer printing means sequentially execute through-hole processing of different through-holes and internal electrode patterns and internal electrode printing in accordance with the lamination order in the laminating means. Item 4. An apparatus for producing a multilayer chip component according to item 3. 5. The apparatus for manufacturing a multilayer chip component according to claim 3, further comprising a thermal transfer printing means for a flattening material for printing the flattening material on the card-like green sheet by thermal transfer.