JP2000091795A - Apparatus for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for mounting electronic components which can mount many chucking nozzles by responding to kinds of electronic component. SOLUTION: In a parts feeder 10 which is equipped with parts trays accommodating electronic components by kind and feeds a parts tray for housing a required kind of electronic component onto a feed table 4, there is provided with a nozzle replacing station 19 which has tool trays 20 housing plural kinds of chucking nozzles. When replacing the chucking nozzle, the parts feeder 10 feeds the tool tray 20 onto the feed table 4, which allows the chucking nozzle to be changed to one responsive to the kind of electronic component. The tool trays 20 can be increased in response to the numbers of electronic components to respond to circuit boards of large-scale mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a circuit board.

[0002]

2. Description of the Related Art FIG. 8 shows a configuration of an electronic component mounting apparatus according to a conventional configuration. The electronic component mounting apparatus is mounted on a circuit board 1 carried in a predetermined position based on a preset mounting program.
The electronic components supplied from the tray-type component supply device 3 and the reel-type component supply device 5 can be mounted by the mounting head 7.

[0003] The tray-type component supply device 3 stores a plurality of parts trays 2 containing relatively large-sized electronic components such as integrated circuit components by type, and supplies the parts trays 2 containing required electronic components. It is configured to be supplied on the table 4. In addition, the reel type component supply device 5
It is configured such that small electronic components such as chip components and the like packaged by taping are wound around a reel for each type and supplied to a predetermined supply position. The mounting head 7 is freely moved in the XY plane by the XY robot 6, and the electronic components are sucked from the component supply positions of the tray-type component supply device 3 and the reel-type component supply device 5 by lifting and lowering the mounted suction nozzles 8. The electronic component is mounted on the circuit board 1 while being held.

The suction nozzle 8 is configured so that it can be replaced with one that matches the shape and size of the electronic component. When the mounting head 7 finishes mounting the electronic component on the circuit board 1,
It moves to the nozzle replacement station 9 and replaces the suction nozzle 8 with a suction nozzle 8 suitable for the next electronic component to be suction-held.

[0005]

In the electronic component mounting apparatus, it is important that the suction nozzle 8 reliably sucks and holds the electronic component so that the electronic component can be accurately mounted at a predetermined position on the circuit board 1. It is necessary to provide a suction nozzle 8 that matches the shape and dimensions of the component. Although the suction nozzle 8 is prepared at the nozzle replacement station 9, in order to correspond to the circuit board 1 with many types of electronic components to be mounted,
Inevitably, the number of suction nozzles 8 provided in the nozzle replacement station 9 also increases, and the nozzle replacement station 9 occupies a large area in which many suction nozzles 8 are arranged.
Since the nozzle replacement station 9 needs to be disposed within the movable area of the mounting head 7, an increase in the area occupied by the nozzle replacement station 9 will increase the size of the electronic component mounting apparatus.

Further, if the type of the circuit board processed by the electronic component mounting apparatus changes, the type of the electronic component also changes. Therefore, it is necessary to also change the suction nozzle 8 prepared in the nozzle changing station 9. In order to smoothly switch the type of circuit board to be produced, it is necessary to smoothly change the type of the suction nozzle 8, but in the conventional configuration, it is necessary to stop the operation of the apparatus and replace it. There was a problem that the work of switching the circuit boards to be produced was not performed smoothly.

An object of the present invention is to increase the number of suction nozzles suitable for the type of electronic component and increase the number of suction nozzles mounted on the electronic component, thereby facilitating replacement of the suction nozzle in accordance with a change in a circuit board to be produced. Is to provide.

[0008]

According to the present invention, there is provided a component for storing a plurality of parts trays accommodating electronic components and supplying the parts tray accommodating required electronic components to a component supply position. A supply device, a mounting head that holds an electronic component from a parts tray supplied to the component supply position by a component holding tool that is freely moved and mounted in a movable area, and mounts the electronic component at a predetermined position on a circuit board; And a tool exchange station accommodating a plurality of component holding tools so that the component holding tool to be mounted can be exchanged according to the shape and size of the electronic component. Of the component holding tool on the tool tray
The tool tray is stored in the component supply device, and the tool tray is supplied to the component supply position when the component holding tool is replaced.

According to the above configuration, the tool exchange station is configured by storing the tool tray accommodating the component holding tool in the component supply device. It can be supplied to the supply position.

Since the component supply device stores a plurality of component trays for each type of electronic component and supplies the required component trays to the component supply position, it is possible to supply a tool tray as required by utilizing this operation. By configuring to
A large number of component holding tools can be prepared by increasing the number of tool trays, and the number of component holding tools can be increased without increasing the size of the electronic component mounting device. It can correspond to a substrate.

In the above configuration, a plurality of component supply devices are provided, and a tool tray is stored in each of the component supply devices to form a tool exchange station.
The operation of switching to the component holding tool corresponding to the circuit board to be produced next can be performed during the production operation, and the setup accompanying the switching of the circuit board to be produced can be performed quickly, and the production efficiency can be improved.

Further, by storing a plurality of tool trays in the component supply device to form a tool exchange station, it is easy to increase the number of component holding tools, and to cope with a circuit board having a large mounting scale. It becomes possible.

[0013] Further, by configuring the component supply device so that the component tray can be supplied onto the tool tray in a state where the component tray is supplied to the component supply position, the replacement operation of the component holding tool can be quickly performed. can do.

[0014] Further, the accommodating position of each of a plurality of types of component holding tools accommodated in the tool tray is registered as tool accommodating data, and when the component holding tool is replaced, the mounting head is moved to the accommodating position of the corresponding component holding tool. With this configuration, the position of the component holding tool to be replaced is registered in the electronic component mounting apparatus, so that the mounting head can be accurately moved to the replacement position with reference to the tool housing data.

Further, by providing the tool accommodation data with the identification numbers of the plurality of tool trays, the accommodation position of the corresponding component holding tool can be determined even when a plurality of tool trays are provided. The tool tray containing the component holding tool is supplied to the component supply position.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.
Note that the same reference numerals are given to elements common to the conventional configuration, and the characteristic configuration of the present invention will be clarified.

In FIG. 1, the electronic component mounting apparatus according to the present embodiment is configured such that the circuit board 1 carried into a predetermined position is
The electronic component supplied from the tray-type component supply device 10 and the reel-type component supply device 5 can be mounted by the mounting head 7 based on a preset mounting program.

The tray type component supply apparatus 10 stores relatively large electronic components such as integrated circuit components on the parts tray 2 according to their types, and the parts tray 2 containing the required electronic components is supplied to a supply table (parts). (Supply position) 4. In addition, the reel-type component supply device 5 is configured to be capable of winding and holding small electronic components such as chip components packaged in taping on a reel for each type and supplying them to a predetermined supply position. The mounting head 7 is freely moved in the XY plane shown in the figure by an XY robot 6, and a mounted suction nozzle (component holding tool) 8 is moved up and down in the Z-axis direction to thereby provide a tray-type component supply device 10 and a reel-type component supply device. 5 Electronic components are mounted on the circuit board 1 by sucking and holding the electronic components from the respective component supply positions.

The suction nozzle 8 mounted on the mounting head 7
Is configured so that it can be replaced with one that matches the shape and size of the electronic component, and the mounting head 7 is replaced with a suction nozzle 8 that matches the electronic component to be suction-held. A plurality of types of suction nozzles 8 that match the shape and dimensions of the electronic components are stored in the tray-type component supply device 10 as a nozzle replacement station (tool replacement station) 19 and are placed on the supply table 4 when the suction nozzles 8 are replaced. It is configured to be withdrawn.

As shown in FIG. 2, the tray-type component supply device 10 includes two tray magazines 13a and 13b that are individually driven up and down by a lifting device 14.
The tray magazines 13a and 13b accommodate a plurality of tray plates 12 on which the parts tray 2 is mounted. When the tray magazines 13a and 13b are driven up and down by the elevating device 14 to move the tray plate 12 on which the parts tray 2 accommodating the required electronic components is mounted to the height position of the supply table 4, as shown in FIG. The two pull-out arms 11a and 11b provided on the supply table 4 corresponding to the respective tray magazines 13a and 13b are pulled out onto the supply table 4 by moving in the Y-axis direction. Although the electronic components can be taken out from the parts tray 2 drawn out on the supply table 4 by the mounting head 7, in the electronic component mounting apparatus having this configuration, the electronic components housed in the parts tray 2 are transferred. Transfer head 17 moved in the X-axis direction by the loading robot 16
The component supply table 1 provided on the pull-out arm 11b
A plurality of electronic components are transferred on the mounting head 7 and a plurality of electronic components can be collectively sucked and held by a plurality of suction nozzles 8 mounted on the mounting head 7. Therefore, while the mounting head 7 performs the operation of mounting the electronic component, the next electronic component to be mounted can be prepared, and the mounting of the electronic component can be efficiently executed.

Further, on the tray magazine 13a side,
As shown in FIG. 3, the nozzle exchange station 19 is provided below the tray magazine 13a,
When exchanging the suction nozzle 8 mounted thereon, the nozzle exchanging station 19 is driven up and down by the elevating device 14 to move to the height position of the supply table 4, and the drawing arm 1
By 1a, it is pulled out onto the supply table 4 as shown in FIG. Since the component supply position is within the movable area of the mounting head 7, the suction nozzle 8 can be replaced by moving the mounting head 7 to a predetermined storage position of the suction nozzle 8 for replacement.

The nozzle exchange station 19 is configured by fixing a tool tray 20 containing a plurality of types of suction nozzles 8 to the tray plate 12. When the number of suction nozzles 8 to be prepared is large, a plurality of stages are provided. The nozzle replacement station 19 in which the required suction nozzles 8 are accommodated can be pulled out onto the supply table 4. Also, as in the present configuration, the tray magazines 13a, 1
When two units 3b are arranged in parallel, a nozzle exchange station 19 can also be arranged on the tray magazine 13b side, and one of the nozzle exchange stations 19 during operation stop is produced next. Since it is possible to replace the nozzle replacing station 19 corresponding to the model or replace the suction nozzle 8 itself, it is possible to perform setup for the next production while the electronic component mounting apparatus is operating.
Productivity can be improved. Even if the number of suction nozzles 8 is increased, the size of the electronic component mounting device is not increased, and the electronic component mounting device can be easily mounted on a large-scale circuit board such as a computer motherboard having many types of electronic components to be mounted. Can be made to correspond.

Further, as shown in FIG.
It is also possible to configure so that the parts tray 2 can be pulled out on the tool tray 20 pulled out. In this configuration, rails for pulling out trays are provided on the supply table 4 in two stages, and the drawer arm 1 is provided on the lower side.
With the tool tray 20 pulled out by 1c, the parts tray 2 can be pulled out by the pull-out arm 11a upward. With this configuration, the replacement of the suction nozzle 8 can be performed quickly, so that production efficiency can be improved.

Since a plurality of types of suction nozzles 8 are accommodated in the tool tray 20, the type of the suction nozzles 8 accommodated in the tool tray 20 and the position on the tool tray 20 are determined by the master of the electronic component mounting apparatus. It must be registered as data. FIG. 6 shows an example of the suction nozzle 8. The suction nozzle 8 is formed in such a manner that the shape and size of the nozzle 33, the shape and size of the cap 34, and the like correspond to the shape and size of the electronic component to be suctioned. . Therefore, it is necessary to mount more kinds of suction nozzles 8 to the nozzle replacement station 19 as the number of types of electronic components mounted on the circuit board 1 increases.
The suction nozzle 8 is held at a predetermined position by a stopper arranged in a mesh shape on the tool tray 20, and the suction nozzle 8 housed in each mesh has an X coordinate and a Y coordinate as shown in FIG. The type of the suction nozzle 8 and the presence / absence of accommodation are registered as master data for each accommodation position indicated by coordinates. When a plurality of tool trays 20 are mounted, an identification number of each tool tray 20 is assigned.

The suction nozzle 8 is given a serial number for each type. When the suction nozzle 8 is accommodated in the tool tray 20, the serial number is registered as nozzle data at a corresponding accommodation position as shown in FIG. Since the accommodation data of the suction nozzles 8 shown in FIG. 7 is stored as master data in the electronic component mounting device, the tray-type component supply device 10 is displayed on the supply table 4 according to the type of electronic components set in the electronic component mounting program. Then, the tool tray 20 accommodating the suction nozzle 8 corresponding to the type of the electronic component is pulled out. Since the accommodation position of the corresponding suction nozzle 8 is recognized from the master data, the mounting head 7 returns the currently mounted suction nozzle 8 to a predetermined position, mounts the corresponding suction nozzle 8, and replaces the nozzle.

In the configuration described above, an example is shown in which the suction nozzle 8 is used as a component holding tool for holding an electronic component. However, the same configuration can be applied when a chuck for holding an electronic component is used.

[0027]

As described above, according to the present invention, a large number of component holding tools such as suction nozzles can be mounted in a component supply device, and electronic components can be mounted on a large-sized circuit board such as a large circuit board. Even when there are many types of components, it is possible to cope without increasing the size of the electronic component mounting apparatus.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing the configuration of an electronic component mounting apparatus according to an embodiment.

FIG. 2 is a perspective view showing a configuration of a component supply device according to the embodiment.

FIG. 3 is a structural diagram showing a mounting structure of a nozzle replacement station.

FIG. 4 is a perspective view showing a state where a tool tray is pulled out to a component supply position.

FIG. 5 is a perspective view showing a structure for pulling out a tool tray and a parts tray to the same position.

FIG. 6 is a side view showing a structural example of a suction nozzle.

FIG. 7 is a data table showing an example of accommodation position data of a suction nozzle.

FIG. 8 is a perspective view showing a configuration of an electronic component mounting apparatus according to a conventional configuration.

[Description of Signs] 1 Circuit board 2 Parts tray 4 Supply table 7 Mounting head 8 Suction nozzle (Component holding tool) 10 Tray type component supply device 19 Nozzle exchange station 20 Tool tray

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Uchiyama 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Koji Kodera 1006 Kadoma, Kazuma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroshi Ogata 1006, Kadoma Kadoma, Kadoma, Osaka Pref. AA18 AA23 CC03 DD05 DD31 EE24 EE25 EE34 FF05 FF24 FF28

Claims (6)

[Claims] 1. A component supply device for storing a plurality of component trays accommodating electronic components and supplying a component tray accommodating required electronic components to a component supply position, and a component mounted by freely moving within a movable area. A mounting head that holds an electronic component from a parts tray supplied to the component supply position by a holding tool and mounts the electronic component on a predetermined position on a circuit board, and a component holding tool mounted on the mounting head corresponds to the shape and dimensions of the electronic component. An electronic component mounting apparatus comprising: a tool exchange station accommodating a plurality of types of component holding tools for exchanging the components. The tool exchange station accommodates a plurality of types of component holding tools on a tool tray. The tool tray is stored in the component supply device so that the tool tray is supplied to the component supply position when the component holding tool is replaced. An electronic component mounting apparatus characterized by comprising configured. 2. The electronic component mounting apparatus according to claim 1, wherein a plurality of component supply devices are provided, and a tool exchange station is configured by storing a tool tray in each of the component supply devices. 3. The electronic component mounting device according to claim 1, wherein a plurality of tool trays are stored in the component supply device to form a tool exchange station. 4. The component supply device is configured to be able to supply a part tray on the tool tray in a state where the tool tray is supplied to the component supply position.
An electronic component mounting device according to any one of claims 1 to 3. 5. The storage position of each of a plurality of types of component holding tools stored in a tool tray is registered as tool storage data, and when the component holding tool is replaced, the mounting head is moved to the corresponding component holding tool storage position. The electronic component mounting device according to claim 1, wherein the electronic component mounting device is configured as described above. 6. The electronic component mounting apparatus according to claim 1, wherein an identification number of each of the plurality of tool trays is added to the tool accommodation data.