JP2000080276A - Curable silicone composition - Google Patents
Curable silicone compositionInfo
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- JP2000080276A JP2000080276A JP10248369A JP24836998A JP2000080276A JP 2000080276 A JP2000080276 A JP 2000080276A JP 10248369 A JP10248369 A JP 10248369A JP 24836998 A JP24836998 A JP 24836998A JP 2000080276 A JP2000080276 A JP 2000080276A
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- Prior art keywords
- curable silicone
- silicone composition
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は硬化性シリコーン組
成物に関し、詳しくは、艶消しされた硬化物を形成する
ことができる硬化性シリコーン組成物に関する。The present invention relates to a curable silicone composition, and more particularly to a curable silicone composition capable of forming a matte cured product.
【０００２】[0002]
【従来の技術】オルガノポリシロキサンを有機過酸化物
やオルガノハイドロジェンポリシロキサンと白金系触媒
により硬化させる硬化性シリコーン組成物は加熱により
短時間に硬化させることができることから、電気・電子
機器等のシール剤、ポッティング剤、あるいは接着剤と
して好適に使用されている。しかし、このような硬化性
シリコーン組成物の硬化物は表面に光沢を有するため
に、ＬＥＤ表示装置等の防水処理のためのポッティング
剤ないしは接着剤として用いた場合にはＬＥＤや外部か
らの光を反射してしまい視認性が悪いという問題があっ
た。このため、硬化性シリコーン組成物に無機系充填剤
を配合して硬化物の艶消しを行う場合もあるが、十分な
艶消し性を示すものではなく、また、艶消し性を付与す
るためには多量の充填剤を配合しなければならないが、
そうすると得られる硬化性シリコーン組成物の流動性が
低下し、もはやポッティング剤や接着剤として使用でき
なくなるという問題があった。2. Description of the Related Art A curable silicone composition obtained by curing an organopolysiloxane with an organic peroxide or an organohydrogenpolysiloxane and a platinum catalyst can be cured in a short time by heating. It is suitably used as a sealing agent, potting agent, or adhesive. However, since the cured product of such a curable silicone composition has a glossy surface, when it is used as a potting agent or adhesive for waterproof treatment of an LED display device or the like, it emits light from an LED or external light. There is a problem that the light is reflected and visibility is poor. For this reason, in some cases, the matting of the cured product is carried out by blending an inorganic filler with the curable silicone composition, but it does not show sufficient matting properties, and in order to impart matting properties. Has to mix a large amount of filler,
Then, the flowability of the curable silicone composition obtained is reduced, and there is a problem that it can no longer be used as a potting agent or an adhesive.
【０００３】[0003]
【発明が解決しようとする課題】本発明者らは、上記の
課題について鋭意検討した結果、本発明に到達した。す
なわち、本発明の目的は、艶消し性の優れた硬化物を形
成することができる硬化性シリコーン組成物を提供する
ことにある。DISCLOSURE OF THE INVENTION The present inventors have intensively studied the above-mentioned problems, and as a result, have reached the present invention. That is, an object of the present invention is to provide a curable silicone composition capable of forming a cured product having excellent matting properties.
【０００４】[0004]
【課題を解決するための手段】本発明は、 (Ａ)平均組成式： Ｒ1 nＳｉＯ(4-n)/2 （式中、Ｒ1は同じか、または異なる置換もしくは非置換の一価炭化水素基であ り、ｎは１.６〜２.４の正数である。） で表されるオルガノポリシロキサン １００重量部、 (Ｂ)空気酸化硬化性の不飽和基を有する有機化合物 ０.０１〜５０重量部、 (Ｃ)硬化剤｛上記(Ａ)成分を硬化させ得る量｝ からなることを特徴とする硬化性シリコーン組成物に関
する。According to the present invention, there is provided (A) an average composition formula: R 1 n SiO (4-n) / 2 (where R 1 is the same or different, substituted or unsubstituted monovalent) A hydrocarbon group, and n is a positive number from 1.6 to 2.4.) 100 parts by weight of an organopolysiloxane represented by the following formula: (B) an organic compound having an air oxidation-curable unsaturated group 0 0.01 to 50 parts by weight, comprising: (C) a curing agent (an amount capable of curing the component (A)).
【０００５】[0005]
【発明の実施の形態】本発明の硬化性シリコーン組成物
を詳細に説明する。 (Ａ)成分は本組成物の主剤であり、平均組成式： Ｒ1 nＳｉＯ(4-n)/2 で表されるオルガノポリシロキサンである。上式中のＲ
1は同じか、または異なる置換もしくは非置換の一価炭
化水素基であり、メチル基、エチル基、プロピル基、ブ
チル基等のアルキル基；シクロヘキシル基等のシクロア
ルキル基；ビニル基、アリル基、ブテニル基、ヘキセニ
ル基等のアルケニル基；フェニル基、トリル基等のアリ
ール基；クロロメチル基、３，３，３−トリフルオロプ
ロピル基等のハロゲン化アルキル基が例示される。本組
成物が有機過酸化物により硬化する組成物である場合に
は、(Ａ)成分中のケイ素原子に結合する基は限定されな
いが、本組成物がヒドロシリル化反応により硬化する組
成物である場合には、(Ａ)成分中のケイ素原子に結合す
る基の少なくとも２個は上記のアルケニル基であること
が必要である。また、上式中のｎは１.６〜２.４の範囲
内の正数である。これは、本成分のオルガノポリシロキ
サンの分子構造が実質的に直鎖状であることを意味して
いるが、分子構造の一部が分岐していたり、あるいは樹
枝状であったりしていてもよく、また、分子構造が分岐
していたり、樹枝状であるオルガノポリシロキサンを併
用してもよい。BEST MODE FOR CARRYING OUT THE INVENTION The curable silicone composition of the present invention will be described in detail. Component (A) is the main ingredient of the present composition and is an organopolysiloxane represented by an average composition formula: R 1 n SiO (4-n) / 2 . R in the above formula
1 is the same or different, substituted or unsubstituted monovalent hydrocarbon group, an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group; a cycloalkyl group such as a cyclohexyl group; a vinyl group, an allyl group, Examples thereof include alkenyl groups such as butenyl group and hexenyl group; aryl groups such as phenyl group and tolyl group; and halogenated alkyl groups such as chloromethyl group and 3,3,3-trifluoropropyl group. When the present composition is a composition that is cured by an organic peroxide, the group bonded to the silicon atom in the component (A) is not limited, but the present composition is a composition that is cured by a hydrosilylation reaction. In this case, it is necessary that at least two of the groups bonded to the silicon atom in the component (A) are the above-mentioned alkenyl groups. Further, n in the above equation is a positive number in the range of 1.6 to 2.4. This means that the molecular structure of the organopolysiloxane of this component is substantially linear, but even if a part of the molecular structure is branched or dendritic. Alternatively, an organopolysiloxane having a branched or dendritic molecular structure may be used in combination.
【０００６】(Ｂ)成分の空気酸化硬化性の不飽和基を有
する有機化合物は本組成物の特徴的な成分であり、本組
成物の硬化物に十分な艶消し性を付与するための成分で
ある。本成分は空気中の酸素により分子内の不飽和基が
反応して硬化するものであり、具体的には、リノレン
酸、リノール酸等の不飽和高級脂肪酸；桐油、亜麻仁
油、大豆油等の不飽和高級脂肪酸とグリセリンとのエス
テルからなる油脂；リノレン酸メチル、リノール酸メチ
ル等の不飽和高級脂肪酸とアルコールのエステル；ブタ
ジエン、ペンタジエン、ヘキサジエン等の不飽和炭化水
素化合物あるいはその重合体が例示され、好ましくは、
リノレン酸、リノレン酸メチル、桐油、１，３−ヘキサ
ジエン、１，４−ポリブタジエンである。The organic compound having an air-oxidatively curable unsaturated group as the component (B) is a characteristic component of the present composition, and is a component for imparting a sufficient matting property to a cured product of the present composition. It is. This component is one in which unsaturated groups in the molecule react and cure with oxygen in the air, and specifically, unsaturated higher fatty acids such as linolenic acid and linoleic acid; tung oil, linseed oil, soybean oil, etc. Fats and oils composed of esters of unsaturated higher fatty acids and glycerin; esters of unsaturated higher fatty acids such as methyl linolenate and methyl linoleate and alcohols; unsaturated hydrocarbon compounds such as butadiene, pentadiene and hexadiene or polymers thereof. ,Preferably,
Linolenic acid, methyl linolenate, tung oil, 1,3-hexadiene and 1,4-polybutadiene.
【０００７】この(Ｂ)成分の添加量は、上記の(Ａ)成分
１００重量部に対して０.０１〜５０重量部の範囲内と
なる量であり、好ましくは、０.１〜２０重量部の範囲
内となる量であり、特に好ましくは、０.１〜１０重量
部の範囲内となる量である。これは、(Ｂ)成分の配合量
が、上記範囲の下限未満である量であると、得られる硬
化性シリコーン組成物の硬化物に十分な艶消し性を付与
できなくなるからであり、一方、上記範囲の上限をこえ
る量であると、得られる硬化性シリコーン組成物の硬化
物の機械的特性が低下したりするからである。The component (B) is added in an amount of 0.01 to 50 parts by weight, preferably 0.1 to 20 parts by weight, per 100 parts by weight of the component (A). Parts by weight, particularly preferably in the range of 0.1 to 10 parts by weight. This is because if the amount of the component (B) is less than the lower limit of the above range, sufficient matting properties cannot be imparted to the cured product of the curable silicone composition to be obtained. If the amount exceeds the upper limit of the above range, the mechanical properties of the cured product of the curable silicone composition to be obtained may be reduced.
【０００８】(Ｃ)成分は本組成物の硬化剤であり、有機
過酸化物、あるいはオルガノハイドロジェンポリシロキ
サンと白金系触媒を選択し得る。(Ｃ)成分として有機過
酸化物を選択した場合には、得られる硬化性シリコーン
組成物は有機過酸化物硬化型となり、一方、オルガノハ
イドロジェンポリシロキサンと白金系触媒を選択した場
合には、ヒドロシリル化反応硬化型となる。The component (C) is a curing agent for the present composition, and can be selected from an organic peroxide or an organohydrogenpolysiloxane and a platinum-based catalyst. When an organic peroxide is selected as the component (C), the resulting curable silicone composition is of an organic peroxide curable type.On the other hand, when an organohydrogenpolysiloxane and a platinum-based catalyst are selected, It becomes a hydrosilylation reaction curing type.
【０００９】この有機過酸化物としては、ベンゾイルパ
ーオキサイド、ｐ−メチルベンゾイルパーオキサイド、
２，４−ジクミルパーオキサイド、２，５−ジメチル−
ビス（２，５−ｔ−ブチルパーオキシ）ヘキサン、ジ−
ｔ−ブチルパーオキサイド、ｔ−ブチルパーベンゾエー
トが例示される。この有機過酸化物の添加量は、上記
(Ａ)成分のオルガノポリシロキサン１００重量部に対し
て０.１〜５重量部の範囲内となる量であることが好ま
しい。As the organic peroxide, benzoyl peroxide, p-methylbenzoyl peroxide,
2,4-dicumyl peroxide, 2,5-dimethyl-
Bis (2,5-t-butylperoxy) hexane, di-
T-butyl peroxide and t-butyl perbenzoate are exemplified. The addition amount of the organic peroxide is as described above.
The amount is preferably in the range of 0.1 to 5 parts by weight based on 100 parts by weight of the organopolysiloxane (A).
【００１０】一方、オルガノハイドロジェンポリシロキ
サンは、一分子中に少なくとも２個のケイ素原子結合水
素原子を有するものであり、その分子構造としては、直
鎖状、分岐鎖状、環状が例示される。このようなオルガ
ノハイドロジェンポリシロキサンとしては、分子鎖両末
端がジメチルハイドロジェンシロキシ基で封鎖されたジ
メチルポリシロキサン、分子鎖両末端がジメチルハイド
ロジェンシロキシ基で封鎖されたジメチルシロキサン・
メチルハイドロジェンシロキサン共重合体、分子鎖両末
端がトリメチルシロキシ基で封鎖されたメチルハイドロ
ジェンポリシロキサン、環状メチルハイドロジェンシロ
キサン、環状ジメチルシロキサン・メチルハイドロジェ
ンシロキサン共重合体、式：(ＣＨ3)2ＨＳｉＯ1/2で表
されるシロキサン単位と式：ＳｉＯ4/2で表されるシロ
キサン単位とからなる共重合体が例示される。On the other hand, the organohydrogenpolysiloxane has at least two silicon-bonded hydrogen atoms in one molecule, and its molecular structure is exemplified by linear, branched and cyclic structures. . Examples of such an organohydrogenpolysiloxane include dimethylpolysiloxane in which both ends of a molecular chain are blocked with a dimethylhydrogensiloxy group, dimethylsiloxane in which both ends of a molecular chain are blocked with a dimethylhydrogensiloxy group,
Methyl hydrogen siloxane copolymer, methyl hydrogen polysiloxane in which both molecular chain terminals are blocked by a trimethylsiloxy group, cyclic methyl hydrogen siloxane, cyclic dimethyl siloxane / methyl hydrogen siloxane copolymer, Formula: (CH 3 ) Examples of the copolymer include a siloxane unit represented by 2 HSiO 1/2 and a siloxane unit represented by the formula: SiO 4/2 .
【００１１】このオルガノハイドロジェンポリシロキサ
ンの添加量は、上記(Ａ)成分のオルガノポリシロキサン
中のアルケニル基１モルに対して、本成分中のケイ素原
子結合水素原子が０.５〜１０モルとなる範囲内の量で
あることが好ましい。The amount of the organohydrogenpolysiloxane to be added is such that the silicon-bonded hydrogen atoms in the component are 0.5 to 10 mol per 1 mol of the alkenyl group in the organopolysiloxane of the component (A). It is preferable that the amount is within the range.
【００１２】また、白金系触媒としては、塩化白金酸、
塩化白金酸のアルコール化合物、白金のオレフィン錯
体、白金のアルケニルシロキサン錯体、白金のカルボニ
ル錯体が例示される。この白金系触媒の添加量は、上記
(Ａ)成分のオルガノポリシロキサンに対し、本組成物中
の白金金属が重量単位で０.１〜１,０００ppmの範囲内
となる量であることが好ましく、特に、これが１〜５０
０ppmの範囲内の量であることが好ましい。The platinum-based catalyst includes chloroplatinic acid,
Examples thereof include an alcohol compound of chloroplatinic acid, an olefin complex of platinum, an alkenylsiloxane complex of platinum, and a carbonyl complex of platinum. The amount of the platinum-based catalyst added is
The amount of the platinum metal in the present composition is preferably in the range of 0.1 to 1,000 ppm by weight, based on the organopolysiloxane of the component (A).
Preferably, the amount is in the range of 0 ppm.
【００１３】本組成物には、その他任意の成分として、
ヒュームドシリカ、沈降性シリカ、粉砕石英、酸化チタ
ン、酸化鉄、炭酸カルシウム、炭酸マグネシウム等の無
機質充填剤；カーボンブラック、ベンガラ等の顔料；そ
の他、耐熱性向上剤、反応制御剤、離型剤、可塑剤、増
感剤、重合禁止剤等を配合してもよい。[0013] In the composition, other optional components include:
Inorganic fillers such as fumed silica, precipitated silica, ground quartz, titanium oxide, iron oxide, calcium carbonate, and magnesium carbonate; pigments such as carbon black and red iron oxide; other heat resistance improvers, reaction control agents, and mold release agents , A plasticizer, a sensitizer, a polymerization inhibitor and the like.
【００１４】本組成物を調製する方法は限定されず、例
えば、(Ａ)成分、(Ｂ)成分、(Ｃ)成分、およびその他任
意の成分を２本ロール、バンバリーミキサー、ニーダー
ミキサー、プラネタリミキサー等の周知の混練装置を用
いて均一に混合する方法が挙げられる。また、本組成物
の用途は限定されないが、艶消しされた硬化物を形成す
ることができるので、ＬＥＤ等の表示装置の充填、ある
いは接着に好適に使用することができる。The method for preparing the present composition is not limited. For example, the components (A), (B), (C) and any other components may be mixed in two rolls, a Banbury mixer, a kneader mixer, a planetary mixer. And the like, using a well-known kneading apparatus. The use of the present composition is not limited, but it can form a matte cured product, so that it can be suitably used for filling or bonding a display device such as an LED.
【００１５】[0015]
【実施例】本発明の硬化性シリコーン組成物を実施例に
より詳細に説明する。なお、実施例中の粘度は２５℃に
おける値である。また、硬化物の艶消し性の度合いは、
硬化物の光沢度の測定(ＪＩＳ Ｚ ８７４１に規定す
る光沢度測定方法、測定角度６０°)により評価した。EXAMPLES The curable silicone composition of the present invention will be described in more detail with reference to examples. In addition, the viscosity in an Example is a value in 25 degreeC. Also, the degree of mattness of the cured product is
Evaluation was carried out by measuring the glossiness of the cured product (the glossiness measurement method specified in JIS Z8741 at a measurement angle of 60 °).
【００１６】［実施例１］ジメチルシロキサン単位９９
モル％、ジメチルビニルシロキシ単位１モル％からなる
粘度４００mPa・sのオルガノポリシロキサン１００重量
部、平均粒径５μｍの粉砕シリカ１００重量部を均一に
混合した後、塩化白金酸のイソプロピルアルコール溶液
(塩化白金酸の添加量は上記のジメチルポリシロキサン
に対して白金金属が０.００１重量％となる量)、粘度１
０mPa・sの分子鎖両末端ジメチルハイドロジェンシロキ
シ基封鎖ジメチルポリシロキサン１２重量部、粘度５mP
a・sの分子鎖両末端トリメチルシロキシ基封鎖ジメチル
シロキサン・メチルハイドロジェンシロキサン共重合体
(ジメチルシロキサン単位とメチルハイドロジェンシロ
キサン単位のモル比は３：５である。)１重量部、桐油
１.５重量部を混合して硬化性シリコーン組成物を調製
した。次に、この硬化性シリコーン組成物を８０℃で２
時間加熱することにより硬化させてゴム状の硬化物を形
成した。この硬化物を室温で１週間放置した後に、この
硬化物の光沢度を測定したところ、光沢度は０であっ
た。[Example 1] Dimethylsiloxane unit 99
100 parts by weight of an organopolysiloxane having a viscosity of 400 mPa · s and 100 parts by weight of pulverized silica having an average particle size of 5 μm consisting of 1% by mole of dimethylvinylsiloxy unit and 1% by mole of dimethylvinylsiloxy unit.
(The amount of chloroplatinic acid is 0.001% by weight of platinum metal with respect to the above dimethylpolysiloxane).
12 parts by weight of dimethylpolysiloxane blocked with dimethylhydrogensiloxy groups at both ends of molecular chain of 0 mPa · s, viscosity of 5 mP
Trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer at both ends of a ・ s molecular chain
(The molar ratio of dimethylsiloxane units to methylhydrogensiloxane units is 3: 5.) 1 part by weight and 1.5 parts by weight of tung oil were mixed to prepare a curable silicone composition. Next, the curable silicone composition was heated at 80 ° C. for 2 hours.
The composition was cured by heating for a time to form a rubber-like cured product. After leaving the cured product at room temperature for one week, the glossiness of the cured product was measured. As a result, the glossiness was 0.
【００１７】［比較例１］実施例１において、桐油を添
加しない以外は実施例１と同様にして硬化性シリコーン
組成物を調製した。この組成物を実施例１と同様に硬化
させ、その硬化物の光沢度を測定したところ、光沢度は
６０であった。Comparative Example 1 A curable silicone composition was prepared in the same manner as in Example 1 except that tung oil was not added. This composition was cured in the same manner as in Example 1, and the gloss of the cured product was measured. As a result, the gloss was 60.
【００１８】[0018]
【発明の効果】本発明の硬化性シリコーン組成物は、硬
化して、艶消し性に優れた硬化物を形成することができ
るという特徴がある。The curable silicone composition of the present invention is characterized in that it can be cured to form a cured product having excellent matting properties.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4J002 AC023 AC033 AE053 CP031 CP042 CP121 CP141 DE197 EA016 EE037 EF056 EH076 EK037 EK047 EK057 EK067 FD010 FD090 FD143 FD146 FD147 GJ01 4J040 BA172 CA032 CA052 EK031 EK042 EK091 FA012 FA022 HA096 KA16 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J002 AC023 AC033 AE053 CP031 CP042 CP121 CP141 DE197 EA016 EE037 EF056 EH076 EK037 EK047 EK057 EK067 FD010 FD090 FD143 FD146 FD147 GJ01 4J040 BA172 CA032 CA052 012
Claims (3)
分子中に少なくとも２個の脂肪族不飽和基を有し、(Ｃ)
成分の硬化剤がオルガノハイドロジェンポリシロキサン
と白金系触媒からなることを特徴とする、請求項１記載
の硬化性シリコーン組成物。2. The organopolysiloxane of component (A) has at least two aliphatic unsaturated groups in one molecule, and (C)
The curable silicone composition according to claim 1, wherein the component curing agent comprises an organohydrogenpolysiloxane and a platinum-based catalyst.
接着用としての硬化性シリコーン組成物。3. The display device according to claim 1 or 2, wherein:
A curable silicone composition for bonding.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24836998A JP3855040B2 (en) | 1998-09-02 | 1998-09-02 | Curable silicone composition |
| US09/384,354 US6297305B1 (en) | 1998-09-02 | 1999-08-27 | Curable silicone composition |
| EP99117063A EP0985710B1 (en) | 1998-09-02 | 1999-08-30 | Curable silicone composition |
| DE69911530T DE69911530T2 (en) | 1998-09-02 | 1999-08-30 | Curable silicone composition |
| TW89103375A TW555811B (en) | 1998-09-02 | 2000-02-25 | Curable silicone composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24836998A JP3855040B2 (en) | 1998-09-02 | 1998-09-02 | Curable silicone composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000080276A true JP2000080276A (en) | 2000-03-21 |
| JP3855040B2 JP3855040B2 (en) | 2006-12-06 |
Family
ID=17177084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24836998A Expired - Fee Related JP3855040B2 (en) | 1998-09-02 | 1998-09-02 | Curable silicone composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3855040B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000191915A (en) * | 1998-12-22 | 2000-07-11 | Dow Corning Corp | Composition for coating woven fabric |
| JP2005343984A (en) * | 2004-06-02 | 2005-12-15 | Kaneka Corp | Curable composition and semiconductor device encapsulated with the curable composition |
| JP2008120844A (en) * | 2006-11-08 | 2008-05-29 | Momentive Performance Materials Japan Kk | Silicone adhesive composition for optical semiconductor and optical semiconductor device using the same |
| JP2010529233A (en) * | 2007-05-30 | 2010-08-26 | ダウ・コーニング・コーポレイション | Silicone copolymers and silicone elastomers derived from natural oils |
| KR101094348B1 (en) * | 2004-05-04 | 2011-12-19 | 코오롱인더스트리 주식회사 | Thermal stable adhesive and adhesive tape coated it |
| US8142698B2 (en) | 2006-06-07 | 2012-03-27 | Shin-Etsu Chemical Co., Ltd. | Method for reducing a surface glossiness of an organopolysiloxane-cured article |
| JP2013533368A (en) * | 2010-08-09 | 2013-08-22 | ワッカー ケミー アクチエンゲゼルシャフト | Self-adhesive silicone elastomer |
| CN113698913A (en) * | 2021-10-15 | 2021-11-26 | 东莞天绘新材料有限公司 | Matte silicone rubber for silk screen printing and preparation method thereof |
-
1998
- 1998-09-02 JP JP24836998A patent/JP3855040B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000191915A (en) * | 1998-12-22 | 2000-07-11 | Dow Corning Corp | Composition for coating woven fabric |
| KR101094348B1 (en) * | 2004-05-04 | 2011-12-19 | 코오롱인더스트리 주식회사 | Thermal stable adhesive and adhesive tape coated it |
| JP2005343984A (en) * | 2004-06-02 | 2005-12-15 | Kaneka Corp | Curable composition and semiconductor device encapsulated with the curable composition |
| US8142698B2 (en) | 2006-06-07 | 2012-03-27 | Shin-Etsu Chemical Co., Ltd. | Method for reducing a surface glossiness of an organopolysiloxane-cured article |
| JP2008120844A (en) * | 2006-11-08 | 2008-05-29 | Momentive Performance Materials Japan Kk | Silicone adhesive composition for optical semiconductor and optical semiconductor device using the same |
| JP2010529233A (en) * | 2007-05-30 | 2010-08-26 | ダウ・コーニング・コーポレイション | Silicone copolymers and silicone elastomers derived from natural oils |
| JP2013533368A (en) * | 2010-08-09 | 2013-08-22 | ワッカー ケミー アクチエンゲゼルシャフト | Self-adhesive silicone elastomer |
| US8748553B2 (en) | 2010-08-09 | 2014-06-10 | Wacker Chemie Ag | Self-adhesive silicone elastomers |
| CN113698913A (en) * | 2021-10-15 | 2021-11-26 | 东莞天绘新材料有限公司 | Matte silicone rubber for silk screen printing and preparation method thereof |
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|---|---|
| JP3855040B2 (en) | 2006-12-06 |
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