JP2000068102A - Resistor - Google Patents

Abstract

(57) [Summary] [PROBLEMS] The present invention prevents thermal deterioration of other components mounted on the periphery and generation of solder cracks in a soldered portion even when a high power load is applied to a resistor. It is an object of the present invention to provide a resistor that can be used. A substrate 11 having a pair of through holes 12 and 13 penetrating upper and lower surfaces located at substantially equal intervals from an end,
The pair of through holes 12 and 13 and the pair of through holes 1
The substrate 11 passes through the lower surface of the central part of the substrate 11 sandwiched between the pair of through holes 12 and 13 and is sandwiched between the pair of through holes 12 and 13.
And a metal plate 16 provided along both end surfaces of the upper surface of the substrate excluding the central portion of the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a current detecting resistor for detecting a current value in an electronic circuit as a voltage value.

[0002]

2. Description of the Related Art A conventional resistor of this type is disclosed in Japanese Unexamined Patent Publication No.
What is described in -20802 is known.

[0003] A conventional resistor will be described below with reference to the drawings. FIG. 10A is a perspective view of a conventional resistor, and FIG. 10B is a sectional view of the same.

In FIGS. 10 (a) and 10 (b), reference numeral 1 denotes a resistor, which is provided with a pair of terminals 2 and 3 at both ends, and the resistor 1 and the pair of terminals 2 and 3 are integrally formed of the same metal. It is composed of Note that the resistor section 1 has a predetermined distance from the pair of terminal sections 2 and 3 in order to keep a distance from the mounting board surface. Reference numeral 4 denotes an insulating material provided so as to cover the periphery of the resistance portion 1, and has a function of protection and heat dissipation.

A method of manufacturing the conventional resistor having the above-described structure will be described below with reference to the drawings.

FIG. 11 is a process chart showing a conventional method for manufacturing a resistor. First, as shown in FIGS.
The resistance portion 1 is formed of metal having a predetermined resistance value, and the terminal portions 2 and 3 are formed at both ends of the resistance portion 1. The terminal portions 2 and 3 are bent downward with respect to the resistance portion 1 for surface mounting.

Finally, as shown in FIG. 11 (c), a conventional resistor is manufactured by coating an insulating material 4 around the resistor portion 1.

[0008]

In the conventional resistor configured as described above, when a high power load is applied to the resistor, the contact area between the resistor portion and the insulating material is small. The surface becomes very hot, and the temperature of the soldered portion of the resistor also becomes very high because the heated heat passes through the terminal portion at this time.

Therefore, there is a problem that other components mounted around the resistor are easily deteriorated by heat, and the reliability of the soldered portion is liable to be deteriorated due to a rise in temperature of the soldered portion.

The present invention solves the above-mentioned conventional problems. Even when a high power load is applied to a resistor, thermal degradation of other components mounted in the vicinity and reliability of a soldered portion are prevented. It is an object of the present invention to provide a resistor capable of preventing deterioration of the resistor.

[0011]

In order to achieve the above object, a resistor according to the present invention comprises: a substrate having a pair of through holes penetrating through upper and lower surfaces located at substantially equal intervals from an end; A metal plate provided so as to pass through a hole and a lower surface of a central portion of the substrate sandwiched between the pair of through holes and to extend along an upper surface of a substrate edge excluding a central portion of the substrate sandwiched between the pair of through holes; Accordingly, even when high power is applied, a resistor can be obtained that can prevent thermal deterioration of other components mounted on the periphery and deterioration of the reliability of the soldered portion.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, there is provided a substrate having a pair of through holes penetrating upper and lower surfaces located at substantially equal intervals from an end portion, the pair of through holes and the pair of through holes. A metal plate provided so as to pass along the lower surface of the central portion of the substrate sandwiched between the through holes and to extend along the upper surface of the substrate edge excluding the central portion of the substrate sandwiched between the pair of through holes. According to this configuration, since the metal plate passes through the pair of through holes, the lower surface of the central portion of the substrate sandwiched between the pair of through holes, and both end surfaces of the upper surface of the substrate, the entire metal plate is , Which increases the contact area between the metal plate and the substrate, so that the entire substrate can be effectively used for heat dissipation. Therefore, even when a high power load is applied to the resistor, the temperature rise on the resistor surface can be reduced, thereby preventing thermal degradation of other components mounted around the resistor, and furthermore,
This has the effect that the rise in the temperature of the soldered portion can be reduced, thereby preventing the reliability of the soldered portion from deteriorating.

According to a second aspect of the present invention, the upper surface of the central portion of the substrate sandwiched between the pair of through holes is made more convex than the surface obtained by adding the thickness of the metal plate to the upper surface of the substrate excluding the central portion of the substrate. According to this configuration, the entire metal plate is in contact with the substrate surface,
This increases the contact area between the metal plate and the substrate, and at the same time increases the volume of the substrate in contact with the entire metal plate, thereby improving heat dissipation. Therefore, even when a high power load is applied to the resistor, the temperature rise on the surface of the resistor can be reduced, thereby deteriorating the heat of other components mounted on the periphery and further reducing the temperature of the soldered portion. The rise can be reduced, thereby preventing the reliability of the soldered portion from deteriorating more effectively.In addition, the entire metal plate is in contact with the substrate surface, thereby increasing the contact area between the metal plate and the substrate. The thickness of the upper surface of the central portion is increased, so that the volume of the substrate is increased, thereby increasing the stability of the component adsorption property when the resistor is automatically mounted on the surface and improving the automatic mounting property.

According to a third aspect of the present invention, the lower surface of the central portion of the substrate sandwiched between the pair of through holes is recessed from the surface obtained by adding the thickness of the metal plate to the lower surface of the substrate excluding the central portion of the substrate. According to this configuration, since the distance between the lower surface of the central portion of the substrate and the mounting substrate sandwiched between the pair of through holes can be maintained, heat conduction from the resistor to the soldering portion is suppressed,
As a result, the reliability of the soldered portion is improved, it is possible to form a wiring pattern under the resistor body, and in addition to being compatible with high-density mounting, the volume of the board that the entire metal plate contacts is increased. , Heat dissipation is improved. Therefore, even when a high power load is applied to the resistor, the temperature rise on the surface of the resistor can be reduced, thereby deteriorating the heat of other components mounted on the periphery and increasing the temperature of the soldered portion. This has the effect of more effectively preventing the reliability of the soldered portion from deteriorating.

According to a fourth aspect of the present invention, the metal plate is provided integrally along the end surface and the lower surface of the end of the substrate except for the central portion of the substrate sandwiched between the pair of through holes. According to this configuration, the contact area between the metal plate and the substrate can be further increased, so that heat dissipation is improved. Therefore, even when a high power load is applied to the resistor, the temperature rise on the surface of the resistor can be reduced, thereby deteriorating the heat of other components mounted on the periphery and further reducing the temperature of the soldered portion. The rise can be reduced, thereby preventing the reliability of the soldered portion from deteriorating more effectively.In addition, since the terminal portion is provided on the end face or the lower surface of the board, the soldering area becomes large, This has the effect of improving the mountability on the mounting board.

According to a fifth aspect of the present invention, there is provided a substrate having a pair of through holes penetrating through upper and lower surfaces located at substantially equal intervals from an end portion, and being sandwiched between the pair of through holes and the pair of through holes. A metal plate that passes along the lower surface of the central part of the substrate and is provided along the upper surface of the substrate end excluding the central part of the substrate sandwiched between the pair of through holes, and the upper surface, the end surface, and It is composed of a metal cap provided so as to cover the lower surface and electrically connected to the metal plate, and according to this configuration, the portion in contact with the mounting board is not a metal plate but a metal cap, so that the mounting board The heat capacity of the contacting portion is increased, thereby further reducing the heat conduction from the resistor to the soldered portion, and has the effect of improving the reliability of the soldered portion.

According to a sixth aspect of the present invention, there is provided a substrate having a pair of through-holes penetrating upper and lower surfaces located at substantially equal intervals from an end portion, and being sandwiched between the pair of through-holes and the pair of through-holes. A metal plate passing through the lower surface of the central portion of the substrate and extending along the upper surface of the edge of the substrate excluding the central portion of the substrate sandwiched between the pair of through holes; and the upper surface, the end surface, and the lower surface of the edge of the substrate And a protective film provided on the surface of a metal plate passing through the lower surface of the central portion of the substrate sandwiched between the pair of through-holes. The metal plate that passes through the lower surface of the central portion of the substrate sandwiched between the through holes is exposed, but since a protective film is provided on the surface of the metal plate, the metal plate does not come into direct contact with air or moisture, thereby preventing the metal plate from being exposed. Since oxidation and corrosion can be suppressed, the resistance value does not change, Those having an effect of capable of improving the-reliability.

According to a seventh aspect of the present invention, the metal plate is made of an alloy containing any one of copper and nickel. According to this structure, the metal plate has heat resistance and specific resistance. Since it is made of a low alloy, it has an effect that a thermally stable low resistance value can be easily obtained.

According to an eighth aspect of the present invention, the metal cap is made of the same metal as the metal plate or an alloy containing either copper or nickel. Since the metal cap is made of an alloy having the same composition, the metal cap is made of an alloy having heat resistance and low specific resistance, so that it has an effect that a thermally stable low resistance value can be easily obtained. is there.

Embodiment 1 Hereinafter, a resistor according to Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1A is a perspective view of a resistor according to the first embodiment of the present invention, FIG. 1B is a sectional view of the same, and FIG.
FIG. 2 is a sectional view of the resistor shown in FIG.

In FIG. 1, reference numeral 11 denotes an insulating substrate, which is provided with a pair of first and second through holes 12 and 13 which are located at substantially equal intervals from an end portion penetrating the upper and lower surfaces.
It consists of ceramics containing up to 98%. In order to easily obtain the effect of suppressing the temperature rise on the resistor surface and the soldered portion, it is preferable to use a material having high thermal conductivity with alumina purity of 70% or more. Reference numerals 14 and 15 denote end portions of the first and second substrates, respectively, and the first and second through holes 12 and 1.
3 except for the central portion of the substrate 11 sandwiched between
1 outside. Reference numeral 16 denotes a metal plate made of copper nickel, nickel chromium, copper manganese nickel, or the like which integrally forms a resistance portion and a terminal portion to be soldered, and a first and a second through holes. Holes 12, 13
And the substrate 11 sandwiched between the first and second through holes 12 and 13.
The substrate is bent so as to pass along the lower surface of the central portion and to be along the upper surface and the ends and the lower surface of the substrate ends 14 and 15. As a result, the contact area between the metal plate and the substrate is increased, so that the entire substrate can be effectively used for heat dissipation, thereby increasing the temperature of the resistor surface even when a high power load is applied to the resistor. And the rise in the temperature of the soldered portion can be reduced, so that it is possible to prevent thermal degradation of other components mounted on the periphery and deterioration of the reliability of the soldered portion.

Further, as described above, the metal plate is connected to the substrate end portions 14,
Since they are provided on the end portions and the lower surface, the soldering area is increased, thereby improving the mountability on the mounting board.

Although FIGS. 1B and 1C show the case where the front and back surfaces of the resistor are inverted, the present invention can also be applied to bulk mounting when surface mounting is performed by an automatic mounting machine.

The method of manufacturing the resistor according to the first embodiment of the present invention having the above-described configuration will be described below with reference to the drawings.

FIG. 6 is a process chart showing a method of manufacturing the resistor according to the first embodiment of the present invention. First, as shown in FIG. 6A, a ceramic substrate 11 having a pair of through holes 12 and 13 penetrating through upper and lower surfaces located at substantially equal intervals from an end is manufactured. The first and second through holes 12 and 13 are formed in a square or elliptical shape by punching or the like in accordance with the width or thickness of the plate-shaped metal plate 16. The substrate 11 may be manufactured by punching or by firing a product formed by a mold.

Next, as shown in FIG.
6 is formed and processed into a U-shape by a press using a mold or the like so as to match the dimension between the pair of through holes of the substrate 11.

Next, as shown in FIG. 6C, a metal plate 16 bent in a U-shape is inserted into the first and second through holes 12 and 13 formed in the substrate 11. 16 from both ends.

Finally, as shown in FIG. 6D, the metal plate 16 is bent so as to be along the upper and lower surfaces of the first and second substrate ends 14 and 15.

Hereinafter, comparison of the surface temperature between the resistor according to the first embodiment of the present invention and the conventional resistor will be described.

FIG. 8 shows a size of 10 cm × 10 cm and 1.6 mm.
A resistor is mounted on a mounting board with a thickness of
It is the result of comparing and measuring the surface temperature of a resistor with a thermocouple by applying a voltage equivalent to power of 2 W. Here, FIG. 8 (a) shows the central part of the resistor surface, and FIG. 8 (b) shows the comparative measurement of the temperature of the soldered part of the resistor.

In the measurement of the surface temperature of the resistor shown in FIG. 8A, the temperature rise of the conventional product was reduced to 105 deg, while the temperature rise of the conventional product was 173 deg, and the temperature rise was reduced by about 40%.

Also, in the temperature rise measurement of the soldered portion in FIG. 8B, the temperature rise of the conventional product is reduced to 60 deg compared to 154 deg of the conventional product, and the temperature rise is reduced by about 60%. . As described above, the rise in the temperature of the soldered portion is reduced, so that the solder crack due to the thermal shock does not occur.

Of course, the effect of reducing the temperature rise of the resistor can also be obtained when the front and back surfaces of the resistor are inverted as shown in FIGS. 1 (b) and 1 (c).

In the first embodiment of the present invention, the metal plate is attached to the substrate ends 14, 1 in consideration of the mountability on the mounting substrate.
5 is bent along the upper surface, the end surface, and the lower surface. However, even if the metal plate is configured to extend only along the upper surfaces of the substrate end portions 14 and 15, the contact area between the metal plate and the substrate also increases. The heat dissipation is improved, and even when a high power load is applied to the resistor, it is possible to reduce a rise in the temperature of the resistor surface and a rise in the temperature of the soldered portion. However, at this time, since the upper surfaces of the substrate ends 14 and 15 serve as the terminal portions, there is no problem in the mountability on the mounting substrate.

(Embodiment 2) Hereinafter, a resistor according to Embodiment 2 of the present invention will be described with reference to the drawings.

FIG. 2 is a sectional view of the resistor according to the second embodiment of the present invention. In FIG. 2, first and second through holes 1
The point that the upper surface of the central portion of the substrate 11 sandwiched between the substrates 2 and 13 is more convex than the surface obtained by adding the thickness of the metal plate 16 to the upper surfaces of the substrate ends 14 and 15 is the structural diagram of the first embodiment. Unlike a certain FIG. 1, the other configuration and the manufacturing method are the same, so that the description is omitted, and the same reference numerals are given.

According to this configuration, the entire metal plate is in contact with the substrate surface, thereby increasing the contact area between the metal plate and the substrate, and at the same time, increasing the volume of the substrate in contact with the entire metal plate. Effective use of the resistor, even when a high power load on the resistor is applied,
Increased temperature on the resistor surface and soldered part can be reduced, which prevents thermal deterioration of other components mounted on the periphery and deterioration of reliability of the soldered part. In addition, the volume of the substrate is increased, whereby the stability of the component adsorption property when the resistor is automatically mounted can be improved, and the automatic mountability can be improved.

The temperature rise of the soldered portion is 56 de.
g, which is about 60% lower than the conventional product.

(Embodiment 3) Hereinafter, a resistor according to Embodiment 3 of the present invention will be described with reference to the drawings.

FIG. 3 is a sectional view of a resistor according to the third embodiment of the present invention. In FIG. 3, the first and second through holes 1
The point that the lower surface of the central portion of the substrate 11 sandwiched between the substrates 2 and 13 is more concave than the surface obtained by adding the thickness of the metal plate 16 to the lower surfaces of the substrate ends 14 and 15 is the structural diagram of the first embodiment. Unlike a certain FIG. 1, the other configuration and the manufacturing method are the same, so that the description is omitted, and the same reference numerals are given.

According to this structure, the distance between the lower surface of the central portion of the substrate and the mounting substrate, which is sandwiched between the pair of through holes, can be maintained, so that a wiring pattern can be formed under the resistor main body. Compatible with density mounting. Furthermore, the entire metal plate contacts the substrate surface, which increases the contact area between the metal plate and the substrate, and at the same time increases the volume of the substrate in contact with the entire metal plate, so that the entire substrate can be effectively used for heat dissipation. Even when a high-power load is applied to the resistor, the rise in the temperature of the resistor surface and the soldered part can be reduced, so that the thermal degradation of other components mounted around and the reliability of the soldered part In addition to preventing deterioration of the resistor, the thickness of the upper surface of the central portion of the substrate is increased, so that the volume of the substrate is increased. As a result, the stability of the component attraction when the resistor is automatically mounted is improved, and the automatic mountability can be improved.

The temperature rise at the soldered portion was 58 de.
g, which is about 60% lower than the conventional product.

Embodiment 4 Hereinafter, a resistor according to Embodiment 4 of the present invention will be described with reference to the drawings.

FIG. 4 is a sectional view of a resistor according to the fourth embodiment of the present invention. In FIG. 4, the components 11 to 16 have the same configuration as that of the first embodiment shown in FIG. Reference numerals 17 and 18 denote first and second metal caps, which are provided so as to cover the upper surface, the end surface, and the lower surface of the substrate end portions 14 and 15, respectively.
It is made of nickel chromium, copper manganese nickel, or the like, and a plating film of tin, solder, or the like is formed on the surface in advance.

FIGS. 6 and 7A show a process chart of a method of manufacturing the resistor according to the fourth embodiment of the present invention configured as described above.

Here, the first half of the method of manufacturing the resistor according to the fourth embodiment is the same as that of the first embodiment shown in FIGS. 6
(D) The subsequent steps will be described.

After the step of FIG. 6 (d) is completed, as shown in FIG. 7 (a), the first and second metal plates 16 made of copper nickel, nickel chromium, copper manganese nickel or the like are used.
The metal cap is provided by a method such as press-fitting or welding so as to cover the upper surface, the end surface, and the lower surface of the substrate ends 14, 15, and the fabrication is completed.

According to the above configuration, the portion in contact with the mounting board is not a metal plate but a metal cap, so that the heat capacity of the portion in contact with the mounting board is increased, whereby the heat conduction from the resistor to the soldered portion is reduced. It can be further reduced, and the reliability of the soldered portion is improved.

The temperature rise on the surface of the resistor according to the fourth embodiment of the present invention was measured, and the effect of reducing the temperature rise over the resistor according to the first embodiment of the present invention was confirmed. The reliability of the soldered portion was able to be ensured even for a long time of 10 times or more as compared with the resistor of the first embodiment.

Embodiment 5 Hereinafter, a resistor according to Embodiment 5 of the present invention will be described with reference to the drawings. FIG. 5 is a cross-sectional view of a resistor according to a fifth embodiment of the present invention, and FIGS. 5A and 5B show a state where the mounted state of the resistor is reversed.

In FIG. 5, since 11 to 16 have the same configuration as that of the first embodiment shown in FIG. 1, their description is omitted. Reference numeral 19 denotes a protective film provided on the surface of the metal plate 16 that passes through the lower surface of the central portion of the substrate 11 sandwiched between the pair of through holes 12 and 13.

FIGS. 6 and 7B show a process chart of the method of manufacturing the resistor according to the fifth embodiment of the present invention configured as described above.

Here, the first half of the method of manufacturing the resistor according to the fifth embodiment is the same as that of the first embodiment shown in FIGS. 6
(D) The subsequent steps will be described.

As shown in FIG. 7B, a pair of through holes 1
A protective film 19 is formed on the surface of the metal plate 16 passing through the lower surface of the central portion of the substrate 11 sandwiched between the substrates 2 and 13 by using a pattern printing method, a coating method using a dispenser, an evaporation method, or the like, and the fabrication is completed.

Regarding the above-mentioned protective film, a resin material containing alumina and silica powder or a resin material having a temperature of 200 ° C. or more is applied by a coating method so that insulation and heat resistance can be ensured even when applied on the surface of the resistor. A resin material such as high-melting glass having heat resistance is formed.

In the protective film deposition method, alumina or silica powder may be deposited to a thickness of 2 μm or more to secure insulation and heat resistance.

With the above structure, the metal plate passing through the lower surface of the central portion of the substrate sandwiched between the pair of through holes is exposed. However, since a protective film is provided on the surface of the metal plate, the metal plate is directly connected to the metal plate. Since air and moisture do not come into contact with the metal plate, thereby preventing oxidation and corrosion of the metal plate, the resistance value does not change, and the reliability of the resistor can be improved.

The temperature rise of the resistor according to the fifth embodiment of the present invention was also measured, and the effect of reducing the temperature rise similar to that of the resistor according to the first embodiment of the present invention was confirmed. Also in the test performed, the change in resistance value was able to be reduced to about 1/3 as compared with the resistor according to the first embodiment of the present invention.

In the first to fifth embodiments of the present invention, the metal plate 16 is passed through the through holes 12 and 13 provided in the substrate 11, but as shown in FIG. Notches 22, 23 are provided inside the ends 24, 25,
Even if the metal plate 26 is inserted into the notches 22 and 23 from the side of the resistor, the temperature rise of the resistor can be similarly reduced, and at the same time, the insertability into the substrate 21 is reduced even when the metal plate 26 is thin. It is possible to manufacture without making it.

[0061]

As described above, according to the present invention, there are provided a substrate having a pair of through holes penetrating the upper and lower surfaces located at substantially equal intervals from the end, the pair of through holes and the pair of through holes. A metal plate provided so as to pass along the lower surface of the central portion of the substrate and to extend along the upper surface of the end portion of the substrate excluding the central portion of the substrate sandwiched between the pair of through holes.
According to this configuration, since the metal plate passes through the pair of through holes and the lower surface of the central portion of the substrate sandwiched between the pair of through holes, and both end surfaces of the upper surface of the substrate, the entire metal plate contacts the substrate surface, This increases the contact area between the metal plate and the substrate, thereby improving heat dissipation. Therefore, even when a high power load is applied to the resistor, an advantageous effect that thermal degradation of other components mounted on the periphery and deterioration of the reliability of the soldered portion can be prevented can be obtained.

[Brief description of the drawings]

FIG. 1A is a perspective view of a resistor according to a first embodiment of the present invention. FIG.

FIG. 2 is a sectional view of a resistor according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a resistor according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a resistor according to a fourth embodiment of the present invention.

5A and 5B are cross-sectional views of a resistor according to a fifth embodiment of the present invention.

FIG. 6 is a process chart showing a method of manufacturing the resistor according to the first, fourth, and fifth embodiments of the present invention.

FIG. 7A is a process chart showing a second half of a method of manufacturing a resistor according to a fourth embodiment of the present invention; and FIG. 7B is a process chart showing a second half of a method of manufacturing a resistor according to a fifth embodiment of the present invention.

FIG. 8 (a) Comparison of the temperature rise on the surface of the resistor between the resistor according to the first embodiment of the present invention and the conventional resistor. (B) Comparison between the resistor according to the first embodiment of the present invention and the conventional resistor. Comparison chart of temperature rise of soldering part

9A is a perspective view of a resistor according to a modification of the first embodiment of the present invention, and FIG.

10A is a perspective view of a conventional resistor, and FIG.

FIG. 11 is a process chart showing a conventional method for manufacturing a resistor.

[Explanation of symbols]

 11, 21 Substrate 12 First through-hole 13 Second through-hole 14, 24 First substrate end 15, 25 Second substrate end 16, 26 Metal plate 17 First metal cap 18 Second metal Cap 19 Protective film 22, 23 Notch

Claims (8)

[Claims] 1. A substrate having a pair of through holes penetrating upper and lower surfaces located at substantially equal intervals from an end portion, a pair of the through holes, and a lower surface of a central portion of the substrate sandwiched between the pair of the through holes. And a metal plate provided along the upper surface of an end of the substrate except for a central portion of the substrate sandwiched between the pair of through holes. 2. The resistor according to claim 1, wherein an upper surface of a central portion of the substrate sandwiched between the pair of through holes is made more convex than a surface obtained by adding a thickness of a metal plate to an upper surface of the substrate excluding the central portion of the substrate. vessel. 3. The substrate according to claim 1, wherein the lower surface of the central portion of the substrate sandwiched between the pair of through-holes is recessed from a surface obtained by adding the thickness of the metal plate to the lower surface of the substrate excluding the central portion of the substrate. Resistors. 4. The resistor according to claim 1, wherein the metal plate is provided integrally along the end surface and the lower surface of the end of the substrate excluding the central portion of the substrate sandwiched between the pair of through holes. vessel. 5. A substrate having a pair of through holes penetrating upper and lower surfaces located at substantially equal intervals from an end portion, a pair of the through holes, and a lower surface of a central portion of the substrate sandwiched between the pair of the through holes. And a metal plate provided along the upper surface of the substrate end except for the central portion of the substrate sandwiched between the pair of through holes, and provided to cover the upper surface, the end surface, and the lower surface of the substrate end. A resistor comprising the metal plate and a metal cap electrically connected. 6. A substrate having a pair of through holes penetrating upper and lower surfaces located at substantially equal intervals from an end portion, a pair of the through holes, and a lower surface of a central portion of the substrate sandwiched between the pair of the through holes. A metal plate provided along the upper surface of the substrate end except for the central portion of the substrate sandwiched between the pair of through holes, and a metal provided to cover the upper surface, the end surface, and the lower surface of the substrate end A resistor comprising: a cap; and a protective film provided on a surface of a metal plate passing through a lower surface of a central portion of the substrate sandwiched between the pair of through holes. 7. The metal plate is made of an alloy containing one of copper and nickel.
The resistor as described. 8. The resistor according to claim 5, wherein the metal cap is made of the same metal as the metal plate or an alloy containing either copper or nickel.