JP2000068192A - Apparatus and method for exposure and method of detecting position - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily change the position of a position detector. SOLUTION: Position detectors 5, 105 fixed to a projection lens PL are capable of projecting spot lights approximately at the same time on four substrate marks PM formed at the four corners on a substrate P. For measuring the positions of the substrate marks PM, the existence of the substrate marks PM can be detected approximately at the same time. On a substrate holder of a substrate stage ST2 a larger substrate P' than the substrate P can be mounted wherein the position of the substrate mark PM on the substrate holder 38b also changes according to the size of the short side of the substrate P. To detect the four substrate marks PM, PM' at the four corners on the substrate P' at the same time, one position detector 105 is shifted by specified distance in a direction X perpendicular to the optical axis AX as an integrated unit and fixed so as to be apart from the projection lens PL. Thus the quick position detection can be made according to the size of the substrate P.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an exposure apparatus and method for projecting a circuit pattern of a mask onto a photosensitive substrate such as a liquid crystal glass substrate, and to a position detecting method used for these.

[0002]

2. Description of the Related Art In an exposure apparatus, a circuit pattern drawn on an original called a mask is printed on a resist layer such as a liquid crystal glass substrate through a projection lens and developed to form a resist pattern of a desired circuit. ing.

When printing a circuit pattern, a photosensitive substrate is preliminarily positioned with respect to a projection optical system and a mask based on a detection result obtained from a position detection device provided in an exposure device.

That is, prior to the projection of the circuit pattern onto the photosensitive substrate, the photosensitive substrate set on the moving stage is irradiated with a laser beam for position detection from the vertical direction. The position detection mark formed on the photosensitive substrate generates scattered light when irradiated with the position detection laser beam. Therefore, while moving the movable stage along the mounting surface, when the scattered light from the position detection mark is detected, the laser interferometer detects the position of the reflecting mirror provided on the movable stage. By reading the detection signal, the position of the photosensitive substrate on the moving stage can be detected.

[0005] For example, an exposure apparatus for a liquid crystal may include a plurality of position detection devices so that several position detection marks formed on a liquid crystal glass substrate can be simultaneously detected. In such a case, in order to shorten the position detection time, by aligning the positions of the positioning marks on the glass substrate with the arrangement of the plurality of position detection devices (that is, the irradiation position of the laser beam for position detection),
With one position detection operation, position information can be obtained from each position detection device almost simultaneously.

[0006]

However, in the above-described exposure apparatus, since the laser light source for generating the position detecting laser beam is a heat source, it is necessary to prevent the heat from adversely affecting the apparatus. The laser light source must be located in the temperature control chamber, on the leeward side, away from the imaging optical system for exposure and the position detecting device. for that reason,
From the laser light source to the position detection device, it is necessary to route the laser beam in a long optical path, and by changing the position of the position detection device according to the short side dimensions of the liquid crystal glass substrate, the position of the glass substrate placed on the moving stage is changed. In order to give a certain degree of freedom to the size, it was necessary to perform optical adjustment of the position detecting device again.

Accordingly, an object of the present invention is to provide an exposure apparatus and method capable of easily changing the position of a position detection device, and a position detection method used for the same.

[0008]

In order to solve the above problems, an exposure apparatus according to the present invention comprises a substrate stage (ST2) on which a photosensitive substrate (P) is mounted, and a mask (R) pattern (PA) on the photosensitive substrate. ), And a sensor unit (10) for detecting the position of the positioning pattern (PM) of the photosensitive substrate with respect to the optical axis (AX) of the projection optical system.
5) and a position change mechanism (72, 73, 171, 176, 177) provided on the support stand (33) for supporting the projection optical system or the projection optical system and changing the position of the sensor unit according to the position of the positioning pattern. ).

In a preferred embodiment, the sensor unit (105) is provided with driving means (176, 177, 178) for changing the position with respect to the projection optical system (PL).

In a preferred embodiment, the sensor unit (105) includes a light source (51a) and a position detecting optical system (51, 52) for irradiating the photosensitive substrate with light from the light source and detecting signal light from the substrate. , 53, 54, 55, 5
6).

In a preferred embodiment, the light source (51a)
And the position detection optical system (52, 53, 54, 55, 56) changes the position integrally with the projection optical system (PL).

In a preferred embodiment, the sensor unit (105) includes a light source (51a) and a position detecting optical system (5).
1, 52, 53, 54, 55, 56) and a heat insulating wall (51b).

In a preferred embodiment, the light source (51a)
However, a temperature controller (57) for controlling the temperature of the light source is provided.

In a preferred embodiment, the light source (51a)
Are covered with a heat insulating wall (51b).

An exposure apparatus according to another aspect of the present invention provides a substrate stage (ST2) on which a photosensitive substrate (P) is placed.
, A projection optical system (PL) for projecting a pattern (RP) of a mask (R) on a photosensitive substrate, and an optical axis (AX) of the projection optical system
A sensor unit (105) for detecting a positioning pattern (PM) of the photosensitive substrate with respect to the image sensor, and a position changing mechanism (72, 73, 171, 176) for moving the sensor unit in a direction perpendicular to the optical axis (AX) direction of the projection optical system. , 177).

Further, the exposure method of the present invention uses a plurality of positioning patterns (PM) of the photosensitive substrate (P) and a plurality of sensor units (5, 105) corresponding to the plurality of positioning patterns to form the photosensitive substrate and the photosensitive substrate. In an exposure method for positioning a projection optical system (PL) for projecting a mask pattern (PA) on a photosensitive substrate and exposing the mask pattern on the photosensitive substrate, a plurality of sensor units (5, 105) The interval is adjusted.

Further, the position detecting method according to the present invention provides a method for detecting a relative position between a positioning pattern (PM) of a photosensitive substrate (P) and a projection optical system (PL) for projecting a pattern (PA) of a mask (R) onto the photosensitive substrate. Sensor unit (10
In the position detection method for performing position detection using the method (5), the position of the sensor unit is changed according to the position of the positioning pattern.

According to another aspect of the present invention, there is provided a position detecting method, comprising: a first and a second positioning mark provided on a substrate; and a first positioning mark corresponding to the first positioning mark. In a position detecting method for detecting a plurality of positioning marks using a sensor unit (5) and a second sensor unit (105) corresponding to the second positioning mark,
The distance between the first and second sensor units (5, 105) is adjusted according to the distance between the first and second positioning marks.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An exposure apparatus according to one embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus of the embodiment. The exposure apparatus includes an illumination system 2 for uniformly illuminating the reticle R on which the pattern PA is formed, a reticle stage ST1 on which the reticle R illuminated by the illumination system 2 is mounted, and a pattern PA on the reticle R formed of a liquid crystal. A projection lens PL for projecting onto a substrate P made of a manufacturing glass plate, a substrate stage ST2 which is an XY stage on which the substrate P can be mounted and relatively moved with respect to the projection lens PL, and a substrate stage ST2 Control system 4 for controlling the movement of the projection lens PL and the substrate stage ST
An alignment control system 6 for performing alignment between the two, and a main control device 8 for integrally controlling these are provided.

Although not shown, the illumination system 2 includes a light source for generating illumination light, a beam expander for converting the shape of a light beam from this light source, an integrator optical system for performing uniform illumination, and a light beam diameter. A reticle R is illuminated under desired conditions by providing an aperture stop, a condenser lens group, and the like for limiting the illumination light and making the illumination light incident on the reticle R via the mirror 21.

The reticle stage ST1 has a stage control system (not shown) for controlling the movement of the reticle stage ST1. Note that a reticle alignment detection system 31 is arranged above reticle stage ST1. The reticle alignment detection system 31 is provided with a reticle mark RM for alignment formed on the reticle R.
And a reference mark FM arranged on the substrate stage ST2 and an alignment substrate mark PM formed on the substrate P.
Is an alignment sensor that can adjust the position of the lens through the projection lens PL.

The projection lens PL is one-side telecentric on both sides or the substrate side, and the projection magnification from the reticle R onto the substrate P is, for example, equal. Note that the lens barrel of the projection lens PL is fixed to a support 33 extending from the main body of the exposure apparatus. Further, a substrate mark PM on the substrate P and a substrate stage S are provided below the lens barrel of the projection lens PL.
In order to detect the reference mark FM on T2, a pair of position detection devices 5 and 105 are attached.

The substrate stage ST2 includes a stage driving unit 3
7 to move two-dimensionally in the XY plane together with the substrate P, and also to move in the Z direction. Note that a focus detection system 35 is disposed above the substrate stage ST2 and on the side of the projection lens PL, and stores information regarding an image forming state when the pattern PA on the reticle R is projected on the substrate P. To detect.

The stage control system 4 controls the stage driving section 37 based on an instruction from the alignment control system 6 and the main control device 8 to move the substrate stage ST2 two-dimensionally in the XY plane to a suitable position. , And also moved in the Z direction so that the image of the pattern PA on the reticle R can be focused on the substrate P via the projection lens PL.

The alignment control system 6 drives the reticle alignment detection system 31 and the position detection devices 5 and 105, transmits an instruction corresponding to a detection signal from these to the stage control system 4, Then, the positioning operation between the reticle R and the substrate P is performed.

The procedure of alignment and exposure in the apparatus shown in FIG. 1 will be described below. First, baseline measurement is performed for the position detection devices 5 and 105. That is, the reference mark FM provided on the substrate stage ST2
Are detected by the position detection devices 5 and 105, and the reference mark FM and the reticle mark RM on the reticle R are
Detection is performed by a reticle alignment detection system 31 arranged above the reticle R. And these two detection results,
Based on the output of the interferometer for detecting the position of the substrate stage ST2, the base line amounts of the position detecting devices 5 and 105 are determined. The measurement of the baseline amount may be performed when the baseline can fluctuate due to mechanical vibration or the like, and need not be performed for each alignment. Note that the position detection devices 5, 1 and
The relative positional relationship between the lens 05 and the projection lens PL is obtained. Next, the substrate P is pre-aligned in advance by a pre-alignment device (not shown) and the substrate stage S
It is placed on T2. A band-like spot light from the position detection devices 5 and 105 is irradiated onto the substrate mark PM, and scattered light generated from the substrate mark PM is detected to detect the substrate mark P.
Measure the position of M. By this measurement, the position of the substrate mark PM with respect to the position detection devices 5 and 105 (indirectly, the position of the substrate mark PM with respect to the optical axis AX of the projection lens PL) can be monitored. The stage driving unit 37
In accordance with an instruction from the stage control system 4, the substrate P is moved to an arbitrary exposure region by moving the substrate stage ST2 based on the measured position of the substrate mark PM, and exposure is sequentially repeated. Finally, it is determined whether or not the reticle R is replaced to expose another pattern. When it is not necessary to replace the reticle R, the procedure from the alignment except for the above-described baseline measurement is repeated. When exchanging the reticle and further performing exposure, the reticle R is exchanged, and then the above-described baseline measurement is started.

FIG. 2 is a perspective view for explaining the arrangement and structure of the position detecting device 5. Each position detecting device 5, 105
It has almost the same structure. That is, each of the position detection devices 5 and 105 is provided with a laser light source device 5 for generating a laser beam for alignment in a chamber 50 made of a heat insulating material.
1, a plurality of reflection mirrors 52 and half mirrors 53 for guiding a laser beam from a laser light source device 51 to an appropriate position, a polarizing beam splitter 54 for polarizing a laser beam to be vertically incident on a substrate P in a spot shape, Wave plate 55 disposed between splitter 54 and substrate P
And a detector unit 56 for detecting scattered light from the substrate mark PM on the substrate P illuminated by the spot light. Here, the reflection mirror 52, the half mirror 53, the polarization beam splitter 54, the wave plate 5
The detector 5 and the detector unit 56 constitute a detection optical system. The detection output from the detector 56 is output to the main control device 8 shown in FIG. A cooling device 57 for cooling the internal laser light source device 51 is disposed above the chamber 50 covering the position detection devices 5 and 105.

Below the position detecting devices 5 and 105, a substrate stage ST2 movable in the X-axis direction and the Y-axis direction is disposed. The upper part of the substrate stage ST2 is a stage table part 38a, and the upper part is a substrate holder 38b for sucking the substrate P. Driving motors 37a and 37b are arranged on two orthogonal sides of the substrate stage ST2, respectively.
7a and 37b are driven by a signal from the drive control circuit 37c to move the stage table section 38a two-dimensionally. Note that the drive motors 37a and 37b and the drive control circuit 37c constitute the stage drive unit 37 shown in FIG.

A reflection mirror 38e (only one is shown) is mounted on the stage table section 38a along two orthogonal sides, and a laser interferometer (not shown) is arranged opposite to these. Has been established. Among these laser interferometers, for example, the interferometer facing the reflection mirror 38e irradiates the reflection mirror 38e with the laser beam LA to thereby position the substrate stage ST2 (specifically, the stage table section 38a) in the X-axis direction. (Or the amount of movement), and outputs the result to main controller 8 shown in FIG.

The position detection devices 5 and 105 are fixed to the projection lens PL, and can project a spot light almost simultaneously on four substrate marks PM formed at four corners on the substrate P. When measuring the position of the substrate mark PM, the spot light is moved on the substrate mark PM while scanning the substrate stage ST2 in the X-axis direction and the Y-axis direction. In this case, since the distance between the spot light from the position detection devices 5 and 105 and the distance between the substrate marks PM are matched, the position detection devices 5 and 105 use the substrate marks PM.
By monitoring the scattered light generated from the substrate mark, the presence / absence of the substrate mark PM can be detected almost simultaneously at four places, and quick position detection becomes possible.

On the substrate holder 38b of the substrate stage ST2, a substrate (two-dot chain line) larger than the substrate P shown by the solid line
P 'can be placed. In this case, the substrate mark P corresponds to the size of the short side of the substrate P.
The position of M on the substrate holder 38b also changes. Therefore, the four substrate marks P formed at the four corners on the substrate P ′
One of the position detecting devices 105 is moved and fixed by a predetermined amount in the X direction perpendicular to the optical axis AX so that one of the position detecting devices 105 is separated from the projection lens PL as an integral unit so that M and PM ′ can be simultaneously detected (2). (See the position of the dotted line.) As a result, the space between the two units 5 and 105 is set to the substrate mark P
It is possible to correspond to the interval between M and PM ′, and quick position detection according to the size of the substrate P becomes possible.

FIG. 3 shows details of the internal structure of the position detecting device 105 shown in FIG. 2, and explains a method of cooling the laser light source device 51. The laser light source device 51 includes a cooling shield 51b as a heat insulating wall around the main body portion 51a.
Is provided. A hole 51c through which a cooling fluid passes is penetrated inside the cooling shield 51b. Both ends of the hole 51c are
The cooling device 57 is connected to the cooling device 57 via a heat-insulating cooling pipe 59, and the cooling fluid is constantly circulated through the hole 51c. The cooling device 57 can monitor the temperature of the cooling fluid, and circulates the cooling fluid to the hole 51c while controlling the power so that the inside of the chamber 50 becomes the set temperature. For example, when it is determined that an abnormality has occurred in the operation of the cooling device 57, such as a sudden rise in the temperature of the warm cooling fluid,
Main controller 8 stops the operation of the exposure apparatus. Also,
A temperature sensor 58 is attached to an appropriate structure near the cooling shield 51b of the laser light source device 51 in case an abnormality of the cooling device 57 cannot be found for some reason. The temperature sensor 58 is connected to the main control device 8, and when the temperature near the laser light source device 51 is out of the set temperature range, the main control device 8 stops the operation of the exposure device.

FIG. 4 is a diagram for explaining a method of fixing the position detecting devices 5 and 105. A pair of projecting members 71 and 72 fixed to the lens barrel are formed on the outer circumference of the lens barrel of the projection lens PL. The position detecting devices 5 and 105 are fixed to the lower side of the overhang members 71 and 72, respectively. The position detecting device 5 includes four bolts 73 attached to the overhanging member 71.
Is fastened to the projecting member 71 while being positioned with respect to the optical axis AX of the projection lens PL. The other position detecting device 105 also has the overhanging member 7 constituting the position changing mechanism.
The two bolts 73 attached to the projection lens 2 are fastened to the extension member 72 while being positioned with respect to the optical axis AX of the projection lens PL. The latter position detection device 105
By loosening all the bolts 73, the bolts 73 can be removed from the overhanging member 72. Further, four screw holes 75 into which bolts 73 can be screwed are formed separately on the overhanging member 72. By screwing the bolts 73 into these screw holes 75, the position detecting device 105 can be connected to the projection lens PL.
Can be moved to a position more distant from the optical axis AX and fixed. That is, the substrate mark P formed on the substrate P
The interval between the two position detection devices 5 and 105 can be easily changed according to the interval of M.

Further, if the fixing screw of the position detecting device is removed, the projecting member is prevented from dropping, and although not shown in the drawing, a guide for shifting the position is attached to the projecting member. Changing the positions of the detection devices 5 and 105 can be easily performed by moving the detection devices along the guides. Further, the exact position of the position detecting device when it is moved can be obtained from the relative positional relationship of the position change by measuring the position of the reference mark provided on the substrate stage ST2.

FIG. 5 is a diagram showing a modification of the position changing method of the position detecting device 105 shown in FIG. Projection lens PL
The overhanging member 172 fixed to the lens barrel of
And a vertical portion 172b and are formed in an L-shape.
A slide guide 179 is provided on the lower surface of the horizontal portion 172a, so that the position detecting device 105 can smoothly reciprocate in the X direction perpendicular to the optical axis of the projection lens PL. A motor 176 as a driving unit is fixed outside the vertical portion 172b. A screw shaft 177 is connected to the rotation shaft of the motor 176, and the position detection device 10
5 is screwed into a nut 178 fixed within. If the amount of rotation is controlled by controlling the motor 176, the position detecting device 105 can be appropriately moved to the position in the X direction perpendicular to the optical axis of the projection lens PL and fixed there.

In FIG. 4, the position detecting device 105 has a movable structure. However, the projecting member 71 of the position detecting device 5 has the same structure as that of the projecting member 72, so that the position detecting device 5 The interval can be changed freely.

As is clear from the above description, in the exposure apparatus of the above embodiment, since the laser light source device 51 is disposed in the position detection devices 5 and 105, the optical path is shortened and the position detection optical system has a simple structure. It can be.

Further, the position detecting device 105 is
Since it is housed inside and can be easily moved as a sensor unit, optical adjustment in the position detecting device 105 is not required, and the laser light source device 51 and the position detecting optical system are maintained on the substrate P while maintaining a relative positional relationship. It is possible to easily cope with a change in the interval between the substrate marks PM to be detected.

Although the present invention has been described in connection with the actual embodiment, the present invention is not limited to the above embodiment. For example, the position detecting devices 5 and 105
There is no need to fix the projection lens PL to the support base 33 for fixing the projection lens PL. The mounting position of the position detection device 105 with respect to the support base 33 can be changed.

In the above embodiment, the position detecting device 1
Although only 05 is movable with respect to the projection lens PL, the position detection device 5 can also be movable with respect to the projection lens PL.

Further, it is not always necessary to arrange the cooling device 57 around the chamber 50, and the laser light source device 51 may be cooled by the cooling device 57 provided outside the exposure device. At this time, by forming the cooling pipe 59 from a flexible material, the movement of the position detecting device 105 is simplified, and workability is improved.

[0043]

As is apparent from the above description, according to the exposure apparatus of the present invention, the position changing mechanism is provided on the support base or the projection optical system that supports the projection optical system, and is provided at the position of the positioning pattern. Since the position of the sensor unit is changed accordingly, quick position detection in response to a change in the position of the positioning pattern or the like becomes possible.

Further, according to a preferred embodiment, since the sensor unit is provided with a driving means for changing the position with respect to the projection optical system, the position of the positioning pattern can be easily changed.
Workability is improved.

According to a preferred embodiment, the sensor unit includes the light source and the position detecting optical system for irradiating the light from the light source to the photosensitive substrate and detecting the signal light from the substrate. The system can be easily and precisely moved as a set, and quick and precise position detection can be performed according to a change in the position of the positioning pattern.

According to a preferred mode, the light source and the position detecting optical system change their positions integrally with respect to the projection optical system. Therefore, even if the position of the sensor unit is changed, the light source and the position detecting optical system are changed. There is no need to perform alignment again, and the position detection accuracy can be easily maintained.

Further, according to a preferred embodiment, since the sensor unit has a heat insulating wall between the light source and the position detecting optical system, it is possible to prevent the heat generation of the light source from affecting the position detecting optical system and to improve the alignment accuracy. The optical path length from the light source to the position detection optical system can be easily shortened.

Further, according to a preferred embodiment, since the light source is provided with a temperature control device for controlling the temperature of the light source, it is possible to prevent the heat of the light source from being transmitted into and out of the sensor unit and adversely affecting the operation accuracy of the exposure device. Can be prevented.

Further, according to the preferred embodiment, since the light source is covered with the heat insulating wall, the heat of the light source can be prevented from being released to the surroundings, and the operation accuracy of the exposure apparatus can be maintained. it can.

According to another aspect of the present invention, there is provided an exposure apparatus including a position changing mechanism for moving a sensor unit in a direction orthogonal to an optical axis direction of a projection optical system. Rapid position detection can be performed in response to changes in exposure conditions, substrate size, and the like.

According to the exposure method of the present invention, the interval between the plurality of sensor units is adjusted in accordance with the interval between the plurality of positioning patterns. Rapid position detection according to the size and the like becomes possible.

Further, according to the position detecting method of the present invention, the position of the sensor unit is changed according to the position of the positioning pattern, so that quick position detection can be performed in response to the position change of the positioning pattern.

According to the position detecting method according to another aspect of the present invention, the distance between the first and second sensor units is adjusted according to the distance between the first and second positioning marks. Further, quick position detection according to the interval between the second positioning marks, that is, the size of the substrate placed on the substrate stage, and the like can be performed.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a structure of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating the position detection device of FIG.

FIG. 3 is a diagram illustrating details of a position detection device in FIG. 2;

FIG. 4 is a diagram illustrating a method of fixing the position detection device of FIG.

FIG. 5 is a diagram illustrating a modification of the fixing method of FIG. 4;

[Description of Signs] 2 Illumination system 4 Stage control system 5 Position detection device 6 Alignment control system 8 Main control device 31 Reticle alignment detection system 33 Support base 37 Stage drive unit 50 Chamber 51 Laser light source device 51a Main unit 51b Cooling shield 51c Hole 57 Cooling device 58 Temperature sensor 59 Cooling pipe 71, 72 Overhang member 73 Bolt 75 Screw hole AX Optical axis P, P 'Substrate PL Projection lens PM Substrate mark R Reticle RM Reticle mark ST1 Reticle stage ST2 Substrate stage

Claims (11)

[Claims] A substrate stage on which a photosensitive substrate is placed; a projection optical system for projecting a mask pattern onto the photosensitive substrate; and a sensor for detecting a position of a positioning pattern of the photosensitive substrate with respect to an optical axis of the projection optical system. An exposure unit comprising: a unit; a support table that supports the projection optical system; or a position change mechanism that is provided on the projection optical system and that changes the position of the sensor unit according to the position of the positioning pattern. apparatus. 2. The exposure apparatus according to claim 1, wherein the sensor unit includes a driving unit that changes a position with respect to the projection optical system. 3. The sensor unit according to claim 1, further comprising: a light source; and a position detecting optical system that irradiates the photosensitive substrate with light from the light source and detects signal light from the substrate. 3. The exposure apparatus according to 1 or 2. 4. The exposure apparatus according to claim 3, wherein the light source and the position detection optical system change positions integrally with respect to the projection optical system. 5. The exposure apparatus according to claim 3, wherein the sensor unit includes a heat insulating wall between the light source and the position detection optical system. 6. The exposure apparatus according to claim 3, wherein the light source includes a temperature controller for controlling a temperature of the light source. 7. The exposure apparatus according to claim 3, wherein the light source is covered with a heat insulating wall. 8. A substrate stage for mounting a photosensitive substrate, a projection optical system for projecting a mask pattern onto the photosensitive substrate, and a sensor unit for detecting a positioning pattern of the photosensitive substrate with respect to an optical axis of the projection optical system. An exposure apparatus, comprising: a position changing mechanism that moves the sensor unit in a direction orthogonal to an optical axis direction of the projection optical system. 9. Positioning the photosensitive substrate and a projection optical system for projecting a mask pattern onto the photosensitive substrate using a plurality of positioning patterns of the photosensitive substrate and a plurality of sensor units corresponding to the plurality of positioning patterns, An exposure method for exposing the mask pattern on a photosensitive substrate, comprising: adjusting an interval between the plurality of sensor units according to an interval between the plurality of positioning patterns. 10. A positioning method for detecting a position by using a sensor unit for detecting a relative position between a positioning pattern of a photosensitive substrate and a projection optical system for projecting a pattern of a mask onto the photosensitive substrate, wherein the position is determined according to the position of the positioning pattern. And changing the position of the sensor unit. 11. A first and a second positioning mark provided on a substrate, a first sensor unit corresponding to the first positioning mark, and a second sensor unit corresponding to the second positioning mark. In the position detecting method for detecting the plurality of positioning marks by using, the distance between the first and second sensor units is adjusted according to the distance between the first and second positioning marks. Method.