JP2000058586A - Solder ball installer and method for installation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a filling failure of a metal paste with requiring no proprietary metal paste feeder. SOLUTION: In a method for installing a solder ball 3 of a larger diameter than a diameter of a concave section for forming a solder bump to an electrode 17 at a bottom of a concave section 16a, a metal paste 6 is coated beneath of the solder ball 3 and the metal paste 6 coated on the solder ball 3 is attached on the concave section 16a through an alignment of the solder ball 3 to the concave section 16a. To securely attach the metal paste 6 to the electrode 17 at the bottom of the concave section 16a, the solder ball 3 is once moved away from and moved again to the concave section 16a, for instance, moved back and forth in a vertical and horizontal direction. This enables the metal paste 6 to fill into the concave section 16a securely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus and method for mounting solder balls for forming solder bumps.

[0002]

2. Description of the Related Art As a method of forming solder bumps on a work such as an electronic component or a substrate, a method using a solder ball is known. In this method, a solder ball is mounted on an electrode of a work, and the solder ball is melted by heating and soldered to the electrode. A solder paste containing solder particles in a flux is applied to the joint between the solder ball and the electrode in order to improve the bondability. As a method of applying at this time, a method of applying a solder paste to the lower end portion of the solder ball in advance, a method of transferring the solder paste to the electrode surface with a pin, and the like are used.

[0003]

However, depending on the type of electronic component, a solder bump may be formed on a concave portion provided on an insulating layer covering an electrode such as a TAB tape.
In such a case, since the solder ball for forming the bump is electrically connected to the electrode formed at the bottom of the concave portion to perform solder joining, it is necessary to fill the inside of the concave portion with the above-mentioned solder paste.

[0004] However, since the solder paste is an adhesive paste-like material, it is not easy to fill the recesses evenly. In particular, with the increase in the density of electronic components, the opening diameter of the recess has become smaller than the diameter of the solder ball and the size of the transfer pin, so that it is more difficult to fill the recess with the solder paste. A good method of filling the solder paste by printing into the recesses using a stencil mask can achieve good filling of the solder paste.However, this method requires a solder paste printing apparatus, which increases equipment costs and increases the number of steps. It is not preferable because of complication. Then, if soldering is performed while the filling of the solder paste is incomplete, there is a problem that the solder bumps are not satisfactorily formed due to the inferior joining with the electrode surface.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a solder ball mounting apparatus and a mounting method capable of performing satisfactory filling of a metal paste.

[0006]

In the solder ball mounting apparatus according to the present invention, since a solder bump is formed on an electrode at the bottom of a recess formed in a work, a solder having a size larger than an opening dimension of the recess is formed. A solder ball mounting device for mounting a ball in the concave portion, a work holding portion for holding a work with a surface on which the concave portion is formed facing upward, a solder ball supply portion for supplying a solder ball, A suction head that sucks and holds the solder balls of the ball supply unit; a metal paste supply unit that shapes the liquid surface of the metal paste to be flat; and suction that moves the suction head to suction the solder balls from the solder ball supply unit. Operation, an adhering operation of adhering the metal paste of the metal paste supply unit to the lower surface of the solder ball, and applying the solder ball coated with the metal paste to the work holding unit. A suction head moving means for causing the suction head to perform each of the mounting operations of mounting the held work in the concave portion, and an operation of once moving the solder ball away from the concave portion and then approaching again during the mounting operation. And a controller for controlling the suction head moving means so as to perform the operation.

According to a second aspect of the present invention, there is provided a method for mounting a solder ball.
In order to form a solder bump on an electrode at the bottom of a recess formed in a work, a solder ball mounting method of mounting a solder ball having a size larger than the opening dimension of the recess in the recess is provided. A first step of applying a metal paste, a second step of aligning a solder ball with the recess, and attaching a metal paste attached to the solder ball to an upper surface of the recess, and applying the metal paste to the recess. A step of once moving the solder ball away from the recess and then approaching it again at least once in order to attach the solder ball to the electrode.

According to a third aspect of the present invention, there is provided a method of mounting a solder ball.
3. The method of mounting a solder ball according to claim 2, wherein the third step includes an operation of vertically moving the solder ball.

According to a fourth aspect of the present invention, there is provided a method of mounting a solder ball.
3. The method for mounting a solder ball according to claim 2, wherein the third step includes an operation of moving the solder ball in a horizontal direction.

According to a fifth aspect of the present invention, there is provided a method for mounting a solder ball.
3. The method of mounting a solder ball according to claim 2, wherein in the third step, after moving the solder ball upward,
An operation of lowering the concave portion to a position off the center of the concave portion is included.

According to a sixth aspect of the present invention, there is provided an apparatus for mounting a solder ball,
A solder ball mounting apparatus for mounting a solder ball having a size larger than an opening dimension of the concave portion in the concave portion to form a solder bump on an electrode at the bottom of the concave portion formed in the work, wherein the concave portion is formed. A work holding unit for holding a work with its surface facing upward, a solder ball supply unit for supplying a solder ball, a suction head for suction holding the solder ball of the solder ball supply unit and mounting the solder ball in a recess, and a metal paste. A metal paste supply unit for shaping the liquid surface flat, a transfer head having a plurality of transfer pins having a lower end portion having a size larger than the opening dimension of the concave portion and attaching the metal paste to the lower end portion, A transfer head moving means for moving the transfer head to perform an attaching operation for attaching the metal paste of the metal paste supply unit to the concave portion of the substrate held by the work holding unit; When, and a control unit for controlling the transfer head moving means so as to the operation to close again after away once from the recesses of the transfer pin during the attachment operation performed at least once.

[0012] A method for mounting a solder ball according to claim 7 is as follows.
A method of mounting a solder ball, in which a solder ball having a size larger than the opening dimension of the concave portion is formed in the concave portion in order to form a solder bump on an electrode at the bottom of the concave portion formed in the work, comprising: A first step of attaching a metal paste to the lower end of a transfer pin having a lower end having a larger size, and a metal paste applied to the transfer pin by aligning the transfer pin with a recess of the work. A second step of adhering the transfer pin to the upper surface of the recess, and an operation of once moving the transfer pin away from the recess and then approaching the same again in order to attach the metal paste to the electrode at the bottom of the recess. 3 steps,
Mounting a solder ball in the concave portion to which the metal paste has adhered.

[0013] The method of mounting a solder ball according to claim 8 is as follows.
8. The method for mounting a solder ball according to claim 7, wherein the third step includes an operation of moving the solder ball in a vertical direction.

According to a ninth aspect of the present invention, there is provided a method for mounting a solder ball,
8. The method for mounting a solder ball according to claim 7, wherein the third step includes an operation of moving the solder ball in a horizontal direction.

According to a tenth aspect of the present invention, there is provided the method of mounting a solder ball according to the seventh aspect, wherein in the third step, after the solder ball is moved upward, the center of the recess is formed. The operation includes a lowering operation to a position out of the range.

According to the eleventh aspect of the present invention, in order to form a solder bump on an electrode at the bottom of a concave portion formed in a work, a solder ball having a size larger than an opening size of the concave portion is mounted in the concave portion. A work holding unit for holding a work with the surface having the concave portion facing upward, a solder ball supply unit for supplying the solder ball, and a liquid surface of the metal paste which is flattened. A metal paste supply unit for shaping, a transfer head including a plurality of transfer pins having a lower end portion having a size smaller than the opening dimension of the concave portion, and attaching a metal paste to the lower end portion and transferring the metal paste to the electrode; And a suction head for sucking and holding the solder ball of the solder ball supply unit and mounting the solder ball in a recess having an electrode to which a metal paste is transferred.

According to the solder ball mounting method of the present invention, since a solder bump is formed on the bottom electrode of the recess formed in the work, a solder ball having a size larger than the opening dimension of the recess is mounted in the recess. Applying a metal paste to the lower end of a transfer pin having a lower end smaller in size than the opening of the recess, and positioning the transfer pin in the recess of the work. Transferring the metal paste adhered to the transfer pin to the electrode at the bottom of the recess, and holding the solder ball of the solder ball supply unit by the suction head to transfer the metal paste to the recess. And mounting the device on a substrate.

According to the first to tenth aspects of the present invention, the operation of moving the solder ball or the transfer pin once away from the recess and then approaching it again at least once is performed. According to this, by using the transfer pin having the lower end portion having a size smaller than the opening size of the concave portion, the concave portion can be filled with the metal paste satisfactorily.

[0019]

(Embodiment 1) FIG. 1 is a front view of a solder ball mounting apparatus according to Embodiment 1 of the present invention, and FIG.
2A is a cross-sectional view of the electronic component, FIG. 2B is an enlarged cross-sectional view of the same solder bump, and FIGS. 3A, 3B, 3C, and 3C.
(D) and (e) are process explanatory views of the method of mounting the solder ball, and FIGS. 4, 5 and 6 are explanatory views of the mounting operation of the solder ball.

First, the structure of the solder ball mounting device will be described with reference to FIG. In FIG. 1, a solder ball supply unit 1
In the container 2, a large number of solder balls 3 are stored.
A metal paste supply unit 4 is provided on a side of the solder ball supply unit 1. The metal paste supply unit 4 includes a container 5 having a flat bottom surface, and a metal paste 6 is applied to the bottom surface of the container 5. The container 5 is provided with a squeegee unit 8 having a squeegee 7, and the squeegee unit 8 is provided with a belt 9 adjusted between pulleys 10 and 11.
Is joined to. By driving the motor 12 to rotate the pulley 11, the squeegee unit 8 moves horizontally, and the squeegee 7 shapes the metal paste 6 flat on the bottom surface of the container 5 by this horizontal movement. Thereby, the metal paste 6 is applied on the bottom surface of the container 5 with a constant thickness t. Here, the metal paste 6 is a flux or resin containing conductive particles such as solder, gold, silver, and aluminum.

A work holding unit 20 is provided beside the metal paste supply unit 4. The work holding unit 20 has a holding table 21, and the holder 22 of the holding table 21 holds the electronic component 15 as a work.
Here, the electronic component 15 will be described with reference to FIG.

As shown in FIG. 2A, the electronic component 15 is obtained by mounting a semiconductor element 18 on a substrate 16 made of polyimide or glass epoxy (FR-4) and sealing it with a resin layer 19. . A wire 18 is provided on the lower surface of the substrate 16.
An electrode 17 connected to the semiconductor element 18 by a is provided, and a through hole 16 a is provided at the position of the electrode 17. The through hole 16a is formed on the substrate 16 with the electrode 17 as the bottom.
(Hereinafter referred to as a concave portion 16a). The electronic component 15 is held by the work holding portion 20 with the concave portion 16a facing upward. Then, a solder ball 3 having a size larger than the opening dimension of the concave portion 16a is mounted on the concave portion 16a, and the solder ball 3 is melted by heating and joined to the electrode 17. That is, the solder ball 3 is mounted on the concave portion 16a, and the solder ball 3 is heated and melted, so that the solder bump 3 'is formed on the electrode 17 at the bottom of the concave portion 16a as shown in FIG.

Referring again to FIG. 1, the solder ball supply unit 1,
Absorption head 30 is arranged above metal paste supply unit 4 and work holding unit 20. The suction head 30 includes a lifting mechanism 32, and a suction tool 31 is mounted on a lower end of the lifting mechanism 32. By suctioning the inside of the suction tool 31 by vacuum using a suction means (not shown),
The solder ball 3 is vacuum-sucked in a suction hole provided on the lower surface of the suction tool 31. The suction head 30 is a bracket 3
The nut 3 is coupled to a nut 34, and a feed screw 35 held by a frame 37 is screwed into the nut 34. Further, the frame 37 is connected to a Y-axis table 38 driven by a Y-axis motor 39.

Therefore, by controlling the X-axis motor 36, the Y-axis motor 39, and the elevating mechanism 32 by the control unit 40, the suction head 30 can be connected to each of the solder ball supply unit 1, the metal paste supply unit 4, and the work holding unit 20. Is moved in the X direction, the Y direction (the direction perpendicular to the paper surface of FIG. 1) and the Z direction, and the solder ball 3 is sucked from the solder ball supply unit 1. The attaching operation of attaching the metal paste 6 of the supply unit 4 and the attaching operation of attaching the solder ball 3 to the concave portion 16a of the electronic component 15 can be performed.

That is, the lifting mechanism 32, the nut 34, the feed screw 35, the X-axis motor 36, the frame 37, the Y-axis table 38, and the Y-axis motor 39 constitute suction head moving means. In the mounting operation of the solder ball 3 by the suction head 30, the control unit 40 controls the suction head moving means, so that the solder ball 3 can perform a predetermined operation. Various operation patterns are input to the control unit 40 by the setting unit 41.

The solder ball mounting apparatus is configured as described above, and a method for mounting the solder balls will be described below with reference to FIG. In FIG. 3A, the suction head 30 is moved by the suction head moving means to the solder ball supply unit 1.
By moving it up and down there,
The solder ball 3 is vacuum-sucked on the lower surface of the suction tool 31 and picked up. Thereafter, as shown in FIG. 3B, the suction head 30 is moved above the metal paste supply unit 4.

Next, as shown in FIG. 3C, a suction tool 31 is applied to the metal paste 6 applied to the bottom of the container 5.
The metal paste 6 adheres to the lower surface of the solder ball 3 by transfer by raising and lowering the solder ball 3 held in the first step (first step). Thereafter, the suction head 30 moves above the work holding unit 20, and as shown in FIG.
The electronic component 15 held by the holder 22 of the holding table 21 is aligned. Meanwhile, in the metal paste supply unit 4, the metal paste 6 is shaped by moving the squeegee unit 8 horizontally.

Then, the suction head 30 is moved up and down to bring the solder balls 3 with the metal paste 6 into contact with the substrate 16 of the electronic component 15 as shown in FIG. 6 is attached to the upper surface of the concave portion 16a (second step). In FIG. 3E, the metal paste 6 is drawn on the surface of the substrate 16 for simplicity, but is mounted on a concave portion 16a provided on the substrate 16 as described below in detail. You.

Next, the mounting operation of the solder ball 3 when mounting the solder ball 3 in the recess 16a will be described with reference to FIGS. The purpose of these operations is to promote the filling of the solder ball 3 with the metal paste 6 in order to satisfactorily fill the concave portion 16a with a small opening size with the metal paste 6 having high adhesiveness and difficult to fill the narrow gap. It is to be done in.

First, the operation shown in FIG. 4 will be described. FIG. 4A shows a state where the solder ball 3 having the lower surface coated with the metal paste 6 is held by the suction tool 31 and positioned on the concave portion 16 a of the substrate 16. Thereafter, by lowering the suction tool 31, the metal paste 6 adhered to the solder ball 3 is adhered to the upper surface of the concave portion 16a as shown in FIG. Next, as shown in FIG. 4C, the suction tool 31 is raised, and the solder ball 3 is separated from the metal paste 6 attached to the upper surface of the concave portion 16a.
Then, as shown in FIG. 4D, a portion of the metal paste 6 rises while adhering to the solder ball 3, and as a result, the recess 16a is formed.
The metal paste 6 adhering to the solder ball 3 is gathered at the center of the recess 16a by being pulled by the solder ball 3, and is eventually separated into a portion remaining on the recess 16a and a portion attached to the solder ball 3 to be separated. At this time, the shape of the separated portion is a conical shape with vertices facing each other.

Next, when the solder ball 3 is lowered again,
As shown in FIG. 4E, the metal paste 6 adhered to the solder balls 3 is collected on the concave portion 16a, and the metal paste 6 which tends to hang down into the concave portion 16a due to fluidity is further pressed down. As a result, the metal paste 6 is pushed into the recess 16a and is filled well, and the metal paste 6 adheres to the electrode 17 at the bottom of the recess 16a. Then, in this state, the vacuum suction by the suction tool 31 is released and the suction tool 31 is raised, so that the solder ball 3 is mounted on the concave portion 16a filled with the metal paste 6, as shown in FIG. . That is, FIG. 4 shows a process of once moving the solder ball 3 away from the recess 16a and then approaching it again at least once in order to attach the metal paste 6 to the electrode 17 at the bottom of the recess 16a (third process). 3) shows an example in which the solder ball 3 is moved only vertically in the recess 16a in this operation. By the operation of moving the solder ball 3 in the vertical direction, the metal paste 6 adhered on the concave portion 16a is collected at the center of the concave portion 16a and pushed into the bottom thereof. This operation is performed at least once, and the actual number of times is
Is determined by trial in accordance with the properties of the concave portion 16a and the shape of the concave portion 16a. The direction in which the solder ball 3 is moved up and down is the concave portion 1.
It may be obliquely upward from 6a.

Next, another operation example performed for the same purpose as the above operation will be described with reference to FIG. In FIG. 5, the steps up to FIGS. 5A and 5B are the same as the example shown in FIG. Here, as shown in FIG. 5B, the solder ball 3 is slightly moved in the horizontal direction from the state where the metal paste 6 is adhered on the concave portion 16a. At this time, the metal paste 6
Has already entered the concave portion 16a, and as shown in FIG. 5C, a considerable portion is located in the concave portion 16a and is in a hanging state.

When the solder ball 3 is horizontally moved in the opposite direction from this state, as shown in FIG.
As a result, the metal paste 6 brought toward the center of the recess 16a pushes down the metal paste 6 already located in the recess 16a in the recess 16a. As shown in FIG.
By repeating the operation shown in (d) a predetermined number of times, the metal paste 6 is sequentially brought into the recess 16a by the solder ball 3, and the metal paste 6 is filled in the recess 16a as shown in FIG. 17 adhere to the upper surface. FIG.
(F) shows the same state as FIG. 4 (F). That is, in the operation shown in FIG. 5, in order to attach the metal paste 6 to the electrode 17 at the bottom of the concave portion 16a, the solder ball 3 is once moved away from the concave portion 16a in the horizontal direction, and then is made to approach again at least once. (3rd step), which includes an operation of moving the solder ball in the horizontal direction.

Next, another example of the operation performed for the same purpose will be described with reference to FIG. In FIG.
(A), (B) and (C) are shown in FIGS.
This is the same operation as (d). Thereafter, as shown in FIG. 6D, the solder ball 3 is horizontally moved by a small distance corresponding to the width of the metal paste, and then lowered. Thereby, the metal paste 6 is moved toward the center of the concave portion 16a by the spherical portion on the lower surface of the solder ball 3, and
The metal paste 6 already located on the concave portion 16a in FIG. 6C is pushed down into the concave portion 16a.

Next, as shown in FIG. 6E, the solder ball 3 is raised, moved horizontally in the opposite direction by the same distance, and then lowered again. Thereby, the metal paste 6 is further moved toward the center of the concave portion 16a, and by repeating this operation, the metal paste 6 adheres to the electrode 17 at the bottom of the concave portion 16a. FIG. 6F shows a state in which the metal paste 6 is filled in the recess 16a in this manner.
(G) shows a state where the mounting of the solder ball 3 is completed. That is, the operation shown in FIG.
This operation is performed at least once after moving away from the center of the recess 6a at least once (third step). After moving the solder ball 3 upward, the solder ball 3 is lowered to a position off the center of the concave portion. .

In any of the operations shown in FIGS. 4 to 6, the metal paste 6 attached to the upper surface of the concave portion 16a is effectively pushed into the concave portion 16a by causing the solder ball 3 to perform the above-described operation. The recess 16a is filled and adheres to the bottom electrode 17. The operation performed in the third step is not limited to the above three operations, and may be a combination of these operations.

The electronic component 15 having the solder balls 3 mounted on the recesses 16a through the above steps is sent to the reflow step. Here, by being heated to a temperature equal to or higher than the melting point of the solder, the solder ball 3 is melted and soldered to the upper surface of the electrode 17 at the bottom of the concave portion 16a. At this time, since the metal paste 6 is well filled in the recess 16a in the previous step and is in contact with the surface of the electrode 17, the solder film 3 and the oxide film on the surface of the electrode 17 are removed at the time of soldering. ,
Good solder bonding is performed. When the solder ball 3 is melted, the molten solder surely reaches the surface of the electrode 17 and wets the surface due to the presence of the conductive particles in the metal paste 6 in the concave portion 16a. A good solder bump 3 ′ (see FIG. 2B) having excellent strength is formed on the electrode 17 of the concave portion 16 a.

(Embodiment 2) FIG. 7 is a front view of a solder ball mounting apparatus according to Embodiment 2 of the present invention.
(B), (c), (d), (e), and (f) are process explanatory diagrams of the solder ball mounting method, FIG. 9 is a partially enlarged view of a transfer pin of the solder ball mounting device, FIG. FIG. 11 is an explanatory diagram of a coating operation by the transfer pin.

First, a solder ball mounting device will be described with reference to FIG. In FIG. 7, the solder ball supply unit 1
The work holding part 20 is arranged on the side of the work holding part 20, and the metal paste supply part 4 is arranged on the side of the work holding part 20. The solder ball supply unit 1, the work holding unit 20, and the metal paste supply unit 4 are the same as those in the first embodiment shown in FIG. However, Embodiment 2 is different in that the work holding unit 20 is located at the center.

Above the solder ball supply unit 1, the work holding unit 20, and the metal paste supply unit 4, a head moving means similar to that in the first embodiment is provided.
The suction head 30 is attached to the bracket 33 of the head moving means.
And a transfer head 42 is mounted. Suction head 3
0 and the transfer head 42 move integrally in the horizontal direction. Here, the suction head 30 is the same as that in the first embodiment. The transfer head 42 includes a plurality of transfer pins 44.
And a lifting mechanism 46 for lifting and lowering the transfer tool 43.

Elevating mechanism 46, nut 34, feed screw 3
5, X-axis motor 36, frame 37, Y-axis table 3
8. The Y-axis motor 39 constitutes a transfer head moving means. By controlling the transfer head moving means by the control unit 40, the transfer pin 44 can perform a predetermined operation. With the transfer tool 43 positioned on the metal paste supply unit 4, the transfer pins 44 are lowered to come into contact with the metal paste 6 applied to the container 5, and then the transfer pins 44 are raised. Has a metal paste 6 adhered to the lower end thereof.

The solder ball mounting apparatus is configured as described above, and a method for mounting the solder balls will be described below. First, in FIG. 8A, the transfer head moving means is driven to position the transfer head 42 on the metal paste supply unit 4. At this time, the suction head 30 that moves simultaneously
Are located on the work holding unit 20. Next, FIG.
The transfer tool 43 is moved down as shown in
4 is brought into contact with the bottom surface of the container 5 to which the metal paste 6 has been applied, and then the transfer tool 43 is raised. As a result, the metal paste 6 adheres to the lower end of the transfer pin 44 by transfer (first step).

Thereafter, as shown in FIG. 8C, the head moving means is driven to position the transfer head 42 on the work holding unit 20 and the suction head 30 on the solder ball supply unit 1. Then, the transfer pins 44 are aligned with the concave portions 16 a provided on the substrate 16 of the electronic component 15. Next, FIG.
As shown in (d), the transfer tool 43 is lowered to attach the metal paste 6 attached to the lower end of the transfer pin 44 onto the concave portion 16a of the substrate 16 (second step). Concurrently with this operation, the suction tool 31 is moved up and down with respect to the solder ball supply unit 1 and vacuum-sucked from the suction tool 31, whereby the solder ball 3 is picked up on the lower surface of the suction tool 31 by vacuum suction. At this time, in the metal paste supply unit 4, the squeegee unit 8 is horizontally moved to shape the surface of the metal paste 6.

Next, as shown in FIG. 8E, the head moving means is driven again to move the suction head 30 to the work holding section 20.
The solder ball 3 held on the suction tool 31 is positioned on the concave portion 16a to which the metal paste 6 is attached. Next, the suction tool 31 is lowered to release the vacuum suction, so that the solder ball 3 is mounted on the concave portion 16a to which the metal paste 6 has adhered.

Next, the transfer of the metal paste 6 to the recess 16a by the transfer pin 44 will be described with reference to FIGS. As shown in FIG. 9, the transfer pin 44 is
a having a lower end portion 44a having a size larger than the opening size of a.
The shape of the lower end portion 44a is substantially spherical. By bringing the lower end portion 44a into contact with the metal paste 6 applied to the metal paste supply section 4, the lower end portion 44a is provided with the metal paste 6 in the same manner as in the case of attaching the metal paste 6 to the solder balls 3 in the first embodiment. 6 adheres.

FIG. 10 shows an operation performed by the transfer pin 44 in order to fill the recess 16a with the metal paste 6 and adhere it to the electrode 17 at the bottom of the recess 16a, that is, to temporarily move the transfer pin 44 away from the recess 16a. After that, the operation of approaching again (third step) is described. FIG.
In the example shown in FIG. 4, the same operation as the operation by the solder ball 3 shown in FIG. 4 in the first embodiment is applied to the metal paste 6, and the states shown in FIGS. This corresponds to FIGS.

FIG. 10 shows an example in which the transfer pins are moved up and down during the above operation. In the first embodiment, the transfer pins 44 correspond to the operations shown in FIGS. 5 and 6, respectively. Including an operation of moving the transfer pin 44 in the horizontal direction, or after moving the transfer pin 44 upward,
An example including an operation of descending to a position deviated from the center of 6a can also be used as the intended operation. In each of these examples, the same effect as in the case of filling the metal paste 6 into the recess 16a using the solder ball 3 in the first embodiment can be obtained.

Further, as shown in FIG.
By using a material having a lower end 45a having a size smaller than the opening dimension of the recess 16a, the metal paste 6 can be favorably filled in the recess 16a. That is, as shown in FIG. 11A, the metal paste 6 is adhered to the lower end 45a of the transfer pin 45, and is aligned with the concave portion 16a. Then, as shown in FIG.
5, the lower end 45a is inserted into the recess 16a.

As a result, the metal paste 6 attached to the transfer pin 45 is pushed into the recess 16a, and the lower end 45a
Is directly attached to the surface of the electrode 17 at the bottom of the concave portion 16a. Thereafter, by raising the transfer pin 45, the metal paste 6 is satisfactorily supplied into the recess 16a as shown in FIG. 11C.

The solder balls 3 are mounted on the recesses 16a to which the metal paste 6 has been attached in this way, and then sent to reflow, where the solder balls 3 are melted by heating to form solder bumps 3 '. Is the same as in the first embodiment.

As described above, as a method of supplying the metal paste 6 onto the electrode formed on the bottom in the recess 16a, the transfer by the solder ball 3 or the transfer pins 44 and 45 is adopted, and the metal paste 6 is transferred into the recess 16a. An operation for better filling of the solder balls 3 and the transfer pins 44 and 45 is performed.
Therefore, it is possible to efficiently mount the solder balls for forming the solder bumps without separately providing a metal paste supply step into the concave portion 16a by a dedicated device. In addition, since the supply of the metal paste into the concave portion 16a is ensured, a solder bump having excellent solder bonding properties and a good shape can be formed.

[0052]

According to the present invention, the solder ball or the transfer pin to which the metal paste is attached is once moved away from the recess at least once, or the lower end portion is smaller than the opening dimension of the recess. Since the transfer pins having the following configuration are used, the concave portion is filled with the metal paste satisfactorily, and the mounting of the solder balls for forming the solder bumps is efficiently performed without separately providing a metal paste supply step using a dedicated device. be able to.

[Brief description of the drawings]

FIG. 1 is a front view of a solder ball mounting device according to a first embodiment of the present invention.

2A is a cross-sectional view of an electronic component according to the first embodiment of the present invention. FIG. 2B is an enlarged cross-sectional view of a solder bump according to the first embodiment of the present invention.

FIG. 3A is a process explanatory view of a solder ball mounting method according to the first embodiment of the present invention. FIG. 3B is a process explanatory view of a solder ball mounting method according to the first embodiment of the present invention. Process description diagram of the solder ball mounting method of the first embodiment (d) Process description diagram of the solder ball mounting method of the first embodiment of the present invention (e) Solder ball mounting method of the first embodiment of the present invention Process description diagram

FIG. 4 is an explanatory diagram of a mounting operation of a solder ball according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram of a solder ball mounting operation according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram of a mounting operation of the solder ball according to the first embodiment of the present invention.

FIG. 7 is a front view of a solder ball mounting device according to a second embodiment of the present invention;

FIG. 8A is a process explanatory view of a solder ball mounting method according to a second embodiment of the present invention. FIG. 8B is a process explanatory view of a solder ball mounting method according to a second embodiment of the present invention. Process description diagram of the solder ball mounting method of the second embodiment (d) Process description diagram of the solder ball mounting method of the second embodiment of the present invention (e) Method of mounting the solder ball of the second embodiment of the present invention (F) Process explanatory diagram of the solder ball mounting method according to the second embodiment of the present invention

FIG. 9 is a partially enlarged view of a transfer pin of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 10 is an explanatory diagram of a coating operation using a transfer pin according to the second embodiment of the present invention.

11A is a diagram illustrating a coating operation using a transfer pin according to a second embodiment of the present invention. FIG. 11B is a diagram illustrating a coating operation using a transfer pin according to the second embodiment of the present invention. Explanatory drawing of the coating operation by the transfer pin of mode 2

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball supply part 3 Solder ball 4 Metal paste supply part 6 Metal paste 15 Electronic component 16 Substrate 16a Depression 30 Suction head 31 Suction tool 32 Elevating mechanism 34 Nut 35 Feed screw 36 X axis motor 38 Y axis table 39 Y axis motor 40 Control unit 42 Transfer head 44 Transfer pin 45 Transfer pin

Claims (12)

[Claims] 1. A solder ball mounting apparatus for mounting a solder ball having a size larger than an opening dimension of a concave portion in the concave portion to form a solder bump on an electrode at a bottom of the concave portion formed in the work, A work holding unit for holding the work with the surface having the concave portion formed facing upward, a solder ball supply unit for supplying a solder ball, a suction head for suction holding the solder ball of the solder ball supply unit, and a metal paste A metal paste supply unit for flattening the liquid surface of the solder ball, a suction operation for moving the suction head to suction the solder ball from the solder ball supply unit, and a metal paste of the metal paste supply unit on the lower surface of the solder ball. And a mounting operation of mounting a solder ball coated with a metal paste in a concave portion of a work held by the work holding portion. A suction head moving means for causing the suction head to perform, and a control unit for controlling the suction head moving means so as to perform at least once an operation of once moving the solder ball away from the recess and then approaching it again during the mounting operation. A mounting device for a solder ball, comprising: 2. A method of mounting a solder ball, wherein a solder ball having a size larger than an opening dimension of the concave portion is mounted in the concave portion in order to form a solder bump on an electrode at a bottom of the concave portion formed in the work. A first step of attaching a metal paste to the lower surface of the solder ball, and a second step of aligning the solder ball with the concave portion to attach the metal paste to the upper surface of the concave portion.
Mounting the solder ball at least once by moving the solder ball away from the recess and then approaching the solder ball again at least once in order to attach the metal paste to the electrode in the recess. Method. 3. The method for mounting a solder ball according to claim 2, wherein the third step includes an operation of vertically moving the solder ball. 4. The method of claim 2, wherein the third step includes an operation of moving the solder ball in a horizontal direction. 5. The mounting of a solder ball according to claim 2, wherein in the third step, an operation of moving the solder ball upward and then lowering the solder ball to a position deviated from the center of the concave portion is included. Method. 6. A solder ball mounting apparatus for mounting a solder ball having a size larger than an opening dimension of a concave portion in the concave portion to form a solder bump on an electrode at a bottom of the concave portion formed in the work, A work holding portion for holding the work with the surface having the concave portion formed facing upward, a solder ball supply portion for supplying a solder ball, and a suction device for suction holding the solder ball of the solder ball supply portion and mounting the solder ball in the concave portion A head, a metal paste supply unit for flattening the liquid surface of the metal paste, and a plurality of transfer pins having a lower end having a size larger than the opening dimension of the concave portion and attaching the metal paste to the lower end. A transfer head, and a transfer for moving the transfer head to perform an attaching operation of attaching the metal paste of the metal paste supply unit to the concave portion of the substrate held by the work holding unit. And a control unit for controlling the transfer head moving means so as to perform at least once an operation of once moving the transfer pin away from the concave portion and then approaching the transfer pin again at the time of the attaching operation. Solder ball mounting device. 7. A method for mounting a solder ball, wherein a solder ball having a size larger than an opening dimension of the concave portion is mounted in the concave portion in order to form a solder bump on an electrode at a bottom of the concave portion formed in the work. A first step of attaching a metal paste to the lower end of the transfer pin having a lower end portion having a size larger than the opening dimension of the concave portion, and positioning the transfer pin in the concave portion of the work to form the transfer pin; At least one of a second step of attaching the attached metal paste to the upper surface of the recess and an operation of once moving the transfer pin away from the recess and then approaching again to attach the metal paste to the electrode at the bottom of the recess. 3. A method for mounting a solder ball, comprising: a third step of rotating the solder ball; and a step of mounting a solder ball in the concave portion to which the metal paste is attached. 8. The method according to claim 7, wherein the third step includes an operation of moving the transfer pin in a vertical direction. 9. The method of claim 7, wherein the third step includes an operation of moving the transfer pin in a horizontal direction. 10. The solder ball according to claim 7, wherein in the third step, an operation of moving the transfer pin upward and then lowering the transfer pin to a position deviated from the center of the recess is included. Mounting method. 11. A solder ball mounting apparatus for mounting a solder ball having a size larger than an opening dimension of a concave portion in the concave portion to form a solder bump on an electrode at the bottom of the concave portion formed in the work, A work holding unit that holds the work with the surface having the concave portion facing upward, a solder ball supply unit that supplies a solder ball, a metal paste supply unit that shapes a liquid surface of the metal paste to be flat, and the concave portion A transfer head including a plurality of transfer pins for attaching a metal paste to the lower end and transferring the solder paste to the electrodes, and a suction head for holding the solder balls of the solder ball supply unit. And a suction head mounted on a concave portion having an electrode to which a metal paste is transferred. 12. A method of mounting a solder ball, wherein a solder ball having a size larger than an opening dimension of the concave portion is mounted in the concave portion in order to form a solder bump on an electrode at the bottom of the concave portion formed in the work. A step of applying a metal paste to the lower end of the transfer pin having a lower end having a size smaller than the opening dimension of the recess, and applying the metal paste to the transfer pin by aligning the transfer pin with the recess of the work. Transferring the metal paste to the electrode at the bottom of the concave portion, and mounting the solder ball of the solder ball supply section by suction with a suction head and mounting the solder ball in the concave portion having the electrode to which the metal paste is transferred. Characteristic solder ball mounting method.