JP2000049015A - Inductor array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure to maximum, a pattern area allowed at an individual internal conductor by allowing the internal conductor connected to at least a pair of adjoining external terminal electrodes among a plurality of external ones to be allocated in a lamination direction through an insulating layer and an intermediate conductor layer. SOLUTION: A plurality of external terminal electrodes 18 constitute external terminal electrodes 18a-18d, comprising one pair respectively. A plurality of internal conductors 13 constituting a coil comprise internal conductors 13a-13d, comprising one pair respectively, electrically connected through the conductor material filling a through hole 12. The internal conductors 13a-13d and the external terminal electrodes 18a-18d are electrically connected, and the internal conductors 13a and 13b, 13b and 13c, and, 13c and 13d electrically connected to the adjoining external terminal electrodes 18a and 18b, 18b and 18c, and, 18c and 18d are all allocated in lamination direction through an insulating layer 15 and an intermediate conductor layer 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor array used for various electronic devices.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become lighter and thinner, the demand for smaller and higher-density component parts has become even more severe. In particular, the market needs for inductor arrays that can be reduced in size and increased in density by housing multiple elements on the same substrate are rapidly increasing.

Hereinafter, this type of conventional inductor array will be described with reference to the drawings.

FIG. 13 is a perspective view of a conventional inductor array, and FIG. 14 is an exploded perspective view of the inductor array.

In FIGS. 13 and 14, reference numeral 1 denotes a first magnetic sheet made of ferrite having through holes 2 filled with a conductive material such as Ag. Reference numeral 3 denotes a second magnetic material sheet provided on the upper and lower surfaces of the first magnetic material sheet 1. The second magnetic material sheet 3 has an outer side from a center just above or directly below the through hole 2. A plurality of internal conductors 4 formed of a conductor pattern are formed in a spiral shape so as to spread, and the leading ends extend to one edge of the second magnetic sheet 3. Reference numeral 5 denotes a plurality of third magnetic sheets provided on the surface of the second magnetic sheet 3 facing the first magnetic sheet 1, and the first, second, and third magnetic sheets 5 are provided. The sheets 1, 3, and 5 are laminated to form a laminate 6 shown in FIG. Reference numeral 7 denotes external terminal electrodes provided on both opposing side surfaces of the laminate 6 so as to be electrically connected to the internal conductor 4. A method of manufacturing the conventional inductor array configured as described above will be described below with reference to the drawings.

FIGS. 15A to 15E are manufacturing process diagrams showing a conventional method for manufacturing an inductor array.

First, as shown in FIG. 15A, a plurality of third magnetic sheets 5 are formed from a ferrite slurry by a green sheet method.

Next, as shown in FIG. 15 (b), four through holes 2 are formed by drilling a center portion, and the through holes 2 are filled with a conductive material such as Ag. The first magnetic material sheet 1 is formed.

Next, as shown in FIG. 15C, an internal conductor 4 made of a conductor pattern is formed on the second magnetic sheet 3. The inner conductor 4 is formed in a spiral shape from the center to the outer side, and its tip is formed to extend to one edge in the width direction of the second magnetic material sheet 3. It is formed by printing.

Next, as shown in FIG. 14, the second magnetic sheet 3 is connected to the upper and lower sides of the first magnetic sheet 1 through the through holes 2 at the sheet inner side edge of the internal conductor 4. Then, the third magnetic sheet 5 is laminated on the upper and lower sides of the second magnetic sheet 3 until a predetermined thickness is obtained, and after applying a predetermined pressure, the mixture is heated in the air to remove the binder. It is burned off and fired at a high temperature of about 850 to 1000 ° C. to form a laminate 8 shown in FIG. At this time, the inner conductor 4 formed on the second magnetic sheet 3 is exposed from the end face of the laminate 8.

Next, as shown in FIG. 15E, an Ag-based conductive material is connected to the opposing side surface of the laminate 8 so as to be electrically connected to the internal conductor 4 exposed from the end face of the laminate 8. The external terminal electrode 7 is formed by applying a paste and baking at 550 to 900 ° C.

Next, Ni plating is applied so as to cover the external terminal electrodes 7, and Sn plating is applied so as to cover the Ni plating, thereby forming a chip inductor array.

[0013]

However, in the above-mentioned conventional structure, since all the internal conductors 4 are formed on the same green sheet, that is, the second magnetic sheet 3, all the internal conductors 4 are patterned. There is a problem that the allowable pattern area is restricted and it is difficult to manufacture an inductor having a large characteristic.

Further, when the internal conductors 4 approach each other due to miniaturization of components, there is a problem that crosstalk generated between the internal conductors 4 increases. As a countermeasure against crosstalk, the structures disclosed in Japanese Utility Model Laid-Open No. 7-10927, Japanese Utility Model Laid-Open No. 7-10914, and the like can be considered. This is a structure in which a common ground electrode is formed on one surface in the stacking direction of the element body in a composite electronic component array in which a capacitor or the like is formed inside. It is connected to electrodes and soldered to the printed circuit board.
That is, an object is to reduce electromagnetic coupling, so-called crosstalk, generated between internal conductors by interposing a ground electrode. However, in this structure, it is necessary to form a ground electrode on a printed circuit board serving as a component mounting surface, and thus there is a problem in that component arrangement is restricted and it is difficult to reduce a mounting area.

The present invention solves the above-mentioned conventional problems. Even if the pitch of adjacent external terminal electrodes is reduced by reducing the size of an inductor, the pattern area allowed for each internal conductor is maximized. Further, it is an object of the present invention to provide an inductor array that can suppress crosstalk due to magnetic and electrostatic coupling generated between internal conductors connected to adjacent external terminal electrodes even if the inductor array is downsized. Things.

[0016]

In order to achieve the above object, an inductor array according to the present invention comprises an insulating layer, a plurality of internal conductors laminated on the insulating layer, and an electrical connection with the plurality of internal conductors. And an internal conductor connected to at least one set of adjacent external terminal electrodes of the plurality of external terminal electrodes is disposed via an insulating layer and an intermediate conductor layer in the laminating direction. According to this configuration, even if the pitch of the adjacent external terminal electrodes is reduced by reducing the size of the inductor, the pattern area allowed for each internal conductor can be maximized.
Even if the inductor array is miniaturized, crosstalk due to magnetic and electrostatic coupling generated between internal conductors connected to adjacent external terminal electrodes can be suppressed.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention comprises an insulating layer, a plurality of internal conductors laminated on the insulating layer, and a plurality of internal conductors electrically connected to the plurality of internal conductors. And an internal conductor connected to at least one set of adjacent external terminal electrodes among the plurality of external terminal electrodes, the internal conductor being disposed in the stacking direction with an insulating layer and an intermediate conductor layer interposed therebetween. According to this, among the plurality of external terminal electrodes electrically connected to the plurality of internal conductors, the internal conductor connected to at least one set of adjacent external terminal electrodes is disposed in the stacking direction via the insulating layer and the intermediate conductor layer. Even if the pitch of adjacent external terminal electrodes is reduced by miniaturizing the inductor, the pattern area allowed for each internal conductor can be maximized, and as a result, the inductor performance can be maximized. In addition to being able to exert, the mutual interference of the magnetic field between the internal conductors connected to the adjacent external terminal electrodes can be shielded by the intermediate conductor layer, and as a result, the magnetic and This has the effect of suppressing crosstalk due to electrostatic coupling.

According to a second aspect of the present invention, the degree of overlap between an internal conductor connected to an adjacent terminal electrode and an intermediate conductor layer disposed via an insulating layer is determined by determining whether the intermediate conductor layer is at least overlapped with the internal conductor. According to this configuration, since the intermediate conductor layer overlaps the internal conductor by at least 30% or more, this intermediate conductor layer allows the intermediate conductor layer to overlap between adjacent internal conductors as in the related art. There is an effect that crosstalk due to magnetic and electrostatic coupling that occurs can be reduced.

According to a third aspect of the present invention, the inner conductor and the intermediate conductor layer are made of an Ag-based material. According to this structure, the resistance of the inner conductor is reduced by using the Ag-based material. Therefore, it has an effect that the inductor can be relatively easily fired in an oxidizing atmosphere.

According to a fourth aspect of the present invention, the intermediate conductor layer is formed of a planar material or a material having at least one or more holes. According to this structure, the intermediate conductor layer is connected to the adjacent external terminal electrode. Interference of the magnetic field between the inner conductors can be shielded by the intermediate conductor layer,
When the intermediate conductor layer is formed of one having one or more holes, the effect is that the amount of material used can be reduced without lowering the shielding ability.

Hereinafter, an inductor array according to an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is an exploded perspective view showing the inside of an inductor array according to Embodiment 1 of the present invention, and FIG. 2 (a) is a perspective view showing the appearance of the inductor array shown in FIG. 2B is a sectional view taken along line AA of FIG. 2A, and FIG. 2C is a sectional view taken along line BB of FIG. 2A.

In FIGS. 1 and 2 (a), (b) and (c),
Reference numeral 11 denotes a first magnetic sheet made of ferrite having through holes 12 filled with a conductive material such as Ag.
Reference numeral 13 denotes a plurality of internal conductors formed in a spiral shape so as to extend outward from the center immediately above or immediately below the through hole 12. Reference numeral 14 denotes an intermediate conductor layer which is located substantially at the center with respect to the lamination direction and is disposed via an insulating layer 15 so as to separate a plurality of internal conductors 13 provided above and below. Reference numeral 16 denotes a plurality of second magnetic sheets provided on a surface facing the first magnetic sheet 11 via a plurality of internal conductors 13, and the second magnetic sheet 16 and the first magnetic sheet 16 are provided. The magnetic sheet 11, the insulating layer 15, and the intermediate conductor layer 14 are laminated to form a laminate 17. Reference numeral 18 denotes a plurality of external terminal electrodes provided on at least both side surfaces of the laminated body 17 facing each other so as to be electrically connected to the plurality of internal conductors 13.
As shown in (a), four external terminal electrodes 18a, 18b, 18c, and 18d are formed in pairs.
The plurality of internal conductors 13 constitute a coil. As shown in FIG. 2B, the plurality of internal conductors 13 are formed via a conductive material such as Ag filled in the through holes 12. It constitutes four inner conductors 13a, 13b, 13c, 13d, each of which is electrically connected. The four inner conductors 13a, 13b, 13
c, 13d and the four external terminal electrodes 18a, 18b,
18c and 18d, respectively, and are electrically connected to the four external terminal electrodes 18a, 18b, 18c and 18d.
Of the adjacent external terminal electrodes 18a and 18b, 18b
As shown in FIG. 2B, the inner conductors 13a and 13b, 13b and 13c, 13c and 13d, which are electrically connected to the inner conductors 18c and 18c and 18d, are all disposed in the laminating direction via the insulating layer 15 and the intermediate conductor layer 14. It is what is arranged.

A method of manufacturing the inductor array having the above-described configuration will be described below with reference to the drawings.

FIGS. 3A to 3F are manufacturing process diagrams showing a method for manufacturing the inductor array according to the first embodiment of the present invention.

First, as shown in FIG. 3A, a plurality of second magnetic sheets 16 are formed from a ferrite slurry by a green sheet method.

Next, as shown in FIG. 3 (b), two through-holes 12 are formed by drilling at predetermined locations, and the through-holes 12 are filled with a conductive material such as Ag. The first magnetic material sheet 11 is formed.

Next, as shown in FIG. 3C, a plurality of inner conductors 1 formed in a spiral shape from the center to the outside.
Prepare 3

Next, as shown in FIG. 3D, an intermediate conductor layer 14 is formed using an Ag-based material.

Next, as shown in FIG. 1, a plurality of internal conductors 13a are connected to the upper and lower sides of the first magnetic sheet 11 through the through holes 12 so that the inner side edges of the internal conductors 13 are connected. , 13c, and the intermediate conductor layer 14 is laminated via the insulating layer 15.

The intermediate conductor layer 14 has a structure sandwiched between insulating layers 15. Similarly, a plurality of internal conductors 13b, 14b are connected to the upper and lower sides of the first magnetic sheet 11 so that the sheet inner side edges of the internal conductors 13 are connected via the through holes 12.
13d is overlapped. That is, the upper inner conductors 13a and 13c and the lower inner conductor 13
b and 13d are arranged so as to have a two-story structure. Thereafter, a second magnetic sheet 16 is laminated on the upper inner conductors 13a and 13b and below the lower inner conductors 13b and 13d until a predetermined thickness is reached, and is about 70 kg / c.
After applying a pressure of m ² , the binder is burned and removed by heating in air, and then fired at a high temperature of about 850 to 1000 ° C. to form a laminate 19 shown in FIG. At this time, four internal conductors 13a, 13b, 13c, and 4c formed above and below the first magnetic sheet 11 from the end face of the laminate 19 are formed.
13d is exposed. That is, the internal conductors 13a, 1 electrically connected to adjacent external terminal electrodes
3b, 13c and 13d are arranged so as to face each other via the insulating layer 15 and the intermediate conductor layer 14 in the stacking direction.

Next, as shown in FIG.
9 is coated with an Ag-based conductive paste so as to be electrically connected to the four inner conductors 13 a, 13 b, 13 c, and 13 d exposed from the end face of the laminate 19. By baking at 900 ° C., four external terminal electrodes 18a, 18b, 18c, 18d are formed.

Next, the external terminal electrodes 18a, 18b, 18
Ni plating is applied so as to cover c and 18d, and Sn plating is applied so as to cover the Ni plating to form a chip inductor array.

The method of forming the second magnetic sheet 16 may be another printing method other than the green sheet method, and the materials of the inner conductors 13a, 13b, 13c, 13d and the intermediate conductor layer 14 may be different. , Ag was used, but Ag-P
d and the inner conductors 13a, 13b, 1
3c and 13d may be those that form a coil or those that are linear. Also, the external terminal electrodes 18a, 18b, 1
Ag was used as the material for 8c and 18d, but Ag-Pd,
These alloys including Ni, Cu or Ag may be used, and the external terminal electrodes 18a, 18b, 18
The method of forming c, 18d may be printing, vapor deposition, sputtering, or the like. The individual magnetic sheets 11, 16 are overlapped, and the external terminal electrodes 18a, 18b are applied in a state before firing under a certain pressure. , 18c, 18d,
Thereafter, these may be simultaneously fired together.

The inductor array constructed and manufactured as described above will be described below based on experimental results obtained by examining the crosstalk which is a main part of the present invention. In this experiment, a 3.2 mm long, 1.6 mm wide, 1.2 mm thick inductor array with four built-in elements and a typical characteristic of 100 M
Although the one having an impedance of about 600Ω at Hz was used, the result of the same tendency can be obtained by using one having a different representative characteristic.

FIG. 4 is a characteristic diagram comparing the crosstalk characteristics between the inductor array according to the first embodiment of the present invention and a conventional product. The conventional product 1 has a structure in which a plurality of internal conductors are formed at the same position in the stacking direction inside the laminate, and the conventional product 2 has a structure in which internal conductors connected to adjacent external terminal electrodes are stacked. The samples are arranged so as to be alternately shifted with respect to the direction, and all samples have the same external dimensions and terminal electrode spacing.

According to the experimental results shown in FIG. 4, it is understood that the structure according to the first embodiment of the present invention has the best crosstalk characteristics. This is because the intermediate conductor layer 14 is provided inside, which is improved by about 5 to 10 dB as compared with the conventional product 1, that is, the structure in which a plurality of internal conductors are formed at the same position in the laminating direction inside the laminate. Is what it is.

FIG. 5 is a cross-sectional view in which the shape effect of the inductor array according to the first embodiment of the present invention is compared with a conventional product. In order to obtain an impedance value of 600Ω, when ferrite is used as the material of the magnetic sheet in the first embodiment of the present invention, the plurality of inner conductors 13 have a line width of 5 mm.
It must be formed in a spiral shape for about 5 turns with 0 μm and 30 μm between lines. FIG. 5 (a) shows the first embodiment of the present invention, and FIG. 5 (b) shows a conventional example 1 of a structure in which a plurality of internal conductors 4 are formed at the same position in the lamination direction inside the laminate. In the case of the structure of the conventional example 1, since the pattern area of each internal conductor 4 is restricted by the pitch between the external terminal electrodes, more conductor layers are required to obtain an impedance value. It becomes. FIG. 5 (c)
In the conventional example 2 shown in FIG. 2, the internal conductors 4 connected to the adjacent external terminal electrodes are stacked in the stacking direction in order to suppress the crosstalk due to the magnetic and electrostatic coupling generated between the adjacent internal conductors 4 in the conventional example 1. However, in this case as well, in order to suppress the crosstalk generated between the adjacent inner conductors 4, the interval between the adjacent inner conductors 4 is set as wide as possible. There must be. Therefore, also in the second conventional example, since the pattern area of the internal conductor 4 is restricted, the number of stacked internal conductors 4 is increased. On the other hand, in the first embodiment of the present invention shown in FIG. 5A, upper internal conductors 13a and 13c and lower internal conductor 13
b, 13d, the inner conductor 1
3a, 13b, 13c, and 13d are relatively insensitive to the pattern, and therefore have an impedance value of 600Ω.
To obtain the inner conductors 13a, 13b, 13c, 13
d can be formed in two layers, and from this result, it can be seen that the structure in the first embodiment of the present invention is the most excellent.

(Embodiment 2) FIG. 6 is an exploded perspective view of the inside of an inductor array according to Embodiment 2 of the present invention, and FIG. 1 of the first embodiment of the present invention shown in FIG.
4a and 14b. FIG. 7A is a top perspective view of the inductor array according to the second embodiment of the present invention, and FIG. 7B is a cross-sectional view of the inductor array.
As shown in FIGS. 7A and 7B, the intermediate conductor layer 14
a and 14b are arranged so as to overlap at least 30% or more with each of the plurality of internal conductors 13. FIG. 8 shows a result of comparing the magnitude of crosstalk depending on the degree of overlap between the intermediate conductor layers 14a and 14b and the internal conductor 13. As is apparent from FIG. 8, the degree of overlap between the intermediate conductor layers 14a and 14b and the internal conductor 13 is 30% or more, and crosstalk is small. This is considered to be because when the intermediate conductor layers 14a and 14b have a certain area or more, an effect of shielding electromagnetic coupling generated between the adjacent internal conductors 13 is brought about. As a result, an inductor array in which crosstalk due to electromagnetic coupling generated between the adjacent internal conductors 13 is suppressed can be obtained.

(Embodiment 3) FIG. 9 is an exploded perspective view showing the inside of an inductor array according to Embodiment 3 of the present invention, FIG. 10 is a perspective view showing the appearance of the inductor array shown in FIG. 9, and FIG. FIG. 11 is a sectional view taken along line CC of FIG. 10.

9 to 11, reference numeral 21 denotes a first magnetic sheet made of ferrite having through holes 22 filled with a conductive material such as Ag. Reference numeral 23 denotes a plurality of internal conductors formed in a spiral shape so as to spread outward from the center immediately above or immediately below the through hole 22. Reference numeral 24 denotes an intermediate conductor layer which is located substantially at the center with respect to the lamination direction and is disposed via an insulating layer 25 so as to separate a plurality of internal conductors 23 provided above and below. Reference numeral 26 denotes the first magnetic sheet 2 via a plurality of internal conductors 23.
The second magnetic material sheet 26, the first magnetic material sheet 21, the insulating layer 25, and the intermediate conductor layer 24 are laminated on a plurality of second magnetic material sheets provided on the side opposite to 1. A laminate 27 is formed. Reference numeral 28 denotes a plurality of external terminal electrodes provided on at least both side surfaces of the laminated body 27 facing each other so as to be electrically connected to the plurality of internal conductors 23. As shown in FIG. , Four external terminal electrodes 28a, 28b, 28
c, 28d. The plurality of inner conductors 2
Numeral 3 denotes a coil, and the plurality of inner conductors 23 are formed from a pair electrically connected via a conductive material such as Ag filled in the through hole 22, as shown in FIG. Four internal conductors 23a, 23b, 23
c, 23d. The four internal conductors 23a, 23b, 23c, 23d are electrically connected to the four external terminal electrodes 28a, 28b, 28c, 28d respectively, and the four external terminal electrodes 28a, 28
8b, 28c and 28d, adjacent external terminal electrodes 2
The internal conductors 23a and 23b, 23c and 23d electrically connected to 8a and 28b, 28c and 28d are arranged in the laminating direction via an insulating layer 25 and an intermediate conductor layer 24 as shown in FIG. is there. In this case, in Embodiment 3 of the present invention, as shown in FIG. 12, internal conductors 23 electrically connected to external terminal electrodes 28a and 28d are provided.
a and 23d are located on the lower side, and the inner conductors 23b and 23c electrically connected to the external terminal electrodes 28b and 28c are located on the upper side. Accordingly, the inner conductors 23b and 23c electrically connected to the adjacent external terminal electrodes 28b and 28c are not arranged via the insulating layer 25 and the intermediate conductor layer 24 in the laminating direction. Internal conductors 23a and 23b, 23c and 23 electrically connected to adjacent external terminal electrodes 28a and 28b, 28c and 28d.
“d” is disposed via the insulating layer 25 and the intermediate conductor layer 24 in the laminating direction as described above.

In the third embodiment of the present invention, the same operation and effect as those in the first embodiment of the present invention can be obtained.

In the first embodiment of the present invention, the internal conductors 13a, 1
3c and the lower inner conductors 13b, 13d are arranged in a two-story structure, but the inner conductors 13a, 13b, 13c, 13d have a four-story structure with three intermediate conductor layers interposed therebetween. Even if it arrange | positions so that it may become, it has the same effect as said Embodiment 1 of this invention.

In the second embodiment of the present invention, the intermediate conductor layer 14 is divided into two intermediate conductor layers 14a and 14b.
Although the intermediate conductor layer 14 has been described as being formed separately, the intermediate conductor layer 14 may have a continuous planar shape, or may have one or more holes or a mesh shape.

In the second embodiment of the present invention, the case where the two intermediate conductor layers 14a and 14b are provided on the same lamination surface has been described. An effect can be obtained.

Further, in the third embodiment of the present invention, the inner conductors 23b,
Although the description has been given of the arrangement in which the inner conductor 23c and the lower inner conductors 23a and 23d are arranged in a two-story structure, the inner conductors 23b, 23a, 23c and 23d are arranged in a four-story structure with three intermediate conductor layers interposed therebetween. Even if it arrange | positions so that it may become, it has the same effect as said Embodiment 3 of this invention.

[0047]

As described above, the inductor array of the present invention comprises an insulating layer, a plurality of internal conductors laminated on the insulating layer, and a plurality of external terminal electrodes electrically connected to the plurality of internal conductors. According to this configuration, the internal conductor connected to at least one set of adjacent external terminal electrodes among the plurality of external terminal electrodes is arranged via an insulating layer and an intermediate conductor layer in a laminating direction. The internal conductors connected to at least one set of adjacent external terminal electrodes among the plurality of external terminal electrodes electrically connected to the plurality of internal conductors are arranged in the stacking direction via an insulating layer and an intermediate conductor layer. Therefore, even if the pitch of adjacent external terminal electrodes is reduced by miniaturizing the inductor, it is possible to maximize the pattern area allowed for each internal conductor, thereby maximizing the inductor performance. In addition to the above, the mutual interference of the magnetic field between the internal conductors connected to the adjacent external terminal electrodes can be shielded by the intermediate conductor layer. As a result, the magnetic field generated between the adjacent internal conductors can be reduced. And an excellent effect that crosstalk due to electrostatic coupling can be suppressed.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of the inside of an indenter array according to a first embodiment of the present invention.

2A is a perspective view showing the appearance of the inductor array, FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. 2C is a cross-sectional view taken along the line BB in FIG.

FIGS. 3A to 3F are manufacturing process diagrams showing a manufacturing method of the inductor array; FIGS.

FIG. 4 is a characteristic diagram comparing crosstalk characteristics between the inductor array and a conventional product.

FIGS. 5A to 5C are cross-sectional views comparing the shape effect of the inductor array with a conventional product;

FIG. 6 is an exploded perspective view of the inside of the inductor array according to the second embodiment of the present invention.

FIG. 7A is a top perspective view of an inductor array according to a second embodiment of the present invention. FIG. 7B is a cross-sectional view of the inductor array.

FIG. 8 is a characteristic diagram showing a result of comparing the magnitude of crosstalk due to the degree of overlap between the intermediate conductor layer and the internal conductor in the inductor array.

FIG. 9 is an exploded perspective view showing the inside of an inductor array according to a third embodiment of the present invention.

FIG. 10 is a perspective view showing the appearance of the inductor array.

11 is a sectional view taken along line CC of FIG. 10;

FIG. 12 is a perspective view of a laminated body in the inductor array.

FIG. 13 is a perspective view of a conventional inductor array.

FIG. 14 is an exploded perspective view of the inductor array.

FIGS. 15A to 15E are manufacturing process diagrams showing a manufacturing method of the inductor array.

[Explanation of symbols]

 11, 21 First magnetic sheet (insulating layer) 13, 13a, 13b, 13c, 13d Internal conductor 23, 23a, 23b, 23c, 23d Internal conductor 14, 14a, 14b, 24 Intermediate conductor layer 15, 25 Insulation layer 18, 18a, 18b, 18c, 18d External terminal electrodes 28, 28a, 28b, 28c, 28d External terminal electrodes

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Eiichi Uryu 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Tomoyuki Washizaki 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazuo Oishi 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. 5E058 BB19 5E070 AA01 AB01 AB08 BA12 CB03 CB08 CB12 CB13 CB17 DA17 EA01

Claims (4)

[Claims] An insulating layer, a plurality of internal conductors laminated on the insulating layer, and a plurality of external terminal electrodes electrically connected to the plurality of internal conductors; Wherein the inner conductor connected to at least one pair of adjacent external terminal electrodes is disposed in the stacking direction via an insulating layer and an intermediate conductor layer. 2. The method according to claim 1, wherein the degree of overlap between the inner conductor connected to the adjacent external terminal electrode and the intermediate conductor layer disposed via the insulating layer is at least 30%.
The inductor array according to claim 1, wherein the inductor array overlaps at least%. 3. The inductor array according to claim 1, wherein the inner conductor and the intermediate conductor layer are made of an Ag-based material. 4. The intermediate conductor layer according to claim 1, wherein the intermediate conductor layer has a planar shape or has at least one hole.
An inductor array as described.