IT609174A - - Google Patents
Info
- Publication number
- IT609174A IT609174A IT609174DA IT609174A IT 609174 A IT609174 A IT 609174A IT 609174D A IT609174D A IT 609174DA IT 609174 A IT609174 A IT 609174A
- Authority
- IT
- Italy
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B1/00—Film strip handling
- G03B1/18—Moving film strip by means which act on the film between the ends thereof
- G03B1/20—Acting means
- G03B1/32—Friction grippers or rollers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K13/00—Conveying record carriers from one station to another, e.g. from stack to punching mechanism
- G06K13/18—Conveying record carriers from one station to another, e.g. from stack to punching mechanism the record carrier being longitudinally extended, e.g. punched tape
- G06K13/26—Winding-up or unwinding of record carriers; Driving of record carriers
- G06K13/30—Winding-up or unwinding of record carriers; Driving of record carriers intermittently
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L13/00—Details of the apparatus or circuits covered by groups H04L15/00 or H04L17/00
- H04L13/02—Details not particular to receiver or transmitter
- H04L13/06—Tape or page guiding or feeding devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Resistance Heating (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0054550 | 1957-07-31 | ||
DES59117A DE1076824B (en) | 1957-07-31 | 1958-07-23 | Surface rectifier with a semiconductor element, which is fastened with one surface to a carrier plate and with the other surface on a rigid bolt |
Publications (1)
Publication Number | Publication Date |
---|---|
IT609174A true IT609174A (en) |
Family
ID=25995414
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT602174D IT602174A (en) | 1957-07-31 | ||
IT609174D IT609174A (en) | 1957-07-31 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT602174D IT602174A (en) | 1957-07-31 |
Country Status (4)
Country | Link |
---|---|
DE (2) | DE1076824B (en) |
GB (1) | GB878100A (en) |
IT (2) | IT609174A (en) |
NL (2) | NL6600089A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE25184E (en) * | 1959-08-03 | 1962-06-12 | Mcadam | |
NL7604220A (en) * | 1976-04-21 | 1977-10-25 | Leer Koninklijke Emballage | HOLDER WITH OUTFLOW DUCT AND ONE-TIME CLOSURE. |
FR2376392A2 (en) * | 1977-01-04 | 1978-07-28 | Lemer & Cie | Thick wall cooling system - comprises studs perpendicular to wall and with fins parallel to it |
JPS58169943A (en) * | 1982-03-29 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
DE102011081687A1 (en) * | 2011-08-26 | 2013-02-28 | Robert Bosch Gmbh | Semiconductor device with a heat sink |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2751528A (en) * | 1954-12-01 | 1956-06-19 | Gen Electric | Rectifier cell mounting |
-
0
- NL NL239393D patent/NL239393A/xx unknown
- DE DENDAT1071234D patent/DE1071234B/de active Pending
- IT IT602174D patent/IT602174A/it unknown
- IT IT609174D patent/IT609174A/it unknown
-
1958
- 1958-07-23 DE DES59117A patent/DE1076824B/en active Pending
- 1958-07-31 GB GB2473858A patent/GB878100A/en not_active Expired
-
1966
- 1966-01-05 NL NL6600089A patent/NL6600089A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
IT602174A (en) | |
GB878100A (en) | 1961-09-27 |
DE1076824B (en) | 1960-03-03 |
DE1071234B (en) | |
NL239393A (en) | |
NL6600089A (en) | 1966-03-25 |