IT1401220B1 - Sensore e metodo di fabbricazione. - Google Patents
Sensore e metodo di fabbricazione.Info
- Publication number
- IT1401220B1 IT1401220B1 ITTO2010A000616A ITTO20100616A IT1401220B1 IT 1401220 B1 IT1401220 B1 IT 1401220B1 IT TO2010A000616 A ITTO2010A000616 A IT TO2010A000616A IT TO20100616 A ITTO20100616 A IT TO20100616A IT 1401220 B1 IT1401220 B1 IT 1401220B1
- Authority
- IT
- Italy
- Prior art keywords
- sensor
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Fluid Pressure (AREA)
- Laminated Bodies (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO2010A000616A IT1401220B1 (it) | 2010-07-15 | 2010-07-15 | Sensore e metodo di fabbricazione. |
| PCT/IB2011/053154 WO2012007922A1 (en) | 2010-07-15 | 2011-07-14 | Sensor and method of manufacture thereof |
| CN2011800446657A CN103229033A (zh) | 2010-07-15 | 2011-07-14 | 传感器及其制造方法 |
| US13/810,385 US8815625B2 (en) | 2010-07-15 | 2011-07-14 | Sensor and method of manufacture thereof |
| RU2013101589/28A RU2556751C2 (ru) | 2010-07-15 | 2011-07-14 | Датчик и способ его изготовления |
| BR112013001053A BR112013001053A2 (pt) | 2010-07-15 | 2011-07-14 | sensor e método de fabricação do mesmo |
| EP11751941.3A EP2593764A1 (en) | 2010-07-15 | 2011-07-14 | Sensor and method of manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO2010A000616A IT1401220B1 (it) | 2010-07-15 | 2010-07-15 | Sensore e metodo di fabbricazione. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ITTO20100616A1 ITTO20100616A1 (it) | 2012-01-16 |
| IT1401220B1 true IT1401220B1 (it) | 2013-07-12 |
Family
ID=43530809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITTO2010A000616A IT1401220B1 (it) | 2010-07-15 | 2010-07-15 | Sensore e metodo di fabbricazione. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8815625B2 (it) |
| EP (1) | EP2593764A1 (it) |
| CN (1) | CN103229033A (it) |
| BR (1) | BR112013001053A2 (it) |
| IT (1) | IT1401220B1 (it) |
| RU (1) | RU2556751C2 (it) |
| WO (1) | WO2012007922A1 (it) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITMI20120456A1 (it) * | 2012-03-23 | 2013-09-24 | Microtel Tecnologie Elettroniche S P A | Sensore di pressione ceramico e relativo metodo di produzione, e trasduttore che incorpora un sensore di pressione ceramico |
| US9546928B2 (en) * | 2014-05-30 | 2017-01-17 | General Electric Company | Methods for producing strain sensors on turbine components |
| US9410868B2 (en) * | 2014-05-30 | 2016-08-09 | General Electric Company | Methods for producing strain sensors on turbine components |
| US10415964B2 (en) * | 2014-05-30 | 2019-09-17 | General Electric Company | Methods for producing passive strain indicator on turbine components |
| EP3012596A1 (de) | 2014-10-21 | 2016-04-27 | wenglor fluid GmbH | Messeinrichtung zur Bestimmung der Fließgeschwindigkeit eines Mediums in einem Rohr |
| ES2809898T3 (es) | 2014-12-19 | 2021-03-08 | Procedimiento para ahorrar agua y energía para elaborar trigo integral y harina de grano integral sin gluten | |
| US9583406B2 (en) * | 2015-03-17 | 2017-02-28 | Infineon Technologies Austria Ag | System and method for dual-region singulation |
| ITUB20150460A1 (it) * | 2015-04-16 | 2016-10-16 | Metallux Sa | Sensore per la rilevazione di una o piu' grandezze di un fluido, particolarmente un sensore di pressione |
| TW201641461A (zh) * | 2015-04-28 | 2016-12-01 | 賀利氏貴金屬北美康舍霍肯有限責任公司 | 介電物帶組合物 |
| FR3041430B1 (fr) * | 2015-09-17 | 2017-11-24 | Sagem Defense Securite | Dispositif de mesure et systeme de mesure d'une pression comprenant un tel capteur |
| FR3041431B1 (fr) * | 2015-09-17 | 2019-04-05 | Safran Electronics & Defense | Capteur de pression, dispositif de mesure et systeme de mesure d'une pression comprenant un tel capteur |
| CN109490033B (zh) * | 2018-11-12 | 2020-11-03 | 中国石油大学(北京) | 一种用于去除岩样中无机碳的预处理装置 |
| US11385118B2 (en) | 2018-12-07 | 2022-07-12 | Vitesco Technologies USA, LLC | Pressure sensor with external vertical electrical interconnection system |
| EP3671160B1 (de) * | 2018-12-21 | 2024-07-31 | Exentis Knowledge GmbH | Formkörper sowie verfahren zur herstellung eines formkörpers |
| EP3671161A1 (de) | 2018-12-21 | 2020-06-24 | Exentis Knowledge GmbH | Formkörper sowie verfahren zur herstellung eines formkörpers |
| RU197682U1 (ru) * | 2019-12-27 | 2020-05-21 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский Томский государственный университет" (ТГУ, НИ ТГУ) | Полупроводниковый датчик давления |
| CN111665165B (zh) * | 2020-05-26 | 2021-09-24 | 中国地质大学（武汉） | 一种基于感应电荷的天然气水合物密度传感器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5142915A (en) * | 1990-07-06 | 1992-09-01 | Siemens Automotive L.P. | Method for fabrication of force sensing elements by laminating dielectric tape |
| US5285690A (en) * | 1992-01-24 | 1994-02-15 | The Foxboro Company | Pressure sensor having a laminated substrate |
| US5634999A (en) * | 1994-09-06 | 1997-06-03 | Ngk Insulators, Ltd. | Method of producing ceramic diaphragm structure having convex diaphragm portion |
| US7600433B2 (en) * | 2007-02-23 | 2009-10-13 | Silicon Micro Sensors Gmbh | Pressure sensor with roughened and treated surface for improving adhesive strength and method of manufacturing the sensor |
| US7513164B1 (en) * | 2007-12-18 | 2009-04-07 | Honeywell International Inc. | Single diaphragm ATF differential pressure transducer |
-
2010
- 2010-07-15 IT ITTO2010A000616A patent/IT1401220B1/it active
-
2011
- 2011-07-14 RU RU2013101589/28A patent/RU2556751C2/ru not_active IP Right Cessation
- 2011-07-14 CN CN2011800446657A patent/CN103229033A/zh active Pending
- 2011-07-14 EP EP11751941.3A patent/EP2593764A1/en not_active Withdrawn
- 2011-07-14 WO PCT/IB2011/053154 patent/WO2012007922A1/en active Application Filing
- 2011-07-14 US US13/810,385 patent/US8815625B2/en active Active
- 2011-07-14 BR BR112013001053A patent/BR112013001053A2/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US8815625B2 (en) | 2014-08-26 |
| WO2012007922A1 (en) | 2012-01-19 |
| BR112013001053A2 (pt) | 2016-05-24 |
| ITTO20100616A1 (it) | 2012-01-16 |
| EP2593764A1 (en) | 2013-05-22 |
| CN103229033A (zh) | 2013-07-31 |
| RU2556751C2 (ru) | 2015-07-20 |
| US20130168785A1 (en) | 2013-07-04 |
| RU2013101589A (ru) | 2014-08-20 |
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